LED lamp bead, LED lamp strip and LED product

Abstract

The embodiment of the invention provides an LED lamp bead, an LED lamp strip and an LED product, and the LED lamp bead comprises an insulating seat which is recessed from the top to form a first reflection cup; the conductive pin and the insulating base are integrally formed in an embedded mode, the conductive pin is provided with a die bonding part, and the die bonding part is located in the first reflection cup; the light-emitting wafer is arranged in the first reflection cup, is positioned on the wafer fixing part of the conductive pin, and is electrically connected with the first power supply pin; the driving chip is arranged in the first reflection cup, located on the die bonding part of the conductive pin and electrically connected with the second power supply pin and the grounding pin, and the light-emitting wafer is electrically connected with the grounding pin through the driving chip; wherein the first power supply pin is electrically connected with a first power supply, the second power supply pin is electrically connected with a second power supply, and the power supply voltage corresponding to the first power supply is greater than the power supply voltage corresponding to the second power supply; and the driving chip is electrically connected with the signal input pin and the signal output pin so as to control the light-emitting wafer to emit light according to a control signal input by the signal input pin.

Description

Technical Field

[0001] This application relates to the technical field of LEDs, and particularly to an LED lamp bead, an LED light strip, and an LED product. Background Art

[0002] With the wide application of LED lamps in the household, commercial, and public fields, the design of LED drive circuits has received increasing attention. In traditional LED drive circuits, the power supply part (VDD) and the load power supply part (VCC) of the drive IC are usually directly connected in parallel, using a unified power supply voltage, usually 5V. The original intention of this design is to simplify the circuit structure and reduce costs. However, with the growth of application requirements, the logic circuits, some storage, and decoding circuits inside the drive IC only require a power supply voltage of about 3V to operate normally, while the load (such as an LED chip) requires a higher power supply voltage, usually at least greater than the power supply voltage of the chip. When using a unified 5V power supply, the excess voltage inside the drive IC's internal circuit is converted into heat energy through the internal voltage stabilization circuit, resulting in an increase in system power consumption. At the same time, due to the conversion of the excess voltage into heat energy, the temperature of the drive IC and related components rises, affecting the stability and lifespan of the circuit. Especially in the case of long-term high-load operation, the heat problem is particularly serious.

[0003] Therefore, there is an urgent need for an LED lamp bead to solve the problem of excessive power consumption of existing LED lamp beads. Summary of the Invention

[0004] This application provides an LED lamp bead, a preparation method, and an electronic device, aiming to solve the problem that when using a unified 5V power supply, the excess voltage inside the drive IC's internal circuit is converted into heat energy through the internal voltage stabilization circuit, resulting in an increase in system power consumption. At the same time, due to the conversion of the excess voltage into heat energy, the temperature of the drive IC and related components rises, affecting the stability and lifespan of the circuit.

[0005] According to the first aspect of this application, this application provides an LED lamp bead, which includes:

[0006] An insulating base, the insulating base is recessed from the top to form a first reflecting cup;

[0007] A conductive pin, the conductive pin is integrally inlaid and formed with the insulating base, the conductive pin has a die bonding part, the die bonding part is located inside the first reflecting cup, and the conductive pin at least includes a first power supply pin, a second power supply pin, a signal input pin, the signal output pin, and a ground pin;

[0008] A light-emitting wafer, the light-emitting wafer is arranged inside the first reflecting cup and on the die bonding part of the conductive pin, and the light-emitting wafer is electrically connected to the first power supply pin;

[0009] A driving chip, which is arranged in the first reflecting cup and located on the die bonding part of the conductive pin. The driving chip is electrically connected to the second power supply pin and the ground pin, and the light-emitting wafer is electrically connected to the ground pin through the driving chip;

[0010] Wherein, the first power supply pin is electrically connected to a first power supply, the second power supply pin is electrically connected to a second power supply, and the supply voltage corresponding to the first power supply is greater than the supply voltage corresponding to the second power supply; the driving chip is electrically connected to the signal input pin and the signal output pin to control the light-emitting wafer to emit light according to the control signal input by the signal input pin.

[0011] The innovation of this LED lamp bead design mainly lies in its ability to support power supply with two different voltages. This design effectively solves the problem that the excess voltage generated by the driving IC during unified power supply is converted into heat energy, and thus brings a series of beneficial effects:

[0012] Reduce system power consumption: By adopting the power supply method with two different voltages, especially providing a lower power supply voltage for the driving chip, the energy loss in the voltage stabilizing circuit can be reduced, because there is no need to significantly reduce the power supply voltage to match the working voltage of the driving chip. This directly reduces the overall power consumption of the system, which is of great significance for improving energy utilization efficiency.

[0013] Improve circuit stability: The conversion of excess voltage into heat energy will cause the temperature of the driving IC and its surrounding components to rise. The increase in temperature will not only increase power consumption, but more importantly, it will affect the working performance and lifespan of electronic components. This design helps to maintain the temperature of the circuit at a relatively stable level by reducing the internal heat generation, thereby improving the overall stability of the circuit.

[0014] Prolong service life: Due to the reduction of heat generated by voltage conversion and the reduction of overall power consumption, this LED lamp bead can reduce the risk of damage caused by overheating, which helps to prolong the service life of electronic devices. This is particularly important for applications that need to work in high-temperature environments for a long time.

[0015] Optimize signal transmission: The driving chip is directly controlled by the control signal on the signal input pin. In this way, not only can the light-emitting effect of the light-emitting wafer be controlled more precisely, but also the interference and attenuation in the signal transmission process are reduced, improving the control efficiency and response speed.

[0016] Compact design: By arranging both the light-emitting wafer and the driving chip in the first reflecting cup, this design effectively utilizes the limited space, making the structure of the entire LED lamp bead more compact, which is particularly important for miniaturized and integrated electronic products.

[0017] Enhanced light-emitting effect: The design of the first reflector cup helps to concentrate and enhance the light output of the light-emitting wafer, so that a brighter and more concentrated light beam can be obtained without increasing additional power consumption, improving the optical performance of the LED lamp bead.

[0018] In summary, the design of this LED lamp bead not only solves the problems of increased power consumption and temperature rise caused by unified power supply, but also optimizes the performance of the LED lamp bead in multiple aspects, and is applicable to electronic devices that require high efficiency, stability and long life.

