Electric connection method, camera module and electronic device

Abstract

An electric connection method comprises the steps that a to-be-pressed assembly is provided, the to-be-pressed assembly comprises a first connecting pad, a second connecting pad and an insulating layer, the first connecting pad comprises a first part and a second part connected with the first part, the first part and the second connecting pad are oppositely arranged in a spaced mode, and the second part and the second connecting pad are arranged in a staggered mode; the insulating layer covers the second portion. A conductive film to be activated is disposed between the first portion and the second connection pad. The conductive film to be activated includes a plurality of conductive particles electrically isolated from each other. The first part, the second connecting pad and the to-be-activated conductive film are pressed, the to-be-activated conductive film is pressed to become an activated conductive film, part of the activated conductive film extends to the insulating layer, the activated conductive film comprises a plurality of conductive particles which are electrically connected with one another, and the activated conductive film is electrically connected with the first part and the second connecting pad; the insulating layer electrically isolates the second portion from the second connection pad. In addition, the invention also provides a camera module and an electronic device.

Description

Technical Field

[0001] This application relates to the field of electrical connection, and particularly to an electrical connection method, a camera module, and an electronic device. Background Art

[0002] In the camera module assembly industry, anisotropic conductive film (ACF) is widely used due to its low cost, high reliability, and good toughness. This material is particularly suitable for connecting miniaturized electronic components, for example, establishing an electrical connection between the pads of a flexible printed circuit board (FPC) and the pads of a lens assembly. The key characteristic of anisotropic conductive film is its anisotropic conductivity, which means it conducts electricity only in the vertical direction (i.e., the direction of applied pressure) and remains insulated in the horizontal direction.

[0003] This characteristic of anisotropic conductive film mainly benefits from its internal structure: tiny conductive particles (usually metal or metal-coated particles) are dispersed in a non-conductive adhesive (usually epoxy resin). In the process of press-fitting connection, applying pressure and heat causes these conductive particles to be pressed into the surface of the contacting electronic components, forming a vertical conductive path. At the same time, due to the presence of the adhesive, conduction in the horizontal direction is prevented.

[0004] However, this technology also faces challenges in practical applications. Due to the characteristics of epoxy resin glue and the mobility of conductive particles, when the epoxy resin glue is heated during the press-fitting process, the conductive particles may accumulate in specific areas. This non-uniform distribution of particles may cause signal interference between signal connection pads, especially in applications with high-density connections. Signal interference not only affects the performance of the circuit but may also lead to circuit failures, thus affecting the reliability and performance of the entire camera module. Summary of the Invention

[0005] The purpose of this application is to provide an electrical connection method to solve the above technical problems.

[0006] In addition, this application also provides a camera module.

[0007] In addition, this application also provides an electronic device, which includes the above camera module.

[0008] An electrical connection method comprises the following steps: providing a component to be pressed, the component to be pressed comprises a first connection pad, a second connection pad and an insulating layer, the first connection pad comprises a first part and a second part connected to the first part, the first part and the second connection pad are arranged relative to each other, the second part and the second connection pad are arranged staggered, and the insulating layer covers the second part. A conductive film to be activated is arranged between the first part and the second connection pad, the conductive film to be activated comprises a plurality of conductive particles electrically isolated from each other. Pressing the first part, the second connection pad and the conductive film to be activated, the conductive film to be activated is pressed to become an activated conductive film, a part of the activated conductive film extends to the insulating layer, the activated conductive film comprises a plurality of conductive particles electrically connected to each other, the activated conductive film electrically connects the first part and the second connection pad, and the insulating layer electrically isolates the second part and the second connection pad.

[0009] In some possible embodiments, the assembly to be pressed includes a lens assembly and a circuit board assembly, the lens assembly includes a first body and a plurality of the first connecting pads, the plurality of the first connecting pads are arranged side by side on the outer surface of the first body, and the circuit board assembly includes a second body and a plurality of the second connecting pads, the plurality of the second connecting pads are arranged side by side on the outer surface of the second body.

[0010] In some possible embodiments, the conductive film to be activated also includes an adhesive, and the plurality of conductive particles are dispersed in the adhesive at intervals, and the step of "pressing the first part, the second connecting pad and the conductive film to be activated" also includes: heating and curing the adhesive to form an adhesive matrix, the adhesive matrix has a thickness direction, the plurality of conductive particles are in contact with each other and form a conductive path, and the conductive path electrically connects the first part and the second connecting pad along the thickness direction.

