Cofferdam structure, semiconductor device and packaging method thereof

Abstract

The invention discloses a cofferdam structure, a semiconductor device and a packaging method thereof.The semiconductor device comprises a lead frame and at least one component, the cofferdam structure is applied to packaging of the semiconductor device, the component and the cofferdam structure are located on the same side of the lead frame, and the cofferdam structure comprises first protection glue and a plurality of auxiliary components; the plurality of auxiliary parts are arranged at intervals around the area where the component is located, and the first protection glue covers the plurality of auxiliary parts and fully surrounds the area where the component is located. By adopting the cofferdam structure provided by the embodiment of the invention to package the semiconductor device, the performance and the reliability of the semiconductor device can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device packaging, and particularly to a cofferdam structure, a semiconductor device and a packaging method thereof. Background Art

[0002] Wire bonding and plastic encapsulation are two key processes in the packaging process of semiconductor devices. Among them, wire bonding refers to the process of electrically connecting the pads / pins of the lead frame to the pads on the components (such as chips) and electrically connecting the pads between different components using very fine bonding wires (such as metal wires); plastic encapsulation refers to the process of wrapping the entire structure with plastic encapsulant after the wire bonding process. In addition, after the wire bonding process, the prior art usually coats a layer of silicone on the surface of the components to protect the components.

[0003] It is found that the traditional packaging method has the following problems: Since the silicone only covers the surface of the chip, it cannot ensure the protection of the bonding wires. When plastic encapsulating, the plastic encapsulant will bend and deform the bonding wires, resulting in a decline in device performance. For radio frequency devices, if the bonding wires are in contact with the plastic encapsulant, it will also lead to an increase in radio frequency performance loss. If the silicone is increased to cover the components and the bonding wires, the silicone will flow from the gaps of the lead frame to the back of the lead frame, and the improvement effect is not good, and the above problems cannot be well solved. Summary of the Invention

[0004] The present invention provides a cofferdam structure, a semiconductor device and a packaging method thereof. Applying this cofferdam structure to the packaging of semiconductor devices can improve the performance and reliability of semiconductor devices.

[0005] In a first aspect, the present invention provides a cofferdam structure for use in the packaging of semiconductor devices; the semiconductor device includes a lead frame and at least one component, and the component and the cofferdam structure are located on the same side of the lead frame; the cofferdam structure includes a first protective glue and a plurality of auxiliary components;

[0006] The plurality of auxiliary components are arranged at intervals around the area where the component is located;

[0007] The first protective glue covers the plurality of auxiliary components and completely surrounds the area where the component is located.

[0008] Optionally, the orthographic projection of the auxiliary component on the lead frame does not overlap with the orthographic projection of the first bonding wire in the semiconductor device on the lead frame;

[0009] Wherein, the first bonding wire is used to electrically connect the component and the pad of the lead frame.

[0010] Optionally, the first protective glue covers a part of the bonding line segment of the first bonding wire in the semiconductor device;

[0011] Among them, the first bonding wire is used for electrically connecting the component and the pad of the lead frame.

[0012] Optionally, along the direction perpendicular to the plane where the lead frame is located, the height of the auxiliary component is greater than the maximum height of the component.

[0013] Optionally, the three-dimensional shape of the plurality of auxiliary components includes at least one of an arc shape, a column shape, and a sheet shape; among them,

[0014] Both ends of the arc-shaped auxiliary component are fixed to the lead frame;

[0015] The bottom surface of the column-shaped auxiliary component is fixed to the lead frame;

[0016] The plane where the sheet-shaped auxiliary component is located is perpendicular to the plane where the lead frame is located.

[0017] Optionally, the plurality of auxiliary components include a plurality of arc-shaped metal wires, and both ends of the metal wires are fixed to the lead frame.

[0018] Optionally, the extending direction of the metal wire is the same as the extending direction of the first bonding wire in the semiconductor device;

[0019] Among them, the first bonding wire is used for electrically connecting the component and the pad of the lead frame.

[0020] Optionally, the orthographic projection of the area where the component is located on the lead frame includes a first edge;

[0021] In the first direction, a plurality of auxiliary components are arranged side by side to form a group of auxiliary components; in the second direction, the cofferdam structure includes at least two groups of auxiliary components, and the auxiliary components in adjacent two groups of auxiliary components are arranged in a staggered manner; among them, the second direction intersects with the extending direction of the first edge, and the first direction intersects with the second direction and is parallel to the plane where the lead frame is located.

[0022] In a second aspect, based on the same inventive concept, the present invention provides a semiconductor device, including:

[0023] A lead frame; the lead frame includes a device area and a pad area;

[0024] At least one component, located on one side of the lead frame and fixed to the device area; at least part of the component is electrically connected to the pad in the pad area through the first bonding wire;

[0025] The cofferdam structure provided in any embodiment of the present invention is fixed to the device area and is arranged around the area where the component is located;

[0026] A second protective glue; the second protective glue covers the area where the component is located and is in contact with the cofferdam structure.

[0027] Optionally, the semiconductor device further includes a third protective adhesive;

[0028] The first bonding wire includes a first bonding section, and the first bonding section is located on the side of the dam structure close to the pad area; the third protective adhesive wraps the first bonding section of the first bonding wire and contacts the dam structure.

[0029] In a third aspect, based on the same inventive concept, the present invention provides a packaging method for a semiconductor device, including:

[0030] Providing a lead frame; the lead frame includes a device area and a pad area;

[0031] Fixing at least one component to the device area of the lead frame and electrically connecting at least part of the components to the pads in the pad area through a first bonding wire;

[0032] Forming the dam structure provided in any embodiment of the present invention; the dam structure is fixed to the device area and is arranged around the area where the components are located;

[0033] Forming a second protective adhesive; the second protective adhesive covers the area where the components are located and contacts the dam structure.

[0034] Optionally, the step of forming the dam structure includes:

[0035] Forming a plurality of auxiliary components; the plurality of auxiliary components are arranged at intervals around the area where the components are located;

[0036] Coating a first liquid adhesive material in the area where the plurality of auxiliary components are located;

[0037] Curing the first liquid adhesive material to form a first protective adhesive; the first protective adhesive covers the plurality of auxiliary components and completely surrounds the area where the components are located.

[0038] Optionally, the three-dimensional shape of the plurality of auxiliary components includes an arc shape;

[0039] Forming the plurality of auxiliary components includes:

[0040] In the device area of the lead frame, forming a plurality of arc-shaped metal wires around the area where the components are located, and both ends of the metal wires are fixed to the device area.

