Heat dissipation system, method and equipment, electronic equipment and storage medium

Abstract

The invention provides a heat dissipation system, method and equipment, electronic equipment and a storage medium, and relates to the technical field of heat dissipation, and the heat dissipation system comprises a conductive copper film arranged on the second side of a heat conduction substrate; at least one thermoelectric refrigeration structure is fixedly arranged on the conductive copper film; the thermoelectric refrigeration structure comprises a structure consisting of a P-type semiconductor and an N-type semiconductor; a conductive strip is arranged on the second side of each thermoelectric refrigeration structure; the first side of the conductive strip is attached to the second side of the thermoelectric refrigeration structure. The second side of the conductive strip is provided with a microstructure, and the microstructure is used for increasing the boiling heat transfer coefficient of the cooling liquid; the conductive copper film is connected with a lead which is a power transmission line for feeding the thermoelectric refrigeration structure; electricity is transmitted to or stopped from being transmitted to the at least one thermoelectric refrigeration structure through the conductive copper film, and heat dissipation of the chip to be cooled is achieved; therefore, the heat generated by the chip can be utilized to reduce the thermal resistance of the heat dissipation device, the heat dissipation capability of the heat dissipation device is enhanced, the heat is fully utilized, and energy waste is avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation, and particularly to a heat dissipation system, method, device, electronic device, and storage medium. Background Art

[0002] As a network device, a switch can realize interconnection and networking between computing devices and other resource devices within a local area, and achieve information transmission and exchange. With the gradual increase in the amount of data, the requirement for the transmission rate of the switch is also increasing, and the rates and bandwidths of switching chips and optical modules are also increasing accordingly, resulting in a rapid increase in power consumption. Mainstream switches use air cooling for heat dissipation, and the heat dissipation efficiency is low.

[0003] With the gradual popularization and application of liquid cooling heat dissipation technology in server devices, as a switch device used in conjunction with server devices, adopting liquid cooling heat dissipation technology can greatly improve the heat dissipation efficiency, thereby reducing the Power Usage Effectiveness (PUE) value of the entire data center. The heat dissipation efficiency of phase change liquid cooling heat dissipation technology is higher than that of non-phase change liquid cooling heat dissipation technology, and among the phase change liquid cooling heat dissipation technologies, the spray-type phase change cooling technology has the highest heat dissipation efficiency. However, a large amount of energy is consumed during the atomization process of the coolant in spray cooling, and currently, when using liquid cooling heat dissipation technology to dissipate heat from switches and other high-power electronic devices, the heat generated by the electronic devices needs to be taken away by external cooling devices, which cannot be fully utilized, resulting in a large amount of energy waste. Summary of the Invention

[0004] The present disclosure provides a heat dissipation system, method, device, electronic device, and storage medium to at least solve the above technical problems existing in the prior art.

[0005] According to a first aspect of the present disclosure, a heat dissipation system is provided, and the system includes a heat dissipation device 205; The heat dissipation device 205 includes a heat conducting substrate 101, a first side of the heat conducting substrate 101 is attached to a chip to be cooled 204, and a conductive copper film 102 is provided on a second side of the heat conducting substrate 101; At least one thermoelectric refrigeration structure 103 is fixedly arranged on the conductive copper film 102; the thermoelectric refrigeration structure 103 includes a structure composed of a P-type semiconductor and an N-type semiconductor; a first side of each thermoelectric refrigeration structure 103 is fixedly arranged on the conductive copper film 102, and a conductive strip 104 is provided on a second side; A first side of the conductive strip 104 is attached to the second side of the thermoelectric refrigeration structure 103; a micro-structure 105 is provided on a second side of the conductive strip 104, and the micro-structure 105 is used to increase the boiling heat transfer coefficient of the coolant 202; The conductive copper film 102 is connected to a wire 106, and the wire 106 is a power transmission line for feeding power to the thermoelectric refrigeration structure 103; By transmitting power to or stopping power transmission to at least one thermoelectric refrigeration structure 103 through the conductive copper film 102, heat dissipation of the chip 204 to be cooled is achieved.

[0006] In the above solution, in response to transmitting power to at least one thermoelectric refrigeration structure 103 through the wire 106 and the conductive copper film 102, one side of each thermoelectric refrigeration structure 103 in contact with the heat conducting substrate 101 absorbs heat and becomes the cold end, and one side in contact with the conductive strip 104 releases heat and becomes the hot end; the cold end absorbs the heat generated by the chip 204 to be cooled through the heat conducting substrate 101 to cool the chip 204 to be cooled; the hot end raises the temperature of the micro-structure 105 and increases the number of surface vaporization nuclei at the same time, enhancing the boiling reaction of the coolant 202, reducing the thermal resistance of the heat dissipation device 205, and enabling the heat dissipation device 205 to dissipate heat for the chip 204 to be cooled; In response to the temperature of the chip 204 to be cooled being within the first preset range, power transmission is stopped, and the heat dissipation device 205 enters the low thermal resistance mode to continue dissipating heat for the chip to be cooled.

[0007] In the above solution, the heat conducting substrate 101 includes one of aluminum nitride ceramic, silicon carbide ceramic, and silicon carbide ceramic.

[0008] In the above solution, the conductive copper film 102 is tightly attached to the heat conducting substrate 101 by an evaporation coating process.

[0009] In the above solution, the at least one thermoelectric refrigeration structure 103 and the conductive strip 104 disposed thereon form a rib array structure to increase the area of the boiling reaction; The distances between the at least one thermoelectric refrigeration structure 103 are the same or different.

[0010] In the above solution, the conductive strip 104 is a metal and has a thickness within the second preset range.

[0011] In the above solution, the micro-structure 105 includes a porous rough structure formed on the surface of the conductive strip 104 by one of a sintering process, a spraying process, and a laser processing process; The micro-structure 105 includes one of a convex structure, a sintered powder structure, and a porous foam structure.

