Method for arranging electronic component on flat cable and flat cable provided with electronic component

Abstract

The invention provides a method for arranging an electronic component on a flat cable and the flat cable provided with the electronic component. The method comprises the following steps that a flat cable is provided, the flat cable is provided with a first circuit and an insulating layer, and the insulating layer wraps the first circuit; a first line and an insulating layer in the flat cable are cut off to form a first opening, and the cut first line forms a first line segment and a second line segment. At the position of the first hole, the insulating layer partially covering the first line is removed to form a first opening partially exposing the first line segment and a second opening partially exposing the second line segment. Arranging a first electronic component in the first opening, wherein the first electronic component is provided with a first pin electrically connected with the first line segment and a second pin electrically connected with the second line segment; according to the method for arranging the electronic elements on the flat cable, the electronic elements can be configured and connected to the flat cable in an elastic, economical and optimal manner.

Description

Technical Field

[0001] The present invention relates to a method for arranging electronic components and a flexible printed circuit (FPC), and more particularly to a method for arranging electronic components on an FPC and an FPC with electronic components arranged thereon. Background Art

[0002] A circuit board includes various electronic components, and through various connection technologies, such as surface mount technology (SMT), electronic components such as resistors, capacitors, and transistors can be mounted on the surface of the circuit board. Regardless of the technology used, each electronic component must be connected and arranged on the circuit board according to the circuit layout of the circuit board.

[0003] In addition, due to the limited area of the circuit board, too many electronic components cannot be arranged on the circuit board, so that the functions of the circuit board are limited.

[0004] Therefore, how to provide a method for arranging electronic components on an FPC and an FPC with electronic components arranged thereon has become an urgent research topic at present. Summary of the Invention

[0005] In view of the above problems, the present invention provides a method for arranging an electronic component on an FPC, including the following steps: providing an FPC; wherein the FPC has a first circuit and an insulating layer, and the insulating layer covers the first circuit. Cutting the first circuit and the insulating layer in the FPC to form a first opening; wherein the cut first circuit forms a first line segment and a second line segment; at the position of the first opening, removing a part of the insulating layer covering the first circuit to form a first opening and a second opening; wherein the first opening exposes a part of the first line segment, and the second opening exposes a part of the second line segment. Arranging a first electronic component in the first opening, the first electronic component having a first pin and a second pin, the first pin being electrically connected to the first line segment exposed by the first opening, and the second pin being electrically connected to the second line segment exposed by the second opening.

[0006] The present invention further provides another method for arranging an electronic component on an FPC, including the following steps: providing an FPC; wherein the FPC has a first circuit, a second circuit, and an insulating layer, the first circuit and the second circuit are arranged side by side, and the insulating layer covers the first circuit and the second circuit; at a preset position of the component, removing a part of the insulating layer covering the first circuit and a part of the insulating layer covering the second circuit to form a slot; wherein the slot exposes the first circuit and the second circuit; arranging a second electronic component in the slot; wherein the second electronic component has a third pin and a fourth pin, the third pin being electrically connected to the first circuit exposed by the slot, and the fourth pin being electrically connected to the second circuit exposed by the slot.

[0007] The present invention includes a flexible printed circuit (FPC) provided with electronic components, comprising an FPC which includes a first circuit, an insulating layer, a first opening, a first aperture, and a second aperture. The first circuit includes a first line segment and a second line segment. The insulating layer coats the first circuit. The first opening is located in the insulating layer and between the first line segment and the second line segment. The first aperture is located in the first opening, partially exposing the first line segment. The second aperture is located in the first opening, partially exposing the second line segment, wherein a first electronic component is disposed in the first opening, the first electronic component having a first pin and a second pin, the first pin being electrically connected to the first line segment exposed by the first aperture, and the second pin being electrically connected to the second line segment exposed by the second aperture.

[0008] The present invention further includes a flexible printed circuit (FPC) provided with electronic components, comprising an FPC which includes a first circuit, a second circuit, an insulating layer, and a slot. The second circuit is arranged side by side with the first circuit. The insulating layer coats the first circuit and the second circuit. The slot is located in the insulating layer, partially exposing the first circuit and the second circuit, wherein a second electronic component is disposed in the slot, the second electronic component having a third pin and a fourth pin, the third pin being electrically connected to the first circuit exposed by the slot, and the fourth pin being electrically connected to the second circuit exposed by the slot.

