Inductor component

Abstract

Provided is an inductor component capable of improving inductance acquisition efficiency. The inductor component includes: a green body including a first main surface and a second main surface facing each other; a coil which is provided on the body and is wound in a spiral shape along an axis; and a first external electrode and a second external electrode that are provided on the body, are electrically connected to the coil, and are disposed such that the axis of the coil is parallel to the first main surface, the coil including: a plurality of first coil wirings that are provided on the first main surface side with respect to the axis, and that are arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the opposite side of the first through wiring with respect to the axis, and arranged along the axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are sequentially connected according to the order of the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring so as to form at least a part of a spiral shape, and in a cross section parallel to the first main surface and including the axis, the first through wiring and the second through wiring form a spiral shape. The first through wiring includes an inner peripheral edge facing the shaft side and an outer peripheral edge facing the opposite side from the shaft, and the length of the inner peripheral edge is longer than the length of the outer peripheral edge.

Description

Technical Field

[0001] The present disclosure relates to an inductor component. Background Art

[0002] Conventionally, as an inductor component, there is a component described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has a green compact, a coil disposed in the green compact and wound along an axial direction, and a first external electrode and a second external electrode disposed on the green compact and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns laminated along the axis. The coil patterns adjacent in the axial direction are connected via conductive vias. The coil pattern has a wiring portion extending in a direction orthogonal to the axis and a pad portion provided at an end of the wiring portion and connected to the conductive via. In order to improve the connectivity between the pad portion and the conductive via, the width of the pad portion is wider than the width of the wiring portion.

[0004] Patent Document 1: Japanese Patent No. 6652280

[0005] However, in the inductor component as described above, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located on the inner side in the radial direction of the coil compared with the wiring portion. Therefore, the inner diameter of the coil becomes smaller, and the acquisition efficiency of the inductance is not necessarily high. Summary of the Invention

[0006] Accordingly, the present disclosure provides an inductor component capable of improving the acquisition efficiency of inductance.

[0007] In order to solve the above problems, an inductor component according to an aspect of the present disclosure includes:

[0008] A green compact including a first main surface and a second main surface facing each other;

[0009] A coil disposed on the green compact and wound in a spiral shape along an axis; and

[0010] A first external electrode and a second external electrode disposed on the green compact and electrically connected to the coil,

[0011] The axis of the coil is arranged parallel to the first main surface,

[0012] The coil includes:

[0013] A plurality of first coil wirings disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface;

[0014] A plurality of second coil wirings disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface;

[0015] A plurality of first through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring and are arranged along the above-mentioned axis; and

[0016] A plurality of second through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring, are provided on the opposite side of the above-mentioned axis from the above-mentioned first through wirings, and are arranged along the above-mentioned axis,

[0017] By connecting the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring in this order, at least a part of the above-mentioned spiral shape is formed,

[0018] In a cross-section parallel to the above-mentioned first main surface and including the above-mentioned axis, the above-mentioned first through wiring includes an inner periphery facing the above-mentioned axis side and an outer periphery facing the side opposite to the above-mentioned axis, and the length of the inner periphery is longer than the length of the outer periphery.

[0019] Here, the axis refers to the intersection line of a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring.

[0020] The inner periphery facing the axis side refers to the region of the periphery on the entire circumference of the first through wiring that is projected onto the axis when the first through wiring is projected from a direction orthogonal to the axis toward the axis. The outer periphery facing the side opposite to the axis refers to the region of the periphery on the entire circumference of the first through wiring that is projected onto a virtual line parallel to the axis on the opposite side of the first through wiring when the first through wiring is projected from a direction orthogonal to the axis toward the virtual line. The region of the periphery on the entire circumference of the first through wiring that is parallel to the direction orthogonal to the axis does not correspond to the inner periphery and the outer periphery.

[0021] "The external electrode is provided on the green body" specifically means that the external electrode is provided on the outer surface side of the green body. For example, it includes the case where the external electrode is provided directly above the outer surface of the green body, the case where the external electrode is provided outside the green body via other components on the green body, and the case where the external electrode is provided on the outer surface in a state where a part of the external electrode is buried in the green body.

[0022] According to the above-described embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring, and at least a part of the spiral shape is formed by sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0023] Moreover, since the length of the inner periphery of the first through-wiring is longer than the length of the outer periphery of the first through-wiring, the surface area of the inner surface of the coil can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased.

[0024] To solve the above problems, an inductor component according to one aspect of the present disclosure includes:

[0025] a green body including a first main surface and a second main surface facing each other;

[0026] a coil provided on the green body and wound in a spiral shape along an axis; and

[0027] a first external electrode and a second external electrode provided on the green body and electrically connected to the coil,

[0028] the axis of the coil is arranged parallel to the first main surface,

[0029] the coil includes:

[0030] a plurality of first coil wirings arranged on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface;

[0031] a plurality of second coil wirings arranged on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface;

[0032] a plurality of first through-wirings extending from the first coil wirings toward the second coil wirings and arranged along the axis; and

[0033] a plurality of second through-wirings extending from the first coil wirings toward the second coil wirings, arranged on the side opposite to the first through-wirings with respect to the axis, and arranged along the axis,

[0034] at least a part of the spiral shape is formed by connecting the first coil wirings, the first through-wirings, the second coil wirings, and the second through-wirings in this order.

[0035] When viewed from a direction orthogonal to the first main surface, when a bisector of the angle formed by the first coil wiring and the second coil wiring connected to a reference first through-wiring which is one of the first through-wirings is defined, in a cross-section parallel to the first main surface and including the axis, the reference first through-wiring includes an inner periphery facing the bisector side and an outer periphery facing the side opposite to the bisector, and the length of the inner periphery is longer than the length of the outer periphery.

[0036] Here, the angle formed by the first coil wiring and the second coil wiring refers to the angle between the center line of the width of the first coil wiring and the center line of the width of the second coil wiring when viewed from a direction orthogonal to the first main surface.

[0037] The inner periphery facing the bisector side refers to the region of the periphery on the entire circumference of the reference first through-wiring that is projected onto the orthogonal line when the reference first through-wiring is projected onto the orthogonal line from a direction parallel to the bisector. The outer periphery facing the side opposite to the bisector refers to the region of the periphery on the entire circumference of the reference first through-wiring that is projected onto the virtual line when the reference first through-wiring is projected onto the virtual line from a direction parallel to the bisector, where the virtual line is defined on the side opposite to the orthogonal line and parallel to the orthogonal line with respect to the reference first through-wiring. The region of the periphery on the entire circumference of the reference first through-wiring where the direction orthogonal to the periphery is opposed to the direction parallel to the bisector does not correspond to the inner periphery and the outer periphery.

[0038] According to the above-described embodiment, the coil includes a first coil wiring, a first through-wiring, a second coil wiring, and a second through-wiring. By sequentially connecting the first coil wiring, the first through-wiring, the second coil wiring, and the second through-wiring, at least a part of a spiral shape is formed. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0039] Moreover, since the length of the inner periphery of the reference first through-wiring is longer than the length of the outer periphery of the reference first through-wiring, the surface area of the inner surface of the coil can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased.

[0040] To solve the above problems, an inductor component according to one aspect of the present disclosure includes:

[0041] A green body including a first main surface and a second main surface facing each other;

[0042] A coil provided on the green body and wound in a spiral shape along an axis; and

[0043] A first external electrode and a second external electrode provided on the green body and electrically connected to the coil,

[0044] The axis of the coil is arranged parallel to the first main surface,

[0045] The coil includes:

[0046] A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface;

[0047] A plurality of second coil wirings, disposed on the second main surface side with respect to the above-mentioned axis, and arranged along the above-mentioned axis in a plane parallel to the second main surface;

[0048] A plurality of first through wirings, extending from the first coil wiring toward the second coil wiring, and arranged along the above-mentioned axis; and

[0049] A plurality of second through wirings, extending from the first coil wiring toward the second coil wiring, disposed on the opposite side of the above-mentioned axis from the first through wiring, and arranged along the above-mentioned axis,

[0050] By connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring in this order, at least a part of the above-mentioned spiral shape is formed.

[0051] In a cross-section parallel to the first main surface and including the above-mentioned axis, the first through wiring includes an inner periphery parallel to the above-mentioned axis and facing the axis side, and an outer periphery parallel to the above-mentioned axis and facing the side opposite to the axis, and the length of the inner periphery is longer than the length of the outer periphery.

[0052] According to the above-described embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. By sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of the spiral shape is formed. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of the inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0053] Moreover, since the length of the inner periphery of the first through wiring is longer than the length of the outer periphery of the first through wiring, the inner surface area of the coil can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased.

[0054] To solve the above problems, an inductor component according to one aspect of the present disclosure includes:

[0055] A green body including a first main surface and a second main surface facing each other;

[0056] A coil, disposed on the above-mentioned green body and wound in a spiral shape along an axis; and

[0057] A first external electrode and a second external electrode, disposed on the above-mentioned green body and electrically connected to the above-mentioned coil,

[0058] The above-mentioned axis of the above-mentioned coil is arranged parallel to the above-mentioned first main surface,

[0059] The above coil includes:

[0060] A plurality of first coil wirings, which are disposed on the first main surface side with respect to the above axis and are arranged along the above axis in a plane parallel to the first main surface;

[0061] A plurality of second coil wirings, which are disposed on the second main surface side with respect to the above axis and are arranged along the above axis in a plane parallel to the second main surface;

[0062] A plurality of first through wirings, which extend from the above first coil wiring toward the above second coil wiring and are arranged along the above axis; and

[0063] A plurality of second through wirings, which extend from the above first coil wiring toward the above second coil wiring, are disposed on the opposite side of the above first through wiring with respect to the above axis, and are arranged along the above axis,

[0064] By sequentially connecting the above first coil wiring, the above first through wiring, the above second coil wiring, and the above second through wiring in this order, at least a part of the above spiral shape is formed,

[0065] When viewed from a direction orthogonal to the first main surface, when a bisector of the angle formed by the first coil wiring and the second coil wiring connected to a reference first through wiring among the first through wirings is defined, on a cross-section parallel to the first main surface and including the above axis, the reference first through wiring includes an inner periphery parallel to a direction orthogonal to the bisector and facing the bisector side, and an outer periphery parallel to a direction orthogonal to the bisector and facing the side opposite to the bisector, and the length of the inner periphery is longer than the length of the outer periphery.

[0066] Here, the angle formed by the first coil wiring and the second coil wiring refers to the angle between the center line of the width of the first coil wiring and the center line of the width of the second coil wiring when viewed from a direction orthogonal to the first main surface.

[0067] According to the above embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. By sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of a spiral shape is formed. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0068] Moreover, since the length of the inner periphery of the reference first through-wiring is longer than the length of the outer periphery of the reference first through-wiring, the surface area of the inner surface of the coil can be increased, the resistance value at high frequencies can be reduced, and the Q value at high frequencies can be increased.

[0069] Preferably, in one embodiment of the inductor component, the green body contains SiO 2 .

[0070] According to the above embodiment, insulation and rigidity can be imparted to the green body.

[0071] Preferably, in one embodiment of the inductor component, the inner periphery of the first through-wiring has a curved portion with a convex curve.