[0019] According to the second aspect of the present application, the present application provides an LED lamp bead, which includes:

[0020] An insulating base, the insulating base is recessed from the top to form a first reflector cup;

[0021] A conductive pin, the conductive pin is integrally inlaid and formed with the insulating base, the conductive pin has a die bonding part, the die bonding part is located in the first reflector cup, and the conductive pin at least includes a first power supply pin, a second power supply pin, a signal input pin, the signal output pin and a ground pin;

[0022] A light-emitting wafer, the light-emitting wafer is arranged in the first reflector cup and on the die bonding part of the conductive pin, and the light-emitting wafer is electrically connected to the first power supply pin;

[0023] A driving chip, the driving chip is arranged in the first reflector cup and on the die bonding part of the conductive pin, the driving chip is electrically connected to the second power supply pin and the ground pin, and the light-emitting wafer is electrically connected to the ground pin through the driving chip;

[0024] A decoding chip, the decoding chip is arranged in the first reflector cup and on the die bonding part of the conductive pin, and the decoding chip is electrically connected to the second power supply pin and the ground pin;

[0025] Wherein, the first power supply pin is electrically connected to a first power supply, the second power supply pin is electrically connected to a second power supply, and the supply voltage corresponding to the first power supply is greater than the supply voltage corresponding to the second power supply; the decoding chip is electrically connected to the signal input pin, the decoding chip is electrically connected to the driving chip, the driving chip is electrically connected to the signal output pin, the decoding chip decodes and transcodes the control signal input by the signal input pin and then sends it to the driving chip, and the driving chip controls the light-emitting wafer to emit light.

[0026] In this design scheme, a decoding chip is introduced. This chip is responsible for appropriately decoding and transcoding the control signals received from the signal input pins, and then transmitting them to the driving chip. Such a design increases the support of the LED lamp beads for complex control signals, enabling them to more accurately adjust the lighting effect according to the input control instructions and adapt to more diverse application scenarios.

[0027] According to the third aspect of the present application, the present application provides an LED light strip, including a plurality of LED lamp beads as described in the first aspect and an LED lamp bead as described in the second aspect; wherein, the LED lamp bead in the first aspect is the first LED lamp bead; the LED lamp bead described in any one of the second aspect is the second LED lamp bead;

[0028] The second LED lamp bead and the plurality of first LED lamp beads are connected in series, and the signal output pin of the second LED lamp bead is connected to the signal input pin of the first one of the plurality of first LED lamp beads; among the plurality of first LED lamp beads, the signal output pin of each first LED lamp bead is connected to the signal input pin of the next LED lamp bead.

[0029] The technical content of this LED light strip is mainly based on the combined use and connection method of two types of LED lamp beads. The first LED lamp bead is an LED lamp bead with a basic lighting function. It controls the light emission of the light-emitting wafer according to the input control signal through a driving chip. In the design of this type of lamp bead, the integrated molding of the conductive pin and the insulating seat has been integrated, which not only enhances the overall mechanical strength of the lamp bead but also simplifies the manufacturing process.

[0030] The second LED lamp bead adds a decoding chip on the basis of the first LED lamp bead, enabling this lamp bead to not only receive and process control signals but also decode and transcode the signals, and then transmit the processed signals to the driving chip to further control the light emission of the light-emitting wafer. The addition of the decoding chip enables the lamp bead to better adapt to various signal control requirements and achieve more complex and precise light control.

[0031] In the design of the LED light strip, the second LED lamp bead serves as the input endpoint of the data signal. Its signal output pin is connected to the signal input pin of the first lamp bead in a series of multiple first LED lamp beads connected in series, and the signal output pin of each first LED lamp bead is sequentially connected to the signal input pin of the next lamp bead. This series connection form realizes the step-by-step transmission of the data signal, enabling the entire LED light strip to display the expected light output effect according to the input data signal.

[0032] The beneficial effects of this LED light strip are mainly reflected in the following aspects:

[0033] Enhanced signal processing capabilities: The introduced decoding chip can decode the input complex signals, improving the adaptability of the LED strip to various control signals and enabling more diverse and complex visual display effects.

[0034] Higher luminous efficiency: By supplying power to the driving chip and the light-emitting wafers with different supply voltages, it is possible to reduce the power consumption of the entire LED strip while ensuring the efficient operation of the light-emitting wafers, thereby improving the overall luminous efficiency.

[0035] Simplified circuit design: Since the insulating base and the conductive pins in the LED lamp beads adopt an integrated inlay molding technology, it not only enhances the structural stability of the lamp beads but also facilitates the subsequent circuit design and strip assembly, reducing the complexity of the connection lines and improving the reliability and aesthetics of the product.

[0036] Easy to install and maintain: The LED strip in a series connection form has a clear connection method between each lamp bead, reducing the difficulty during installation and maintenance and also reducing the possibility of failures caused by poor connections.

[0037] Good scalability: By adjusting the number of the first LED lamp beads in the LED strip and the connection method with the second LED lamp beads, it is possible to easily adjust the length and luminous effect of the LED strip to meet the application requirements in different scenarios.

[0038] In summary, the design of this LED strip not only improves the technical performance but also simplifies the complexity of manufacturing and use, having high application value.

[0039] Fourthly, the embodiments of the present application provide an LED product, which at least includes the LED lamp beads as described in the first aspect, or includes the LED lamp beads as described in the second aspect, or includes the LED strip as described in the third aspect of the claims.

[0040] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. Description of the Drawings

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0042] Figure 1 is one of the schematic structural diagrams of the LED lamp beads provided by an embodiment of the present application;

[0043] Figure 2 It is the second structural schematic diagram of the LED lamp bead provided by an embodiment of the present application;

[0044] Figure 3 It is the third structural schematic diagram of the LED lamp bead provided by an embodiment of the present application;

[0045] Figure 4 It is the fourth structural schematic diagram of the LED lamp bead provided by an embodiment of the present application;

[0046] Figure 5 It is the fifth structural schematic diagram of the LED lamp bead provided by an embodiment of the present application;

[0047] Figure 6 It is the structural schematic diagram of the LED light strip provided by an embodiment of the present application.

[0048] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. Detailed implementation manners

[0049] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0050] It should also be understood that the terms used in the specification of the present application are only for the purpose of describing specific embodiments, and in the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0051] The following will describe in detail some embodiments of the present application with reference to the accompanying drawings. In the case of no conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0052] With the wide application of LED lamps in the household, commercial, and public fields, the design of LED drive circuits has received increasing attention. In traditional LED drive circuits, the power supply part (VDD) of the drive IC and the load power supply part (VCC) are usually directly connected in parallel and adopt a unified power supply voltage, usually 5V. The original intention of this design is to simplify the circuit structure and reduce costs. However, with the growth of application requirements, the logic circuits, some storage, and decoding circuits inside the drive IC only need a power supply voltage of about 3V to work properly, while the load (such as an LED chip) requires a higher power supply voltage, usually at least greater than the power supply voltage of the chip. When using a unified 5V power supply, the excess voltage of the internal circuit of the drive IC is converted into heat energy through the internal voltage stabilization circuit, resulting in an increase in system power consumption. At the same time, due to the conversion of the excess voltage into heat energy, the temperature of the drive IC and related components rises, affecting the stability and lifespan of the circuit. Especially in the case of long-term high-load operation, the heat problem is particularly serious.

