Heat dissipation plate, middle frame and electronic equipment

Abstract

The invention provides a heat dissipation plate, a middle frame and electronic equipment. The heat dissipation plate comprises a first cover plate, a second cover plate, a capillary structure and a cooling medium; the second cover plate comprises a middle area and an edge area arranged around the middle area, and the middle area comprises a shaping area and a containing area connected with the shaping area; the edge area is fixedly connected with the first cover plate, the containing area of the middle area and the first cover plate are arranged in a spaced mode, a containing cavity is defined, the capillary structure is fixedly connected with the first cover plate and located in the containing cavity, and the cooling medium is arranged in the containing cavity; the shaping area of the middle area is fixedly connected with the first cover plate. Therefore, when the accommodating area of the second cover plate is not flat, the edge acting force can be applied to the shaping area of the second cover plate, so that the flatness of the accommodating area of the second cover plate can be calibrated to be within the specification, the yield of the flatness of the heat dissipation plate is improved to a great extent, and the problems of top screen of the heat dissipation plate and battery degumming are solved.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly relates to a heat dissipation plate, a middle frame, and an electronic device. Background Art

[0002] High-performance heat dissipation of mobile phones is an important way to release the performance of mobile phones. The heat dissipation plate is used as a high-performance heat dissipation component to improve the overall heat dissipation capacity of the machine. The traditional heat dissipation plate includes a first cover plate, a second cover plate, a capillary structure, and a coolant. The edge of the second cover plate is fixedly connected to the first cover plate, so that the middle part of the second cover plate and the first cover plate enclose a sealed cavity, and both the capillary structure and the coolant are arranged in the sealed cavity. However, during the assembly process of the heat dissipation plate, the first cover plate and / or the second cover plate are prone to deformation, resulting in poor flatness of the first cover plate and / or the second cover plate. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a heat dissipation plate, a middle frame, and an electronic device, and the heat dissipation plate has relatively high flatness.

[0004] In a first aspect, this application provides a heat dissipation plate. The heat dissipation plate includes a first cover plate, a second cover plate, a capillary structure, and a cooling medium; the second cover plate includes a middle area and an edge area arranged around the middle area, the middle area includes a shaping area and a receiving area connecting the shaping area; the edge area is fixedly connected to the first cover plate, the receiving area of the middle area is spaced from the first cover plate and encloses a receiving cavity, the capillary structure is fixedly connected to the first cover plate and is located in the receiving cavity, the cooling medium is arranged in the receiving cavity; the shaping area of the middle area is fixedly connected to the first cover plate.

[0005] It can be understood that when the receiving area of the second cover plate protrudes away from the first cover plate, the flatness of the receiving area of the second cover plate is poor. In the embodiments of this application, a jig can be used to apply a force in a first direction to the shaping area of the second cover plate, so that the receiving area of the second cover plate no longer protrudes away from the first cover plate under the tensile force, that is, the receiving area of the second cover plate can be flattened, and the receiving area of the second cover plate can be calibrated to a better flatness, that is, the flatness of the receiving area of the second cover plate can be calibrated within the specifications, thereby greatly improving the yield of the flatness of the heat dissipation plate. In addition, since the shaping area of the second cover plate is fixedly connected to the first cover plate, no capillary structure is provided between the shaping area and the first cover plate. At this time, the shaping area can bear a large force, so as to meet the flatness requirements of the heat dissipation plate. In other words, when a force in the first direction is applied to the shaping area of the second cover plate, the second cover plate will not deform towards the first cover plate and squeeze the capillary structure, thereby avoiding damage to the capillary structure.

[0006] It can be understood that when the first cover plate protrudes away from the second cover plate, the flatness of the first cover plate is also relatively poor. In the implementation manner of the present application, a force along the second direction can be applied to the shaping area of the second cover plate through a jig, so that the first cover plate no longer protrudes away from the second cover plate under the tensile force, that is, the first cover plate can be flattened, and the first cover plate can be restored to a better flatness, that is, the flatness of the first cover plate can be calibrated within the specification, thereby greatly improving the yield of the flatness of the heat dissipation plate.

[0007] It can be understood that by arranging a shaping area in the middle area of the second cover plate, the flatness of a relatively large area of the heat dissipation plate can be shaped by using the shaping area.

[0008] In some implementation manners, the shaping area is recessed towards the first cover plate and fixedly connected to the first cover plate. In this way, compared with the solution in which at least part of the first cover plate protrudes towards the shaping area and is fixedly connected to the shaping area, the flatness of the first cover plate in this implementation manner is higher, which is beneficial to the stable connection between the first cover plate and other structural parts.

[0009] In some implementation manners, the accommodating area is arranged around the shaping area. In this way, the shaping area is far from the edge area. The shaping area can be responsible for shaping the flatness of most areas of the accommodating area.

[0010] In some implementation manners, the number of shaping areas is multiple, and the multiple shaping areas are arranged at intervals along the length direction of the heat dissipation plate. In this way, two shaping areas can be responsible for shaping the flatness of different positions of the accommodating area, so as to ensure that most of the deformed and protruding parts of the accommodating area can be flattened.

[0011] In some implementation manners, the edge area of the second cover plate includes a first edge and a second edge arranged along the length direction of the heat dissipation plate, and the shortest distance between the first edge and the second edge is a; the number of shaping areas is two, and the distance between the centers of the first shaping area and the second shaping area is b, where a and b satisfy: 0.25a ≤ b ≤ 0.4a.

[0012] It can be understood that when a and b satisfy: 0.25a ≤ b ≤ 0.4a, the first shaping area and the second shaping area can cooperate with each other, so that the flatness of most positions of the accommodating area can be shaped.

[0013] In some implementation manners, the edge area of the second cover plate includes a third edge and a fourth edge arranged along the width direction of the heat dissipation plate, the third edge and the fourth edge are connected between the first edge and the second edge, and the shortest distance between the third edge and the fourth edge is c; the distance between the center of the first shaping area and the third edge is d, where c and d satisfy: 0.4c ≤ d ≤ 0.6c.

[0014] It can be understood that when c and d satisfy: 0.4c ≤ d ≤ 0.6c, the shaping area can shape the flatness of most positions in the accommodating area.

[0015] In some implementation manners, a part of the accommodating area is recessed towards the direction of the first cover plate and is fixedly connected to the capillary structure. It can be understood that the structure of the accommodating area can solve the problem that the accommodating area has low strength due to its thin thickness.

[0016] In a second aspect, the present application provides a middle frame. The middle frame includes a frame and a middle plate. The middle plate is fixedly connected to the inner side surface of the frame. The middle plate includes a support plate and the above-mentioned heat dissipation plate. The support plate is provided with a hollowed-out area. The first cover plate is fixedly connected to the support plate. The first cover plate covers the hollowed-out area and encloses a battery compartment. It can be understood that the flatness of the heat dissipation plate is relatively good, which is beneficial to improving the flatness of the middle frame.

[0017] In some implementation manners, the number of shaping areas is two. The first shaping area is opposite to the junction of the battery compartment and the support plate, and the second shaping area is opposite to the battery compartment. In this way, on the one hand, the first shaping area can shape the flatness of the part of the heat dissipation plate opposite to the battery compartment, so that the flatness of the part of the heat dissipation plate opposite to the battery compartment can be calibrated within the specification, and further improve the yield of the flatness of the part of the heat dissipation plate opposite to the battery compartment to a large extent. In this way, when the middle frame is applied to an electronic device, both the battery and the heat dissipation plate are well combined with the battery back glue, and the battery is not likely to have the problem of glue detachment. On the other hand, the first shaping area can also shape the flatness of the part of the heat dissipation plate opposite to the support plate, so that the flatness of the part of the heat dissipation plate opposite to the support plate can be calibrated within the specification, and further improve the yield of the flatness of the part of the heat dissipation plate opposite to the support plate to a large extent. At this time, the problem that the support plate squeezes the heat dissipation plate due to poor flatness, the heat dissipation plate is deformed and squeezes the display screen can be solved. The reliability of the display screen in the implementation manner of the present application is relatively good.

[0018] It can be understood that the second shaping area can better shape the flatness of the area of the heat dissipation plate opposite to the battery compartment, so that the flatness of the heat dissipation plate can be calibrated within the specification, and further improve the yield of the flatness of the heat dissipation plate to a large extent. In this way, both the battery and the first cover plate of the heat dissipation plate are well combined with the battery back glue, and the battery is not likely to have the problem of glue detachment.

[0019] In some implementations, the support plate includes a first connection area and a second connection area. The second connection area is fixedly connected to the first connection area. The first cover plate includes a third connection area and a fourth connection area. The fourth connection area is fixedly connected to the third connection area. The third connection area of the heat dissipation plate is fixedly connected to the first connection area of the support plate through a fastener. The fourth connection area of the heat dissipation plate is fixedly connected to the second connection area of the support plate through a back glue and / or an adhesive layer.

[0020] It can be understood that the heat dissipation plate can be fixedly connected to the support plate through the cooperation of the fastener, the back glue and the adhesive layer. At this time, the connection between the heat dissipation plate and the support plate is more reliable and stable.

