Packaging and wire bonding method and system of integrated circuit

Abstract

The invention discloses a packaging and wire bonding method and system for an integrated circuit, and the method comprises the steps: obtaining a packaging structure of the integrated circuit, determining a plurality of welding points and the position parameter of each welding point according to the packaging structure, and generating a welding path according to the position parameter of each welding point; welding process requirement parameters of each welding point are obtained, and post-welding form parameters of each welding point are determined according to the welding process requirement parameters; determining a standard ultrasonic feedback signal parameter of each welding point based on the post-welding form parameter of each welding point, and generating a welding qualification evaluation criterion according to the standard ultrasonic feedback signal parameter; and controlling the welding robot to carry out wire welding treatment on the packaging structure according to the welding path, detecting a real-time ultrasonic feedback signal of each welding point, carrying out welding strength adjustment according to the real-time ultrasonic feedback signal, and carrying out qualification evaluation on the welding state of each welding point through a welding qualification evaluation criterion. And efficient welding work can be achieved by intelligently controlling welding workers.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit package soldering, and particularly to a method and system for packaging and wire bonding of integrated circuits. Background Art

[0002] Currently, with the rapid development of electronic technology, the packaging technology of integrated circuits (ICs) is also constantly advancing. The main functions of integrated circuit packaging are to protect the chip, provide electrical connections, and dissipate heat. During the packaging process, wire bonding technology is a commonly used electrical connection method, which connects the pads of the chip to the packaging substrate or lead frame through metal wires (such as gold wires, copper wires, or aluminum wires). Traditional wire bonding technology relies on operators for manual wire bonding and qualified evaluation, which not only has low production efficiency but also cannot ensure the objectivity and reliability of the evaluation results, reducing product quality and user experience. Summary of the Invention

[0003] In view of the problems shown above, the present invention provides a method and system for packaging and wire bonding of integrated circuits to solve the problems that traditional wire bonding technology relies on operators for manual wire bonding and qualified evaluation, which not only has low production efficiency but also cannot ensure the objectivity and reliability of the evaluation results, reducing product quality and user experience.

[0004] A method for packaging and wire bonding of integrated circuits includes the following steps: Obtain the packaging structure of the integrated circuit, determine multiple welding points and the position parameters of each welding point according to the packaging structure, and generate a welding path according to the position parameters of each welding point; Obtain the welding process requirement parameters of each welding point, and determine the post-welding form parameters of each welding point according to the welding process requirement parameters; Determine the standard ultrasonic feedback signal parameters of each welding point based on the post-welding form parameters of each welding point, and generate a welding qualification assessment criterion according to the standard ultrasonic feedback signal parameters; Control a welding robot to perform wire bonding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force according to it, and conduct a qualification assessment on the welding state of each welding point through the welding qualification assessment criterion.

[0005] Preferably, the step of obtaining the packaging structure of the integrated circuit, determining multiple welding points and the position parameters of each welding point according to the packaging structure, and generating a welding path according to the position parameters of each welding point includes: Retrieve the data manual of the integrated circuit, determine the packaging structure of the integrated circuit according to the data manual, and retrieve the standard packaging model from the packaging database based on the packaging structure; Determine the pin arrangement of the integrated circuit according to the standard packaging model, determine multiple welding points based on the pin arrangement, and extract the three-dimensional coordinates of each welding point through an EDA tool; Determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through a path planning algorithm according to the position parameters; Determine the welding parameter requirements for each welding path, determine the feasibility of each welding path according to the welding parameter requirements, and screen out the optimal welding path according to the feasibility and preset welding resources.

[0006] Preferably, obtain the welding process requirement parameters of each welding point, and determine the post-welding shape parameters of each welding point according to the welding process requirement parameters, including: Determine the welding quality of each welding point, determine the optimal welding conditions according to the welding quality, and determine the welding process requirement parameters of each welding point based on the optimal welding conditions; Determine the welding duration and welding temperature according to the welding process requirement parameters, and determine the solder strain coverage data of each welding point under high-temperature load according to the welding duration, welding temperature and the first high-temperature deformation parameter of the scalar solder; Determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first shape description features of each welding point after welding based on the multi-view point cloud data; Evaluate the internal void ratio of the solder joint of each welding point according to the first shape description feature, and evaluate whether the first shape description feature meets the standard according to the internal void ratio of the solder joint; If so, determine the post-welding shape parameters of each welding point according to the first shape description feature; If not, obtain the second shape description features of each welding point after welding through the second high-temperature deformation parameter of the reduced solder, repeatedly evaluate the internal void ratio of the solder joint for the second shape description features until the second shape description features meet the standard, and determine the post-welding shape parameters of each welding point according to the second shape description features.