[0072] According to the above embodiment, the stress applied to the curved portion of the inner periphery of the first through-wiring can be dispersed.

[0073] Preferably, in one embodiment of the inductor component, the plurality of first through-wirings include two first through-wirings in which the directions of the curved portions of the inner peripheries are different from each other.

[0074] Here, the direction of the curved portion refers to the direction connecting the midpoint of the curved portion and the center line of the first through-wiring.

[0075] According to the above embodiment, the direction of the curved portion of the first through-wiring can be changed according to the arrangement of the first coil wiring and the second coil wiring.

[0076] Preferably, in one embodiment of the inductor component, the length of the inner periphery of the first through-wiring is 1.5 times or more the length of the outer periphery of the first through-wiring.

[0077] According to the above embodiment, the length of the inner periphery of the first through-wiring can be increased, and the resistance value at high frequencies can be further reduced.

[0078] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the first main surface, the first end portion of the first coil wiring is connected to the first end portion of the first through-wiring, and the shape of the outside of the coil of the first end portion of the first coil wiring follows the shape of the outside of the coil of the first end portion of the first through-wiring.

[0079] According to the above embodiment, the shape of the first end portion of the first coil wiring can be made to correspond to the shape of the first end portion of the first through-wiring, and the DC resistance of the connection portion between the first coil wiring and the first through-wiring can be reduced.

[0080] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the first main surface, the angle formed by the first coil wiring and the second coil wiring connected to the same first through-wiring is 5° or more and 45° or less.

[0081] According to the above embodiment, since the coil is wound tightly, the inductance can be increased.

[0082] Preferably, in one embodiment of the inductor component, in a cross-section orthogonal to the direction in which the first coil wiring extends, the upper surface of the first coil wiring on the side opposite to the axis has a convex shape protruding upward in the direction opposite to the axis.

[0083] According to the above embodiment, the distance between the upper surfaces of two adjacent first coil wirings in the axial direction can be increased, the parasitic capacitance between the adjacent first coil wirings can be reduced, and the self-resonant frequency of the inductor component can be increased.

[0084] Preferably, in one embodiment of the inductor component, the first external electrode is disposed on the first coil wiring, and the upper surface of the first coil wiring faces the first external electrode.

[0085] According to the above embodiment, the distance between the first external electrode and the upper surface of the first coil wiring can be increased, the parasitic capacitance between the first external electrode and the first coil wiring can be reduced, and the self-resonant frequency of the inductor component can be increased.

[0086] Preferably, in one embodiment of the inductor component, when viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel.

[0087] According to the above embodiment, the distance between the first through-wiring and the second through-wiring can be increased, the inner diameter of the coil can be increased, and the Q value can be increased.

[0088] Preferably, in one embodiment of the inductor component, the green body contains SiO 2 , and the first through-wiring contains SiO 2 .

[0089] According to the above embodiment, the linear expansion coefficient of the first through-wiring can be made consistent with the linear expansion coefficient of the green body, and cracks between the first through-wiring and the green body can be suppressed.

[0090] Preferably, in one embodiment of the inductor component, the first through-wiring contains a void portion or a resin portion.

[0091] According to the above embodiment, the stress caused by the difference in linear expansion coefficient between the first through-wiring and the green body can be absorbed by the void portion or the resin portion, and thus the stress can be alleviated.

[0092] Preferably, in one embodiment of the inductor component, when viewed in the direction extending from the first through-wiring, the first through-wiring has a conductive layer on the outer peripheral side and a non-conductive layer on the inner side of the conductive layer.

[0093] According to the above embodiment, when used in the high-frequency band, due to the skin effect, the current mainly flows on the surface of the first through-wiring. Therefore, by providing the conductive layer on the outer peripheral side, the Q value will not be reduced. In addition, by providing the non-conductive layer on the inner side, the stress can be alleviated, and the manufacturing cost brought about by not using a conductor can be reduced.

[0094] Preferably, in one embodiment of the inductor component, the axial length of the coil is shorter than the inner diameter of the coil.

[0095] According to the above embodiment, since the coil length is shorter and the inner diameter of the coil is larger, the Q value can be improved.

[0096] Preferably, in one embodiment of the inductor component, the first through-wiring extends in a direction orthogonal to the first main surface, and the cross-sectional area of at least one of the both end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

[0097] According to the above embodiment, the cross-sectional area of the end portion of the first through-wiring can be increased, and the connectivity between the first through-wiring and at least one of the first coil wiring and the second coil wiring can be improved. In addition, when forming a hole portion in the green body and filling the hole portion with a conductive material such as electroplating to form the first through-wiring in the hole portion of the green body, it is easy to fill the conductive material on the opening side of the hole portion. Moreover, since the cross-sectional area of the end portion of the first through-wiring is large and the cross-sectional area of the central portion of the first through-wiring is small, it is easy to form the first through-wiring.

[0098] Preferably, in one embodiment of the inductor component, when viewed in the direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside compared to the outer surface of the green body.

[0099] According to the above embodiment, since the first external electrode and the second external electrode do not contact the outer surface of the green body, when singulating into individual inductor components, the load applied to the first external electrode and the second external electrode can be reduced, and the deformation and peeling of the first external electrode and the second external electrode can be suppressed. Therefore, even if the inductor component is miniaturized, the deformation and peeling of the first external electrode and the second external electrode can be prevented.

[0100] Preferably, in one embodiment of the inductor component, an organic insulator provided on the first main surface is further provided. The green body is an inorganic insulator. When viewed in a direction orthogonal to the first main surface, the organic insulator is located inside compared to the outer surface of the inorganic insulator.

[0101] According to the above embodiment, since there is an organic insulator, the organic insulator is easy to impart fluidity. When covering the first coil wiring with the organic insulator, it is possible to easily fill the organic insulator between adjacent first coil wirings, and the insulation can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating into individual inductor components, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0102] According to the inductor component as one aspect of the present disclosure, the acquisition efficiency of inductance can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0103] Figure 1 It is a schematic perspective view of the inductor component according to the first embodiment viewed from the bottom side.

[0104] Figure 2 is Figure 1 the II-II cross-sectional view.

[0105] Figure 3 is Figure 1 the III-III cross-sectional view.

[0106] Figure 4 It is an XY cross-sectional view of the first through-wiring and the second through-wiring.

[0107] Figure 5 is Figure 1 an enlarged view of a part of

[0108] Figure 6A It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0109] Figure 6B It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0110] Figure 6C It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0111] Figure 6D It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0112] Figure 6E It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0113] Figure 6FIt is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0114] Figure 6G It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0115] Figure 6H It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0116] Figure 6I It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0117] Figure 6J It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0118] Figure 6K It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0119] Figure 6L It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0120] Figure 6M It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0121] Figure 7A It is a cross-sectional view showing a first modification example of the inductor component.

[0122] Figure 7B It is a cross-sectional view showing a second modification example of the inductor component.

[0123] Figure 7C It is a cross-sectional view showing a third modification example of the inductor component.

[0124] Figure 7D It is a cross-sectional view showing a fourth modification example of the inductor component.

[0125] Figure 8 It is a schematic perspective view of the inductor component according to the second embodiment as viewed from the bottom side.

[0126] Figure 9 It is Figure 8 the IX - IX cross-sectional view.

[0127] Figure 10 It is a schematic bottom view of the coil as viewed from the bottom side.

[0128] Figure 11 It is the XY cross-sectional view of the first through-wiring and the second through-wiring.

[0129] Figure 12A It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0130] Figure 12B It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0131] Figure 12C It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0132] Figure 12D It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0133] Figure 12E It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0134] Figure 12F It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0135] Figure 12G It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0136] Figure 12H It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0137] Figure 13A It is a cross-sectional view showing a first modification example of the inductor component.

[0138] Figure 13B It is a cross-sectional view showing a second modification example of the inductor component.

[0139] Figure 13C It is a cross-sectional view showing a third modification example of the inductor component.

[0140] Figure 14 It is an XY cross-sectional view showing a first through-wiring of the inductor component of the third embodiment.

[0141] Figure 15 It is an XY cross-sectional view showing a first through-wiring of the inductor component of the fourth embodiment. Detailed implementation mode

[0142] Hereinafter, the inductor component as one mode of the present disclosure will be described in detail by the illustrated embodiments. In addition, the drawings include some schematic drawings, and there are cases where the actual dimensions and ratios are not reflected.

[0143] <First Embodiment>

[0144] Hereinafter, the inductor component 1 of the first embodiment will be described. Figure 1 It is a schematic bottom view of observing the inductor component 1 from the bottom side. Figure 2 It is Figure 1 The II-II cross-sectional view of. Figure 3 It is Figure 1Cross-sectional view taken along line III-III. In addition, in Figure 1 for convenience, the external electrodes are depicted by double-dashed lines. Further, in Figure 1 for the sake of easy understanding of the structure, the green body 10 is depicted transparently, but it may also be semi-transparent or opaque.

[0145] 1. General Structure

[0146] The general structure of the inductor component 1 will be described. The inductor component 1 is, for example, a surface-mount type inductor component for a high-frequency signal transmission circuit. As Figure 1 , Figure 2 and Figure 3 shown, the inductor component 1 includes a green body 10, a coil 110 provided on the green body 10 and wound in a spiral shape along the axis AX, and a first external electrode 121 and a second external electrode 122 provided on the green body 10 and electrically connected to the coil 110.

[0147] The green body 10 has a length, a width, and a height. The green body 10 has a first end face 100e1 and a second end face 100e2 on both end sides in the length direction, a first side face 100s1 and a second side face 100s2 on both end sides in the width direction, and a bottom face 100b and a top face 100t on both end sides in the height direction. In other words, the outer surface 100 of the green body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b and the top face 100t. The bottom face 100b is an example of the "first main face" described in the claims, and the top face 100t is an example of the "second main face" described in the claims.

[0148] In addition, as shown in the drawings, hereinafter, for convenience of description, the length direction (long side direction) of the green body 10 and the direction from the first end face 100e1 toward the second end face 100e2 are set as the X direction. Further, the width direction of the green body 10 and the direction from the first side face 100s1 toward the second side face 100s2 are set as the Y direction. In addition, the height direction of the green body 10 and the direction from the bottom face 100b toward the top face 100t are set as the Z direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions, and when arranged in the order of X, Y, Z, they form a right-handed system.

[0149] In this specification, the "outer surface 100 of the green body" including the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the green body 10 does not merely mean the surface facing the outer peripheral side of the green body 10, but rather the surface that forms the boundary between the outside and the inside of the green body 10. In addition, "above the outer surface 100 of the green body 10" does not refer to an absolute direction such as directly above in the direction defined by gravity, but rather refers to the direction toward the outside among the outside and the inside with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, "above the outer surface 100" refers to a relative direction determined according to the orientation of the outer surface 100. In addition, for a certain element, "above" includes not only the position above the element that is separated from the element, that is, the upper side position of another object on the element, the upper side position with a gap, but also the position directly above that is in contact with the element (on).

[0150] The axis AX of the coil 110 is arranged parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom wirings 11b disposed on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX in a plane parallel to the bottom surface 100b, a plurality of top wirings 11t disposed on the top surface 100t side with respect to the axis AX and arranged along the axis AX in a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom wirings 11b toward the top wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom wirings 11b toward the top wirings 11t, disposed on the side opposite to the first through wirings 13 with respect to the axis AX, and arranged along the axis AX. By sequentially connecting the bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14, at least a part of a spiral shape is formed.

