Valve assembly, power module, energy storage sub-module and energy storage system

Abstract

The invention relates to a valve assembly, a power module, an energy storage valve sub-module and an energy storage system. The valve assembly comprises a power device, a cooling piece, an impedance device and a press-fitting structure, the press-fitting structure is provided with a press-fitting space, the power device, the cooling piece and the impedance device are arranged in the press-fitting space, and the power device is electrically connected with the impedance device. The power device, the cooling piece and the impedance device are pressed in the press-fitting space of the press-fitting structure at the same time, so that the distance between the power device and the impedance device can be shortened, the distance for realizing electrical connection between the power device and the impedance device is shorter, the electrical loss is reduced, and the impedance device is pressed in the press-fitting structure, so that the reliability of the power device is improved. And the installation space and the wiring space of the impedance device are also saved.

Description

Technical Field

[0001] The present application relates to the technical field of energy storage, and particularly to a valve assembly, a power module, an energy storage sub-module and an energy storage system. Background Art

[0002] With the development of large-scale energy storage, high-voltage energy storage valves have been gradually widely used. One end of a high-voltage energy storage valve is usually connected to the power grid through a converter valve, and the other end is connected to a battery through an energy storage valve power module. By controlling the switching of power devices, the input and cut-off of the energy storage valve sub-module are realized, so as to charge the battery when the power grid has excess energy and discharge the battery to supplement the power grid when the power grid has insufficient energy. However, in related technologies, there are many impedance devices in the power module. When these impedance devices need to be connected to the power devices, there is a problem of a large electrical connection distance. Summary of the Invention

[0003] In view of the problems, the present application provides a valve assembly, a power module, an energy storage sub-module and an energy storage system, which can alleviate the problem of a large electrical connection distance between the impedance device and the power device.

[0004] In a first aspect, the present application provides a valve assembly, including a power device, a cooling member, an impedance device and a pressing structure. The pressing structure has a pressing space, and the power device, the cooling member and the impedance device are arranged in the pressing space, and the power device and the impedance device are electrically connected.

[0005] For the above valve assembly, by pressing the power device, the cooling member and the impedance device into the pressing space of the pressing structure at the same time, the distance between the power device and the impedance device can be shortened, so that the electrical connection distance between the power device and the impedance device is shorter, reducing the electrical loss. And since the impedance device is pressed in the pressing structure, the installation space and wiring space of the impedance device are also saved.

[0006] In some embodiments, the power device, the cooling member and the impedance device are arranged along a preset direction, and each power device and impedance device is adjacent to at least one cooling member.

[0007] Since each power device and impedance device is adjacent to at least one cooling member, each power device and impedance device can be cooled by the cooling member to achieve heat dissipation and cooling, so the operating reliability of the power device and the impedance device during operation is improved.

[0008] In some embodiments, the impedance device and the power device are arranged between the same two adjacent cooling members, and / or the impedance device and the power device are respectively arranged between two different adjacent cooling members.

[0009] A cooling space can be formed between any two adjacent cooling members, and the devices placed in this cooling space can obtain a better cooling effect.

[0010] In some embodiments, there are multiple power devices, and the multiple power devices and the cooling member are arranged alternately along a preset direction.

[0011] In this way, any power device can be cooled by the cooling member to achieve heat dissipation and cooling, improving the heat dissipation efficiency and effect.

[0012] In some embodiments, the power device includes an IGBT or a unidirectional conduction tube, the valve assembly includes two IGBTs and two unidirectional conduction tubes, and each IGBT and each unidirectional conduction tube are arranged alternately along a preset direction.

[0013] In this way, each IGBT is arranged between two adjacent cooling members, and each unidirectional conduction tube is arranged between another two adjacent cooling members. Each IGBT and unidirectional conduction tube of the power device can be cooled by the cooling member to achieve heat dissipation and cooling, improving the heat dissipation efficiency and effect.

[0014] In some embodiments, the power device and the impedance device have a contact conductive surface.

[0015] By setting that the power device and the impedance device have a contact conductive surface, the power device and the impedance device can be in direct contact conduction with the conductive device, simplifying the electrical connection relationship between the power device 10 and the impedance device 30 and the conductive device. Compared with the traditional copper busbar or cable connection, a large amount of space and cost can be saved.

[0016] In some embodiments, the impedance device is flat, and the contact conductive surface is located on the flat surface of the impedance device.

[0017] The flat impedance device has a larger flat surface area, making the contact conductive surface area larger and improving the stability of the electrical connection between the impedance device and the conductive device.

[0018] In some embodiments, the cooling member is a conductive cooling member, and the contact conductive surfaces of the power device and the impedance device are in contact with the cooling member to achieve electrical connection.

[0019] By setting the cooling member as a conductive cooling member and making the contact conductive surfaces of the power device and the impedance device in contact with the cooling member to achieve electrical connection, the electrical connection relationship between the power devices and between the power device and the impedance device can be simplified. Compared with the traditional copper busbar or cable connection, a large amount of space and cost can be saved. And since the devices in the valve assembly are connected together by press-fitting, the reliability of the electrical connection is improved.

[0020] In some embodiments, the impedance device and the power device are in a disc shape, and the absolute value of the difference between the diameter of the impedance device and the diameter of the power device is not greater than 10% of the diameter of the power device.

[0021] By setting the absolute value of the difference between the diameter of the impedance device and the diameter of the power device to be no greater than 10% of the diameter of the power device, the diameter of the impedance device can be made close to the diameter of the power device, so that the pressing force between the devices is more uniform during press-fitting, improving the press-fitting stability during the press-fitting process, and further improving the electrical connection reliability between the contact conductive surface of the impedance device and the power device and the cooling member.

[0022] In some embodiments, the valve assembly further includes at least one positioning member, and at least one positioning member is disposed between the impedance device and the cooling member.

[0023] Setting the positioning member can improve the stability of the positional relationship between the impedance device and the cooling member, and further improve the reliability of press-fitting and the electrical connection reliability between the impedance device and the cooling member.

[0024] In a second aspect, a power module is further provided, and the power module includes the valve assembly in any of the above embodiments.

[0025] For the above power module, by simultaneously press-fitting the power device, the cooling member and the impedance device into the press-fitting space of the press-fitting structure, the distance between the power device and the impedance device can be shortened, so that the distance for the power device and the impedance device to achieve electrical connection is shorter, reducing the electrical loss, and since the impedance device is press-fitted into the press-fitting structure, the installation space and wiring space of the impedance device are also saved.

[0026] In some embodiments, the impedance device includes a resistor.