[0021] In some implementations, a first groove is provided in the first connection area of the support plate. The fastening hole of the support plate is located in the first groove. At least a part of the third connection area of the first cover plate is recessed toward the bottom wall of the first groove to form a second groove. The fastening hole of the first cover plate is located in the second groove, and a part of the fastener is located in the second groove. In this way, when the middle frame is applied to an electronic device, the fastener can avoid the display screen, thus avoiding the problem of the fastener pressing against the screen. In addition, when the electronic device is impacted, the fastener will not impact the display screen, thus avoiding display defects such as broken bright spots caused by the impact of the fastener on the display screen.

[0022] In some implementations, the third connection area includes a plurality of convex bumps arranged at intervals. The plurality of convex bumps are arranged around the fastening hole of the first cover plate, and the plurality of convex bumps abut against the first connection area. In this way, the connection between the first cover plate and the support plate is closer and more reliable.

[0023] In some implementations, the second connection area includes a first plate area, the back glue includes a first back glue, and the adhesive layer includes a first adhesive layer. The fourth connection area of the first cover plate is fixedly connected to the first plate area of the support plate through the mutual cooperation of the first back glue and the first adhesive layer.

[0024] It can be understood that because the first back glue has good adhesiveness and good impact resistance, the connection between the first cover plate of the heat dissipation plate and the support plate is reliable, so that the reliability test requirements can be better met.

[0025] In some implementations, the first back glue is provided with a dispensing hole, and the first adhesive layer is arranged in the dispensing hole. It can be understood that because the viscosity of the first adhesive layer is stronger, the first adhesive layer can fix and connect the heat dissipation plate and the support plate more firmly. In this way, the connection between the heat dissipation plate and the support plate is more reliable and can better meet the reliability test requirements.

[0026] It can be understood that the first back glue can provide a dispensing hole (i.e., a dispensing space) for the first glue layer to prevent the glue from overflowing during the dispensing process. In addition, during the process of fixing the heat dissipation plate to the support plate, the first back glue can well support the heat dissipation plate, thereby preventing the heat dissipation plate from collapsing the glue during the pressing process and ensuring the connection stability between the heat dissipation plate and the support plate.

[0027] In some implementation manners, the second connection area includes a first border area, and the first border area is fixedly connected to the first plate area; the glue layer includes a second glue layer, and the fourth connection area of the first cover plate is fixedly connected to the first border area of the support plate through the second glue layer.

[0028] It can be understood that since the viscosity of the second glue layer is stronger, the second colloid can more firmly fixedly connect the heat dissipation plate and the first border area of the support plate. In this way, the connection between the heat dissipation plate and the support plate is more reliable and can better meet the requirements of the reliability test.

[0029] In some implementation manners, a first retaining wall protrudes from the first border area of the support plate, and the first retaining wall is located between the second glue layer and the battery compartment; the middle frame further includes a retaining wall insulating member, and the retaining wall insulating member is connected between the fourth connection area of the first cover plate and the first retaining wall.

[0030] It can be understood that the first retaining wall can prevent the glue from overflowing from the dispensing groove and flowing into the battery compartment during the dispensing process. In addition, by setting the height of the first retaining wall, the thickness of the glue layer can be flexibly controlled, so as to ensure that the second glue layer has sufficient glue height to enable the heat dissipation plate and the support plate to be stably connected.

[0031] In this way, the fourth connection area of the first cover plate of the heat dissipation plate can also be insulated from the first retaining wall of the support plate through the retaining wall insulating member.

[0032] In some implementation manners, it is characterized in that the second connection area includes a first border area, the first border area is fixedly connected to the first plate area, and in the width direction of the middle frame, the width D of the first border area is greater than or equal to 1.5 millimeters; the back glue includes a second back glue, and the fourth connection area of the first cover plate is fixedly connected to the first border area of the support plate through the second back glue. At this time, the first cover plate can be fixedly connected to the first border area of the support plate through the second back glue. In this way, since the second back glue has good adhesiveness and good impact resistance, the connection between the first cover plate and the first border area of the support plate is more reliable and can better meet the requirements of the reliability test.

[0033] It can be understood that, compared with the solution where the fourth connection area of the first cover plate is fixedly connected to the first edge area of the support plate through the second adhesive layer, in this implementation, since the fourth connection area of the first cover plate is fixedly connected to the first edge area of the support plate through the second back adhesive, this implementation can avoid using the dispensing process. Thus, it can not only avoid the risk of glue overflow but also eliminate the dispensing process, reducing the process cost. In addition, the first edge area of the support plate does not need to be provided with a first retaining wall. In this way, on the one hand, the structure of the first edge area of the support plate is relatively simple and easy to manufacture; on the other hand, the flatness of the first edge area of the support plate is relatively high, which is beneficial to the connection between the first cover plate and the support plate.

[0034] In some implementations, the support plate includes a first connection area and a second connection area, the second connection area is fixedly connected to the first connection area, the first cover plate includes a third connection area and a fourth connection area, the fourth connection area is fixedly connected to the third connection area, and the thickness H of the first cover plate is less than or equal to 0.2 mm; the third connection area of the heat dissipation plate is fixedly connected to the first connection area of the support plate through solder joints, and the fourth connection area of the heat dissipation plate is fixedly connected to the second connection area of the support plate through back adhesive and / or an adhesive layer. At this time, solder joints are formed between the third connection area of the first cover plate and the first connection area of the support plate. The solder joints are conductive components. At this time, the third connection area of the heat dissipation plate can be electrically connected to the first connection area of the support plate through the solder joints. Since the first connection area of the support plate is the grounding position of the antenna, the third connection area of the heat dissipation plate can be grounded through the solder joints.

[0035] It can be understood that, compared with the solution where the heat dissipation plate is grounded through fasteners, in the implementation of the present application, the heat dissipation plate is grounded through solder joints. On the one hand, the electrical connection between the heat dissipation plate and the support plate is more secure and has better reliability; on the other hand, neither the third connection area of the heat dissipation plate nor the first connection area of the support plate is easily damaged due to opening holes, thus ensuring that the heat dissipation plate and the support plate have better structural strength.

[0036] In some implementations, it is characterized in that a part of the frame forms the radiator of the antenna, or the radiator of the antenna is fixed to the inner side surface of the frame; the support plate includes a first connection area and a second connection area, the second connection area is fixedly connected to the first connection area, and the first connection area is the grounding position of the radiator of the antenna; the first cover plate includes a third connection area and a fourth connection area, the fourth connection area is fixedly connected to the third connection area; the third connection area of the heat dissipation plate is electrically connected to the first connection area of the support plate through a conductive component, and the fourth connection area of the heat dissipation plate is insulated from the second connection area of the support plate through an insulating component. At this time, the current of the antenna is not easily grounded at the non-grounding position of the heat dissipation plate, thereby avoiding the generation of a new magnetic field at the non-grounding position of the heat dissipation plate and affecting the antenna performance.

[0037] In some implementations, the conductive member includes a fastener, a solder joint, or a conductive foam. Among them, the material of the fastener includes a conductive material, and the insulating member includes an adhesive or an adhesive layer, and the materials of the adhesive and the adhesive layer include insulating materials.

[0038] It can be understood that by setting the material of the fastener to include a conductive material and the first connection area of the support plate to be the grounding position of the antenna, the third connection area of the heat dissipation plate can be electrically connected to the first connection area of the support plate through the fastener, that is, the third connection area of the heat dissipation plate can be grounded through the fastener. In this way, the heat dissipation plate is not likely to generate clutter to the surrounding antennas, thus not affecting the antenna performance.

[0039] It can be understood that the fastener can not only firmly fix and connect the third connection area of the heat dissipation plate and the first connection area of the support plate, but also firmly electrically connect the third connection area of the heat dissipation plate and the first connection area of the support plate. The fastener has the effect of "serving multiple purposes with one object".

[0040] It can be understood that by setting the materials of the adhesive and the adhesive layer to both include insulating materials, the fourth connection area of the heat dissipation plate and the second connection area of the support plate can be insulated. At this time, the current of the antenna is not likely to be grounded at the non-grounding position of the heat dissipation plate, thereby avoiding the excitation of a new magnetic field at the non-grounding position of the heat dissipation plate and affecting the antenna performance.

[0041] It can be understood that the adhesive and the adhesive layer can not only fix and connect the fourth connection area of the heat dissipation plate and the second connection area of the support plate, but also electrically connect the fourth connection area of the heat dissipation plate and the second connection area of the support plate. The adhesive and the adhesive layer have the effect of "serving multiple purposes with one object".

[0042] In some implementations, a limiting boss is convexly provided on the inner side surface of the frame, and the distance between the heat dissipation plate and the limiting boss is less than the distance between the heat dissipation plate and the inner side surface of the frame. In this way, since the distance between the first cover plate of the heat dissipation plate and the limiting boss is small, to a certain extent, the positioning of the heat dissipation plate and the frame can be achieved through the mutual cooperation between the first cover plate of the heat dissipation plate and the limiting boss. At this time, the plurality of fastening holes of the heat dissipation plate and the plurality of fastening holes of the support plate can also be accurately positioned. On the one hand, the process of locking the fastener in the fastening holes of the heat dissipation plate and the fastening holes of the support plate is relatively simple; on the other hand, the fastener is not likely to have problems such as floating height, loose locking, and assembly deviation.