[0151] The bottom wiring 11b corresponds to an example of the "first coil wiring" described in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" described in the claims. The axis AX refers to the intersection line of the first plane passing through the center between the bottom wiring 11b and the top wiring 11t and the second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction orthogonal to the axis AX.

[0152] According to the above structure, the coil 110 includes a bottom surface wiring 11b, a first through-wiring 13, a top surface wiring 11t, and a second through-wiring 14. By sequentially connecting the bottom surface wiring 11b, the first through-wiring 13, the top surface wiring 11t, and the second through-wiring 14, at least a part of a spiral shape is formed. Therefore, the inner diameter of the coil 110 can be increased, and the acquisition efficiency of the inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0153] Specifically, the pad portion of the conventional inductor component, the bottom surface wiring 11b, and the top surface wiring 11t of the present embodiment are the "receiving portions" of the wirings (the conductive vias of the conventional inductor component or the first through-wiring 13 and the second through-wiring 14 of the present embodiment) that penetrate the green body. Therefore, they have a shape that expands perpendicular to the direction of the through-green body. Here, in the structure of the conventional inductor component, since the conductive vias extend in the direction parallel to the axis of the coil, the pad portion expands in the direction perpendicular to the axis of the coil, and thus it is likely to form a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0154] In contrast, in the present embodiment, since the first through-wiring 13 and the second through-wiring 14 extend in the direction perpendicular to the axis AX of the coil 110, the bottom surface wiring 11b and the top surface wiring 11t expand in the direction parallel to the axis AX of the coil 110. As a result, the bottom surface wiring 11b and the top surface wiring 11t are less likely to form a structure that blocks the magnetic flux generated in the direction of the axis AX. That is, in the present embodiment, a structure that is less likely to block the magnetic flux can be formed, and the inductance acquisition efficiency and the Q value can be improved.

[0155] Figure 4 It is an XY cross-sectional view of the first through-wiring 13 and the second through-wiring 14. As Figure 4 shown, in the cross-section parallel to the bottom surface 100b and including the axis AX, the first through-wiring 13 includes an inner periphery 131 facing the axis AX side, an outer periphery 132 facing the side opposite to the axis AX, and a side edge 133 parallel to the direction orthogonal to the axis AX. The length of the inner periphery 131 is longer than the length of the outer periphery 132. In Figure 4 , for convenience, the inner periphery 131 is shown by a dashed line, the outer periphery 132 is shown by a one-dot chain line, and the side edge 133 is shown by a solid line.

[0156] The inner periphery 131 is the area of the periphery on the entire circumference of the first through-wiring 13 that is projected onto the axis AX when the first through-wiring 13 is projected from a direction orthogonal to the axis AX toward the axis AX. The outer periphery 132 is the area of the periphery on the entire circumference of the first through-wiring 13 that is projected onto the virtual line BX when a virtual line BX parallel to the axis AX is defined on the opposite side of the axis AX with respect to the first through-wiring 13 and the first through-wiring 13 is projected from a direction orthogonal to the axis AX toward the virtual line BX.

[0157] According to the above structure, since the length of the inner periphery 131 is longer than the length of the outer periphery 132, the surface area of the inner surface of the first through-wiring 13 can be increased. Thereby, the surface area of the inner surface of the coil 110 can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased. Specifically, when a high-frequency signal passes through the coil 110, due to the skin effect, the current is concentrated near the surface of the coil 110. However, in the present embodiment, since the inner periphery 131 of the first through-wiring 13 where the high-frequency signal is concentrated is relatively long, the resistance value is reduced, and the Q value at high frequencies is increased.

[0158] In addition, the second through-wiring 14 also has the same structure as the first through-wiring 13 and has the same effects as the above-mentioned first through-wiring 13. Specifically, the second through-wiring 14 includes an inner periphery 141 facing the axis AX side, an outer periphery 142 facing the side opposite to the axis AX, and a side edge 143 parallel to the direction orthogonal to the axis AX. The length of the inner periphery 141 is longer than the length of the outer periphery 142. Thereby, the surface area of the inner surface of the second through-wiring 14 can be increased, the surface area of the inner surface of the coil 110 can be further increased, the resistance value at high frequencies is further reduced, and the Q value at high frequencies is further increased.

[0159] Furthermore, in the first through-wiring 13, the length of the inner periphery 131 may be longer than the length of the outer periphery 132, and in the second through-wiring 14, the length of the inner periphery 141 may be shorter than or the same as the length of the outer periphery 142.

[0160] 2. Structures of each part

[0161] (Inductor component 1)

[0162] The volume of the inductor component 1 is 0.08 mm 3Hereinafter, the size of the long side of the inductor component 1 is 0.65 mm or less. The size of the long side of the inductor component 1 refers to the maximum value among the length, width, and height of the inductor component 1. In this embodiment, it refers to the length in the X direction. According to the above structure, since the volume of the inductor component 1 is small and the long side of the inductor component 1 is also short, the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. In addition, it is preferable that the thickness of the inductor component 1 is 0.2 mm or less. Accordingly, the inductor component 1 can be made thin.

[0163] Specifically, the dimensions (length (X direction) × width (Y direction) × height (Z direction)) of the inductor component 1 are 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. In addition, the width and height may not be equal. For example, it may also be 0.4 mm × 0.2 mm × 0.3 mm, etc.

[0164] (Green body 10)

[0165] The green body 10 contains SiO 2 . Accordingly, insulation and rigidity can be imparted to the green body 10. The green body 10 is formed of, for example, a glass sintered body. The glass sintered body may also contain alumina, which can further improve the strength of the green body.

[0166] For example, a glass sintered body is formed by laminating insulating layers containing a plurality of glasses. The lamination direction of the plurality of insulating layers is the Z direction. That is, the insulating layer is a layer having a main surface extending in the XY plane. In addition, in the green body 10, due to firing or the like, the interfaces between the plurality of insulating layers may become unclear.

[0167] In addition, for example, the green body 10 may be formed of a glass substrate. The glass substrate may be a single-layer glass substrate. Since most of the green body is glass, losses such as eddy current loss at high frequencies can be suppressed.

[0168] (Coil 110)

[0169] The coil 110 includes a plurality of bottom surface wirings 11b, a plurality of top surface wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are connected in sequence to form at least a part of the coil 110 wound in the axis AX direction.

[0170] According to the above structure, the coil 110 is a coil 110 of a so-called spiral shape. Therefore, in a cross-section orthogonal to the axis AX, the area where the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be lowered.

[0171] Here, the spiral shape means that the number of turns of the entire coil is greater than one turn, and the number of turns of the coil in a cross-section orthogonal to the axis is less than one turn. More than one turn means that in a cross-section orthogonal to the axis, the wiring of the coil has a state where there are radially adjacent parts in the radial direction when viewed from the axial direction and are parallel in the winding direction. Less than one turn means that in a cross-section orthogonal to the axis, the wiring of the coil does not have a state where there are radially adjacent parts in the radial direction when viewed from the axial direction and are parallel in the winding direction.

[0172] The bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b extends in the Y direction slightly inclined in the X direction. A plurality of bottom surface wirings 11b are arranged in parallel along the X direction. Here, in the lithography process, if deformed illumination such as annular illumination or dipole illumination is used, for example, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed. According to the above structure, since the bottom surface wiring 11b extends only in one direction, by using deformed illumination in the lithography process, for example, a fine bottom surface wiring 11b can be formed, and the inductor component 1 can be miniaturized.

[0173] The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t has a shape extending in the Y direction. A plurality of top surface wirings 11t are arranged in parallel along the X direction. According to the above structure, since the top surface wiring 11t extends only in one direction, by using deformed illumination in the lithography process, for example, a fine top surface wiring 11t can be formed, and the inductor component 1 can be miniaturized.

[0174] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or their alloys. The bottom surface wiring 11b and the top surface wiring 11t can be either a metal film formed by electroplating, evaporation plating, sputtering, etc., or a metal sintered body obtained by coating a conductor paste and sintering it. In addition, the bottom surface wiring 11b and the top surface wiring 11t can also be a multilayer structure in which a plurality of metal layers are stacked. Preferably, the thickness of the bottom surface wiring 11b and the top surface wiring 11t is 5 μm or more and 50 μm or less.

[0175] The first through-wiring 13 is disposed on the first side surface 100s1 side with respect to the axis AX within the through-hole V of the green body 10, and the second through-wiring 14 is disposed on the second side surface 100s2 side with respect to the axis AX within the through-hole V of the green body 10. The first through-wiring 13 and the second through-wiring 14 extend in directions orthogonal to the bottom surface 100b and the top surface 100t, respectively. Accordingly, the lengths of the first through-wiring 13 and the second through-wiring 14 can be shortened, so that the DC resistance (Rdc) can be suppressed. A plurality of first through-wirings 13 and a plurality of second through-wirings 14 are arranged in parallel along the X direction.

[0176] Preferably, the first through-wiring 13 contains SiO 2 . Accordingly, when the green body 10 contains SiO 2 , the coefficient of linear expansion of the first through-wiring 13 can be made to coincide with the coefficient of linear expansion of the green body 10, and cracks between the first through-wiring 13 and the green body 10 can be suppressed. The first through-wiring 13 uses, for example, a conductive paste. The conductive material is Ag, Cu, etc. Preferably, the second through-wiring 14 also contains SiO 2 .

[0177] Preferably, the inner periphery 131 of the first through-wiring 13 has a curved portion with a convex curve. Accordingly, the stress applied to the curved portion of the inner periphery 131 of the first through-wiring 13 can be dispersed. Although the entire inner periphery 131 is a curved portion, a part of the inner periphery 131 may be a curved portion. Although the outer periphery 132 of the first through-wiring 13 is a straight line parallel to the axis AX, it may have a curved portion with a convex curve, and the stress applied to the curved portion of the outer periphery 132 of the first through-wiring 13 can be dispersed. The side edge 133 of the first through-wiring 13 is a straight line orthogonal to the axis AX.

[0178] Preferably, the inner periphery 141 of the second through-wiring 14 also has a curved portion with a convex curve. Accordingly, the stress applied to the curved portion of the inner periphery 141 of the second through-wiring 14 can be dispersed. The outer periphery 142 of the second through-wiring 14 is a straight line parallel to the axis AX. The side edge 143 of the second through-wiring 14 is a straight line orthogonal to the axis AX.

[0179] Preferably, the length of the inner periphery 131 of the first through-wiring 13 is 1.5 times or more the length of the outer periphery 132 of the first through-wiring 13. Accordingly, the length of the inner periphery 131 of the first through-wiring 13 can be increased, and the resistance value at high frequencies can be further reduced. In other words, since the current flows in a spiral shape on the inner diameter side of the coil 110, the larger the length of the inner periphery 131, the lower the resistance. For example, the length of the inner periphery 131 is approximately 47 μm, and the outer periphery 132 is approximately 30 μm. The length can be measured using WinRooF2018 manufactured by Mitani Corporation, and the lengths of the peripheries (inner periphery, outer periphery) of the through-wiring can be obtained from the cross-sectional image. In addition, in the measurement of the inner and outer peripheries, the positions of the measured inner and outer peripheries are specified respectively. In addition, the measured cross-section is the cross-section at the center in the extending direction of the first through-wiring 13.