[0027] By providing the resistance value required for the resistor element to suppress the underdamped oscillation current generated at the input moment of the energy storage valve sub-module, it is not only highly economical and convenient to use, but also greatly reduces the additional impact on the overall function of the energy storage valve sub-module.

[0028] In a third aspect, an energy storage valve sub-module is provided, including the power module in any of the above embodiments.

[0029] For the above energy storage valve sub-module, by simultaneously press-fitting the power device, the cooling member and the impedance device into the press-fitting space of the press-fitting structure, the distance between the power device and the impedance device can be shortened, so that the distance for the power device and the impedance device to achieve electrical connection is shorter, reducing the electrical loss, and since the impedance device is press-fitted into the press-fitting structure, the installation space and wiring space of the impedance device are also saved.

[0030] In a fourth aspect, an energy storage system is provided, including the energy storage valve sub-module in any of the above embodiments.

[0031] In the above energy storage system, by pressing the power device, the cooling device, and the impedance device into the pressing space of the pressing structure at the same time, the distance between the power device and the impedance device can be shortened, so that the distance for the power device and the impedance device to achieve electrical connection is shorter, reducing the electrical loss. And since the impedance device is pressed into the pressing structure, the installation space and wiring space of the impedance device are also saved.

[0032] The above description is only an overview of the technical solution of this application. In order to be able to understand the technical means of this application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features, and advantages of this application more obvious and understandable, the following specifically gives the specific implementation manners of this application. Brief Description of the Drawings

[0033] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of this application. And in all the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0034] Figure 1 It is a schematic structural diagram of a valve assembly in one or more embodiments.

[0035] Figure 2 It is a schematic structural diagram of an impedance device in one or more embodiments.

[0036] Figure 3 It is a schematic structural diagram of a power module in another or more embodiments.

[0037] Figure 4 For Figure 3 It is a schematic structural diagram of a partial structure of the power module shown.

[0038] Figure 5 It is a topological schematic diagram of an energy storage valve sub-module in the related art.

[0039] Figure 6 For Figure 5 It is a schematic diagram of the equivalent stray inductance and equivalent internal resistance of the energy storage unit in the energy storage valve sub-module shown.

[0040] Figure 7 It is a topological schematic diagram of an energy storage valve sub-module in one or more embodiments.

[0041] Figure 8 It is a topological schematic diagram of an energy storage valve sub-module in another or more embodiments.

[0042] Figure 9 It is a schematic structural diagram of a power module in another or more embodiments.

[0043] Figure 10 It is a schematic structural diagram of a power module in one or more embodiments.

[0044] Figure 11 It is Figure 10 a schematic structural diagram of another perspective of the power module shown.

[0045] Figure 12 It is Figure 10 a schematic structural diagram of a partial structure of another perspective of the power module shown.

[0046] Figure 13 It is Figure 10 a schematic structural diagram of yet another perspective of the power module shown.

[0047] The reference numerals in the specific embodiments are as follows:

[0048] Valve assembly 100;

[0049] First side 101, second side 102, third side 103, fourth side 104, fifth side 105;

[0050] Power device 10, cooling member 20;

[0051] Impedance device 30, contact conductive surface 31, pin hole 32;

[0052] Press-fit structure 40, first press-fit assembly 41, frame plate 411, equalizing plate 412, insulating block 413, second press-fit assembly 42, connection assembly 43, pull rod 431;

[0053] First laminated busbar 50;

[0054] DC busbar 55;

[0055] AC busbar 60;

[0056] First capacitor 65, end face 651;

[0057] Second capacitor 70;

[0058] Second laminated busbar 75;

[0059] Bypass switch 78;

[0060] Adapter busbar 80;

[0061] Power supply 85;

[0062] Inlet and outlet water pipe 88;

[0063] Explosion-proof insulating part 90;

[0064] Flow guide box 95

[0065] Power module 200. Detailed implementation

[0066] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore are only examples and cannot be used to limit the protection scope of the present application.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.

[0068] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, "a plurality of" means more than two, unless otherwise specifically defined.

[0069] Referring to "embodiments" herein means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0070] In the description of the embodiments of this application, the term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, 1 and / or 2 can represent: 1 exists alone, 1 and 2 exist simultaneously, and 2 exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0071] In the description of the embodiments of this application, the term "a plurality of" refers to more than two (including two). Similarly, "a plurality of groups" refers to more than two groups (including two groups), and "a plurality of pieces" refers to more than two pieces (including two pieces).

[0072] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the embodiments of the present application.

[0073] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0074] As Figure 1 shown, Figure 1 is a schematic structural diagram of a valve assembly according to one or more embodiments. Referring to the drawings, an embodiment of the present application provides a valve assembly 100. The valve assembly 100 includes a power device 10, a cooling member 20, an impedance device 30, and a press-fitting structure 40. The press-fitting structure 40 has a press-fitting space AA, and the power device 10, the cooling member 20, and the impedance device 30 are disposed in the press-fitting space AA, and the power device 10 and the impedance device 30 are electrically connected.

[0075] The power device 10 is also called a power semiconductor device. The power device 10 can form a half-bridge circuit or a full-bridge circuit, etc. in the energy storage valve sub-module to form a power conversion unit in the energy storage valve sub-module. The main function of the power change unit is to realize the two working modes of the energy storage unit being put into and cut off in the charge and discharge states through different paths. Specifically, the power device 10 can include one of a unidirectional conduction tube, an IGBT device, or a thyristor.

[0076] In some embodiments, the power devices can be discrete or integrated, the number of power devices can be one or more, and when the power devices are connected to the impedance devices in the electrical topology, by press-fitting the power devices and the impedance devices together, a highly reliable connection is achieved, and it is beneficial to reduce the device size.

[0077] The cooling component 20 refers to a device that can achieve a cooling effect on external components. The cooling method of the cooling component 20 can generally be water cooling, or it can also be air cooling, air blast cooling, or other cooling methods. Specifically, the cooling component 20 can include a cooling plate, and the cooling plate has a larger area and better heat dissipation effect.

[0078] The impedance device 30 can be any device with a resistance value. Specifically, it can be a resistor, or it can also be other passive devices containing a resistance value, such as an inductor.

[0079] The press-fitting structure 40 can be in the form of an assembly formed by multiple components, which can apply pressure to the power device 10, the cooling component 20, and the impedance device 30, so that there is a close relationship between the power device 10, the cooling component 20, and the impedance device 30. This close relationship can be a contact relationship, specifically, it can be the contact relationship between the contact conductive surface and the cooling component 20, or between the contact conductive surfaces, or it can also be a close spacing relationship. Press-fitting the power device can improve the connection reliability and good heat dissipation performance, and is suitable for the operating environment in the power system that bears high current and high power.