[0012] In the above solution, the system further includes a box body 201, a coolant 202, a main board 203, a condensing pipe 207, a condensate 208, and a baseboard management controller 206; The main board 203 is disposed in close contact with the inner wall on one side of the box body 201, and the main board 203 is provided with the chip 204 to be cooled and the baseboard management controller 206; The coolant 202 is inside the box body 201, and the main board 203, the heat dissipation device 205, the chip to be cooled 204, and the baseboard management controller 206 are all immersed in the coolant 202; In the box body 201, a condensing pipe 207 is arranged above the liquid level of the coolant 202, which includes condensate 208; After the coolant 202 undergoes a boiling reaction and turns into a gas and rises, it contacts the condensing pipe 207 and cools down through the condensate 208 to become droplets and fall back.

[0013] In the above solution, the system further includes a box body 201, a coolant 202, a main board 203, a cold plate housing 304, a cold plate water inlet pipe 307, a cold plate water outlet pipe 308, and a baseboard management controller; The main board 203, the cold plate housing 304, the cold plate water inlet pipe 307, the cold plate water outlet pipe 308, and the baseboard management controller 206 are all arranged inside the box body 201; The main board 203 is attached to the inner wall on one side of the box body 201, and the chip to be cooled 204 and the baseboard management controller 206 are arranged on the main board 203; The heat dissipation device 205 and the coolant 202 are arranged inside the cold plate housing 304; The cold plate water inlet pipe 307 and the cold plate water outlet pipe 308 are respectively arranged on the first side and the second side of the cold plate housing; The cold plate water inlet pipe 307 is used to input the coolant 202 into the cold plate housing; The cold plate water outlet pipe 308 is used to discharge the vaporized coolant 202 and the liquid coolant 202 in the cold plate housing.

[0014] In the above solution, the horizontal plane corresponding to the cold plate water inlet pipe 307 is lower than the horizontal plane corresponding to the cold plate water outlet pipe 308.

[0015] In the above solution, the main board 203 is arranged parallel to the horizontal plane corresponding to the cold plate water inlet pipe 307.

[0016] In the above solution, the system further includes a processing device 309; After the vaporized coolant 202 discharged from the cold plate water outlet pipe 308 contacts the processing device 309, it cools down and becomes droplets; The droplets and the liquid coolant 202 discharged from the cold plate water outlet pipe 308 re-enter the cold plate housing 304 through the cold plate water inlet pipe 307.

[0017] In the above solution, the baseboard management controller 206 is used for: Obtaining the power consumption of the chip to be cooled 204; In response to the power consumption rising rate of the chip to be cooled being greater than a third preset threshold, power is transmitted to at least one thermoelectric refrigeration structure 103 through the wire 106 and the conductive copper film 102; Obtain the temperature of the chip 204 to be cooled; In response to the temperature of the chip 204 to be cooled being within a first preset range, stop transmitting power to at least one thermoelectric refrigeration structure 103.

[0018] In the above solution, after stopping transmitting power to at least one thermoelectric refrigeration structure 103, the baseboard management controller 206 is further configured to: Obtain the power consumption of the chip 204 to be cooled; Based on the power consumption of the chip 204 to be cooled, adjust the flow rate of the coolant 202 or the condensate 208.

[0019] According to a second aspect of the present disclosure, there is provided a heat dissipation method applied to a baseboard management controller, the method including: Obtain the power consumption of the chip to be cooled; In response to the power consumption rising rate of the chip to be cooled being greater than a third preset threshold, transmit power to at least one thermoelectric refrigeration structure through a wire and a conductive copper film; Obtain the temperature of the chip to be cooled; In response to the temperature of the chip to be cooled being within a first preset range, stop transmitting power to at least one thermoelectric refrigeration structure.

[0020] In the above solution, the method further includes: Obtain the power consumption of the chip to be cooled; Based on the power consumption of the chip to be cooled, adjust the flow rate of the coolant or the condensate.

[0021] According to a third aspect of the present disclosure, there is provided a heat dissipation device applied to a baseboard management controller, the device including: A first acquisition unit for obtaining the power consumption of the chip to be cooled; A control unit for, in response to the power consumption rising rate of the chip to be cooled being greater than a third preset threshold, transmitting power to at least one thermoelectric refrigeration structure through a wire and a conductive copper film; A second acquisition unit for obtaining the temperature of the chip to be cooled; The control unit is further configured to, in response to the temperature of the chip to be cooled being within a first preset range, stop transmitting power to at least one thermoelectric refrigeration structure.

[0022] According to a fourth aspect of the present disclosure, there is provided an electronic device, including: At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method described in the present disclosure.

[0023] According to a fifth aspect of the present disclosure, there is provided a non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute the method described in the present disclosure.

[0024] According to a sixth aspect of the present disclosure, there is provided a computer program product including a computer program which, when executed by a processor, implements the method described in the present disclosure.

[0025] The heat dissipation system of the present disclosure includes a heat dissipation device, and the heat dissipation device 205 includes a heat conducting base 101. The first side of the heat conducting base 101 is attached to the chip to be cooled 204, and a conductive copper film 102 is provided on the second side of the heat conducting base 101; at least one thermoelectric refrigeration structure 103 is fixedly provided on the conductive copper film 102; the thermoelectric refrigeration structure 103 includes a structure composed of a P-type semiconductor and an N-type semiconductor; the first side of each thermoelectric refrigeration structure 103 is fixedly provided on the conductive copper film 102, and a conductive strip 104 is provided on the second side; the first side of the conductive strip 104 is attached to the second side of the thermoelectric refrigeration structure 103; a microstructure 105 is provided on the second side of the conductive strip 104, and the microstructure 105 is used to increase the boiling heat transfer coefficient of the coolant 202; the conductive copper film 102 is connected with a wire 106, and the wire 106 is a power transmission line for feeding power to the thermoelectric refrigeration structure 103; by transmitting power to or stopping power transmission to at least one thermoelectric refrigeration structure 103 through the conductive copper film 102, heat dissipation of the chip to be cooled 204 is achieved. In response to power transmission of the thermoelectric refrigeration structure, the side of each thermoelectric refrigeration structure 103 in contact with the heat conducting base 101 absorbs heat and becomes the cold end, and the side in contact with the conductive strip 104 releases heat and becomes the hot end; the cold end absorbs the heat generated by the chip to be cooled 204 through the heat conducting base 101 to cool the chip to be cooled 204; the hot end raises the temperature of the microstructure 105 and increases the number of surface vaporization nuclei at the same time, so that the boiling reaction of the coolant 202 is enhanced, the thermal resistance of the heat dissipation device 205 is reduced, and the heat dissipation device 205 dissipates heat for the chip to be cooled 204; it is possible to reduce the thermal resistance of the heat dissipation device by using the heat generated by the chip, enhance the heat dissipation capacity of the heat dissipation device, make full use of the heat, and avoid energy waste.