[0041] The cofferdam structure provided by the embodiment of the present invention includes a first protective glue and a plurality of auxiliary components. The plurality of auxiliary components are arranged at intervals around the area where the component is located. The first protective glue covers the plurality of auxiliary components and completely surrounds the area where the component is located. When this cofferdam structure is applied to the packaging of semiconductor devices, the cofferdam structure and the component are located on the same side of the lead frame and are arranged around the area where the component is located. This not only enables the cofferdam structure to play a role of cofferdam shielding, preventing liquid glue from overflowing the lead frame, improving the packaging effect, and enhancing the performance and reliability of semiconductor devices, but also benefits from the special structure of the cofferdam structure, which is convenient for avoiding the mutual influence between the cofferdam structure and the bonding wires in the semiconductor device, facilitating the fabrication of a taller cofferdam structure to achieve a better shielding effect, improving the protection effect of the protective glue on the component and the bonding wires, and also being conducive to protecting partial line segments of the bonding wires of the semiconductor device through the first protective glue in the cofferdam structure. In addition, it also has the advantage of more flexible preparation methods.

[0042] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. Brief Description of the Drawings

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0044] Figure 1 is a top view structural schematic diagram of a semiconductor device provided by an embodiment of the present invention;

[0045] Figure 2 is along Figure 1 in AA' of the cross-sectional structural schematic diagram of the semiconductor device intercepted;

[0046] Figure 3 is a top view structural schematic diagram of another semiconductor device provided by an embodiment of the present invention;

[0047] Figure 4 is along Figure 3 in BB' of the cross-sectional structural schematic diagram of the semiconductor device intercepted;

[0048] Figure 5 is along Figure 3 in BB' of another cross-sectional structural schematic diagram of the semiconductor device intercepted;

[0049] Figure 6 is along Figure 3Another cross-sectional structure schematic diagram of the semiconductor device taken along BB';

[0050] Figure 7 It is a top view structure schematic diagram of another semiconductor device provided by an embodiment of the present invention;

[0051] Figure 8 It is a flowchart schematic diagram of a packaging method for a semiconductor device provided by an embodiment of the present invention;

[0052] Figure 9 It is a flowchart schematic diagram of another packaging method for a semiconductor device provided by an embodiment of the present invention;

[0053] Figures 10 - 17 It is related to Figure 9 The corresponding semiconductor device packaging flowchart. Detailed implementation manners

[0054] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0055] Without departing from the spirit or scope of the present application, various modifications and changes can be made in the present application, which is obvious to those skilled in the art. Therefore, the present application is intended to cover the modifications and changes of the present application that fall within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in the embodiments of the present application can be combined with each other without conflict.

[0056] First of all, it should be noted that unless otherwise defined, the technical terms or scientific terms used in the present invention should have the ordinary meanings understood by those of ordinary skill in the field to which the present invention belongs. The "first", "second", "third" and similar terms used in the present invention do not denote any order, quantity or importance, but are only used to distinguish different components. "Including", "having" and their similar terms mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Similar terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Similar terms such as "upper", "lower", "left", "right", "horizontal", "vertical" are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly. In addition, the shapes and sizes of the components in the drawings do not reflect the true proportions, and the purpose is only to schematically illustrate the content of the present invention.

[0057] An embodiment of the present invention provides a dam structure applicable to the packaging of semiconductor devices. As described above, a semiconductor device includes a lead frame and at least one component. The dam structure provided by the embodiment of the present invention is on the same side of the lead frame as the component. Specifically, the dam structure includes a first protective glue and a plurality of auxiliary components, wherein the plurality of auxiliary components are arranged at intervals around the area where the component is located; the first protective glue covers the plurality of auxiliary components and completely surrounds the area where the component is located.

[0058] Specifically, the dam structure is formed before applying silicone. Since the dam structure has a certain height and completely surrounds the area where the component is located, when applying silicone to the area where the component is located, the dam structure can block the silicone from overflowing the lead frame, so that enough silicone can be added to protect the components and bonding wires in the dam structure with the silicone, improving the performance and reliability of the semiconductor device.

[0059] Furthermore, different from the traditional dam structure (usually a finished product that has been formed (such as a ring / loop shape)), the dam structure provided in this embodiment is composed of a plurality of auxiliary components and a first protective glue. Among them, the first protective glue can be cured from a first liquid glue material, and the auxiliary components can provide support and attachment for the first liquid glue material during the formation of the first protective glue, enabling the first liquid glue material to diffuse along the auxiliary components, and then forming a first protective glue with a certain height after curing, so that the first protective glue covers the auxiliary components and completely surrounds the area where the component is located, thereby enabling the dam structure provided in this embodiment to play a role of dam shielding.

[0060] In addition to playing a basic role in retaining the surrounding material, compared with the traditional retaining structure, applying the retaining structure provided in this embodiment to the packaging of semiconductor devices has the following advantages: First, the traditional retaining structure can only be formed before the wire bonding process. The reason is that after electrically connecting components to each other and components to the pads of the lead frame through bonding wires, due to the presence of the bonding wires, it is impossible to place a retaining structure around the area where the components are located. Therefore, the traditional retaining structure can only be formed before the wire bonding process, that is, first fix the retaining structure around the area where the components are located and then perform wire bonding. In contrast, in the retaining structure provided in this embodiment, since multiple auxiliary components are arranged at intervals and the first protective glue can be cured from the first liquid glue material, the auxiliary components can be formed before the wire bonding process or after the wire bonding process as long as the bonding wires are not affected. Therefore, the technical solution of this embodiment has the advantage of more flexible preparation methods. Second, given that the traditional retaining structure can only be formed before the wire bonding process, the height of the traditional retaining structure is limited (too high will affect wire bonding), resulting in a limited shielding effect, and further limiting the amount of silica gel added to the area where the components are located, affecting the protection effect of the silica gel on the components and the bonding wires. In contrast, in the retaining structure provided in this embodiment, since multiple auxiliary components are arranged at intervals, it is easy to avoid conflicts between the auxiliary components and the bonding wires in the semiconductor device, so that the height of the auxiliary components is not limited by the height of the bonding wires. Therefore, by increasing the height of the auxiliary components, the height of the first protective glue can be increased, that is, the height of the retaining structure can be increased to achieve a better shielding effect, and the amount of silica gel added to the area where the components are located can also be increased to improve the protection effect on the components and the bonding wires. Third, when the height of the auxiliary component exceeds the height of the bonding wire in its vicinity, adopting the retaining structure provided in this embodiment can also protect part of the line segment of the bonding wire through the first protective glue, further improving the protection effect on the bonding wire. The above advantages and other advantages can be further understood in combination with the subsequent embodiments.

[0061] The above is the core idea of this application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application. Hereinafter, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application.

[0062] First of all, it should be noted that since the retaining structure provided in the embodiments of the present invention is applied to the packaging of semiconductor devices, the embodiments of the present invention do not separately provide drawings of the retaining structure, but illustrate the structure of the retaining structure and the semiconductor device based on the drawings of the semiconductor device.

