Sensor control device with integrally formed connecting assembly

Abstract

The invention provides a sensor control device with an integrally-formed connecting assembly. The sensor control device comprises a sensor assembly, an electronic assembly and the integrally-formed connecting assembly. The sensor assembly includes a distal portion for measuring an analyte signal and a proximal portion connected to the distal portion and having a first electrical contact; the electronic assembly comprises an electronic device with a second electric contact, a device shell used for containing the electronic device, and a receiving part formed in the device shell and used for containing the integrally-formed connecting assembly. The integrally-formed connecting assembly comprises a conductive part and a sealing part, during electric connection, the first end part and the second end part of the conductive part are configured to be aligned with the first electric contacts and the second electric contacts with the corresponding number respectively, the sealing part is configured to at least partially surround the conductive part, and the conductive part and the sealing part are integrally formed. According to the sensor control device, the assembling efficiency and the sealing effect of the sensor control device can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of the biomedical industry, and particularly relates to a sensor control device with an integrally formed connection component. Background Art

[0002] Monitoring the glucose concentration or other analyte levels (such as blood ketone concentration or lactic acid concentration, etc.) of some target objects is crucial for their health. For example, for diabetic patients, if they do not monitor their own glucose concentration, there may be some complications due to lack of timely control. Currently, the Continuous Glucose Monitoring (CGM) system has been widely applied in the field of glucose control. The target object can continuously monitor glucose, control glucose, and reduce the occurrence of complications through the CGM system.

[0003] The CGM system or other analyte monitoring systems generally include at least two parts: a sensor component and an electronic component. When in use, the sensor component needs to be placed in the liquid to be measured to collect signals related to the analyte level. For example, in the CGM system, a glucose sensor can be implanted subcutaneously in a host to obtain signals related to the glucose concentration. The electronic component can receive the signals and process and / or transmit the signals. Currently, in the CGM system or other analyte monitoring systems, the sensor component and the electronic component are generally two independent components. When assembling the sensor component and the electronic component, a connection component for connecting the two electronic parts needs to be introduced. The connection component usually includes a conductive part. After separately producing the conductive part and other parts of the connection component, the conductive part needs to be placed into other parts (for example, the conductive part needs to be stuffed into other parts).

[0004] However, the volume of the sensor component generally should not be too large. A too large sensor component is likely to affect the user experience. Correspondingly, the volume of the connection component should also not be too large. In this case, the process of installing the conductive part into other parts is relatively complex. For example, in the CGM system, it is difficult to place neatly a conductive part as small as a rice grain. In the prior art, generally, an automated device or manual assembly is used to assemble the conductive part and other parts. However, such an automated device generally has a very complex structure and high cost, and there is also a problem of placement error. In addition, installing the conductive part into other parts one by one by an automated device or manually is also likely to affect the assembly efficiency, thus limiting the production capacity. In some scenarios with high requirements for the sealing effect, the gap generated when the conductive part is installed into other parts may also affect the sealing effect. Summary of the Invention

[0005] The present disclosure is proposed in view of the above situation, and its purpose is to provide a sensor control device with an integrally formed connection component that can improve the assembly efficiency and sealing effect of the sensor control device.

[0006] To this end, the present disclosure provides a sensor control device with an integrally formed connection component, including: a sensor component, an electronic component, and the integrally formed connection component; the sensor component includes a distal portion for measuring a signal related to the analyte level and a proximal portion connected to the distal portion and having a first electrical contact, and the distal portion is connected to the electronic component through the proximal portion; the electronic component includes an electronic device having a second electrical contact, a device housing for accommodating the electronic device, and a receiving portion formed in the device housing for accommodating the integrally formed connection component; the integrally formed connection component includes a conductive portion and a sealing portion, the conductive portion is configured to provide an electrical connection between the corresponding electrical contacts of the sensor component and the electronic component, wherein, during electrical connection, a first end portion of the conductive portion is configured to be aligned with a corresponding number of the first electrical contacts, a second end portion of the conductive portion is configured to be aligned with a corresponding number of the second electrical contacts, the sealing portion is configured to at least partially surround the conductive portion, and the conductive portion and the sealing portion are integrally formed.

[0007] In the present disclosure, the conductive portion and the sealing portion are integrally formed, which facilitates obtaining the connection component without the need to assemble the conductive portion and the sealing portion, can improve the assembly efficiency of the sensor control device, and thus can improve the production capacity. In addition, the integrally formed manner can also reduce the errors brought by the assembly process, and thus reduce quality problems. In addition, it can also reduce the possibility of using expensive and structurally complex automated equipment to assemble the separately formed conductive portion and sealing portion, and thus can reduce costs. In addition, the conductive portion and the sealing portion are integrally formed and the sealing portion at least partially surrounds the conductive portion, which can improve the sealing effect of the portion surrounded by the sealing portion, thereby reducing or even completely isolating the flow of substances between the two ends of the conductive portion, and is beneficial to forming respective sealed spaces at both ends of the conductive portion.

[0008] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, it further includes a support component for supporting the integrally formed connection component; the receiving portion is a cavity formed by the device housing recessing in the thickness direction of the device housing, and the integrally formed connection component is accommodated in the cavity through the support component so that the proximal portion of the sensor component is electrically connected to the electronic device, or the device housing includes a base and an upper cover combined with the base, the receiving portion is formed on the inner surface of the base, the integrally formed connection component is accommodated in the receiving portion through the support component, and the upper cover is combined with the base so that the proximal portion of the sensor component is electrically connected to the electronic device. In this case, by accommodating the connection component in the cavity, it is possible to facilitate the disassembly of the sensor component from the outside of the electronic component, which is suitable for an integrated electronic component. In addition, by accommodating the connection component in the receiving portion provided on the inner surface of the base, it is possible to facilitate the disassembly of the sensor component when the electronic component is opened, which is suitable for a split-type electronic component.

[0009] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, the sealing portion includes a first seat body, the first seat body at least partially surrounds the conductive portion, and a sealing ring higher than the protruding surface of the conductive portion is provided on the periphery of the first seat body. During electrical connection, the sealing ring provides a waterproof seal for the second electrical contact. In this case, when the sealing ring is used to cooperate with the surface where the second electrical contact is located to form a sealed space, the second electrical contact in the sealed space can reduce or even prevent liquids such as water or moisture from penetrating into the internal space of the electronic component through the second electrical contact, and can extend the service life of the electronic component.

[0010] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, the sealing portion further includes a second seat body, and the first seat body and the second seat body cooperate to enable the sealing portion to be switched between an open state and a closed state. When the sealing portion is in the open state, the sealing portion can receive the proximal portion of the sensor component. When the sealing portion is in the closed state, the proximal portion of the sensor component is located between the first seat body and the second seat body. In this case, by switching the sealing portion between the open state and the closed state, it is possible to facilitate the disassembly of the sensor component and also protect the proximal portion of the sensor component.

[0011] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, when the sealing portion is in the closed state, the sealing ring provides a waterproof seal for the first electrical contact. In this case, when a sealed space is formed by the cooperation of the sealing ring with the surface of the proximal portion supporting the sensor component, the penetration of liquids such as water or moisture into the proximal portion of the sensor component can be reduced or even prevented, and the service life of the sensor component can be extended.