[0007] Preferably, determine the standard ultrasonic feedback signal parameters of each welding point based on the post-welding shape parameters of each welding point, and generate a welding qualification assessment criterion, including: Determine the post-welding surface concavity and convexity state vector of each welding point according to the post-welding shape parameters of each welding point, and determine the ultrasonic echo feedback amplitude change parameter and signal feedback delay parameter at each welding point according to the post-welding surface concavity and convexity state vector; Determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude change parameter and signal feedback delay parameter; Extract the key features of the morphological parameters after each welding spot welding, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the morphological parameters after the welding spot welding; Generate the evaluation criteria for judging the welding qualification of each welding point based on the ultrasonic feedback according to the correlation mapping relationship.

[0008] Preferably, the welding robot is controlled to perform wire bonding on the encapsulation structure according to the welding path, the real-time ultrasonic feedback signal of each welding point is detected and the welding force is adjusted according to it, and the welding state of each welding point is evaluated for qualification through the welding qualification evaluation criteria, including: Determine the welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire bonding on the encapsulation structure through the welding control parameters; Detect the real-time feedback signal when the welding robot performs wire bonding on each welding point through an ultrasonic sensor, determine the signal difference of each welding point according to the real-time feedback signal, and determine the force adjustment direction based on the signal difference, and the force adjustment direction includes: increasing the force and reducing the force; Determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction; Based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot, determine the final morphological characteristics after welding through the welding qualification evaluation criteria, and evaluate the welding state of each welding point for qualification according to the final morphological characteristics.

[0009] An integrated circuit package wire bonding system, the system includes: A first generation module, configured to obtain the encapsulation structure of the integrated circuit, determine a plurality of welding points and the position parameters of each welding point according to the encapsulation structure, and generate a welding path according to the position parameters of each welding point; A determination module, configured to obtain the welding process requirement parameters of each welding point, and determine the post-welding morphological parameters of each welding point according to the welding process requirement parameters; A second generation module, configured to determine the standard ultrasonic feedback signal parameters of each welding point based on the post-welding morphological parameters of each welding point, and generate the welding qualification evaluation criteria according to the standard ultrasonic feedback signal parameters; A welding force adjustment and welding qualification evaluation module, configured to control the welding robot to perform wire bonding on the encapsulation structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force according to it, and evaluate the welding state of each welding point for qualification through the welding qualification evaluation criteria.

[0010] Preferably, the first generation module includes: Retrieval sub-module, used to retrieve the data sheet of the integrated circuit, determine the package structure of the integrated circuit according to the data sheet, and retrieve the standard package model from the package database based on the package structure; First extraction sub-module, used to determine the pin arrangement of the integrated circuit according to the standard package model, determine multiple welding points based on the pin arrangement, and extract the three-dimensional coordinates of each welding point through EDA tools; First generation sub-module, used to determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through the path planning algorithm according to the position parameters; Screening sub-module, used to determine the welding parameter requirements of each welding path, determine the feasibility of each welding path according to the welding parameter requirements, and screen out the optimal welding path according to the feasibility and preset welding resources.

[0011] Preferably, the determination module includes: First determination sub-module, used to determine the solder joint quality of each welding point, determine the optimal welding conditions according to the welding quality, and determine the welding process requirement parameters of each welding point based on the optimal welding conditions; Second determination sub-module, used to determine the welding duration and welding temperature according to the welding process requirement parameters, and determine the solder strain coverage data of each welding point under high-temperature load according to the welding duration, welding temperature and the first high-temperature deformation parameter of the scalar solder; First extraction sub-module, used to determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first morphological description features of each welding point after welding based on the multi-view point cloud data; Evaluation sub-module, used to evaluate the internal void rate of each welding point according to the first morphological description features, and evaluate whether the first morphological description features meet the standards according to the internal void rate of the solder joint; Third determination sub-module, used to, if so, determine the post-welding morphological parameters of each welding point according to the first morphological description features; Fourth determination sub-module, used to, if not, obtain the second morphological description features of each welding point after welding through the second high-temperature deformation parameter of the reduced solder, repeatedly evaluate the internal void rate of the solder joint for the second morphological description features until the second morphological description features meet the standards, and determine the post-welding morphological parameters of each welding point according to the second morphological description features.