[0180] Preferably, the length of the inner periphery 141 of the second through-wiring 14 is also 1.5 times or more the length of the outer periphery 142 of the second through-wiring 14. Accordingly, the length of the inner periphery 141 of the second through-wiring 14 can be increased, and the resistance value at high frequencies can be further reduced.

[0181] Preferably, the directions of the bent portions of the inner peripheries 131 of all the first through-wirings 13 are the same. The direction of the bent portion is the direction connecting the midpoint of the bent portion and the center line of the first through-wiring 13. The center line of the first through-wiring 13 is a line passing through the center of gravity of the first through-wiring 13 in a cross-section orthogonal to the extending direction of the first through-wiring 13. Here, since the entire inner periphery 131 is a bent portion, the direction of the bent portion is the direction connecting the midpoint of the inner periphery 131 and the center line of the first through-wiring 13. The direction of the bent portion is a direction orthogonal to the axis AX. In addition, in the two first through-wirings 13, the direction of the bent portion of the inner periphery 131 of one first through-wiring 13 may be different from the direction of the bent portion of the inner periphery 131 of the other first through-wiring 13. Accordingly, the direction of the bent portion of the first through-wiring 13 can be changed according to the arrangement of the bottom surface wiring 11b and the top surface wiring 11t.

[0182] Similarly, it is preferable that the directions of the bent portions of the inner peripheries 141 of all the second through-wirings 14 are the same. In addition, in the two second through-wirings 14, the direction of the bent portion of the inner periphery 141 of one second through-wiring 14 may be different from the direction of the bent portion of the inner periphery 141 of the other second through-wiring 14.

[0183] Figure 5 is Figure 1 a partial enlarged view. As Figure 5As shown, when viewed from a direction orthogonal to the bottom surface 100b, the first end portion 11b1 of the bottom surface wiring 11b is connected to the first end portion 13a of the first through-wiring 13. Preferably, the shape of the outer side of the coil 110 of the first end portion 11b1 of the bottom surface wiring 11b follows the shape of the outer side of the coil 110 of the first end portion 13a of the first through-wiring 13. The outer side of the coil 110 refers to the outer peripheral surface side of the coil 110. Specifically, the outer shape of the first end portion 11b1 of the bottom surface wiring 11b follows the outer periphery 132 and the side edge 133 of the first end portion 13a of the first through-wiring 13. According to the above structure, the shape of the first end portion 11b1 of the bottom surface wiring 11b can be made to correspond to the shape of the first end portion 13a of the first through-wiring 13, and the DC resistance of the connection portion between the bottom surface wiring 11b and the first through-wiring 13 can be reduced.

[0184] At this time, it is preferable that the first end portion 11b1 of the bottom surface wiring 11b is larger than the first end portion 13a of the first through-wiring 13. Thereby, even if a position shift of the bottom surface wiring 11b occurs, the connection between the bottom surface wiring 11b and the first through-wiring 13 can be ensured.

[0185] Similarly, when viewed from a direction orthogonal to the bottom surface 100b, it is preferable that the second end portion 11b2 of the bottom surface wiring 11b is connected to the first end portion 14a of the second through-wiring 14, and the shape of the outer side of the coil 110 of the second end portion 11b2 of the bottom surface wiring 11b follows the shape of the outer side of the coil 110 of the first end portion 14a of the second through-wiring 14.

[0186] Specifically, the outer shape of the second end portion 11b2 of the bottom surface wiring 11b follows the outer periphery 142 and the side edge 143 of the first end portion 14a of the second through-wiring 14. According to the above structure, the shape of the second end portion 11b2 of the bottom surface wiring 11b can be made to correspond to the shape of the first end portion 14a of the second through-wiring 14, and the DC resistance of the connection portion between the bottom surface wiring 11b and the second through-wiring 14 can be reduced.

[0187] As Figure 2 shown, when viewed from a direction orthogonal to the bottom surface 100b, it is preferable that the first end portion of the bottom surface wiring 11b overlaps with the first end portion of the top surface wiring 11t, and the angle θ formed by the bottom surface wiring 11b and the top surface wiring 11t is an acute angle. The angle θ refers to the angle between the center line ( Figure 2 the dotted line) of the width of the bottom surface wiring 11b and the center line ( Figure 2 the dotted line) of the width of the top surface wiring 11t when viewed from a direction orthogonal to the bottom surface 100b.

[0188] As Figure 2As shown, preferably when viewed from a direction orthogonal to the bottom surface 100b, the angle θ formed between the bottom surface wiring 11b and the top surface wiring 11t connected to the same first through-wiring 13 is 5° or more and 45° or less. The angle θ refers to the angle between the center line of the width of the bottom surface wiring 11b ( Figure 2 the dotted line) and the center line of the width of the top surface wiring 11t ( Figure 2 the dotted line) when viewed from a direction orthogonal to the bottom surface 100b.

[0189] According to the above structure, since the coil 110 is wound tightly, the inductance can be increased. Since the angle θ is 45° or less, the coil length is shortened, the leakage magnetic flux is reduced, and the Q value is increased. The coil length refers to the interval between the two end portions of the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 that are located at the outermost position closest to the axis AX direction. Since the angle θ is 5° or more, the possibility of contact between two adjacent first through-wirings 13 in the axis AX direction can be reduced, and in addition, the possibility of contact between two adjacent second through-wirings 14 in the axis AX direction can be reduced. In addition, it is sufficient that the angle θ is 5° or more and 45° or less in at least one set of the bottom surface wiring 11b and the top surface wiring 11t among all the bottom surface wirings 11b and the top surface wirings 11t.

[0190] Similarly, preferably when viewed from a direction orthogonal to the bottom surface 100b, the angle θ formed between the bottom surface wiring 11b and the top surface wiring 11t connected to the same second through-wiring 14 is 5° or more and 45° or less. Accordingly, since the coil 110 is wound tightly, the inductance can be increased.

[0191] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 includes a void portion or a resin portion. Accordingly, the stress caused by the difference in the linear expansion coefficients of the wiring and the green body 10 can be absorbed by the void portion or the resin portion, and the stress can be alleviated. As a method of forming the void portion, for example, a component that burns out by sintering can be used in the material of the wiring, and the void portion can be formed by sintering the wiring. As a method of forming the resin portion, for example, the resin portion can be formed by using a conductive paste in the material of the wiring.

[0192] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t includes SiO 2 . Accordingly, when the green body 10 contains SiO 2 , the linear expansion coefficient of the wiring can be made consistent with the linear expansion coefficient of the green body 10, and cracks between the wiring and the green body 10 can be suppressed.

[0193] (First external electrode 121 and second external electrode 122)

[0194] The first external electrode 121 is connected to the first end portion of the coil 110, and the second external electrode 122 is connected to the second end portion of the coil 110. The first external electrode 121 is disposed on the first end face 100e1 side with respect to the center of the green compact 10 in the X direction so as to be exposed from the outer surface 100 of the green compact 10. The second external electrode 122 is disposed on the second end face 100e2 side with respect to the center of the green compact 10 in the X direction so as to be exposed from the outer surface 100 of the green compact 10.

[0195] When viewed from a direction orthogonal to the bottom face 100b, the first external electrode 121 and the second external electrode 122 are located inside compared to the outer surface 100 of the green compact 10. In other words, the first external electrode 121 and the second external electrode 122 are located inside compared to the first end face 100e1, the second end face 100e2, the first side face 100s1, and the second side face 100s2 of the green compact 10.

[0196] According to the above structure, since the first external electrode 121 and the second external electrode 122 do not contact the outer surface 100 of the green compact 10, when singulating the respective inductor components, the load applied to the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is miniaturized, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0197] In addition, the first external electrode 121 may be continuously provided on the bottom face 100b and the first end face 100e1. Accordingly, since the first external electrode 121 is an electrode having a so-called L shape, when mounting the inductor component 1 to a mounting substrate, a solder leg can be formed on the first external electrode 121. Similarly, the second external electrode 122 may also be continuously provided on the bottom face 100b and the second end face 100e2.

[0198] The first external electrode 121 has a bottom face portion 121b provided on the bottom face 100b and a conduction portion 121v buried in the bottom face 100b. The conduction portion 121v is connected to the bottom face portion 121b. The conduction portion 121v is connected to an end portion of the bottom face wiring 11b on the first end face 100e1 side in the direction of the axis AX.

[0199] The second external electrode 122 has a bottom face portion 122b provided on the bottom face 100b and a conduction portion 122v buried in the bottom face 100b. The conduction portion 122v is connected to the bottom face portion 122b. The conduction portion 122v is connected to an end portion of the bottom face wiring 11b on the second end face 100e2 side in the direction of the axis AX.

[0200] The first external electrode 121 has a base layer 121e1 and a plating layer 121e2 that covers the base layer 121e1. The base layer 121e1 contains a conductive material such as Ag or Cu, for example. The plating layer 121e2 contains a conductive material such as Ni or Sn, for example. A part of the bottom surface portion 121b and the conduction portion 121v are formed of the base layer 121e1. The other part of the bottom surface portion 121b is formed of the plating layer 121e2. Similarly, the second external electrode 122 has a base layer and a plating layer that covers the base layer. In addition, the first external electrode 121 and the second external electrode 122 may be formed of a single-layer conductive material.

[0201] (Manufacturing method of the inductor component 1)

[0202] Next, use Figures 6A - 6M to describe the manufacturing method of the inductor component 1. Figures 6A - 6H 、 Figure 6K 、 Figure 6L is a diagram corresponding to the II-II cross-section of Figure 1 . Figure 6I 、 Figure 6J 、 Figure 6M is a diagram corresponding to the III-III cross-section of Figure 1 .

[0203] As Figure 6A shows, the first insulating layer 1011 is provided on the base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc., and the material of the first insulating layer 1011 is, for example, a resin such as epoxy resin or polyimide, an inorganic insulating film such as SiO or SiN, etc.

[0204] As Figure 6B shows, the second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed by, for example, a photolithography process. In addition, the groove may be formed as a printing pattern from the beginning.

[0205] As Figure 6C shows, the top surface conductor layer 1011t is provided on the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc. At this time, for example, the top surface conductor layer 1011t is formed to remain only on the groove 1012a as a printing pattern. In addition, after printing the top surface conductor layer 1011t on the second insulating layer 1012, the top surface conductor layer 1011t may be made to remain only on the groove 1012a by a photolithography process.

[0206] As Figure 6DAs shown, a third insulating layer 1013 is provided by printing on the second insulating layer 1012. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed by the same method as Figure 6B the same.

[0207] As Figure 6E shown, a first through-conductor layer 1131 of the first layer is provided by printing in the first groove 1013a, and a second through-conductor layer 1141 of the first layer is provided by printing in the second groove 1013b. The first through-conductor layer 1131 of the first layer and the second through-conductor layer 1141 of the first layer are formed by the same method as Figure 6C the same.

[0208] The above process is repeated. As Figure 6F shown, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a first through-conductor layer 1132 of the second layer and a second through-conductor layer 1142 of the second layer are respectively provided on two grooves provided in the fourth insulating layer 1014. Further, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a first through-conductor layer 1133 of the third layer and a second through-conductor layer 1143 of the third layer are respectively provided on two grooves provided in the fifth insulating layer 1015.