[0012] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, the conductive portion is made of a first material, the sealing portion is made of a second material, the first material includes silica gel and a conductive substance, and the second material is non-conductive silica gel. In this case, both the first material and the second material include silica gel, which can improve the molecular affinity between the surfaces of the conductive portion and the sealing portion, and can improve the finished product effect when the conductive portion and the sealing portion are integrally formed. In addition, silica gel has self-adhesiveness, which can improve the adhesion between the conductive portion and the sealing portion. In addition, when the hardness of silica gel is low, the interfacial tension between the conductive portion and the sealing portion can be reduced, thereby improving the adhesion, and the curing temperatures of the materials are substantially the same, which can reduce the control difficulty of the curing temperature during integral forming.

[0013] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, the sealing portion is made of a non-conductive elastic material. In this case, the sealing portion made of the elastic material has the property of being deformed under pressure, which can improve the tightness of the fit with the relevant contact surfaces of the electronic components, and thus can improve the sealing effect. In addition, the impact force can be dispersed, thereby reducing the impact pressure and further reducing the risk of damage to the components in contact with the sealing portion.

[0014] In addition, in the sensor control device with an integrally formed connection component according to the present disclosure, optionally, the conductive portion is made of a first material, the sealing portion is made of a second material, the first material includes a conductive substance, and the second material is a non-conductive material. In the integral forming, according to the adhesion requirement between the conductive portion and the sealing portion, a vulcanizing agent is added to at least one of the first material and the second material, and the vulcanizing agent is used to increase the molecular affinity of the contact portion between the surface of the conductive portion and the surface of the sealing portion. Thereby, the finished product effect when the conductive portion and the sealing portion are integrally formed can be improved.

[0015] In addition, in the sensor control device with an integrally formed connection component involved in the present disclosure, optionally, the conductive part has a process hole, which is used to cooperate with a mold to fix the conductive part during the integral forming. In this case, the cooperation between the process hole and the mold can fix the conductive part, and thus facilitate the conductive part to reach the position for the next injection molding.

[0016] In addition, in the sensor control device with an integrally formed connection component involved in the present disclosure, optionally, a holding part is formed on the surface of the process hole close to the rear mold of the mold, and the holding part is configured to hold the conductive part on the rear mold when the mold is opened. In this case, on the one hand, it is convenient for the front mold with an injection port to inject glue. On the other hand, it can also reduce the movement of the conductive part relative to the part of the mold at the process hole, and thus further improve the accuracy of the conductive part reaching the position for the next injection molding.

[0017] In addition, in the sensor control device with an integrally formed connection component involved in the present disclosure, optionally, the process hole is a blind hole. In this case, on the one hand, it can reduce the complexity of the mold, and on the other hand, it can achieve integral forming with less change in the shape of the conductive part, which is beneficial to the downward compatibility of the product.

[0018] In addition, in the sensor control device with an integrally formed connection component involved in the present disclosure, optionally, during the integral forming, when the mold faces the first direction, the mold is used to injection-mold the conductive part of the current integrally formed connection component, and when the mold faces the second direction different from the first direction, the mold is used to injection-mold the sealing part of the current integrally formed connection component and the conductive part of the new integrally formed connection component at the same time. In this case, injection-molding the current sealing part and the new conductive part at the same time in the second direction can improve the efficiency of integral forming.

[0019] According to the present disclosure, there is provided a sensor control device with an integrally formed connection component that can improve the assembly efficiency and sealing effect of the sensor control device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present disclosure will now be further explained in detail only by way of examples with reference to the drawings.

[0021] Figure 1 is a schematic diagram showing the monitoring environment of the glucose concentration involved in the examples of the present disclosure.

[0022] Figure 2 is an exemplary block diagram showing the control device involved in the examples of the present disclosure.

[0023] Figure 3AIt is a schematic diagram showing the first perspective of the control device involved in the examples of the present disclosure.

[0024] Figure 3B It is a schematic diagram showing the second perspective of the control device involved in the examples of the present disclosure.

[0025] Figure 3C It is an assembly schematic diagram showing the control device involved in the examples of the present disclosure.

[0026] Figure 4 It is a schematic diagram showing the support connection component of the support component involved in the examples of the present disclosure.

[0027] Figure 5 It is a schematic diagram showing the structure of the proximal part of the sensor component involved in the examples of the present disclosure.

[0028] Figure 6A It is a schematic diagram showing the first state of the connection component involved in the examples of the present disclosure.

[0029] Figure 6B It is a schematic diagram showing one end of the second state of the connection component involved in the examples of the present disclosure.

[0030] Figure 6C It is a schematic diagram showing the other end of the second state of the connection component involved in the examples of the present disclosure.

[0031] Figure 6D It is shown along Figure 6B The sectional schematic diagram of AA' shown in

[0032] Figure 7 It is a schematic diagram showing the sealing principle involved in the examples of the present disclosure.

[0033] Figure 8 It is an exemplary flowchart showing the integral molding process involved in the examples of the present disclosure. Detailed implementation manners

[0034] Hereinafter, with reference to the drawings, the preferred embodiments of the present disclosure will be described in detail. In the following description, the same reference numerals are given to the same components, and repeated descriptions are omitted. In addition, the drawings are only schematic diagrams, and the dimensional ratios between components or the shapes of components may be different from the actual ones. It should be noted that the terms "including" and "having" in the present disclosure and any variations thereof, for example, the processes, methods, systems, products, or devices including or having a series of steps or units do not necessarily have to be limited to those steps or units clearly listed, but may include or have other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0035] As mentioned above, when the connection component provides an electrical connection for two electronic components (such as a sensor component and an electronic component), the assembly of the conductive part and other parts of the connection component is relatively complex. If not assembled correctly, it is likely to affect the effect of the electrical connection. In addition, the gaps generated during the process of assembling the conductive part to other parts may affect the sealing effect. In some scenarios that require sterilization, there are also certain requirements for the connection method of the two electronic components. For example, if the two electronic components are directly welded together, it may not be possible to flexibly select simultaneous sterilization or separate sterilization according to the material characteristics of the electronic components, thus increasing the difficulty of sterilization.

[0036] Through research, the inventors have provided some solutions. The corresponding embodiments can at least solve some of the above problems, thereby improving the assembly efficiency and sealing effect of the device using the connection component (such as a sensor control device). The examples of the present disclosure will be described in detail below.

[0037] A sensor control device according to an example of the present disclosure may include a sensor component and an electronic component. The sensor component can be used to collect signals related to the analyte level (hereinafter simply referred to as analyte signals), and the electronic component can be used to receive the analyte signals and process and / or transmit information related to the analyte signals (hereinafter simply referred to as analyte information) to a receiving device. Hereinafter, the sensor control device will be simply referred to as a control device. In some examples, when using the control device, the electronic component can be located on the surface of the host body, and the sensor component can be at least partially placed under the host skin. In addition, the control device according to the example of the present disclosure can also be referred to as a medical device or an analyte monitoring device, etc.

[0038] A connection component according to an example of the present disclosure can be used to provide an electrical connection between two electronic components. When applied to a control device, the connection component can be used to provide an electrical connection between the sensor component and the electronic component of the control device. In addition, the connection component according to the example of the present disclosure can also be referred to as a connection device or a connection apparatus, etc.

[0039] In some examples, for an integrally formed connection component, it can also be referred to as an integrally formed connection component. When the integrally formed connection component is applied to a control device, the control device can also be referred to as a control device having an integrally formed connection component.