[0043] In some implementations, the support plate is provided with a plurality of first positioning holes, and the first cover plate is provided with a plurality of second positioning holes. The plurality of second positioning holes are disposed opposite to the plurality of first positioning holes in a one-to-one correspondence. By providing the first positioning holes on the support plate and the second positioning holes on the heat dissipation plate, during the assembly process of the heat dissipation plate and the support plate, the first positioning holes and the second positioning holes are first aligned, and then the positioning posts of the assembly tool are inserted into the first positioning holes and the second positioning holes, thereby fixing the relative position of the heat dissipation plate on the support plate. At this time, the plurality of fastening holes of the heat dissipation plate and the plurality of fastening holes of the middle plate can also be accurately positioned. In this way, on the one hand, the process of locking the fasteners in the fastening holes of the heat dissipation plate and the support plate is relatively simple; on the other hand, problems such as floating height, loose locking, and assembly deviation of the fasteners are not likely to occur.

[0044] Thirdly, the present application provides an electronic device. The electronic device includes a rear cover, a display screen, a battery, and the above-mentioned middle frame; at least a part of the display screen is fixedly connected to the second cover plate of the heat dissipation plate, the battery is fixedly connected to the first cover plate of the heat dissipation plate, and the battery is located in the battery compartment; the rear cover is fixedly connected to the frame of the middle frame, and the rear cover is located on the side of the middle plate of the middle frame away from the display screen, and the rear cover covers the battery.

[0045] It can be understood that, on the one hand, the battery is fixedly connected to the first cover plate of the heat dissipation plate. At this time, no support plate is provided between the battery and the first cover plate. In this way, in the thickness direction of the electronic device, the thickness of the support plate can be saved, which is beneficial to the realization of the thin-type setting of the electronic device. On the other hand, the heat dissipation plate can not only dissipate heat from the battery and the flexible screen, but also support the battery and the flexible screen. The heat dissipation plate has the effect of "serving multiple purposes with one object".

[0046] It can be understood that since the flatness of the heat dissipation plate can be calibrated within the specifications, the yield rate of the flatness of the heat dissipation plate can be greatly improved. Thus, on the one hand, the problem of the heat dissipation plate squeezing the display screen can be solved, that is, the reliability of the display screen in the implementation manner of the present application is relatively good; on the other hand, both the battery and the first cover plate of the heat dissipation plate can be better combined with the battery back glue, and the battery is not likely to have the problem of glue detachment.

[0047] In some implementations, the electronic device further includes a display screen insulating member, and the display screen insulating member is located between the display screen and the second cover plate. In this implementation manner, by providing a display screen insulating member between a part of the middle of the display screen and the second cover plate to separate the middle of the display screen from the second cover plate, thereby preventing the display screen from being electrically connected to the second cover plate.

[0048] In some implementations, the electronic device further includes a circuit board, which is fixedly connected to the support plate and located on the side of the support plate away from the first cover plate. In this implementation, the heat generated by the circuit board can be transmitted to the first cover plate through the support plate. In this way, the first cover plate can also dissipate the heat generated by the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the following will describe the drawings required to be used in the embodiments of the present application or the background art.

[0050] Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0051] Figure 2 is Figure 1 a partial exploded view of the electronic device shown in some embodiments;

[0052] Figure 3 is Figure 1 a partial cross-sectional view of the electronic device shown in some embodiments taken along line A-A;

[0053] Figure 4 is Figure 1 a partial structural diagram of the electronic device shown in one implementation;

[0054] Figure 5 is Figure 2 an enlarged view of the middle frame shown in another angle;

[0055] Figure 6 is Figure 2 a partial exploded view of the middle frame shown in one implementation;

[0056] Figure 7 is Figure 6 a partial exploded view of the heat dissipation plate shown in one implementation;

[0057] Figure 8 is Figure 6 a partial cross-sectional view of the heat dissipation plate shown in some embodiments taken along line B-B;

[0058] Figure 9 is Figure 2 a partial cross-sectional view of the middle frame shown in some embodiments taken along line C-C;

[0059] Figure 10 is Figure 6 a partial cross-sectional view of the heat dissipation plate shown in some other embodiments taken along line B-B;

[0060] Figure 11 is Figure 2 a partially exploded schematic view of the middle frame shown in another embodiment;

[0061] Figure 12 is Figure 11 an enlarged schematic view of a partial middle frame shown in one embodiment;

[0062] Figure 13 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some embodiments cut along D-D;

[0063] Figure 14 is Figure 2 a partial structural schematic view of the middle frame shown in one embodiment;

[0064] Figure 15 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some embodiments cut along E-E;

[0065] Figure 16 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some embodiments cut along F-F;

[0066] Figure 17 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some other embodiments cut along F-F;

[0067] Figure 18 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some other embodiments cut along D-D;

[0068] Figure 19 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in still some other embodiments cut along D-D;

[0069] Figure 20 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some other embodiments cut along F-F;

[0070] Figure 21 is Figure 2 a partial cross-sectional schematic view of the middle frame shown in some embodiments cut along G-G;

[0071] Figure 22 is Figure 2 a structural schematic view of the middle frame shown in one embodiment from another angle. Detailed Embodiments

[0072] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0073] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected and the relative positional relationship after connection remains unchanged. The orientation terms mentioned in the embodiments of the present application, such as "top", "bottom", "upper", "lower", "inner", "outer", etc., are only with reference to the direction of the accompanying drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the embodiments of the present application. "Plurality" means at least two. A and / or B includes three scenarios, specifically scenario A, scenario B, and scenario AB. Among them, "electrical connection" means that electrical signals can be conducted between each other. In addition, the fact that two components are integrated through an integral molding process means that during the process of forming one of the two components, the component is connected to the other component, and there is no need to connect the two components through additional processing (such as bonding, welding, snap connection, screw connection) methods.

[0074] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of such features.

[0075] In addition, in the embodiments of the present application, mathematical concepts such as parallel and perpendicular are mentioned. These definitions are all in view of the current technological level, rather than the absolutely strict definitions in the mathematical sense, allowing for a small amount of deviation. Approximations to parallel, approximations to perpendicular, etc. are all acceptable. For example, A is parallel to B means that A is parallel to B or approximately parallel to B, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is perpendicular to B means that A is perpendicular to B or approximately perpendicular to B, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0076] It can be understood that the specific embodiments described herein are only used to explain the related invention and are not a limitation to the invention. Additionally, it should be noted that for the convenience of description, only the parts related to the invention are shown in the drawings.

[0077] Figure 1 It is a schematic structural diagram of an electronic device 1000 provided by the embodiments of the present application.

[0078] As Figure 1 shown, in some embodiments, the electronic device 1000 may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet, etc., which are devices having a middle frame 100. Figure 1 The electronic device 1000 of the illustrated embodiment will be described by taking a mobile phone as an example.

[0079] Figure 2 is Figure 1 a partial exploded view of the electronic device 1000 in some embodiments as shown.

[0080] As Figure 1 and Figure 2 shown, the electronic device 1000 includes a middle frame 100, a rear cover 200, a display screen 300, a circuit board 400, and a battery 500. It can be understood that Figure 1 and the related drawings below only schematically show some components included in the electronic device 1000, and the actual shapes, actual sizes, actual positions, and actual structures of these components are not limited by Figure 1 and the respective drawings below. Additionally, for the convenience of description hereinafter, it is defined that the electronic device 1000 has a first direction X, a second direction Y, and a third direction Z. The first direction X may be the width direction of the electronic device 1000, the second direction Y may be the length direction of the electronic device 1000, and the third direction Z may be the thickness direction of the electronic device 1000. In some embodiments, the coordinate system setting of the electronic device 1000 can be flexibly set according to specific actual needs.

[0081] In some embodiments, the display screen 300 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a liquid crystal display (LCD), etc.

[0082] Figure 3 is Figure 1 a partial cross-sectional view of the electronic device 1000 in some embodiments taken along A-A as shown.

[0083] As Figure 2 and Figure 3 shown, the middle frame 100 includes a frame 101 and a middle plate 102. The middle plate 102 is fixedly connected to the inner side surface 104 of the frame 101. The frame 101 can be arranged to surround the middle plate 102.

[0084] As Figure 2 and Figure 3 shown, the display screen 300 is fixedly connected to the middle frame 100. It can be understood that the middle frame 100 can be used to carry the display screen 300.

[0085] In some embodiments, the edge of the display screen 300 can be fixedly connected to the frame 101 of the middle frame 100. At least part of the middle part of the display screen 300 can be fixedly connected to the middle plate 102 of the middle frame 100. In some implementation manners, the connection manner between the display screen 300 and the middle frame 100 is not specifically limited.

[0086] As Figure 2 and Figure 3 shown, the rear cover 200 is fixedly connected to the middle frame 100. The rear cover 200 is located on the side of the middle plate 102 of the middle frame 100 away from the display screen 300. The rear cover 200 can be used to cover the middle plate 102 of the middle frame 100 and related devices on the middle plate 102.

[0087] In some embodiments, the edge of the rear cover 200 can be fixedly connected to the frame 101 of the middle frame 100. The middle part of the rear cover 200 can be arranged opposite to the middle plate 102 of the middle frame 100.

