Novel base material back grinding protection device and using method thereof

Abstract

The invention relates to the technical field of semiconductor manufacturing, and provides a novel base material back grinding protection device and a using method thereof.The novel base material back grinding protection device comprises a bracket used for supporting a base material, the bracket comprises a frame body, a bracket groove is formed in the top face of the frame body, and the side face of the bracket groove is attached to the side face of the base material; a through hole is formed in the bottom surface of the rack body, the through hole is communicated with the bracket, the sealing cover is used for sealing the through hole and comprises a cover body, and the top surface of the cover body is attached to the bottom surface of the rack body; in addition, the invention further discloses a using method of the novel base material back grinding protection device, and the using method is suitable for the novel base material back grinding protection device and comprises a base material loading method and a base material disassembling method. According to the invention, the production efficiency can be improved, the protection on the base material is more comprehensive, the precision requirement of the required equipment is low, the operation is simple, and the produced temporary protective film can be easily stripped from the base material and is not easy to remain.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and more particularly, to a novel substrate back grinding protection device and a method for using the same. Background Art

[0002] With the increasing applications of semiconductor chips and display glass, improving the yield and reliability and avoiding damage to the substrate during the processing have gradually become the focus of the industry.

[0003] To solve the above problems, a temporary protective film is usually formed on the surface of the substrate and peeled off after the processing is completed. Such a temporary protective film formed on the substrate has the following requirements: it is required to have a certain hardness and a small coating thickness deviation; when forming the temporary protective film, it is necessary to meet the requirements of the automated production line beat, that is, it can quickly form a temporary protective film on the substrate; after completing the relevant processing technology, the temporary protective film can be easily peeled off from the substrate without causing damage or contamination to the substrate.

[0004] However, a coating composition using a polyvinyl chloride resin paste and a plasticizer in the prior art can play a certain protective role for the substrate, but there are still some problems, such as low production efficiency, insufficient protection, high equipment precision requirements, complex operation, difficult peeling, and easy residue.

[0005] Therefore, the existing wafer back grinding protection devices and methods still need to be improved. Summary of the Invention

[0006] According to the above-mentioned technical problems, a novel substrate back grinding protection device and a method for using the same are provided.

[0007] The technical means adopted by the present invention are as follows: In a first aspect, a novel substrate back grinding protection device includes: a bracket for holding the substrate, the bracket including a frame body, a receiving groove being formed on the top surface of the frame body, the side surface of the receiving groove being in contact with the side surface of the substrate, a through hole being formed on the bottom surface of the frame body, the through hole being communicated with the receiving groove; and a sealing cover for sealing the through hole, the sealing cover including a cover body, the top surface of the cover body being in contact with the bottom surface of the frame body.

[0008] Further, the substrate includes a wafer and display glass.

[0009] Further, the materials of the bracket and the sealing cover both include acrylate polymers.

[0010] Second aspect, a method for using a novel substrate back grinding protection device, applicable to the novel substrate back grinding protection device described in any one of the first aspect, including a substrate loading method A, and the substrate loading method A includes the following steps: SA1: Make the top surface of the cover body fit with the bottom surface of the frame body. At this time, the cover body seals the through hole. SA2: Inject ultraviolet curable adhesive into the support groove and the through hole, and then place the substrate into the support groove. At this time, the side surface of the support groove fits with the side surface of the substrate, and the surface to be processed on the substrate faces upward and is located directly above the support groove. SA3: Irradiate ultraviolet light on the ultraviolet curable adhesive in the support groove and the through hole from directly below the cover body until the ultraviolet curable adhesive in the support groove and the through hole is completely cured. At this time, process the surface to be processed on the substrate.

[0011] Furthermore, it also includes a substrate disassembly method B, and the substrate disassembly method B includes the following steps: SB1: Separate the top surface of the cover body from the bottom surface of the frame body. At this time, the cover body no longer seals the through hole. SB2: Place the frame body into an alkaline solution. At this time, the alkaline solution dissolves the ultraviolet curable adhesive in the support groove and the through hole. SB3: When the ultraviolet curable adhesive in the support groove and the through hole is completely dissolved, take out the substrate from the support groove.