[0209] As Figure 6G shown, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in a groove provided in the sixth insulating layer 1016. The material of the bottom conductor layer 1011b is the same as that of the top conductor layer 1011t. As Figure 6H shown, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016.

[0210] As Figure 6I shown, a groove 1017a is provided in the seventh insulating layer 1017 to expose a part of the bottom conductor layer 1011b. As Figure 6J shown, a base conductor layer 1121e1 is provided on the seventh insulating layer 1017 and within the groove 1017a. The material of the base conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.

[0211] As Figure 6KAs shown, the entire laminate is sintered in a furnace at a high temperature (e.g., 500 °C or higher). The first to seventh insulating layers 1011 to 1017 are sintered to form a green body 10, the top surface conductor layer 1011t is sintered to form the top surface wiring 11t, the bottom surface conductor layer 1011b is sintered to form the bottom surface wiring 11b, the first through-conductor layers 1131 to 1133 of the first to third layers are sintered to form the first through-wiring 13, the second through-conductor layers 1141 to 1143 of the first to third layers are sintered to form the second through-wiring 14, and the base conductor layer 1121e1 is sintered to form the base layer 121e1. Therefore, sintering the insulating layer can improve the strength. In addition, by sintering the conductor layer, unnecessary resin components contained in the conductor layer can be volatilized, and the conductor material contained in the conductor layer is melted to achieve a high conductivity. The base substrate 1000 can be peeled off by surface decomposition during sintering, or can be removed mechanically by grinding or the like before and after sintering, or can be removed chemically by etching or the like before and after sintering.

[0212] As Figure 6L shown, singulation is performed along the dicing line C. As Figure 6M shown, the plating layer 121e2 is formed to cover the base layer 121e1 by barrel plating to form the first external electrode 121. Thus, as Figure 2 shown, the inductor component 1 is manufactured.

[0213] 3. Modification

[0214] (First Modification)

[0215] Figure 7A is a diagram corresponding to the II-II cross-section of the first modification of the inductor component with Figure 1 shown. As Figure 7A shown, in the inductor component 1A of the first modification, when viewed from a direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0216] Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance between them becomes wider toward the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 toward the center in the Z direction. Further, the first through-wiring 13 and the second through-wiring 14 each have a stepped shape along the Z direction. With the above structure, when the first through-wiring 13 and the second through-wiring 14 are respectively formed by laminating a plurality of conductor layers, the first through-wiring 13 and the second through-wiring 14 can be easily formed into a stepped shape by staggering the conductor layers of each layer.

[0217] (Second modified example)

[0218] Figure 7B is a diagram corresponding to the II-II cross-section of a second modified example of an inductor component and Figure 1 as shown. As Figure 7B shown, in the inductor component 1B of the second modified example, when viewed from a direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0219] Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance between them becomes wider toward the top surface wiring 11t side in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 toward the top surface wiring 11t in the Z direction. Thus, when the coil 110 is viewed from the axis AX direction, it has a trapezoidal shape. With the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed into a straight shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0220] (Third modified example)

[0221] Figure 7C is a diagram corresponding to the II-II cross-section of a third modified example of an inductor component and Figure 1 as shown. As Figure 7C shown, in the inductor component 1C of the third modified example, compared with the inductor component 1A of the first modified example shown in Figure 7A , it includes a first coil 110A and a second coil 110B.

[0222] In the first coil 110A, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0223] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1A of the first modified example. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is bent at the center so that the interval between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The first through-wiring 13 has a stepped shape along the Z direction. According to the above structure, when the first through-wiring 13 is formed by laminating a plurality of conductor layers, the first through-wiring 13 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0224] In the second coil 110B, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0225] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1A of the first modified example. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is bent at the center so that the interval between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. According to the above structure, when the second through-wiring 14 is formed by laminating a plurality of conductor layers, the second through-wiring 14 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0226] (Fourth modified example)

[0227] Figure 7D is a diagram corresponding to the II-II cross-section of the fourth modified example of the inductor component and Figure 1 As shown in Figure 7D In the inductor component 1D of the fourth modified example, as compared with the inductor component 1B of the second modified example shown in Figure 7B it includes the first coil 110A and the second coil 110B.

[0228] In the first coil 110A, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be enlarged, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0229] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1B of the second modification. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. With the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0230] In the second coil 110B, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be enlarged, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0231] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1B of the second modification. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. With the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape, and the resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0232] <Second Embodiment>

[0233] Figure 8 is a schematic bottom view of the second embodiment of the inductor component as viewed from the bottom side. Figure 9 is Figure 8 the IX - IX cross-sectional view. In Figure 8 for convenience, the insulating layer is omitted and the external electrodes are depicted by a double-dashed line. Also, in Figure 8 in order to easily understand the structure, the green body 10 is depicted transparently. The second embodiment is mainly different from the first embodiment in the position of the axis of the coil, the orientation of the through-wiring, the material of the green body, and the provision of the insulating layer. The following mainly describes these different structures. Other structures are the same as those of the first embodiment, and their descriptions are omitted.

[0234] 1. Structure of Each Part

[0235] (Inductor component 1E)

[0236] As Figure 8 shown, in the inductor component 1E, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the green body 10 in the X direction. Accordingly, the interference of the first external electrode 121 and the second external electrode 122 with the magnetic flux of the coil 110 can be reduced, and the acquisition efficiency of the inductance can be improved.

[0237] The length of the coil 110 in the direction of the axis AX is shorter than the inner diameter of the coil 110. The length of the coil 110 in the direction of the axis AX is also referred to as the coil length. Accordingly, since the coil length becomes shorter and the inner diameter of the coil becomes larger, the Q value can be improved. The inner diameter of the coil refers to the circular equivalent diameter based on the minimum area of the region surrounded by the coil 110 when viewed through in the direction of the axis AX.

[0238] (Green body 10)

[0239] The green body 10 is an inorganic insulator. Preferably, the material of the green body 10 is glass. Accordingly, since the glass has high insulation, eddy currents can be suppressed and the Q value can be improved. Preferably, the green body 10 contains Si elements. Accordingly, the thermal stability of the green body 10 is improved, and thus, the change in the size of the green body 10 caused by heat can be suppressed, and the electrical characteristic deviation can be reduced.

[0240] Preferably, the green body 10 is a single-layer glass plate. Accordingly, the strength of the green body 10 can be ensured. In addition, in the case of a single-layer glass plate, since the dielectric loss is small, the Q value at high frequencies can be improved. In addition, since there is no sintering process like that of a sintered body, the deformation of the green body 10 during sintering can be suppressed, and thus, pattern shift can be suppressed, and an inductor component with a small inductance tolerance can be provided.

[0241] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate represented by Foturan II (registered trademark of Schott AG) is preferred. In particular, it is preferred that the single-layer glass plate contains cerium oxide (cerium oxide: CeO 2 ), in which case the cerium oxide becomes a sensitizer and the processing based on photolithography becomes easier.

[0242] However, since the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist / metal mask, laser processing, etc., it can also be a non-photosensitive glass plate. In addition, the single-layer glass plate can be either a glass plate obtained by sintering a glass paste or formed by a known method such as the float method.

[0243] (Insulator 22)

[0244] As Figure 9 shown, the inductor component 1E has an insulator 22. The insulator 22 covers the bottom surface 100b and the top surface 100t of the green body 10, respectively. In addition, the insulator 22 may be provided only on the bottom surface 100b among the bottom surface 100b and the top surface 1100t.

[0245] The insulator 22 is a component that covers the wirings (bottom surface wiring 11b, top surface wiring 11t) and has the functions of protecting the wirings from external forces and preventing damage to the wirings, and improving the insulation of the wirings. The insulator 22 is preferably an organic insulator. For example, the insulator 22 may be a resin film such as epoxy resin or polyimide that is easy to form. In particular, it is preferable that the insulator 22 is made of a material with a low dielectric constant. Thus, when the insulator 22 exists between the coil 110 and the external electrodes 121 and 122, the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 can be reduced. For example, the insulator 22 can be formed by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or coating a paste-like resin and performing thermal curing or the like. In addition, the insulator 22 may be an inorganic film such as an oxide, nitride, or oxynitride of silicon, hafnium, etc. that has excellent insulation and thin film properties.

[0246] It is preferable that the green body 10 is an inorganic insulator. When the insulator 22 is an organic insulator, when viewed from a direction orthogonal to the bottom surface 100b, the outer surface of the organic insulator is located inside compared to the inorganic insulator. Accordingly, since there is an organic insulator, the organic insulator is easy to impart fluidity, and when covering the wirings (bottom surface wiring 11b, top surface wiring 11t) with the organic insulator, the organic insulator can be easily filled between adjacent wirings, and the insulation can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating each inductor component, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0247] (Coil 110)

[0248] As Figure 8 shown, the bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b has a shape extending in the X direction. A plurality of bottom surface wirings 11b are arranged in parallel along the Y direction. The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t extends in the X direction while being slightly inclined in the Y direction. A plurality of top surface wirings 11t are arranged in parallel along the Y direction.

[0249] The first through-wiring 13 is disposed inside the through-hole V of the green body 10 on the first end face 100e1 side with respect to the axis AX, and the second through-wiring 14 is disposed inside the through-hole V of the green body 10 on the second end face 100e2 side with respect to the axis AX. The first through-wiring 13 and the second through-wiring 14 each extend in a direction orthogonal to the bottom face 100b and the top face 100t. The plurality of first through-wirings 13 and the plurality of second through-wirings 14 are each arranged in parallel along the Y direction.

[0250] As Figure 9 shown, preferably, in a cross-section orthogonal to the extending direction of the bottom face wiring 11b, the upper surface 11b3 of the bottom face wiring 11b on the side opposite to the axis AX has a convex shape protruding upward in the direction opposite to the axis AX. Accordingly, the distance between the upper surfaces 11b3 of two adjacent bottom face wirings 11b in the axis AX direction can be increased, the parasitic capacitance between the adjacent bottom face wirings 11b in the axis AX direction can be reduced, and the self-resonant frequency of the inductor component 1E can be increased.

[0251] Similarly, preferably, in a cross-section orthogonal to the extending direction of the top face wiring 11t, the upper surface 11t3 of the top face wiring 11t on the side opposite to the axis AX has a convex shape protruding upward in the direction opposite to the axis AX. Accordingly, the distance between the upper surfaces 11t3 of two adjacent top face wirings 11t in the axis AX direction can be increased, the parasitic capacitance between the adjacent top face wirings 11t in the axis AX direction can be reduced, and the self-resonant frequency of the inductor component 1E can be increased.

[0252] Preferably, the first external electrode 121 is disposed on the bottom face wiring 11b, and the upper surface 11b3 of the bottom face wiring 11b faces the first external electrode 121. Accordingly, the distance between the first external electrode 121 and the upper surface 11b3 of the bottom face wiring 11b can be increased, the parasitic capacitance between the first external electrode 121 and the bottom face wiring 11b can be reduced, and the self-resonant frequency of the inductor component 1E can be increased.