[0080] The press-fitting space AA is formed by the press-fitting structure 40. When the power device 10, the cooling component 20, and the impedance device 30 are arranged in the press-fitting space AA, they can be pressured by the press-fitting structure 40. That is to say, when the power device 10, the cooling component 20, and the impedance device 30 are arranged outside the press-fitting space AA, the pressure of the press-fitting structure 40 may not reach the devices, resulting in press-fitting failure.

[0081] Therefore, for the valve assembly 100 of the present application, by simultaneously press-fitting the power device 10, the cooling component 20, and the impedance device 30 in the press-fitting space AA of the press-fitting structure 40, the distance between the power device 10 and the impedance device 30 can be shortened, and further the distance for the power device 10 and the impedance device 30 to achieve electrical connection is shorter, reducing the electrical loss. And because the impedance device 30 is press-fitted in the press-fitting structure 40, the installation space and wiring space of the impedance device 30 are also saved.

[0082] Please continue to refer to Figure 1 , according to some embodiments of the present application, the power device 10, the cooling component 20, and the impedance device 30 are arranged along a preset direction, and each power device 10 and impedance device 30 is adjacent to at least one cooling component 20.

[0083] The preset direction referred to here can be Figure 1 the Z direction shown in the figure. Specifically, after the valve assembly 100 is installed, the preset direction can be the vertical direction. Of course, the preset direction is not limited to the Z direction and the vertical direction, and can also be other directions or the horizontal direction.

[0084] In an embodiment of the present application, the preset direction is also the direction in which the press-fitting structure 40 presses on the power device 10, the cooling member 20, and the impedance device 30.

[0085] Since each power device 10 and impedance device 30 is adjacent to at least one cooling member 20, each power device 10 and impedance device 30 can be cooled by the cooling member 20 to achieve heat dissipation and cooling, thus improving the operating reliability of the power device 10 and impedance device 30 during operation.

[0086] Specifically, in the embodiment of the present application, the impedance device 30 and the power device 10 are disposed between the same two adjacent cooling members 20; and / or the impedance device 30 and the power device 10 are respectively disposed between two different adjacent cooling members 20.

[0087] A cooling space can be formed between any two adjacent cooling members 20, and the devices placed in this cooling space can obtain a better cooling effect. In the embodiment of the present application, the cooling members 20 are arranged at intervals along the preset direction.

[0088] Specifically, the impedance device 30 and the power device 10 are disposed between the same two adjacent cooling members 20, that is to say, without increasing the cooling members 20, the impedance device 30 and the power device 10 share the cooling members 20. In another embodiment, the impedance device 30 and the power device 10 are respectively disposed between two different adjacent cooling members 20. Therefore, the impedance device 30 can be independently disposed between two adjacent cooling members 20, and the power device 10 can also be independently disposed between two other adjacent cooling members 20. In still another embodiment, when there are multiple impedance devices 30, at least one impedance device 30 can be disposed between the same two adjacent cooling members 20 as at least one power device 10, and at least another impedance device 30 is disposed between two other different adjacent cooling members 20. When there are multiple power devices 10, at least one power device 10 can be disposed between the same two adjacent cooling members 20 as at least one impedance device 30, and at least another power device 10 is disposed between two other different adjacent cooling members 20.

[0089] In summary, for the valve assembly 100 in the embodiment of the present application, regardless of where the impedance device 30 and the power device 10 are specifically disposed, both sides of them are adjacent to the cooling members 20, and thus the cooling members 20 can more efficiently dissipate heat from and cool the impedance device 30 and the power device 10.

[0090] Optionally, when the impedance device 30 and the power device 10 are disposed between the same two adjacent cooling members 20, the impedance device 30 can be arranged side by side with the power device 10, or stacked, or offset.

[0091] When the impedance device 30 and the power device 10 are disposed between two adjacent cooling components 20, the impedance device 30 can be disposed between two adjacent cooling components 20 at one end of all the power devices 10 along a preset direction, or can be interspersed between two adjacent cooling components 20 between two adjacent power devices 10.

[0092] Furthermore, there are multiple power devices 10, and the multiple power devices 10 and the cooling components 20 are alternately arranged along a preset direction.

[0093] In this way, any one of the power devices 10 can be cooled by the cooling component 20 to achieve heat dissipation and cooling, improving the heat dissipation efficiency and effect.

[0094] Even further, the power device 10 includes an IGBT or a unidirectional conduction tube, the valve assembly 100 includes two IGBTs and two unidirectional conduction tubes, and each IGBT and each unidirectional conduction tube are alternately arranged along a preset direction.

[0095] In this way, each IGBT is disposed between two adjacent cooling components 20, each unidirectional conduction tube is disposed between two other adjacent cooling components 20, and each IGBT and unidirectional conduction tube of the power device 10 can be cooled by the cooling component 20 to achieve heat dissipation and cooling, improving the heat dissipation efficiency and effect.

[0096] In other embodiments, the valve assembly 100 can also include four IGBTs and four unidirectional conduction tubes, and each IGBT and each unidirectional conduction tube are alternately arranged along a preset direction.

[0097] In the embodiments of the present application, the press-fitting structure 40 includes a first press-fitting assembly 41, a second press-fitting assembly 42 and a connecting assembly 43. The first press-fitting assembly 41 and the second press-fitting assembly 42 are oppositely arranged to form a press-fitting space AA. The connecting assembly 43 connects the first press-fitting assembly 41 and the second press-fitting assembly 42 to generate a pressing force for pressing the power device 10, the cooling component 20 and the impedance device 30 between the first press-fitting assembly 41 and the second press-fitting assembly 42. By setting the opposite first press-fitting assembly 41 and second press-fitting assembly 42 to apply pressure to the power device 10, the cooling component 20 and the impedance device 30, the pressing force can be made more uniform and the pressure application is stable and reliable.

[0098] More specifically, the first press-fitting component 41 and the second press-fitting component 42 are arranged opposite to each other along a preset direction. The structures of the first press-fitting component 41 and the second press-fitting component 42 may be the same or different. The first press-fitting component 41 includes a frame plate 411, an equalizing plate 412 and an insulating block 413. The equalizing plate 412 and the insulating block 413 are connected to the inner side of the frame plate 411, and the equalizing plate 412 is located between the insulating block 413 and the frame plate 411. In some embodiments, in order to make the pressure applied by the first press-fitting component 41 and the second press-fitting component 42 on the device more uniform, some elastic members, such as compression springs, etc., may be provided to adjust the magnitude of the applied pressure.

[0099] The connecting component 43 may include a plurality of tie rods 431. One end of each tie rod 431 is connected to the first press-fitting component 41, and the other end is connected to the second press-fitting component 42. The tie rods 431 are arranged at intervals in a ring shape.