[0088] Figure 4 is Figure 1 a partial structural schematic diagram of the electronic device 1000 shown in one implementation manner. Figure 4 It can be Figure 1 a schematic diagram of the back side of the electronic device 1000 shown in which the rear cover 200 is hidden. Figure 5 is Figure 2 an enlarged schematic diagram of the middle frame 100 shown in another angle.

[0089] As Figures 3 to 5 shown, the middle plate 102 of the middle frame 100 can be provided with a battery compartment 103 and a receiving groove 105. The battery compartment 103 and the receiving groove 105 can communicate with each other or be separately arranged. Among them, the openings of the battery compartment 103 and the receiving groove 105 on the middle plate 102 can face the rear cover 200.

[0090] In some embodiments, the battery 500 is fixedly connected to the middle plate 102 of the middle frame 100, and the battery 500 is located within the battery compartment 103. The circuit board 400 is fixedly connected to the middle plate 102 of the middle frame 100, and the circuit board 400 is located within the receiving groove 105. The rear cover 200 covers the battery 500 and the circuit board 400 to protect the battery 500 and the circuit board 400. It can be understood that the depths of the battery compartment 103 and the receiving groove 105 in the Z-axis direction can be flexibly set according to different requirements to better adapt to the sizes of the battery 500 and the circuit board 400.

[0091] Figure 6 Yes Figure 2 FIG. shows a partial exploded view of the middle frame 100 in one embodiment.

[0092] As Figure 5 And Figure 6 shown, the middle plate 102 of the middle frame 100 includes a heat dissipation plate 10 and a support plate 20. It can be understood that the support plate 20 can be a plate-like structure. In some embodiments, the support plate 20 is fixed to the inner side surface 104 of the frame 101. Exemplarily, the support plate 20 and the frame 101 can be formed as an integral structural member by an injection molding process.

[0093] In some embodiments, the support plate 20 is provided with a hollowed-out area 20a. The heat dissipation plate 10 is fixedly connected to the support plate 20. The heat dissipation plate 10 covers the hollowed-out area 20a of the support plate 20 and encloses the battery compartment 103. Combining Figure 4 shown, the battery 500 is fixedly connected to the heat dissipation plate 10. It can be understood that the heat dissipation plate 10 can both dissipate heat from the battery 500 and support the battery 500. Combining Figure 3 shown, a part of the middle of the display screen 300 is fixedly connected to the support plate 20, and a part is fixedly connected to the heat dissipation plate 10. The support plate 20 and the heat dissipation plate 10 jointly support the display screen 300. In addition, the heat dissipation plate 10 can also dissipate heat from the display screen 300.

[0094] As Figure 4 And Figure 5 shown, the support plate 20 can be provided with the receiving groove 105. At this time, the circuit board 400 is fixedly connected to the support plate 20. In some embodiments, the receiving groove 105 can also be formed by the support plate 20 and the heat dissipation plate 10. At this time, the circuit board 400 can be fixedly connected to the heat dissipation plate 10. The heat dissipation plate 10 can dissipate heat from the circuit board 400.

[0095] The above has introduced the connection relationships between the display screen 300, the battery 500, the circuit board 400 and the support plate 20 and the heat dissipation plate 10 of the middle plate 102 in combination with the relevant drawings. The following will specifically introduce the structure of the heat dissipation plate 10 in combination with the relevant drawings.

[0096] Figure 7 Yes Figure 6 Partial exploded view of the heat dissipation plate 10 shown in one embodiment.

[0097] As Figure 7 shown, the heat dissipation plate 10 includes a first cover plate 11, a second cover plate 12, a capillary structure 13, and a cooling medium 14. It can be understood that Figure 7 The cooling medium 14 is only schematically shown by a rectangular frame.

[0098] In some embodiments, the material of the first cover plate 11 can be a high-strength material. Exemplarily, the first cover plate 11 can be a multi-layer material. For example, the first cover plate 11 can be two-layer material. The first layer of material can be stainless steel. The second layer of material can be copper or copper alloy.

[0099] In some embodiments, the thickness of the first cover plate 11 in the Z-axis direction can be in the range of 0.15 mm to 0.2 mm. For example, the thickness of the first cover plate 11 in the Z-axis direction can be 0.15 mm, 0.16 mm, 0.18 mm, or 0.2 mm.

[0100] In some embodiments, the material of the second cover plate 12 can also be a high-strength material. Exemplarily, the second cover plate 12 can be a multi-layer material. For example, the second cover plate 12 can be two-layer material. The first layer of material can be stainless steel. The second layer of material can be copper or copper alloy.

[0101] In some embodiments, the thickness of the second cover plate 12 in the Z-axis direction can be in the range of 0.04 mm to 0.08 mm. For example, the thickness of the first cover plate 11 in the Z-axis direction can be 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, or 0.08 mm.

[0102] In some embodiments, the capillary structure 13 can be a metal structural member with a porous structure. For example, the capillary structure 13 can be a copper mesh, copper fiber, copper foam, etc.

[0103] In some embodiments, the cooling medium 14 can be water, methanol, acetone, etc.

[0104] As Figure 7 shown, the first cover plate 11 can include a first surface 11a and a first surface 11b arranged back to back.

[0105] As Figure 7 shown, the second cover plate 12 can include an intermediate region 121 and an edge region 122 arranged around the intermediate region 121. In some embodiments, the width of the edge region 122 of the second cover plate 12 can be in the range of 1 mm to 6 mm.

[0106] In addition, the middle region 121 of the second cover plate 12 may include a shaping region 1211 and a receiving region 1212 connecting the shaping region 1211. In some embodiments, the receiving region 1212 is disposed around the shaping region 1211. It can be understood that the receiving region 1212 may be disposed around a part of the shaping region 1211 or around the entire shaping region 1211. In some embodiments, the number of shaping regions 1211 is two. In some embodiments, the actual shape, actual size, actual position, and actual number of the shaping regions 1211 are not specifically limited in this application.

[0107] Figure 8 is Figure 6 A partial cross-sectional view of the heat dissipation plate 10 shown in some embodiments taken along the line B-B.

[0108] As Figure 7 and Figure 8 shown, the second cover plate 12 and the first cover plate 11 may be disposed opposite to each other. The edge region 122 of the second cover plate 12 may be fixed to the first surface 11a of the first cover plate 11, that is, the edge region 122 of the second cover plate 12 and the first cover plate 11 may be fixedly connected. A sealed space may be formed between the second cover plate 12 and the first cover plate 11. Among them, the receiving region 1212 of the middle region 121 of the second cover plate 12 and the first cover plate 11 may be spaced apart and enclose a receiving cavity 15.

[0109] In some embodiments, the shaping region 1211 of the middle region 121 of the second cover plate 12 may be recessed toward the first cover plate 11 and fixed to the first surface 11a of the first cover plate 11, that is, the shaping region 1211 of the middle region 121 of the second cover plate 12 and the first cover plate 11 may be fixedly connected. In this way, compared with the solution in which at least a part of the first cover plate 11 protrudes toward the shaping region 1211 and is fixedly connected to the shaping region 1211, the flatness of the first cover plate 11 in this implementation manner is relatively high, which is beneficial to the stable connection between the first cover plate 11 and other structural members. In some embodiments, the first cover plate 11 protrudes toward the shaping region 1211 and is fixedly connected to the shaping region 1211.

[0110] In some embodiments, the edge region 122 of the second cover plate 12 may be fixedly connected to the first cover plate 11 by a welding process (such as brazing, etc.). In this way, the connection between the second cover plate 12 and the first cover plate 11 is more stable and firm. In addition, the sealing performance of the receiving cavity 15 is better.

[0111] In some embodiments, the shaping region 1211 of the middle region 121 of the second cover plate 12 may also be fixedly connected to the first cover plate 11 by a welding process (such as brazing, etc.). In this way, the connection between the shaping region 1211 and the first cover plate 11 is more stable and firm.

[0112] As Figure 7 and Figure 8 shown, the capillary structure 13 is fixed to the first surface 11a of the first cover plate 11, and the capillary structure 13 is located within the accommodation cavity 15. In some embodiments, the capillary structure 13 may be fixedly connected to the first cover plate 11 by a welding process. In this way, the connection between the capillary structure 13 and the first cover plate 11 is more stable and firm.

[0113] As Figure 7 and Figure 8 shown, the cooling medium 14 may be disposed within the accommodation cavity 15. The capillary structure 13 may be immersed in the cooling medium 14.

[0114] As Figure 5 and Figure 6 shown, the first cover plate 11 of the heat dissipation plate 10 and the support plate 20 may be fixedly connected. The first cover plate 11 may cover the hollowed-out area 20a of the support plate 20 and enclose the battery compartment 103.

[0115] As Figure 4 and Figure 5 shown, the battery 500 may be fixedly connected to the first cover plate 11 and is located within the battery compartment 103. At this time, on the one hand, the heat generated by the battery 500 can be transmitted to the heat dissipation plate 10 and dissipated through the heat dissipation plate 10. On the other hand, there is no longer a support plate 20 disposed between the battery 500 and the heat dissipation plate 10. In this way, in the thickness direction of the electronic device 1000, the thickness of the support plate 20 can be saved, which is conducive to realizing the thin-type setting of the electronic device 1000.

[0116] In some embodiments, the battery 500 may be fixedly connected to the first cover plate 11 by a battery adhesive (such as double-sided tape).