[0026] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. Description of the Drawings

[0027] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become readily understandable. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, where: In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0028] Figure 1 An optional structural schematic diagram of a heat dissipation device provided by an embodiment of the present disclosure is shown; Figure 2 A first optional structural schematic diagram of a heat dissipation system provided by an embodiment of the present disclosure is shown; Figure 3 A second optional structural schematic diagram of a heat dissipation system provided by an embodiment of the present disclosure is shown; Figure 4 An optional flowchart of a heat dissipation method provided by an embodiment of the present disclosure is shown; Figure 5 An optional structural schematic diagram of a heat dissipation device provided by an embodiment of the present disclosure is shown; Figure 6 A structural schematic diagram of a composition of an electronic device according to an embodiment of the present disclosure is shown.

[0029] In the figure, 101 - heat conduction substrate, 102 - conductive copper film, 103 - thermoelectric refrigeration structure, 104 - conductive strip, 105 - microstructure, 106 - wire, 201 - box body, 202 - coolant, 203 - main board, 204 - chip to be cooled, 205 - heat dissipation device, 206 - baseboard management controller, 207 - condenser tube, 208 - condensate, 304 - cold plate housing, 307 - cold plate inlet water pipe, 308 - cold plate outlet water pipe. Detailed Embodiments

[0030] To make the objectives, features, and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present disclosure.

[0031] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with each other without conflict.

[0032] In the following description, the terms "first" and "second" involved only distinguish similar objects and do not represent a specific order for the objects. It can be understood that, when permitted, "first" and "second" can be interchanged in a specific order or sequence so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0033] Unless otherwise defined, all technical and scientific terms used in this disclosure have the same meaning as commonly understood by those skilled in the technical field to which this disclosure belongs. The terms used in this disclosure are only for the purpose of describing the embodiments of this disclosure and are not intended to limit this disclosure.

[0034] It should be understood that in various embodiments of the present disclosure, the magnitude of the serial numbers of the respective implementation processes does not mean the sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present disclosure.

[0035] Figure 1 The optional structural schematic diagram of the heat dissipation device provided by the embodiment of the present disclosure is shown, and will be described according to each part.

[0036] In some embodiments, the heat dissipation device 205 includes a heat conduction base 101, a conductive copper film 102, at least one thermoelectric refrigeration structure 103, at least one conductive strip 104, and a microstructure 105.

[0037] In some embodiments, the first side of the heat conduction base 101 is attached to the chip 204 to be cooled, and the second side of the heat conduction base 101 is provided with a conductive copper film 102.

[0038] At least one thermoelectric refrigeration structure 103 is fixedly arranged on the conductive copper film 102; the thermoelectric refrigeration structure 103 includes a structure composed of a P-type semiconductor and an N-type semiconductor; the first side of each thermoelectric refrigeration structure 103 is fixedly arranged on the conductive copper film 102, and the second side is provided with a conductive strip 104.

[0039] The first side of the conductive strip 104 is attached to the second side of the thermoelectric refrigeration structure 103; the second side of the conductive strip 104 is provided with a microstructure 105, and the microstructure 105 is used to increase the boiling heat transfer coefficient of the coolant 202.

[0040] The conductive copper film 102 is connected with a wire 106, and the wire 106 is a power transmission line for feeding power to the thermoelectric refrigeration structure 103.

[0041] By transmitting power to or stopping transmitting power to at least one thermoelectric refrigeration structure 103 through the conductive copper film 102, heat dissipation of the chip 204 to be cooled is achieved.

[0042] In some embodiments, the heat dissipation device 205 is applied to a liquid cooling system, which dissipates heat from the chip 204 to be cooled by undergoing a boiling reaction with the coolant 202. Specifically, it includes: in response to the heat generated by the chip to be cooled, power is transmitted to at least one thermoelectric refrigeration structure 103 through the wire 106 and the conductive copper film 102. One side of each thermoelectric refrigeration structure 103 in contact with the heat-conducting substrate 101 absorbs heat and becomes the cold end, and the side in contact with the conductive strip 104 releases heat and becomes the hot end; the cold end absorbs the heat generated by the chip 204 to be cooled through the heat-conducting substrate 101 to cool the chip 204 to be cooled; the hot end raises the temperature of the micro-structure 105 and increases the number of surface vaporization nuclei at the same time, enhancing the boiling reaction of the coolant 202, reducing the thermal resistance of the heat dissipation device 205, and enabling the heat dissipation device 205 to dissipate heat from the chip 204 to be cooled; in response to the temperature of the chip 204 to be cooled being within the first preset range, power transmission is stopped, and the heat dissipation device 205 enters the low thermal resistance mode to continue dissipating heat from the chip to be cooled. The first preset range can be set according to actual requirements or experimental results.

[0043] In some embodiments, the heat-conducting substrate 101 includes a heat-conducting ceramic substrate, such as one of aluminum nitride ceramics, silicon carbide ceramics, and silicon carbide ceramics, for insulation and heat conduction. The first side (smooth side) of the heat-conducting substrate 101 is directly in contact with the chip 204 to be cooled.

[0044] In some embodiments, the conductive copper film 102 is formed into a tightly bonded thin conductive copper film on the heat-conducting substrate 101 by an evaporation process.

