Surface member, method for manufacturing laminated molded article, and press device

Abstract

The present invention relates to a lamination molding system and a lamination molding method using the same. The lamination molding system is superior to a conventional system in at least one of uniformity of surface pressure distribution during pressurization of a press device, smoothness of a laminated molded article, and mold release at the time of completion of lamination molding. In a lamination molding system (1) comprising a vacuum lamination device (2) and a press device (3) provided in a downstream process of the vacuum lamination device (2), the press device (3) comprises: pressing blocks (317) and (318) attached to at least one of an upper plate (312) and a lower plate (314); buffer parts (321) and (324) attached to the surfaces of the pressing blocks (317) and (318); and metal plates (322) and (325) attached to surfaces of the buffer parts (321) and (324), and surfaces of the metal plates (322) and (325) are formed with coatings (323) and (326) formed of at least one of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, and DLC.

Description

Technical Field

[0001] The present invention relates to a lamination forming system and a lamination forming method using the lamination forming system. The lamination forming system includes a vacuum lamination device, a press device provided in a downstream process of the vacuum lamination device, and a conveying device that conveys an intermediate laminated portion laminated and formed by the vacuum lamination device to the press device. Background Art

[0002] As disclosed in Patent Document 1, a lamination forming system is known, which includes a vacuum lamination device, a press device provided in a downstream process of the vacuum lamination device, and a conveying device that conveys an intermediate laminated portion laminated and formed by the vacuum lamination device to the press device. In Patent Document 1, a flattening machine as a press device is provided in a downstream process of the vacuum lamination device. The flattening machine includes: a buffer portion made of rubber or the like, which has a thickness of about 1.5 mm, attached to the surface of a polishing plate serving as a pressing block; and an elastically deformable mirror plate made of stainless steel or the like, which has a thickness of about 2 mm, attached to the surface of the buffer portion. It is described that during molding, the mirror plate constituting the molding surface is initially elastically deformed according to the unevenness of the product surface, and then gradually returns to its original flat surface due to the elastic deformation of the buffer portion and the elastic deformation of the mirror plate.

[0003] Citation List

[0004] Patent Document

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication JP 2002 - 120100. Summary of the Invention

[0006] However, according to the press device of the conventional lamination forming system, there are cases where at least one of the uniformity of the surface pressure distribution during pressurization, the smoothness of the laminated and formed lamination formed product, and the demoldability at the completion of lamination forming is not entirely satisfactory. Therefore, an object of the present invention is to provide a lamination forming system and a lamination forming method using the lamination forming system, which are improved in at least one of the following aspects compared to the conventional system: the uniformity of the surface pressure distribution during pressurization of the press device, the smoothness of the lamination formed product, and the demoldability at the completion of lamination forming.

[0007] Based on the description and drawings of this specification, other problems and novel features will become apparent.

[0008] The lamination forming system according to claim 1 of the present invention includes a vacuum lamination device, a press device provided in a downstream process of the vacuum lamination device, and a conveying device that conveys an intermediate laminated portion laminated and formed by the vacuum lamination device to the press device. The press device includes a pressing block attached to at least one of an upper plate and a lower plate, a buffer portion attached to a surface of the pressing block, and a metal plate attached to a surface of the buffer portion. A coating formed of at least one of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, and DLC is formed on the surface of the metal plate.

[0009] In the lamination forming system of the present invention, the lamination forming system includes a vacuum lamination device, a press device provided in a downstream process of the vacuum lamination device, and a conveying device that conveys an intermediate laminated portion laminated and formed by the vacuum lamination device to the press device. The press device includes a pressing block attached to at least one of an upper plate and a lower plate, a buffer portion attached to a surface of the pressing block, and a metal plate attached to a surface of the buffer portion. A coating formed of at least one of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, and DLC is formed on the surface of the metal plate. As a result, good results can be obtained in at least one of the uniformity of the surface pressure distribution during pressing, the smoothness of the laminated formed product, and the demolding property when the lamination forming is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic explanatory view of a lamination forming system according to a first embodiment;

[0011] Figure 2 is an enlarged view of a main part of a lamination forming system according to a first embodiment;

[0012] Figure 3 is a schematic explanatory view of a lamination forming system according to a second embodiment;

[0013] Figure 4 is a schematic explanatory view of a lamination forming system according to a third embodiment; and

[0014] Figure 5 is a schematic explanatory view when press forming is performed using a press device of a conventional lamination forming system. DETAILED DESCRIPTION OF THE INVENTION

[0015] Reference will be made to Figure 1A lamination molding system 1 according to a first embodiment of the present invention is described, wherein a vacuum lamination device 2 and a press device 3 are shown in cross-sectional view. In the lamination molding system 1, the press device 3 is provided in a downstream process of the vacuum lamination device 2, and an intermediate lamination portion A4 formed by a substrate A1 having convex and concave portions and being a member to be laminated and a lamination film A2 is press-molded by the press device 3, the substrate A1 having convex and concave portions and being a member to be laminated, and the substrate A1 and the lamination film A2 are conveyed from the vacuum lamination device 2 via carrier films F1 and F2 conveyed by a conveying device.

