Refrigerator and refrigeration control method

Abstract

The invention provides a refrigerator and a refrigeration control method. The refrigeration control method comprises the steps that the environment temperature of the refrigerator is obtained; when the environment temperature is smaller than a first threshold value and the refrigerator is in a defrosting stage, the defrosting heater is started, the first semiconductor module is controlled to operate, the second semiconductor module is closed, a first port of the first semiconductor module provides cooling capacity for the freezing chamber, and a second port of the first semiconductor module provides heat for the evaporator; and when the environment temperature is smaller than the first threshold value and the refrigerator is in the refrigeration stage, the first semiconductor module is closed, the second semiconductor module is controlled to execute the second operation mode, a third port of the second semiconductor module provides heat for the refrigerating chamber, and a fourth port of the second semiconductor module provides cold for the evaporator. The semiconductor modules are arranged on the two sides of the freezing evaporator correspondingly, through cold and heat output of the semiconductor modules, temperature fluctuation in the chamber defrosting stage is reduced, the defrosting efficiency of the evaporator is improved, and energy consumption is reduced.

Description

Technical Field

[0001] This application relates to the technical field of refrigerators, and particularly to a refrigerator and a refrigeration control method. Background Art

[0002] In the field of modern household appliances, the side-by-side refrigerator is deeply favored by consumers due to its large capacity and reasonable zoning. Due to its large volume, built-in installation requirements, and air-cooled refrigeration method, the side-by-side refrigerator usually adopts a design structure with separate placement of the refrigerating chamber and the freezing chamber. The freezing chamber and the refrigerating chamber are separated by a foaming layer with heat insulation function. However, limited by the heat conduction characteristics of the material, there is a significant temperature difference between the refrigerating chamber and the freezing chamber. Especially in a low-temperature environment (such as the ambient temperature ≤ 10°C), the freezing chamber continuously releases cold due to the refrigeration demand, while the refrigeration demand of the refrigerating chamber decreases or even no refrigeration is required. At this time, the cold in the freezing chamber is conducted to the refrigerating chamber through the middle partition, resulting in an abnormal decrease in the temperature of the refrigerating chamber, and even a phenomenon of falling below 0°C, which is extremely likely to cause damage to fruits and vegetables and other food materials by freezing.

[0003] Too low temperature in the refrigerating chamber will cause a series of serious problems. On the one hand, the freezing of food materials destroys the cell structure, affecting freshness and taste; on the other hand, long-term operation at ultra-low temperature increases the power consumption of the compressor and reduces the energy efficiency ratio; on the other hand, when the temperature sensor in the refrigerating chamber misjudges the working condition, it may trigger an abnormal refrigeration cycle, exacerbating the temperature fluctuation. In addition, in the existing technology, air-cooled refrigerators generally adopt the air duct circulation refrigeration. During the defrosting process, the heat generated by the electric heating wire will spread to the refrigerating chamber and the freezing chamber, causing a large temperature fluctuation in the compartments (up to ±5°C or more), seriously affecting the food preservation effect, especially for temperature-sensitive dairy products, drugs, etc. The harm is more significant.

[0004] To address the problem of too low temperature in the refrigerating chamber, the existing technology usually takes two improvement measures: one is to move the freezing evaporator to the sandwich space between the refrigerating chamber and the freezing chamber to reduce the temperature difference by shortening the heat transfer path; the other is to optimize the thermal conductivity of the foaming layer material to inhibit the lateral conduction of cold. However, the above solutions have serious defects: although the sandwich evaporator design expands the effective volume, it instead increases the cold coupling effect between the freezing chamber and the refrigerating chamber, exacerbating the subcooling phenomenon in the refrigerating chamber under low-temperature conditions; while simply reducing the thermal conductivity of the foaming layer will hinder the uniform distribution of cold during normal refrigeration, resulting in a decrease in the refrigeration efficiency of the refrigerating chamber. In addition, most of the existing defrosting technologies adopt the electric heating centralized defrosting mode, and the defrosting heat cannot be directionally controlled, further deteriorating the problem of the temperature stability of the compartments. The problems of large temperature fluctuations in the freezing chamber and the refrigerating chamber during the defrosting process of the side-by-side refrigerator and low temperature in the refrigerating chamber under low-temperature conditions have never been solved. Summary of the Invention

[0005] This application provides a refrigerator and a refrigeration control method to solve the problems of large temperature fluctuations in the freezing chamber and the refrigerating chamber during the defrosting process of the side-by-side refrigerator and low temperature in the refrigerating chamber under low-temperature conditions in the prior art.