[0100] In the embodiments of the present application, the first press-fitting component 41, the second press-fitting component 42 and the connecting component 43 can be combined to form a frame structure, so that the power device 10, the cooling component 20 and the impedance device 30 are located inside the frame structure. This not only makes the relationship between the power device 10, the cooling component 20 and the impedance device 30 closer, but also protects each device.

[0101] According to some embodiments of the present application, the power device 10 and the impedance device 30 have contact conductive surfaces.

[0102] The contact conductive surface refers to a surface that can contact a conductive device to achieve electrical connection. The label of the contact conductive surface of the impedance device 30 is given as 31 here.

[0103] The contact conductive surfaces of the power device 10 and the impedance device 30 may include only one, or may include multiple. And when the contact conductive surfaces of the power device 10 and the impedance device 30 include multiple, different contact conductive surfaces may be located on different surfaces of the power device 10 and the impedance device 30. For example, the contact conductive surfaces of the power device 10 and the impedance device 30 include two, and the two contact conductive surfaces are respectively located on the opposite sides of the power device 10 and the impedance device 30.

[0104] By setting that the power device 10 and the impedance device 30 have contact conductive surfaces, the power device 10 and the impedance device 30 can directly contact and conduct electricity with the conductive device, simplifying the electrical connection relationship between the power device 10 and the impedance device 30 and the conductive device. Compared with the traditional copper busbar or cable connection, a large amount of space and cost can be saved.

[0105] In the embodiments of the present application, the contact conductive surfaces of the power device 10 and the impedance device 30 are both located on the sides of the power device 10 and the impedance device 30 along the preset direction.

[0106] In this way, when the contact conductive surface of the power device 10 is in conductive contact with the impedance device 30 and the cooling member 20, due to the pressing force of the pressing structure 40, the reliability of the electrical connection can be further improved.

[0107] Combined with Figure 2 , further, the impedance device 30 is flat, and the contact conductive surface is located on the flat surface of the impedance device 40.

[0108] The flat impedance device 30 has a larger flat surface area, making the area of the contact conductive surface larger and improving the stability of the electrical connection between the impedance device 30 and the conductive device.

[0109] According to some embodiments of the present application, the cooling member 20 is a conductive cooling member, and the conductive contact surfaces of the power device 10 and the impedance device 30 are in contact with the cooling member 20 to achieve electrical connection.

[0110] The conductive cooling member means that the cooling member 20 has a conductive function. Specifically, the cooling member 20 may have a metal shell, such as a copper shell or an aluminum shell, etc.

[0111] By setting the cooling member 20 as a conductive cooling member, and making the conductive contact surfaces of the power device 10 and the impedance device 30 in contact with the cooling member 20 to achieve electrical connection, the electrical connection relationship between the power device 10 and the impedance device 30 can be simplified. Compared with the traditional copper busbar or cable connection, a large amount of space and cost can be saved. And since the devices in the valve assembly 100 are pressed together by the pressing structure 40, the reliability of the electrical connection is further improved.

[0112] For example, when the power device 10 includes an IGBT device, the IGBT device has a collector contact conductive surface and an emitter contact conductive surface, and the cooling member 20 can be electrically connected to the collector contact conductive surface and the emitter contact conductive surface. By means of electrical connection, the connection line can be simplified and the connection reliability can be improved.

[0113] Optionally, the impedance device 30 may be in a disc shape, or may also be in a square flat shape in other embodiments.

[0114] Optionally, the power device 10 may also be in a disc shape, and the absolute value of the difference between the diameter of the impedance device 30 and the diameter of the power device 10 is not greater than 10% of the diameter of the power device 10.

[0115] By setting the absolute value of the difference between the diameter of the impedance device 30 and the diameter of the power device 10 to be no greater than 10% of the diameter of the power device 10, the diameter of the impedance device 30 can be made close to the diameter of the power device 10. Furthermore, when press-fitting, the pressing force between the devices can be made more uniform, improving the press-fitting stability during the press-fitting process, and further enhancing the electrical connection reliability between the contact conductive surface of the impedance device 30 and the power device 10 and the cooling member 20.

[0116] In other embodiments, the power devices 10 can also be directly electrically connected to each other through the contact conductive surfaces. For example, when one of the power devices 10 is an IGBT and the other power device 10 is a unidirectional conduction tube, the contact conductive surface of the IGBT is in direct contact with the contact conductive surface of the unidirectional conduction tube to achieve electrical connection.

[0117] Similarly, the power device 10 and the impedance device 30 can also be directly electrically connected to each other through the contact conductive surfaces.

[0118] According to some embodiments of the present application, the valve assembly 100 further includes at least one positioning member, and at least one positioning member is disposed between the impedance device 30 and the cooling member 20.

[0119] By providing the positioning member, the stability of the positional relationship between the impedance device 30 and the cooling member 20 can be improved, thereby improving the reliability of the press-fitting and the electrical connection reliability between the impedance device 30 and the cooling member 20. Specifically, the positioning member can position the impedance device 30 relative to the cooling member 20.

[0120] Optionally, the positioning member can be a positioning pin, and corresponding positioning holes 32 can be provided on the impedance device 30 and the cooling member 20 for the positioning pin to pass through and cooperate.

[0121] Similarly, a positioning member can also be provided between the power device 10 and the cooling member 20, or a positioning member can be provided between the power devices 10.

[0122] In addition, as Figure 3 and Figure 4 shown, the embodiments of the present application also provide a power module 200, including the valve assembly 100 in any of the above embodiments.

[0123] In the power module 200 of the present application, by simultaneously press-fitting the power device 10, the cooling member 20, and the impedance device 30 into the press-fitting space AA of the press-fitting structure 40, the distance between the power device 10 and the impedance device 30 can be shortened, thereby making the distance for the power device 10 and the impedance device 30 to achieve electrical connection shorter, reducing the electrical loss, and since the impedance device 30 is press-fitted into the press-fitting structure 40, the installation space and wiring space of the impedance device 30 are also saved, making the structure of the power module 200 more compact.

[0124] According to some embodiments of the present application, when the cooling member 20 is a conductive cooling member, the valve assembly 100 further includes a first laminated busbar 50. The first laminated busbar 50 is disposed on one side of all the cooling members 20 and is electrically connected to some of the cooling members 20 to electrically connect the power device 10 and the impedance device 30.

[0125] The first laminated busbar 50 refers to a composite busbar with a multi-layer structure. Specifically, the laminated busbar may include two-layer, three-layer busbars stacked, etc.

