Probe and electrical connection device

Abstract

The probe includes: a columnar base material having a first end portion and a second end portion, the base material having a polygonal cross-section perpendicular to the axial direction; and a contact film that covers the top end surface of the second end part and the remaining side surface of the second end part except the side surface facing the first direction among the plurality of side surfaces connected to the top end surface of the second end part. The end surface of the contact film covering the top end surface of the second end portion is a plane orthogonal to the axial direction.

Description

Technical Field

[0001] The present invention relates to a probe and an electrical connection device used for inspecting the electrical characteristics of an object to be inspected. Background Art

[0002] In order to inspect the electrical characteristics of an object to be inspected, such as a semiconductor integrated circuit, in a wafer state, an electrical connection device including a probe is used. In the inspection using the probe, one end of the probe is brought into contact with an electrode of the object to be inspected, and the other end of the probe is brought into contact with a terminal (hereinafter referred to as a "pad") disposed on a printed circuit board or the like. The pad is electrically connected to an inspection device such as a tester.

[0003] Prior art documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2015-118064 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In order to accurately inspect the electrical characteristics of an object to be inspected, it is necessary to stably contact the probe with the pad. An object of the present invention is to provide a probe and an electrical connection device capable of stably contacting the pad.

[0008] Means for Solving the Problems

[0009] A probe according to one aspect of the present invention includes: a columnar base material having a first end and a second end, and a cross section of the base material perpendicular to the axial direction is a polygonal shape; and a contact film covering the remaining sides and the top surface of the second end among the plurality of sides of the second end connected to the top surface of the second end, except for the side facing the first direction. An end surface of the contact film covering the top surface of the second end is a plane orthogonal to the axial direction.

[0010] Effects of the Invention

[0011] According to the present invention, it is possible to provide a probe and an electrical connection device capable of stably contacting a pad. Brief Description of the Drawings

[0012] Figure 1 It is a schematic diagram showing the structure of a probe according to an embodiment of the present invention.

[0013] Figure 2 It is Figure 1 a schematic cross-sectional view taken along the line II-II.

[0014] Figure 3It is a schematic perspective view showing the structure of the second end portion of the probe according to an embodiment of the present invention.

[0015] Figure 4 It is a schematic perspective view showing the structure of the second end portion of the probe according to an embodiment of the present invention.

[0016] Figure 5 It is a schematic view showing the structure of the electrical connection device according to an embodiment of the present invention.

[0017] Figure 6 It is a schematic view showing the state where the probe of the first comparative example is in contact with the connection pad.

[0018] Figure 7 It is a schematic view showing the state where the probe according to an embodiment of the present invention is in contact with the connection pad.

[0019] Figure 8 It is a schematic view showing the state where probes not having a wedge shape are arranged adjacent to each other.

[0020] Figure 9 It is a schematic view showing the state where probes having a wedge shape are arranged adjacent to each other.

[0021] Figure 10 It is a schematic perspective view showing the structure of the second end portion of the probe of the second comparative example. Detailed Embodiments

[0022] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and it should be noted that the ratios of the thicknesses of the respective parts are different from the actual ones. In addition, there are of course parts having different dimensional relationships and ratios between the drawings. The embodiments shown below illustrate devices and methods for embodying the technical idea of the present invention, and the embodiments of the present invention do not specify the materials, shapes, structures, arrangements, manufacturing methods, etc. of the constituent parts as the following modes.

[0023] Figure 1 The probe 1 of the embodiment shown is used for inspecting the electrical characteristics of an object to be inspected. The probe 1 includes: a base material 10 having a first end portion 11 as one end portion that comes into contact with the object to be inspected (not shown) during the inspection and a second end portion 12 as the other end portion; and a contact film 13 that covers a part of the second end portion 12 of the base material 10. The base material 10 has a columnar shape extending along the axial direction D3. During the inspection of the object to be inspected, the second end portion 12 comes into contact with the connection pad.