[0009] As described above, the method of disposing electronic components on the flexible printed circuit (FPC) and the flexible printed circuit (FPC) provided with electronic components according to the present invention use a readily available FPC to dispose electronic components on the FPC, whereby the series-connected and parallel-connected electronic components can be configured in a flexible, economical, and optimized manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figures 1A to 1D is a sectional step flow chart of the first method for disposing electronic components on the flexible printed circuit (FPC) according to the present invention;

[0011] Figures 2A to 2D corresponding to Figures 1A to 1D is a top view;

[0012] Figure 3 is a sectional view of the electronic component disposed on the first circuit;

[0013] Figures 4A to 4C is a sectional step flow chart of the second method for disposing electronic components on the flexible printed circuit (FPC) according to the present invention;

[0014] Figure 5A and Figure 5B are a perspective view and a partial enlarged view of the flexible printed circuit (FPC) with electronic components disposed thereon by combining the first method and the second method according to the present invention; and

[0015] Figures 6A to 6E is a step flow chart of folding the circuit of the flexible printed circuit (FPC) according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] Please refer to Figures 1A to 1D, and refer to Figures 2A to 2D and Figure 3 , Figures 1A to 1D FIG. Figures 1A to 1D is a flow chart of the cross-sectional steps of the first method for setting electronic components on a flexible printed circuit (FPC). Figures 2A to 2D Corresponding to Figures 1A to 1D is a top view, Figure 3 and FIG. Figure 3 is a cross-sectional view of the electronic component disposed on the first circuit. The method for setting the electronic component on the FPC includes the following steps. As shown in FIGS. Figure 1A and Figure 2A , first, an FPC 10 is provided. The FPC 10 includes a first circuit 11 and an insulating layer 12. The insulating layer 12 includes an upper and a lower layer structure and covers the first circuit 11. For the sake of simplicity in the drawings, only the upper insulating layer 12 is labeled. As shown in FIGS. Figure 1B and Figure 2B , the first circuit 11 and the insulating layer 12 in the FPC 10 are cut to form a first opening 13. The cut first circuit 11 forms a first line segment 11a and a second line segment 11b. In an embodiment of the present invention, the method for cutting the insulating layer 12 and the first circuit 11 includes using various tools, such as a cutting tool or a punching machine, etc. In addition, the lower insulating layer 12 can be selectively cut or not cut, which is not limited in the present invention. As shown in FIGS. Figure 1C and Figure 2C , at the position of the first opening 13, a part of the insulating layer 12 covering the first circuit 11 is removed to form a first opening 141 and a second opening 142. Among them, the first opening 141 partially exposes the first line segment 11a of the first circuit 11, and the second opening 142 partially exposes the second line segment 11b of the first circuit 11. In an embodiment of the present invention, the method for removing a part of the insulating layer 12 includes melting or cutting. As shown in FIGS. Figure 1D , Figure 2D and Figure 3 , a first electronic component E1 is disposed in the first opening 13. The first electronic component E1 has a first pin E1a and a second pin E1b. The first pin E1a is electrically connected to the first line segment 11a exposed by the first opening 141, and the second pin E1b is electrically connected to the second line segment 11b exposed by the second opening 142. In an embodiment of the present invention, the method for disposing the first electronic component E1 on the first line segment 11a and the second line segment 11b includes surface mount technology (SMT), or using an adhesive to adhere the first pin E1a and the second pin E1b of the first electronic component E1 to the first line segment 11a and the second line segment 11b.

[0017] Please refer to Figures 4A to 4C ​​​​​​​​​​​​​​​​​​, which is a flowchart of the cross-sectional steps of the second method for disposing electronic components on a flexible printed circuit (FPC). In the above method steps, in addition to disposing the first electronic component E1 on both ends of the disconnected first line 11 to facilitate connecting the pins of the electronic component on the same line, in fact, the FPC 10 includes a plurality of parallel lines. Therefore, the pins of the electronic component can also be connected through each of the parallel lines in the FPC 10. Further, the FPC 10 has a second line 15, the first line 11 and the second line 15 are arranged side by side, and the insulating layer 12 covers the second line 15. The method for disposing an electronic component on a flexible printed circuit includes the following steps. As Figure 4A shown, Figure 4A shows a cross-sectional view of the first line 10 and the second line 15 arranged side by side in the FPC 10. As Figure 4B shown, at a preset component position, a part of the insulating layer 12 covering the first line 11 and a part of the insulating layer 12 covering the second line 15 are removed to form a slot 16. As Figure 4C shown, a second electronic component E2 is disposed in the slot 16. The second electronic component E2 has a third pin E2a and a fourth pin E2b. The third pin E2a is electrically connected to the exposed first line 11 in the slot 16, and the fourth pin E2b is electrically connected to the exposed second line 15 in the slot 16.