[0012] Preferably, the second generation module includes: Fifth determination sub-module, used to determine the post-welding surface concavo-convex state vector of each welding point according to the post-welding morphological parameters of each welding point, and determine the ultrasonic echo feedback amplitude change parameter and signal feedback delay parameter at each welding point according to the post-welding surface concavo-convex state vector; The sixth determination sub-module is used to determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude change parameter and the signal feedback time delay parameter; The seventh determination sub-module is used to extract the key features of the post-welding morphological parameters of each welding point, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the post-welding morphological parameters of the welding point; The second generation sub-module is used to generate the evaluation criteria for judging the qualification of welding based on ultrasonic feedback for each welding point according to the correlation mapping relationship.

[0013] Preferably, the welding force adjustment and welding qualification evaluation module includes: The control sub-module is used to determine the welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire bonding on the packaging structure through the welding control parameters; The eighth determination sub-module is used to detect the real-time feedback signal when the welding robot performs wire bonding on each welding point through the ultrasonic sensor, determine the signal difference of each welding point according to the real-time feedback signal, and determine the force adjustment direction based on the signal difference. The force adjustment direction includes: increasing the force and reducing the force; The welding force adjustment sub-module is used to determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction; The welding qualification evaluation sub-module is used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot through the welding qualification evaluation criteria, and evaluate the welding state of each welding point according to the final morphological characteristics.

[0014] Other features and advantages of the present invention will be described in the following description, and, in part, will be obvious from the description, or will be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained by the structure specifically pointed out in the written description and the drawings.

[0015] The technical solution of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0016] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention, and do not constitute a limitation to the present invention.

[0017] Figure 1 It is a working flowchart of a method for wire bonding of an integrated circuit package provided by the present invention; Figure 2 It is another working flowchart of a method for wire bonding of an integrated circuit package provided by the present invention; Figure 3 Schematic structural diagram of a wire bonding system for packaging an integrated circuit provided by the present invention; Figure 4 Schematic structural diagram of a first generation module in a wire bonding system for packaging an integrated circuit provided by the present invention. Detailed implementation manners

[0018] Here, exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0019] Currently, with the rapid development of electronic technology, the packaging technology of integrated circuits (ICs) is also constantly advancing. The main functions of integrated circuit packaging are to protect the chip, provide electrical connections, and dissipate heat. During the packaging process, wire bonding technology is a commonly used electrical connection method, which connects the pads of the chip to the packaging substrate or lead frame through metal wires (such as gold wires, copper wires, or aluminum wires). Traditional wire bonding technology relies on operators for manual wire bonding and qualified evaluation, which not only has low production efficiency but also cannot ensure the objectivity and reliability of the evaluation results, reducing product quality and user experience. To solve the above problems, this embodiment discloses a wire bonding method for packaging an integrated circuit.

[0020] A wire bonding method for packaging an integrated circuit, as Figure 1 shown, includes the following steps: Step S101: Obtain the packaging structure of the integrated circuit, determine a plurality of welding points and the position parameters of each welding point according to the packaging structure, and generate a welding path according to the position parameters of each welding point; Step S102: Obtain the welding process requirement parameters of each welding point, and determine the post-welding form parameters of each welding point according to the welding process requirement parameters; Step S103: Determine the standard ultrasonic feedback signal parameters of each welding point based on the post-welding form parameters of each welding point, and generate a welding qualification criterion according to the standard ultrasonic feedback signal parameters; Step S104: Control a welding robot to perform wire bonding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force according to it, and perform a qualification assessment on the welding state of each welding point through the welding qualification criterion.