[0006] In a first aspect, the present application provides a refrigerator, which includes:

[0007] A freezer compartment;

[0008] A refrigerator compartment;

[0009] An evaporator and a freezing air duct are vertically arranged on an intermediate partition between the freezer compartment and the refrigerator compartment. A blower is arranged in the freezing air duct. A first semiconductor module is arranged on a side of the evaporator close to the refrigerator compartment, and a second semiconductor module is arranged on a side of the evaporator close to the freezer compartment; the first semiconductor module is arranged in the freezing air duct, and the second semiconductor module is arranged in a foaming layer of the intermediate partition between the freezer compartment and the refrigerator compartment; the first semiconductor module includes a first semiconductor refrigeration chip, the second semiconductor module includes a second semiconductor refrigeration chip, and the first semiconductor refrigeration chip and the second semiconductor refrigeration chip respectively include a first port, a second port, a third port and a fourth port;

[0010] A defrost heater is arranged at the bottom of the evaporator;

[0011] A controller, which is arranged in the refrigerator and is configured to:

[0012] Obtain the ambient temperature of the refrigerator;

[0013] When the ambient temperature is less than a first threshold and the refrigerator is in the defrosting stage, start the defrost heater, control the first semiconductor module to operate, and turn off the second semiconductor module. The first port of the first semiconductor module provides cold for the freezer compartment, and the second port of the first semiconductor module provides heat for the evaporator;

[0014] When the ambient temperature is less than a first threshold and the refrigerator is in the refrigeration stage, turn off the first semiconductor module, control the second semiconductor module to execute a second operation mode, the third port of the second semiconductor module provides heat for the refrigerator compartment according to the real-time temperature of the refrigerator compartment, and the fourth port of the second semiconductor module provides cold for the evaporator.

[0015] In some possible implementation manners, the controller is configured to:

[0016] When the ambient temperature is greater than or equal to the first threshold and the refrigerator is in the defrosting stage, start the defrosting heater, control the operation of the first semiconductor module, control the second semiconductor module to execute the first operation mode, the first port of the first semiconductor refrigeration chip provides cold for the freezer compartment, the third port of the second semiconductor refrigeration chip provides cold for the refrigerator compartment, and the second port of the first semiconductor refrigeration chip and the fourth port of the second semiconductor refrigeration chip provide heat for the evaporator.

[0017] In some possible implementation manners, the controller is configured to:

[0018] When the ambient temperature is greater than or equal to the first threshold and the refrigerator is in the refrigeration stage, control the first semiconductor module and the second semiconductor module to execute the shutdown mode.

[0019] In some possible implementation manners, the controller is configured to: in the first operation mode of the second semiconductor module, the second semiconductor refrigeration chip is set to a forward current, the third port provides cold, and the fourth port provides heat.

[0020] In some possible implementation manners, the controller is further configured to: in the second operation mode of the second semiconductor module, the second semiconductor refrigeration chip is set to a negative current.

[0021] In some possible implementation manners, when the second semiconductor refrigeration chip is set to a negative current, the third port and the fourth port are converted with each other, the third port provides heat for the freezer compartment, and the fourth port provides cold for the evaporator.

[0022] In some possible implementation manners, the first port of the first semiconductor refrigeration chip is arranged on the side close to the freezer compartment, the second port of the first semiconductor refrigeration chip is arranged on the side close to the evaporator, and a heat insulation material is arranged between the first port and the second port.

[0023] In some possible implementation manners, the third port of the second semiconductor refrigeration chip is arranged on the side close to the refrigerator compartment, the fourth port of the second semiconductor refrigeration chip is arranged on the side close to the evaporator, and a foaming layer is arranged between the third port and the fourth port.

[0024] In some possible implementation manners, a humidity sensor is arranged in the foaming layer of the intermediate partition. When the relative humidity in the refrigerator compartment > RH90%, the controller starts the fourth port of the second semiconductor module to perform condensation dehumidification on the surface of the evaporator, and the dehumidification condensate is evaporated and discharged through the heat of the second port of the first semiconductor module.

[0025] Second aspect, the present application provides a refrigeration control method, which is applied to the refrigerator described in the first aspect. The method includes:

[0026] When the ambient temperature is less than the first threshold and the refrigerator is in the defrosting stage, start the defrosting heater, control the first semiconductor module to operate, and turn off the second semiconductor module. The first port of the first semiconductor module provides cold for the freezer compartment, and the second port of the first semiconductor module provides heat for the evaporator;

[0027] When the ambient temperature is less than the first threshold and the refrigerator is in the refrigeration stage, turn off the first semiconductor module, and control the second semiconductor module to execute the second operation mode. The third port of the second semiconductor module provides heat for the refrigerator compartment according to the real-time temperature of the refrigerator compartment, and the fourth port of the second semiconductor module provides cold for the evaporator.

[0028] As can be seen from the above, the present application provides a refrigerator and a refrigeration control method. The refrigeration control method includes: obtaining the ambient temperature of the refrigerator; when the ambient temperature is less than the first threshold and the refrigerator is in the defrosting stage, start the defrosting heater, control the first semiconductor module to operate, and turn off the second semiconductor module. The first port of the first semiconductor module provides cold for the freezer compartment, and the second port of the first semiconductor module provides heat for the evaporator; when the ambient temperature is less than the first threshold and the refrigerator is in the refrigeration stage, turn off the first semiconductor module, and control the second semiconductor module to execute the second operation mode. The third port of the second semiconductor module provides heat for the refrigerator compartment according to the real-time temperature of the refrigerator compartment, and the fourth port of the second semiconductor module provides cold for the evaporator. By precisely controlling the operation of the semiconductor module in different stages, the present application avoids unnecessary refrigeration or heating operations. In a low-temperature environment, turning off the operation of the first semiconductor module in the refrigeration stage reduces energy consumption; at the same time, the second semiconductor module provides heat according to the actual needs of the refrigerator compartment, avoiding overheating, realizing efficient utilization of energy, and reducing the overall energy consumption of the refrigerator. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0030] Figure 1 It is a schematic structural diagram of the refrigerator provided by the embodiment of the present application;