[0045] In some embodiments, the at least one thermoelectric refrigeration structure 103 and the conductive strip 104 provided thereon form a rib array structure to increase the area of the boiling reaction; the distances between the at least one thermoelectric refrigeration structures 103 are the same or different. After the thermoelectric refrigeration structure 103 is energized, the Seebeck effect will occur. One side of the conductive copper film 102 in contact with the heat-conducting substrate 101 absorbs heat and becomes the cold end, and the side in contact with the conductive strip 104 releases heat and becomes the hot end.

[0046] In some embodiments, the conductive strip 104 corresponds to the thermoelectric refrigeration structure 103 one by one. Its material can be a metal with strong heat conduction ability, such as copper; its thickness is within the second preset range. The second preset range can be set according to actual requirements, such as 1mm ± 0.2mm.

[0047] In some embodiments, the portion of the conductive bar 104 in contact with the coolant 202 is a microstructure 105, which can enhance the boiling heat transfer coefficient. It is a porous rough structure formed on the surface of the conductive bar 104 by processes such as sintering, spraying, and laser processing. The purpose is to increase the boiling heat transfer surface area and the number of vaporization nuclei, reduce the initial boiling superheat degree, and increase the critical heat flux density. It includes, but is not limited to, micro-protrusion structures, sintered powder structures, porous foam structures, etc.

[0048] In some embodiments, it is detected that the power consumption of the chip 204 to be cooled increases; an electric current is applied to at least one thermoelectric refrigeration structure 103 through the wire 106; the thermoelectric refrigeration structure 103 operates to rapidly reduce the temperature of the heat conduction substrate 101, and at the same time increase the temperature of the microstructure 105; the cooled heat conduction substrate 101 rapidly absorbs the instantaneous heat generated by the newly added power consumption of the chip 204 to be cooled. After the superheat degree of the microstructure 105 increases, the boiling heat transfer process is strengthened to reduce the boiling heat resistance; as the boiling heat resistance decreases, the heat generated by the subsequent newly added power consumption of the chip is dissipated through the boiling phase change process, maintaining the temperature of the chip 204 to be cooled relatively stable; further, the cold end of the thermoelectric refrigeration structure 103 can rapidly absorb the heat generated by the chip 204 through the heat conduction substrate 101; and due to the increase in the superheat degree of the microstructure 105 on the surface of the heated hot end conductive bar 104, the number of vaporization nuclei on its surface will increase, thereby enhancing the boiling heat transfer process to reduce the boiling heat resistance of the entire heat dissipation device 205.

[0049] Thus, the heat dissipation system provided by the embodiments of the present disclosure can rapidly achieve the effect of temperature transfer by using the thermoelectric refrigeration structure, rapidly reduce the chip temperature by using the cold end to suppress temperature fluctuations; use the hot end to strengthen boiling heat transfer to reduce the boiling heat resistance and accelerate heat dissipation, ensuring that the temperature of the chip to be cooled remains stable and does not show large fluctuations after the thermoelectric refrigeration structure stops working; make full use of the large amount of heat generated at the hot end when the thermoelectric refrigeration structure operates, overcome the low efficiency problem of the traditional thermoelectric refrigeration structure, make full use of the heat transport characteristics of the thermoelectric refrigeration structure, reduce the boiling heat resistance while rapidly absorbing the chip heat, and use short-time rapid adjustment to ensure the subsequent stable operation of the system.

[0050] Figure 2 Fig. 1 shows a first optional structural schematic diagram of the heat dissipation system provided by the embodiments of the present disclosure, which will be described according to each part.

[0051] As Figure 2 shown, the heat dissipation system includes a box body 201, a coolant 202, a main board 203, a heat dissipation device 205, a baseboard management controller 206, a condensation pipe 207, and a condensate 208. The heat dissipation system dissipates heat for the chip 204 to be cooled.

[0052] As Figure 2As shown, the main board 203 can be placed vertically against any side wall of the box body 201, and a chip 204 to be cooled and a baseboard management controller 206 are arranged on the main board 203.

[0053] The baseboard management controller 206 is configured to obtain the power consumption and temperature of the chip 204 to be cooled, and control the power-on or power-off of the heat dissipation device 205 based on the power consumption and temperature, so as to achieve the heat dissipation control of the chip 204 to be cooled.

[0054] In some embodiments, the first side of the heat conduction base 101 of the heat dissipation device 205 is attached to the chip 204 to be cooled, and the main board 203, the chip 204 to be cooled, the heat dissipation device 205 and the baseboard management controller 206 are all immersed in the coolant 202. The coolant 202 can be a two-phase electronic fluorinated liquid, and heat dissipation is carried out through a boiling reaction.

[0055] In some embodiments, inside the box body 201, a condensing pipe 207 is arranged in the space above the liquid level of the coolant 202, and a condensate 208 flows through it. After the coolant 202 boils and vaporizes, it rises from the liquid level of the coolant 202 into the space above the box body 201. After encountering the condensing pipe 207, it is cooled and condensed back into droplets by the condensate 208 in it, and drips back into the coolant 202, so that the coolant 202 maintains the immersion of the main board 203, the chip 204 to be cooled, the heat dissipation device 205 and the baseboard management controller 206.

[0056] In some embodiments, the main board 203 can be placed vertically against any side wall of the box body 201, or can be placed against the bottom end of the box body 201, and the corresponding condensing pipe 207 is arranged on the top surface opposite to the bottom surface of the box body 201.