[0021] The working principle of the above technical solution is as follows: Obtain the packaging structure of the integrated circuit, determine multiple welding points and the position parameters of each welding point according to the packaging structure, and generate a welding path based on the position parameters of each welding point; obtain the welding process requirement parameters of each welding point, and determine the post-welding form parameters of each welding point according to the welding process requirement parameters; determine the standard ultrasonic feedback signal parameters of each welding point based on the post-welding form parameters of each welding point, and generate a welding qualification assessment criterion according to the standard ultrasonic feedback signal parameters; control the welding robot to perform wire bonding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force according to it, and perform a qualification assessment on the welding state of each welding point through the welding qualification assessment criterion.

[0022] The beneficial effects of the above technical solution are as follows: By generating a welding path and formulating a welding qualification assessment criterion for each welding point, it is possible to not only achieve efficient welding work through intelligent control of the welding robot, but also effectively evaluate the welding results of the welding robot based on the post-welding form of each welding point, improving the objectivity, accuracy and efficiency of the assessment, ensuring the quality qualification of the product and the user experience, and solving the problems mentioned in the prior art that the traditional wire bonding technology relies on operators for manual wire bonding and qualification assessment, resulting in low production efficiency and inability to ensure the objectivity and reliability of the assessment results, reducing the product quality and user experience.

[0023] In this embodiment, after generating the welding path according to the position parameters of each welding point, it further includes: Determine the movement trajectory of the welding torch between two adjacent welding points according to the welding path, and analyze the movement trajectory of the welding torch to determine the kinematic parameters of the fixed arm of the welding robot's welding torch; Determine the process pose change parameters of the fixed arm of the welding torch when welding between two adjacent welding points according to the kinematic parameters of the fixed arm of the welding torch; Determine the motion space parameters of the fixed arm of the welding robot's welding torch based on the process pose change parameters, and construct a three-dimensional monitoring space model of the fixed arm of the welding torch according to the motion space parameters; Collect the standard motion state parameters of the fixed arm of the welding torch when welding between two adjacent welding points; Determine the pheromone concentration of the fixed arm of the welding torch according to the standard motion parameters through the three-dimensional monitoring space model, and the pheromone concentration includes: the information concentration of the movement frequency of the fixed arm of the welding torch and the information concentration of the synchronous motion detection between the fixed arm of the welding torch and the welding torch; Determine the welding regular synchronization factor between two adjacent welding points of the fixed arm of the welding torch under the welding path according to the pheromone concentration of the fixed arm of the welding torch; Determine the welding requirement value of the welding sub-path between two adjacent welding points based on the welding regular synchronization factor, and determine the welding weight of the welding sub-path between two adjacent welding points according to the welding requirement value; Determine the welding energy range between two adjacent welding points according to the welding weight, and determine the welding parameters of the welding sub-path between two adjacent welding points based on the welding energy range through the preset welding energy-quality ratio; Determine whether the welding sub-path between two adjacent welding points meets the weld quality requirements and weld appearance requirements according to the welding parameters, the preset quality index, and the preset image index; If so, confirm that the welding sub-path design between two adjacent welding points is reasonable; if not, confirm that the welding sub-path between two adjacent welding points is unreasonable and issue an adjustment reminder.

[0024] The beneficial effects of the above technical solution are as follows: By splitting the welding path to determine the welding sub-path between two adjacent welding points and evaluating its specifications, quality, and appearance requirements, the welding stability and reliability between key welding points can be ensured. At the same time, based on the minimum welding energy requirement between two adjacent welding points, it is determined whether the welding sub-path between two adjacent welding points is reasonable, and a timely adjustment reminder is given, ensuring the stability and reliability of the welding process. At the same time, the movement parameters of the welding arm of the welding robot are accurately monitored and corrected, further ensuring the welding stability and reliability.

[0025] In one embodiment, as Figure 2 shown, the obtaining of the package structure of the integrated circuit, determining multiple welding points and the position parameters of each welding point according to the package structure, and generating a welding path according to the position parameters of each welding point include: Step S201: Retrieve the data manual of the integrated circuit, determine the package structure of the integrated circuit according to the data manual, and retrieve the standard package model from the package database based on the package structure; Step S202: Determine the pin arrangement of the integrated circuit according to the standard package model, determine multiple welding points based on the pin arrangement, and extract the three-dimensional coordinates of each welding point through an EDA tool; Step S203: Determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through a path planning algorithm according to the position parameters; Step S204: Determine the welding parameter requirements of each welding path, determine the feasibility of each welding path according to the welding parameter requirements, and screen out the optimal welding path according to the feasibility and the preset welding resources.