[0031] Figure 2 It is a schematic diagram of the freezer compartment structure provided by the embodiment of the present application;

[0032] Figure 3 Partial enlarged schematic view of the freezer compartment structure provided by the embodiment of the present application;

[0033] Figure 4 Schematic view of the refrigerator compartment structure provided by the embodiment of the present application;

[0034] Figure 5 Schematic view of the structures of the first semiconductor module and the second semiconductor module provided by the embodiment of the present application;

[0035] Figure 6 Flow chart of the refrigeration control method provided by the embodiment of the present application Figure 1 ;

[0036] Figure 7 Flow chart of the refrigeration control method provided by the embodiment of the present application Figure 2 。

[0037] Illustration: 1 - Freezer compartment; 2 - Refrigerator compartment; 3 - Evaporator; 4 - Freezing air duct; 5 - First semiconductor module; 6 - Second semiconductor module; 7 - Defrosting heater; 501 - First semiconductor refrigeration chip; 502 - First port; 503 - Second port; 601 - Second semiconductor refrigeration chip; 602 - Third port; 603 - Fourth port. Detailed implementation manners

[0038] The embodiments will be described in detail below, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following embodiments do not represent all implementation manners consistent with the present application. They are only examples of systems and methods consistent with some aspects of the present application detailed in the claims.

[0039] In the field of modern household appliances, the French door refrigerator is deeply favored by consumers for its large capacity and reasonable zoning. Due to its large volume, the need for built-in installation, and the air-cooled refrigeration method, the French door refrigerator usually adopts a design structure with separate freezer and refrigerator compartments. The freezer compartment and the refrigerator compartment are separated by a foaming layer with heat insulation function, but due to the heat conduction characteristics of the material, there is a significant temperature difference between the freezer compartment and the refrigerator compartment. Especially in a low-temperature environment (such as the ambient temperature ≤ 10°C), the freezer compartment continuously releases cold due to the refrigeration demand, while the refrigeration demand of the refrigerator compartment decreases or even no refrigeration is required. At this time, the cold in the freezer compartment is conducted to the refrigerator compartment through the middle partition, resulting in an abnormal decrease in the temperature of the refrigerator compartment, and even a phenomenon where the temperature is lower than 0°C, which is extremely likely to cause damage to fruits, vegetables and other food materials by freezing.

[0040] An excessively low temperature in the refrigerating compartment can cause a series of serious problems. On the one hand, the freezing of food ingredients leads to the destruction of cell structure, affecting freshness and taste. On the other hand, long-term operation at ultra-low temperatures increases the power consumption of the compressor and reduces the energy efficiency ratio. On the other hand, when the temperature sensor in the refrigerating compartment misjudges the working condition, it may trigger an abnormal refrigeration cycle, exacerbating temperature fluctuations. In addition, in the existing technology, air-cooled refrigerators generally adopt the air duct circulation refrigeration. During the defrosting process, the heat generated by the electric heating wire will spread to the refrigerating compartment and the freezing compartment, causing violent temperature fluctuations in the compartments (up to more than ±5°C), seriously affecting the food preservation effect, especially for temperature-sensitive dairy products, medicines, etc., and the harm is more significant.

[0041] In response to the problem of excessively low temperature in the refrigerating compartment, the existing technology usually takes two improvement measures: one is to move the freezing evaporator to the sandwich space between the refrigerating compartment and the freezing compartment, and reduce the temperature difference by shortening the heat transfer path; the other is to optimize the thermal conductivity of the foaming layer material to inhibit the lateral conduction of cold. However, the above solutions have serious defects: although the sandwich evaporator design expands the effective volume, it instead increases the cold coupling effect between the freezing compartment and the refrigerating compartment, exacerbating the supercooling phenomenon in the refrigerating compartment under low temperature conditions; while simply reducing the thermal conductivity of the foaming layer will hinder the uniform distribution of cold during normal refrigeration, resulting in a decrease in the refrigeration efficiency of the refrigerating compartment. In addition, most of the existing defrosting technologies adopt the electric heating centralized defrosting mode, and the defrosting heat cannot be directionally controlled, further deteriorating the problem of temperature stability in the compartments. The problems of large temperature fluctuations in the freezing compartment and the refrigerating compartment during the defrosting process of the French door refrigerator and low temperature in the refrigerating compartment under low temperature conditions have never been solved.