[0040] In some examples, where the analyte is glucose, the sensor component can be a glucose sensor and the analyte level can be the glucose concentration. However, the examples of the present disclosure are not limited to glucose concentration. For example, by changing the sensor component, other body fluid components other than glucose concentration can also be obtained. The body fluid components here can be, for example, one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, chorionic gonadotropin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, hormone, ketone body, lactate, oxygen, peroxide, prostate specific antigen, prothrombin, RNA, thyroid stimulating hormone or troponin.

[0041] For ease of description hereinafter, some examples are described with the analyte being glucose. Accordingly, the analyte level is the glucose concentration. It should be noted that this does not represent a limitation to the present disclosure. Unless there is a contradiction, the relevant descriptions also apply to other analyte levels or other information to be measured.

[0042] Examples of the present disclosure will be described in detail hereinafter with reference to the accompanying drawings. Figure 1 is a schematic diagram showing a monitoring environment of the glucose concentration involved in the examples of the present disclosure.

[0043] Reference Figure 1 , the monitoring environment may include a control device 100 and a receiving device 900. The control device 100 can be configured to obtain analyte information of the host. The receiving device 900 can be configured to receive the analyte information and process and / or display the analyte information.

[0044] In some examples, the control device 100 can be coupled to the receiving device 900. In some examples, the control device 100 can be directly or indirectly communicatively coupled to the receiving device 900. The control device 100 can be communicatively coupled to the receiving device 900 via one or more communication links. For example, the communication link can include at least one of a proprietary wireless protocol, a wired communication link (e.g., serial communication), and a wireless communication link (e.g., Bluetooth). In other examples, the control device 100 can also operate as an independent device and have an integrated receiving device 900 inside itself.

[0045] Figure 2 is an exemplary block diagram showing the control device 100 involved in the examples of the present disclosure.

[0046] Figure 3A is a schematic diagram showing a first perspective of the control device 100 involved in the examples of the present disclosure.

[0047] Figure 3B is a schematic diagram showing a second perspective of the control device 100 involved in the examples of the present disclosure.

[0048] Figure 3C It shows an assembly schematic diagram of the control device 100 involved in the examples of the present disclosure.

[0049] Reference Figure 2 , in some examples, the control device 100 may include a sensor component 110, an electronic component 120, and a connection component 130. The sensor component 110 may be used to measure an analyte signal, the electronic component 120 may be used to receive the analyte signal, and the connection component 130 may be used to provide an electrical connection between the sensor component 110 and the electronic component 120.

[0050] In some examples, at least a part of the sensor component 110 is configured to be implantable subcutaneously in a host, the electronic component 120 is configured to be attachable to the body surface of the host, and at least a part of the sensor component 110 can be electrically connected to the electronic component 120 through the connection component 130.

[0051] In some examples, the sensor component 110 may be detachably assembled to the electronic component 120. In some examples, the sensor component 110 may be electrically connected to the electronic component 120 through the connection component 130.

[0052] In some examples, the connection component 130 may be provided on the electronic component 120. In some examples, the connection component 130 may be detachably assembled to the electronic component 120. In this case, the connection component 130 and the electronic component 120 can be respectively encapsulated before the connection component 130 is assembled to the electronic component 120, thereby facilitating sterilization of the sensor component 110 and the electronic component 120 in different ways.

[0053] In some examples, the connection component 130 may be assembled to a receiving portion 122 (described later) of the electronic component 120.

[0054] In some examples, for the receiving portion 122 located outside the electronic component 120, the connection component 130 may be assembled to the electronic component 120 through a cavity outside the electronic component 120. In some examples, the connection component 130 may be received in the cavity to electrically connect the sensor component 110 and the electronic component 120. In this case, it is convenient to disassemble the sensor component 110 from outside the electronic component 120, which is applicable to an integrated electronic component 120.

[0055] In some examples, for the receiving portion 122 located inside the electronic component 120, the connection component 130 can be assembled to the electronic component 120 through the accommodating cavity located inside the electronic component 120. In some examples, the connection component 130 can be accommodated in the accommodating cavity, and the sensor component 110 is electrically connected to the electronic component 120 when the electronic component 120 is closed. In this case, it is easy to disassemble the sensor component 110 when the electronic component 120 is opened, which is suitable for a split electronic component 120.

[0056] In some examples, the control device 100 may further include a support assembly 140 (described later), and the connection assembly 130 may be accommodated in the electronic assembly 120 through the support assembly 140, thereby ultimately achieving electrical connection between the sensor assembly 110 and the electronic assembly 120. For example, the connection assembly 130 may be accommodated in the receiving portion 122 (described later) through the support assembly 140.

[0057] To this end, the example of the present disclosure also provides an example of assembling the support component 140 through the concave cavity outside the electronic component 120. It should be noted that it is also applicable to the assembly of other components that play a connecting role. Figure 3A , Figure 3B and Figure 3C , is a schematic diagram showing that the support component 140 is accommodated by a cavity outside the electronic component 120. Figure 3A and Figure 3B 1 is a diagram showing different perspectives of the assembled control device 100. Figure 3C is a schematic diagram showing that the sensor component 110 can be mounted in a cavity outside the electronic component 120 via the support component 140 .

[0058] refer to Figure 3A In some examples, the electronic component 120 may include a coupling hole 121 extending from the upper surface to the lower surface, and when the sensor component 110 is assembled to the electronic component 120, the axis of the sensor component 110 may pass through the coupling hole 121. In this case, the puncture member is inserted into the subcutaneous tissue through the coupling hole 121, thereby facilitating the placement of the sensor component 110 under the skin.

[0059] refer to Figure 3B In some examples, the support assembly 140 can be used to support the connection assembly 130. In some examples, the connection assembly 130 can be detachably mounted on the electronic assembly 120 through the support assembly 140. Specifically, the connection assembly 130 can be detachably mounted on the support assembly 140, and the support assembly 140 can be detachably mounted on the electronic assembly 120. It should be noted that if the support assembly 140 is not provided, the connection assembly 130 can also be directly mounted at the corresponding position. In some examples, the support assembly 140 can at least partially surround the bottom of the connection assembly 130.

[0060] In some examples, the hardness of the support component 140 can be greater than the hardness of the connection component 130. In this case, when the connection component 130 achieves the effects of some low-hardness materials (such as waterproof sealing), the support component 140 can protect the connection component 130.

[0061] Reference Figure 3C , in some examples, the support component 140 can be received in the receiving portion 122 of the control device 100. In some examples, the connection component 130 can be received in the receiving portion 122 of the control device 100 through the support component 140.

[0062] Figure 4 is a schematic diagram showing the support component 140 supporting the connection component 130 involved in the examples of the present disclosure.

[0063] Reference Figure 4 , the connection component 130 can be disposed on the support component 140. The connection component 130 disposed on the support component 140 can be received in the receiving portion 122 of the control device 100 through the support component 140.

[0064] In some examples, the connection component 130 can be fixed and supported by cooperating with a holding member ( Figure 4 not shown in the figure) protruding from the surface of the support component 140.

[0065] In some examples, the support component 140 can have a mating hole 141, and the axis of the sensor component 110 can pass through the mating hole 141. In some examples, for the case of assembling the connection component 130 in the accommodation cavity inside the electronic component 120, the support component 140 may not need to be provided with the mating hole 141 either. For example, a mating hole can be provided at the position where the axis of the sensor component 110 passes through in the housing of the electronic component 120, so that the axis of the sensor component 110 can pass through the mating hole.