[0026] The beneficial effects of the above technical solution are as follows: By determining the position parameters of each welding point according to the three-dimensional coordinates, the position parameters of the welding points can be determined more accurately, ensuring the position determination accuracy. Further, by evaluating the feasibility of the generated multiple welding paths, the best welding path can be selected based on the welding material consumption, duration loss, etc. of each welding path, saving the welding time cost and material cost to a certain extent and improving the practicability.

[0027] In one embodiment, the obtaining of the welding process requirement parameters of each welding point and determining the post-weld morphology parameters of each welding point according to the welding process requirement parameters include: Determining the welding quality of each welding point, determining the best welding conditions according to the welding quality, and determining the welding process requirement parameters of each welding point based on the best welding conditions; Determining the welding duration and welding temperature according to the welding process requirement parameters, and determining the solder strain coverage data of each welding point under high-temperature load according to the welding duration, welding temperature, and the first high-temperature deformation parameter of the scalar solder; Determining the multi-view point cloud data of each welding point according to the solder strain coverage data, and extracting the first morphology description feature of each welding point after welding based on the multi-view point cloud data; Evaluating the internal void ratio of each welding point according to the first morphology description feature, and evaluating whether the first morphology description feature meets the standard according to the internal void ratio of the welding point; If so, determining the post-weld morphology parameters of each welding point according to the first morphology description feature; If not, obtaining the second morphology description feature of each welding point after welding through the second high-temperature deformation parameter of the reduced solder, repeatedly evaluating the internal void ratio of the second morphology description feature until the second morphology description feature meets the standard, and determining the post-weld morphology parameters of each welding point according to the second morphology description feature.

[0028] The beneficial effects of the above technical solution are as follows: By determining the post-weld morphology parameters of each welding point according to the temperature deformation parameters of the solder, the welding coverage rate can be ensured and the occurrence of welding cracking caused by a large internal void ratio of the welding point can be avoided, providing the most intuitive and effective post-weld morphology reference parameters, laying a reference foundation for the stability of subsequent welding, and further improving the practicability.

[0029] In one embodiment, the determining of the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphology parameters of each welding point and generating the welding qualification assessment criterion include: Determine the post-weld surface concavity and convexity state vector of each welding point according to the post-weld morphological parameters of each welding point, and determine the ultrasonic echo feedback amplitude change parameter and signal feedback time delay parameter at each welding point according to the post-weld surface concavity and convexity state vector; Determine the standard ultrasonic feedback signal parameter of each welding point according to the ultrasonic echo feedback amplitude change parameter and signal feedback time delay parameter; Extract the key features of the post-weld morphological parameters of each welding point, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameter of each welding point and the key features of the post-weld morphological parameters of this welding point; Generate the evaluation criterion for judging the welding qualification of each welding point based on ultrasonic feedback according to the correlation mapping relationship.

[0030] The beneficial effects of the above technical solution are: By determining the standard ultrasonic feedback signal parameter according to the surface concavity and convexity state vector of the post-weld morphology, the standard ultrasonic feedback signal can be accurately determined based on the object feedback characteristics of the ultrasonic sensor, ensuring the data quality and reference value.

[0031] In one embodiment, the welding robot is controlled to perform wire bonding on the packaging structure according to the welding path, the real-time ultrasonic feedback signal of each welding point is detected and the welding force is adjusted according to it, and the welding state of each welding point is judged to be qualified by the welding qualification evaluation criterion, including: Determine the welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire bonding on the packaging structure through the welding control parameters; Detect the real-time feedback signal when the welding robot performs wire bonding on each welding point through the ultrasonic sensor, determine the signal difference of each welding point according to the real-time feedback signal, and determine the force adjustment direction based on the signal difference. The force adjustment direction includes: increasing the force and reducing the force; Determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction; Based on the real-time ultrasonic feedback signal parameter of each welding point by the welding robot, determine the final morphological characteristics after welding through the welding qualification evaluation criterion, and judge the welding state of each welding point to be qualified according to the final morphological characteristics.