[0057] In some embodiments, the working principle of the baseboard management controller 206 includes: the baseboard management controller 206 reads the power consumption of the chip 204 to be cooled; if the power consumption of the chip 204 to be cooled increases by more than a preset threshold or the power consumption rising rate is greater than a third preset threshold compared with the power consumption at the previous moment, the baseboard management controller 206 turns on the power supply of the heat dissipation device 205 through the wire 106. After at least one thermoelectric refrigeration structure 103 is energized, it starts to work, forming a hot end and a cold end; the cold end rapidly reduces the temperature of the chip 204 to be cooled through the conductive copper film 102 and the heat conduction base 101; the hot end raises the temperature on the side of the micro-structure 105; the cold end of the heat dissipation device 205 absorbs the heat of the chip 204 to be cooled, suppressing the temperature rise of the chip 204 to be cooled; the temperature of the micro-structure 105 of the heat dissipation device 205 rises, and the surface superheat degree increases, thereby reducing the boiling heat resistance of the heat dissipation device 205; with the reduction of the boiling heat resistance, the heat obtained by the chip 204 to be cooled is more easily dissipated; if the baseboard management controller 206 reads that the temperature of the chip 204 to be cooled does not rise significantly within a certain time interval, it means that the current boiling heat transfer state reaches equilibrium, then the baseboard management controller 206 disconnects the power supply of the heat dissipation device 205, and the thermoelectric refrigeration structure 103 of the heat dissipation device 205 stops working, avoiding excessive heat generation and power waste, and at the same time increasing the flow rate of the condensate 208 in the condenser tube 207 to balance the internal pressure of the box body 201; the heat dissipation device 205 enters the low heat resistance mode, and the heat generated by the chip 204 to be cooled after the power consumption increases is more easily dissipated; further, the heat generated by the boiling heat transfer of the chip 204 to be cooled needs to be exchanged with the coolant 202 to achieve heat dissipation. Therefore, the entire system needs to increase the flow rate of the coolant 202 or reduce the temperature of the coolant 202 after calculating the increase in the power consumption of the chip 204 to be cooled to achieve the balance between heat generation and heat dissipation of the entire system. The third preset threshold can be set according to actual requirements or experimental results.

[0058] Figure 3 FIG. 4 shows a second alternative structural schematic diagram of the heat dissipation system provided by the embodiments of the present disclosure, and will be described according to each part.

[0059] In some embodiments, the heat dissipation system includes a box body 201, a coolant 202, a main board 203, a cold plate housing 304, a cold plate water inlet pipe 307, a cold plate water outlet pipe 308, and a baseboard management controller 206.

[0060] In some embodiments, the main board 203, the cold plate housing 304, the cold plate water inlet pipe 307, the cold plate water outlet pipe 308, and the baseboard management controller 206 are all arranged inside the box body 201.

[0061] In some embodiments, the main board 203 is attached to the inner wall on one side of the box body 201, and the chip 204 to be cooled and the baseboard management controller 206 are arranged on the main board 203; as Figure 3As shown, the main board 203 is disposed at the bottom of the box body 201, and a chip to be cooled 204 and a baseboard management controller 206 are arranged on the main board 203; the first side of the heat conduction base of the heat dissipation device 205 is attached to the chip to be cooled 204.

[0062] In some embodiments, the heat dissipation device 205 is covered with a cold plate housing 304, and there is a coolant 202 in the cold plate housing 304, and the coolant 202 submerges the heat dissipation device 205; the cold plate inlet pipe 307 and the cold plate outlet pipe 308 are respectively arranged on the first side and the second side of the cold plate housing 304; the cold plate inlet pipe 307 is used to input the coolant 202 into the cold plate housing; the cold plate outlet pipe 308 is used to discharge the vaporized coolant 202 and the liquid coolant 202 in the cold plate housing.

[0063] In some embodiments, the horizontal plane corresponding to the cold plate inlet pipe 307 is lower than the horizontal plane corresponding to the cold plate outlet pipe 308, which is convenient for the vaporized coolant 202 to be discharged from the cold plate housing 304; the cold plate inlet pipe 307 and the cold plate outlet pipe 308 are respectively arranged on the first side and the second side of the cold plate housing 304, so that the coolant 202 can fully contact the heat dissipation device 205 in the cold plate housing, improving the heat dissipation efficiency.

[0064] In some embodiments, the main board 203 is arranged parallel to the horizontal plane corresponding to the cold plate inlet pipe 307.

[0065] In some embodiments, the main board 203 can also be attached to any side wall of the box body 201. Correspondingly, the cold plate inlet pipe 307 can be arranged at the bottom end of the cold plate housing (parallel to the horizontal plane where the liquid level in the cold plate housing is located) or on the side of the cold plate housing 304, and the distance between the cold plate inlet pipe 307 and the bottom end of the cold plate housing 304 is less than a fifth preset threshold; the cold plate outlet pipe 308 can be arranged at the top end of the cold plate housing (parallel to the horizontal plane where the liquid level in the cold plate housing is located) or on the side of the cold plate housing 304, and the distance between the cold plate outlet pipe 308 and the top end of the cold plate housing 304 is less than a sixth preset threshold. Among them, the fifth preset threshold and the sixth preset threshold can be set according to actual needs.

[0066] In some embodiments, the system can further include a processing device. After the vaporized coolant 202 discharged from the cold plate outlet pipe 308 contacts the processing device, it cools down and becomes liquid droplets; the liquid droplets and the liquid coolant 202 discharged from the cold plate outlet pipe 308 flow back into the cold plate housing 304 through the cold plate inlet pipe 307 again. The processing device can be arranged inside the box body 201 or outside the box body 201. In the case of being arranged outside the box body 201, the cold plate outlet pipe 308 penetrates through any inner wall of the box body 201 to transport the vaporized coolant 202 therein to the processing device.

[0067] The processing device may be composed of a condenser tube, condensate, and a box body. The box body is provided with a liquid inlet and a liquid outlet. The liquid inlet is connected to the cold plate outlet water pipe 308, and the liquid outlet may be connected to the cold plate inlet water pipe 307. The condenser tube contains condensate, which is used to cool and condense the vaporized coolant 202 into a liquid coolant 202.