[0011] In some possible embodiments, the step of "pressing the first part, the second connection pad, and the conductive film to be activated" includes: providing a hot press machine, the hot press machine including a machine platform and a hot press head. The assembly to be pressed and the conductive film to be activated are arranged between the machine platform and the hot press head, the machine platform supports the first body, the second body faces the hot press head, and the conductive film to be activated is arranged between the first part and the second connection pad. The hot press head is moved toward the machine platform, the hot press head applies pressure to the second body, and the machine platform applies pressure to the first body, so that the conductive film to be activated between the first part and the second connection pad is pressed to become the activated conductive film.

[0012] In some possible embodiments, the method further includes steps of disposing a first buffer pad between the hot pressing head and the second body, and disposing a second buffer pad between the machine table and the first body.

[0013] A camera module includes a circuit board assembly, a lens assembly, and an activation conductive film. The circuit board assembly includes a first connection pad and an insulating layer. The first connection pad includes a first portion and a second portion. The insulating layer covers the first portion. The lens assembly includes a second connection pad disposed corresponding to the first portion. The second portion is disposed offset from the second connection pad. The activation conductive film is disposed between the first connection pad and the second connection pad. The activation conductive film includes a plurality of conductive particles connected to each other. The activation conductive film is electrically connected to the first portion and the second connection pad. The insulating layer electrically isolates the second portion and the second connection pad.

[0014] In some possible embodiments, the circuit board assembly further includes a substrate layer and a conductive structure disposed in the substrate layer. A plurality of the first connection pads are disposed on one side of the substrate layer. The plurality of first connection pads are connected to the conductive structure. The insulating layer is disposed on the substrate layer and covers the plurality of first connection pads. The insulating layer is provided with openings, and the first portions of the plurality of first connection pads are exposed in the openings.

[0015] In some possible embodiments, the lens assembly further includes a lens element assembly, a voice coil motor, an anti-shake assembly, and a photosensitive chip. The lens element assembly is connected to one side of the voice coil motor. The anti-shake assembly is connected to the other side of the voice coil motor. The photosensitive chip is disposed on the anti-shake assembly. The anti-shake assembly protrudes from an edge of the voice coil motor to form a connection portion. The connection portion is electrically connected to the voice coil motor. A plurality of the second connection pads are arranged side by side on a surface of the connection portion.

[0016] In some possible embodiments, the activation conductive film further includes an adhesive matrix. The plurality of conductive particles are in contact with each other in the adhesive matrix and form a conduction path. The conduction path electrically conducts the first portion and the second connection pad.

[0017] An electronic device includes the camera module as described above.

[0018] Compared with the prior art, the electrical connection method provided by the present application sets an insulating layer on the second part of the first connection pad, and then presses the first connection pad, the second connection pad, and the to-be-activated conductive film therebetween, so that the to-be-activated conductive film becomes an activated conductive film. Even if a part of the activated conductive film extends out of the corresponding area of the first connection pad and the first part and extends onto the second part, the insulating layer can electrically isolate the second part and the second connection pad. In this way, it is beneficial to reduce the risk of short circuit between the second part and the second connection pad caused during the pressing process and improve the yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a flowchart of the electrical connection method provided by an embodiment of the present application.

[0020] Figure 2 It is a cross-sectional schematic view of a to-be-pressed component provided by an embodiment of the present application.

[0021] Figure 3 is Figure 2 A top view of the circuit board assembly of the to-be-pressed component shown.

[0022] Figure 4 is Figure 2 A cross-sectional schematic view of the to-be-pressed component shown after setting the to-be-activated conductive film.

[0023] Figure 5 is for pressing Figure 4 A cross-sectional schematic view during the process of pressing the to-be-pressed component shown.

[0024] Figure 6 is for pressing Figure 4 A cross-sectional schematic view of the camera module formed after pressing the to-be-pressed component shown.