[0032] The beneficial effects of the above technical solution are as follows: By determining the force adjustment parameters and adjustment directions based on the signal difference, it is possible to quickly and reasonably and efficiently adjust and feedback the real-time operation parameters of the welding robot during the welding process, ensuring the welding quality and stability. Further, by determining the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot according to the welding qualification assessment criteria and then performing the welding state qualification determination, it is possible to more intuitively and accurately select the evaluation angle for the qualification assessment, improving the evaluation accuracy and efficiency.

[0033] In one embodiment, this embodiment also discloses a wire bonding system for integrated circuit packaging, as Figure 3 shown. The system includes: A first generation module 301, configured to obtain the packaging structure of the integrated circuit, determine a plurality of welding points and the position parameters of each welding point according to the packaging structure, and generate a welding path according to the position parameters of each welding point; A determination module 302, configured to obtain the welding process requirement parameters of each welding point, and determine the post-welding morphological parameters of each welding point according to the welding process requirement parameters; A second generation module 303, configured to determine the standard ultrasonic feedback signal parameters of each welding point based on the post-welding morphological parameters of each welding point, and generate a welding qualification assessment criterion according to the standard ultrasonic feedback signal parameters; A welding force adjustment and welding qualification assessment module 304, configured to control the welding robot to perform wire bonding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force according to it, and perform a qualification assessment on the welding state of each welding point through the welding qualification assessment criterion.

[0034] The working principle and beneficial effects of the above technical solution have been described in the method embodiment and will not be elaborated here.

[0035] In one embodiment, as Figure 4 shown, the first generation module 301 includes: An access sub-module 3011, configured to access the data manual of the integrated circuit, determine the packaging structure of the integrated circuit according to the data manual, and access the standard packaging model from the packaging database based on the packaging structure; A first extraction sub-module 3012, configured to determine the pin arrangement of the integrated circuit according to the standard packaging model, determine a plurality of welding points based on the pin arrangement, and extract the three-dimensional coordinates of each welding point through an EDA tool; A first generation sub-module 3013, configured to determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate a plurality of welding paths through a path planning algorithm according to the position parameters; The screening sub-module 3014 is used to determine the welding parameter requirements for each welding path, determine the feasibility of each welding path according to the welding parameter requirements, and screen out the optimal welding path according to the feasibility and preset welding resources.

[0036] In one embodiment, the determination module includes: The first determination sub-module is used to determine the solder joint quality of each solder joint, determine the optimal welding conditions according to the welding quality, and determine the welding process requirement parameters of each solder joint based on the optimal welding conditions; The second determination sub-module is used to determine the welding duration and welding temperature according to the welding process requirement parameters, and determine the solder strain coverage data of each solder joint under high-temperature load according to the welding duration, welding temperature and the first high-temperature deformation parameter of the scalar solder; The first extraction sub-module is used to determine the multi-view point cloud data of each solder joint according to the solder strain coverage data, and extract the first morphological description features of each solder joint after welding based on the multi-view point cloud data; The evaluation sub-module is used to evaluate the internal void ratio of each solder joint according to the first morphological description features, and evaluate whether the first morphological description features meet the standards according to the internal void ratio of the solder joint; The third determination sub-module is used to, if so, determine the post-welding morphological parameters of each solder joint according to the first morphological description features; The fourth determination sub-module is used to, if not, obtain the second morphological description features of each solder joint after welding through the second high-temperature deformation parameter of the reduced solder, repeatedly evaluate the internal void ratio of the solder joint for the second morphological description features until the second morphological description features meet the standards, and determine the post-welding morphological parameters of each solder joint according to the second morphological description features.

[0037] In one embodiment, the second generation module includes: The fifth determination sub-module is used to determine the post-welding surface concavity and convexity state vector of each solder joint according to the post-welding morphological parameters of each solder joint, and determine the ultrasonic echo feedback amplitude change parameter and signal feedback delay parameter at each solder joint according to the post-welding surface concavity and convexity state vector; The sixth determination sub-module is used to determine the standard ultrasonic feedback signal parameter of each solder joint according to the ultrasonic echo feedback amplitude change parameter and signal feedback delay parameter; The seventh determination sub-module is used to extract the key features of the post-welding morphological parameters of each solder joint, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameter of each solder joint and the key features of the post-welding morphological parameters of the solder joint; The second generation sub-module is used to generate the evaluation criterion for judging the welding qualification of each solder joint based on ultrasonic feedback according to the correlation mapping relationship.