[0068] In some embodiments, the working principle of the baseboard management controller 206 includes: the baseboard management controller 206 reads the power consumption of the chip to be cooled 204; if the power consumption of the chip to be cooled 204 increases by more than a preset threshold or the power consumption rising rate is greater than a third preset threshold compared to the power consumption at the previous moment, the baseboard management controller 206 turns on the power supply of the heat dissipation device 205 through the wire 106. After at least one thermoelectric refrigeration structure 103 is energized, it starts to work, forming a hot end and a cold end; the cold end rapidly reduces the temperature of the chip to be cooled 204 through the conductive copper film 102 and the heat conduction base 101; the temperature of the micro-structure 105 side at the hot end rises; the cold end of the heat dissipation device 205 absorbs the heat of the chip to be cooled 204, suppressing the temperature rise of the chip to be cooled 204; the temperature of the micro-structure 105 of the heat dissipation device 205 rises, and the surface superheat degree increases, thereby reducing the boiling heat resistance of the heat dissipation device 205; with the reduction of the boiling heat resistance, the heat of the chip to be cooled 204 is more likely to dissipate; if the baseboard management controller 206 reads that the temperature of the chip to be cooled 204 does not rise significantly within a certain time interval, it means that the current boiling heat transfer state reaches equilibrium. Then the baseboard management controller 206 disconnects the power supply of the heat dissipation device 205, and the thermoelectric refrigeration structure 103 of the heat dissipation device 205 stops working, avoiding excessive heat generation and power waste. At the same time, the flow rate of the coolant 202 in the cold plate inlet water pipe 307 is increased to balance the internal pressure of the cold plate housing 304; the heat dissipation device 205 enters the low heat resistance mode, and the heat generated by the chip to be cooled 204 after the power consumption increases is more likely to dissipate; further, the heat generated by the boiling heat transfer of the chip to be cooled 204 needs to be exchanged with the coolant 202 to achieve heat dissipation. Therefore, the entire system needs to increase the flow rate of the coolant 202 or reduce the temperature of the coolant 202 after calculating the increase in the power consumption of the chip to be cooled 204 to achieve the heat generation and heat dissipation balance of the entire system.

[0069] Thus, the heat dissipation system provided by the embodiments of the present disclosure utilizes the heat rapid migration characteristic of the semiconductor thermoelectric refrigeration structure. In the face of the sharp increase in the chip power consumption, the cold end is used to rapidly cool the chip, and the hot end is used to strengthen the boiling heat transfer to reduce the thermal resistance of the heat dissipation device, accelerating the rapid dissipation of heat. It can achieve the rapid suppression of the chip temperature fluctuation caused by the short-term sharp rise or long-term increase of the chip power consumption, solve the disadvantage of slow response in the traditional boiling heat transfer process to a certain extent, and avoid the adverse situation of frequency fluctuation caused by calculating the chip temperature fluctuation; make full use of the temperature transfer characteristic of the thermoelectric refrigeration structure, make full use of the heat at the hot end to reduce the boiling thermal resistance, realize the effective utilization of the heat at the hot end, and avoid the low efficiency problem in the use of the traditional thermoelectric refrigeration structure; at the same time, this adjustment method is feasible, avoiding complex pipeline structures, and can be detected and controlled by the BMC in the server system. The scheme has strong versatility and can be applied to immersion liquid-cooled servers and cold plate liquid-cooled servers.

[0070] Figure 4 Fig. shows an optional flowchart of the heat dissipation method provided by the embodiments of the present disclosure, which will be described according to each part.

[0071] Step S401, obtain the power consumption of the chip to be cooled.

[0072] In some embodiments, the heat dissipation method can be implemented by a baseboard management controller, and the baseboard management control can sample the power consumption of the chip to be cooled at a preset frequency and record the power consumption corresponding to each sampling moment.

[0073] Step S402, in response to the power consumption rising rate of the chip to be cooled being greater than a third preset threshold, transmit power to at least one thermoelectric refrigeration structure through a wire and a conductive copper film.

[0074] In some embodiments, based on at least two adjacent sampling moments and the corresponding power consumption, determine the power consumption rising rate of the chip to be cooled; in response to the power consumption rising rate of the chip to be cooled being greater than a third preset threshold, it indicates that the chip to be cooled starts to run and the temperature will gradually increase, and the heat dissipation system can dissipate heat from the chip to be cooled, then the baseboard management control transmits power to at least one thermoelectric refrigeration structure through a wire and a conductive copper film. The third preset threshold can be set according to actual requirements.

[0075] After the power is transmitted to the thermoelectric refrigeration structure, one side of each thermoelectric refrigeration structure in contact with the heat conduction substrate absorbs heat and becomes the cold end, and the side in contact with the conductive bar releases heat and becomes the hot end; the cold end absorbs the heat generated by the chip to be cooled through the heat conduction substrate to cool the chip to be cooled; the hot end raises the temperature of the micro-structure and increases the number of surface vaporization nuclei at the same time, enhancing the boiling reaction of the coolant, reducing the thermal resistance of the heat dissipation device, and enabling the heat dissipation device to dissipate heat from the chip to be cooled.

[0076] Step S403: Obtain the temperature of the chip to be cooled.

[0077] In some embodiments, the baseboard management controller obtains the temperature of the chip to be cooled within a preset time interval; optionally, the baseboard management controller may sample the temperature of the chip to be cooled within the preset time interval to obtain at least one temperature value. The preset time interval can be set according to actual needs.

[0078] Step S404: In response to the temperature of the chip to be cooled being within a first preset range, stop supplying power to at least one thermoelectric cooling structure.

[0079] In some embodiments, in response to at least one temperature value of the chip to be cooled within the preset time interval being within the first preset range, it indicates that the heat dissipation device has started to work and the temperature balance between the chip generation and the heat dissipation system has been achieved. At this time, power supply to at least one thermoelectric cooling structure can be stopped; since the thermal resistance of the heat dissipation device decreases during power-on and the process of dissipating heat from the chip to be cooled, the heat dissipation device can still dissipate heat from the chip to be cooled after power supply is stopped. The first preset range can be set according to actual needs.