[0025] Figure 7 It is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0026] MAIN ELEMENT SYMBOL DESCRIPTION

[0027] Camera module 100

[0028] To-be-pressed component 10

[0029] First connection pad 11

[0030] First part 111

[0031] Second part 112

[0032] Second connection pad 12

[0033] Insulating layer 13

[0034] Window opening 131

[0035] Circuit board assembly 20

[0036] First body 21

[0037] Flexible board 211

[0038] Base material layer 211a

[0039] Conductive structure 211b

[0040] Lens assembly 30

[0041] Second body 31

[0042] Lens element assembly 311

[0043] Voice coil motor 312

[0044] Anti-shake assembly 313

[0045] Photosensitive chip 314

[0046] To-be-activated conductive film 40

[0047] Conductive particles 41

[0048] Conduction path 411

[0049] Adhesive 42

[0050] Activated conductive film 43

[0051] Bonding matrix 44

[0052] First buffer pad 45

[0053] Second buffer pad 46

[0054] Hot press 50

[0055] Machine platform 51

[0056] Hot press head 52

[0057] Electronic device 200

[0058] Housing 201

[0059] Thickness direction A1

[0060] The following specific embodiments will further illustrate the present invention in conjunction with the above accompanying drawings. Specific embodiments

[0061] Next, the technical solutions of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0062] It should be noted that when a component is referred to as "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component at the same time. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are only for the purpose of illustration.

[0063] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "vertical" is used to describe the ideal state between two components. In the actual production or use state, there can be a state approximately vertical between two components. For example, in combination with numerical descriptions, vertical can refer to the included angle range between two straight lines being between 90°±10°, vertical can also refer to the dihedral angle range between two planes being between 90°±10°, and vertical can also refer to the included angle range between a straight line and a plane being between 90°±10°. The two components described as "vertical" may not be absolutely straight lines or planes, and may also be approximately straight lines or planes. From a macroscopic perspective, as long as the overall extension direction is a straight line or a plane, the components can be considered "straight lines" or "planes".

[0064] Unless otherwise defined, all technical and scientific terms used in this article have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the specification of this application in this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "or / and" used in this article includes any and all combinations of one or more of the related listed items.

[0065] The following will describe in detail some embodiments of this application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0066] Please refer to Figure 1 , this application provides an electrical connection method, including the steps:

[0067] S1: Please refer to Figure 2 and Figure 3, provide a component 10 to be pressed. The component 10 to be pressed includes a first connection pad 11, a second connection pad 12 and an insulating layer 13. The first connection pad 11 includes a first part 111 and a second part 112 connected to the first part 111. The first part 111 and the second connection pad 12 are arranged relative to each other. The second part 112 and the second connection pad 12 are staggered. The insulating layer 13 covers the second part 112. Among them, the insulating layer 13 includes an oxide layer or a polymer coating, the material of the oxide layer includes aluminum oxide (Al2O3), silicon oxide (SiO2), etc., and the material of the polymer coating includes polyimide (Polyimide), polytetrafluoroethylene (PTFE, i.e. Teflon), polyethylene (PE), etc.

[0068] In the present embodiment, the assembly to be pressed 10 includes a circuit board assembly 20 and a lens assembly 30. The circuit board assembly 20 includes a first body 21 and a plurality of first connection pads 11 arranged on the outer surface of the first body 21, and the plurality of first connection pads 11 are arranged side by side. The lens assembly 30 includes a second body 31 and a plurality of second connection pads 12 arranged on the outer surface of the second body 31, and the plurality of second connection pads 12 are arranged side by side. The first part 111 of the first connection pad 11 is arranged relative to the second connection pad 12 one by one. It can be understood that in other embodiments of the present application, the assembly to be pressed 10 can be a light-emitting diode and a control circuit in a display, a car dashboard and other display systems, an electronic component in a medical device, and other scenes requiring electrical connection.

[0069] In this embodiment, the first body 21 includes a flexible board 211, and the flexible board 211 includes a substrate layer 211a and a conductive structure 211b arranged in the substrate layer 211a. A plurality of first connection pads 11 are arranged on one side of the substrate layer 211a, and each of the first connection pads 11 is connected to the conductive structure 211b. The insulating layer 13 is arranged on the substrate layer 211a. The insulating layer 13 covers a plurality of first connection pads 11. The insulating layer 13 electrically isolates the second parts 112 of the plurality of first connection pads 11. The insulating layer 13 is provided with a window 131, so that the first part 111 of each first connection pad 11 is exposed in the window 131. Among them, the substrate layer 211a is made of polyimide. It can be immediately understood that in other embodiments of the present application, the first body 21 can also be a hard board or a hard-flex board.