[0066] In some examples, when the support component 140 is embedded in the receiving portion 122, the mating hole 121 of the electronic component 120 and the mating hole 141 of the support component 140 can communicate with each other. That is, when the connection component 130 is disposed on the support component 140 and the support component 140 is embedded in the electronic component 120, the axis of the distal portion of the sensor component 110 can pass through the mating hole 121 of the electronic component 120 and the mating hole 141 of the support component 140 (see Figure 3A , Figure 3B and Figure 3C ).

[0067] Reference Figure 4, in some examples, the support component 140 may further include a structure capable of being fixedly connected to the electronic component 120. In some examples, the support component 140 may further include engaging portions 142 provided on all sides. Additionally, the receiving portion 122 of the electronic component 120 may also be formed in a shape matching the support component 140 to be adapted to receive the support component 140.

[0068] Figure 5 is a schematic structural diagram showing the proximal portion 111 of the sensor component 110 involved in the examples of the present disclosure.

[0069] As described above, the sensor component 110 can be used to measure analyte signals. In some examples, the sensor component 110 may include a distal portion and a proximal portion 111 (described later). The distal portion can be used to measure analyte signals, and the proximal portion 111 can be used to receive analyte signals. Additionally, the proximal portion 111 can be connected to the distal portion. Thereby, analyte signals can be received at the proximal portion 111. In some examples, the connection between the proximal portion 111 and the distal portion can be an electrical connection.

[0070] In some examples, the distal portion can be connected to the electronic component 120 through the proximal portion 111. In some examples, the distal portion can be placed subcutaneously in a host and connected to the electronic component 120 through the proximal portion 111. In this case, by placing the distal portion subcutaneously in the host and connecting the distal portion to the electronic component 120 through the proximal portion 111, it is possible to facilitate the transmission of the acquired analyte information to the receiving device 900.

[0071] In some examples, the distal portion may include a plurality of electrodes. In some examples, the plurality of electrodes may include a working electrode and a counter electrode. In some examples, for a glucose sensor, a sensing layer including glucose enzyme may be provided on the working electrode. The distal portion placed subcutaneously can undergo an oxidation-reduction reaction with glucose in the body fluid through the glucose enzyme on the working electrode and form a circuit with the counter electrode to generate a current signal (i.e., one of the analyte signals). In some examples, glucose concentration information can be obtained by processing the current signal.

[0072] In some examples, the plurality of electrodes of the distal portion may further include a reference electrode. In some examples, the reference electrode can form a known and fixed potential difference with the body fluid. In this case, the potential difference between the working electrode and the body fluid can be measured by the potential difference formed by the reference electrode and the working electrode. Thereby, the voltage generated by the working electrode can be obtained more accurately.

[0073] As described above, in some examples, the distal portion can be connected to the electronic component 120 through the proximal portion 111. Refer to Figure 5, in some examples, the proximal portion 111 may have a first electrical contact 1111, and the first electrical contact 1111 may be used to connect to the electronic component 120. In some examples, the proximal portion 111 may be connected to the electronic component 120 through a connection component 130.

[0074] In some examples, the shape of the first electrical contact 1111 of the proximal portion 111 may be disc-shaped. In this case, the contact area between the first electrical contact 1111 and the conductive portion 131 (described later) can be increased, and thus the reliability of the electrical connection can be improved.

[0075] As described above, in some examples, the electronic component 120 may receive the analyte signal measured by the sensor component 110. In some examples, the electronic component 120 may include an electronic device. The electronic device may be disposed inside the electronic component 120. The electronic device may receive the analyte signal measured by the sensor component 110. In some examples, the electronic device may further process the analyte signal. In other examples, the electronic device may also transmit the received analyte signal to the receiving device 900.

[0076] In some examples, the electronic device may have a second electrical contact. The second electrical contact may be used to connect to the sensor component 110. In some examples, the second electrical contact may be used to connect to the first electrical contact 1111 of the sensor component 110. In some examples, the electronic device may be a PCB (Printed Circuit Board).

[0077] In some examples, the electronic component 120 may include a receiving portion 122, and the receiving portion 122 may be used to accommodate the connection component 130. In some examples, the receiving portion 122 may be a cavity outside the electronic component 120 (see Figure 3C ). In some examples, the receiving portion 122 may be a receiving cavity inside the electronic component 120.

[0078] Return reference Figure 3C , in some examples, the electronic component 120 may further include a device housing 123. The device housing 123 may be used to accommodate the electronic device. That is, the electronic device may be disposed inside the device housing 123.

[0079] In some examples, the receiving portion 122 may be formed on the device housing 123. In some examples, the receiving portion 122 may be a cavity formed on the device housing 123. In some examples, the cavity may be recessed in the thickness direction of the device housing 123 (see Figure 3C ).

[0080] In some examples, the receiving portion 122 may be a receiving cavity provided within the device housing 123. In some examples, the receiving cavity may be provided on the lower surface within the device housing 123. In some examples, the device housing 123 may include a base and an upper cover combined with the base, and the receiving portion 122 may be formed on the inner surface of the base. In some examples, for the receiving cavity provided within the device housing 123, the connection component 130 is received within the receiving portion 122 and the upper cover is combined with the base (i.e., the electronic component 120 is closed) to electrically connect the sensor component 110 and the electronic component 120. That is, when the connection component 130 is received within the receiving portion 122 and the upper cover is combined with the base, the sensor component 110 and the electronic component 120 can be electrically connected.

[0081] Figure 6A is a schematic diagram showing the first state of the connection component 130 involved in the examples of the present disclosure. Figure 6B is a schematic diagram showing one end of the second state of the connection component 130 involved in the examples of the present disclosure. Figure 6C is a schematic diagram showing the other end of the second state of the connection component 130 involved in the examples of the present disclosure. Figure 6D is shown along Figure 6B the cross-sectional schematic diagram of AA' shown in

[0082] As described above, in some examples, the connection component 130 can be used to provide an electrical connection between the sensor component 110 and the electronic component 120. In some examples, the connection component 130 can be used to provide an electrical connection between the proximal portion 111 of the sensor component 110 and the electronic device of the electronic component 120. It should be noted that the above descriptions regarding the electrical connection between the sensor component 110 and the electronic component 120 also apply to the electrical connection between the proximal portion 111 of the sensor component 110 and the electronic device of the electronic component 120.

[0083] Refer to Figure 6A 、 Figure 6B and Figure 6C , in some examples, the connection component 130 may include a conductive portion 131 and a sealing portion 132. The conductive portion 131 can achieve the electrical connection between the sensor component 110 and the electronic component 120, and the sealing portion 132 can achieve the waterproof sealing of the portions of the conductive portion 131 that do not require electrical connection. In some examples, the sealing portion 132 can also achieve the electrical insulation of the portions of the conductive portion 131 that do not require electrical connection.

[0084] In some examples, the conductive portion 131 may be configured to provide an electrical connection between the corresponding electrical contacts of the sensor component 110 and the electronic component 120. In some examples, the conductive portion 131 may have an end portion 1311 protruding from the surface of the sealing portion 132 (see Figure 6B and Figure 6C)。

[0085] Reference Figure 6B , in some examples, the end portion 1311 may include a first end portion 1311a. Reference Figure 6C , in some examples, the end portion 1311 may further include a second end portion 1311b. In some examples, when the sensor assembly 110 and the electronic assembly 120 are electrically connected, the first end portion 1311a of the conductive portion 131 may be configured to align with a corresponding number of first electrical contacts 1111, and the second end portion 1311b of the conductive portion 131 may be configured to align with a corresponding number of second electrical contacts.