[0117] As Figure 4 and Figure 5 shown, the circuit board 400 may be fixedly connected to the support plate 20 and is located on the side of the support plate 20 away from the first cover plate 11. The heat generated by the circuit board 400 can be transmitted to the first cover plate 11 through the support plate 20. In this way, the first cover plate 11 can also dissipate the heat generated by the circuit board 400.

[0118] As Figure 3 shown, a part of the middle of the display screen 300 may be fixedly connected to the second cover plate 12. In some embodiments, a part of the middle of the display screen 300 may be fixedly connected to the second cover plate 12 by a display screen adhesive (not shown in the figure). In some embodiments, the middle of the display screen 300 may not be fixedly connected to the second cover plate 12.

[0119] In some embodiments, an insulating member 80 for the display screen may be disposed between a part of the middle of the display screen 300 and the second cover plate 12 to separate the middle of the display screen 300 from the second cover plate 12, thereby preventing electrical connection between the display screen 300 and the second cover plate 12.

[0120] As Figure 7 and Figure 8 shown, a shaping area 1211 may be provided in the middle area 121 of the second cover plate 12, and the shaping area 1211 may be fixed to the first surface 11a of the first cover plate 11, so as to use the shaping area 1211 to shape the flatness of the accommodating area 1212 and the first cover plate 11.

[0121] It can be understood that when the accommodating area 1212 of the second cover plate 12 protrudes away from the first cover plate 11, the flatness of the accommodating area 1212 of the second cover plate 12 is poor. At this time, when the heat dissipation plate 10 is applied to the electronic device 1000, the second cover plate 12 of the heat dissipation plate 10 is likely to push against the screen, thereby damaging the display screen 300. In the embodiment of the present application, a force in the first direction may be applied to the shaping area 1211 of the second cover plate 12 through a jig, so that the accommodating area 1212 of the second cover plate 12 no longer protrudes away from the first cover plate 11 under the tensile force, that is, the accommodating area 1212 of the second cover plate 12 can be flattened, and the accommodating area 1212 of the second cover plate 12 can be calibrated to a better flatness, that is, the flatness of the accommodating area 1212 of the second cover plate 12 can be calibrated within the specification, thereby greatly improving the yield of the flatness of the heat dissipation plate 10. In this way, the second cover plate 12 of the heat dissipation plate 10 is not likely to have the problem of pushing against the screen, thereby ensuring better reliability of the display screen 300. Wherein, the first direction may be the direction in which the second cover plate 12 faces the first cover plate 11. In addition, since the shaping area 1211 of the second cover plate 12 is fixedly connected to the first cover plate 11, no capillary structure 13 is provided between the shaping area 1211 and the first cover plate 11. At this time, the shaping area 1211 can bear a large force, so as to meet the flatness requirement of the heat dissipation plate 10. In other words, when a force in the first direction is applied to the shaping area 1211 of the second cover plate 12, the second cover plate 12 will not squeeze the capillary structure 13 due to deformation towards the first cover plate 11, thereby avoiding damage to the capillary structure 13.

[0122] It can be understood that when the first cover plate 11 protrudes away from the second cover plate 12, the flatness of the first cover plate 11 is also relatively poor. At this time, when the heat dissipation plate 10 is applied to the electronic device 1000, due to the poor flatness of the first cover plate 11, both the battery 500 and the first cover plate 11 of the heat dissipation plate 10 have poor bonding with the battery back glue, the connection is not reliable, and problems such as the battery 500 coming off the glue are likely to occur. In the implementation manner of the present application, a jig can be used to apply a force along the second direction to the shaping area 1211 of the second cover plate 12, so that the first cover plate 11 no longer protrudes away from the second cover plate 12 under the pulling force, that is, the first cover plate 11 can be flattened, the first cover plate 11 can be restored to a better flatness, that is, the flatness of the first cover plate 11 can be calibrated within the specification, thereby greatly improving the yield of the flatness of the heat dissipation plate 10. In this way, both the battery 500 and the first cover plate 11 of the heat dissipation plate 10 have better bonding with the battery back glue, and the battery 500 is not likely to have problems with the glue coming off. Among them, the second direction can be the direction in which the first cover plate 11 faces the second cover plate 12.

[0123] As Figure 7 shown, the number of shaping areas 1211 is multiple. In some embodiments, the number of shaping areas 1211 can be two. The two shaping areas 1211 can be arranged at intervals along the length direction of the heat dissipation plate 10 (that is, the Y-axis direction). In this way, the two shaping areas 1211 can be responsible for shaping the flatness of different positions of the accommodating area 1212, so as to ensure that most of the accommodating area 1212 can be flattened once it is deformed and protrudes.

[0124] As Figure 7 shown, the edge area 122 of the second cover plate 12 can include a first edge 1221 and a second edge 1222 arranged along the length direction of the heat dissipation plate 10 (that is, the Y-axis direction).

[0125] In some embodiments, the shortest distance between the first edge 1221 and the second edge 1222 is a. The distance between the centers of the first shaping area 1211 and the second shaping area 1211 is b. Among them, a and b satisfy: 0.25a ≤ b ≤ 0.4a. For example, b can be equal to 0.25a, 0.3a, 0.35a or 0.4a, etc. It can be understood that when a and b satisfy: 0.25a ≤ b ≤ 0.4a, the first shaping area 1211 and the second shaping area 1211 can cooperate with each other, so that the flatness of most positions of the accommodating area 1212 can be shaped.

[0126] In some embodiments, the edge region 122 of the second cover plate 12 includes a third edge 1223 and a fourth edge 1224 arranged along the width direction of the heat dissipation plate 10 (i.e., the X-axis direction). The third edge 1223 and the fourth edge 1224 are connected between the first edge 1221 and the second edge 1222, and the shortest distance between the third edge 1223 and the fourth edge 1224 is c.

[0127] The distance between the center of the shaping area 1211 and the third edge 1223 is d, where c and d satisfy: 0.4c ≤ d ≤ 0.6c. For example, d can be equal to 0.4c, 0.5c, 0.55c, or 0.6c, etc.

[0128] It can be understood that when c and d satisfy: 0.4c ≤ d ≤ 0.6c, the shaping area 1211 can shape the flatness of most positions in the accommodating area 1212.

[0129] Figure 9 is Figure 2 The partial cross-sectional view of the middle frame 100 shown in some embodiments cut along C-C.

[0130] As Figure 9 shown, exemplarily, the first shaping area 1211 can be directly opposite to the junction of the battery compartment 103 and the support plate 20. In this way, the first shaping area 1211 can shape the flatness of the part of the heat dissipation plate 10 directly opposite to the battery compartment 103, so that the flatness of the part of the heat dissipation plate 10 directly opposite to the battery compartment 103 can be calibrated within the specification, and thus the yield rate of the flatness of the part of the heat dissipation plate 10 directly opposite to the battery compartment 103 can be greatly improved. In this way, both the battery 500 and the heat dissipation plate 10 are well combined with the battery back glue, and the battery 500 is not prone to the problem of degumming. The first shaping area 1211 can also shape the flatness of the part of the heat dissipation plate 10 directly opposite to the support plate 20, so that the flatness of the part of the heat dissipation plate 10 directly opposite to the support plate 20 can be calibrated within the specification, and thus the yield rate of the flatness of the part of the heat dissipation plate 10 directly opposite to the support plate 20 can be greatly improved. At this time, the problem that the support plate 20 squeezes the heat dissipation plate 10 due to poor flatness, and the heat dissipation plate 10 is deformed and squeezes the display screen 300 can be solved. The reliability of the display screen 300 in the embodiment of the present application is better.

[0131] As Figure 9As shown, exemplarily, the second shaping area 1211 can be directly opposite to the battery compartment 103. In this way, the second shaping area 1211 can better shape the flatness of the area of the heat dissipation plate 10 that is directly opposite to the battery compartment 103, so that the flatness of the heat dissipation plate 10 can be calibrated within the specifications, thereby greatly improving the yield rate of the flatness of the heat dissipation plate 10. In this way, both the battery 500 and the first cover plate 11 of the heat dissipation plate 10 are better combined with the battery back glue, and the battery 500 is not likely to have the problem of glue detachment.

[0132] Figure 10 is Figure 6 A partial cross-sectional schematic view of the heat dissipation plate 10 shown in the figure taken along the B-B in some other embodiments.

[0133] As Figure 10 shown, in some embodiments, a part of the receiving area 1212 of the second cover plate 12 can be recessed towards the first cover plate 11 and can be fixedly connected to the capillary structure 13. In this way, the receiving area 1212 of the second cover plate 12 is generally bent, and the strength of the second cover plate 12 is better. It can be understood that the structure of the receiving area 1212 of the second cover plate 12 in the implementation manner of the present application can solve the problem that the strength of the receiving area 1212 of the second cover plate 12 is low due to its thin thickness.

[0134] It can be understood that although Figure 10 shows that the capillary structure 13 is separately arranged from the shaping area 1211 of the second cover plate 12, in some implementation manners, the capillary structure 13 can also be connected to the shaping area 1211 of the second cover plate 12.