[0016] The carrier film unwinding device 4 of the conveying device 10 as a transfer device and a tensioning device for the substrate A1 and the laminated film A2 includes a lower unwinding roller 411 and a driven roller 412. The orientation of the lower carrier film F1 unwound from the unwinding roller 411 becomes horizontal at the position of the driven roller 412. The loading table 413 is provided at a position where the lower carrier film F1 becomes horizontal to load the substrate A1 and the laminated film A2, which are components to be formed and are sent in a superimposed state from a previous process. In addition, the carrier film unwinding device 5 of the conveying device 10 includes an upper unwinding roller 414 and a driven roller 415, and the upper carrier film F2 unwound from the unwinding roller 414 is superimposed on the laminated molded product A3 formed by the substrate A1 and the laminated film A2 at the position of the driven roller 415. The substrate A1 and the laminate film A2 are transferred by sandwiching them between these carrier films F1 and F2, and laminated in the vacuum laminating device 2 or the press device 3 via the carrier films F1 and F2, thereby preventing the laminate film A2 from melting and adhering to the device components, and in particular, the press device 3 also has the advantage of imparting a certain buffering effect when the intermediate lamination portion A4 is pressurized. In addition, according to the type of laminated product A5, after the temperature of the laminated product A5 taken out of the press device 3 is lowered, the carrier films F1 and F2 and the laminated product A5 are peeled off, thereby peeling or demolding can be performed under good conditions.

[0017] The vacuum lamination device 2 provided in the downstream process of the carrier film unwinding device 4 of the conveying device 10 presses the lamination molded product A3 formed by the substrate A1 and the lamination film A2 through a pressing body, such as a diaphragm 211, in the chamber C in a vacuum state (reduced pressure state), and laminates and molds the intermediate lamination portion A4 as a primary molded product. The vacuum lamination device 2 is arranged in such a way that the lower plate 213 can be lifted and lowered relative to the fixedly arranged upper plate 212 by a lifting mechanism 214, and when the lower plate 213 rises and contacts the upper plate 212, the chamber C can be formed therein. The chamber C is connected to a vacuum pump (not shown) and is configured to perform decompression. In addition, a heating plate 215 is attached to the lower surface at the center of the upper plate 212, and an elastomer 216, such as a heat-resistant rubber film (not shown), is attached to the surface of the heating plate 215. On the other hand, a heating plate 217 is attached to the upper surface at the center of the lower plate 213. In addition, a diaphragm 211 used as a pressing body and made of a heat-resistant rubber film is attached around the heating plate 217 of the lower plate 213 so as to cover the upper surface of the heating plate 217. Then, the pressurized air is sent to the rear side of the diaphragm 211 by a compressor (not shown), whereby the diaphragm 211 expands in the chamber C and presses the substrate A1 and the lamination film A2 between the diaphragm 211 and the heating plate 217. Note that the diaphragm 211 of the vacuum lamination device 2 can be attached to the upper plate. In addition, the pressing body of the vacuum lamination device can be a pressing body that presses the substrate A1 and the lamination film A2 between roller bodies with an elastomer attached to the surface or between a roller body and a pressing plate.

[0018] The press device 3 provided in the downstream process of the vacuum laminating device 2 in the series direction further presses the intermediate laminating portion A4 that has been pressure-formed by the vacuum laminating device 2, thereby performing pressure-forming to obtain a flatter laminated molded product A5. The intermediate laminating portion A4 includes a substrate A1 as a laminate member having uneven portions and a laminate film A2, and is in a state where the uneven portions exist on the laminate film A2 side. The press device 3 includes a substantially rectangular bottom plate 311 provided on the lower side and tie rods 313 erected between the vicinity of the four corners of the upper plate 312. The upper plate 312 is a substantially rectangular fixed plate located above the bottom plate 31. The press device 3 is designed such that the lower plate 314, which is a substantially rectangular movable plate, can be lifted and lowered between the bottom plate 311 and the upper plate 312. In addition, a pressing cylinder 315 is provided on the bottom plate 311. The pressing cylinder 315 is a press mechanism and is actuated by hydraulic pressure, and the ram 316 of the pressing cylinder 315 is fixed to the back surface of the lower plate 314. Note that the pressing mechanism of the press device 3 according to the first embodiment may be another type, such as a pressing mechanism that uses an electric motor to rotate a ball screw to directly move the lower plate, or a pressing mechanism that uses an electric motor to move the lower plate via a toggle device. In addition, the press device 3 may be a device in which the upper plate descends relative to the lower plate. In addition, the press device 3 according to the first embodiment does not have a chamber that can be in a vacuum state, but may have a chamber that can be in a vacuum state, and perform pressing in this vacuum chamber.