[0053] Therefore, there is an urgent need for an LED lamp bead to solve the problem of excessive power consumption of existing LED lamp beads.

[0054] To solve the above problems, please refer to Figure 1 , as Figure 1As shown in the figure, the present application provides an LED lamp bead, which is referred to as the first LED lamp bead 10 in this embodiment. The first LED lamp bead 10 includes an insulating base 11, and the insulating base 11 is recessed from the top to form a first reflecting cup; a conductive pin 12, the conductive pin 12 is integrally inlaid and molded with the insulating base 11, the conductive pin 12 has a die bonding portion, the die bonding portion is located in the first reflecting cup, and the conductive pin 12 at least includes a first power supply pin, a second power supply pin, a signal input pin, the signal output pin and a ground pin; a light-emitting wafer 13, the light-emitting wafer 13 is disposed in the first reflecting cup and on the die bonding portion of the conductive pin 12, and the light-emitting wafer 13 is electrically connected to the first power supply pin; a driving chip 14, the driving chip 14 is disposed in the first reflecting cup and on the die bonding portion of the conductive pin 12, the driving chip 14 is electrically connected to the second power supply pin and the ground pin, and the light-emitting wafer 13 is electrically connected to the ground pin through the driving chip 14; wherein, the first power supply pin is electrically connected to a first power supply, the second power supply pin is electrically connected to a second power supply, and the supply voltage corresponding to the first power supply is greater than the supply voltage corresponding to the second power supply; the driving chip 14 is electrically connected to the signal input pin and the signal output pin to control the light-emitting wafer 13 to emit light according to the control signal input through the signal input pin.

[0055] Specifically, the insulating base 11 serves as the foundation of the entire LED lamp bead and forms a first reflecting cup by being recessed from the top, which helps to concentrate and improve the light emission efficiency. The conductive pins 12 are integrally inlaid and molded with the insulating base 11, providing connection points to the external circuit. These conductive pins 12 include at least five parts: a first power supply pin, a second power supply pin, a signal input pin, a signal output pin and a ground pin. Among them, the die bonding portion is located in the first reflecting cup and is used to fix the light-emitting wafer 13 and the driving chip 14. The light-emitting wafer 13 is disposed in the first reflecting cup and connected to the die bonding portion of the conductive pin 12. It is electrically connected to the first power supply pin (usually at a higher voltage) to ensure the light emission efficiency. The driving chip 14 is also located in the first reflecting cup and connected to the die bonding portion of the conductive pin 12. The driving chip 14 is connected to the second power supply pin (usually at a lower voltage) and the ground pin, and is used to receive the control signal from the signal input pin and control the light emission of the light-emitting wafer 13 accordingly. Two power supplies are used to power the LED lamp bead, and the voltage of the first power supply is higher than that of the second power supply. Such a design allows the light-emitting wafer 13 to operate at a higher working voltage, thereby increasing the brightness, while the driving chip 14 can work more stably at a lower working voltage, reducing power consumption.

[0056] The following gives a hypothetical application example to help understand the practical application of this technology:

[0057] Application scenario: Outdoor billboard lighting.

[0058] Specific application: In outdoor billboards, LED lamp beads that require high brightness and can remotely control their lighting status are needed. Traditional LED lamp beads often struggle to meet the requirements due to single power supply or complex control circuits. With the LED lamp bead design described above, a high-voltage first power supply can be used to enhance the brightness of the light-emitting wafer 13, ensuring that the brightness of the billboard at night is sufficient to attract attention. At the same time, a low-voltage second power supply is used to power the driving chip 14, enabling the driving chip 14 to operate efficiently with lower power consumption. By receiving signals from the central control system through the signal input pins, remote control of the on, off, or dimming of a single LED lamp bead can be achieved without worrying about the complex control circuit occupying too much space.

[0059] By connecting the light-emitting wafer 13 to the first power supply pin with a higher voltage, the luminous efficiency and brightness of the LED lamp bead can be significantly improved, making it suitable for applications that require high light output.

[0060] Since the driving chip 14 is connected to the second power supply pin with a lower voltage, it has lower power consumption when providing current to drive the light-emitting wafer 13, contributing to energy conservation and emission reduction.

[0061] Through the design of the signal input pins and signal output pins, precise control of a single LED lamp bead can be easily achieved, including switch control, dimming control, etc., greatly enhancing the flexibility of the system design.

[0062] The design of the integrally inlaid insulating seat 11 and the conductive pins 12 not only reduces the overall volume of the LED lamp bead but also simplifies the assembly process and reduces production costs.

[0063] Due to the adoption of a more reasonable power supply method and structural design, the stability and reliability of the LED lamp bead have been significantly improved, extending its service life.

[0064] In summary, this innovative LED lamp bead design not only achieves a breakthrough at the technical level but also brings significant benefits to users and has broad application prospects.

[0065] In some embodiments, it further includes: a vibration elimination module, where the driving chip 14 is connected to the signal output terminal through the vibration elimination module, and / or; the driving chip 14 is connected to the second power supply pin through the vibration elimination module, and / or; the driving chip 14 is connected to the signal input pin through the vibration elimination module; the vibration elimination module is used to eliminate the clock vibration of the driving chip 14.

[0066] In an embodiment, a vibration elimination module is introduced into the design of the LED lamp bead. The function of this module is to eliminate the clock vibration generated by the driving chip 14 during operation. According to different specific connection methods, the vibration elimination module can be connected between the driving chip 14 and the signal output terminal, the second power supply pin, or the signal input pin.

[0067] By connecting the vibration elimination module, electromagnetic interference (EMI) during signal output can be reduced, and the stability and reliability of the signal can be improved. By connecting the vibration elimination module, the power supply voltage can be stabilized, and the vibration caused by power fluctuations can be reduced. By connecting the vibration elimination module, the noise in the input signal can be filtered out, ensuring that the control signal received by the driving chip 14 is purer.