[0063] Exemplarily, Figure 1It is a top view structural schematic diagram of a semiconductor device provided by an embodiment of the present invention. Figure 2 It is along Figure 1 The cross-sectional structural schematic diagram of the semiconductor device intercepted at AA' in Figure 1 and Figure 2 As shown, the semiconductor device 100 provided by the embodiment of the present invention includes a lead frame 1, at least one component 2, a dam structure 3, and a second protective glue 5; the dam structure 3 and the component 2 are located on the same side of the lead frame 1 and are arranged around the area where the component 2 is located; the second protective glue 5 covers the area where the component 2 is located and is in contact with the dam structure 3.

[0064] As Figure 1 and Figure 2 shown, the lead frame 1 includes a device area 11 and a pad area 12. The device area 11 of the lead frame 1 mainly includes a heat sink for carrying the component 2 and playing a role in heat dissipation; the pad area 12 of the lead frame 1 mainly includes a plurality of pads for electrically connecting with the component 2, thereby realizing the electrical connection between the semiconductor device and the external circuit.

[0065] Further, as Figure 2 shown, the component 2 is located on one side of the lead frame 1 and is fixed to the device area 11; at least part of the component 2 is electrically connected to the pads in the pad area 12 through the first bonding wire 41. It should be noted that the number of components can be one or more, which needs to be determined according to the specific semiconductor device. Figure 1 Only taking the semiconductor device 100 including two components 2 as an example for illustration. As Figure 1 shown, the different components 2, and between the component 2 and the pads in the pad area 12 can all be electrically connected through the bonding wire 4. Specifically, when the semiconductor device includes multiple components, the different components 2 can be electrically connected through the second bonding wire 42, and the component 2 and the pads in the pad area 12 can be electrically connected through the first bonding wire 41. Among them, the first bonding wire 41 is used to electrically connect the component and the pad of the lead frame. In other words, the first bonding wire 41 generally refers to all the bonding wires 4 that are used to electrically connect the pads in the pad area 12 with the corresponding component 2. The second bonding wire 42 is used to electrically connect different components. In other words, the second bonding wire 41 generally refers to all the bonding wires 4 that are used to electrically connect different components 2. The electrical connection relationship between the components and between the component and the pads in the pad area can be determined according to the specific semiconductor device, and the embodiment of the present invention does not make specific limitations in this regard. Exemplarily, the bonding wire 4 can be a gold wire, a copper wire, or an alloy wire. The components in the semiconductor device include but are not limited to semiconductor chips, capacitors, resistors, and other devices.

[0066] It also needs to be noted that Figure 1Only taking the example that the pad regions 12 are located on the opposite sides (such as the left and right sides) of the device region 11 for illustration, the relative positional relationship between the device region 11 and the pad regions 12 is not limited to this. Exemplarily, in other embodiments, the pad regions 12 can be distributed around the device region 11, and specifically, the structure of the lead frame can be designed according to the actual product. The embodiments of the present invention do not limit this.

[0067] As Figure 1 shown, the structure of the device region 11 of the lead frame 1 is connected to the structure of the pad regions 12, and there is a gap between the device region 11 and the pad regions 12. It should be noted that Figure 1 only taking the example that the structures of the device region 11 and the pad regions 12 are connected by a plurality of connecting ribs 13, and there is a gap Q between adjacent connecting ribs 13 for illustration. In other embodiments, the structures of the device region 11 and the pad regions 12 can be connected by other means, and the embodiments of the present invention do not limit this. Due to the gap between the device region 11 and the pad regions 12, if we want to simply cover the components and bonding wires (such as the second bonding wire 42) by increasing the silicone on the device region, the silicone will flow from the gap Q of the lead frame 1 to the back of the lead frame 1, affecting the encapsulation effect and not being able to well solve the aforementioned technical problems.

[0068] Combined with Figure 1 and Figure 2 shown, the solution of the embodiment of the present invention is to set a cofferdam structure 3 around the region where the component 2 is located. Specifically, the cofferdam structure 3 in this embodiment includes a first protective glue 31 and a plurality of auxiliary components 32; the plurality of auxiliary components 32 are arranged at intervals around the region where the component 2 is located; the first protective glue 31 covers the plurality of auxiliary components 32 and completely surrounds the region where the component 2 is located.

[0069] After forming the above cofferdam structure 3, a second protective glue 5 with sufficient thickness can be formed inside the cofferdam structure 3, and the second protective glue 5 is used to cover the region where the component 2 is located, protecting the component 2 and the bonding wires (such as the second bonding wire 42 and the ab segment of the first bonding wire 41) in the cofferdam structure 3 from direct contact with the encapsulant 7, optimizing the encapsulation effect and improving the performance of the semiconductor device.

[0070] In addition, as Figure 2 shown, optionally, the first protective glue 31 covers a part of the bonding wire segment of the first bonding wire 41. In this way, a part of the segment of the first bonding wire 41 (such as the bc segment of the first bonding wire 41) can be protected by the first protective glue 31 in the cofferdam structure 3 from direct contact with the encapsulant 7, further optimizing the encapsulation effect and improving the performance of the semiconductor device.

[0071] Furthermore, Figure 3 is a top view structure schematic diagram of another semiconductor device provided by the embodiment of the present invention.Figure 4 is a schematic cross-sectional structure diagram of a semiconductor device taken along Figure 3 BB' in the middle, combined with Figure 3 and Figure 4 As shown, optionally, the semiconductor device 100 further includes a third protective glue 6; the first bonding wire 41 includes a first bonding branch 411, and the first bonding branch 411 is located on the side of the cofferdam structure 3 close to the pad area 12; the third protective glue 6 wraps the first bonding branch 411 of the first bonding wire 41 and contacts the cofferdam structure 3. In this way, the first bonding branch 411 of the first bonding wire 41 located outside the cofferdam structure 3 can be protected by the third protective glue 6, avoiding direct contact with the encapsulant 7, further optimizing the encapsulation effect and improving the performance of the semiconductor device.

[0072] Exemplarily, taking the Figure 4 shown semiconductor device as an example, in this embodiment, by setting the cofferdam structure 3, the first bonding wire 41 can be divided into three parts, specifically including a first bonding branch 411, a second bonding branch 412, and a third bonding branch 413, where: the first bonding branch 411 refers to the first bonding wire between the node c and the node d, that is, the part of the first bonding wire 41 located on the side of the cofferdam structure 3 close to the pad area 12; the second bonding branch 412 refers to the first bonding wire between the node a and the node b, that is, the part of the first bonding wire 41 located on the side of the cofferdam structure 3 away from the pad area 12; the third bonding branch 413 refers to the first bonding wire between the node b and the node c, that is, the part of the first bonding wire 41 located between the first bonding branch 411 and the second bonding branch 412.