[0019] Pressing blocks 317 and 318 are respectively attached to the opposing surfaces of the upper plate 312 and the lower plate 314 of the press device 3. Next, the pressing block 318 on the lower plate 314 side will be described in detail with reference to Figure 2 Note that, in Figure 2 a buffer portion 321 made of a resin film, a stainless steel metal plate 322 that is a thin metal plate, and a titanium nitride coating 323 are shown. In the length direction ( Figure 2 the horizontal direction in Figure 2 ), their thicknesses ( Figure 2 the vertical direction in

[0020] The buffer portion 321 made of an engineering plastic (such as a polyimide film) or a resin film of a thermosetting resin is laid on the smooth surface 318a of the pressing block 318. The resin film used in the present invention is an engineering plastic film or a thermosetting resin film, and preferably an industrial functional film. Specifically, a film made of an engineering plastic (including super engineering plastics), such as polyimide, or a thermosetting resin film made of a fluororesin is preferred. Particularly preferably, these resin films have a Rockwell R scale hardness of 15 to 140 ((ISO2039-2) and a heat resistance temperature of 150 °C or higher. The thickness of these resin films as the buffer portion 321 is 0.005 mm to 3.00 mm, more preferably 0.05 mm to 1.00 mm. In addition, in addition to the resin, the material of the buffer portion may be an elastomer, a fiber, paper, or a composite thereof.

[0021] A metal plate 322 made of stainless steel or the like is stacked on the surface of the buffer portion 321. In the first embodiment, the surface 318a of the pressing block 318, the buffer portion 321, and the metal plate 322 made of stainless steel have the same shape in a plan view. As an example, in a plan view, the length of one side of the metal plate 322 or the like is 250 mm to 1000 mm, but it is not limited thereto. In addition, the shape of the metal plate 322 or the like may be rectangular or square, and may have various chamfers, concavo-convex portions, etc. for easy installation. When the material of the metal plate 322 is stainless steel, high-hardness martensitic stainless steel (such as SUS440C) is particularly preferably used. Alternatively, particularly preferably, the hardness of the high-hardness stainless steel is 54 or more, or the elastic modulus (×10 3 kg / mm 2 ) is 20.0 or more. Alternatively, the metal forming the metal plate 322 may be stainless steel, nickel, iron, copper, zinc, aluminum, or an alloy of these metals. The thickness of the metal plate 322 is 0.05 mm to 5.0 mm, more preferably 0.3 mm to 3.0 mm.

[0022] In the present invention, a coating 323 formed of at least one of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, and DLC is formed on the surface 322a of the metal plate 322 made of stainless steel or the like. In the present embodiment, more specifically, the coating 323 is formed of titanium nitride (TiN) which is a type of metal nitride. The coating 323 is formed of titanium nitride by an ion plating method which is one of the PVD methods, and the thickness of the coating film of the coating 323 formed of titanium nitride is 0.1 μm to 100 μm. The thickness of the coating formed of a metal nitride, such as titanium nitride, is more preferably 0.3 μm to 2.0 μm. The pressing surface 323a of the surface of the coating 323 formed of a metal nitride, such as titanium nitride, by an ion plating method is polished as needed using a polishing wheel or the like, and is finished to have a surface roughness as described below.

[0023] The roughness of the pressing surface 323a on the surface of the titanium nitride coating 323 formed on the surface 322a of the metal plate 322 is not limited to this. The arithmetic mean roughness Ra (JIS B0601: 2013) is preferably 0.07 μm or less, and particularly preferably, the arithmetic mean roughness Ra is 0.04 μm or less. In addition, the surface roughness of the titanium nitride coating film is preferably 0.06 μm or less in terms of the maximum height roughness Rz (JIS B0601: 2013), and particularly preferably 0.35 μm or less in terms of the maximum height roughness Rz. For the arithmetic mean roughness Ra and the maximum height roughness Rz, it is more preferable to have a smaller lower limit value, but the surface treatment method is selected considering the relationship with cost.

[0024] In addition to TiN, the type of the metal nitride coating can also be a coating obtained by nitriding titanium or a titanium alloy, such as TiC, TiCN, TiAlN. The coating film of the metal nitride other than titanium can be a coating obtained by nitriding, such as CrN, molybdenum nitride or tungsten nitride. In addition, examples of the material applicable to the coating may include DLC, which is a diamond carbide coating. The thickness of such a coating film is also preferably 0.3 μm to 100 μm, and the surface roughness Ra is preferably 0.1 μm or less. Note that as a method for forming the coating film or the like, the most suitable coating film forming method is selected according to the type of the coating, such as the ion plating method, PVD vacuum deposition or sputtering, CVD method, etc.