[0018] Please refer to Figure 5A and Figure 5B, which is a perspective view and a partial enlarged view of setting electronic components on a flexible printed circuit (FPC) by combining the above first method and second method. In this embodiment, a method of setting a first electronic component E1 and a second electronic component E2 on the FPC 10 by combining the above first method and second method is provided. The FPC has a second circuit, the first circuit and the second circuit are arranged side by side, and the insulating layer covers the first circuit and the second circuit. In this embodiment, the method of setting electronic components on the FPC includes the following steps. In step S10, an FPC 10 is provided, the FPC 10 includes a first circuit 11 and an insulating layer 12, and the insulating layer 12 includes an upper and a lower layer structure and covers the first circuit 11. In step S11, the first circuit 11 and the insulating layer 12 in the FPC 10 are cut to form a first opening 13, and the cut first circuit 11 forms a first line segment 11a and a second line segment 11b. In step S12, at the position of the first opening 13, a part of the insulating layer 12 covering the first circuit 11 is removed to form a first opening 141 and a second opening 142. Among them, the first opening 141 partially exposes the first line segment 11a of the first circuit 11, and the second opening 142 partially exposes the second line segment 11b of the first circuit 11. In step S13, the first electronic component E1 is set in the first opening 13. The first electronic component E1 has a first pin E1a and a second pin E1b. The first pin E1a is electrically connected to the first line segment 11a exposed by the first opening 141, and the second pin E1b is electrically connected to the second line segment 11b exposed by the second opening 142. In step S14, at a preset position of a component, a part of the insulating layer 12 covering the first circuit 11 and a part of the insulating layer 12 covering the second circuit 15 are removed to form a slot 16. In step S15, the second electronic component E2 is set in the slot 16. The second electronic component E2 has a third pin E2a and a fourth pin E2b. The third pin E2a is electrically connected to the first circuit 11 exposed in the slot 16, and the fourth pin E2b is electrically connected to the second circuit 15 exposed in the slot 16.

[0019] Please refer to again Figure 1D , in Figure 1DIn an embodiment, a flexible printed circuit (FPC) provided with electronic components includes a flexible printed circuit 10, the flexible printed circuit 10 having a first circuit 11, an insulating layer 12, a first opening 13, a first opening 141 and a second opening 142. The first circuit 11 includes a first line segment 11a and a second line segment 11b. The insulating layer 12 covers the first circuit 11. The first opening 13 is located in the insulating layer 12 and between the first line segment 11a and the second line segment 11b. The first opening 141 is located in the first opening 13, partially exposing the first line segment 11a. The second opening 142 is located in the first opening 13, partially exposing the second line segment 11b. A first electronic component E1 is disposed in the first opening 13. The first electronic component E1 has a first pin E1a and a second pin E1b. The first pin E1a is electrically connected to the first line segment 11a exposed in the first opening 141, and the second pin E1b is electrically connected to the second line segment 11b exposed in the second opening 142.

[0020] Please refer to again Figure 3 , in Figure 3 In an embodiment, a flexible printed circuit (FPC) provided with electronic components includes a first circuit 11, a second circuit 15, an insulating layer 12 and a slot 16. The second circuit 15 is arranged side by side with the first circuit 11. The insulating layer 12 covers the first circuit 11 and the second circuit 15. The slot 16 is located in the insulating layer 12 to partially expose the first circuit 11 and the second circuit 15. A second electronic component E2 is disposed in the slot 16. The second electronic component E2 has a third pin E2a and a fourth pin E2b. The third pin E2a is electrically connected to the first circuit 11 exposed in the slot 16, and the fourth pin E2b is electrically connected to the second circuit 15 exposed in the slot 16.

[0021] Please refer to together Figure 1D , Figure 3 and Figure 5A, The wire harness provided with electronic components includes a first circuit 11, an insulating layer 12, a first opening 13, a first opening 141, a second opening 142, and a slot 16. The first circuit 11 includes a first line segment 11a and a second line segment 11b. The insulating layer 12 covers the first circuit 11 and the second circuit 15. The second circuit 15 is arranged side by side with the first circuit 11. The first opening 13 is located in the insulating layer 12 and between the first line segment 11a and the second line segment 11b. The first opening 141 is located in the first opening 13, and part of the first line segment 11a is exposed. The second opening 142 is located in the first opening 13, and part of the second line segment 11b is exposed. The first electronic component E1 is arranged in the first opening 13. The first electronic component E1 has a first pin E1a and a second pin E1b. The first pin E1a is electrically connected to the first line segment 11a exposed in the first opening 141, and the second pin E1b is electrically connected to the second line segment 11b exposed in the second opening 142. The slot 16 is located in the insulating layer 12 and partially exposes the first circuit 11 and the second circuit 15. The second electronic component E2 is arranged in the slot 16. The second electronic component E2 has a third pin E2a and a fourth pin E2b. The third pin E2a is electrically connected to the first circuit 11 exposed in the slot 16, and the fourth pin E2b is electrically connected to the second circuit 15 exposed in the slot 16.