[0086] In some examples, for the conductive portion 131 made of an elastic material, the end portion 1311 of the conductive portion 131 may be higher than the sealing ring 1321a (described later). In this case, when the sealing portion 132 is in a compressed state, the conductive portion 131 is deformed under pressure, which can improve the tightness of the fit between the end portion 1311 of the conductive portion 131 and the electronic component, and thus can improve the reliability of the electrical connection.

[0087] In addition, the number of the conductive portions 131 may be multiple. For example, the number of the conductive portions 131 may be 2, 3, or 4. In Figure 6A the illustrated embodiment, the number of the conductive portions 131 is 3. However, the examples of this embodiment are not limited thereto, and the number of the conductive portions 131 may be the same as the number of the electrodes of the sensor assembly 110.

[0088] In some examples, the conductive portion 131 may be columnar. That is, the conductive portion 131 may be a conductive column. One end of the conductive column may be connected to the first electrical contact 1111, and the other end of the conductive column may be connected to the second electrical contact.

[0089] As described above, the connection assembly 130 may include a sealing portion 132. Reference Figure 6D , in some examples, the sealing portion 132 may be configured to at least partially surround the conductive portion 131. In some examples, the sealing portion 132 at least partially surrounding the conductive portion 131 can achieve a waterproof seal. In some examples, the sealing portion 132 at least partially surrounding the conductive portion 131 can achieve a waterproof seal and electrical insulation. Specifically, the sealing portion 132 may surround the portion of the conductive portion 131 that does not need to achieve electrical connection to provide a waterproof seal or provide a waterproof seal and electrical insulation.

[0090] Reference Figure 6A , in some examples, the sealing portion 132 may include a first seat body 1321, and the first seat body 1321 may at least partially surround the conductive portion 131. Reference Figure 6B and Figure 6C, in some examples, the first housing 1321 can at least partially surround the conductive part 131 to expose the ends 1311 (i.e., the first end 1311a and the second end 1311b) of the conductive part 131, so that the conductive part 131 provides a third electrical contact and a fourth electrical contact at the first end 1311a and the second end 1311b respectively. The third electrical contact can be connected to the first electrical contact 1111, and the fourth electrical contact can be connected to the second electrical contact. That is, referring to Figure 6A , the conductive part 131 can protrude from the surface of the first housing 1321.

[0091] Referring to Figure 6A , in some examples, the periphery of the first housing 1321 can have a sealing ring 1321a that is higher than the surface from which the conductive part 131 protrudes. That is, there is a raised fence around the outer circle of the first housing 1321. In some examples, two sealing rings 1321a can be respectively arranged at both ends of the first housing 1321. Thus, waterproof seals can be provided for the corresponding electronic components at both ends respectively.

[0092] In some examples, when the sensor assembly 110 is electrically connected to the electronic assembly 120, the first housing 1321 with the sealing ring 1321a can provide a waterproof seal for the second electrical contact. In this case, when the sealing ring 1321a is used to cooperate with the surface where the second electrical contact is located to form a sealed space, the second electrical contact in the sealed space can reduce or even prevent liquids such as water or moisture from penetrating into the internal space of the electronic assembly 120 through the second electrical contact, and the service life of the electronic assembly 120 can be extended. In some examples, for the first housing 1321 with the sealing ring 1321a, when cooperating with other components, a waterproof seal can also be provided for the first electrical contact 1111. Specifically, the first housing 1321 can have a sealing ring 1321a at the proximal part 111 side close to the sensor assembly 110. The other components can be any components that support the sensor assembly 110 and do not contact the conductive part 131. For example, the other components can be the second housing 1322 described later.

[0093] Figure 7 is a schematic diagram showing the sealing principle involved in the examples of the present disclosure. It should be noted that Figure 7 the components or electronic components in

[0094] Referring to Figure 7When the sealing part 132 is pressed against other components, that is, when the sealing part 132 is in a compressed state, the two ends of the first base body 1321 can be respectively attached to the first surface 211 and the second surface 212, and the sealing rings 1321a at the two ends of the first base body 1321 can be respectively attached to the first surface 211 and the second surface 212, thereby forming sealed spaces at the two ends to provide waterproof sealing for the electronic components in the sealed space. For example, the sealed space can provide waterproof sealing for the first contact 213 of an electronic component in the sealed space, the second contact 214 of another electronic component, and the portion of the conductive part 131 exposed from the first base body 1321.

[0095] In some examples, for the connecting component 130 applied to the control device 100, the first surface 211 can be a surface of the electronic component 120 on which the second electrical contact is provided, the second surface 212 can be a surface of the proximal portion 111 supporting the sensor component 110 (for example, the surface of the second seat body 1322), the first contact 213 can be the second electrical contact of the electronic component 120, and the second contact 214 can be the first electrical contact 1111 of the sensor component 110.

[0096] In addition, the portion of the sealing portion 132 surrounding the conductive portion 131 may provide a waterproof seal for the conductive portion 131 or provide a waterproof seal and electrical insulation.

[0097] Return to reference Figure 6A , Figure 6B and Figure 6C In some examples, the sealing portion 132 may further include a second seat body 1322. In some examples, the first seat body 1321 and the second seat body 1322 may provide a receiving space for the proximal portion 111 of the sensor assembly 110. In some examples, the first seat body 1321 and the second seat body 1322 may cooperate to enable the sealing portion 132 to switch between an open state and a closed state. Figure 6A and Figure 6B ,in, Figure 6A The first state shown is the closed state, Figure 6B The second state shown is an example of an open state.

[0098] In some examples, when the sealing portion 132 is in the open state, the sealing portion 132 can receive the proximal portion 111 of the sensor assembly 110, and when the sealing portion 132 is in the closed state, the proximal portion 111 of the sensor assembly 110 can be located between the first seat body 1321 and the second seat body 1322. In this case, by switching the sealing portion 132 between the open state and the closed state, the sensor assembly 110 can be easily disassembled, and the proximal portion 111 of the sensor assembly 110 can also be protected.

[0099] Specifically, after separately manufacturing the connection component 130 and the sensor component 110, when the sealing portion 132 of the connection component 130 is in an open state, the sensor component 110 can be assembled into the sealing portion 132, and the sealing portion 132 can be closed to hold the sensor component 110.

[0100] As described above, in some examples, the second housing 1322 can protect the proximal portion 111 of the sensor component 110. In some examples, when the sealing portion 132 is made of an elastic material (i.e., when the second housing 1322 is made of an elastic material), the second housing 1322 can disperse the impact force, thereby reducing the impact pressure, and further reducing the risk of damage to the proximal portion 111 of the sensor component 110.

[0101] As described above, in some examples, for the first housing 1321 having the sealing ring 1321a, when cooperating with other components, it can also provide a waterproof seal for the first electrical contact 1111. In some examples, for the first housing 1321 having the sealing ring 1321a and the other component being the second housing 1322, when the sealing portion 132 is in a closed state, the sealing ring 1321a can provide a waterproof seal for the first electrical contact 1111. That is, the first housing 1321 having the sealing ring 1321a and the second housing 1322 can cooperate to provide a waterproof seal for the first electrical contact 1111. In this case, when forming a sealed space by mating the sealing ring 1321a with the surface supporting the proximal portion 111 of the sensor component 110, it is possible to reduce or even prevent the penetration of liquids such as water or moisture into the proximal portion 111 of the sensor component 110, and the service life of the sensor component 110 can be extended.