[0126] In this way, the electrical connection of the power device 10 and the impedance device 30 can be realized through the multi-layer busbars of the first laminated busbar 50. In other words, the electrical connection line of the impedance device 30 is simplified by the connection method of the busbar. Therefore, the DC electrical connection relationship of the entire valve assembly 10 becomes simple, and the overall structure of the valve assembly 10 is more compact.

[0127] Please refer to Figure 4 Furthermore, the valve assembly 100 further includes a DC busbar 55. The DC busbar 55 is disposed on the side of the first laminated busbar 50 facing away from all the cooling members 20 and is electrically connected to the first laminated busbar 50.

[0128] Specifically, the DC busbar 55 refers to a conductive busbar through which DC current flows. One end of the DC busbar 55 can be connected to the DC main circuit of the energy storage system, and the other end is electrically connected to the first laminated busbar 50. Optionally, the DC busbar 55 is a DC flexible copper busbar.

[0129] By disposing the DC busbar 55 and the first laminated busbar 50 on the same side and electrically connecting them, the loop path can be made the shortest, optimizing the loop path.

[0130] According to some embodiments of the present application, the valve assembly 100 further includes an AC busbar 60. The AC busbar 60 and the first laminated busbar 50 are respectively disposed on opposite sides of all the cooling members 20, and the AC busbar 60 is electrically connected to some other cooling members 20.

[0131] The AC busbar 60 refers to a conductive busbar through which AC current flows. One end of the AC busbar 60 can be connected to the AC busbar of the energy storage system, and the other end is electrically connected to the cooling member 20. Optionally, the AC busbar 60 is an AC copper busbar.

[0132] By arranging the AC busbar 60 on the opposite side of the first laminated busbar 50, on the one hand, the interference between AC and DC is reduced, and on the other hand, the peripheral space of the cooling member 20 is fully utilized, making the structure of the valve assembly 100 more compact.

[0133] According to some embodiments of the present application, when the impedance device 30 and the power device 10 are respectively disposed between two adjacent cooling members 20, and the cooling member 20 is a conductive cooling member, the power module 200 further includes a first capacitor 65. The first capacitor 65 is connected in series with the cooling member 20 adjacent to the impedance device 30 through a first laminated busbar 50 to form an RC branch. The power device 10 and the cooling member 20 connected to the power device 10 form a DC output side, and the RC branch is connected in parallel with the DC output side through the first laminated busbar 50.

[0134] Generally, there are relatively large equivalent internal resistance and equivalent stray inductance inside the energy storage unit. The equivalent internal resistance and equivalent stray inductance not only come from the connection bars inside the energy storage unit, but also from the busbars connecting the energy storage unit and the power conversion unit in the entire energy storage valve sub-module topology. When the energy storage unit is Figure 5 connected in the manner shown, the equivalent resistance, equivalent stray inductance inside the energy storage unit, and the DC support capacitor are equivalent to a parallel RLC network. The modes of the energy storage valve sub-module in the entire high-voltage direct-connected energy storage system include two states: the input state and the cut-off state. When the energy storage valve sub-module switches between the input and cut-off states, the current on the main circuit of the high-voltage direct-connected energy storage system enters the energy storage valve sub-module, and this current can be regarded as a step current source excitation for the RLC network. Please refer to Figure 6 , Figure 6 which is a schematic diagram of the parallel RLC network equivalent to the energy storage valve sub-module topology. Among them, L represents the equivalent stray inductance, Rdc represents the equivalent internal resistance, I / P represents the step current source excitation, and Figure 6 the power conversion unit in the energy storage valve sub-module is not shown in

[0135] Due to the relatively large equivalent stray inductance, the inductive reactance of the equivalent stray inductance L in the energy storage valve sub-module does not match the capacitive reactance of the DC support capacitor. In this case, once under the step current source excitation I / P, the mismatch between the inductive reactance of the equivalent stray inductance L and the capacitive reactance of the DC support capacitor will cause the entire RLC network to undergo underdamped oscillation, forming an underdamped network, thereby causing underdamped oscillation between the DC support capacitor and the energy storage unit.

[0136] This underdamped oscillation may bring certain hazards to the energy storage valve sub-module, including but not limited to overcurrent in the energy storage unit, resulting in damage, deterioration, and reduced lifespan of the energy storage unit; and an increase in the capacitor current in the energy storage valve sub-module, for example, it can increase by about 30% or so, which will cause an increase in the weight, volume, and cost of the capacitor; and if the energy storage valve sub-module is in an overcurrent state for a long time during operation, it will also cause relatively large current stress on the electrical components in the energy storage valve sub-module, etc. Thus, it affects the working reliability of the energy storage valve sub-module.

[0137] To address this, it can be solved by at least one of the following methods: increasing the capacitance value of the capacitor in the energy storage valve sub-module, reducing the stray inductance, and increasing the resistance. However, considering that the main source of the equivalent stray inductance in the energy storage unit is the connection busbar inside the energy storage unit and the busbar connecting the energy storage unit to the power conversion unit, it is difficult to reduce. Moreover, the equivalent internal resistance in the energy storage unit mainly comes from the internal resistance of a large number of series-parallel connected battery cells. The resistance value of this equivalent internal resistance is relatively low, causing the equivalent internal resistance to fluctuate greatly with the charge-discharge frequency. Therefore, this equivalent internal resistance is also insufficient to suppress the underdamped oscillation. If a resistor is added to the main circuit of the high-voltage direct-connected energy storage system, since the charge-discharge current of the energy storage in the high-voltage direct-connected energy storage system is as high as thousands of amperes, even adding a resistor of milliohm level will cause huge losses, resulting in a significant temperature rise, which will affect the heat dissipation design and lifespan of the energy storage unit. If the oscillation is suppressed by increasing the capacitance of the capacitor in the energy storage valve sub-module, the capacitance value of the capacitor needs to be increased to several hundred mF. With the increase in the capacitance value of the capacitor, the volume, weight, and cost of the capacitor will also increase correspondingly, which will have a certain impact on the applicability and convenience of the energy storage valve sub-module.

[0138] Taking the above into consideration, the topology of the energy storage valve sub-module can be improved. Please refer to Figure 7 , which provides a topology schematic diagram of an energy storage valve sub-module according to an embodiment of the present application. An impedance device 30 for underdamped oscillation is added to the energy storage valve sub-module. The cooling part 20 adjacent to the impedance device 30 is connected in series with the first capacitor 65 through the first laminated busbar 50 to form a resistor-capacitor branch. And this resistor-capacitor branch is connected in parallel with the power device 10 and the cooling part 20 connected to the power device 10 through the first laminated busbar 50 to form a DC output side. Since the impedance device 30 can adjust the resistance value of the impedance in the energy storage valve sub-module to suppress the underdamped oscillation current generated at the moment of switching the switching state of the energy storage valve sub-module, the underdamped oscillation current generated at the moment of switching the switching state of the energy storage valve sub-module is greatly reduced, achieving the effect of suppressing the underdamped oscillation current, and greatly reducing the harm brought by the underdamped oscillation current to the energy storage valve sub-module, thereby improving the reliability of the energy storage valve sub-module.