[0022] In an embodiment of the present invention, the first electronic component E1 and the second electronic component E2 include surface mount technology components, pin type components (such as resistors, capacitors, transistors, light emitting diodes, etc.), fuse and other components, and different setting methods are used according to different first electronic component E1 and second electronic component E2 to arrange the first electronic component E1 and the second electronic component E2 on the first circuit 11 and the second circuit 15. The wire harness 10 includes a transmission line made of Flexible Flat Cable (FFC) material, such as IDE (Integrated Device Electronics) wire harness, SATA (Serial Advanced Technology Attachment) wire harness. Accordingly, the method for setting electronic components on the wire harness by the present invention can widely and flexibly arrange various electronic components on the wire harness 10.

[0023] Please refer to Figures 6A to 6E , which is a step flow chart of the folding wire harness circuit of the present invention. Since the wire harness 10 and the circuit are made of flexible materials, therefore, without being limited to setting the wire harness on a plane, in the present invention, by folding, each circuit in the wire harness 10 can be bent to facilitate connection to the required position according to requirements. As Figure 6A shown, first, the setting position of the folding line 17 is drawn on the insulating layer 12 of the wire harness 10. As Figure 6BAs shown, according to the position of the folding line 17, the redundant first line 11, second line 15, and the insulating layer 12 covering the outside of the first line 11 and second line 15 are removed. As Figure 6C shown, one end of the flexible cable 10, the first line 11 and the second line 15 are connected to the circuit board B. As Figure 6D shown, on a plane, each of the first lines 11 and second lines 15 is bent in various preset directions and at various preset angles according to the configured positions of the lines. In the embodiment of the present invention, the bending angle is taken as 90 degrees as an example, but is not limited to 90 degrees. As Figure 6E shown, in space, each of the first lines 11 and second lines 15 is bent in various preset directions and at various preset angles according to the configured positions of the lines to form a three-dimensional circuit structure of the flexible cable 10. It should be noted that Figures 6A to 6E The flowchart of the steps of folding the flexible cable circuit is exemplified by Figures 1A to 1D the first method of setting electronic components on the flexible cable. In fact Figures 6A to 6E the flowchart of the steps of folding the flexible cable circuit can also be applied to Figures 4A to 4C the second method of setting electronic components on the flexible cable, and is applied to Figure 5A and Figure 5B the combination of the first method and the second method.

[0024] In summary, the method of the present invention for disposing electronic components on a flexible cable uses a readily available flexible cable to dispose the electronic components on the flexible cable, whereby the series-connected and parallel-connected electronic components can be configured in a flexible, economical, and optimized manner. In addition, compared with the prior art that uses Flexible Printed Circuit materials, in the manufacturing process, processing must be performed on the flexible printed circuit board, such as drilling holes, developing, exposing, and etching on the circuit substrate to complete the circuit configuration, thus making the overall manufacturing process consume more steps and materials. In contrast, in the method of the present case for disposing electronic components on a flexible cable, only a single copper wire in the flexible cable needs to be bonded and formed with the electronic components, so the material loss is less. Furthermore, compared with the original product using Flexible Flat Cable material, the product completed by the present case through Surface Mount Technology (SMT) combined with Flexible Flat Cable (FFC) material can withstand the high temperature of 260 degrees Celsius in the SMT process, thus significantly improving the high-temperature resistance of the product and can be further widely applied to various electronic components such as resistors, capacitors, and light-emitting diodes, thereby achieving product diversity from complexity. In addition, compared with the existing flexible flat cable that can only dispose the fuse at the input / output position of the circuit board, when the fuse is disposed on the flexible cable as an electronic component in the present case, since the product completed by Surface Mount Technology (SMT) combined with Flexible Flat Cable (FFC) material can directly dispose the fuse near the battery module, when an overcurrent occurs, the fuse can achieve a quick response and instant fusing effect, thus further improving the safety factor of the product.