[0068] The vibration elimination module can significantly reduce the influence of clock vibration and other noises, making the signal output more stable and pure. By reducing electromagnetic interference, the signal can be prevented from being interfered during transmission, and the anti-interference ability of the entire system can be improved. Stabilizing the power supply voltage and filtering out the noise in the input signal help improve the stability and reliability of the driving chip 14, thereby extending the service life of the LED lamp bead. Reducing noise and interference can improve the performance of the LED lamp bead in practical applications. For example, in outdoor billboards or stage lighting, users can experience a more stable and high-quality lighting effect.

[0069] Exemplarily, the vibration elimination module includes any one of a resistor or a magnetic bead.

[0070] The magnetic ring can efficiently absorb and eliminate high-frequency noise, reduce electromagnetic interference, and improve the signal transmission quality. Due to the presence of the magnetic ring, the signal output line and input line are more stable during transmission and are not affected by the external electromagnetic environment. A stable power supply voltage and a pure control signal help reduce the working pressure of the driving chip 14 and extend its service life. As a mature electromagnetic interference suppression component, the magnetic ring is simple to install, has a low cost, and will not significantly increase the complexity and production cost of the product.

[0071] Exemplarily, if the vibration elimination module includes a magnetic ring, the magnetic ring is sleeved on the outside of the corresponding line. Both the resistor and the magnetic bead are components with low costs, and the appropriate component can be selected according to specific requirements, which is both economical and practical. The selection of the resistor and the magnetic bead can be flexibly adjusted according to the actual application scenario. For example, a resistor is used in low-frequency applications, and a magnetic bead is used in high-frequency applications, which has high design flexibility. Both the resistor and the magnetic bead can effectively filter out the noise on the signal line and improve the stability and purity of the signal. Using these simple components can simplify the circuit design, reduce complex filter circuits, and lower the design and production difficulty.

[0072] In some embodiments, the first power supply pin, the second power supply pin, and the ground pin are arranged on the insulating base 11 in a preset order; and / or, the second power supply pin, the first power supply pin, and the ground pin are arranged on the insulating base 11 in a preset order.

[0073] As Figure 2 shown, the first power supply pin is VCC, the second power supply pin is VDD, the signal input pin is DI, the signal output pin is DO, and the ground pin is GND. The arrangement of the pins can be designed according to specific requirements, and the embodiments of the present application do not limit this.

[0074] In some embodiments, the number of the light-emitting wafers 13 is multiple; the insulating base 11 is recessed from the top to further form a second reflecting cup opposite to the first reflecting cup, and at least one of the light-emitting wafers 13 is disposed in the second reflecting cup.

[0075] The design of multiple light-emitting wafers 13 can significantly improve the light output of the LED lamp bead, making it perform better in application scenarios that require higher brightness. By setting light-emitting wafers 13 of different colors in different reflecting cups, the combination of multi-color light can be realized, providing a richer lighting effect and color selection. The design of the second reflecting cup helps to further concentrate and improve the light emission efficiency, reduce light loss, and improve the overall light efficiency. The design of multiple light-emitting wafers 13 and the double reflecting cups provides more flexibility for the product, which can be adjusted and optimized according to specific application requirements.

[0076] Exemplarily, the light-emitting wafer 13 includes a red light wafer, a green light wafer, a blue light wafer, and a white light wafer. The red light wafer, the green light wafer, and the blue light wafer are disposed in the first reflecting cup, and the white light wafer is disposed in the second reflecting cup.

[0077] By setting wafers of three colors, red, green, and blue, in the first reflecting cup, the combination of RGB three-color light can be realized, providing a wide range of color selections. By setting the white light wafer in the second reflecting cup, the brightness and stability of the white light can be independently controlled, enhancing the white light output, and being applicable to application scenarios that require high-brightness white light. Wafers of different colors are respectively disposed in different reflecting cups, which helps to achieve a more uniform light distribution, reducing color patches and light spots. By distributing wafers of different colors in different reflecting cups, the design of the control circuit can be simplified, controlling wafers of different colors respectively, and improving the overall efficiency of the system.

[0078] Exemplarily, a protective glue layer is formed between the first reflecting cup and the second reflecting cup, so that during the processing of the first reflecting cup and the second reflecting cup, the corresponding molds of the first reflecting cup and the second reflecting cup will not contact the conductive feet 12.

[0079] The protective glue layer can effectively prevent the physical contact of the mold with the conductive pins 12 during the processing, reduce the risk of damage to the conductive pins 12, and improve the yield rate of the product. Reducing the possibility of damage to the conductive pins 12 helps to improve the stability and reliability of the LED lamp beads and extend their service life. The existence of the protective glue layer simplifies the processing technology, avoids complex protection measures, and improves production efficiency. The protective glue layer can also play a certain sealing role to prevent external pollutants from entering the reflector cup and maintain the optical performance of the LED lamp beads.

[0080] It should be noted that, in some embodiments, the material of the protective glue layer is any one of green oil, white oil, or black oil.

[0081] The protective glue layers of different materials can be selected according to specific application requirements to provide multiple solutions. Green oil, white oil, and black oil are all materials with low costs, suitable for mass production, and have good economic efficiency. The protective glue layers of different materials have differences in transparency, temperature resistance, anti-aging property, etc., and the most suitable material can be selected according to the actual application scenario to optimize the performance. Selecting protective glue layers of different colors can match the color or appearance of the reflector cup to improve the aesthetics and consistency of the product.

[0082] Exemplarily, as Figure 2 shown, the conductive pin 12 further includes a transition pin. The die bonding portion of the transition pin is simultaneously located in the first reflector cup and the second reflector cup. The driving chip 14 is electrically connected to the light-emitting wafer 13 in the second reflector cup through the transition pin.

[0083] The design of the transition pin can simplify the connection between the driving chip 14 and the light-emitting wafer 13 in the second reflector cup, reduce the wiring complexity, and improve the reliability and stability of the circuit. By connecting the light-emitting wafers 13 in the two reflector cups through one transition pin, the integration degree of the product can be improved, the volume can be reduced, and it is convenient to be applied in scenarios with limited space. The existence of the transition pin can optimize the signal transmission path, reduce signal loss, and improve the signal quality and transmission efficiency. The design of the transition pin provides more flexibility for system design and can more conveniently adjust and optimize the connection modes of different color wafers.

[0084] In some embodiments, the supply voltage corresponding to the first power supply is determined according to the number of the light-emitting wafers 13 and the rated voltage of each light-emitting wafer 13, and the supply voltage corresponding to the second power supply is determined according to the rated voltage corresponding to the driving chip 14.