[0253] Similarly, preferably, the second external electrode 122 is disposed on the bottom face wiring 11b, and the upper surface 11b3 of the bottom face wiring 11b faces the second external electrode 122. Accordingly, the distance between the second external electrode 122 and the upper surface 11b3 of the bottom face wiring 11b can be increased, the parasitic capacitance between the second external electrode 122 and the bottom face wiring 11b can be reduced, and the self-resonant frequency of the inductor component 1E can be increased.

[0254] In addition, the first external electrode 121 and the second external electrode 122 may not be disposed directly above the bottom surface wiring 11b, and may be slightly separated from the bottom surface wiring 11b when viewed in a direction orthogonal to the bottom surface 100b. In this case, the parasitic capacitance between the first external electrode 121 and the second external electrode 122 and the bottom surface wiring 11b can also be reduced.

[0255] Figure 10 is a schematic bottom view of the coil 110 as viewed from the bottom surface 100b side. As Figure 10 shown, when viewed in a direction orthogonal to the bottom surface 100b, a bisector of a first angle θ1 formed by the bottom surface wiring 11b and the top surface wiring 11t that is connected to a reference first through-wiring 13A, which is one of the first through-wirings 13, is defined (hereinafter referred to as a first bisector L1.).

[0256] As Figure 11 shown, in a cross-section parallel to the bottom surface 100b and including the axis AX, the reference first through-wiring 13A includes an inner peripheral edge 131 facing the first bisector L1 side and an outer peripheral edge 132 facing the side opposite to the first bisector L1. The length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132.

[0257] The inner peripheral edge 131 is a region of the periphery on the entire circumference of the reference first through-wiring 13A that is projected onto the orthogonal line Lr when the reference first through-wiring 13A is projected onto the orthogonal line Lr from a direction parallel to the first bisector L1. The outer peripheral edge 132 is a region of the periphery on the entire circumference of the reference first through-wiring 13A that is projected onto the virtual line Lv when the reference first through-wiring 13A is projected onto the virtual line Lv from a direction parallel to the first bisector L1 on the side opposite to the orthogonal line Lr.

[0258] According to the above structure, since the length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132, the surface area of the inner surface of the reference first through-wiring 13A can be increased. As a result, the surface area of the inner surface of the coil 110 can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased. In addition, all of the first through-wirings 13 may have the same structure as the reference first through-wiring 13A.

[0259] Similarly, as Figure 10 shown, when viewed in a direction orthogonal to the bottom surface 100b, a bisector of a second angle θ2 formed by the bottom surface wiring 11b and the top surface wiring 11t that is connected to a reference second through-wiring 14A, which is one of the second through-wirings 14, is defined (hereinafter referred to as a second bisector L2.).

[0260] As Figure 11 shown, in a cross-section parallel to the bottom surface 100b and including the axis AX, the reference second through-wiring 14A includes an inner periphery 131 facing the second bisecting line L2 side and an outer periphery 132 facing the side opposite to the second bisecting line L2. The length of the inner periphery 131 is longer than the length of the outer periphery 132. Thereby, the surface area of the inner surface of the reference second through-wiring 14A can be increased, the surface area of the inner surface of the coil 110 can be further increased, the resistance value at high frequencies is further reduced, and the Q value at high frequencies is further improved. In addition, all of the second through-wirings 14 may have the same structure as the reference second through-wiring 14A.

[0261] Preferably, the direction of the bent portion of the inner periphery 131 of the reference first through-wiring 13A coincides with the first bisecting line L1. Here, since the entire inner periphery 131 is a bent portion, the direction of the bent portion is the direction connecting the midpoint of the inner periphery 131 and the center line of the first through-wiring 13. In addition, all of the first through-wirings 13 may have the same structure as the reference first through-wiring 13A.

[0262] Preferably, the direction of the bent portion of the inner periphery 131 of the reference second through-wiring 14A coincides with the second bisecting line L2. Here, since the entire inner periphery 131 is a bent portion, the direction of the bent portion is the direction connecting the midpoint of the inner periphery 131 and the center line of the second through-wiring 14. In addition, all of the second through-wirings 14 may have the same structure as the reference second through-wiring 14A.

[0263] In addition, the angles formed by all of the bottom surface wirings 11b and the top surface wirings 11t may be different. In this case, all of the bisecting lines are not parallel. Further, the directions of the bent portions of the inner peripheries 131 of all of the first through-wirings 13 may be the same, or may be different. The directions of the bent portions of the inner peripheries 141 of all of the second through-wirings 14 may be the same, or may be different.

[0264] (Manufacturing method of the inductor component 1E)

[0265] Next, Figures 12A - 12H the manufacturing method of the inductor component 1E will be described. Figures 12A - 12H is a diagram corresponding to the IX - IX cross-section of Figure 8 .

[0266] As Figure 12A shown, a copper foil 2001 is provided on the base substrate 2000 by printing. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

[0267] As Figure 12BAs shown, a glass substrate 2010 that forms a green body 10 is provided on a base substrate 2000. For example, jigs such as conductive tapes, pins, and frames are used to closely attach the base substrate 2000 to the glass substrate 2010. The glass substrate 2010 has a through-hole V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate on which through-holes have been formed in advance by laser, photolithography, or the like. The glass substrate 2010 can also be, for example, a TSV (Through Silicon Via) substrate, or it can be something else. Additionally, Ti / Cu or other required conductive materials can be vapor-deposited on the surface of the glass substrate 2010 in advance by sputtering or the like as seeds.

[0268] As Figure 12C shown, a first through-conductor layer 2013 that forms a first through-wiring 13 is formed in the through-hole V of the glass substrate 2010. Although not shown, a second through-conductor layer that forms a second through-wiring 14 is similarly formed in the through-hole V. Specifically, by supplying power from a copper foil 2001 on the base substrate 2000, the first through-conductor layer 2013 is formed by electroplating in the through-hole V of the glass substrate 2010. In addition to this, a seed layer can also be formed on the surface of the glass substrate 2010 and the inner surface of the through-hole V by sputtering or the like, and a through-conductor layer can be formed using known methods such as filling electroplating, conformal electroplating, and printing and filling methods of conductive pastes. When unwanted plating grows on the surface of the glass substrate 2010, the unwanted parts are removed by grinding, CMP, wet etching (etching), or dry etching.

[0269] As Figure 12D shown, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 can be removed mechanically by grinding or the like, or it can be removed chemically by etching or the like.

[0270] As Figure 12EAs shown, a bottom conductor layer 2011b serving as the bottom wiring 11b and a top conductor layer 2011t serving as the top wiring 11t are formed on a glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed on the seed layer in the opening of the photoresist by electrolytic plating. The photoresist and the seed layer are removed by wet etching or dry etching. Thus, the bottom conductor layer 2011b and the top conductor layer 2011t patterned into an arbitrary shape are formed. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t can be formed one by one, or both can be formed simultaneously. In addition, the shape of the upper surface of the top wiring and the bottom wiring can also be a convex curved surface by optimizing the additives and the stirring conditions of the electrolytic plating solution.

[0271] As Figure 12F shown, an insulating layer 2022 serving as an insulator 22 is provided on the top and bottom surfaces of the glass substrate 2010 to cover the conductor layer. At this time, the bottom-side insulating layer 2022 and the top-side insulating layer 2022 can be formed one by one, or both can be formed simultaneously. Thereafter, holes 2022a are provided in the bottom conductor layer 2011b of the bottom-side insulating layer 2022 using photolithography or laser processing.

[0272] As Figure 12G shown, a first external electrode conductor layer 2121 serving as the first external electrode 121 is provided on the bottom-side insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b via the holes 2022a. Specifically, a Pd catalyst (not shown) is provided on the bottom-side insulating layer 2022, and Ni and Au coatings are formed by electroless plating. A patterned photoresist is formed on the coating. The coating in the opening of the photoresist is removed by wet etching or dry etching. Thus, the first external electrode conductor layer 2121 patterned into an arbitrary shape is formed. Alternatively, a seed layer (not shown) is provided on the bottom-side insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the opening of the photoresist is removed by wet etching or dry etching. Ni and Au coatings can also be formed by electroless plating on the remaining seed layer. Although not shown, a second external electrode conductor layer serving as the second external electrode 122 is similarly provided on the bottom-side insulating layer 2022.

[0273] Here, since the first external electrode conductor layer 2121 is formed following the shape of the upper surface of the insulating layer 2022 on the bottom side, the upper surface of the first external electrode conductor layer 2121 has a depression in the region overlapping the hole 2022a. Alternatively, the upper surface of the first external electrode conductor layer 2121 may be flat.

[0274] like Figure 12H As shown in FIG. 1 , the chips are separated into individual pieces along the cutting line C. Thus, as shown in FIG. Figure 9 As shown, the inductor component 1E is manufactured.

[0275] 2. Modifications

[0276] (First Modification)

[0277] Figure 13A is a diagram showing a first modification of the inductor component. Figure 8 The corresponding figure is the IX-IX section of Figure 13A As shown, in the inductor component 1F of the first modified example, the first external electrode 121 is not connected to the bottom wiring 11b, but is connected to the first through wiring 13. In other words, the first end of the first through wiring 13 is connected to the first external electrode 121, and the second end of the first through wiring 13 is connected to the top wiring 11t. According to this, even if the number of turns of the coil is changed, the coil can be easily connected to the first external electrode 121. Similarly, the second external electrode 122 may be connected to the second through wiring 14 instead of the bottom wiring 11b.

[0278] (Second Modification)

[0279] Figure 13B is a diagram showing a second modification of the inductor component. Figure 8 The corresponding figure is the IX-IX section of Figure 13B As shown in FIG. 1 , in the inductor component 1G of the second modified example, the first through wiring 13 extends in a direction orthogonal to the bottom wiring 11b, and the cross-sectional area of ​​each of the two end portions 13e in the extending direction of the first through wiring 13 is larger than the cross-sectional area of ​​the central portion 13m in the extending direction of the first through wiring 13. In other words, in the cross section of the first through wiring 13 along the extending direction, the width of the first through wiring 13 in the direction orthogonal to the extending direction continuously increases from the central portion 13m toward the two end portions 13e.

[0280] Accordingly, the cross-sectional area of the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom surface wiring 11b and the top surface wiring 11t can be improved. Further, when forming the through-hole V as a hole portion in the green body 10 and filling the through-hole V with a conductive material by electroplating or the like to form the first through-wiring 13 in the through-hole V, it is easy to fill the conductive material on the opening side of the through-hole V. Moreover, since the cross-sectional area of the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0281] In addition, it is sufficient that the cross-sectional area of one end portion 13e of the first through-wiring 13 is larger than the cross-sectional area of the central portion 13m of the first through-wiring 13. Similarly, the cross-sectional area of at least one end portion of the second through-wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-wiring 13.

[0282] (Third modification example)

[0283] Figure 13C is a diagram corresponding to the IX - IX cross-section showing a third modification example of the inductor component Figure 8 As shown in FIG. Figure 13C In the inductor component 1H of the third modification example, the first through-wiring 13 has a conductive layer 13s located on the outer peripheral side and a non-conductive layer 13u located inside the conductive layer 13s when viewed in the extending direction of the first through-wiring 13. Accordingly, when used in a high-frequency band, due to the skin effect, the current mainly flows on the surface of the first through-wiring 13, so the Q value is not reduced by providing the conductive layer 13s on the outer peripheral side. In addition, by providing the non-conductive layer 13u inside, stress can be alleviated, and the manufacturing cost can be reduced by not using a conductor.