[0038] In one embodiment, the welding force adjustment and welding qualification assessment module includes: A control sub-module, configured to determine welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire bonding on the packaging structure through the welding control parameters; An eighth determination sub-module, configured to detect a real-time feedback signal when the welding robot performs wire bonding on each welding point through an ultrasonic sensor, determine the signal difference of each welding point according to the real-time feedback signal, and determine the force adjustment direction based on the signal difference, where the force adjustment direction includes: increasing the force and decreasing the force; A welding force adjustment sub-module, configured to determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction; A welding qualification assessment sub-module, configured to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot through the welding qualification assessment criterion, and perform a qualification assessment on the welding state of each welding point according to the final morphological characteristics.

[0039] Those skilled in the art should understand that the first and second in the present invention refer to different application stages.

[0040] After considering the specification and practicing the disclosure herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the following claims.

[0041] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A method for packaging wire bonding of an integrated circuit, characterized in that: The following steps are involved: Acquire a packaging structure of the integrated circuit, determine a plurality of welding points and position parameters of each welding point according to the packaging structure, and generate a welding path according to the position parameters of each welding point; Obtain welding process requirement parameters for each welding point, and determine post-weld morphological parameters of each welding point according to the welding process requirement parameters; Determine the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters; The welding robot is controlled according to the welding path to process the welding wires of the packaging structure, the real-time ultrasonic feedback signal of each welding point is detected and the welding force is adjusted accordingly, and the welding status of each welding point is qualified by the welding qualification assessment criteria.

2. The method for packaging wire bonding of integrated circuit according to claim 1, characterized in that: The step of obtaining a packaging structure of an integrated circuit, determining a plurality of welding points and a position parameter of each welding point according to the packaging structure, and generating a welding path according to the position parameter of each welding point includes: Retrieving a data sheet of the integrated circuit, determining a package structure of the integrated circuit according to the data sheet, and retrieving a standard package model from a package database based on the package structure; Determine the pin arrangement of the integrated circuit according to the standard packaging model, determine multiple welding points based on the pin arrangement, and extract the three-dimensional coordinates of each welding point through the EDA tool; Determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through a path planning algorithm according to the position parameters; Determine the welding parameter requirements for each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and select the best welding path based on the feasibility and preset welding resources.

3. The method for packaging wire bonding of an integrated circuit according to claim 1, characterized in that: The step of obtaining welding process requirement parameters of each welding point and determining the post-welding morphological parameters of each welding point according to the welding process requirement parameters includes: Determine the quality of each welding point, determine the best welding conditions according to the welding quality, and determine the welding process requirement parameters of each welding point based on the best welding conditions; Determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to welding time and welding temperature and first high temperature deformation parameter of scalar solder; Determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first morphological description feature of each welding point after welding based on the multi-view point cloud data; According to the first form description feature, the internal void rate of each welding point is evaluated, and according to the internal void rate of the welding point, whether the first form description feature meets the standard is evaluated; If yes, determining the post-weld morphological parameters of each welding point according to the first morphological description feature; If not, obtain the second morphological description characteristics of each welding spot after welding by reducing the second high temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder joints on the second morphological description characteristics until the second morphological description characteristics meet the standards, and determine the post-weld morphological parameters of each welding point according to the second morphological description characteristics.

4. The method for packaging wire bonding of an integrated circuit according to claim 1, characterized in that: The method of determining the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point and generating welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters includes: Determine the post-weld surface concave-convex state vector of each weld point according to the post-weld morphological parameters of each weld point, and determine the ultrasonic echo feedback amplitude variation parameter and signal feedback delay parameter at each weld point according to the post-weld surface concave-convex state vector; Determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude variation parameters and the signal feedback delay parameters; Extract the key features of the morphological parameters of each welding spot after welding, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the morphological parameters of the welding spot after welding; The evaluation criteria for welding qualification judgment based on ultrasonic feedback for each welding point are generated according to the correlation mapping relationship.