[0042] Based on this, the present application provides a refrigerator, as Figures 1 to 5 shown, a freezing compartment 1 is provided on one side of the refrigerator, a refrigerating compartment 2 is provided on the other side of the refrigerator, a vertical partition is provided between the freezing compartment 1 and the refrigerating compartment 2, an evaporator 3 and a freezing air duct 4 are arranged, a blower 401 is arranged in the freezing air duct 4, a first semiconductor module 5 is arranged on the freezing side of the evaporator 3, and a second semiconductor module 6 is arranged on the refrigerating side of the evaporator 3. A defrosting heater 7 is arranged at the bottom of the evaporator 3.

[0043] The first semiconductor module 5 includes a first semiconductor refrigeration chip 501 and is arranged in the freezing air duct 4. The first port 502 of the semiconductor refrigeration chip 501 is arranged on the freezing side, the second port 503 of the first semiconductor refrigeration chip 501 is arranged on the side of the evaporator 3, and a heat insulation material 504 is arranged between the first port 502 and the second port 503.

[0044] The second semiconductor module 6 includes a second semiconductor refrigeration chip 601 and is arranged in the foaming layer of the partition between the freezing compartment 1 and the refrigerating compartment 2. The third port 602 of the second semiconductor refrigeration chip 601 is arranged on the refrigerating side, the fourth port 603 of the second semiconductor refrigeration chip 601 is arranged on the side of the evaporator 3, and a foaming layer 604 is arranged between the third port 602 and the fourth port 603.

[0045] The third port 602 is provided on the side surface of the foaming layer of the refrigerating inner liner, and no heat insulation material is filled in the middle.

[0046] The second semiconductor module 6 realizes the mutual conversion between the third port 602 and the fourth port 603 by changing the current direction of the second semiconductor refrigeration chip 601, meeting the different functional requirements of the refrigerator.

[0047] In the first operating mode of the second semiconductor module 6, the second semiconductor refrigeration chip 601 is set to a forward current, the third port 602 provides cold, and the fourth port 603 provides heat.

[0048] In the second operating mode of the second semiconductor module 6, the second semiconductor refrigeration chip 601 is set to a negative current, the third port and the fourth port are mutually converted, the third port 602 provides heat for the freezer compartment, and the fourth port 603 provides cold for the evaporator.

[0049] In the first operating mode, the forward current enables the third port 602 to provide cold for refrigerating the refrigerating compartment 2. When the external environmental temperature is high and the heat load of the refrigerating compartment 2 is large, the temperature of the refrigerating compartment 2 can be quickly reduced to keep the food fresh. In the second operating mode, the negative current makes the third port 602 provide heat, which is suitable for the situation where the temperature of the refrigerating compartment 2 is too low due to the cold leakage of the freezer compartment 1 in a low-temperature environment. By heating the refrigerating compartment 2, the food is prevented from being frozen, and the temperature of the refrigerating compartment 2 is accurately regulated to meet the fresh-keeping requirements under different environments and usage scenarios.

[0050] In the two operating modes, cold and heat are respectively provided, which helps to balance the temperature field inside the refrigerating compartment 2. For example, when refrigerating in the first operating mode, the fourth port 603 provides heat to the evaporator, which can reduce the temperature difference between the vicinity of the evaporator and other areas of the refrigerating compartment; in the second operating mode, the combined action of the third port 602 providing heat and the fourth port 603 providing cold further makes the temperature distribution in the refrigerating compartment 2 more uniform, preventing local overheating or overcooling from affecting the fresh-keeping of the food.

[0051] In the first operating mode, the fourth port 603 provides heat for the evaporator 3 and works in cooperation with the defrosting heater 7. During defrosting, the additional heat source can accelerate the melting of the frost layer on the surface of the evaporator 3, shorten the defrosting time, and reduce the increase in the overall energy consumption of the refrigerator caused by defrosting. In the second operating mode, the fourth port 603 provides cold for the evaporator 3, which can reduce the heat load of the evaporator 3 during the refrigeration stage, enable the evaporator 3 to perform refrigeration work more efficiently, improve the refrigeration efficiency, reduce the running time of the compressor, and reduce the energy consumption.

[0052] Under different operating modes of the second semiconductor module, the cooling and heating outputs of the third port 602 and the fourth port 603 cooperate with the evaporator 3, the freezer 1, and the refrigerator compartment 2, optimizing the energy distribution of the entire refrigeration system. It avoids the energy waste caused by unreasonable energy utilization among various components in a traditional refrigerator, improves the comprehensive performance of the refrigeration system, enables the refrigerator to ensure a good refrigeration effect while reducing energy consumption.

[0053] The second semiconductor module realizes different functions by changing the direction of the current. Only one set of semiconductor refrigeration chips and related ports are needed to complete multiple functions such as refrigerating, heating the refrigerator compartment 2, and assisting the evaporator 3 in defrosting. Compared with a traditional refrigerator that requires multiple independent devices to achieve these functions respectively, the internal structure of the refrigerator is greatly simplified.

[0054] In some embodiments, the first semiconductor module 5 is set to an operating mode and a shutdown mode. The operating mode is that the first semiconductor module 5 switches to the working state, continuously provides cooling capacity to the freezer 1 from the first port 502, and continuously provides heat to the evaporator 3 from the second port 503, while realizing the refrigeration of the freezer 1 and the defrosting process of the evaporator 3. The shutdown mode is that the first semiconductor module 5 switches to the shutdown state and does not provide any cooling capacity or heat to the refrigerator.