[0284] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through-hole V of the green body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electroplating. In this way, a plurality of conductive layers 13s such as Ti / Cu / Electrolytic Cu or Pd / Electroless Cu / Electrolytic Cu can be formed on the outer peripheral side of the first through-wiring 13. Thereafter, the inside of the conductive layer 13s is sealed with resin by printing or hot pressing or the like to form a non-conductive layer 13u made of resin. In this way, the current can flow on the surface (conductive layer 13s) of the first through-wiring 13, and stress can be alleviated by the non-conductive layer 13u inside the first through-wiring 13.

[0285] Similarly, the second through-wiring 14 may also have a conductive layer on the outer peripheral side and a non-conductive layer on the inner side of the conductive layer when viewed in the direction extending from the second through-wiring 14.

[0286] <Third Embodiment>

[0287] Figure 14 is an XY cross-sectional view of the first through-wiring of the third embodiment of the inductor component. The inner periphery and the outer periphery of the first through-wiring of the third embodiment are different from those of the first embodiment ( Figure 4 ). The following describes this different structure. Other structures are the same as those of the first embodiment, and their descriptions are omitted.

[0288] As Figure 14 shown, in the inductor component 1I of the third embodiment, in a cross-section parallel to the bottom surface 100b and including the axis AX, the first through-wiring 13I includes an inner periphery 131 parallel to the axis AX and facing the axis AX side, and an outer periphery 132 parallel to the axis AX and facing the side opposite to the axis AX. The length of the inner periphery 131 is longer than the length of the outer periphery 132. Accordingly, since the length of the inner periphery 131 is longer than the length of the outer periphery 132, the surface area of the inner surface of the first through-wiring 13I can be increased. Therefore, the surface area of the inner surface of the coil can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased.

[0289] The first through-wiring 13I further includes a side edge 133 connecting the inner periphery 131 and the outer periphery 132. The side edge 133 is a straight line and is inclined with respect to the direction orthogonal to the axis AX. The side edge 133 faces the side opposite to the axis AX. The interval between both side edges 133 becomes wider as it goes from the outer periphery 132 toward the inner periphery 131. In other words, the cross-sectional shape of the first through-wiring 13I is trapezoidal. In addition, the side edge 133 may not be a straight line but a curve.

[0290] In addition, although not shown, the second through-wiring may also have the same structure as the first through-wiring 13I and have the same effects as the above-described first through-wiring 13I.

[0291] <Fourth Embodiment>

[0292] Figure 15 is an XY cross-sectional view of the first through-wiring of the fourth embodiment of the inductor component. The inner periphery and the outer periphery of the reference first through-wiring of the fourth embodiment are different from those of the second embodiment ( Figure 11 ). The following describes this different structure. Other structures are the same as those of the second embodiment, and their descriptions are omitted.

[0293] As Figure 15As shown, in the inductor component 1J of the fourth embodiment, when the bisector L1 of the angle θ formed by the bottom surface wiring 11b and the top surface wiring 11t connected to the reference first through-wiring 13J is defined when viewed from a direction orthogonal to the bottom surface 100b, in a cross-section parallel to the bottom surface 100b and including the axis AX, the reference first through-wiring 13A includes an inner periphery 131 parallel to the direction orthogonal to the bisector L1 and facing the bisector L1 side, and an outer periphery 132 parallel to the direction orthogonal to the bisector L1 and facing the side opposite to the bisector L1. The length of the inner periphery 131 is longer than the length of the outer periphery 132. Accordingly, since the length of the inner periphery 131 is longer than the length of the outer periphery 132, the surface area of the inner surface of the reference first through-wiring 13J can be increased. Therefore, the surface area of the inner surface of the coil can be increased, the resistance value at high frequencies is reduced, and the Q value at high frequencies is increased.

[0294] The reference first through-wiring 13J further includes a side edge 133 connecting the inner periphery 131 and the outer periphery 132. The side edge 133 is a straight line and is inclined with respect to the bisector L1. The side edge 133 faces the side opposite to the bisector L1. The interval between the two side edges 133 becomes wider as it goes from the outer periphery 132 toward the inner periphery 131. In other words, the cross-sectional shape of the reference first through-wiring 13J is trapezoidal. In addition, the side edge 133 may not be a straight line but a curve.

[0295] In addition, all the first through-wirings may have the same structure as the reference first through-wiring 13A. Although not shown, the reference second through-wiring may also have the same structure as the reference first through-wiring 13J and have the same effects as the above-mentioned reference first through-wiring 13J. At this time, all the second through-wirings may have the same structure as the reference second through-wiring.

[0296] In addition, the present disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the gist of the present disclosure. For example, various combinations of the characteristic points of the first to fourth embodiments can be made.

[0297] In the above-described first embodiment and the above-described second embodiment, the first through-wiring includes an inner periphery, an outer periphery, and a side edge, but it may not include the side edge and only include the inner periphery and the outer periphery. At this time, the inner periphery and the outer periphery may also be convex curves. For example, the radius of curvature of the inner periphery is larger than the radius of curvature of the outer periphery. In addition, the inner periphery and the outer periphery may also be concave curves. In addition, the second through-wiring may also be the same as the first through-wiring.

[0298] The present disclosure includes the following aspects.

[0299] <1> An inductor component, comprising:

[0300] A green body including a first major surface and a second major surface facing each other;

[0301] A coil disposed on the green body and wound in a spiral shape along an axis; and

[0302] A first external electrode and a second external electrode disposed on the green body and electrically connected to the coil,

[0303] The axis of the coil is arranged parallel to the first major surface,

[0304] The coil includes:

[0305] A plurality of first coil wirings disposed on the first major surface side with respect to the axis and arranged along the axis in a plane parallel to the first major surface;

[0306] A plurality of second coil wirings disposed on the second major surface side with respect to the axis and arranged along the axis in a plane parallel to the second major surface;

[0307] A plurality of first through wirings extending from the first coil wirings toward the second coil wirings and arranged along the axis; and

[0308] A plurality of second through wirings extending from the first coil wirings toward the second coil wirings, disposed on the side opposite to the first through wirings with respect to the axis, and arranged along the axis,

[0309] At least a part of the spiral shape is formed by connecting the first coil wirings, the first through wirings, the second coil wirings, and the second through wirings in this order.

[0310] In a cross-section parallel to the first major surface and including the axis, the first through wiring includes an inner periphery facing the axis side and an outer periphery facing the side opposite to the axis, and the length of the inner periphery is longer than the length of the outer periphery.

[0311] <2> An inductor component including:

[0312] A green body including a first major surface and a second major surface facing each other;

[0313] A coil disposed on the green body and wound in a spiral shape along an axis; and

[0314] A first external electrode and a second external electrode disposed on the green body and electrically connected to the coil,

[0315] The axis of the coil is arranged parallel to the first major surface,

[0316] The above-mentioned coil includes:

[0317] A plurality of first coil wirings, which are arranged on the first main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the first main surface;

[0318] A plurality of second coil wirings, which are arranged on the second main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the second main surface;

[0319] A plurality of first through wirings, which extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring and are arranged along the above-mentioned axis; and

[0320] A plurality of second through wirings, which extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring, are arranged on the opposite side of the above-mentioned axis from the above-mentioned first through wiring, and are arranged along the above-mentioned axis,

[0321] At least a part of the above-mentioned spiral shape is formed by connecting the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring in this order.

[0322] When viewed from a direction orthogonal to the first main surface, when a bisector of the angle formed by the first coil wiring and the second coil wiring connected to the reference first through wiring is defined, in a cross-section parallel to the first main surface and including the above-mentioned axis, the reference first through wiring includes an inner periphery facing the bisector side and an outer periphery facing the side opposite to the bisector, the length of the inner periphery is longer than the length of the outer periphery, and the reference first through wiring is one of the above-mentioned first through wirings.

[0323] <3>An inductor component, comprising:

[0324] A green body including a first main surface and a second main surface facing each other;

[0325] A coil, which is provided on the above-mentioned green body and is wound in a spiral shape along an axis; and

[0326] A first external electrode and a second external electrode, which are provided on the above-mentioned green body and are electrically connected to the above-mentioned coil,

[0327] The axis of the above-mentioned coil is arranged parallel to the first main surface,

[0328] The above-mentioned coil includes:

[0329] A plurality of first coil wirings are arranged on the first main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the first main surface;

[0330] A plurality of second coil wirings are arranged on the second main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the second main surface;

[0331] A plurality of first through wirings extend from the first coil wiring toward the second coil wiring and are arranged along the above-mentioned axis; and

[0332] A plurality of second through wirings extend from the first coil wiring toward the second coil wiring, are arranged on the side opposite to the first through wiring with respect to the above-mentioned axis, and are arranged along the above-mentioned axis,

[0333] At least a part of the spiral shape is formed by connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring in this order.

[0334] In a cross-section parallel to the first main surface and including the above-mentioned axis, the first through wiring includes an inner periphery parallel to the above-mentioned axis and facing the axis side, and an outer periphery parallel to the above-mentioned axis and facing the side opposite to the axis, and the length of the inner periphery is longer than the length of the outer periphery.

[0335] <4> An inductor component, comprising:

[0336] A green body including a first main surface and a second main surface facing each other;

[0337] A coil provided on the above-mentioned green body and wound in a spiral shape along an axis; and

[0338] A first external electrode and a second external electrode provided on the above-mentioned green body and electrically connected to the above-mentioned coil,

[0339] The axis of the above-mentioned coil is arranged parallel to the first main surface,

[0340] The above-mentioned coil includes:

[0341] A plurality of first coil wirings are arranged on the first main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the first main surface;

[0342] A plurality of second coil wirings are arranged on the second main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the second main surface;

[0343] A plurality of first through wirings extending from the above-mentioned first coil wiring toward the above-mentioned second coil wiring and arranged along the above-mentioned axis; and

[0344] A plurality of second through wirings extending from the above-mentioned first coil wiring toward the above-mentioned second coil wiring, provided on the opposite side of the above-mentioned axis from the above-mentioned first through wirings, and arranged along the above-mentioned axis,

[0345] By connecting the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring in this order, at least a part of the above-mentioned spiral shape is formed.

[0346] When viewed from a direction orthogonal to the above-mentioned first main surface, when bisecting the angle formed by the above-mentioned first coil wiring and the above-mentioned second coil wiring connected to the reference first through wiring, on a cross-section parallel to the above-mentioned first main surface and including the above-mentioned axis, the reference first through wiring includes an inner periphery and an outer periphery. The inner periphery is parallel to the direction orthogonal to the bisecting line and faces the bisecting line side, the outer periphery is parallel to the direction orthogonal to the bisecting line and faces the side opposite to the bisecting line, the length of the inner periphery is longer than the length of the outer periphery, and the reference first through wiring is one of the above-mentioned first through wirings.

[0347] <5> The inductor component according to any one of <1> to <4>,

[0348] The above-mentioned green body contains SiO 2 .

[0349] <6> The inductor component according to <1> or <2>,

[0350] The inner periphery of the above-mentioned first through wiring has a curved portion with a convex curve.