[0073] Furthermore, continue to refer to Figure 4 , due to the setting of the cofferdam structure 3, enough second liquid glue material can be added in the device area inside the cofferdam structure 3. The cofferdam structure 3 prevents the second liquid glue material from overflowing, and then the second protective glue 5 can be formed by curing the second liquid glue material. The second protective glue 5 can protect the components 2 and the bonding wires (such as the second bonding wire 42 and the second bonding branch 412 of the first bonding wire 41) inside the cofferdam structure 3, avoiding direct contact with the encapsulant 7.

[0074] Furthermore, continue to refer to Figure 4, for the first bonding section 411 located outside the cofferdam structure 3, in this embodiment, the third protective glue 6 is used to protect it. Specifically, in an actual product, the spacing between adjacent first bonding wires 41 is very small. The third protective glue 6 can be formed in the following way: First, apply the third liquid glue material to the pad area 12. In this way, under the capillary force of the first bonding wire 41, the third liquid glue material can spread along the bottom of the first bonding wire 41 (such as node d) toward the side close to the cofferdam structure 3, so as to wrap the first bonding section 411, and then cure the third liquid glue material to obtain the third protective glue 6. The third protective glue 6 is used to protect the first bonding section 411 of the first bonding wire 41 to prevent the encapsulant 7 from directly contacting it.

[0075] Continue to refer to Figure 4 , since the height of the auxiliary component 32 in the cofferdam structure 3 adopted in this embodiment is not limited, therefore, by appropriately increasing the height of the auxiliary component 32, the height of the first protective glue 31 can be raised, and the first protective glue 31 in the cofferdam structure 3 is used to protect the third bonding section 413 of the first bonding wire 41 to prevent the third bonding section 413 from directly contacting the encapsulant 7.

[0076] Specifically, the formation process of the first protective glue 31 is similar to that of the second protective glue 5 / third protective glue 6. Specifically, first apply the first liquid glue material and then cure it. Referring to the above explanation, in this embodiment, the auxiliary component 32 is used to provide support and attachment for the first liquid glue material during the formation process of the first protective glue 31, so that the first liquid glue material can spread along the auxiliary component 32, and then form the first protective glue 31 with a certain height after curing. Refer to Figure 3 and Figure 4 , specifically, when forming the cofferdam structure 3, first form the auxiliary component 32, and then form the first protective glue 31; after the auxiliary component 32 is formed, the first liquid glue material can be applied to the area where the auxiliary component 32 is located. In this way, the first liquid glue material can spread along the auxiliary component 32 toward the side away from the lead frame 1 to the top of the auxiliary component 32, and then form a solid first protective glue 31 after curing, so that the first protective glue 31 covers the auxiliary component 32 and completely surrounds the area where the component 2 is located, playing a role of cofferdam shielding, and can also protect part of the line segments of the first bonding wire.

[0077] By adopting the above scheme, all components 2 and all bonding wires 4 can be fully wrapped / covered by the second protective glue 5, the third protective glue 6 and the first protective glue 31 in the cofferdam structure 3, and it can also prevent the second protective glue from overflowing the lead frame during the formation process, and prevent the bonding wire 4 from directly contacting the encapsulant 7 during the subsequent encapsulation process, thereby significantly improving the performance and reliability of the semiconductor device.

[0078] Exemplarily, the first liquid adhesive material, the second liquid adhesive material, and the third liquid adhesive material may be liquid silicone rubber. The viscosity thereof is not limited in the embodiments of the present invention, and those skilled in the art can select it by themselves.

[0079] As described above, in this embodiment, the auxiliary component 32 may be formed before the wire bonding process or after the wire bonding process. Preferably, the auxiliary component 32 is formed after the wire bonding process, that is, before the auxiliary component 32 is formed, the bonding wire 4 has been formed. In this way, on the one hand, the presence of the auxiliary component 32 can be avoided from interfering with the wire bonding process of the bonding wire 4 (especially the first bonding wire 41). On the other hand, by forming the bonding wire 4 first and then the auxiliary component 32, it is convenient to avoid the bonding wire 4 when preparing the auxiliary component 32. On the basis of ensuring the production yield of the bonding wire, the conflict between the bonding wire 4 and the auxiliary component 32 can be effectively avoided. In addition, it is also beneficial to prepare a higher auxiliary component 32 with reference to the height of the existing first bonding wire 41, so as to use the first protective glue 31 to protect part of the line segment in the first bonding wire 41.

[0080] Optionally, the auxiliary component 32 does not contact the first bonding wire 41 to ensure that the auxiliary component 32 will not cause any adverse effects on the first bonding wire 41.

[0081] Refer to Figure 2 , as a feasible implementation manner, optionally, the orthographic projection of the auxiliary component 32 on the lead frame 1 does not overlap with the orthographic projection of the first bonding wire 41 on the lead frame 1. In this way, it can not only ensure that the auxiliary component 32 does not contact the first bonding wire 41, but also avoid the position where the first bonding wire 41 is located when preparing the auxiliary component 32, which is beneficial to reducing the preparation difficulty of the auxiliary component 32, improving the preparation efficiency of the auxiliary component 32, and then improving the packaging efficiency of the semiconductor device; in addition, it is also beneficial to make an auxiliary component with a relatively high height to increase the height of the cofferdam structure. Of course, this setting method is not unique. In some embodiments, for all auxiliary components, it is optional that a part of the auxiliary components do not overlap with the orthographic projection of the first bonding wire on the lead frame, and another part of the auxiliary components overlap with the orthographic projection of the first bonding wire on the lead frame (that is, at least part of the auxiliary component is located directly below the first bonding wire, so that there is an overlap between the two in the direction perpendicular to the plane where the lead frame is located). However, it should be noted that for this part of the auxiliary component that overlaps with the first bonding wire, it is necessary to ensure that its height is less than the height of the first bonding wire to avoid affecting the first bonding wire.

[0082] As Figure 2 shown, optionally, along the direction perpendicular to the plane where the lead frame 1 is located, the height of the auxiliary component 32 is greater than the maximum height of the component 2.

[0083] Among them, the maximum height of component 2 can be specifically understood as the height of the component with the maximum height among all components 2. The heights at different positions of the second protective glue 5 are different, but its maximum height must be higher than the maximum height of component 2. In this embodiment, by setting the height of the auxiliary component 32 to be greater than the maximum height of component 2, the height of the first protective glue 31 (i.e., the height of the cofferdam structure 3) can be ensured to be greater than the maximum height of component 2, ensuring the shielding effect of the cofferdam structure 3.