[0025] The above are only the preferred embodiments of the present invention and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art, without departing from the technical solution of the present invention, can make some changes or modifications to the above-disclosed technical content to obtain equivalent embodiments with equivalent changes. However, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A method for arranging electronic components on a flexible printed circuit, characterized in that, The method includes the following steps: Provide a flexible printed circuit (FPC); wherein, the FPC has a first circuit and an insulating layer, and the insulating layer covers the first circuit; Cut the first circuit and the insulating layer in the FPC to form a first opening; wherein, the cut first circuit forms a first line segment and a second line segment; At the position of the first opening, remove a part of the insulating layer covering the first circuit to form a first opening and a second opening; wherein, the first opening exposes part of the first line segment of the first circuit, and the second opening exposes part of the second line segment of the first circuit; and Dispose a first electronic component in the first opening; wherein, the first electronic component has a first pin and a second pin, the first pin is electrically connected to the first line segment exposed by the first opening, and the second pin is electrically connected to the second line segment exposed by the second opening.

2. The method for arranging electronic components on a flexible printed circuit according to claim 1, characterized in that, The FPC further has a second circuit, the first circuit and the second circuit are arranged side by side, and the insulating layer covers the second circuit; Wherein, the method further includes the following steps: At a preset position of a component, remove a part of the insulating layer covering the first circuit and a part of the insulating layer covering the second circuit to form a slot; and Dispose a second electronic component in the slot; wherein, the second electronic component has a third pin and a fourth pin, the third pin is electrically connected to the first circuit exposed by the slot, and the fourth pin is electrically connected to the second circuit exposed by the slot.

3. The method for arranging electronic components on a flexible printed circuit according to claim 2, characterized in that, The method further includes the following steps: Dispose at least one folding line on the insulating layer of the FPC; Remove a part of the first circuit, a part of the second circuit, and the insulating layer covering the first circuit and the second circuit according to the set position of the at least one folding line; Connect one end of the first circuit and the second circuit of the FPC to a circuit board; Bend the first circuit and the second circuit on a plane at a first preset angle and in a first preset direction according to the set position of the at least one folding line; And Bend the first circuit and the second circuit in a space at a second preset angle and in a second preset direction according to the set position of the at least one folding line.

4. A method for arranging electronic components on a flexible printed circuit, characterized in that, The method includes the following steps: Provide a flexible printed circuit (FPC); wherein, the FPC has a first circuit, a second circuit and an insulating layer, the first circuit and the second circuit are arranged side by side, and the insulating layer covers the first circuit and the second circuit; At a preset position of a component, remove a part of the insulating layer covering the first circuit and a part of the insulating layer covering the second circuit to form a slot; wherein, the slot exposes part of the first circuit and the second circuit; and Dispose a second electronic component in the slot; wherein, the second electronic component has a third pin and a fourth pin, the third pin is electrically connected to the first circuit exposed by the slot, and the fourth pin is electrically connected to the second circuit exposed by the slot.

5. A flexible printed circuit with electronic components arranged thereon, characterized in that, The method includes: A flexible printed circuit (FPC) having: A first circuit including a first line segment and a second line segment; An insulating layer covering the first circuit; A first opening located in the insulating layer and between the first line segment and the second line segment; A first opening located in the first opening, exposing part of the first line segment; And A second opening, located in the first opening, partially exposes the second line segment; One of the first electronic components is disposed in the first opening. The first electronic component has a first pin and a second pin. The first pin is electrically connected to the first line segment exposed by the first opening, and the second pin is electrically connected to the second line segment exposed by the second opening.

6. The flexible printed circuit with electronic components arranged thereon according to claim 5, characterized in that, Further comprising: A second line, arranged side by side with the first line, and the insulating layer covers the second line; And A slot, located in the insulating layer, partially exposes the first line and the second line; One of the second electronic components is disposed in the slot. The second electronic component has a third pin and a fourth pin. The third pin is electrically connected to the first line exposed by the slot, and the fourth pin is electrically connected to the second line exposed by the slot.

7. The flexible cable provided with electronic components according to claim 6, wherein, The first electronic component and the second electronic component are a fuse.

8. A flexible cable provided with electronic components, characterized in that, Comprising: A flexible printed circuit (FPC), comprising: A first line; A second line, arranged side by side with the first line; An insulating layer, covering the first line and the second line; And A slot, located in the insulating layer, partially exposes the first line and the second line; One of the second electronic components is disposed in the slot. The second electronic component has a third pin and a fourth pin. The third pin is electrically connected to the first line exposed by the slot, and the fourth pin is electrically connected to the second line exposed by the slot.

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