[0070] In this embodiment, the second body 31 includes a lens assembly 311, a voice coil motor 312, an anti-shake assembly 313, and an image sensor chip 314. The lens assembly 311 is connected to one side of the voice coil motor 312. The anti-shake assembly 313 is connected to the other side of the voice coil motor 312. The image sensor chip 314 is disposed on the anti-shake assembly 313. The lens assembly 311 is configured to focus and direct light to the image sensor chip 314. The voice coil motor 312 uses the magnetic force generated by an electromagnetic coil to control the movement of the lens assembly 311, thereby achieving fast and accurate focusing. The anti-shake assembly 313 is configured to adjust the position of the image sensor chip 314 physically or electronically to counteract minute movements or vibrations, thereby improving image quality. The anti-shake assembly 313 protrudes from the edge of the voice coil motor 312 to form a connection portion 313a, and the connection portion 313a is electrically connected to the voice coil motor 312. A plurality of the second connection pads 12 are arranged side by side on the surface of the connection portion 313a. The plurality of second connection pads 12 are configured to be electrically connected to the plurality of first connection pads 11 to achieve electrical connection between the second body 31 and the first body 21.

[0071] S2: Please refer to Figure 4 , and a to-be-activated conductive film 40 is disposed between the first portion 111 and the second connection pad 12. The to-be-activated conductive film 40 includes a plurality of conductive particles 41 that are electrically insulated from each other.

[0072] In this embodiment, the to-be-activated conductive film 40 is an anisotropic conductive film (ACF). The to-be-activated conductive film 40 further includes an adhesive 42, and the plurality of conductive particles 41 are dispersed in the adhesive 42, and adjacent conductive particles 41 are electrically insulated from each other. The material of the conductive particles 41 includes one of gold (Au), nickel (Ni), nickel-plated gold (Ni / Au), silver (Ag), and copper (Cu). The adhesive 42 is a thermosetting resin, specifically including one of epoxy resins, polyimide, and phenolic resins.

[0073] S3: Please refer to Figure 5 and Figure 6, press the first connection pad 11, the second connection pad 12, and the to-be-activated conductive film 40. The to-be-activated conductive film 40 is pressed to become the activated conductive film 43. A part of the activated conductive film 43 extends to the insulating layer 13. The activated conductive film 43 includes a plurality of conductive particles 41 that are electrically connected to each other. The activated conductive film 43 is electrically connected to the first part 111 and the second connection pad 12. The insulating layer 13 electrically isolates the second part 112 and the second connection pad 12.

[0074] In this embodiment, please refer to Figure 5 and Figure 6 , step S3 further includes the steps of:

[0075] S31: Heat the adhesive 42 in the to-be-activated conductive film 40 so that the adhesive 42 cures into the bonding matrix 44. The bonding matrix 44 has a thickness direction A1, and a plurality of the conductive particles 41 are in contact with each other and form a conduction path 411, and the conduction path 411 conducts electricity between the first part 111 and the second connection pad 12 along the thickness direction A1.

[0076] In this embodiment, step S3 specifically includes:

[0077] S32: Please refer to Figure 5 , provide a hot press 50, and the hot press 50 includes a machine table 51 and a hot pressing head 52. The machine table 51 is used to provide support, and the hot pressing head 52 is used to apply pressure and generate heat.

[0078] S33: Please refer to Figure 5 and Figure 6 , arrange the to-be-pressed component 10 and the to-be-activated conductive film 40 between the machine table 51 and the hot pressing head 52. The machine table 51 supports the second body 31, and the first body 21 faces the hot pressing head 52. The to-be-activated conductive film 40 is arranged between the first connection pad 11 and the second connection pad 12.

[0079] S34: Please refer to Figure 6 , move the hot pressing head 52 towards the machine table 51, the hot pressing head 52 presses on the first body 21, and the machine table 51 presses on the second body 31, so that the to-be-activated conductive film 40 between the first part 111 and the second connection pad 12 is pressed to become the activated conductive film 43. At the same time, the hot pressing head 52 conducts heat to the to-be-activated conductive film 40, so that the adhesive 42 cures into the bonding matrix 44.