[0055] In some embodiments, the second semiconductor module 6 is set to a first operating mode, a second operating mode, and a shutdown mode. The first operating mode is that the second semiconductor module 6 switches to the working state, and the second semiconductor refrigeration chip 601 is set to a positive current. The third port 602 continuously provides cooling capacity to the refrigerator compartment 2, and the fourth port 603 continuously provides heat to the evaporator 3, while realizing the refrigeration of the refrigerator compartment 2 and the defrosting process of the evaporator 3. The second operating mode is that the second semiconductor module 6 switches to the working state, and the second semiconductor refrigeration chip 601 is set to a negative current, realizing the conversion of the third port 602 from providing cooling capacity to providing heat, and the conversion of the fourth port 603 from providing heat to providing cooling capacity. The third port 602 continuously provides heat to the refrigerator compartment 2, and the fourth port 603 continuously provides cooling capacity to the evaporator 3, while realizing the heating of the refrigerator compartment 2 and the refrigeration process of the evaporator 3. The shutdown mode is that the semiconductor module 6 switches to the shutdown state and does not provide any cooling capacity or heat to the refrigerator.

[0056] In this embodiment, a controller is further provided in the refrigerator. The controller is disposed inside the refrigerator and is configured to:

[0057] Obtain the ambient temperature of the refrigerator;

[0058] When the ambient temperature is lower than the first threshold and the refrigerator is in the defrosting stage, start the defrosting heater, control the first semiconductor module to operate, and turn off the second semiconductor module. The first port of the first semiconductor module provides cooling capacity for the freezer compartment, and the second port of the first semiconductor module provides heat for the evaporator.

[0059] When the ambient temperature is lower than the first threshold and the refrigerator is in the refrigeration stage, turn off the first semiconductor module and control the second semiconductor module to execute the second operating mode. The third port of the second semiconductor module provides heat for the refrigerator compartment according to the real-time temperature of the refrigerator compartment, and the fourth port of the second semiconductor module provides cooling capacity for the evaporator. In some embodiments, the first threshold may be 10°C.

[0060] By obtaining the ambient temperature, when the ambient temperature is lower than the first threshold and the refrigerator is in the refrigeration stage, the second semiconductor module 6 provides heat for the refrigerator compartment through the third port 602 according to the real-time temperature of the refrigerator compartment. This design can accurately match the heat demand of the refrigerator compartment, avoid the temperature of the refrigerator compartment being too low due to cold leakage from the freezer compartment, reduce the risk of food freezing damage, and extend the fresh-keeping period of food. For example, in winter, the external ambient temperature is low, and the cold capacity of the freezer compartment is likely to penetrate into the refrigerator compartment. At this time, this function can effectively maintain the appropriate temperature of the refrigerator compartment and ensure that ingredients such as vegetables and fruits remain fresh.

[0061] When in the defrosting stage, the first semiconductor module 5 operates, and the first port 502 provides cooling capacity for the freezer compartment. When the defrosting heater is working, the temperature of the freezer compartment 1 usually rises due to heat conduction, but the first semiconductor module 5 promptly replenishes the cooling capacity, stabilizing the temperature of the freezer compartment 1 and preventing the quality of frozen food from deteriorating due to temperature fluctuations. For example, when meat thaws and then refreezes, it affects the taste and nutrition.

[0062] In the defrosting stage, while the defrosting heater 7 is started, the second port 503 of the first semiconductor module 5 provides heat for the evaporator. Compared with the traditional defrosting method, this adds an additional heat source, which can accelerate the melting of the frost layer on the surface of the evaporator and shorten the defrosting time. By accurately controlling the operation of the semiconductor module in different stages, unnecessary refrigeration or heating operations are avoided. For example, in a low-temperature environment, turning off the operation of the first semiconductor module 5 in the refrigeration stage reduces energy consumption; at the same time, the second semiconductor module 6 provides heat according to the actual needs of the refrigerator compartment, avoiding overheating, achieving efficient utilization of energy, and reducing the overall energy consumption of the refrigerator.

[0063] The first semiconductor module 5 is arranged in the refrigerating air duct, and the second semiconductor module 6 is arranged in the foaming layer of the middle partition. This layout makes clever use of the existing space inside the refrigerator without occupying the storage volume of the freezer compartment 1 and the refrigerating compartment 2. Compared with adding an additional temperature control device inside the refrigerator, this design ensures that the storage space available to the user remains unaffected, enhancing the practicality of the refrigerator and meeting the user's demand for large-capacity storage.

[0064] In some embodiments, when the ambient temperature is greater than or equal to the first threshold and the refrigerator is in the defrosting stage, the defrosting heater is activated, the first semiconductor module is controlled to operate, and the second semiconductor module is controlled to execute the first operating mode. The first port of the first semiconductor cooling plate provides cooling capacity for the freezer compartment, the third port of the second semiconductor cooling plate provides cooling capacity for the refrigerating compartment, and the second port of the first semiconductor cooling plate and the fourth port of the second semiconductor cooling plate provide heat for the evaporator.