[0085] The voltage of the first power supply is determined according to the number of light-emitting wafers 13 and the rated voltage of each light-emitting wafer 13. Specifically, the voltage of the first power supply should be equal to the sum of the rated voltages of all light-emitting wafers 13 to ensure that each light-emitting wafer 13 can operate at an appropriate voltage. The voltage of the second power supply is determined according to the rated voltage of the driving chip 14 to ensure the stable operation of the driving chip 14.

[0086] By determining the voltage of the first power supply according to the number and rated voltage of the light-emitting wafers 13, it can be ensured that each light-emitting wafer 13 can operate at the optimal working voltage, improving the light-emitting efficiency and brightness. Determining the voltage of the second power supply according to the rated voltage of the driving chip 14 can ensure that the driving chip 14 operates under appropriate working conditions, reducing damage caused by overvoltage or undervoltage, and improving its reliability and stability.

[0087] Reasonably determining the supply voltage can reduce voltage fluctuations, avoid the flashing or damage of lamp beads caused by unstable voltage, and improve the overall reliability of the system. Ensuring that each component operates at its rated voltage can reduce the working stress of the component and extend its service life. Each component operating at an appropriate voltage can reduce unnecessary power consumption and improve the energy efficiency of the entire system. A reasonable supply voltage design can improve the working efficiency of the light-emitting wafer 13 and the driving chip 14, enabling them to produce higher output effects under the same input power.

[0088] In some embodiments, the supply voltage corresponding to the second power supply is less than the withstand voltage of the driving chip 14.

[0089] The voltage of the second power supply is less than the withstand voltage of the driving chip 14. The withstand voltage refers to the maximum voltage that the driving chip 14 can withstand, and exceeding this voltage may cause damage to the driving chip 14. The voltage of the second power supply should be lower than the withstand voltage of the driving chip 14 to ensure that the driving chip 14 operates within a safe range.

[0090] By ensuring that the voltage of the second power supply is less than the withstand voltage of the driving chip 14, damage to the driving chip 14 caused by overvoltage can be avoided, improving the safety of product use. Excessive voltage will cause the temperature of the driving chip 14 to rise, increasing the thermal effect and reducing its service life. A reasonable voltage design can reduce the thermal effect and improve safety. The driving chip 14 can operate more stably at an appropriate working voltage, reducing performance fluctuations caused by too high or too low voltage. Excessive voltage may cause more electromagnetic interference, and reasonable voltage control can reduce interference and improve the stability and purity of the signal. Ensuring that the driving chip 14 operates within the withstand voltage range can reduce the stress on the component and extend its service life. A stable supply voltage helps to improve the reliability of the entire LED lamp bead system and reduce the failure rate.

[0091] Please refer to Figure 3 、 Figure 4 and Figure 5 , an embodiment of the present application provides an LED lamp bead, which is referred to as the second LED lamp bead 20 in this embodiment. The second LED lamp bead 20 includes: an insulating base 11, and the insulating base 11 is recessed from the top to form a first reflecting cup; a conductive lead 12, the conductive lead 12 is integrally embedded and molded with the insulating base 11, the conductive lead 12 has a die bonding portion, the die bonding portion is located in the first reflecting cup, and the conductive lead 12 at least includes a first power supply pin, a second power supply pin, a signal input pin, the signal output pin, and a ground pin; a light-emitting wafer 13, the light-emitting wafer 13 is disposed in the first reflecting cup and on the die bonding portion of the conductive lead 12, and the light-emitting wafer 13 is electrically connected to the first power supply pin; a driving chip 14, the driving chip 14 is disposed in the first reflecting cup and on the die bonding portion of the conductive lead 12, the driving chip 14 is electrically connected to the second power supply pin and the ground pin, and the light-emitting wafer 13 is electrically connected to the ground pin through the driving chip 14; a decoding chip 15, the decoding chip 15 is disposed in the first reflecting cup and on the die bonding portion of the conductive lead 12, the decoding chip 15 is electrically connected to the second power supply pin and the ground pin; wherein, the first power supply pin is electrically connected to a first power supply, the second power supply pin is electrically connected to a second power supply, and the supply voltage corresponding to the first power supply is greater than the supply voltage corresponding to the second power supply; the decoding chip 15 is electrically connected to the signal input pin, the decoding chip 15 is electrically connected to the driving chip 14, the driving chip 14 is electrically connected to the signal output pin, the decoding chip 15 decodes and transcodes the control signal input to the signal input pin and then sends it to the driving chip 14, and the driving chip 14 controls the light-emitting wafer 13 to emit light.

[0092] The insulating base 11 is recessed from the top to form a first reflecting cup. The insulating base 11 is used to support and isolate each conductive pin 12, and at the same time the first reflecting cup is used to concentrate and reflect the light emitted by the light-emitting wafer 13, improving the light efficiency. The conductive pins 12 and the insulating base 11 are integrally formed by inlaying. The die bonding part of the conductive pin 12 is located inside the first reflecting cup. The first power supply pin is electrically connected to the first power supply to provide the operating voltage for the light-emitting wafer 13. The second power supply pin is electrically connected to the second power supply to provide the operating voltages for the driving chip 14 and the decoding chip 15. The signal input pin is electrically connected to the decoding chip 15 to receive an external control signal. The signal output pin is electrically connected to the driving chip 14 to output a control signal. The ground pin is electrically connected to the driving chip 14 and the decoding chip 15 to provide a common ground wire. The light-emitting wafer 13 is disposed inside the first reflecting cup and on the die bonding part of the conductive pin 12. The light-emitting wafer 13 is electrically connected to the first power supply pin and is electrically connected to the ground pin through the driving chip 14. The light-emitting wafer 13 emits light under the control of the driving chip 14 to generate the required light output. The driving chip 14 is disposed inside the first reflecting cup and on the die bonding part of the conductive pin 12. The driving chip 14 is electrically connected to the second power supply pin and the ground pin, and is also electrically connected to the light-emitting wafer 13 and the signal output pin. The driving chip 14 receives the control signal from the decoding chip 15 and controls the light-emitting state of the light-emitting wafer 13.

[0093] The decoding chip 15 is disposed inside the first reflecting cup and on the die bonding part of the conductive pin 12. The decoding chip 15 is electrically connected to the second power supply pin and the ground pin, and is also electrically connected to the signal input pin and the driving chip 14. The decoding chip 15 decodes and transcodes the control signal input by the signal input pin and then sends it to the driving chip 14.