[0135] It can be understood that as introduced above in combination with the related drawings, the heat dissipation plate 10 not only plays the role of carrying the battery 500 and the display screen 300, but also plays the role of dissipating heat from the battery 500 and the display screen 300. Obviously, the connection reliability between the heat dissipation plate 10 and the support plate 20 is particularly important. The following will specifically introduce several fixing methods of the heat dissipation plate 10 and the middle plate 102 in combination with the related drawings to ensure that the heat dissipation plate 10 and the support plate 20 can be stably and firmly connected.

[0136] Figure 11 is Figure 2 A partial exploded schematic view of the middle frame 100 shown in another implementation manner.

[0137] As Figure 11 shown, the heat dissipation plate 10 can be fixedly connected to the support plate 20 through the cooperation of the fastener 31, the back glue 32 and the glue layer 33. Among them, the fastener 31 can be a screw, a bolt or a pin, etc. The back glue 32 can be a double-sided adhesive. The glue layer 33 can be a structure formed by curing glue. The glue can be formed between the heat dissipation plate 10 and the support plate 20 through a dispensing process.

[0138] Figure 12 is Figure 11 An enlarged schematic view of the partial middle frame 100 in one embodiment as shown.

[0139] As Figure 12 shown, the support plate 20 may include a first connection area 21 and a second connection area 22. The second connection area 22 is fixedly connected to the first connection area 21.

[0140] In some embodiments, the number of the first connection areas 21 may be one or more. The number of the second connection areas 22 may be one or more. Hereinafter, an example in which the number of the first connection areas 21 is multiple and the number of the second connection areas 22 is one will be described.

[0141] In some embodiments, the second connection area 22 may be disposed around a plurality of first connection areas 21. In addition, the plurality of first connection areas 21 may be distributed near the edge of the second connection area.

[0142] In some embodiments, the present application does not specifically limit the number, shape, size, and position of the first connection area 21 and the second connection area 22 of the support plate 20.

[0143] In some embodiments, the second connection area 22 may include a first plate area 221, a second plate area 222, and first and second edge areas 223 and 224 disposed opposite to each other. The first edge area 223 may be connected to the second edge area 224 between the first plate area 221 and the second plate area 222. The first edge area 223, the second edge area 224, the first plate area 221, and the second plate area 222 may surround the hollow area 20a. In addition, the first edge area 223 and the second edge area 224 may be arranged along the width direction (i.e., the X-axis direction) of the heat dissipation plate 10. The first plate area 221 and the second plate area 222 may be arranged along the length direction (i.e., the Y-axis direction) of the heat dissipation plate 10. It can be understood that, in the width direction of the middle frame 100, the sizes of the first edge area 223 and the second edge area 224 may be smaller than the sizes of the first plate area 221 and the second plate area 222.

[0144] It can be understood that when the number of the first connection areas 21 is multiple, the first connection areas 21 may be spaced apart and distributed on the first plate area 221, the second plate area 222, the first edge area 223, and the second edge area 224 of the second connection area 22.

[0145] As Figure 11 shown, in some embodiments, the first cover plate 11 of the heat dissipation plate 10 may include a third connection area 111 and a fourth connection area 112. The fourth connection area 112 is fixedly connected to the third connection area 111.

[0146] Exemplarily, the number of the third connection regions 111 is adapted to the number of the first connection regions 21. The number of the fourth connection regions 112 is adapted to the number of the second connection regions 22. For example, the number of the third connection regions 111 is multiple, and the number of the fourth connection regions 112 is one. In some embodiments, the present application does not specifically limit the number, shape, size, and position of the third connection regions 111 and the fourth connection regions 112 of the first cover plate 11 of the heat dissipation plate 10.

[0147] As Figure 11 and Figure 12 shown, the third connection regions 111 of the heat dissipation plate 10 can be fixedly connected to the first connection regions 21 of the support plate 20 through fasteners 31. The fourth connection regions 112 of the heat dissipation plate 10 are fixedly connected to the second connection regions 22 of the support plate 20 through an adhesive tape 32 and an adhesive layer 33. In this way, the heat dissipation plate 10 can be fixedly connected to the support plate 20 through the mutual cooperation of the fasteners 31, the adhesive tape 32, and the adhesive layer 33. At this time, the connection between the heat dissipation plate 10 and the support plate 20 is more reliable and stable, and the heat dissipation plate 10 can better carry the battery 500 and the display screen 300.

[0148] First, as Figure 11 and Figure 12 shown, the third connection regions 111 of the heat dissipation plate 10 can be fixedly connected to the first connection regions 21 of the support plate 20 through fasteners 31.

[0149] Figure 13 is Figure 2 a partial cross-sectional schematic view of the middle frame 100 shown in some embodiments cut along D-D.

[0150] As Figure 13 shown, exemplarily, the first connection regions 21 of the support plate 20 can be provided with fastening holes 211. The third connection regions 111 of the first cover plate 11 can also be provided with fastening holes 113. The fastening holes 113 of the first cover plate 11 can be arranged opposite to the fastening holes 211 of the support plate 20. The middle frame 100 can further include fasteners 31. By sequentially passing the fasteners 31 through the fastening holes 211 of the support plate 20 and the fastening holes 113 of the first cover plate 11, the heat dissipation plate 10 is locked on the support plate 20. At this time, the connection between the heat dissipation plate 10 and the support plate 20 is more reliable and stable.

[0151] It can be understood that when the number of the first connection regions 21 is multiple, the number of the fastening holes 211 of the support plate 20 can also be multiple. Among them, the number of the fastening holes 113 of the first cover plate 11 can match the number of the fastening holes 211 of the support plate 20, that is, the number of the fastening holes 113 of the first cover plate 11 is also multiple. At this time, the multiple fastening holes of the first cover plate 11 and the multiple fastening holes of the support plate 20 are arranged opposite to each other in a one-to-one correspondence. The multiple fasteners 31 pass through the multiple fastening holes of the first cover plate 11 and the multiple fastening holes of the support plate 20 in a one-to-one correspondence.

[0152] Exemplarily, the first connection region 21 of the support plate 20 can be provided with a first groove 212. The fastening hole 211 of the support plate 20 can be located in the first groove 212. The fastening hole 211 of the support plate 20 can form an opening on the bottom wall of the first groove 212. In addition, at least a part of the third connection region 111 of the first cover plate 11 can be recessed towards the bottom wall of the first groove 212 to form a second groove 114. The fastening hole 113 of the first cover plate 11 can be located in the second groove 114. The fastening hole 113 of the first cover plate 11 can form an opening on the bottom wall of the second groove 114.

[0153] It can be understood that after the fastener 31 passes through the fastening hole 113 of the first cover plate 11 and the fastening hole 211 of the support plate 20, a part (such as a nut) of the fastener 31 can be located in the second groove 114. In this way, the fastener 31 can avoid interfering with the display screen 300, thereby avoiding the problem of the fastener 31 pressing against the screen. In addition, when the electronic device 1000 is impacted, the fastener 31 will not impact the display screen 300 either, thereby avoiding display defects such as broken bright spots on the display screen 300 caused by the impact of the fastener 31.

[0154] Exemplarily, the second groove 114 of the first cover plate 11 can be formed by a stamping process.

[0155] Exemplarily, when the number of the fasteners 31 is multiple, the number of the first grooves 212 of the support plate 20 and the number of the second grooves 114 of the first cover plate 11 can match the number of the fasteners 31. In this way, the nuts of the multiple fasteners 31 are arranged in the multiple second grooves 114 in a one-to-one correspondence.

[0156] Exemplarily, the third connection region 111 of the first cover plate 11 can include a plurality of convex bumps 115 arranged at intervals. The plurality of convex bumps 115 can be arranged around the fastening hole 113 of the first cover plate 11. When the first cover plate 11 is locked on the support plate 20 by the fastener 31, the plurality of convex bumps 115 can abut against the first connection region 21 of the support plate 20. In this way, the connection between the first cover plate 11 and the support plate 20 is closer and more reliable.

[0157] Second, as Figure 11 andFigure 12 As shown, the fourth connection area 112 of the heat dissipation plate 10 can be fixedly connected to the second connection area 22 of the support plate 20 through the mutual cooperation of the back glue 32 and the glue layer 33.

[0158] It can be understood that in some embodiments, since in the width direction of the middle frame 100, the sizes of the first plate area 221 and the second plate area 222 of the second connection area 22 are both larger than the sizes of the first border area 223 and the second border area 224 of the second connection area 22, and the bonding force of the back glue with the heat dissipation plate 10 and the support plate 20 is closely related to the size of the support plate 20 in the width direction of the middle frame 100, the fixing methods of the heat dissipation plate 10 with the first plate area 221 and the second plate area 222, and the fixing methods of the heat dissipation plate 10 with the first border area 223 and the second border area 224 will be introduced separately below. In addition, in some embodiments, since in the width direction of the middle frame 100, the sizes of the second plate area 222 and the first plate area 221 of the support plate 20 are substantially the same, the fixing method of the first plate area 221 of the support plate 20 with the heat dissipation plate 10 will be taken as an example for introduction below. Regarding the fixing method of the second plate area 222 of the support plate 20 with the heat dissipation plate 10, reference can be made to the fixing method of the first plate area 221 of the support plate 20 with the heat dissipation plate 10. Of course, other fixing methods can also be adopted for the fixing method of the second plate area 222 of the support plate 20 with the heat dissipation plate 10. Specifically, it will not be elaborated here. Similarly, the fixing method of the first border area 223 of the support plate 20 with the heat dissipation plate 10 will be taken as an example for introduction below.