[0065] When the ambient temperature is greater than or equal to the first threshold and in the defrosting stage, the first port 502 of the first semiconductor cooling plate 501 provides cooling capacity for the freezer compartment 1. During defrosting, the operation of the defrosting heater 7 causes heat to spread to the freezer compartment 1, resulting in an increase in the temperature of the freezer compartment 1. The cooling capacity provided by the first port 502 can effectively balance this part of the heat, prevent the temperature of the freezer compartment 1 from rising excessively, ensure that the ingredients in the freezer compartment 1 are always in a suitable low-temperature environment, maintain the frozen state of the ingredients, and avoid a decline in the quality of the ingredients due to temperature fluctuations.

[0066] The third port 602 of the second semiconductor cooling plate 601 provides cooling capacity for the refrigerating compartment 2. When the ambient temperature is high, the refrigerating compartment 2 itself has a large heat load and requires additional cooling capacity to maintain a low temperature. The refrigerating effect of the third port 602 can timely remove the heat of the refrigerating compartment 2, keep the refrigerating compartment 2 within a suitable temperature range, and ensure the freshness of the refrigerated ingredients.

[0067] The second port 503 of the first semiconductor cooling plate 501 and the fourth port 603 of the second semiconductor cooling plate 601 simultaneously provide heat for the evaporator 3. This increases the heat source for defrosting the evaporator 3 and accelerates the melting speed of the frost layer. Compared with defrosting only relying on the defrosting heater 7, it can remove the frost on the surface of the evaporator more quickly and thoroughly, reduce the defrosting time, and reduce the overall temperature fluctuation of the refrigerator caused by defrosting.

[0068] In some embodiments, when the ambient temperature is greater than or equal to the first threshold and the refrigerator is in the refrigerating stage, the first semiconductor module and the second semiconductor module are controlled to execute the shutdown mode.

[0069] The first semiconductor module 5 and the second semiconductor module 6 consume electrical energy during operation. When the ambient temperature is relatively high and the refrigeration demand of the refrigerator can be mainly met by conventional refrigeration components such as the compressor, turning off the first and second semiconductor modules can avoid unnecessary power consumption. In the long run, it can significantly reduce the overall energy consumption of the refrigerator and save electricity costs for users. At the same time, it can reduce the operating duration of the semiconductor module, reduce its working load, and avoid component aging and wear caused by long-term use. For example, the performance of the thermoelectric cooler is prone to decay due to frequent heat and cold conversion. Turning off the module can delay this process, extend the service life of the semiconductor module, and reduce the refrigerator repair cost and the frequency of replacing components.

[0070] In some embodiments, a humidity sensor is provided in the foaming layer of the intermediate partition. When the relative humidity in the refrigerating chamber > RH90%, the controller activates the fourth port of the second semiconductor module to perform condensation dehumidification on the surface of the evaporator, and the dehumidification condensate is discharged by heat evaporation through the second port of the first semiconductor module.

[0071] In some embodiments, the present application further provides a refrigeration control method, which is applied to the refrigerator described in the above embodiments, as Figure 6 and Figure 7 shown. The method includes:

[0072] When the ambient temperature is less than the first threshold and the refrigerator is in the defrosting stage, start the defrosting heater, control the first semiconductor module to operate, and turn off the second semiconductor module. The first port of the first semiconductor module provides cold for the freezer compartment, and the second port of the first semiconductor module provides heat for the evaporator;

[0073] When the ambient temperature is less than the first threshold and the refrigerator is in the refrigeration stage, turn off the first semiconductor module, and control the second semiconductor module to execute the second operation mode. The third port of the second semiconductor module provides heat for the refrigerating chamber according to the real-time temperature of the refrigerating chamber, and the fourth port of the second semiconductor module provides cold for the evaporator.

[0074] In the above embodiments, after the controller obtains the ambient temperature of the refrigerator, it can accurately control the operation modes of the two semiconductor modules according to different ambient temperatures and the refrigeration and defrosting stages of the refrigerator. In the refrigeration stage in a high-temperature environment, turn off the two semiconductor modules and rely on the conventional refrigeration system to meet the refrigeration demand to avoid unnecessary energy consumption of the semiconductor modules; in the refrigeration stage in a low-temperature environment, turn on the second semiconductor module to perform heating compensation on the refrigerating chamber; in the defrosting stage, reasonably use the semiconductor module to assist defrosting.

[0075] In this application, the second semiconductor module realizes the mutual conversion of the cold end and the hot end by changing the current direction of the second semiconductor refrigeration chip, meeting the different functional requirements of the refrigerator. When the current is in the forward direction, it cools the refrigerating chamber and defrosts the auxiliary evaporator. When the current is in the reverse direction, it heats the refrigerating chamber and enhances the refrigeration of the evaporator. This flexible control method provides more possibilities for the temperature control of the refrigerator, solving the problems of large temperature fluctuations in the freezer and refrigerating chamber during the defrosting process of the side-by-side refrigerator and low temperature in the refrigerating chamber in a low-temperature environment.