[0094] Through the design of the first reflector cup, the light emitted by the light-emitting chip 13 can be concentrated and reflected, reducing light loss and improving light efficiency. The first power supply pin provides a relatively high supply voltage to ensure that the light-emitting chip 13 operates at the optimal working voltage. The second power supply pin provides a relatively low supply voltage to ensure that the driver chip 14 and the decoding chip 15 operate within a suitable voltage range, reducing the risk of overvoltage. The introduction of the decoding chip 15 enables the LED lamp bead to process complex control signals, improving the flexibility and accuracy of signal processing. Through these two pins, the LED lamp bead can receive external control signals and output the processed signals to achieve more precise control. The conductive pin 12 is integrally embedded and molded with the insulating base 11, reducing the number of connection points and welding points and improving the overall stability of the system. Ensure that each component operates at its rated voltage, reducing the working pressure of the components and extending their service life. Through the reflector cup and reasonable signal processing, electromagnetic interference can be reduced and the anti-interference ability of the components can be improved. All key components (the light-emitting chip 13, the driver chip 14, and the decoding chip 15) are integrated within the first reflector cup, reducing the overall volume and improving the integration degree. Through a reasonable connection method, the design of the control circuit is simplified and the production efficiency is improved.

[0095] Exemplarily, for example, the first power supply pin is connected to an external 12V power supply to provide a working voltage for the light-emitting chip 13. The second power supply pin is connected to an external 3.3V power supply to provide a working voltage for the driver chip 14 and the decoding chip 15. Signal input pin: Connected to an external control signal source to receive a PWM signal. Signal output pin: Connected to an external drive circuit to output the processed PWM signal. Ground pin: Connected to an external ground wire to provide a common ground wire.

[0096] The external control signal is input into the decoding chip 15 through the signal input pin. The decoding chip 15 decodes and transcodes the input control signal into a signal suitable for use by the driver chip 14. The decoding chip 15 sends the processed signal to the driver chip 14 through the signal output pin. The driver chip 14 controls the light-emitting state of the light-emitting chip 13 according to the received signal. The light-emitting chip 13 emits light under the control of the driver chip 14, and the first reflector cup concentrates and reflects the light to improve light efficiency.

[0097] The design of the first reflector cup effectively concentrates and reflects light, reduces light loss, and improves light efficiency. Through a reasonable power supply voltage design, it ensures that each component operates under optimal conditions, reduces component damage, and improves efficiency. The introduction of the decoding chip 15 enables the LED lamp beads to process complex control signals, enhancing the flexibility and accuracy of control. The ground pin and integrated design reduce the connection points and soldering points of the system, improving the overall stability of the system. The reasonable power supply voltage and anti-interference design extend the service life of each component. All key components are integrated within the first reflector cup, reducing the overall volume and facilitating application in space-constrained scenarios.

[0098] In some embodiments, the number of the light-emitting wafers 13 is multiple; the insulating base 11 is recessed from the top and further forms a second reflector cup opposite to the first reflector cup, and at least one of the light-emitting wafers 13 is disposed in the second reflector cup.

[0099] The design of multiple light-emitting wafers 13 can significantly improve the light output of the LED lamp beads, making them perform better in application scenarios that require higher brightness. By arranging light-emitting wafers 13 of different colors in different reflector cups, the combination of multi-color light can be achieved, providing a richer lighting effect and color selection. The design of the second reflector cup helps to further concentrate and improve the light emission efficiency, reduce light loss, and enhance the overall light efficiency. The design of multiple light-emitting wafers 13 and the double reflector cups provides more flexibility for the product, which can be adjusted and optimized according to specific application requirements.

[0100] Exemplarily, the light-emitting wafers 13 include red light wafers, green light wafers, blue light wafers, and white light wafers. The red light wafers, green light wafers, and blue light wafers are disposed in the first reflector cup, and the white light wafer is disposed in the second reflector cup.

[0101] By arranging wafers of three colors, red, green, and blue, in the first reflector cup, the combination of RGB three-color light can be achieved, providing a wide range of color options. By setting the white light wafer in the second reflector cup, the brightness and stability of the white light can be independently controlled, enhancing the white light output and being suitable for application scenarios that require high-brightness white light. Wafers of different colors are respectively disposed in different reflector cups, which helps to achieve a more uniform light distribution, reducing color patches and light spots. By distributing wafers of different colors in different reflector cups, the design of the control circuit can be simplified, and different color wafers can be controlled separately, improving the overall efficiency of the system.

[0102] Exemplarily, a protective glue layer is formed between the first reflector cup and the second reflector cup, so that during the processing of the first reflector cup and the second reflector cup, the corresponding molds of the first reflector cup and the second reflector cup will not contact the conductive pins 12.

[0103] Such as Figure 5The white oil shown is used as a protective glue layer. The protective glue layers of different materials can be selected according to specific application requirements, providing multiple solutions. Green oil, white oil, and black oil are all materials with relatively low costs, suitable for large-scale production, and have good economic efficiency. The protective glue layers of different materials have differences in aspects such as transparency, heat resistance, and anti-aging properties. The most suitable material can be selected according to the actual application scenario to optimize the performance. Selecting protective glue layers of different colors can match the color or appearance of the reflector cup, improving the aesthetics and consistency of the product.

[0104] In some embodiments, the supply voltage corresponding to the first power supply is determined according to the number of the light-emitting wafers 13 and the rated voltage of each of the light-emitting wafers 13, and the supply voltage corresponding to the second power supply is determined according to the rated voltages of the driving chip 14 and the decoding chip 15.

[0105] The voltage of the first power supply is determined according to the number of the light-emitting wafers 13 and the rated voltage of each of the light-emitting wafers 13. Specifically, the voltage of the first power supply should be equal to the sum of the rated voltages of all the light-emitting wafers 13 to ensure that each of the light-emitting wafers 13 can work at an appropriate voltage. The voltage of the second power supply is determined according to the rated voltages of the driving chip 14 and the decoding chip 15 (generally making the rated voltages of the two the same) to ensure the stable operation of the driving chip 14.

[0106] In some embodiments, the supply voltage corresponding to the second power supply is less than the withstand voltages of the driving chip 14 and the decoding chip 15.

[0107] As Figure 6 shown, an embodiment of the present application provides an LED strip, including a plurality of LED lamp beads as described in the corresponding embodiments and an LED lamp bead as described in any one of the corresponding embodiments; wherein, Figures 1 to 2 the LED lamp bead of Figures 3 to 5 is the first LED lamp bead 10; Figures 1 to 2 the LED lamp bead of Figures 3 to 5 is the second LED lamp bead 20;

[0108] The second LED lamp bead 20 is connected in series with a plurality of the first LED lamp beads 10, and the signal output pin of the second LED lamp bead 20 is connected to the signal input pin of the first one of the plurality of the first LED lamp beads 10; among the plurality of the first LED lamp beads 10, the signal output pin of each of the first LED lamp beads 10 is connected to the signal input pin of the next first LED lamp bead 10.