[0012] Compared with the prior art, the present invention has the following advantages: 1. In the present invention, when a temporary protective film needs to be formed on the surface of the substrate, first use the cover body to seal the through hole, and then inject ultraviolet curable adhesive into the support groove and the through hole. The ultraviolet curable adhesive will not overflow outside the frame body through the through hole; after the injection of the ultraviolet curable adhesive is completed, place the substrate into the support groove. At this time, the side surface of the support groove fits with the side surface of the substrate, and the surface to be processed on the substrate faces upward and is located directly above the support groove, so that the temporary protective film produced by the present invention can provide comprehensive protection for the substrate and does not affect the processing of the substrate; irradiate ultraviolet light on the ultraviolet curable adhesive in the support groove and the through hole from directly below the cover body until the ultraviolet curable adhesive in the support groove and the through hole is completely cured. At this time, the surface to be processed on the substrate can be processed; in addition, the present invention can improve production efficiency, and the accuracy requirements for the required equipment are low and the operation is simple.

[0013] 2. In the present invention, when the temporary protective film needs to be removed from the surface of the substrate, first make the cover body no longer seal the through hole, and then place the frame body into an alkaline solution. The alkaline solution can contact the ultraviolet curable adhesive in the support groove and the through hole; when the ultraviolet curable adhesive in the support groove and the through hole is completely dissolved, the processed substrate can be taken out from the support groove; in addition, the temporary protective film produced by the present invention can be easily peeled off from the substrate and is not likely to have residues.

[0014] 3. In the present invention, the material of the bracket and the material of the sealing cover both include acrylic polymers, which have the advantages of good transparency, strong chemical resistance, high mechanical strength, good resistance to ultraviolet aging, etc. At the same time, the material has strong adaptability, and the equipment can be adjusted at any time according to the raw materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 This is an overall structural diagram of a novel substrate back grinding protection device in the present invention; Figure 2 It is a schematic diagram of the bracket, the sealing cover, the substrate, the shadowless adhesive and the ultraviolet light in the present invention; Figure 3 is an overall flow chart of the substrate loading method A of the present invention; Figure 4 is an overall flow chart of the substrate disassembly method B of the present invention; In the figure: 1- bracket; 2- sealing cover; 101- frame body; 102- bracket; 103- through hole; 201- wall body; 202- cover body. DETAILED DESCRIPTION

[0017] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments of the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0020] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be clear that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not require further discussion in subsequent drawings.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention: the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0022] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figure for the device. For example, if the device in the attached drawing is inverted, the device described as "above or over other devices or structures" will then be positioned "below or under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations are made for the spatial relative descriptions used here.

[0023] In addition, it should be noted that the use of terms such as "first", "second" etc. to define components is merely for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the protection scope of the present invention.

[0024] Embodiment 1: As Figure 1 shown, a new type of substrate back grinding protection device includes: a bracket 1 for holding up the substrate. The bracket 1 includes a frame body 101. A receiving groove 102 is formed on the top surface of the frame body 101. The side surface of the receiving groove 102 is in contact with the side surface of the substrate. A through hole 103 is formed on the bottom surface of the frame body 101, and the through hole 103 communicates with the receiving groove 102; a sealing cover 2 for sealing the through hole 103. The sealing cover 2 includes a cover body 202, and the top surface of the cover body 202 is in contact with the bottom surface of the frame body 101.

[0025] Specifically, the frame body 101, the receiving groove 102 and the through hole 103 are all cylindrical structures. A plurality of through holes 103 are provided, and all the through holes 103 are evenly distributed and formed on the bottom surface of the frame body 101.

[0026] In addition, the cover body 202 is a cylindrical structure. The sealing cover 2 further includes a wall body 201 which is an annular structure. The inner diameter of the wall body 201 is equal to the diameter of the frame body 101, and the outer diameter of the wall body 201 is equal to the diameter of the cover body 202. The bottom surface of the wall body 201 is coaxially and fixedly installed on the top surface of the cover body 202; when the top surface of the cover body 202 is in contact with the bottom surface of the frame body 101, the side surface of the frame body 101 is in contact with the inner side surface of the wall body 201, thereby playing a role in limiting the frame body 101.

[0027] In this embodiment, the substrate includes a wafer and a display glass.

[0028] In this embodiment, the material of the bracket 1 and the material of the sealing cover 2 both include acrylic polymer.

[0029] Specifically, the material of the bracket 1 and the material of the sealing cover 2 only need to meet the requirements of good transparency, strong chemical resistance, high mechanical strength, good resistance to ultraviolet aging, etc., and are not limited to acrylic polymers; they have good transparency, strong optical properties and certain resistance to ultraviolet aging, so that the bracket 1 and the sealing cover 2 will not be affected by the material itself during the process of curing the shadowless glue (i.e., UV glue) by irradiating ultraviolet rays (i.e., UV light); they have good chemical resistance, so that the bracket 1 and the sealing cover 2 will not be corroded during the process of soaking and debonding the cured shadowless glue (i.e., UV glue) in an alkaline solution, and can be recycled; they have high mechanical strength and hardness, so that the bracket 1 and the sealing cover 2 will not be deformed or damaged due to external force during the processing of the substrate.