[0076] Embodiment

[0077] When the refrigerator is at a relatively high or high ambient temperature, such as the ambient temperature ≥ 10°C, and in the refrigeration stage, the second semiconductor module 6 is set to the off state and does not participate in the refrigeration process of the refrigerator. When the refrigerator enters the defrosting stage, the defrosting heater 7 is turned on to heat the evaporator 3 for defrosting. The second semiconductor module 6 is adjusted to the on state, and the second semiconductor refrigeration chip 601 is set to have a forward current. The third port (cold end) 602 continuously releases cold to the refrigerating chamber 2 to suppress the temperature rise of the refrigerating chamber 2. The fourth port (hot end) 603 continuously releases heat to the evaporator 3 to assist in defrosting the evaporator 3, shortening the defrosting time of the evaporator 3, improving the defrosting efficiency, and reducing energy consumption.

[0078] Further, when the refrigerator is in a lower ambient temperature, such as the ambient temperature < 10°C, the heat load of the refrigerating chamber 2 is relatively small. Due to the cold quantity conduction existing in the partition between the freezing chamber 1 and the refrigerating chamber 2, when the heat load obtained by the refrigerating chamber 2 is less than the refrigerating capacity, even if the refrigerating state of the refrigerating chamber 2 is turned off, the actual temperature of the refrigerating chamber 2 will passively and continuously decrease, and may reach below 0°C. Moreover, the lower the ambient temperature, the more obvious this phenomenon is. At this time, according to the actual temperature in the refrigerating chamber 2, the second semiconductor module 6 can execute the second operation mode. The second semiconductor refrigerating sheet 601 is set to a negative current, that is, the cold end 602 is converted into the hot end (the third port 602 changes from providing cold quantity to providing heat), and the hot end 603 is converted into the cold end (the fourth port 603 changes from providing heat to providing cold quantity). The hot end (the third port) 602 can continuously or intermittently provide heat to the refrigerating chamber 2 to achieve temperature compensation for the refrigerating chamber 2, raise the actual temperature of the refrigerating chamber 2, and the cold end (the fourth port) 603 provides cold quantity to the evaporator 3 to increase the refrigerating capacity of the evaporator 3. For example, when the ambient temperature of the refrigerator is 2°C, at this time, the refrigerating chamber 2 no longer has a refrigerating requirement. Due to the cold leakage from the freezing chamber 1 to the refrigerating chamber 2 through the middle partition, the actual temperature of the refrigerating chamber 2 is lower than 0°C, which is likely to freeze the stored food in the refrigerating chamber 2. According to the actual temperature of the refrigerating chamber 2, through the effective control of the second semiconductor module 6, the hot end (the third port) 602 can release heat to the refrigerating chamber 2 to ensure that the temperature of the refrigerating chamber 2 is always maintained within a reasonable range, effectively improving the fresh-keeping effect of the refrigerating chamber 2. When the refrigerator is in the defrosting stage, the defrosting heater 7 is in the on state, and the second semiconductor module 6 is adjusted to the off state.

[0079] Further, the working state of the second semiconductor module 6 is judged comprehensively based on the refrigerating requirement and the actual temperature of the refrigerating chamber 2. If the refrigerating chamber 2 has no refrigerating requirement for more than a certain period of time (such as 6 hours) continuously, and the actual temperature of the refrigerating chamber 2 is less than the lowest target temperature (such as 2 degrees), it is determined that the refrigerating chamber 2 has an overcooling phenomenon caused by the cold leakage from the freezing chamber 1. During the refrigerating stage of the refrigerator, the second semiconductor module 6 is started to make the hot end (the third port) 602 release heat to the refrigerating chamber 2 to ensure that the temperature of the refrigerating chamber 2 is always maintained within a reasonable range.

[0080] As can be seen from the above embodiments, the present application provides a refrigerator and a refrigeration control method. The refrigeration control method includes: obtaining the ambient temperature of the refrigerator; when the ambient temperature is less than a first threshold and the refrigerator is in the defrosting stage, starting the defrosting heater, controlling the first semiconductor module to operate, and turning off the second semiconductor module. The first port of the first semiconductor module provides cold for the freezer compartment, and the second port of the first semiconductor module provides heat for the evaporator; when the ambient temperature is less than the first threshold and the refrigerator is in the refrigeration stage, turning off the first semiconductor module, controlling the second semiconductor module to execute a second operation mode, and the third port of the second semiconductor module provides heat for the refrigerating compartment according to the real-time temperature of the refrigerating compartment, and the fourth port of the second semiconductor module provides cold for the evaporator. By precisely controlling the operation of the semiconductor module in different stages, the present application avoids unnecessary refrigeration or heating operations. In a low-temperature environment, turning off the operation of the first semiconductor module in the refrigeration stage reduces energy consumption; at the same time, the second semiconductor module provides heat according to the actual needs of the refrigerating compartment, avoiding overheating, achieving efficient utilization of energy, and reducing the overall energy consumption of the refrigerator.