[0024] The cross section of the base material 10 perpendicular to the axial direction D3 (hereinafter simply referred to as "cross section".) is a polygon. Hereinafter, asFigure 2 As shown, the case where the cross-section of the base material 10 is a rectangular shape is illustrated by way of example. The second end portion 12 has four side surfaces connected to the top end surface 121. That is, the second end portion 12 has a first side surface S1 facing the first direction D1, a second side surface S2 facing the direction opposite to the first direction D1, a third side surface S3 facing the second direction D2 perpendicular to the first direction D1, and a fourth side surface S4 facing the direction opposite to the second direction D2. Hereinafter, without separately defining the first side surface S1 to the fourth side surface S4, they are referred to as side surfaces S.

[0025] The contact film 13 covers the remaining side surfaces of the second end portion 12 connected to the top end surface 121 of the second end portion 12 except for the side surface facing the first direction D1 and the top end surface 121 of the second end portion 12. As Figure 2 , Figure 3 and Figure 4 shown, the contact film 13 covers the remaining side surfaces S of the region (hereinafter referred to as "top region 122".) of the second end portion 12 connected to the top end surface 121 except for the first side surface S1 facing the first direction D1. That is, in the probe 1 having a rectangular cross-section, the contact film 13 covers the second side surface S2, the third side surface S3, and the fourth side surface S4 of the top region 122. And, as Figure 1 shown, the contact film 13 covers the top end surface 121 of the second end portion 12. The end surface 131 of the contact film 13 covering the top end surface 121 of the second end portion 12 is a plane orthogonal to the axial direction D3.

[0026] Preferably, as Figure 3 and Figure 4 shown, the corners of the end surface 131 of the contact film 13 are chamfered. Figure 3 and Figure 4 shown, the contact film 13 is R-chamfered at the connection portion between the outer side surface and the end surface 131 when viewed from the first direction D1.

[0027] The top end surface 121 of the second end portion 12 is a plane orthogonal to the axial direction D3. In addition, the top region 122 covered by the contact film 13 is rectangular in shape when viewed from the side in the first direction D1 and the second direction D2. Therefore, the end surface 131 of the contact film 13 covering the top end surface 121 of the second end portion 12 is a plane, and the portion of the contact film 13 covering the side surface S of the second end portion 12 is orthogonal to the end surface 131.

[0028] Preferably, the region (hereinafter referred to as "connection region".) of the second end portion 12 exposed outside the contact film 13 and connected to the top region 122 is a wedge shape in which the cross-section of the base material 10 gradually narrows in the direction toward the top end surface 121, the reason for which will be described later. In Figure 3 and Figure 4 ​​In [the figure], when viewed from the first direction D1, the extension of the third side surface S3 and the extension of the fourth side surface S4 of the side surface S which is the outer side of the connection region 123 intersect the top surface 121 at an obtuse angle. Hereinafter, the side surface S of the connection region 123 where the extension intersects the top surface 121 at an obtuse angle is referred to as the "wedge-shaped side surface".

[0029] In order to electrically connect the electrode of the object to be inspected and the connection pad, the base material 10 and the contact film 13 are made of a conductive material such as a metal material. For example, the contact film 13 can also be formed on the surface of the base material 10 by plating.

[0030] Preferably, the material of the base material 10 and the material of the contact film 13 are selected such that the conductivity of the base material 10 and the conductivity of the contact film 13 are of the same level or the conductivity of the contact film 13 is higher than the conductivity of the base material 10. By selecting the material of the base material 10 and the material of the contact film 13 in this way, the resistance between the probe 1 and the connection pad can be reduced. For example, the base material 10 is preferably made of nickel (Ni), nickel alloy, gold (Au), silver (Ag), copper (Cu), palladium (Pd), palladium alloy, rhodium (Rh), rhodium alloy, other precious metals, etc. The contact film 13 is preferably made of gold (Au), silver (Ag), copper (Cu), other precious metals, etc.