[0139] In addition, in the embodiment of the present application, while the first laminated busbar 50 is electrically connected to the cooling part 20 adjacent to the impedance device 30 and the first capacitor 65, it is also electrically connected to the resistor-capacitor branch and the DC output side. Therefore, the connection lines between the impedance device 30, the first capacitor 65, and the power device 10 can be made simpler through the first laminated busbar 50, reducing the loop resistance and loop stray inductance.

[0140] Please refer to Figure 3 , specifically, the first capacitor 65 is arranged on the first side 101 of the valve assembly 100, and the first laminated busbar 50 is arranged on the second side 102 of the valve assembly 100. Among them, the first side 101 and the second side 102 are adjacent.

[0141] Due to the setting position of the first stacked busbar 50 relative to the valve assembly 100 being adjacent to the setting position of the first capacitor 65 relative to the valve assembly 100, it is convenient to place the first stacked busbar 50 and the electrical connection path between the first capacitor 65 and the impedance device 30 is shorter.

[0142] Optionally, the directions of the first side 101 and the second side 102 of the valve assembly 100 intersect with a preset direction. Specifically, the direction of the valve assembly 100 where the first side 101 is located is the Y direction as shown in Figure 3 and the direction of the valve assembly 100 where the second side 102 is located is the X direction as shown in Figure 3

[0143] In addition, since the size of the first capacitor 65 is large, in order to reduce the overall size of the power module 200, in the embodiment of the present application, the large surface side of the first capacitor 65 is arranged face to face with the first side 101 of the valve assembly 100. The large surface side of the first capacitor 65 is also one side in the thickness direction of the first capacitor 65. Specifically, the thickness direction of the first capacitor 65 is parallel to the direction of the valve assembly 100 where the first side 101 is located.

[0144] In some embodiments, the end face 651 of one end of the first capacitor 65 close to the second side 102 is flush with the side face of the second side 102 of the first capacitor 65.

[0145] For example, when the end face 651 of one end of the first capacitor 65 close to the second side 102 is flush with the side face of the second side 102 of the first capacitor 65, since the size of the first capacitor 65 is large, a part of the first capacitor 65 will protrude from the opposite side, that is, the third side 103 opposite to the second side 102, and a relatively large accommodation space is formed between the first capacitor 65 and the third side 103 of the valve assembly 100. This accommodation space can accommodate other devices without affecting the overall size of the power module 200. In addition, since the first stacked busbar 50 is also arranged on the second side 102, the flush setting method can also keep the first stacked busbar 50 in a relatively flat layer structure, simplify the structure of the first stacked busbar 50, and make the electrical connection line between the first capacitor 65 and the impedance device 30 shorter.

[0146] Referring to Figure 8 and combining with Figure 9 , according to some embodiments of the present application, the power module 200 further includes a second capacitor 70. The capacitance value of the second capacitor 70 is smaller than that of the first capacitor 65. The second capacitor 70 is connected in parallel with the DC output side through the first stacked busbar 50 and is connected in parallel with the RC branch.

[0147] ​By setting the capacitance value of the second capacitor 70 to be smaller than that of the first capacitor 65, a certain distinction is also made between the high-frequency current passing through the second capacitor 70 and the high-frequency current passing through the first capacitor 65 at the moment when the energy storage valve sub-module is put into operation. For example, the second capacitor 70 mainly passes the high-frequency components in the current, and the first capacitor 65 mainly passes the low-frequency components in the current.

[0148] In practical applications, when determining the capacitance value of the second capacitor 70, the determination process can be achieved through circuit simulation. When simulating, it is necessary to consider not only the overvoltage capability at the moment of IGBT turn-off, but also whether the excessive capacitance value of the second capacitor 70 will exacerbate the under-damped oscillation degree of the energy storage valve sub-module. Therefore, it is necessary to set the capacitance value of the second capacitor 70 within a range that does not cause under-damped oscillation with other devices in the energy storage valve sub-module.

[0149] Optionally, the capacitance value of the second capacitor 70 can be at the sub-mF level. For example, the capacitance value range of the second capacitor 70 includes 10 uF to 300 uF. This capacitance value range can be the value range in the high-voltage direct connection scenario. When the second capacitor 70 takes values within this range, it can reduce the overvoltage stress at the moment of IGBT turn-off and reduce the additional impact on the overall topology of the energy storage valve sub-module.

[0150] In the embodiment of the present application, by integrally connecting a second capacitor 70 in parallel beside the resistor-capacitor branch, the overvoltage stress at the moment of IGBT turn-off can be reduced, the risk of IGBT failure due to excessive overvoltage stress can be reduced, thereby increasing the working reliability of the IGBT, and further increasing the working reliability of the energy storage valve sub-module.

[0151] In addition, in the embodiment of the present application, the second capacitor 70 is arranged to be connected in parallel with the DC output side through the first laminated busbar 50, which simplifies the connection line between the second capacitor 70, the power device 10 and the resistor-capacitor branch.

[0152] Refer to Figure 3 , in other embodiments, the power module 200 further includes a second laminated busbar 75. The second capacitor 70 is connected in parallel with the DC output side through the second laminated busbar 75 and is connected in parallel with the resistor-capacitor branch through the first laminated busbar 50.

[0153] Setting the second laminated busbar 75 to electrically connect the DC output side and the second capacitor 70 makes the connection line simpler, reducing the loop resistance and loop stray inductance.

[0154] Combined with Figure 3 and Figure 9 , according to some embodiments of the present application, the second capacitor 70 is arranged on the second side 102 or the third side 103 of the valve assembly 10. Among them, the third side 103 is arranged opposite to the second side 102 and is adjacent to the first side 101.

[0155] Specifically, the second side 102 and the third side 103 are oppositely arranged along the X direction as shown. Figure 9 shown.

[0156] By arranging the second capacitor 70 on the second side 102 or the third side 103 of the valve assembly 100, the space on the second side 102 or the third side 103 of the valve assembly 100 can be fully utilized, the structural compactness can be improved, and the second capacitor 70 is also arranged closer to the valve assembly 100, simplifying the electrical connection line for its parallel connection with the resistor-capacitor branch.