[0030] In addition, the material of the bracket 1 and the material of the sealing cover 2 must also meet the requirements of being solvent-free, volatile-free, and non-polluting to the ambient air.

[0031] Embodiment 2: like Figures 1 to 3 As shown, a method for using a novel substrate back grinding protection device is applicable to a novel substrate back grinding protection device described in any one of Embodiment 1, including a substrate loading method A, wherein the substrate loading method A includes the following steps: SA1: The top surface of the cover 202 is fitted with the bottom surface of the frame 101 , and the cover 202 seals the through hole 103 ; SA2: injecting shadowless glue (i.e., UV glue) into the bracket 102 and the through hole 103, and then placing the substrate into the bracket 102, at which time the side of the bracket 102 is in contact with the side of the substrate, and the surface to be processed on the substrate faces upward and is located directly above the bracket 102; SA3: Expose ultraviolet light (i.e., UV light) to the shadowless glue (i.e., UV glue) in the bracket 102 and the through hole 103 from directly below the cover body 202 until the shadowless glue (i.e., UV glue) in the bracket 102 and the through hole 103 is completely cured. At this time, the surface that needs to be processed on the substrate is processed (i.e., grinding, polishing, etching, etc.).

[0032] In this embodiment, Figure 4 As shown, it also includes a substrate disassembly method B, and the substrate disassembly method B includes the following steps: SB1: Separate the top surface of the cover 202 from the bottom surface of the frame 101. At this time, the cover 202 no longer seals the through hole 103; SB2: placing the frame 101 into an alkaline solution, and the alkaline solution dissolves the shadowless glue (i.e., UV glue) in the bracket 102 and the through hole 103; SB3: When the shadowless glue (ie, UV glue) in the bracket 102 and the through hole 103 is completely dissolved, the substrate is taken out from the bracket 102 .

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A novel substrate back grinding protection device, characterized in that: include: Bracket (1); Used to hold up a substrate, the bracket (1) comprises a frame body (101), a bracket groove (102) is provided on the top surface of the frame body (101), the side surface of the bracket groove (102) is in contact with the side surface of the substrate, and a through hole (103) is provided on the bottom surface of the frame body (101), the through hole (103) is connected to the bracket groove (102); A sealing cover (2) is used for sealing the through hole (103), wherein the sealing cover (2) comprises a cover body (202), wherein the top surface of the cover body (202) is in contact with the bottom surface of the frame body (101).

2. A novel substrate back grinding protection device according to claim 1, characterized in that: The substrates include wafers and display glass.

3. A novel substrate back grinding protection device according to claim 1, characterized in that: The material of the bracket (1) and the material of the sealing cover (2) both include acrylic polymers.

4. A method for using a novel substrate back grinding protection device, applicable to a novel substrate back grinding protection device as claimed in any one of claims 1 to 3, characterized in that: The method comprises a substrate loading method A, wherein the substrate loading method A comprises the following steps: SA1: The top surface of the cover body (202) is made to fit with the bottom surface of the frame body (101), and the cover body (202) seals the through hole (103); SA2: injecting shadowless glue into the bracket (102) and the through hole (103), and then placing the substrate into the bracket (102), wherein the side surface of the bracket (102) is in contact with the side surface of the substrate, and the surface to be processed on the substrate faces upward and is located directly above the bracket (102); SA3: irradiating the shadowless adhesive in the bracket (102) and the through hole (103) with ultraviolet rays from directly below the cover body (202) until the shadowless adhesive in the bracket (102) and the through hole (103) is completely cured, and then processing the surface that needs to be processed on the substrate.

5. The method for using the novel substrate back grinding protection device according to claim 4 is characterized in that: Also included is a substrate disassembly method B, wherein the substrate disassembly method B The following steps are involved: SB1: The top surface of the cover body (202) is separated from the bottom surface of the frame body (101), and the cover body (202) no longer seals the through hole (103); SB2: placing the frame (101) into an alkaline solution, where the alkaline solution dissolves the shadowless adhesive in the bracket (102) and the through hole (103); SB3: When the shadowless adhesive in the bracket (102) and the through hole (103) is completely dissolved, the substrate is removed from the bracket (102).

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