[0031] The probe 1 is used, for example, in Figure 5 the electrical connection device 100 shown. In the electrical connection device 100, the probe 1 is held by the probe head 20. Specifically, a plurality of probes 1 are inserted into the guide holes of the first guide plate 21, the second guide plate 22, and the third guide plate 23 included in the probe head 20 and are held by the probe head 20. Hereinafter, without separately defining the first guide plate 21, the second guide plate 22, and the third guide plate 23, they are referred to as guide plates. The probe head 20 has a structure in which the first guide plate 21, the second guide plate 22, and the third guide plate 23 are arranged separately from each other in the normal direction (Z direction) of the main surface of the guide plate.

[0032] When inspecting the object to be inspected 2, the first end portion 11 of the probe 1 contacts the electrode pad (not shown) of the object to be inspected 2. The contact film 13 covering the top region 122 of the second end portion 12 of the probe 1 contacts the connection pad 31 of the substrate 30. The connection pad 31 is electrically connected to an inspection device such as an IC tester (not shown).

[0033] As Figure 5 shown, for the guide holes penetrated by the same probe 1, the position of the guide hole of the first guide plate 21 is offset in the -X direction parallel to the main surface of the second guide plate 22 with respect to the guide hole of the second guide plate 22. Figure 5It is a side view observed from the Y direction that is orthogonal to both the X direction and the Z direction. Hereinafter, a configuration that offsets the position of the guide hole will be referred to as an "offset configuration". In addition, the direction in which the position of the guide hole is offset will also be referred to as the "offset direction". In Figure 5 , the offset direction is the -X direction. Through the offset configuration, the base material 10 of the probe 1 bends inside the probe head 20. That is, in the hollow region 200 between the first guide plate 21 and the second guide plate 22, the base material 10 is in a bent state by elastic deformation. The positions of the guide holes of the second guide plate 22 and the positions of the guide holes of the third guide plate 23 are the same when observed from the Z direction.

[0034] By offsetting the configuration of the guide holes of the first guide plate 21 and the second guide plate 22, when the first end portion 11 of the probe 1 contacts the inspection object 2, the probe 1 buckles in the hollow region 200. That is, in the contact state where the probe 1 contacts the inspection object 2, the probe 1 further bends from the bent shape in the non-contact state where the probe 1 does not contact the inspection object 2 through flexural deformation. By further bending the probe 1, the probe 1 contacts the inspection object 2 with a predetermined pressure. Therefore, through the offset configuration, the electrical characteristics of the inspection object 2 can be stably measured using the probe 1. The probe 1 has elasticity to return to the shape before contacting the inspection object 2 when it becomes a non-contact state.

[0035] The probe 1 is mounted on the probe head 20 such that the first direction D1 is the same direction as the offset direction. In other words, the first side surface S1 of the second end portion 12 that is not covered by the contact film 13 faces the same direction as the offset direction. Therefore, as will be described below, it is possible to prevent the probe 1 from contacting a connection pad different from a predetermined contact object connection pad (hereinafter referred to as the "object connection pad").

[0036] Hereinafter, a probe of the first comparative example in which all side surfaces S of the second end portion 12 are covered by the contact film 13 will be studied. As Figure 6 shown, due to the offset configuration, the second end portion 12 is likely to be inclined obliquely with respect to the Z direction. At this time, in the probe of the first comparative example in which all side surfaces S of the second end portion 12 are covered by the contact film 13, when the connection pad interval of the substrate 30 is narrow, the contact film 13 covering the second end portion 12 approaches a connection pad (hereinafter also referred to as the "adjacent connection pad") adjacent to the object connection pad 31A in the offset direction. Therefore, it is possible that the contact film 13 contacts the adjacent connection pad 31B. In particular, when the position of the second end portion 12 is offset parallel to the X direction, the contact between the contact film 13 and the adjacent connection pad 31B is likely to occur.

[0037] In contrast, in the probe 1 in which the first side surface S1 is not covered by the contact film 13, as Figure 7As shown, the gap between the contact film 13 and the adjacent connection pad 31B can be ensured to be wide. Therefore, according to the probe 1, contact between the probe 1 and the adjacent connection pad 31B can be suppressed.