[0159] Figure 14 is Figure 2 Partial structural schematic diagram of the middle frame 100 in one embodiment as shown. Figure 15 is Figure 2 Partial cross-sectional schematic diagram of the middle frame 100 cut along the E-E in some embodiments as shown.

[0160] As Figure 14 and Figure 15 As shown, the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 can be fixedly connected to the first plate area 221 of the support plate 20 through the mutual cooperation of the first back glue 321 and the first glue layer 331.

[0161] Exemplarily, the back glue 32 may include the first back glue 321. The first back glue 321 is bonded between the fourth connection area 112 of the first cover plate 11 and the first plate area 221 of the support plate 20. It can be understood that since the first back glue 321 has good bonding performance and good impact resistance, the connection between the first cover plate 11 of the heat dissipation plate 10 and the support plate 20 is firm, so as to better meet the requirements of reliability testing.

[0162] Exemplarily, the first adhesive layer 321 may be provided with dispensing holes 3211. The adhesive layer 33 may further include a first adhesive layer 331. Among them, the first adhesive layer 331 may be disposed within the dispensing holes 3211. The first adhesive layer 331 may also be bonded between the fourth connection region 112 of the first cover plate 11 and the first plate region 221 of the support plate 20. It can be understood that, due to the stronger adhesiveness of the first adhesive layer 331, the first adhesive layer 331 can more firmly fixedly connect the heat dissipation plate 10 and the support plate 20. In this way, the connection between the heat dissipation plate 10 and the support plate 20 is more reliable and can better meet the requirements of reliability tests.

[0163] It can be understood that the first adhesive layer 321 can provide the dispensing holes 3211 (i.e., dispensing spaces) for the first adhesive layer 331 to prevent the glue from overflowing everywhere during the dispensing process. Additionally, during the process of fixing the heat dissipation plate 10 to the support plate 20, the first adhesive layer 321 can well support the heat dissipation plate 10, thereby preventing the heat dissipation plate 10 from collapsing the glue during the pressing process and ensuring the connection stability between the heat dissipation plate 10 and the support plate 20.

[0164] It can be understood that the fourth connection region 112 of the heat dissipation plate 10 is not limited to fixedly connecting to the first plate region 221 of the support plate 20 only through the mutual cooperation of the first adhesive layer 321 and the first adhesive layer 331. In some embodiments, the fourth connection region 112 of the heat dissipation plate 10 can also be fixedly connected to the first plate region 221 of the support plate 20 solely through the first adhesive layer 321, or can be fixedly connected to the first plate region 221 of the support plate 20 solely through the first adhesive layer 331. In some embodiments, the heat dissipation plate 10 can also be fixedly connected to the first plate region 221 of the support plate 20 through other fixing methods. Specifically, the present application does not make any limitations.

[0165] Figure 16 is Figure 2 Partial cross-sectional schematic view of the middle frame 100 shown cut along F-F in some embodiments.

[0166] Such as Figure 14 and Figure 16 As shown, the fourth connection region 112 of the first cover plate 11 of the heat dissipation plate 10 can also be fixedly connected to the first edge region 223 of the support plate 20 through a second adhesive layer 332.

[0167] Exemplarily, a first retaining wall 225 may protrude from a first edge region 223 of the second connection region 22 of the support plate 20. The first retaining wall 225 may be located at an end of the first edge region 223 close to the battery compartment 103. The first retaining wall 225, the first edge region 223 of the support plate 20, and the frame 101 may enclose a dispensing groove. The adhesive layer further includes a second adhesive layer 332. The second adhesive layer 332 is bonded between the fourth connection region 112 of the first cover plate 11 and the first edge region 223 of the support plate 20. It can be understood that, due to the stronger adhesiveness of the second adhesive layer 332, the second colloid can more firmly fixedly connect the heat dissipation plate 10 and the first edge region 223 of the support plate 20. In this way, the connection between the heat dissipation plate 10 and the support plate 20 is more reliable, and the requirements of the reliability test can be better met.

[0168] It can be understood that the first retaining wall 225 can prevent the glue from overflowing from the dispensing groove and flowing into the battery compartment 103 during the dispensing process. In addition, by setting the height of the first retaining wall 225, the thickness of the adhesive layer can be flexibly controlled, so as to ensure that the second adhesive layer 332 has a sufficient glue height, so that the heat dissipation plate 10 and the support plate can be stably connected.

[0169] Figure 17 Yes Figure 2 It is a partial cross-sectional view of the middle frame 100 shown in FIG. 1 cut along the F-F in some other embodiments.

[0170] Such as Figure 17 As shown, the fourth connection region 112 of the first cover plate 11 of the heat dissipation plate 10 may also be fixedly connected to the first edge region 223 of the support plate 20 through the second back adhesive 322.

[0171] In some embodiments, in the width direction of the middle frame 100 (i.e., the X-axis direction), the width D of the first edge region 223 of the support plate 20 may be greater than or equal to 1.5 mm. For example, the width D of the first edge region 223 may be 1.5 mm, 2 mm, 2.5 mm, 2.6 mm, 2.8 mm, 3.1 mm, or 4 mm, etc. In some embodiments, the width D of the first edge region 223 of the support plate 20 may not be specifically limited.

[0172] Exemplarily, the back adhesive 32 includes a second back adhesive 322. The second back adhesive 322 may be bonded between the fourth connection region 112 of the first cover plate 11 and the first edge region 223 of the support plate 20. At this time, the first cover plate 11 of the heat dissipation plate 10 may be fixedly connected to the first edge region 223 of the support plate 20 through the second back adhesive 322. In this way, due to the good adhesiveness and impact resistance of the second back adhesive 322, the connection between the first cover plate 11 of the heat dissipation plate 10 and the first edge region 223 of the support plate 20 is more reliable, and the requirements of the reliability test can be better met.

[0173] It can be understood that, compared with the solution in which the fourth connection area 112 of the first cover plate 11 is fixedly connected to the first edge area 223 of the support plate 20 through the second adhesive layer 332, in the embodiment of the present application, the fourth connection area 112 of the first cover plate 11 can be fixedly connected to the first edge area 223 of the support plate 20 through the second back adhesive 322. Therefore, the embodiment of the present application can avoid using the dispensing process, which can not only avoid the risk of glue overflow, but also eliminate the dispensing process and reduce the process cost. In addition, the first edge area 223 of the support plate 20 does not need to be provided with a first retaining wall 225 anymore. In this way, on the one hand, the structure of the first edge area 223 of the support plate 20 is relatively simple and easy to manufacture; on the other hand, the flatness of the first edge area 223 of the support plate 20 is relatively high, which is beneficial to the connection between the first cover plate 11 of the heat dissipation plate 10 and the support plate 20.

[0174] In some embodiments, the fourth connection area 112 of the first cover plate 11 can also be fixedly connected to the first edge area 223 of the support plate 20 through the mutual cooperation of the second back adhesive 322 and the second adhesive layer 332. Specifically, the present application is not limited thereto.

[0175] It can be understood that the foregoing has specifically introduced, in combination with the relevant drawings, the solution in which the third connection area 111 of the heat dissipation plate 10 is fixedly connected to the first connection area 21 of the support plate 20 through the fastener 31, and the fourth connection area 112 of the heat dissipation plate 10 is fixedly connected to the second connection area 22 of the support plate 20 through the back adhesive 32 and the adhesive layer 33. This solution can ensure that the heat dissipation plate 10 can be stably and firmly connected to the support plate 20. Several ways of fixedly connecting the third connection area 111 of the heat dissipation plate 10 to the first connection area 21 of the support plate 20 will be specifically introduced below in combination with the relevant drawings.

[0176] Figure 18 is Figure 2 Partial cross-sectional schematic view of the middle frame 100 shown in another embodiment taken along the D-D line.

[0177] As Figure 18 As shown, in some embodiments, the third connection area 111 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 through the solder joint 52. Among them, the solder joint 52 can be a structure formed between the heat dissipation plate 10 and the support plate 20 through the welding process.

[0178] In some embodiments, the thickness H of the first cover plate 11 of the heat dissipation plate 10 can be less than or equal to 0.2 mm. For example, the thickness L of the first cover plate 11 can be 0.2 mm, 0.15 mm, 0.14 mm, 0.13 mm, 0.12 mm or 0.1 mm, etc. In some embodiments, the thickness H of the first cover plate 11 can also not be specifically limited.

[0179] Exemplarily, the third connection area 111 of the first cover plate 11 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 through a welding process. At this time, solder joints 52 can be formed between the third connection area 111 of the first cover plate 11 and the first connection area 21 of the support plate 20.

[0180] It can be understood that, compared with the solution in which the third connection area 111 of the heat dissipation plate 10 is fixedly connected to the first connection area 21 of the support plate 20 through the fastener 31, in the embodiment of the present application, since the third connection area 111 of the heat dissipation plate 10 is fixedly connected to the first connection area 21 of the support plate 20 through the solder joints 52, the third connection area 111 of the heat dissipation plate 10 and the first connection area 21 of the support plate 20 are not easily damaged due to the opening of the holes, thereby ensuring that the heat dissipation plate 10 and the support plate 20 have better structural strength.