[0084] It should be noted that the specific height of the auxiliary component 32 can be reasonably set according to the specific heights of the component 2 and the bonding wire 4 in the device area 11, as long as it is ensured that the height of the cofferdam structure 3 is sufficient to prevent the liquid glue material from overflowing. Since there is no conflict between the auxiliary component 32 and the first bonding wire 41, the embodiment of the present invention does not limit the heights of the auxiliary component 32 and the first bonding wire 41.

[0085] It should also be noted that the heights of the auxiliary components 32 can be the same or different, and the embodiment of the present invention does not limit this. In addition, the embodiment of the present invention does not limit the distribution density of the multiple auxiliary components 32 either. The multiple auxiliary components 32 can be evenly distributed or unevenly distributed.

[0086] Optionally, the three-dimensional shapes of the multiple auxiliary components 32 include at least one of an arc shape, a column shape, and a sheet shape. In other words, for all the auxiliary components 32, it can be that the three-dimensional shapes of all the auxiliary components 32 are arc-shaped, or it can be that the three-dimensional shapes of all the auxiliary components 32 are column-shaped, or it can be that the three-dimensional shapes of all the auxiliary components 32 are sheet-shaped, or it can also be that the three-dimensional shapes of all the auxiliary components 32 are not unique and can include any two or three of an arc shape, a column shape, and a sheet shape. Of course, the three-dimensional shape of the auxiliary component 32 can also be other shapes, as long as it is ensured that the auxiliary component 32 has a certain height and the first liquid glue material can diffuse upward along the auxiliary component and form a first protective glue with a certain height through curing.

[0087] Exemplarily, Figure 2 Taking the three-dimensional shape of the auxiliary component 32 as an arc shape as an example for illustration. As Figure 2 shown, optionally, both ends of the arc-shaped auxiliary component 32 are fixed to the lead frame 1 (specifically fixed to the device area 11 of the lead frame), which is beneficial to ensuring the height of the auxiliary component.

[0088] Continue to refer to Figure 2, in a specific embodiment, optionally, the plurality of auxiliary components 32 include a plurality of arc-shaped metal wires 321, and both ends of the metal wires 321 are fixed to the lead frame 1 (specifically fixed to the device area 11 of the lead frame). Specifically, in this embodiment, the metal wires 321 are used as the auxiliary components 32. In this way, both the metal wires 321 and the bonding wires 4 can be formed by wire bonding process, which not only has a simple processing method, but also can reduce the types of equipment required in the packaging process, improve the packaging efficiency, and reduce the cost.

[0089] Referring to Figure 1 and Figure 2 , further optionally, the extending direction of the metal wire 321 is the same as that of the first bonding wire 41. In this way, while avoiding conflicts between the metal wire 321 and the first bonding wire 41, the production speed of the metal wire 321 can be increased, and the packaging efficiency can be improved.

[0090] It should be noted that for the metal wires 321 within the projection area of the first bonding wire 41, it is preferred that the extending direction of this part of the metal wires 321 is the same as that of the first bonding wire 41. For the metal wires 321 outside the projection area of the first bonding wire 41, their extending directions may be the same as or different from that of the first bonding wire 41, and the embodiments of the present invention do not make any limitations in this regard.

[0091] It should also be noted that the metal wires 321 are only fixed in the device area 11 and there is no electrical connection relationship with the components 2. Additionally, because Figure 1 the cross-sectional line AA' in Figure 2 passes through the first bonding wire 41 and does not pass through the metal wires 321, so

[0092] Exemplarily, Figure 5 is another cross-sectional structure schematic diagram of the semiconductor device taken along Figure 3 BB' in Figure 5 to illustrate the three-dimensional shape of the auxiliary structure 32 as a column. As Figure 5 shown, optionally, the bottom surface of the columnar auxiliary component 32 is fixed to the lead frame 1 (specifically fixed to the device area of the lead frame), which is beneficial to ensuring the height of the auxiliary component. Exemplarily, referring to Figure 5 , as a feasible implementation method, a plurality of solder balls can be stacked and fabricated through a ball mounting process to form a columnar auxiliary structure. Additionally, referring to Figure 5 , in order to ensure the width of the first protective glue 31 in the horizontal direction, at least two columnar auxiliary components 32 can be arranged side by side.

[0093] Exemplarily, Figure 6 is along Figure 3Another schematic cross-sectional structure diagram of the semiconductor device taken along BB' Figure 6 Taking the three-dimensional shape of the auxiliary structure 32 as a sheet as an example for illustration, as Figure 6 shown, optionally, the plane where the sheet-shaped auxiliary component 32 is located is perpendicular to the plane where the lead frame 1 is located, which is beneficial to ensuring the height of the auxiliary component. Exemplarily, the sheet-shaped auxiliary component 32 can be composed of a metal sheet or a ceramic sheet.

[0094] Referring to Figure 3 , optionally, the orthographic projection of the area where the component is located on the lead frame includes the first edge E1; in the first direction, a plurality of auxiliary components are arranged side by side to form an auxiliary component group 30; in the second direction, the cofferdam structure 3 includes at least two auxiliary component groups 30, and the auxiliary components in adjacent two auxiliary component groups 30 are arranged in a staggered manner; wherein, the second direction intersects with the extending direction of the first edge, and the first direction intersects with the second direction and is parallel to the plane where the lead frame is located. With such a setting, on the one hand, it is beneficial to increase the width of the first protective glue and enhance the cofferdam shielding effect of the cofferdam structure, and on the other hand, it is also beneficial to enhance the binding effect of the auxiliary component 32 on the first liquid glue material during the formation of the first protective glue 31, which is beneficial to preventing the first protective glue 31 from overflowing the lead frame during the formation process, improving the manufacturing yield of the cofferdam structure, and ensuring the encapsulation effect.

[0095] Specifically, referring to Figure 3 , the first edge E1 can be understood as any edge in the orthographic projection of the area where the component is located on the lead frame; for the auxiliary component 32 arranged adjacent to the first edge E1, several auxiliary components 32 can be arranged side by side in the first direction (such as Figure 3 the horizontal direction in), and these several side-by-side arranged auxiliary components 32 form an auxiliary component group 30, in the second direction (such as Figure 3 the vertical direction in), the cofferdam structure 3 includes at least two auxiliary component groups 30 (in other words, at least two auxiliary component groups 30 are arranged side by side in the second direction), and moreover, the auxiliary components 32 in adjacent two auxiliary component groups 30 are arranged in a staggered manner in the second direction.

[0096] Exemplarily, Figure 3 taking the area where the component is located as a rectangle, and both the upper edge and the lower edge of the rectangle are taken as the first edge for illustration. Taking the lower edge as an example, Figure 3Among them, for a plurality of auxiliary components 32 disposed adjacent to the lower edge (the first edge), several auxiliary components are arranged side by side in the horizontal direction, and the several auxiliary components form an auxiliary component group 30. In the vertical direction, three auxiliary component groups 30 are arranged side by side, and the auxiliary components 32 in two adjacent auxiliary component groups 30 are arranged offset in the vertical direction. In this way, it is beneficial to ensure the width of the first protective glue in the vertical direction, and it is also beneficial to enhance the binding effect of the auxiliary components 32 on the first liquid protective glue, preventing the first protective glue from overflowing the lead frame during the forming process.