[0025] The coating can be a coating formed of titanium or a titanium alloy, or nickel or a nickel alloy. These metals form a coating on the surfaces of the stainless steel metal plates 322 and 325 by electroplating or spraying, etc. In addition, the coating can be a mixture of coatings formed of titanium or a titanium alloy, nickel or a nickel alloy, metal nitride or DLC, or the coating can be formed as a multi-layer coating on the metal plates 322 and 325. For example, the intermediate layer can be coated with DLC, such as the surface of a titanium nitride layer, or a metal nitride, such as a titanium nitride coating, can be coated on the surface of an intermediate layer formed of a titanium alloy or a nickel alloy, etc., and the above combinations are appropriately selected.

[0026] The buffer portion 321 and the metal plate 322 made of stainless steel are provided with bolt holes (not shown) at a plurality of positions (e.g., four positions, six positions, or eight positions) around the periphery except for the pressing surface. Then, bolts (not shown) are inserted through the holes from the front side of the metal plate 322 into the bolt holes of the pressing block 318, and the buffer portion 321 and the metal plate 322 made of stainless steel are fixed to the pressing block 318. Note that, in order to allow thermal expansion of the metal plate 322 etc. made of stainless steel, an adjustment portion formed of a hole or a long hole having a cross-sectional area larger than that of the bolt may be provided at the portion where the bolt is inserted. In addition, the buffer portion 321 and the metal plate 322 made of stainless steel may be attached to the pressing block 318 by a retainer other than bolts or by bonding with an adhesive. In the above structure, the pressing block 318 of the press device 3 is provided with the metal plate 322 with the buffer portion 321 interposed therebetween.

[0027] In the press device 3 of the first embodiment, the upper plate 312 also includes a pressing block 317, a buffer portion 324, and a metal plate 325, which have the same side dimensions and area as the lower plate 314. The surface of the metal plate 325 is a stainless steel metal plate 325 coated with a titanium nitride coating 326. However, the metal plate 325 of the pressing block 317 on the upper plate 312 side may be different from the metal plate 322 of the pressing block 318 on the lower plate 314 side in terms of plate thickness, coating type on the surface, or surface roughness.

[0028] In the downstream process of the press device 3, a carrier film unwinding device 5 of the conveying device 10 is provided, which also serves as a conveying device and a tensioning device for the laminated molded product A5. The carrier film unwinding device 5 includes a lower winding roller 511 and a driven roller 512, and the lower carrier film F1 is wound around the winding roller 511. The carrier film unwinding device 5 also includes an upper winding roller 513 and a driven roller 514, at the driven roller 514 the upper carrier film F2 is peeled off from the laminated molded product A5, and the upper carrier film F2 is wound around the upper winding roller 513. A take-out table 515 for the laminated molded product A5 is provided at the portion where only the lower carrier film F1 is conveyed in a horizontal state. Note that a transfer device may be provided as a transfer device for the carrier films F1 and F2 to clamp both sides of the carrier films F1 and F2 and pull them to the downstream process. In addition, the conveying device 10 that conveys the laminated molded object A3 of the lamination molding system 1 to the vacuum lamination device 2 and conveys the intermediate laminated portion A4 laminated and molded by the vacuum lamination device 2 to the press device 3 is not limited to the above description, and may also be, for example, a multi-axis robot.

[0029] Next, a lamination molding method for laminating a substrate A1 and a lamination film A2, which are members to be laminated, using the lamination molding system 1 including the press device 3 of the first embodiment will be described. In the lamination molding system 1 during continuous molding, press molding is performed in a batch mode by sequential control of the diaphragm vacuum lamination device 2 and the press device 3 as a flattening device. However, here, the molding sequence of the substrate A1 and the lamination film A2, which are members to be laminated, for one batch will be described. The upper carrier film F1 and the lower carrier film F2, which are set to unwind from the carrier film unwinding device 4 of the conveying device 10 and wind around the carrier film unwinding device 5, are usually made of polyethylene terephthalate (PET) and have a thickness of 0.01 mm to 0.50 mm, but are not limited thereto. The carrier films F1 and F2 can also be made of other materials such as polyethylene, polypropylene, and polyimide.

[0030] The substrate A1 placed on the placement table 413 of the conveying device 10 is a laminated circuit substrate including uneven portions A1a, and the uneven portions A1a are formed by convex portions A1b having copper foil bonded to the substrate surface and concave portions A1c without copper foil. The thickness (relative to the height of the substrate) of the copper foil is in the range of several μm to several tens of μm, but is not limited thereto, and is usually 0.1 mm or less in most cases. The lamination film A2 is stacked on the top and bottom of the substrate A1 to form a lamination molded product A3 for lamination molding. Note that although one lamination molded product A3 is shown in Figure 1 , multiple lamination molded products A3 can be laminated and molded simultaneously.