[0157] Optionally, the second capacitor 70 is arranged on the third side 103 and is located in the accommodation space formed between the first capacitor 65 and the third side 103 of the valve assembly 100.

[0158] Optionally, the second capacitor 70 is arranged below the AC busbar 60.

[0159] To better understand the connection relationship between the first laminated busbar 50, the second laminated busbar 75 and the device, the following is illustrated through two specific embodiments.

[0160] The structures of the valve assemblies 100 in the two specific embodiments are the same. The valve assembly 100 includes two power devices 10, six cooling components 20 and an impedance device 30. The six cooling components 20 are, from top to bottom in sequence, the first cooling component, the second cooling component, the third cooling component, the fourth cooling component, the fifth cooling component and the sixth cooling component. Among them, an impedance device 30 is arranged between the fifth cooling component and the sixth cooling component, and the IGBT and the unidirectional conduction tube of the two power devices 10 are respectively arranged between the other cooling components.

[0161] In one of the specific embodiments, the second capacitor 70 is arranged on the third side 103 of the valve assembly 100, and the first laminated busbar 50 is arranged on the second side 102 of the valve assembly 100. The first laminated busbar 50 includes three layers of laminated busbars. One layer of the busbar electrically connects the negative terminal of the first capacitor 65 and the sixth cooling component, so that the first capacitor 65 and the sixth cooling component are in series. Another layer of the busbar electrically connects the first cooling component and the fifth cooling component. The last layer of the busbar electrically connects the positive terminal of the first capacitor 65 and the third cooling component. The second laminated busbar 75 includes two layers of laminated busbars. One layer of the busbar electrically connects the negative terminal of the second capacitor 70 and the first cooling component and the fifth cooling component. Another layer of the busbar electrically connects the positive terminal of the second capacitor 70 and the third cooling component. In this way, through the first laminated busbar 50 and the second laminated busbar 75, it is possible to realize that the first capacitor 65 and the impedance device 30 are in series and then in parallel with the second capacitor 70 on the power device 10.

[0162] In another embodiment, the second capacitor 70 is provided on the second side 102 of the valve assembly 100, and the first stacked busbar 50 is also located on the second side 102. In this way, the second stacked busbar 75 can be eliminated, and only through the first stacked busbar 50, the series connection of the first capacitor 65 and the impedance device 30 is realized and then paralleled with the second capacitor 70 on the power device 10. Specifically, the first stacked busbar 50 includes three layers of stacked busbars. One layer of the busbar is electrically connected to the positive terminal of the first capacitor 65, the positive terminal of the second capacitor 70, and the third cooling member. Another layer of the busbar is electrically connected to the first cooling member, the fifth cooling member, and the negative terminal of the second capacitor 70. The last layer of the busbar is electrically connected to the negative terminal of the first capacitor 65 and the sixth cooling member.

[0163] According to some embodiments of the present application, the impedance device 30 includes a resistor.

[0164] That is, the suppression circuit in the embodiments of the present application can be realized by a resistive element. By providing the resistance value required for the resistive element to suppress the underdamped oscillating current generated at the moment when the energy storage valve sub-module is put into operation, it is not only highly economical but also convenient and simple to use, greatly reducing the additional impact on the overall function of the energy storage valve sub-module.

[0165] Please refer to Figures 10 to 13 , according to some embodiments of the present application, the power module 200 further includes a bypass switch 78. The bypass switch 78 is provided on the third side 103 of the valve assembly 100, and one end of the AC busbar 60 is electrically connected to the cooling member 20 through the bypass switch 78.

[0166] The function of the bypass switch 78 is to disconnect it from the overall circuit when the power device 10 fails, so as to avoid affecting the operation of the entire energy storage system. Therefore, the operation reliability of the energy storage system is improved. By arranging the bypass switch 78 on the same side as the AC busbar 60, the circuit and structure settings can be simplified.

[0167] Specifically, the power module 200 further includes an adapter busbar 80. The bypass switch 78 and the cooling member 20 are electrically connected through the adapter busbar 80.

[0168] Optionally, the adapter busbar 80 is provided on the third side 103 of the valve assembly 100.

[0169] Further, when the second capacitor 70 is located on the third side 103, the bypass switch 78 and the second capacitor 70 are arranged side by side.

[0170] Specifically, the direction in which the bypass switch 78 and the second capacitor 70 are arranged side by side is the direction in which the second side 102 and the third side 103 face each other. Specifically, the direction in which the second side 102 and the third side 103 face each other is as Figure 6The X direction shown. Of course, in other embodiments, the direction in which the bypass switch 78 and the second capacitor 70 are arranged side by side can also be the direction in which the first side 101 is opposite to the fourth side 104. Specifically, the direction in which the first side 101 is opposite to the fourth side 104 is as Figure 9 shown in the Y direction.

[0171] In this way, the bypass switch 78 and the second capacitor 70 can be centrally arranged, and further, the structure of the power module 200 can be made more compact.

[0172] According to some embodiments of the present application, the power module 200 further includes a controller. The controller can be a secondary board, and the controller can also be arranged on the third side 103 of the valve assembly 100.

[0173] According to some embodiments of the present application, the power module 200 further includes a power supply 85 connected to the controller. The power supply 85 is arranged on the third side 103 of the valve assembly 100. The second capacitor 70, the bypass switch 78 and the AC busbar 60 form an integral body and are spaced apart from the power supply 85.

[0174] The fact that the second capacitor 70, the bypass switch 78 and the AC busbar 60 form an integral body and are spaced apart from the power supply 85 means that none of the second capacitor 70, the bypass switch 78 and the AC busbar 60 is inserted into or connected to the power supply 85, and the second capacitor 70, the bypass switch 78 and the AC busbar 60 are all separated from the power supply 85.

[0175] Since there is sufficient space on the third side 103 of the valve assembly 100 and it is not interfered by the first laminated busbar 50, arranging the relatively large power supply 85 on the third side 103 of the valve assembly 100 can not affect the overall size of the power module 200. In addition, by arranging the second capacitor 70, the bypass switch 78 and the AC busbar 60 to form an integral body and be spaced apart from the power supply 85, the primary AC circuit formed by the second capacitor 70, the bypass switch 78 and the AC busbar 60 can be separated from the secondary control circuit formed by the power supply 85, which not only improves the space utilization rate, but also has good electromagnetic compatibility and takes into account installation and maintenance.

[0176] Optionally, there are multiple power supplies 85, and the multiple power supplies 85 are stacked.

[0177] According to some embodiments of the present application, the power module 200 further includes an inlet and outlet water pipe 88 communicated with a plurality of cooling members 20. The inlet and outlet water pipe 88 is arranged on the fourth side 104 of the valve assembly 100.