[0097] It should be noted that Figure 3 The arrangement manner of the shown auxiliary components is only for illustration and not for limitation. Refer to Figure 3 , for the case where the region where the component is located is a polygon, at least part of all the edges of the optional polygon can be the above-mentioned first edge, preferably each edge is the above-mentioned first edge. Further, for any one of the first edges, the above-mentioned scheme can be adopted to optimize the arrangement manner of the plurality of auxiliary components disposed adjacent to the first edge to improve the encapsulation effect.

[0098] It should also be noted that Figure 3 Only taking the second direction (such as Figure 3 the vertical direction in Figure 3 and the extension direction of the first edge E1 (such as Figure 3 the horizontal direction in Figure 3 are orthogonal, and the first direction (such as Figure 3 the horizontal direction in Figure 3 and the second direction (such as Figure 3 the vertical direction in Figure 3 are orthogonal as an example for illustration. In specific implementation, the second direction and the extension direction of the first edge E1 may not be a strictly orthogonal relationship, and the first direction and the second direction may not be a strictly orthogonal relationship either, as long as it is ensured that the second direction intersects the extension direction of the first edge and the first direction intersects the second direction.

[0099] It should also be noted that Figure 3 Only taking the extension direction of the orthographic projection of each auxiliary component 32 in the auxiliary component group 30 on the lead frame (referred to as the projection extension direction) being consistent with the extension direction of the first edge E1 as an example for illustration, this setting manner is not for limitation. In other embodiments, the projection extension direction of each auxiliary component in the auxiliary component group may also intersect the extension direction of the first edge. At this time, the binding effect of the auxiliary components on the first liquid protective glue can be improved by appropriately increasing the arrangement density of the auxiliary components. The present invention embodiment does not limit the projection extension direction of each auxiliary component in the auxiliary component group. Exemplarily, Figure 7 is a schematic top view structure diagram of another semiconductor device provided by the present invention embodiment. As Figure 7As shown in the figure, for a plurality of auxiliary components 32 disposed adjacent to the left / right edge of the region where the component is located, in this embodiment, a plurality of auxiliary components 32 are arranged side by side in the longitudinal direction to form an auxiliary component group 30, and two auxiliary component groups 30 are arranged side by side in the transverse direction, and the auxiliary components 32 in adjacent two auxiliary component groups 30 are offset in the transverse direction. In addition, the projection extension direction of the auxiliary component 32 is set to intersect with the extension direction of the left / right edge, for example, parallel to the projection extension direction of the first bonding wire 41. In this way, the packaging effect can be further improved, the conflict between the auxiliary component 32 and the first bonding wire 41 can be avoided, and the manufacturing difficulty of the auxiliary component 32 can be reduced.

[0100] It should also be noted that the plurality of auxiliary components in an auxiliary component group can be arranged side by side at equal intervals or at unequal intervals, and the embodiments of the present invention do not limit this.

[0101] It should also be noted that for the case where the region where the component is located is circular (or oval), the edge of the orthographic projection of the region where the component is located on the lead frame is circular. At this time, the entire circular edge can be understood as the above-mentioned first edge, the circumferential direction can be understood as the first direction, and the radial direction of the circle can be understood as the second direction. At this time, a plurality of auxiliary components can be arranged side by side along the circumferential direction, and the plurality of auxiliary components are located on the same circumference to form an auxiliary component group; further, at least two auxiliary component groups are arranged side by side along the radial direction of the circle, and the auxiliary components in adjacent two auxiliary component groups are offset along the radial direction of the circle.

[0102] Based on the same inventive concept, the embodiments of the present invention also provide a packaging method for a semiconductor device. Figure 8 is a schematic flowchart of a packaging method for a semiconductor device provided by an embodiment of the present invention, as Figure 8 shown, the packaging method of the semiconductor device may include the following steps:

[0103] S110. Provide a lead frame; the lead frame includes a device area and a pad area.

[0104] S120. Fix at least one component to the device area of the lead frame, and electrically connect at least part of the components to the pads in the pad area through a first bonding wire.

[0105] Specifically, the component can be fixed to the heat sink on the device area of the lead frame through a medium. Exemplarily, the medium can be a conductive film, a conductive adhesive or other non-conductive but viscous medium, and the component is fixed to the heat sink by pasting; in addition, the component can also be soldered to the heat sink through solder.

[0106] Combined with Figure 2As shown, it should be noted that when the semiconductor device 100 includes multiple components 2, while electrically connecting the component 2 to the pad in the pad region 12 through the first bonding wire 41, it is also necessary to electrically connect different components 2 through the second bonding wire 42 according to the actual electrical connection relationship between the components. The first bonding wire 41 and the second bonding wire 42 can be gold wires, copper wires or alloy wires, and can be specifically formed by wire bonding process.

[0107] S130. Form a cofferdam structure; the cofferdam structure is fixed in the device region and is arranged around the region where the components are located.

[0108] Among them, the cofferdam structure includes a first protective glue and a plurality of auxiliary components; the plurality of auxiliary components are arranged at intervals around the region where the components are located; the first protective glue covers the plurality of auxiliary components and completely surrounds the region where the components are located. The setting manner of the auxiliary components in the cofferdam structure can refer to the description of the above embodiments and will not be elaborated here.

[0109] S140. Form a second protective glue; the second protective glue covers the region where the components are located and is in contact with the cofferdam structure.

[0110] Specifically, referring to the description of the above semiconductor device embodiments, in this embodiment, after fixing at least one component to the device region of the lead frame and electrically connecting at least some of the components to the pads in the pad region through the first bonding wire, that is, after completing the wire bonding process, first form a cofferdam structure around the region where the components are located, fix the cofferdam structure in the device region, and then form a second protective glue. By using the second protective glue to cover the region where the components are located, the cofferdam structure can be used to prevent the liquid glue material from overflowing the lead frame during the formation of the second protective glue, optimize the encapsulation method, and improve the performance and reliability of the semiconductor device.

[0111] Further, referring to Figure 4 , the first bonding wire 41 includes a first bonding section 411, and the first bonding section 411 is located on the side of the cofferdam structure 3 close to the pad region 12; correspondingly, the steps of the encapsulation method may further include: forming a third protective glue, and the third protective glue wraps the first bonding section of the first bonding wire and is in contact with the cofferdam structure. In this way, all the components and all the bonding wires can be completely wrapped by the second protective glue, the third protective glue and the first protective glue in the cofferdam structure, completely solving the drawback that the encapsulating plastic is in direct contact with the bonding wire in the prior art, and further improving the performance and reliability of the semiconductor device.