[0038] In this way, the probe 1 is liable to be affected by the offset configuration and tilt in the offset direction. In addition, since there are clearances in the XY direction between the probe 1 and the guide holes, the probe 1 may sometimes tilt in the direction orthogonal to the offset direction, that is, the Y direction. As Figure 8 shown, when the probe 1 tilts in the Y direction, it approaches the adjacent probe 1. Therefore, it is preferable that the third side surface S3 and the fourth side surface S4 facing the Y direction are wedge-shaped side surfaces, and the connection region 123 of the second end portion 12 is wedge-shaped. By making the connection region 123 of the second end portion 12 wedge-shaped, as Figure 9 shown, contact between adjacent probes 1 can be suppressed. And by making the connection region 123 wedge-shaped, the contact area of the end surface 131 can be made smaller than the cross-sectional area of the base material 10, so that the pressing force of the probe 1 against the connection pad 31 can be increased, thereby improving the contact stability between the probe 1 and the connection pad 31.

[0039] In the above description, the case where the third side surface S3 and the fourth side surface S4 are wedge-shaped side surfaces is illustratively described. However, which side surface S of the connection region 123 is made into a wedge-shaped side surface is arbitrary. For example, all side surfaces S of the connection region 123 can be made into wedge-shaped side surfaces. Thereby, contact between the probes 1 can be suppressed regardless of the direction in which the probe 1 tilts. Or only one side surface S facing the direction in which the probe 1 is liable to tilt can be made into a wedge-shaped side surface. Thereby, the manufacturing process of the probe 1 can be shortened. In the case where any side surface S is made into a wedge-shaped side surface, by reducing the area of the top surface 121 of the second end portion 12, contact between adjacent probes 1 can be suppressed even if the probe 1 is misaligned.

[0040] As described above, in the probe 1, the contact film 13 covers the top region 122 of the second end portion 12, and the end surface 131 of the contact film 13 is flat. Therefore, according to the probe 1, compared with the probe of the second comparative example Figure 10 shown in which a contact member 15 in contact with the connection pad is embedded in the second end portion 12, the contact between the second end portion 12 and the connection pad can be made stable. That is, in the probe of the second comparative example, the contact with the connection pad is point contact. On the other hand, in the probe 1 in which the top region 122 of the second end portion 12 is covered by the contact film 13, the contact with the connection pad is surface contact. Therefore, the contact between the probe 1 and the connection pad is stable. As a result, good electrical conduction between the object to be inspected and the connection pad can be achieved.

[0041] In addition, in Figure 10In the probe of the second comparative example shown, if the contact with the connection pad is repeated, the contact member 15 deforms and the overall length of the probe becomes shorter. As a result, a gap is generated between the probe and the connection pad, and poor contact between the probe and the connection pad is likely to occur. In contrast, in the electrical connection device 100 of the probe 1 in which the tip region 122 including the second end portion 12 is covered with the contact film 13, deformation of the tip region 122 can be suppressed. Therefore, poor contact between the probe 1 and the connection pad can be prevented. In addition, in the probe 1, since the second end portion 12 of the base material 10 is covered with the contact film 13, it is relatively easy to adjust the composition and film thickness of the film, so the design freedom of the probe 1 can be improved. And, in the probe 1, all the side surfaces S connected to the end surface 131 are orthogonal to the end surface 131. Therefore, compared with a wedge shape in which the cross section of the base material becomes larger as the side surface S is farther from the end surface 131, the contact film 13 obtained by plating process, for example, is suppressed from peeling off from the base material 10, and the durability of the probe 1 can be improved. In particular, since the contact film 13 repeatedly contacts the connection pad, the probe 1 is required to have the durability of the contact film 13. However, since all the side surfaces S are orthogonal to the end surface 131, the contact film 13 is not easily peeled off, and the durability of the probe 1 can be improved.