[0031] The lamination film A2 in the first embodiment is an insulating film and is used in a state where the PET films laminated on both sides thereof are peeled off from the original storage state. The resin material of the lamination film A2 is a thermosetting resin such as an epoxy resin or a resin having a thermosetting resin as a main component. In addition to the thermosetting resin, various materials and additives are also contained to adjust roughness, impart flame retardancy, impart low expansibility, impart fluidity, impart film-forming properties, generate a low dielectric loss tangent (impart insulation), and reduce moisture content. In particular, in recent years, the type in which the content of inorganic materials has increased has increased to impart roughness adjustment, impart low expansion performance, generate a low dielectric loss tangent, reduce water content, etc. The types of inorganic materials can include SiO 2 etc., but are not limited thereto.

[0032] In the first embodiment, it is preferable to use the lamination film A2 in which the content (volume %) of the inorganic material SiO 2 is 20% or more. In the present invention, as the inorganic material SiO 2A laminated film A2 having a content (volume %) of 20% or more is defined as a laminated film having a high inorganic material content. Examples of the interlayer insulating film "Ajinomoto build-up Film (ABF)" (registered trademark) manufactured by Ajinomoto Fine-Techno Co., Inc. include, but are not limited to, GX13 (Young's modulus (GPa) 4.0), GX92 (Young's modulus (GPa) 5.0), GX-T31 (Young's modulus (GPa) 7.5), Next GX (Young's modulus (GPa) 7.5), GZ41 (Young's modulus (GPa) 9.0), or a film having a Young's modulus (GPa) of 9.0 or more is used as a laminated film having a high inorganic material content.

[0033] Laminated films of products of other companies containing similar materials with a higher inorganic material content are also considered. As described above, these laminated films contain 20% or more by volume or 40% or more by weight of inorganic materials to improve the adhesion to the object to be laminated by reducing the surface roughness of the film, prevent peeling from the substrate by reducing the coefficient of thermal expansion, improve the insulation performance (reduce the dielectric loss), and reduce the water content. In particular, for a substrate for 5G, which is a fifth-generation communication system, even greater precision is required, and thus it is particularly preferable to use a laminated film A2 (interlayer insulating film) having an inorganic material content of 25% or more by volume. The thickness of the laminated film A2 is not limited, and in the interlayer insulating films manufactured by Ajinomoto Fine-Techno Co., Inc. and the like, films having a thickness of 0.01 mm to 0.1 mm are commercially available and widely used. In addition, the laminated film A2 may be a laminated film having a copper foil layer laminated thereon, and such a film is also used in the press device 3 of the lamination molding system 1 of the present invention.

[0034] Then, when the winding rollers 511 and 513 are rotated and driven, the laminated molded product A3 placed on the stage 413 is conveyed together with the upper carrier film F1 and the lower carrier film F2, and is conveyed and positioned in the chamber C of the vacuum laminating device 2 in the open state. Next, the chamber C of the vacuum laminating device 2 is closed, and the interior of the chamber C is evacuated by a vacuum pump (not shown). Then, pressurized air is conveyed to expand the diaphragm 211 into the chamber C, and the laminated molded product A3 formed of the substrate A1 and the laminated film A2 is pressurized between the diaphragm 211 and the elastic body 216 of the heating plate 215 on the upper plate 212 side. At this time, the pressure applied by the diaphragm 211 is, for example, 1.0 MPa or less, and the substrate A1 and the laminated film A2 are combined together in such a manner that the laminated film A2 is embedded in the concave portion A1c of the substrate A1, and the intermediate laminated portion A4 as a primary molded product is laminated and molded. However, the surface of the laminated film A2 of the intermediate laminated portion A4 laminated and formed by the vacuum laminating device remains in a convexoconcave state, which takes the shape of the convexoconcave portion A1a of the substrate A1. In addition, when the laminated film A2 used in this case has a high content of inorganic material, the fluidity of the molten resin is low, so the convexoconcave property is more likely to remain.

[0035] The intermediate laminated portion A4 formed by the substrate A1 having the convex and concave portions A1a and the laminated film A2 being attached to each other is laminated and formed in the vacuum laminating device 2, and then the chamber C is opened. Then, the carrier films F1 and F2 are next supplied by the carrier film unwinding device 5 of the conveying device 10, and the intermediate laminated portion A4 is conveyed between the upper plate 312 and the lower plate 314 of the press device 3, and stops at a predetermined pressurizing position. Next, the pressurizing cylinder 315 of the press device 3 is operated to raise the lower plate 314 and the pressurizing block 318. As described above, the pressurizing block 318 is attached with a stainless steel metal plate 322, which is elastically deformable by a buffer portion 321 having a buffering effect, and has a titanium nitride coating 323 formed on its surface, and the pressurizing surface 323a on the surface of the titanium nitride coating 323 of the stainless steel metal plate 322 contacts the lower substrate film F1, and then the intermediate laminated portion A4 is further pushed upward through the lower substrate film F1. Then, the intermediate lamination portion A4 contacts the pressurizing surface 326a on the surface of the titanium nitride coating 326 on the surface of the stainless steel metal plate 325 of the upper plate 312 via the upper carrier film F2, and then the intermediate lamination portion A4 is pressurized between the upper pressurizing surface 323a and the lower pressurizing surface 326a via the carrier films F1 and F2.