[0178] Although the inlet and outlet water pipe 88 is small in size, due to its certain extension length, in order to make full use of the peripheral space of the valve assembly 100 and reduce the impact on the size of the power module 200, the inlet and outlet water pipe 88 is arranged on the fourth side 104 of the valve assembly 100. Only the AC busbar 60 protrudes from the fourth side 104, and there are no other devices blocking it. Therefore, the influence on the extension path of the inlet and outlet water pipe 88 is small, the structure of the inlet and outlet water pipe 88 is simplified, and the maintenance is facilitated. In addition, the influence on the size of the power module 200 on the fourth side 104 is also small.

[0179] Optionally, the inlet and outlet water pipe 88 extends along the opposite direction of the second side 102 and the third side 103.

[0180] According to some embodiments of the present application, the power module 200 further includes an explosion-proof insulating member 90, and the explosion-proof insulating member 90 is arranged on the second side 102 of the valve assembly 100 and is located between the valve assembly 100 and the first stacked busbar 50.

[0181] In this way, the explosion-proof insulating member 90 can be closely attached to the valve assembly 100 to protect the cooling member 20 from the impact damage caused by the abnormal explosion of the power device 10.

[0182] According to some embodiments of the present application, the power module 200 further includes a diversion box 95, and the diversion box 95 is arranged on the fifth side 105 of the valve assembly 100. The fifth side 105 is adjacent to the first side 101, the second side 102, the third side 103 and the fourth side 104, and the inlet and outlet water pipe 88 is located above the diversion box 95 in the vertical direction.

[0183] By providing the diversion box 95, when abnormal leakage occurs at the inlet and outlet water pipe 88, the cooling member 20 and the connection between the inlet and outlet water pipe 88 and the cooling member 20, the leaked cooling medium can be collected to reduce the damage of the leaked cooling medium to each device.

[0184] Optionally, when the inlet and outlet water pipe 88 extends along the opposite direction of the second side 102 and the third side 103, the diversion box 95 also extends along the opposite direction of the second side 102 and the third side 103. In this way, the extension direction of the diversion box 95 is the same as that of the inlet and outlet water pipe 88, and the leaked cooling medium on the extension path of the inlet and outlet water pipe 88 can be comprehensively collected.

[0185] Furthermore, the diversion box 95 is provided with a discharge port, and the discharge port can be connected to the outside for discharge or connected to the alarm device. Once the alarm is triggered, the user will be reminded to process the leaked cooling medium, improving the operation reliability of the power module 200.

[0186] According to some embodiments of the present application, refer to Figures 10 to 13, a power module 200 is provided, which includes a valve assembly 100. The valve assembly 100 includes a front side, a rear side, a left side, a right side, an upper side, and a lower side. A first capacitor 65 is disposed on the right side of the valve assembly 100. A first laminated busbar 50 is disposed on the front side of the valve assembly 100 and electrically connects the first capacitor 65 and a part of the cooling member 20. A DC busbar 55 is disposed on the front side and is electrically connected to the first laminated busbar 50. A second capacitor 70 is disposed in the accommodation space formed between the rear side of the valve assembly 100 and the first capacitor 65 and is electrically connected to a part of the cooling member 20 through a second laminated busbar 75. A bypass switch 78 is arranged side by side with the second capacitor 70 in the front-rear direction. An AC busbar 60 is disposed on the rear side of the valve assembly 100, and one end of the AC busbar 60 is electrically connected to the cooling member 20 through the bypass switch 78, and the other end extends out from the left side of the valve assembly 100. A plurality of power supplies 85 are disposed on the rear side of the valve assembly 100 and are arranged in upper and lower layers with the second capacitor 70, the bypass switch 78, and the AC busbar 60. An inlet and outlet water pipe 88 is disposed on the left side of the valve assembly 100 and extends in the front-rear direction.

[0187] In the power module 200 according to the embodiment of the present application, by reasonably arranging other devices on the outer periphery of the valve assembly 100, the power module 200 has a compact structure, improves the space utilization rate, has a high power density, good heat dissipation performance, and improves the operation reliability, manufacturability, and maintainability of the power module 200.

[0188] Secondly, the embodiment of the present application further provides an energy storage valve sub-module, which includes the power module 200 in any of the above embodiments.

[0189] In addition, the embodiment of the present application also provides an energy storage system, which includes the energy storage valve sub-module in any of the above embodiments.

[0190] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered by the scope of the claims and the specification of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A valve assembly, characterized in that, It includes a power device, a cooling component, an impedance device and a press-fitting structure. The press-fitting structure has a press-fitting space, and the power device, the cooling component and the impedance device are arranged in the press-fitting space. The power device and the impedance device are electrically connected.

2. The valve assembly according to claim 1, characterized in that, The power device, the cooling component and the impedance device are arranged along a preset direction, and each power device and the impedance device are adjacent to at least one cooling component.

3. The valve assembly according to claim 2, characterized in that, The impedance device and the power device are arranged between the same two adjacent cooling components, and / or the impedance device and the power device are respectively arranged between two different adjacent cooling components.

4. The valve assembly according to claim 3, characterized in that, There are multiple power devices, and the multiple power devices and the cooling component are arranged alternately along the preset direction.

5. The valve assembly according to claim 4, characterized in that, The power device includes an IGBT or a unidirectional conduction tube. The valve assembly includes two IGBTs and two unidirectional conduction tubes, and each IGBT and each unidirectional conduction tube are arranged alternately along the preset direction.

6. The valve assembly according to any one of claims 1 to 5, characterized in that, The power device and the impedance device have contact conductive surfaces.

7. The valve assembly according to any one of claim 6, characterized in that, The impedance device is flat, and the contact conductive surface is located on the flat surface of the impedance device.

8. The valve assembly according to any one of claims 6 to 7, characterized in that, The cooling component is a conductive cooling component, and the contact conductive surfaces of the power device and the impedance device are in contact with the cooling component to achieve electrical connection.

9. The valve assembly according to claim 8, characterized in that, The impedance device and the power device are disc-shaped, and the absolute value of the difference between the diameter of the impedance device and the diameter of the power device is not greater than 10% of the diameter of the power device.

10. The valve assembly according to claim 8, characterized in that, The valve assembly further includes at least one positioning component, and at least one positioning component is arranged between the impedance device and the cooling component.

11. A power module, characterized in that, It includes the valve assembly according to any one of claims 1 to 10.

12. The power module according to claim 11, characterized in that, The impedance device includes a resistor.

13. An energy storage valve sub-module, characterized in that, It includes the power module according to claim 11 or 12.

14. An energy storage system, characterized in that, It includes the energy storage valve sub-module according to claim 13.

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