[0080] In some embodiments, after the baseboard management controller stops supplying power to at least one thermoelectric cooling structure, it obtains the power consumption of the chip to be cooled; based on the power consumption of the chip to be cooled, it adjusts the flow rate of the coolant or condensate. Specifically, as the power consumption of the chip to be cooled increases, the heat generated by boiling heat transfer needs to be taken away by the coolant (two-phase electronic fluorinated liquid). Therefore, the heat dissipation system needs to increase the flow rate of the coolant after the power consumption of the chip to be cooled increases to achieve the balance between heat generation and heat dissipation of the entire heat dissipation system.

[0081] Thus, according to the heat dissipation method provided by the embodiments of the present disclosure, the thermal resistance of the heat dissipation device can be reduced by using the heat generated by the chip, the heat dissipation capacity of the heat dissipation device can be enhanced, heat can be fully utilized, and energy waste can be avoided.

[0082] Figure 5 The optional structural schematic diagram of the heat dissipation device provided by the embodiments of the present disclosure is shown, and will be described according to each part.

[0083] In some embodiments, the heat dissipation device 500 includes a first acquisition unit 501, a control unit 502, and a second acquisition unit 503.

[0084] The first acquisition unit 501 is configured to obtain the power consumption of the chip to be cooled; The control unit 502 is configured to, in response to the power consumption rising rate of the chip to be cooled being greater than a third preset threshold, supply power to at least one thermoelectric cooling structure through a wire and a conductive copper film; A second acquisition unit 503, configured to acquire the temperature of the chip to be cooled. The control unit 502 is further configured to stop power transmission to at least one thermoelectric refrigeration structure in response to the temperature of the chip to be cooled being within a first preset range.

[0085] The first acquisition unit is further configured to acquire the power consumption of the chip to be cooled after stopping power transmission to at least one thermoelectric refrigeration structure.

[0086] The control unit 502 is configured to adjust the flow rate of the coolant or condensate based on the power consumption of the chip to be cooled.

[0087] According to an embodiment of the present disclosure, the present disclosure further provides an electronic device and a readable storage medium.

[0088] Figure 6 A schematic block diagram of an exemplary electronic device 800 that can be used to implement the embodiments of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as, for example, a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, for example, a personal digital processor, a cellular phone, a smart phone, a wearable device, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely exemplary and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0089] As Figure 6 shown, the electronic device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the electronic device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0090] A plurality of components in the electronic device 800 are connected to the I / O interface 805, including: an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a magnetic disk, an optical disk, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the electronic device 800 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0091] The computing unit 801 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 801 executes the various methods and processes described above, such as the heat dissipation method. For example, in some embodiments, the heat dissipation method can be implemented as a computer software program tangibly embodied in a machine-readable medium, such as the storage unit 808. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the heat dissipation method described above can be executed. Alternatively, in other embodiments, the computing unit 801 can be configured to execute the heat dissipation method in any other suitable manner (e.g., by means of firmware).

[0092] Various embodiments of the systems and techniques described above in this document can be implemented in digital electronic circuitry, integrated circuit systems, field-programmable gate arrays (FPGA), application-specific integrated circuits (ASIC), application-specific standard products (ASSP), systems-on-chip (SOC), complex programmable logic devices (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special-purpose or general-purpose programmable processor, and can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0093] The program code for implementing the methods of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to the processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the program codes are executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program codes can be executed entirely on the machine, partially on the machine, as an independent software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0094] In the context of this disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0095] In order to provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, speech input, or tactile input).

[0096] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0097] A computer system can include a client and a server. The client and the server are generally remote from each other and typically interact through a communication network. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, can also be a server of a distributed system, or a server combined with a blockchain.

[0098] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and no limitations are imposed herein.

[0099] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "a plurality" means two or more, unless otherwise specifically defined.

[0100] As described above, the above are only specific embodiments of this disclosure, but the protection scope of this disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed in this disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be subject to the protection scope of the claims.

Claims

1. A heat dissipation system, characterized in that: The system comprises: a heat dissipation device (205); The heat dissipation device (205) comprises a heat-conducting substrate (101), a first side of the heat-conducting substrate (101) being attached to the chip to be dissipated (204), and a second side of the heat-conducting substrate (101) being provided with a conductive copper film (102); At least one thermoelectric cooling structure (103) is fixedly arranged on the conductive copper film (102); the thermoelectric cooling structure (103) comprises a structure composed of a P-type semiconductor and an N-type semiconductor; a first side of each thermoelectric cooling structure (103) is fixedly arranged on the conductive copper film (102), and a conductive strip (104) is arranged on the second side; The first side of the conductive strip (104) is bonded to the second side of the thermoelectric cooling structure (103); the second side of the conductive strip (104) is provided with a microstructure (105), and the microstructure (105) is used to increase the boiling heat transfer coefficient of the cooling liquid (202); The conductive copper film (102) is connected to a wire (106), and the wire (106) is a transmission line for feeding power to the thermoelectric cooling structure (103); Power is transmitted or stopped to at least one thermoelectric cooling structure (103) through the conductive copper film (102), thereby achieving heat dissipation of the chip (204) to be cooled.

2. The system according to claim 1, characterized in that In response to power transmission to at least one thermoelectric cooling structure (103) through the wire (106) and the conductive copper film (102), the side of each thermoelectric cooling structure (103) in contact with the heat-conducting substrate (101) absorbs heat to become a cold end, and the side in contact with the conductive strip (104) releases heat to become a hot end; the cold end absorbs heat generated by the chip to be cooled (204) through the heat-conducting substrate (101), thereby cooling the chip to be cooled (204); the hot end increases the temperature of the microstructure (105) and increases the number of vaporization cores on the surface, thereby enhancing the boiling reaction of the coolant (202), reducing the thermal resistance of the heat dissipation device (205), and allowing the heat dissipation device (205) to dissipate heat for the chip to be cooled (204); In response to the temperature of the chip to be cooled (204) being within a first preset range, power transmission is stopped, and the heat dissipation device (205) enters a low thermal resistance mode to continue to dissipate heat for the chip to be cooled.