[0036] At this time, the temperature of the press blocks 317 and 318 (heating plates) of the press device 3 varies according to the materials of the substrate A1 and the laminated film A2, and is therefore controlled to be 30°C to 200°C, more preferably 80°C to 140°C, but not limited thereto. If the temperature at this time is too high, the viscosity of the resin material constituting the laminated film is low when it is melted, and the fluidity is too high, causing the resin material constituting the laminated film to flow out from the end of the intermediate laminated portion A4, and it is impossible to obtain a laminated molded product with the required plate thickness and the required insulation layer thickness. In addition, when the temperature of the press blocks 317 and 318 is too high during pressurization, there will also be problems of degradation of the resin material and a longer molding cycle time including cooling in subsequent processes. On the other hand, when the temperature of the press blocks 317 and 318 is too low during pressurization, there will be problems that the viscosity of the resin material is too high to obtain the required fluidity, the laminated film A2 cannot be fully embedded in the substrate A1, and the surface of the laminated molded product A5 does not have sufficient flatness.

[0037] In addition, the pressure (surface pressure) applied to the intermediate lamination portion A4 also varies depending on the materials of the substrate A1 and the laminated film A2, and is therefore controlled to be 0.1MPa-3.0MPa, more preferably 0.5MPa-2.5MPa, but not limited thereto. As with the temperature conditions, when the pressure applied at this time is too strong, the molten resin material constituting the laminated film A2 flows out from the end of the intermediate lamination portion A4, so that the press molding cannot be performed satisfactorily. When the applied pressure is too low, the laminated film A2 cannot be fully embedded in the substrate A1, and the surface of the laminated molded product A5 does not have sufficient flatness.

[0038] In the first embodiment, stainless steel metal plates 322 and 325, which are metal plates having coatings 323 and 326 of titanium nitride or the like formed on their surfaces, are used, and the intermediate laminated portion A4 is pressurized via the carrier films F1 and F2, whereby the smoothness of the intermediate laminated portion A4 can be improved. In addition, by using the stainless steel metal plates 322 and 325 having the titanium nitride coatings 323 and 326 formed thereon and the buffer portions 321 and 324 of the resin film made of polyimide or fluororesin, the uniformity of the surface pressure distribution during the pressurization of the intermediate laminated portion A4 can be improved. Alternatively, by combining the coatings 323 and 326 with the buffer portions 321 and 324 made of the resin film, the resin material of the molten laminated film A2 can be prevented from flowing outward, which is as in the prior art. Figure 5 As shown in FIG. 1 , when the intermediate laminated portion A4 is pressurized between the press blocks 102 and 103 of the press device 101 , stress is concentrated near the end portions A4c and A4d of the intermediate laminated portion A4 during pressurization.

[0039] Then, when the predetermined pressing time has elapsed in the press device 3, the pressing cylinder 315 of the press device 3 is actuated, and the lower plate 314 and the pressing block 318 are lowered. Accordingly, the lower carrier film F1 is separated from the pressing surface 323a of the titanium nitride coating 323 formed on the surface 322a of the metal plate 322 attached to the pressing block 318 on the lower plate 314 side. In addition, the upper carrier film F2 is separated from the pressing surface 326a of the titanium nitride coating 326 formed on the surface of the metal plate 325 attached to the upper plate 312 side. However, in the present invention, since the titanium nitride coatings 323 and 326 are respectively formed on the surfaces of the metal plates 322 and 325, separation from the carrier films F1 and F2 can be performed more easily as compared with the prior art. Accordingly, the phenomenon in which at least one of the carrier films F1 and F2 is separated while still attached to the metal plate in the press device 3, and the laminated molded product A5 molded and pressed between the carrier films F1 and F2 is inadvertently separated from the carrier films F1 and F2 can be minimized.

[0040] Then, when the carrier film unwinding device 5 of the conveying device 10 is actuated in the next molding cycle, the laminated molded product A5 that has been completely laminated and molded in the press device 3 is sent to the take-out table 515 for the laminated molded product A5. At this time, the upper carrier film F2 is satisfactorily separated from the laminated molded product A5 at the driven roller 514. Then, the laminated molded product A5 is taken out from the take-out table 515 by a robot or the like. When the laminated molded product A5 is a substrate for a laminated substrate, the smoothness of the surface is particularly important, and thus the present invention is effective. Note that in the case of a substrate for a laminated substrate, although the surface of the laminated molded product A5 can be very finely roughened with chemicals or the like so as to adhere a copper foil or the like in the next process, since the surface smoothness required by the present invention is a larger-scale smoothness than this, it is important to ensure the smoothness of the laminated molded product A5 for a laminated substrate using the press device 3 in any case.