[0042] As described above, in the probe 1 of the embodiment of the present invention, the end surface 131 of the tip region 122 of the second end portion 12 is covered with the planar contact film 13. Therefore, according to the probe 1, the second end portion 12 and the connection pad can be stably contacted. In addition, the electrical connection device 100 including the probe 1 does not dispose the contact film 13 on the first side surface S1 parallel to the deviation direction of the probe 1 in the tip region 122. Therefore, according to the electrical connection device 100, contact between the probe 1 and an adjacent connection pad can be suppressed. And, according to the electrical connection device 100 of the probe 1 in which the connection region 123 is a wedge shape, contact between adjacent probes 1 can be suppressed.

[0043] (Other embodiments)

[0044] As described above, the present invention has been described using embodiments, but it should not be understood that the description and drawings forming a part of this disclosure limit the present invention. According to this disclosure, those skilled in the art can clearly understand various alternative embodiments, examples, and application techniques.

[0045] For example, in the above description, the case where the cross-sectional shape of the probe 1 is a rectangular shape has been described, but the cross section of the probe 1 may also be other shapes. For example, the cross section of the probe 1 may also be a polygonal shape other than a rectangle. No matter what polygonal shape the cross section of the probe 1 is, as long as the side surface facing the direction opposite to the deviation direction of the probe 1 is not covered with the contact film 13, contact between the probe 1 and an adjacent connection pad can be suppressed.

[0046] In addition, in the above description, the case where the connection region 123 is connected to the tip region 122 covered by the contact film 13 of the probe 1 has been described. However, the contact film 13 does not need to cover all of the tip region 122. For example, it may also be that a surface that is connected to the end face 131 and on which the contact film 13 is not formed on the side opposite to the surface on which the contact film 13 is formed is provided in the tip region 122, and the wedge-shaped connection region 123 is connected to the surface on which the contact film 13 is not formed.

[0047] Thus, the present invention naturally includes various embodiments and the like that are not described in the above description.

[0048] Description of Reference Numerals

[0049] 1, probe; 10, base material; 11, first end; 12, second end; 13, contact film; 20, probe head; 21, first guide plate; 22, second guide plate; 23, third guide plate; 30, substrate; 31, connection pad; 100, electrical connection device; 121, top face; 122, tip region; 123, connection region; 131, end face; S1, first side face; S2, second side face; S3, third side face; S4, fourth side face.

Claims

1. A probe used for inspecting the electrical characteristics of an object, wherein, the probe includes: a columnar base material having a first end and a second end, the first end contacting the object to be inspected during the inspection, and a cross-section of the base material perpendicular to the axial direction being a polygonal shape; and a contact film covering the remaining sides of the second end except for the side facing the first direction among the plurality of sides connected to the top surface of the second end and the top surface of the second end, an end surface of the contact film covering the top surface of the second end being a plane orthogonal to the axial direction.

2. The probe according to claim 1, wherein, when viewed from the first direction, the corners of the end surface of the contact film are chamfered.

3. The probe according to claim 1, wherein, a region of the second end exposed outside the contact film and connected to the region covered by the contact film is a wedge shape in which the cross-section of the base material gradually narrows toward the direction of the top surface.

4. The probe according to claim 1, wherein, the cross-section of the base material perpendicular to the axial direction is a rectangular shape.

5. The probe according to claim 1, wherein, the conductivity of the contact film is higher than that of the base material.

6. An electrical connection device, wherein, the electrical connection device includes: a probe head having a structure in which a first guide plate and a second guide plate each formed with a guide hole are separately arranged; and the probe according to any one of claims 1 to 5, which is inserted into the guide hole and held by the probe head, for the guide holes penetrated by the same probe, the position of the guide hole of the second guide plate is offset and arranged in an offset direction parallel to the main surface of the first guide plate with respect to the guide hole of the first guide plate, and the base material is held in a bent state between the first guide plate and the second guide plate, the first direction being the offset direction.

Images