[0102] Continue to refer to Figure 6B , in some examples, the sealing portion 132 may further include a housing connection portion 1323, and the housing connection portion 1323 can be used to connect the first housing 1321 and the second housing 1322. In some examples, the number of the housing connection portions 1323 can be one or more. For example, the number of the housing connection portions 1323 can be two or three. The overall axis of one or more housing connection portions 1323 can be located on the axis of the sealing portion 132. Thereby, the convenience of switching the sealing portion 132 between the open state and the closed state can be improved.

[0103] In some examples, the sealing portion 132 further includes an extension portion, and the extension portion can extend outward along the side wall of the sealing portion 132 close to the proximal portion 111 of the sensor component 110. In some examples, the extension portion has a through hole, and the through hole can be used to cooperate with the protrusion of the fixing component to fixedly connect the connection component 130. Additionally, the fixing component can be a component (such as the support component 140) that can enable the connection component 130 to be disposed on the electronic component 120.

[0104] In some examples, for the sealing portion 132 having the first seat body 1321, the extending portion may include a first extending portion, and the first extending portion may extend outward along the side wall of the proximal portion 111 of the first seat body 1321 close to the sensor assembly 110.

[0105] In some examples, for the sealing portion 132 having the second seat body 1322, the extending portion may include a second extending portion, and the second extending portion may extend outward along the side wall of the proximal portion 111 of the second seat body 1322 close to the sensor assembly 110.

[0106] In some examples, when fixing the connection assembly 130, the protrusion of the fixing component may sequentially pass through the through holes of the second extending portion and the through holes of the first extending portion. Thus, the sealing effect of the proximal portion 111 of the sealed sensor assembly 110 can be improved.

[0107] In addition, the sealing portion 132 and the conductive portion 131 may be made of different materials. Specifically, the conductive portion 131 may be made of a first material, and the sealing portion 132 may be made of a second material, and the first material is different from the second material.

[0108] In some examples, the first material may include a conductive substance. In some examples, the first material may include a conductive substance and be an elastic material. In some examples, the first material may include silicone and a conductive substance. In this case, while enabling the conductive portion 131 to provide a conductive function, the risk of damaging the electronic components when the conductive portion 131 is connected to the electronic components can be reduced to protect the electronic components, and the closer the connection to the electronic components, the further the sealing effect can be improved. In some examples, the first material may be made by adding a conductive substance to silicone. In some examples, the conductive substance may be silver powder or graphite.

[0109] In some examples, the second material may be a non-conductive material. In some examples, the second material may be a non-conductive elastic material. That is, the sealing portion 132 may be made of a non-conductive elastic material. In this case, the sealing portion 132 made of the elastic material has the property of being deformed under pressure, which can improve the tightness of the contact surface with the relevant electronic components, and thus can improve the sealing effect. In addition, the impact force can be dispersed, thereby reducing the impact pressure, and further reducing the risk of damage to the components in contact with the sealing portion 132.

[0110] In some examples, the second material may be non-conductive silicone. In this case, when the first material includes silicone and a conductive substance, the second material being silicone can improve the molecular affinity between the surface of the conductive portion 131 and the sealing portion 132, and improve the finished product effect when the conductive portion 131 and the sealing portion 132 are integrally formed. In addition, silicone has self-adhesiveness, which can improve the adhesion between the conductive portion 131 and the sealing portion 132. In addition, when the hardness of the silicone is low, the interfacial tension between the conductive portion 131 and the sealing portion 132 can be reduced, thereby improving the adhesion. In addition, both the first material and the second material include silicone, and the curing temperatures of the materials are approximately the same (for example, the curing temperature can be between 120° and 150°), which can reduce the difficulty of controlling the curing temperature during integral forming.

[0111] In some examples, the second material may be transparent silicone.

[0112] In some examples, the second material may be silicone with a Shore A hardness of 10 degrees to 60 degrees. For example, the Shore A hardness can be 10 degrees, 20 degrees, 30 degrees, 40 degrees, 50 degrees, or 60 degrees, etc. Preferably, the second material may be silicone with a Shore A hardness of 20 degrees. In this case, the sealing portion 132 can be prevented from being too soft or too hard, thereby further improving the waterproof sealing performance of the sealing portion 132 for electronic components.

[0113] In some examples, the conductive portion 131 and the sealing portion 132 can be integrally formed. That is, the connecting component 130 can be integrally formed. In other words, when the connecting component 130 is taken out of the mold, the conductive portion 131 and the sealing portion 132 can be formed together. In this case, the integral forming of the conductive portion 131 and the sealing portion 132 facilitates obtaining the connecting component 130 without the need for assembling the conductive portion 131 and the sealing portion 132, which can improve the assembly efficiency of the device using the connecting component 130 (such as the control device 100), and thus can improve the production capacity. In addition, the integral forming method can also reduce the errors caused by the assembly process, thereby reducing quality problems. In addition, it can also reduce the possibility of using expensive and structurally complex automated equipment to assemble the separately manufactured conductive portion 131 and the sealing portion 132, and thus can reduce costs.

[0114] In addition, when the conductive portion 131 and the sealing portion 132 are integrally formed and the sealing portion 132 at least partially surrounds the conductive portion 131, the sealing effect of the portion surrounded by the sealing portion 132 can also be improved, thereby reducing or even completely isolating the flow of substances (such as water) between the two ends of the conductive portion 131, which is beneficial to forming respective sealed spaces at the two ends of the conductive portion 131.

[0115] In addition, the connection component 130 involved in the examples of the present disclosure may also be referred to as an integrally formed connection component when integrally formed. In addition, the control device 100 using the integrally formed connection component may also be referred to as a control device having an integrally formed connection component.

[0116] In some examples, in the integrally formed connection component, the conductive part 131 and the sealing part 132 may be inseparable. That is, after the injection molding is completed, the conductive part 131 and the sealing part 132 are inseparable.

[0117] As described above, in some examples, the sealing part 132 may include the first seat body 1321, the sealing part 132 may include the first seat body 1321 and the second seat body 1322, or the sealing part 132 may include the first seat body 1321, the second seat body 1322 and the seat body connection part 1323. Accordingly, these parts included in the sealing part 132 and the conductive part 131 may be integrally formed. For this reason, the examples of the present disclosure also provide some examples related to integral forming.

[0118] In some examples, for the integrally formed connection component, at least the cross-sectional size of a section of the conductive part 131 surrounded by the sealing part 132 may be the same. Thus, the complexity of the mold can be reduced. In addition, compared with when individual components are manufactured and then assembled, generally, the middle part of the conductive part 131 needs to have the largest cross-section to limit the movement of the conductive part 131, the structure of the conductive part 131 can be simplified.

[0119] In addition, any method can be adopted to integrally form the conductive part 131 and the sealing part 132. For example, the sealing part 132 can be first injection molded, and then the conductive part 131 can be injection molded into the space reserved for the conductive part 131 in the sealing part 132. Another example is that the conductive part 131 can be first injection molded, and then the sealing part 132 can be injection molded around the conductive part 131.

[0120] However, the volume of some conductive parts 131 is small, and how to form the conductive part 131 at a specified position is also a problem that needs to be considered. The inventor found through research that providing a process hole 1312 in the conductive part 131 (see Figure 6B and Figure 6D ) can solve the above problems. If following conventional or traditional ideas, the conductive part 131 generally needs to be designed as solid, and it would not be thought of to provide a process hole 1312 in the conductive part 131.