[0041] Next, reference numerals will mainly be given with respect to Figure 3Description of the differences between the lamination molding system 6 of the second embodiment shown and the lamination molding system 1 of the first embodiment. The press device 8 of the lamination molding system 6 of the second embodiment does not use a diaphragm, and the pressing mechanism, such as the pressing cylinder 821, has substantially the same structure as the press device 3 of the first embodiment. In the press device 8, the pressing blocks 813 and 814 attached to the upper plate 811 and the lower plate 812 respectively include buffer portions 815 and 816, which are buffer portions and are made of resin films such as polyimide, the metal plates 817 and 818 are thin metal plates and are made of stainless steel respectively, and the same titanium nitride coatings 819 and 820 as in the first embodiment are formed on the surfaces of the stainless steel metal plates 817 and 818 respectively. Then, the surfaces of the coatings 819 and 820 are used as the pressing surfaces 819a and 820a respectively. Further, similarly, the lower plate 812 is raised by the pressing cylinder 821, and press molding is performed between the pressing surfaces 819a and 820a.

[0042] The press device 8 of the lamination molding system 6 according to the second embodiment is different from the press device 3 of the first lamination molding system 1 in that the press device 8 is configured such that at least one of the upper plate 811 and the lower plate 812 is formed with side walls 822 and 823, which are chamber forming members, and when the relative distance between the upper plate 811 and the lower plate 812 becomes closer as the lower plate 812 etc. rises, a chamber C is formed. The press device 8 includes a vacuum pump (not shown), which evacuates the inside of the chamber C. Therefore, the press device 8 is a vacuum lamination device.

[0043] In addition, the same press device 3 as in the first embodiment is provided in the downstream process of the press device 8 for secondary molding. The press device 8 includes buffer portions 815 and 816 made of resin films such as polyimide as buffer portions, and stainless steel metal plates 817 and 818 which are thin metal plates. The stainless steel metal plates 817 and 818 of the press device 8, the stainless steel metal plates 817 and 818 of the press device 3, and the stainless steel metal plates 322 and 325 of the press device 3 may be made of the same material or different materials. Further, the coatings such as titanium nitride on the metal plates 817 and 818 and the coatings 323 and 326 such as titanium nitride on the metal plates 322 and 325 may be made of the same material or different materials, and may have the same or different surface roughnesses (arithmetic mean roughness Ra or maximum height roughness Rz). Note that the coatings 323 and 326 such as titanium nitride on the metal plates 322 and 325 of the press device 3 in the subsequent process may have a smaller surface roughness.

[0044] Next, mainly with reference to the reference numerals Figure 4Description of the differences between the lamination forming system 7 of the third embodiment shown and the lamination forming system 1 of the first embodiment. The lamination forming system 7 of the third embodiment is configured such that another similar press device 9 is provided in the downstream process of the press device 3 of the lamination forming system 1 of the first embodiment. In other words, the two press devices 3 and 9 of the lamination forming system 7 are arranged in series in the downstream process of the vacuum lamination device 2. Then, the intermediate lamination portion A4 formed by the substrate A1 with uneven portions and the lamination film A2 conveyed from the vacuum lamination device 2 through the carrier films F1 and F2 is continuously press-formed by the two press devices 3 and 9.

[0045] The press device 9 has substantially the same structure as the press device 3. The pressure blocks 913 and 914 attached to the upper plate 911 and the lower plate 912 respectively include buffer portions 915 and 916 made of a resin film such as polyimide and metal plates 917 and 918 made of stainless steel. Coatings 919 and 920 made of titanium nitride or the like are formed on the surface of the stainless steel metal plate 918, and these surfaces serve as the pressure surfaces 919a and 920a.

[0046] Note that the buffer portions 915 and 916 made of a resin film and the stainless steel metal plates 917 and 918 in the press device 9, and the buffer portions 321 and 324 made of a resin film and the stainless steel metal plates 322 and 325 in the press device 3 may have the same thickness, or one of them may be thicker. In addition, the coatings 919 and 920 made of titanium nitride or the like formed on the metal plates 917 and 918 and the coatings 323 and 326 made of titanium nitride or the like formed on the metal plates 322 and 325 may have the same material or thickness, or one of them may be thicker.

[0047] In the lamination forming method using the lamination forming system 6 of the third embodiment, the laminated and formed intermediate lamination portions A4a and A4b are sequentially sent to the vacuum lamination device 2, the press device 3, and the press device 9. In the case of the two lamination devices as in the first embodiment, the press device 3 generally requires a longer pressing time than the vacuum lamination device 2, and the total forming time is generally determined by the press device 3. However, according to the lamination forming system 7 of the third embodiment, the forming time can be distributed by performing two press-forming operations using the press device 3 and the press device 9, and in most cases, the other press device 3 and the press device 9 can also be used for forming within the forming time required by the vacuum lamination device 2.