5. The method for packaging wire bonding of integrated circuit according to claim 1, characterized in that: The method controls the welding robot to process the welding wire of the packaging structure according to the welding path, detects the real-time ultrasonic feedback signal of each welding point and adjusts the welding force according to the real-time ultrasonic feedback signal, and performs a welding qualification assessment on the welding state of each welding point according to the welding qualification assessment criteria, including: Determine welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire welding on the packaging structure through the welding control parameters; Detecting the real-time feedback signal of the welding robot when welding each welding point by using an ultrasonic sensor, determining the signal difference of each welding point according to the real-time feedback signal, and determining the force adjustment direction based on the signal difference, wherein the force adjustment direction includes: increasing the force and reducing the force; Determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction; The welding qualification assessment criteria are used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot, and the welding state of each welding point is qualified according to the final morphological characteristics.

6. A wire bonding system for integrated circuit packaging, characterized in that: The system includes: A first generating module is used to obtain a packaging structure of the integrated circuit, determine a plurality of welding points and a position parameter of each welding point according to the packaging structure, and generate a welding path according to the position parameter of each welding point; A determination module is used to obtain welding process requirement parameters of each welding point, and determine the post-welding morphological parameters of each welding point according to the welding process requirement parameters; A second generating module is used to determine the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters; The welding force adjustment and welding qualification assessment module is used to control the welding robot to perform wire welding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and perform qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria.

7. The integrated circuit packaging wire bonding system according to claim 6, characterized in that: The first generating module comprises: A calling submodule, used to call the data sheet of the integrated circuit, determine the package structure of the integrated circuit according to the data sheet, and call the standard package model from the package database based on the package structure; A first extraction submodule is used to determine the pin arrangement of the integrated circuit according to the standard packaging model, determine a plurality of welding points based on the pin arrangement, and extract the three-dimensional coordinates of each welding point through an EDA tool; A first generating submodule is used to determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through a path planning algorithm according to the position parameters; The screening submodule is used to determine the welding parameter requirements of each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and screen out the best welding path based on the feasibility and preset welding resources.

8. The integrated circuit packaging wire bonding system according to claim 6, characterized in that: The determining module comprises: A first determination submodule is used to determine the quality of each welding point, determine the best welding conditions according to the welding quality, and determine the welding process requirement parameters of each welding point based on the best welding conditions; A second determination submodule is used to determine the welding time and welding temperature according to the welding process requirement parameters, and determine the solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and the first high temperature deformation parameter of the scalar solder; A first extraction submodule is used to determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first morphological description feature of each welding point after welding based on the multi-view point cloud data; An evaluation submodule, used to evaluate the internal void rate of each welding point according to the first morphological description feature, and evaluate whether the first morphological description feature meets the standard according to the internal void rate of the welding point; A third determination submodule is used to determine the post-weld morphological parameters of each welding point according to the first morphological description feature if yes; The fourth determination submodule is used to obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder joint on the second morphological description characteristics until the second morphological description characteristics meet the standards, and determine the post-weld morphological parameters of each welding point according to the second morphological description characteristics.

9. The integrated circuit packaging wire bonding system according to claim 6, characterized in that: The second generating module comprises: A fifth determination submodule is used to determine the post-weld surface concave-convex state vector of each welding point according to the post-weld morphological parameters of each welding point, and to determine the ultrasonic echo feedback amplitude variation parameter and the signal feedback delay parameter at each welding point according to the post-weld surface concave-convex state vector; A sixth determination submodule, used to determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude variation parameter and the signal feedback delay parameter; The seventh determination submodule is used to extract the key features of the morphological parameters of each welding spot after welding, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the morphological parameters of the welding spot after welding; The second generation submodule is used to generate, according to the correlation mapping relationship, an evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point.

10. The integrated circuit packaging wire bonding system according to claim 6, characterized in that: The welding force adjustment and welding qualification assessment module includes: A control submodule, used to determine welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire welding on the packaging structure through the welding control parameters; an eighth determination submodule, configured to detect a real-time feedback signal of the welding robot when welding each welding point through an ultrasonic sensor, determine a signal difference of each welding point according to the real-time feedback signal, and determine a force adjustment direction based on the signal difference, wherein the force adjustment direction includes: increasing the force and reducing the force; A welding force adjustment submodule, used to determine a force adjustment difference according to the signal difference, and to adjust the welding force based on the force adjustment difference and the force adjustment direction; The welding qualification assessment submodule is used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot according to the welding qualification assessment criteria, and to perform qualification assessment on the welding state of each welding point according to the final morphological characteristics.

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