[0080] In this embodiment, step S3 further includes:

[0081] S35: A first buffer pad 45 is arranged between the hot pressing head 52 and the second body 31, and a second buffer pad 46 is arranged between the machine table 51 and the first body 21. The first buffer pad 45 is used to buffer and maintain the stability of the component to be pressed 10 and to assist in uniformly distributing the pressure and heat applied to the conductive film 40 to be activated. The second buffer pad 46 is used to fix the component to be pressed 10. Specifically, the first buffer pad 45 is made of silicone. The second buffer pad 46 is made of rubber or polyurethane.

[0082] Compared with the prior art, the electrical connection method provided in the present application is to set an insulating layer 13 on the second part 112 of the first connection pad 11, and then press the first connection pad 11, the second connection pad 12 and the conductive film 40 to be activated therebetween, so that the conductive film 40 to be activated becomes an activated conductive film 43. Even if part of the activated conductive film 43 extends out of the corresponding area of ​​the first connection pad 11 and the first part 111, and extends to the second part 112, the insulating layer 13 can also electrically isolate the second part 112 and the second connection pad 12. In this way, it is helpful to reduce the risk of short circuit between the second part 112 and the second connection pad 12 caused by the pressing process, and improve the yield of the product. At the same time, the insulating layer 13 can also electrically isolate the adjacent second part 112, which is helpful to reduce the influence of external static electricity on the product and reduce the problem of product signal interference, thereby improving the reliability of the overall product.

[0083] See also Figure 6 , an embodiment of the present application also provides a camera module 100 made by the above-mentioned electrical connection method, the camera module 100 includes a circuit board assembly 20, a lens assembly 30 and an activated conductive film 43. The circuit board assembly 20 includes a first connection pad 11 and an insulating layer 13, the first connection pad 11 includes a first part 111 and a second part 112, and the insulating layer 13 covers the first part 111. The lens assembly 30 includes a second connection pad 12, the second connection pad 12 is arranged corresponding to the first part 111, and the second part 112 is staggered with the second connection pad 12. The activated conductive film 43 is arranged between the first connection pad 11 and the second connection pad 12, the activated conductive film 43 includes a plurality of conductive particles 41 connected to each other, the activated conductive film 43 electrically connects the first part 111 and the second connection pad 12, and the insulating layer 13 electrically isolates the second part 112 from the second connection pad 12.

[0084] Please also see Figure 2 and Figure 6, in this embodiment, the circuit board assembly 20 further includes a substrate layer 211a and a conductive structure 211b disposed within the substrate layer 211a. A plurality of the first connection pads 11 are disposed on one side of the substrate layer 211a, and the plurality of first connection pads 11 are connected to the conductive structure 211b. The insulating layer 13 is disposed on the substrate layer 211a, and the insulating layer 13 covers the plurality of first connection pads 11. The insulating layer 13 is provided with openings 131, and the first portions 111 of the plurality of first connection pads 11 are exposed in the openings 131.

[0085] In this embodiment, the lens assembly 30 further includes a lens component 311, a voice coil motor 312, an anti-shake component 313, and an image sensor chip 314. The lens component 311 is connected to one side of the voice coil motor 312, the anti-shake component 313 is connected to the other side of the voice coil motor 312, the image sensor chip 314 is disposed on the anti-shake component 313, and the anti-shake component 313 protrudes from the edge of the voice coil motor 312 to form a connection portion 313a. The connection portion 313a is electrically connected to the voice coil motor 312, and a plurality of the second connection pads 12 are arranged side by side on the surface of the connection portion 313a.

[0086] In this embodiment, the activated conductive film 43 further includes an adhesive matrix 44. The adhesive matrix 44 has a thickness direction A1. A plurality of the conductive particles 41 are in contact with each other in the adhesive matrix 44 to form a conduction path 411. The conduction path 411 extends substantially along the thickness direction A1, and the conduction path 411 electrically conducts the first portion 111 and the second connection pad 121.

[0087] In addition, please refer to Figure 7 , an embodiment of the present application further provides an electronic device 200. The electronic device 200 includes a housing 201 and the camera module 100. A part of the camera module 100 is exposed from the housing 201. Specifically, the electronic device 200 includes electronic devices with a camera function such as mobile phones, tablet computers, and smart watches.

[0088] In addition, those of ordinary skill in the art in this technical field should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. As long as appropriate changes and variations made to the above embodiments fall within the scope of the spirit of the present invention, they fall within the scope of protection required by the present invention.