[0081] For the similar parts between the embodiments provided in the present application, reference can be made to each other. The specific embodiments provided above are only several examples under the general concept of the present application, and do not constitute a limitation on the protection scope of the present application. For those skilled in the art, any other implementation manners extended based on the solution of the present application without creative efforts fall within the protection scope of the present application.

Claims

1. A refrigerator, characterized in that: The refrigerator comprises: Freezer; Cold room; An evaporator and a freezing air duct are vertically arranged on the intermediate partition between the freezing chamber and the refrigerating chamber, a fan is arranged in the freezing air duct, a first semiconductor module is arranged on the side of the evaporator close to the refrigerating chamber, and a second semiconductor module is arranged on the side of the evaporator close to the freezing chamber; the first semiconductor module is arranged in the freezing air duct, and the second semiconductor module is arranged in the foaming layer of the intermediate partition between the freezing chamber and the refrigerating chamber; the first semiconductor module includes a first semiconductor refrigeration sheet, the second semiconductor module includes a second semiconductor refrigeration sheet, and the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet respectively include a first port, a second port, a third port, and a fourth port; A defrost heater is provided at the bottom of the evaporator; A controller is disposed in the refrigerator, and the controller is configured as follows: Get the ambient temperature of the refrigerator; When the ambient temperature is less than the first threshold value and the refrigerator is in the defrosting stage, the defrosting heater is started, the first semiconductor module is controlled to operate, and the second semiconductor module is turned off, the first port of the first semiconductor module provides cold air for the freezing chamber, and the second port of the first semiconductor module provides heat for the evaporator; When the ambient temperature is lower than the first threshold value and the refrigerator is in the refrigeration stage, the first semiconductor module is turned off and the second semiconductor module is controlled to execute the second operation mode. The third port of the second semiconductor module provides heat to the refrigerating chamber according to the real-time temperature of the refrigerating chamber, and the fourth port of the second semiconductor module provides cold air to the evaporator.

2. The refrigerator according to claim 1, characterized in that: The controller is configured to: When the ambient temperature is greater than or equal to the first threshold value and the refrigerator is in the defrosting stage, the defrost heater is started, the first semiconductor module is controlled to operate, and the second semiconductor module is controlled to execute the first operating mode. The first port of the first semiconductor refrigeration film provides cold air for the freezer compartment, the third port of the second semiconductor refrigeration film provides cold air for the refrigerator compartment, and the second port of the first semiconductor refrigeration film and the fourth port of the second semiconductor refrigeration film provide heat for the evaporator.

3. The refrigerator according to claim 2, characterized in that: The controller is configured to: When the ambient temperature is greater than or equal to the first threshold and the refrigerator is in a refrigeration stage, the first semiconductor module and the second semiconductor module are controlled to execute a shutdown mode.

4. The refrigerator according to claim 3, characterized in that: The controller is configured such that: in a first operation mode of the second semiconductor module, the second semiconductor refrigeration sheet is set to a forward current, the third port provides cooling, and the fourth port provides heat.

5. The refrigerator according to claim 4, characterized in that: The controller is further configured to: in a second operation mode of the second semiconductor module, the second semiconductor refrigeration sheet is set to a negative current.

6. The refrigerator according to claim 5, characterized in that: When the second semiconductor refrigeration plate is set to a negative current, the third port and the fourth port are converted to each other, the third port provides heat to the freezing chamber, and the fourth port provides coldness to the evaporator.

7. The refrigerator according to claim 5, characterized in that: The first port of the first semiconductor refrigeration plate is arranged on a side close to the freezing chamber, the second port of the first semiconductor refrigeration plate is arranged on a side close to the evaporator, and a heat insulating material is arranged between the first port and the second port.

8. The refrigerator according to claim 5, characterized in that: The third port of the second semiconductor refrigeration plate is arranged on a side close to the refrigerating chamber, the fourth port of the second semiconductor refrigeration plate is arranged on a side close to the evaporator, and a foaming layer is arranged between the third port and the fourth port.

9. The refrigerator according to claim 5, characterized in that: A humidity sensor is provided in the foaming layer of the middle partition. When the relative humidity of the cold storage chamber is greater than RH90%, the controller starts the fourth port of the second semiconductor module to condense and dehumidify the surface of the evaporator, and the dehumidified condensed water is discharged through heat evaporation of the second port of the first semiconductor module.

10. A refrigeration control method, characterized in that: The method is applied to the refrigerator according to claim 1, and the method comprises: When the ambient temperature is less than the first threshold value and the refrigerator is in the defrosting stage, the defrosting heater is started, the first semiconductor module is controlled to operate, and the second semiconductor module is turned off, the first port of the first semiconductor module provides cold air for the freezing chamber, and the second port of the first semiconductor module provides heat for the evaporator; When the ambient temperature is lower than the first threshold value and the refrigerator is in the refrigeration stage, the first semiconductor module is turned off and the second semiconductor module is controlled to execute the second operation mode. The third port of the second semiconductor module provides heat to the refrigerating chamber according to the real-time temperature of the refrigerating chamber, and the fourth port of the second semiconductor module provides cold air to the evaporator.

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