[0121] Specifically, the process hole 1312 can be used to cooperate with the mold to fix the conductive part 131. For example, a fixing device protruding from the surface of the rear mold can be provided on the rear mold of the mold, and the fixing device can cooperate with the process hole 1312 to fix the conductive part 131. In some examples, the fixing device can be in a strip shape. Thus, the stability of fixing the conductive part 131 can be improved.

[0122] Some examples of the process holes 1312 are provided below. It should be noted that this does not represent a limitation to the present disclosure, and other methods can be adopted to achieve integral molding as needed.

[0123] Return reference Figure 6D , in some examples, the conductive part 131 may have process holes 1312. In this case, the process holes 1312 can cooperate with the mold to fix the conductive part 131, and thus facilitate the conductive part 131 to reach the position for the next injection molding. For example, fixing the conductive part 131 through the process holes 1312 can conveniently send the conductive part 131 to the position for the next injection molding through the mechanical movement of the mold. In addition, for the conductive part 131 provided with process holes 1312, the hollow structure can better buffer the pressure in the hollow area, and thus can reduce the risk of damage to the conductive part 131 due to pressure and can withstand higher pressure, which is also beneficial to improving the sealing effect.

[0124] In some examples, the process holes 1312 may be located at the first end 1311a and / or the second end 1311b of the conductive part 131. That is, the contact points with the mold can be at least one end 1311 of the conductive part 131. In this case, by using the part of the conductive part 131 protruding from the sealing part 132 to set the process holes 1312, it is convenient to form the sealing part 132 around the conductive part 131 (for example, convenient for overmolding), and thus can reduce the complexity of the mold. For example, setting the process holes 1312 at other positions of the conductive part 131 may increase the difficulty of mold implementation. In addition, the process holes 1312 located at the first end 1311a or the second end 1311b can improve the accuracy of making the conductive part 131 reach the position for the next injection molding.

[0125] In addition, the process holes 1312 located at the first end 1311a or the second end 1311b can be easily realized without changing or with less change in the outer shape of the conductive part 131. In this case, the risk caused by excessive adjustment of the shape of the conductive part 131 can be reduced, and the risk of downward compatibility with other components cooperating with the conductive part 131 to reduce the need to synchronously adjust the structures of other components can be reduced. For products related to the connection component 130 where the production environment is ready or some versions have been released, this can greatly reduce the verification cost or other costs (such as the cost caused by adjusting the structures of other components).

[0126] In addition, in various examples of the present disclosure, downward compatibility may mean that after the connection component 130 is updated to an integral molding connection component, with the original electronic components (such as the original sensor component 110 or electronic component 120), the integral molding connection component can still provide normal electrical connection.

[0127] In addition, the process hole 1312 located at the first end 1311a or the second end 1311b can facilitate the acquisition of the integrally formed connection component 130 without affecting the conductive function of the conductive part 131 itself. As described above, according to conventional or traditional ideas, holes would not be designed for conduction, and thus it would not be thought to provide the process hole 1312 at the first end 1311a or the second end 1311b.

[0128] In addition, compared with the case where the process hole 1312 is not provided, it is beneficial to increase the contact range with the electronic component while the area of the end 1311 remains unchanged. When the end 1311 is connected to the electronic component, on the one hand, the increased contact range can reduce the force exerted by the end 1311 on the electronic component, thereby further protecting the electronic component; on the other hand, it can increase the probability of contact with the electronic component, thereby improving the reliability of the electrical connection.

[0129] In some examples, when using the connection component 130 to connect electronic components with relatively low current intensity requirements, the proportion of the conductive substance in the conductive part 131 can be unchanged or slightly changed. For example, through research and verification, the inventor found that for the CGM system, a weak current between the sensor component 110 and the electronic component 120 can transmit the analyte signal. It is set that with the process hole 1312 compared to without the process hole 1312, the requirement of transmitting the analyte signal can be met without changing the proportion of the conductive substance in the conductive part 131.

[0130] In some examples, when using the connection component 130 to connect electronic components with relatively high current intensity requirements, the conductivity can be increased by adding conductive substances to offset the slight change in current caused by the process hole 1312.

[0131] In some examples, the diameter of one end 1311 provided with the process hole 1312 can be larger than the diameter of the other end 1311 without the process hole 1312.

[0132] As described above, the process hole 1312 can be located at the first end 1311a and / or the second end 1311b. Preferably, the process hole 1312 can be located at the first end 1311a. In this case, compared with the case where the process hole 1312 is not provided, when the first end 1311a is connected to the sensor component 110, the contact range with the sensor component 110 can be increased, thereby reducing the force exerted by the first end 1311a on the sensor component 110, and thus further protecting the sensor component 110.

[0133] Reference Figure 6D, in some examples, a holding portion 1312a may be formed on the surface of the process hole 1312, and the holding portion 1312a is configured to hold the conductive portion 131 when the mold is opened. In some examples, the holding portion 1312a may be formed on the surface of the process hole 1312 near the rear mold of the mold, and the holding portion 1312a may be configured to hold the conductive portion 131 on the rear mold when the mold is opened. In this case, on the one hand, it is convenient for the front mold with the injection port to inject glue. On the other hand, it can also reduce the movement of the conductive portion 131 relative to the part of the mold in the process hole 1312, and further improve the accuracy of the conductive portion 131 reaching the next injection position.

[0134] In some examples, the process hole 1312 may be a through hole or a blind hole. Preferably, the process hole 1312 may be a blind hole. In this case, on the one hand, the complexity of the mold can be reduced, and on the other hand, integral molding can be achieved with less change in the shape of the conductive portion 131, which is beneficial to the downward compatibility of the product.

[0135] In some examples, the shape of the process hole 1312 may be one of a circle, an ellipse, a square, and a semi - circle. Preferably, the shape of the process hole 1312 may be a circle. In this case, while playing the role of fixing the conductive portion 131, when the conductive portion 131 is connected to the electronic component, the force acting on the electronic component is more uniform, so that the electronic component can be better protected.

[0136] As described above, in some examples, the shape of the first electrical contact 1111 of the proximal portion 111 may be disk - shaped. For the conductive portion 131 having the process hole 1312, when electrically connected, the ring corresponding to the process hole 1312 can be pressed on the disk - shaped first electrical contact 1111. In this case, the fitting degree of the assembly of the connection component 130 and the sensor component 110 can be improved, and thus the reliability of the electrical connection can be improved.

[0137] Figure 8 is an exemplary flowchart showing the integral molding process involved in the examples of the present disclosure.

[0138] In addition, the examples of the present disclosure also provide an example of an integral molding process. Specifically, the process may include injection - molding the conductive portion 131 of the current connection component 130 in a first direction (step S101) and injection - molding the sealing portion 132 of the current connection component 130 and the conductive portion 131 of a new connection component 130 simultaneously in a second direction (step S102). In this case, injecting the current sealing portion 132 and the new conductive portion 131 simultaneously in the second direction can improve the efficiency of integral molding.

[0139] Refer to Figure 8, in some examples, in step S101, when the mold faces the first direction, the mold can be used to perform injection molding on the conductive part 131 of the current connection component 130.

[0140] In some examples, when using the mold to perform injection molding on the conductive part 131 of the current connection component 130, a part of the mold (such as a fixing device) can be located in the process hole 1312 of the conductive part 131. Thus, a part of the mold can fix the conductive part 131 during the molding process or when the conductive part 131 is being molded.