[0109] The LED strip is composed of multiple first LED beads and one second LED bead. The second LED bead and the multiple first LED beads are connected in series through conductive pins 12 to form a continuous circuit. Through the signal input pin and the signal output pin, the step-by-step transmission of the control signal from the second LED bead to the multiple first LED beads is realized.

[0110] Through the decoding chip 15 of the second LED bead, the control signal is processed and transcoded, enabling centralized control of the entire LED strip. The signal is transmitted step by step through the connections between the beads, reducing the complexity of the external control circuit and facilitating installation and maintenance. The multiple first LED beads can achieve combinations of multi-color lights, providing rich lighting effects and color choices. Through the cooperation of the decoding chip 15 and the driving chip 14, dynamic control of each bead can be achieved, such as adjusting the brightness, color temperature, or blinking frequency. The internal reflector cup and protective glue layer design of each bead can reduce electromagnetic interference and improve the stability of the system. All key components are integrated within the bead, reducing external wiring and connection points and enhancing the reliability of the entire strip. Through centralized control and step-by-step signal transmission, the complexity of the external control circuit is reduced, and the cost is lowered. The integrated design of the beads is conducive to mass production, improving production efficiency and reducing the cost of individual beads. Users can increase or decrease the number of first LED beads as needed to achieve LED strips of different lengths. This design can be compatible with various control signal sources, such as PWM signals, digital signals, etc., and has wide applicability.

[0111] Exemplarily, for example, the LED strip is used for home decorative lighting. It includes one second LED bead and 10 first LED beads. The external control signal source provides a PWM signal. The signal output pin of the second LED bead is connected to the signal input pin of the first first LED bead. The signal output pin of each first LED bead is connected to the signal input pin of the next first LED bead. The external PWM signal is input into the decoding chip 15 of the second LED bead through the signal input pin. The decoding chip 15 processes the input PWM signal and converts it into a signal suitable for use by the driving chip 14. The processed signal is transmitted step by step through the signal output pin to the driving chip 14 of each first LED bead. Each driving chip 14 controls the lighting state of the corresponding light-emitting wafer 13 according to the received signal, achieving effects of different colors and brightness.

[0112] Through the centralized control of the second LED lamp beads and the step-by-step transmission of signals, the complexity of the external control circuit is reduced, facilitating installation and maintenance. The multi-color light combination and dynamic control functions enable the LED light strip to be applied to various occasions, providing rich lighting effects. The anti-interference design and integrated design of the lamp beads improve the reliability of the entire light strip and reduce the failure rate. The simplified circuit design and mass production method reduce the manufacturing cost and improve the economy. Users can flexibly increase or decrease the number of lamp beads according to their needs to achieve LED light strips of different lengths, with wide applicability.

[0113] In some embodiments, the decoding chip 15 of the second LED lamp beads decodes and transcodes the control signal input to the signal input pin according to the identification information of each of the first LED lamp beads and the second LED lamp beads, and then transmits it to the driving chips 14 of each of the first LED lamp beads and the second LED lamp beads to control the lighting of each of the first LED lamp beads and the second LED lamp beads.

[0114] The decoding chip 15 of the second LED lamp beads decodes and transcodes the control signal input to the signal input pin according to the identification information of each of the first LED lamp beads and the second LED lamp beads. The processed control signal is transmitted to the driving chips 14 of each of the first LED lamp beads and the second LED lamp beads through the signal output pin to control the lighting state of each lamp bead.

[0115] Each of the first LED lamp beads and the second LED lamp beads has unique identification information, and the decoding chip 15 uses this identification information to identify and control specific lamp beads.

[0116] Through the unique identification information of each lamp bead, the decoding chip 15 can accurately identify and control the lighting state of each lamp bead. Different lighting effects of each lamp bead can be achieved, such as different brightness, colors or blinking frequencies, providing a more rich visual effect. Through decoding and transcoding, various control signal modes can be supported, such as PWM signals, digital signals, etc., improving the flexibility of the system. It can be applied to various occasions such as home decoration, stage effects, advertising displays, etc., providing a more personalized lighting solution.

[0117] The decoding chip 15 can reduce signal interference when processing signals, ensuring that the signals received by each lamp bead are accurate. By centrally processing and gradually transmitting signals, the integrity and stability of the signals are improved, avoiding attenuation and distortion of the signals during long-distance transmission. The connection points between the lamp beads are reduced, reducing the failure rate caused by poor connection. If a certain lamp bead fails, the decoding chip 15 can reallocate the control signals to ensure the normal operation of other lamp beads and improve the overall reliability of the system. Users can flexibly increase or decrease the number of the first LED lamp beads according to needs to achieve LED light strips of different lengths. This design can be compatible with a variety of control signal sources and control systems, having wide applicability. By centrally controlling and gradually transmitting signals, the complexity of the external control lines is reduced, saving wiring resources. Installation and maintenance are more convenient, reducing the installation cost and maintenance difficulty.

[0118] The structural schematic diagram of the LED product provided by the embodiment of the present application. The LED product includes the first LED lamp bead 10, or the second LED lamp bead 20, or the LED light strip provided by any embodiment of the present application.

[0119] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the connection inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0120] In the present application, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0121] The foregoing disclosure provides many different embodiments or examples for implementing the different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described above. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0122] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. An LED lamp bead, characterized in that: The LED lamp beads include: An insulating seat, wherein the insulating seat is concave from the top to form a first reflective cup; the insulating seat is also concave from the top to form a second reflective cup arranged opposite to the first reflective cup, and at least one of the light-emitting chips is arranged in the second reflective cup; A conductive foot, wherein the conductive foot is integrally inlaid with the insulating seat, the conductive foot has a crystal fixing portion, the crystal fixing portion is located in the first reflective cup, and the conductive foot at least includes a first power supply pin, a second power supply pin, a signal input pin, the signal output pin and a ground pin; A light-emitting chip, the light-emitting chip is disposed in the first reflective cup and located on the die-fixing portion of the conductive pin, and the light-emitting chip is electrically connected to the first power supply pin; A driving chip, wherein the driving chip is disposed in the first reflective cup and located on the die-bonding portion of the conductive pin, the driving chip is electrically connected to the second power supply pin and the ground pin, and the light-emitting chip is electrically connected to the ground pin via the driving chip; Among them, the first power supply pin is electrically connected to a first power supply, the second power supply pin is electrically connected to a second power supply, and the power supply voltage corresponding to the first power supply is greater than the power supply voltage corresponding to the second power supply; the driving chip is electrically connected to the signal input pin and the signal output pin to control the light-emitting chip to emit light according to the control signal input by the signal input pin.