[0351] <7> The inductor component according to <6>,

[0352] The above-mentioned plurality of first through wirings include two of the above-mentioned first through wirings in which the directions of the curved portions of the above-mentioned inner peripheries are different from each other.

[0353] <8> The inductor component according to any one of <1> to <7>,

[0354] The length of the inner periphery of the above-mentioned first through wiring is 1.5 times or more the length of the outer periphery of the above-mentioned first through wiring.

[0355] <9> The inductor component according to any one of <1> to <8>,

[0356] When viewed from a direction orthogonal to the first major surface, the first end portion of the first coil wiring is connected to the first end portion of the first through-wiring, and the shape of the outside of the coil of the first end portion of the first coil wiring follows the shape of the outside of the coil of the first end portion of the first through-wiring.

[0357] <10> The inductor component according to any one of <1> to <9>.

[0358] When viewed from a direction orthogonal to the first major surface, the angle formed by the first coil wiring and the second coil wiring that are connected to the same first through-wiring is 5° or more and 45° or less.

[0359] <11> The inductor component according to any one of <1> to <10>.

[0360] In a cross-section orthogonal to the direction in which the first coil wiring extends, the upper surface of the first coil wiring on the side opposite to the axis has a convex shape protruding upward on the side opposite to the axis.

[0361] <12> The inductor component according to <11>.

[0362] The first external electrode is disposed on the first coil wiring.

[0363] The upper surface of the first coil wiring faces the first external electrode.

[0364] <13> The inductor component according to any one of <1> to <12>.

[0365] When viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel.

[0366] <14> The inductor component according to any one of <1> to <13>.

[0367] The green compact contains SiO 2 ,

[0368] The first through-wiring contains SiO 2 .

[0369] <15> The inductor component according to any one of <1> to <14>.

[0370] The first through-wiring contains a void portion or a resin portion.

[0371] <16> The inductor component according to any one of <1> to <15>.

[0372] When viewed in the direction extending from the first through-wiring, the first through-wiring has a conductive layer on the outer peripheral side and a non-conductive layer on the inner side of the conductive layer.

[0373] <17> The inductor component according to any one of <1> to <16>,

[0374] The axial length of the coil is shorter than the inner diameter of the coil.

[0375] <18> The inductor component according to any one of <1> to <17>,

[0376] The first through-wiring extends in a direction orthogonal to the first main surface,

[0377] The cross-sectional area of at least one of the end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

[0378] <19> The inductor component according to any one of <1> to <18>,

[0379] When viewed in a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside compared to the outer surface of the green body.

[0380] <20> The inductor component according to any one of <1> to <19>,

[0381] It further includes an organic insulator provided on the first main surface,

[0382] The green body is an inorganic insulator, and the organic insulator is located inside compared to the outer surface of the inorganic insulator when viewed in a direction orthogonal to the first main surface.

[0383] Explanation of reference numerals

[0384] 1. 1A - 1J... Inductor components, 10... Green body, 11b... Bottom surface wiring (first coil wiring), 11b1... First end, 11b2... Second end, 11b3... Upper surface, 11t... Top surface wiring (second coil wiring), 11t3... Upper surface, 13, 13A, 13I, 13J... First through-wiring, 131... Inner perimeter, 132... Outer perimeter, 13a... First end, 13e... End, 13m... Central part, 13s... Conductive layer, 13u... Non-conductive layer, 14, 14A... Second through-wiring, 141... Inner perimeter, 142... Outer perimeter, 14a... First end, 22... Insulator, 100b... Bottom surface (first main surface), 100t... Top surface (second main surface), 110, 110A, 110B... Coils, 121... First external electrode, 121b... Bottom surface part, 121v... Conductive part, 121e1... Base layer, 121e2... Plating layer, 122... Second external electrode, 122b... Bottom surface part, 122v... Conductive part, AX... Axis, BX... Virtual line, L1, L2... Bisecting lines, Lr... Orthogonal line, Lv... Virtual line, V... Through-hole, θ, θ1, θ2... Angles formed by the bottom surface wiring and the top surface wiring.

Claims

1. An inductor component, wherein, it includes: a green body including a first main surface and a second main surface facing each other; a coil disposed on the green body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode disposed on the green body and electrically connected to the coil, the axis of the coil is arranged parallel to the first main surface, the coil includes: a plurality of first coil wirings disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface; a plurality of second coil wirings disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, disposed on the side opposite to the first through wiring with respect to the axis, and arranged along the axis, by connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring in this order to sequentially connect the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of the spiral shape is formed, in a cross-section parallel to the first main surface and including the axis, the first through wiring includes an inner periphery facing the axis side and an outer periphery facing the side opposite to the axis, and the length of the inner periphery is longer than the length of the outer periphery.

2. An inductor component, wherein, it includes: a green body including a first main surface and a second main surface facing each other; a coil disposed on the green body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode disposed on the green body and electrically connected to the coil, the axis of the coil is arranged parallel to the first main surface, the coil includes: a plurality of first coil wirings disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface; a plurality of second coil wirings disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, disposed on the side opposite to the first through wiring with respect to the axis, and arranged along the axis, by connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring in this order to sequentially connect the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of the spiral shape is formed, When viewed from a direction orthogonal to the above-described first major surface, when a bisector defining an angle formed by the above-described first coil wiring and the above-described second coil wiring connected to the reference first through-wiring is defined, on a cross-section parallel to the above-described first major surface and including the above-described axis, the reference first through-wiring includes an inner periphery facing the bisector side and an outer periphery facing the side opposite to the bisector, the length of the inner periphery is longer than the length of the outer periphery, and the reference first through-wiring is one of the first through-wirings.

3. An inductor component wherein it includes: a green body including a first major surface and a second major surface facing each other; a coil provided on the above-described green body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided on the above-described green body and electrically connected to the above-described coil, the above-described axis of the above-described coil is arranged parallel to the above-described first major surface, the above-described coil includes: a plurality of first coil wirings arranged on the first major surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described first major surface; a plurality of second coil wirings arranged on the second major surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described second major surface; a plurality of first through-wirings extending from the above-described first coil wiring toward the above-described second coil wiring and arranged along the above-described axis; and a plurality of second through-wirings extending from the above-described first coil wiring toward the above-described second coil wiring, arranged on the side opposite to the above-described first through-wiring with respect to the above-described axis, and arranged along the above-described axis, by connecting the above-described first coil wiring, the above-described first through-wiring, the above-described second coil wiring, and the above-described second through-wiring in this order, at least a part of the above-described spiral shape is formed, on a cross-section parallel to the above-described first major surface and including the above-described axis, the above-described first through-wiring includes an inner periphery parallel to the above-described axis and facing the above-described axis side and an outer periphery parallel to the above-described axis and facing the side opposite to the above-described axis, and the length of the inner periphery is longer than the length of the outer periphery.

4. An inductor component wherein it includes: a green body including a first major surface and a second major surface facing each other; a coil provided on the above-described green body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided on the above-described green body and electrically connected to the above-described coil, the above-described axis of the above-described coil is arranged parallel to the above-described first major surface, the above-described coil includes: a plurality of first coil wirings arranged on the first major surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described first major surface; a plurality of second coil wirings arranged on the second major surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described second major surface; a plurality of first through-wirings extending from the above-described first coil wiring toward the above-described second coil wiring and arranged along the above-described axis; and A plurality of second through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring, are arranged on the side opposite to the above-mentioned first through wiring with respect to the above-mentioned axis, and are arranged along the above-mentioned axis. At least a part of the above-mentioned spiral shape is formed by connecting the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring in this order. When viewed from a direction orthogonal to the above-mentioned first main surface, when a bisector of an angle formed by the above-mentioned first coil wiring and the above-mentioned second coil wiring connected to a reference first through wiring is defined, in a cross-section parallel to the above-mentioned first main surface and including the above-mentioned axis, the reference first through wiring includes an inner periphery and an outer periphery. The inner periphery is parallel to a direction orthogonal to the above-mentioned bisector and faces the above-mentioned bisector side, the outer periphery is parallel to a direction orthogonal to the above-mentioned bisector and faces the side opposite to the above-mentioned bisector, the length of the inner periphery is longer than the length of the outer periphery, and the reference first through wiring is one of the above-mentioned first through wirings.

5. The inductor component according to any one of claims 1 to 4, wherein, The above-mentioned green body contains SiO 2 .

6. The inductor component according to claim 1 or 2, wherein, The inner periphery of the above-mentioned first through wiring has a curved portion with a convex curve.

7. The inductor component according to claim 6, wherein, The above-mentioned plurality of first through wirings include two of the above-mentioned first through wirings in which the directions of the curved portions of the above-mentioned inner peripheries are different from each other.

8. The inductor component according to any one of claims 1 to 7, wherein, The length of the inner periphery of the above-mentioned first through wiring is 1.5 times or more the length of the outer periphery of the above-mentioned first through wiring.

9. The inductor component according to any one of claims 1 to 8, wherein, When viewed from a direction orthogonal to the above-mentioned first main surface, a first end portion of the above-mentioned first coil wiring is connected to a first end portion of the above-mentioned first through wiring, and the shape of the outside of the coil of the first end portion of the above-mentioned first coil wiring follows the shape of the outside of the coil of the first end portion of the above-mentioned first through wiring.

10. The inductor component according to any one of claims 1 to 9, wherein, When viewed from a direction orthogonal to the above-mentioned first main surface, the angle formed by the above-mentioned first coil wiring and the above-mentioned second coil wiring connected to the same above-mentioned first through wiring is 5° or more and 45° or less.

11. The inductor component according to any one of claims 1 to 10, wherein, In a cross-section orthogonal to the direction in which the above-mentioned first coil wiring extends, the upper surface of the above-mentioned first coil wiring on the side opposite to the above-mentioned axis has a convex shape, and the convex shape protrudes upward on the side opposite to the above-mentioned axis.

12. The inductor component according to claim 11, wherein, The above-mentioned first external electrode is disposed on the above-mentioned first coil wiring, The upper surface of the above-mentioned first coil wiring faces the above-mentioned first external electrode.

13. The inductor component according to any one of claims 1 to 12, wherein, when viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel.

14. The inductor component according to any one of claims 1 to 13, wherein, The above-mentioned green body contains SiO 2 , The above-mentioned first through-wiring includes SiO 2 .

15. The inductor component according to any one of claims 1 to 14, wherein, the first through-wiring includes a void portion or a resin portion.

16. The inductor component according to any one of claims 1 to 15, wherein, when viewed from the direction in which the first through-wiring extends, the first through-wiring has a conductive layer on the outer peripheral side and a non-conductive layer inside the conductive layer.

17. The inductor component according to any one of claims 1 to 16, wherein, the axial length of the coil is shorter than the inner diameter of the coil.

18. The inductor component according to any one of claims 1 to 17, wherein, the first through-wiring extends in a direction orthogonal to the first main surface, and the cross-sectional area of at least one of the two end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

19. The inductor component according to any one of claims 1 to 18, wherein, when viewed from a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside compared to the outer surface of the green body.

20. The inductor component according to any one of claims 1 to 19, wherein, it further includes an organic insulator provided on the first main surface, the green body is an inorganic insulator, and when viewed from a direction orthogonal to the first main surface, the organic insulator is located inside compared to the outer surface of the inorganic insulator.

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