3. The system according to claim 1, characterized in that The thermally conductive substrate (101) comprises one of aluminum nitride ceramics, silicon carbide ceramics and silicon carbide ceramics.

4. The system according to claim 1, characterized in that The conductive copper film (102) is tightly bonded to the thermal conductive substrate (101) by using an evaporation process.

5. The system according to claim 1, characterized in that The at least one thermoelectric cooling structure (103) and the conductive strips (104) arranged thereon form a rib array structure, thereby increasing the area of ​​the boiling reaction; The distance between the at least one thermoelectric cooling structure (103) is the same or different.

6. The system according to claim 1, characterized in that The conductive strip (104) is made of metal and has a thickness within a second preset range.

7. The system according to claim 1, characterized in that The microstructure (105) comprises a porous rough structure formed on the surface of the conductive strip (104) by using one of a sintering process, a spraying process and a laser processing process; The microstructure (105) comprises one of a protrusion structure, a sintered powder structure and a porous foam structure.

8. The system according to claim 1, characterized in that The system further comprises a box (201), a cooling liquid (202), a mainboard (203), a condensing tube (207), a condensing liquid (208), and a baseboard management controller (206); The mainboard (203) is disposed in close contact with the inner wall of one side of the box body (201), and a chip to be cooled (204) and a baseboard management controller (206) are disposed on the mainboard (203); The cooling liquid (202) is inside the box (201), and the mainboard (203), the heat dissipation device (205), the chip to be cooled (204), and the baseboard management controller (206) are all immersed in the cooling liquid (202); In the box (201), a condenser tube (207) is arranged above the liquid surface of the cooling liquid (202), and contains condensed liquid (208); After the cooling liquid (202) undergoes a boiling reaction and turns into gas and rises, it contacts the condenser (207) and is cooled by the condensate (208) and turns into liquid droplets and falls back.

9. The system according to claim 1, characterized in that: The system further comprises a box (201), a cooling liquid (202), a mainboard (203), a cold plate housing (304), a cold plate water inlet pipe (307), a cold plate water outlet pipe (308), and a baseboard management controller (206); The mainboard (203), the cold plate housing (304), the cold plate water inlet pipe (307), the cold plate water outlet pipe (308) and the baseboard management controller (206) are all arranged inside the box (201); The mainboard (203) is disposed in close contact with the inner wall of one side of the box body (201), and a chip to be cooled (204) and a baseboard management controller (206) are disposed on the mainboard (203); The heat dissipation device (205) and the cooling liquid (202) are arranged inside the cold plate housing (304); The cold plate water inlet pipe (307) and the cold plate water outlet pipe (308) are respectively arranged on a first side and a second side of the cold plate shell (304); The cold plate water inlet pipe (307) is used to input cooling liquid (202) into the cold plate shell; The cold plate water outlet pipe (308) is used to discharge the vaporized coolant (202) and the liquid coolant (202) in the cold plate shell.

10. The system according to claim 9, characterized in that The horizontal plane corresponding to the cold plate water inlet pipe (307) is lower than the horizontal plane corresponding to the cold plate water outlet pipe (308).

11. The system according to claim 9, characterized in that The main board (203) is arranged parallel to a horizontal plane corresponding to the cold plate water inlet pipe (307).

12. The system according to claim 9, characterized in that The system also includes a processing device; The vaporized cooling liquid (202) discharged from the cold plate outlet pipe (308) is cooled and becomes liquid droplets after contacting the processing device; The liquid droplets and the liquid coolant (202) discharged from the cold plate water outlet pipe (308) flow into the cold plate housing (304) again through the cold plate water inlet pipe (307).

13. The system according to claim 8 or 9, characterized in that: The baseboard management controller (206) is used to: Obtaining the power consumption of the chip to be cooled (204); In response to the power consumption increase rate of the chip to be cooled being greater than a third preset threshold, power is transmitted to at least one thermoelectric cooling structure (103) via a wire (106) and a conductive copper film (102); Acquiring the temperature of the chip to be cooled (204); In response to the temperature of the chip to be cooled (204) being within a first preset range, power transmission to at least one thermoelectric cooling structure (103) is stopped.

14. The system according to claim 13, characterized in that After stopping power transmission to at least one thermoelectric cooling structure (103), the baseboard management controller (206) is further used to: Obtaining the power consumption of the chip to be cooled (204); Based on the power consumption of the chip (204) to be cooled, the flow rate of the cooling liquid (202) or the condensing liquid (208) is adjusted.

15. A heat dissipation method, characterized in that: Applied to the heat dissipation system according to any one of claims 1 to 14 above, the method comprises: Obtain the power consumption of the chip to be cooled; In response to the power consumption increase rate of the chip to be cooled being greater than a third preset threshold, power is transmitted to at least one thermoelectric cooling structure through a wire and a conductive copper film; Obtaining the temperature of the chip to be cooled; In response to the temperature of the chip to be cooled being within a first preset range, power supply to at least one thermoelectric cooling structure is stopped.

16. The method according to claim 15, characterized in that The method further comprises: Obtain the power consumption of the chip to be cooled; The flow rate of the cooling liquid or the condensing liquid is adjusted based on the power consumption of the chip to be cooled.

17. A heat dissipation device, characterized in that: The heat dissipation system according to any one of claims 1 to 14 above, wherein the device comprises: A first acquisition unit, used to acquire the power consumption of the chip to be cooled; A control unit, configured to transmit electricity to at least one thermoelectric cooling structure through a wire and a conductive copper film in response to a power consumption increase rate of the chip to be cooled being greater than a third preset threshold; A second acquisition unit, used to acquire the temperature of the chip to be cooled; The control unit is further configured to stop transmitting power to at least one thermoelectric cooling structure in response to the temperature of the chip to be cooled being within a first preset range.

18. An electronic device, characterized in that: include: at least one processor; And a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method described in any one of claims 15-16.

19. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 15-16.

20. A computer program product, characterized in that It comprises a computer program which, when executed by a processor, implements the method according to any one of claims 15-16.

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