2. The LED lamp bead according to claim 1, characterized in that: Also includes: an oscillation elimination module, the driving chip is connected to the signal output terminal via the oscillation elimination module, and / or; The driving chip is connected to the second power supply pin via the oscillation elimination module, and / or; The driving chip is connected to the signal input pin via the oscillation elimination module; the oscillation elimination module is used to eliminate the clock oscillation of the driving chip.

3. The LED lamp bead according to claim 2, characterized in that: The oscillation elimination module includes any one of a resistor or a magnetic bead.

4. The LED lamp bead according to claim 2, characterized in that: If the oscillation elimination module includes a magnetic ring, the magnetic ring is sleeved on the outside of the corresponding circuit.

5. The LED lamp bead according to claim 1, characterized in that: The first power supply pin, the second power supply pin and the ground pin are arranged on the insulating seat in a preset order; and / or, The second power supply pin, the first power supply pin and the ground pin are arranged on the insulating seat in a preset order.

6. The LED lamp bead according to claim 1, characterized in that: The number of the light emitting chips is multiple.

7. The LED lamp bead according to claim 6, characterized in that: The light emitting chips include a red chip, a green chip, a blue chip and a white chip. The red chip, the green chip and the blue chip are arranged in the first reflective cup, and the white chip is arranged in the second reflective cup.

8. The LED lamp bead according to claim 6, characterized in that: A protective rubber layer is formed between the first reflective cup and the second reflective cup, so that during the processing of the first reflective cup and the second reflective cup, the molds corresponding to the first reflective cup and the second reflective cup will not contact the conductive pins.

9. The LED lamp bead according to claim 8, characterized in that: The material of the protective rubber layer is any one of green oil, white oil or black oil.

10. The LED lamp bead according to claim 6, characterized in that: The conductive pin further comprises a transition pin, a crystal-fixing portion of the transition pin is located in both the first reflective cup and the second reflective cup, and the driving chip is electrically connected to the light-emitting chip in the second reflective cup via the transition pin.

11. The LED lamp bead according to claim 1, characterized in that: The supply voltage corresponding to the first power supply is determined according to the number of the light-emitting chips and the rated voltage of each of the light-emitting chips, and the supply voltage corresponding to the second power supply is determined according to the rated voltage corresponding to the driving chip.

12. The LED lamp bead according to claim 1, wherein the supply voltage corresponding to the second power supply is smaller than the withstand voltage of the driving chip.

13. An LED lamp bead, characterized in that: The LED lamp beads include: An insulating seat, wherein the insulating seat is concave from the top to form a first reflective cup; A conductive foot, wherein the conductive foot is integrally inlaid with the insulating seat, the conductive foot has a crystal fixing portion, the crystal fixing portion is located in the first reflective cup, and the conductive foot at least includes a first power supply pin, a second power supply pin, a signal input pin, the signal output pin and a ground pin; A light-emitting chip, the light-emitting chip is disposed in the first reflective cup and located on the die-fixing portion of the conductive pin, and the light-emitting chip is electrically connected to the first power supply pin; A driving chip, wherein the driving chip is disposed in the first reflective cup and located on the die-bonding portion of the conductive pin, the driving chip is electrically connected to the second power supply pin and the ground pin, and the light-emitting chip is electrically connected to the ground pin via the driving chip; A decoding chip, the decoding chip is arranged in the first reflective cup and located on the die-bonding portion of the conductive pin, and the decoding chip is electrically connected to the second power supply pin and the ground pin; Among them, the first power supply pin is electrically connected to the first power supply, the second power supply pin is electrically connected to the second power supply, and the power supply voltage corresponding to the first power supply is greater than the power supply voltage corresponding to the second power supply; the decoding chip is electrically connected to the signal input pin, the decoding chip is electrically connected to the driver chip, and the driver chip is electrically connected to the signal output pin, the decoding chip decodes and transcodes the control signal input by the signal input pin and sends it to the driver chip, and the driver chip controls the light-emitting chip to emit light; the power supply voltage corresponding to the first power supply is determined according to the number of the light-emitting chips and the rated voltage of each of the light-emitting chips, and the power supply voltage corresponding to the second power supply is determined according to the rated voltages corresponding to the driver chip and the decoding chip.

14. The LED lamp bead according to claim 13, characterized in that: There are multiple light-emitting chips; the insulating seat is recessed from the top to form a second reflective cup arranged opposite to the first reflective cup, and at least one light-emitting chip is arranged in the second reflective cup.

15. The LED lamp bead according to claim 14, characterized in that: The light emitting chips include a red chip, a green chip, a blue chip and a white chip. The red chip, the green chip and the blue chip are arranged in the first reflective cup, and the white chip is arranged in the second reflective cup.

16. The LED lamp bead according to claim 14, characterized in that: A protective rubber layer is formed between the first reflective cup and the second reflective cup, so that during the processing of the first reflective cup and the second reflective cup, the molds corresponding to the first reflective cup and the second reflective cup will not contact the conductive pins.

17. The LED lamp bead according to claim 13, characterized in that: The supply voltage corresponding to the second power supply is lower than the withstand voltage of the driving chip and the decoding chip.

18. An LED light strip, characterized in that: The method comprises a plurality of LED lamp beads according to any one of claims 1 to 12 and an LED lamp bead according to any one of claims 13 to 17; wherein the LED lamp bead according to any one of claims 1 to 12 is a first LED lamp bead; and the LED lamp bead according to any one of claims 13 to 17 is a second LED lamp bead; The second LED lamp bead and multiple first LED lamp beads are connected in series, and the signal output pin of the second LED lamp bead is connected to the signal input pin of the first first LED lamp bead among the multiple first LED lamp beads; among the multiple first LED lamp beads, the signal output pin of each first LED lamp bead is connected to the signal input pin of the next first LED lamp bead.

19. The LED light strip according to claim 18, characterized in that: The decoding chip of the second LED lamp bead decodes and transcodes the control signal input from the signal input pin according to the identification information of each of the first LED lamp bead and the second LED lamp bead, and transmits the result to the driving chip of each of the first LED lamp bead and the second LED lamp bead to control the light emission of each of the first LED lamp bead and the second LED lamp bead.

20. An LED product, characterized in that: The LED product at least includes the LED lamp bead according to any one of claims 1 to 12, or includes the LED lamp bead according to any one of claims 13 to 17, or includes the LED light strip according to any one of claims 18 to 19.

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