[0048] In addition, since the press devices 3 and 9 can be used for two-stage pressure forming, even when the laminated film A2 contains a large amount of inorganic material and has poor fluidity during melting, lamination and forming can be satisfactorily performed. Additionally, the temperatures and applied pressures (surface pressures) of the pressing blocks of the press devices 3 and 9 can be the same or different. As an example, although not limited to this example, the temperature of the pressing block in the press device 3 can be set higher than the temperature of the pressing block in the press device 9 to improve the fluidity of the molten resin material of the laminated film A2, and the press device 9 can apply a higher pressure than the press device 3 to improve the smoothness of the surface of the laminated molded product A5. In the third embodiment, additional devices such as a cooling press device can also be provided in a downstream process of the press device 9.

[0049] Note that as a modification of the third embodiment, a press device having a pressing surface made of an elastic plate such as rubber can be used instead of the press device 3 installed adjacent to the vacuum lamination device 2. In this case, the press device of the present invention is only used for the third-stage lamination forming.

[0050] It is also envisioned that the press devices 3, 8, and 9 of the present invention can be transported in a state where a resin film or metal plate used as a buffer portion is not attached, and later, a metal having a coating such as titanium nitride formed thereon according to the present invention can be attached, and such a configuration is also included in the present invention.

[0051] Although not listed here, the present invention is not limited to the above-described first to third embodiments, and it goes without saying that the present invention can also be applied to modifications made by those skilled in the art based on the spirit of the present invention, or to combinations of the descriptions of the first to third embodiments. The laminated molded products laminated and formed by the lamination forming systems 1, 6, or 7 are particularly suitable for laminated molded products where surface roughness is important, and can be, but are not limited to, other circuit boards, semiconductor wafers, etc. in addition to laminated substrates.

[0052] List of Reference Numerals

[0053] 1, 6, 7 Lamination Forming Systems

[0054] 2 Vacuum Lamination Device

[0055] 3, 8, 9 Press Devices

[0056] 212, 312, 811, 911 Upper Plates

[0057] 213, 314, 812, 912 Lower Plates

[0058] 317, 318, 813, 814, 913, 914 Pressing Blocks

[0059] 321, 324, 815, 816, 915, 916 buffer parts

[0060] 322, 325, 817, 818, 917, 918 metal plates

[0061] 323, 326, 819, 820, 919, 920 coatings

[0062] 323a, 326a, 821a, 822a, 919a, 920a pressure surfaces

Claims

1. A surface member that is provided on the surface of a pressure block used in a lamination molding system for molding a laminated molded product, in which a laminated film is laminated on a substrate, the surface of the pressure block faces the laminated molded product, and the surface member comprises: a first member; and a second member having a chemical composition different from that of the first member, wherein the first member is detachably fixed to the pressure block.

2. The surface member according to claim 1, wherein the surface member has through-holes at at least one position.

3. The surface member according to claim 2, wherein the through-holes have a circular shape.

4. The surface member according to claim 2, wherein the cross-sectional area of the through-holes in the inner diameter direction is larger than the cross-sectional area of the bolt fastening holes provided in the pressure block and used for fixing the surface member to the pressure block in the inner diameter direction.

5. The surface member according to claim 1, wherein the first member is provided on the surface of a buffer portion facing the laminated molded product, the buffer portion is provided between the pressure block and the surface member, and the first member has at least one of protrusions and depressions on the surface in contact with the buffer portion.

6. The surface member according to claim 1, wherein the surface member is formed of a metal plate and a coating applied to the surface of the metal plate.

7. The surface member according to claim 6, wherein the metal plate is formed of an alloy containing at least any one of chemical components Ni, Fe, Cu, Zn, and Al.

8. The surface member according to claim 7, wherein the metal plate is stainless steel.

9. The surface member according to claim 6, wherein the metal plate has a thickness of 0.05 mm to 5.0 mm.

10. The surface member according to claim 6, wherein the coating is formed of a material containing at least any one of chemical components Ti, Ni, Al, Cr, Mo, W, N, and C.

11. The surface member according to claim 10, wherein the coating is formed of a titanium-containing nitrogen compound.

12. The surface member according to claim 6, wherein the coating has a thickness of 0.1 μm to 100 μm.

13. The surface member according to claim 6, wherein the coating has a surface roughness Ra of 0.1 μm or less.

14. The surface member according to claim 6, wherein the coating has a surface roughness Rz of 0.06 μm or less.

15. A method for producing a laminated molded product using a lamination molding system for molding a laminated molded product, in which a laminated film is laminated on a substrate, the method comprises: detachably fixing a surface member having a first member and a second member, the second member having a chemical composition different from that of the first member, to a pressure block of the lamination molding system; and using the pressure generated when the pressure block moves up and down to improve the flatness of the surface of the laminated molded product.

16. A press device, comprising: A pressing mechanism that raises and lowers a pressing block; and A surface member that includes a first member and a second member, the second member having a chemical composition different from that of the first member, the first member being detachably fixed to the pressing block.

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