[0141] Continue to refer to Figure 8 , in some examples, in step S102, when the mold faces the second direction, the mold can be used to simultaneously perform injection molding on the sealing part 132 of the current connection component 130 and the conductive part 131 of a new connection component 130.

[0142] As described above, in some examples, the process hole 1312 can be formed with a holding part 1312a. When the mold faces the second direction, the holding part 1312a can hold the conductive part 131 in the rear mold of the mold. In this case, on the one hand, it is convenient to inject glue in the front mold with an injection port. On the other hand, it can also reduce the movement of the conductive part 131 relative to the part of the mold in the process hole 1312, and thus improve the accuracy of the conductive part 131 reaching the injection position corresponding to the second direction.

[0143] In addition, the first direction can be different from the second direction. In some examples, the first direction and the second direction can differ by a preset angle. Additionally, the preset angle can be determined by the injection molding machine used. For example, the preset angle can be 90° or 180°.

[0144] Taking the preset angle of 180° as an example, a set of molds can have a turntable. After the injection molding of the conductive part 131 of the current connection component 130 is completed, the turntable can be rotated 180° to transfer the conductive part 131 of the current connection component 130 held in the rear mold to another position to complete the injection molding of the sealing part 132 (for example, the current rear mold can be matched to another mold cavity to complete the injection molding of the sealing part 132), while the original position continues to inject the conductive part 131 of a new connection component 130.

[0145] In some examples, the integral molding of the connection component 130 can be achieved through a two-color injection molding process.

[0146] In some examples, in integral molding, a vulcanizing agent can be added to at least one of the first material and the second material according to the adhesion requirement between the conductive part 131 and the sealing part 132. Preferably, a vulcanizing agent is added to the material of the post-injected component. Thereby, the adhesion can be improved. For example, if the conductive part 131 is injection-molded first and then the sealing part 132 is injection-molded, a vulcanizing agent can be added to the second material. Additionally, the adhesion requirement can be such that the conductive part 131 and the sealing part 132 are inseparable. In some examples, experiments can be conducted to determine the amount of the vulcanizing agent that meets the adhesion requirement. In some examples, for scenarios with lower requirements for the sealing effect, the adhesion requirement can also be relatively reduced compared to making the conductive part 131 and the sealing part 132 inseparable.

[0147] In addition, the vulcanizing agent can be used to increase the molecular affinity of the contact part between the surface of the conductive part 131 and the surface of the sealing part 132. Thereby, the finished product effect when the conductive part 131 and the sealing part 132 are integrally molded can be improved. In some examples, the vulcanizing agent can be a platinum vulcanizing agent.

[0148] Although the present disclosure has been specifically described above in conjunction with the accompanying drawings and examples, it can be understood that the above description does not limit the present disclosure in any form. Those skilled in the art can make deformations and changes to the present disclosure as needed without departing from the essence and scope of the present disclosure, and these deformations and changes all fall within the scope of the present disclosure.

Claims

1. A sensor control device with an integrally formed connection component, characterized in that, Comprising: A sensor assembly, an electronic assembly, and the integrally formed connection assembly; the sensor assembly includes a distal portion for measuring a signal related to the analyte level and a proximal portion connected to the distal portion and having a first electrical contact, and the distal portion is connected to the electronic assembly through the proximal portion; the electronic assembly includes an electronic device having a second electrical contact, a device housing for accommodating the electronic device, and a receiving portion formed in the device housing for accommodating the integrally formed connection assembly; the integrally formed connection assembly includes a conductive portion and a sealing portion, the conductive portion is configured to provide an electrical connection between the corresponding electrical contacts of the sensor assembly and the electronic assembly, wherein, during electrical connection, a first end portion of the conductive portion is configured to be aligned with a corresponding number of the first electrical contacts, a second end portion of the conductive portion is configured to be aligned with a corresponding number of the second electrical contacts, the sealing portion is configured to at least partially surround the conductive portion, and the conductive portion and the sealing portion are integrally formed.

2. The sensor control device with an integrally formed connection component according to claim 1, characterized in that, Further comprising a support assembly for supporting the integrally formed connection assembly; The receiving portion is a cavity formed by the device housing recessing in the thickness direction of the device housing, and the integrally formed connection assembly is accommodated in the cavity through the support assembly to electrically connect the proximal portion of the sensor assembly to the electronic device, or The device housing includes a base and an upper cover combined with the base, the receiving portion is formed on the inner surface of the base, the integrally formed connection assembly is accommodated in the receiving portion through the support assembly and the upper cover is combined with the base to electrically connect the proximal portion of the sensor assembly to the electronic device.

3. The sensor control device with an integrally formed connection component according to claim 1 or 2, characterized in that, The sealing portion includes a first seat body, the first seat body at least partially surrounds the conductive portion, and a sealing ring higher than the surface where the conductive portion protrudes is provided at the periphery of the first seat body. During electrical connection, the sealing ring provides a waterproof seal for the second electrical contact.

4. The sensor control device with an integrally formed connection component according to claim 3, characterized in that, The sealing portion further includes a second seat body, and the first seat body and the second seat body cooperate to enable the sealing portion to be switched between an open state and a closed state. When the sealing portion is in the open state, the sealing portion can receive the proximal portion of the sensor assembly. When the sealing portion is in the closed state, the proximal portion of the sensor assembly is located between the first seat body and the second seat body.

5. The sensor control device with an integrally formed connection component according to claim 4, characterized in that, When the sealing portion is in the closed state, the sealing ring provides a waterproof seal for the first electrical contact.

6. The sensor control device with an integrally formed connection component according to any one of claims 1 to 2, 4 to 5, characterized in that, The conductive portion is made of a first material, the sealing portion is made of a second material, the first material includes silica gel and a conductive substance, and the second material is non-conductive silica gel.

7. The sensor control device with an integrally formed connection component according to any one of claims 1 to 2, 4 to 5, characterized in that, The sealing portion is made of a non-conductive elastic material.

8. The sensor control device with an integrally formed connection component according to any one of claims 1 to 2, 4 to 5, characterized in that, The conductive part is made of a first material, and the sealing part is made of a second material. The first material includes a conductive substance, and the second material is a non-conductive material. In the integral molding, according to the adhesion requirement between the conductive part and the sealing part, a vulcanizing agent is added to at least one of the first material and the second material. The vulcanizing agent is used to increase the molecular affinity of the contact part between the surface of the conductive part and the surface of the sealing part.

9. The sensor control device with an integrally formed connection component according to any one of claims 1 to 2, 4 to 5, characterized in that, The conductive part has a process hole, which is used to cooperate with the mold to fix the conductive part during the integral molding.

10. The sensor control device with an integrally formed connection component according to claim 9, characterized in that, A holding part is formed on the surface of the process hole close to the rear mold of the mold. The holding part is configured to hold the conductive part on the rear mold when the mold is opened.

11. The sensor control device with an integrally formed connection component according to claim 9, characterized in that, The process hole is a blind hole.

12. The sensor control device with an integrally formed connection component according to claim 10 or 11, characterized in that, In the integral molding, when the mold faces the first direction, the mold is used to injection-mold the conductive part of the current integral molding connection assembly. When the mold faces the second direction different from the first direction, the mold is used to injection-mold the sealing part of the current integral molding connection assembly and the conductive part of a new integral molding connection assembly simultaneously.

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