[0112] As described above, as a feasible implementation manner, in the optional cofferdam structure, the three-dimensional shape of the auxiliary component can be at least one of arc-shaped, columnar and sheet-shaped. Here, taking the three-dimensional shape of the auxiliary component as arc-shaped, for example, composed of arc-shaped metal wires, the encapsulation method of the semiconductor device will be further explained in detail.

[0113] Exemplarily, Figure 9 FIG. 3 is a schematic flow chart of another semiconductor device packaging method provided by an embodiment of the present invention, Figures 10 - 17 which is Figure 9 corresponding to the semiconductor device packaging flow chart. Combining Figures 9 - 17 , the semiconductor device packaging method includes the following steps:

[0114] S210. Provide a lead frame; the lead frame includes a device area and a pad area.

[0115] As Figure 10 shown, the lead frame 1 has a device area 11 and a pad area 12. The device area 11 is mainly used to carry components, and the pad area 12 has pads for electrically connecting with components and an external circuit.

[0116] S220. Fix at least one component to the device area of the lead frame, and electrically connect at least part of the components to the pads in the pad area through a first bonding wire.

[0117] As Figure 11 shown, the component 2 is fixed to the device area 11 of the lead frame 1, and the pads in the pad area 12 are electrically connected to the component 2 through a first bonding wire 41.

[0118] Specifically, the electrical connection relationship between components and the electrical connection relationship between the components and the pads in the pad area can be determined according to the actual product, and the embodiments of the present invention do not make limitations. Exemplarily, Figure 11 taking the semiconductor device including two components 2, the two components 2 being electrically connected to each other and respectively electrically connected to the pads in the pad area 12 as an example for illustration. Taking this as an example, while forming the first bonding wire 41 to electrically connect the component 2 to the pads in the pad area 12 through a wire bonding process, it is also necessary to form a second bonding wire 42 to electrically connect the two components 2 through a wire bonding process.

[0119] After completing the wire bonding process, that is, forming the above-mentioned first bonding wire 41 and second bonding wire 42, the production of the cofferdam structure can be carried out. In this way, compared with forming the cofferdam structure first and then carrying out the wire bonding process, the existence of the cofferdam structure can be avoided from affecting the production process of the bonding wire. For the production process of the cofferdam structure, see S230 - S250.

[0120] S230. Form a plurality of auxiliary components; the plurality of auxiliary components are arranged at intervals around the area where the components are located.

[0121] As Figure 12As shown, a plurality of auxiliary components 32 are arranged in the device area 11 outside the area where the component 2 is located, and the plurality of auxiliary components 32 are arranged at intervals around the area where the component 2 is located. Optionally, the orthographic projection of the auxiliary component 32 on the lead frame 1 does not overlap with the orthographic projection of the first bonding wire 41 on the lead frame 1.

[0122] S240. Coating a first liquid adhesive material in the area where the plurality of auxiliary components are located.

[0123] S250. Curing the first liquid adhesive material to form a first protective adhesive; the first protective adhesive covers the plurality of auxiliary components and completely surrounds the area where the component is located.

[0124] Combined with Figure 13 and Figure 14 As shown, the first protective adhesive 31 covers the plurality of auxiliary components 32 and completely surrounds the area where the component 2 is located, thereby forming a cofferdam structure 3, which can be used to prevent the second liquid adhesive material from overflowing the lead frame during the subsequent formation of the second protective adhesive.

[0125] Referring to Figure 14 , considering that the cofferdam structure 3 is formed after the wire bonding process, and the area where the cofferdam structure 3 is to be arranged passes through the projection area of the first bonding wire 41 on the lead frame 1, and without affecting the first bonding wire 41, it is also necessary to have a certain height to achieve the effect of blocking the overflow of the liquid adhesive material. Therefore, it is obviously not feasible to directly use a formed hard or soft material as the cofferdam structure, and the liquid adhesive material cannot reach the height required for the cofferdam structure while ensuring that it does not overflow the lead frame. In view of this, combined with Figure 12 and Figure 14 As shown, to meet the setting requirements of the cofferdam structure, in this embodiment, when manufacturing the cofferdam structure, a plurality of auxiliary components 32 are arranged at intervals around the area where the component 2 is located. In this way, the setting position of the auxiliary component 32 can avoid the position where the first bonding wire 41 is located, avoiding affecting the first bonding wire 41. Further, a first liquid adhesive material is coated in the area where the plurality of auxiliary components 32 are located. Since the first liquid adhesive material has a certain fluidity, under the support and attachment of the auxiliary component 32, the first liquid adhesive material can diffuse along the auxiliary component 32 to the top of the auxiliary component 32 on the side away from the lead frame 1, covering the auxiliary component 32. Then, by curing the first liquid adhesive material, a solid first protective adhesive 31 with a certain height can be obtained, which can completely surround the area where the component 2 is located and play a role of cofferdam blocking. In addition, referring to the above explanation, by forming the cofferdam structure in this way, the first protective adhesive can also be used to protect a part of the first bonding wire (i.e., the above-mentioned third bonding section), avoiding direct contact with the encapsulant during the subsequent encapsulation process.

[0126] Referring to Figures 12 - 14, optionally, the step of forming a plurality of auxiliary components may include: in the device area 11 of the lead frame 1, a plurality of arc-shaped metal wires 321 are formed around the area where the component 2 is located, and both ends of the metal wire 321 are fixed to the device area 11. In this embodiment, the metal wire 321 is used as the auxiliary component 32. The first liquid adhesive material can diffuse along the metal wire 321 to the top of the metal wire 321 on the side away from the lead frame 1 under the capillary force of the metal wire 321. In addition, both the metal wire 321 and the bonding wire 4 can be formed by wire bonding process, which not only has a simple processing method, but also can reduce the types of equipment required in the packaging process, improve the packaging efficiency, and reduce costs.

[0127] Referring to Figure 12 , further optionally, the extending direction of the metal wire 321 is the same as that of the first bonding wire 41. In this way, while avoiding conflicts between the metal wire 321 and the first bonding wire 41, the production speed of the metal wire 321 can be increased, and the packaging efficiency can be improved.

[0128] S260. Coating a second liquid adhesive material in the device area inside the cofferdam structure and curing the second liquid adhesive material to form a second protective glue.

[0129] As Figure 15 shown, the second protective glue 5 is located in the device area 11 inside the cofferdam structure 3, covering the component 2 and the bonding wire 4 in this area, so as to avoid direct contact with the encapsulant in the subsequent encapsulation process. Since in this embodiment, the flow range of the second liquid adhesive material is restricted by the cofferdam structure, it is possible to prevent the second liquid adhesive material from overflowing the lead frame. Therefore, enough second liquid adhesive material can be added in the area where the component is located to fully ensure the coverage and protection of the second protective glue for the components and bonding wires inside the cofferdam structure.