Claims

1. An electrical connection method, characterized in that, Including the steps of: Providing a component to be laminated, the component to be laminated including a first connection pad, a second connection pad, and an insulating layer, the first connection pad including a first portion and a second portion connecting the first portion, the first portion being disposed opposite and spaced apart from the second connection pad, the second portion being disposed offset from the second connection pad, and the insulating layer covering the second portion; Disposing an activatable conductive film between the first portion and the second connection pad, the activatable conductive film including a plurality of conductive particles that are electrically insulated from each other; Laminating the first portion, the second connection pad, and the activatable conductive film, the activatable conductive film being pressed into an activated conductive film, a part of the activated conductive film extending to the insulating layer, the activated conductive film including a plurality of conductive particles that are electrically connected to each other, the activated conductive film electrically connecting the first portion and the second connection pad, and the insulating layer electrically insulating the second portion and the second connection pad.

2. The electrical connection method according to claim 1, characterized in that, The component to be laminated includes a lens component and a circuit board component, the lens component including a first body and a plurality of the first connection pads, the plurality of first connection pads being arranged side by side on an outer surface of the first body, the circuit board component including a second body and a plurality of the second connection pads, the plurality of second connection pads being arranged side by side on an outer surface of the second body.

3. The electrical connection method according to claim 1, characterized in that, The activatable conductive film further includes an adhesive, the plurality of conductive particles being spaced apart and dispersed in the adhesive, and the step of "laminating the first portion, the second connection pad, and the activatable conductive film" further includes: Heating and curing the adhesive to form an adhesive matrix, the adhesive matrix having a thickness direction, the plurality of conductive particles contacting each other and forming a conduction path, the conduction path electrically conducting the first portion and the second connection pad along the thickness direction.

4. The electrical connection method according to claim 2, characterized in that, The step of "laminating the first portion, the second connection pad, and the activatable conductive film" includes: Providing a hot press, the hot press including a machine table and a hot pressing head; Disposing the component to be laminated and the activatable conductive film between the machine table and the hot pressing head, the machine table supporting the first body, the second body facing the hot pressing head, and the activatable conductive film being disposed between the first portion and the second connection pad; Moving the hot pressing head toward the machine table, the hot pressing head applying pressure to the second body, and the machine table applying pressure to the first body, such that the activatable conductive film between the first portion and the second connection pad is pressed into the activated conductive film.

5. The electrical connection method according to claim 4, characterized in that, Further including the steps of: Disposing a first buffer pad between the hot pressing head and the second body, and Disposing a second buffer pad between the machine table and the first body.

6. A camera module, characterized in that, Including: A circuit board component, the circuit board component including a first connection pad and an insulating layer, the first connection pad including a first portion and a second portion, the insulating layer covering the first portion, A lens component, the lens component including a second connection pad, the second connection pad being disposed corresponding to the first portion, the second portion being disposed offset from the second connection pad; Activate the conductive film, which is disposed between the first connection pad and the second connection pad. The activated conductive film includes a plurality of conductive particles connected to each other. The activated conductive film is electrically connected to the first portion and the second connection pad, and the insulating layer electrically isolates the second portion and the second connection pad.

7. The camera module according to claim 6, characterized in that, The circuit board assembly further includes a substrate layer and a conductive structure disposed within the substrate layer. A plurality of the first connection pads are disposed on one side of the substrate layer, and the plurality of first connection pads are connected to the conductive structure. The insulating layer is disposed on the substrate layer, and the insulating layer covers the plurality of first connection pads. The insulating layer is provided with openings, and the first portions of the plurality of first connection pads are exposed through the openings.

8. The camera module according to claim 6, characterized in that, The lens assembly further includes a lens assembly, a voice coil motor, an anti-shake assembly, and a photosensitive chip. The lens assembly is connected to one side of the voice coil motor, the anti-shake assembly is connected to the other side of the voice coil motor, the photosensitive chip is disposed on the anti-shake assembly, and the anti-shake assembly protrudes from the edge of the voice coil motor to form a connection portion. The connection portion is electrically connected to the voice coil motor, and a plurality of the second connection pads are arranged side by side on the surface of the connection portion.

9. The camera module according to claim 6, characterized in that, The activated conductive film further includes an adhesive matrix. The plurality of conductive particles are in contact with each other in the adhesive matrix and form a conduction path, and the conduction path electrically conducts the first portion and the second connection pad.

10. An electronic device, characterized in that, Comprising the camera module according to any one of claims 6 to 9.

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