[0130] S270. Coating a third liquid adhesive material on the pad area of the lead frame.

[0131] S280. Curing the third liquid adhesive material to form a third protective glue.

[0132] Specifically, S270 and S280 are the formation process of the third protective glue. As Figure 16 shown, first coat the third liquid adhesive material on the pad area 12 of the lead frame 1 (the position pointed by the node d in the figure). In this way, the third liquid adhesive material will diffuse along the first bonding wire 41 to the side close to the cofferdam structure 3 under the capillary force of the first bonding wire 41, wrapping the first bonding wire (i.e., the above-mentioned first bonding section) located outside the cofferdam structure 3. Then, by curing the third liquid adhesive material, the third protective glue 6 can be formed.

[0133] In this embodiment, when applying the third liquid adhesive, it is selected to apply the third liquid adhesive in the pad area of the lead frame. Compared with directly applying the third liquid adhesive on the first bonding wire, it can reduce the risk that the third liquid adhesive drips into the gap of the lead frame and overflows the lead frame, ensuring the encapsulation effect.

[0134] It should be noted that the second protective adhesive and the third protective adhesive can be fabricated simultaneously or at different times, and the embodiments of the present invention do not limit this.

[0135] Optionally, the second protective adhesive, the third protective adhesive, and the first protective adhesive are all solid silicone rubbers, which are cured from liquid silicone rubbers.

[0136] S290. Encapsulate the semiconductor device.

[0137] Specifically, referring to Figure 17 As shown, encapsulating the semiconductor device specifically means wrapping all the above structures (i.e., the lead frame 1, the component 2, the bonding wire 4, the cofferdam structure 3, the second protective adhesive 5, and the third protective adhesive 6) with the encapsulant 7 to form a sealed structure. In this embodiment, before the encapsulation process, all the components 2 and the bonding wire 4 are fully wrapped by the first protective adhesive 31, the second protective adhesive 5, and the third protective adhesive 6 in the cofferdam structure 3, so as to avoid direct contact between the encapsulant and them, and the performance and reliability of the semiconductor device can be ensured.

[0138] The above specific implementation manners do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub - combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A cofferdam structure is applied to the packaging of semiconductor devices; the semiconductor device includes a lead frame and at least one component, and the component and the cofferdam structure are located on the same side of the lead frame; characterized in that, The cofferdam structure includes a first protective glue and a plurality of auxiliary components; The plurality of auxiliary components are arranged at intervals around the area where the component is located; The first protective glue covers the plurality of auxiliary components and completely surrounds the area where the component is located.

2. The cofferdam structure according to claim 1, characterized in that, The orthographic projection of the auxiliary component on the lead frame does not overlap with the orthographic projection of the first bonding wire in the semiconductor device on the lead frame; Wherein, the first bonding wire is used for electrically connecting the component and the pad of the lead frame.

3. The cofferdam structure according to claim 1, characterized in that, The first protective glue covers a part of the bonding segments of the first bonding wire in the semiconductor device; Wherein, the first bonding wire is used for electrically connecting the component and the pad of the lead frame.

4. The cofferdam structure according to claim 1, characterized in that, In the direction perpendicular to the plane where the lead frame is located, the height of the auxiliary component is greater than the maximum height of the component.

5. The cofferdam structure according to claim 1, characterized in that, The three-dimensional shapes of the plurality of auxiliary components include at least one of an arc shape, a column shape, and a sheet shape; wherein, Both ends of the arc-shaped auxiliary component are fixed to the lead frame; The bottom surface of the column-shaped auxiliary component is fixed to the lead frame; The plane where the sheet-shaped auxiliary component is located is perpendicular to the plane where the lead frame is located.

6. The cofferdam structure according to claim 5, characterized in that, The plurality of auxiliary components include a plurality of arc-shaped metal wires, and both ends of the metal wire are fixed to the lead frame.

7. The cofferdam structure according to claim 6, characterized in that, The extending direction of the metal wire is the same as the extending direction of the first bonding wire in the semiconductor device; Wherein, the first bonding wire is used for electrically connecting the component and the pad of the lead frame.

8. The cofferdam structure according to claim 1, characterized in that, The orthographic projection of the area where the component is located on the lead frame includes a first edge; In a first direction, the plurality of auxiliary components are arranged side by side to form an auxiliary component group; in a second direction, the cofferdam structure includes at least two of the auxiliary component groups, and the auxiliary components in adjacent two of the auxiliary component groups are arranged in a staggered manner; wherein, the second direction intersects with the extending direction of the first edge, and the first direction intersects with the second direction and is parallel to the plane where the lead frame is located.

9. A semiconductor device, characterized in that, Including: A lead frame; the lead frame includes a device area and a pad area; At least one component, located on one side of the lead frame and fixed to the device area; at least part of the component is electrically connected to the pad in the pad area through a first bonding wire; The cofferdam structure according to any one of claims 1-8, fixed to the device area and arranged around the area where the component is located; A second protective glue; the second protective glue covers the area where the component is located and contacts the cofferdam structure.

10. The semiconductor device according to claim 9, characterized in that, The semiconductor device further includes a third protective glue; The first bonding wire includes a first bonding branch, and the first bonding branch is located on the side of the cofferdam structure close to the pad area; the third protective glue wraps the first bonding branch of the first bonding wire and contacts the cofferdam structure.

11. A packaging method for a semiconductor device, characterized in that, Including: Providing a lead frame; the lead frame includes a device area and a pad area; Fixing at least one component to the device area of the lead frame and electrically connecting at least part of the component to the pad in the pad area through a first bonding wire; Form the cofferdam structure according to any one of claims 1-8; the cofferdam structure is fixed to the device area and is arranged around the area where the component is located; Form a second protective glue; the second protective glue covers the area where the component is located and contacts the cofferdam structure.

12. The encapsulation method according to claim 11, wherein, The step of forming the cofferdam structure includes: Form a plurality of auxiliary components; the plurality of auxiliary components are arranged at intervals around the area where the component is located; Coat a first liquid glue material in the area where the plurality of auxiliary components are located; Cure the first liquid glue material to form a first protective glue; the first protective glue covers the plurality of auxiliary components and completely surrounds the area where the component is located.

13. The encapsulation method according to claim 12, wherein, The three-dimensional shape of the plurality of auxiliary components includes an arc shape; The forming of the plurality of auxiliary components includes: In the device area of the lead frame, form a plurality of arc-shaped metal wires around the area where the component is located, and both ends of the metal wire are fixed to the device area.

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