[0181] Figure 19 is Figure 2 A partial cross-sectional view of the middle frame 100 shown in the figure taken along the D-D in some embodiments.

[0182] Such as Figure 19 As shown, in some embodiments, the third connection area 111 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 through the third back glue 323. Among them, the third back glue 323 can be double-sided glue.

[0183] In some embodiments, the middle frame 100 can include the third back glue 323. The third back glue 323 can be bonded between the third connection area 111 of the heat dissipation plate 10 and the first connection area 21 of the support plate 20. At this time, the third connection area 111 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 through the third back glue 323. In this way, due to the good adhesiveness and impact resistance of the third back glue 323, the connection between the first cover plate 11 of the heat dissipation plate 10 and the support plate 20 is more reliable, and the requirements of the reliability test can be better met.

[0184] The foregoing has specifically introduced several fixing methods of the heat dissipation plate 10 and the middle plate 102 in combination with the related drawings. It can be understood that since the heat dissipation plate 10 not only serves to carry the battery 500 and the display screen 300, but also serves to dissipate heat, the material of the heat dissipation plate 10 is generally made of a high-strength metal material. In this way, the heat dissipation plate 10 is likely to generate clutter to the surrounding antenna 60, thus seriously affecting the performance of the antenna 60. In particular, when the heat dissipation plate 10 is arranged in a large area, the influence of the heat dissipation plate 10 on the antenna 60 is particularly significant. Based on this problem, several ways of electrically connecting a part of the heat dissipation plate 10 to the support plate 20 are provided in the embodiments of the present application, so as to solve the problem that the heat dissipation plate 10 affects the performance of the antenna 60. In addition, several ways of insulating a part of the heat dissipation plate 10 from the support plate 20 are also provided in the embodiments of the present application, so as to prevent the current from grounding at the non-grounding position of the heat dissipation plate 10, and further avoid the non-grounding position of the heat dissipation plate 10 from exciting a new magnetic field and affecting the performance of the antenna 60. First, several ways of grounding the heat dissipation plate 10 will be specifically described below in combination with the related drawings.

[0185] As Figure 13 shown, the electronic device 1000 may include an antenna 60. It can be understood that the radiator 61 of the antenna 60 can be used to radiate the antenna 60 signal to the outside of the electronic device 1000 according to the radio frequency signal when receiving the radio frequency signal. In addition, the radiator 61 of the antenna 60 can also be used to receive the antenna 60 signal outside the electronic device 1000 and convert the antenna 60 signal into a radio frequency signal. In some embodiments, a part of the frame 101 can form the radiator 61 of the antenna 60. Or, the radiator 61 of the antenna 60 can be fixed to the inner side surface 104 of the frame 101.

[0186] It can be understood that the number of antennas 60 may not be limited to Figure 13 the one shown, and the number of antennas 60 can also be multiple.

[0187] First, by grounding a part of the heat dissipation plate 10, the heat dissipation plate 10 is prevented from generating clutter to the surrounding antenna 60, thereby affecting the performance of the antenna 60.

[0188] As Figure 13 shown, the first connection area 21 of the support plate 20 is the grounding position of the antenna 60. At this time, the third connection area 111 of the heat dissipation plate 10 is in an area with a relatively large electric field intensity. The third connection area 111 of the heat dissipation plate 10 is likely to generate clutter to the surrounding antenna 60, thus seriously affecting the performance of the antenna 60.

[0189] In an embodiment of the present application, the third connection area 111 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 through a fastener 31. Among them, the material of the fastener 31 can include a conductive material. At this time, the fastener 31 can be a conductive member 50. It can be understood that by setting the material of the fastener 31 to include a conductive material, and the first connection area 21 of the support plate 20 is the grounding position of the antenna 60, the third connection area 111 of the heat dissipation plate 10 can be electrically connected to the first connection area 21 of the support plate 20 through the fastener 31, that is, the third connection area 111 of the heat dissipation plate 10 can be grounded through the fastener 31. In this way, the heat dissipation plate 10 is not likely to generate clutter to the surrounding antenna 60, thus not affecting the performance of the antenna 60.

[0190] It can be understood that the fastener 31 can not only firmly fixedly connect the third connection area 111 of the heat dissipation plate 10 and the first connection area 21 of the support plate 20, but also firmly electrically connect the third connection area 111 of the heat dissipation plate 10 and the first connection area 21 of the support plate 20. The fastener 31 has the effect of "serving multiple purposes with one thing".

[0191] Second, by insulating the non-grounding position of the heat dissipation plate 10 from the support plate 20, the current of the antenna 60 is prevented from grounding at the non-grounding position of the heat dissipation plate 10, and further, a new magnetic field excited at the non-grounding position of the heat dissipation plate 10 is avoided, which affects the performance of the antenna 60.

[0192] As Figure 11 and Figure 12 shown, the second connection area 22 of the support plate 20 is the non-grounding position of the antenna 60. In this way, the fourth connection area 112 of the heat dissipation plate 10 fixedly connected to the second connection area 22 of the support plate 20 is also the non-grounding position of the antenna 60.

[0193] In an embodiment of the present application, the fourth connection area 112 of the heat dissipation plate 10 can be fixedly connected to the second connection area 22 of the support plate 20 through the mutual cooperation of the back glue 32 and the glue layer 33. The materials of the back glue 32 and the glue layer 33 can both include insulating materials. At this time, the back glue 32 and the glue layer 33 can be insulating members 70. It can be understood that by setting the materials of the back glue 32 and the glue layer 33 to both include insulating materials, the fourth connection area 112 of the heat dissipation plate 10 can be insulated from the second connection area 22 of the support plate 20. At this time, the current of the antenna 60 is not likely to ground at the non-grounding position of the heat dissipation plate 10, and further, a new magnetic field excited at the non-grounding position of the heat dissipation plate 10 is avoided, which affects the performance of the antenna 60.

[0194] It can be understood that the adhesive layer 32 and the glue layer 33 can not only fixedly connect the fourth connection area 112 of the heat dissipation plate 10 to the second connection area 22 of the support plate 20, but also electrically connect the fourth connection area 112 of the heat dissipation plate 10 to the second connection area 22 of the support plate 20. The adhesive layer 32 and the glue layer 33 have the effect of "serving multiple purposes with one thing".

[0195] It can be understood that the fixed connection method between the fourth connection area 112 of the heat dissipation plate 10 and the second connection area 22 of the support plate 20 may include the fixing method of the fourth connection area 112 of the heat dissipation plate 10 to the first plate area 221 of the second connection area 22 of the support plate 20, the fixing method of the fourth connection area 112 of the heat dissipation plate 10 to the second plate area 222 of the second connection area 22 of the support plate 20, the fixing method of the fourth connection area 112 of the heat dissipation plate 10 to the first edge area 223 of the second connection area 22 of the support plate 20, and the fixing method of the fourth connection area 112 of the heat dissipation plate 10 to the second edge area 224 of the second connection area 22 of the support plate 20. Hereinafter, the fixing method of the first plate area 221 of the support plate 20 to the heat dissipation plate 10 and the fixing method of the first edge area 223 of the support plate 20 to the heat dissipation plate 10 will be taken as examples for introduction.

[0196] As Figure 15 shown, in some embodiments, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first plate area 221 of the second connection area 22 of the support plate 20 through the mutual cooperation of the first adhesive layer 321 and the first glue layer 331, the insulating property between the fourth connection area 112 of the first cover plate 11 and the first plate area 221 of the second connection area 22 of the support plate 20 can be achieved by setting the materials of the first adhesive layer 321 and the first glue layer 331 to include insulating materials.

[0197] In some embodiments, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first plate area 221 of the second connection area 22 of the support plate 20 separately through the first adhesive layer 321 or the first glue layer 331, the insulating property between the fourth connection area 112 of the first cover plate 11 and the first plate area 221 of the second connection area 22 of the support plate 20 can be achieved by setting the material of the first adhesive layer 321 to include insulating materials or the material of the first glue layer 331 to include insulating materials.

[0198] As Figure 16 shown, in some embodiments, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first edge area 223 of the support plate 20 through the second glue layer 332, the insulating property between the fourth connection area 112 of the first cover plate 11 and the first edge area 223 of the support plate 20 can be achieved by setting the material of the second glue layer 332 to include insulating materials.

[0199] AsFigure 17 As shown, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first edge area 223 of the support plate 20 through the second back glue 322, the material of the second back glue 322 can be set to include an insulating material, so that the fourth connection area 112 of the first cover plate 11 and the first edge area 223 of the support plate 20 are insulated.

[0200] Figure 20 Yes Figure 2 It is a partial cross-sectional schematic view of the middle frame 100 shown in some embodiments cut along the F-F.

[0201] Such as Figure 20 As shown, the middle frame 100 may further include a retaining wall insulating member 71. The retaining wall insulating member 71 may be connected between the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 and the first retaining wall 225 of the support plate 20. In this way, the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 can also be insulated from the first retaining wall 225 of the support plate 20 through the retaining wall insulating member 71.

[0202] Exemplarily, the retaining wall insulating member 71 may be mylar. The retaining wall insulating member 71 may be bonded between the fourth connection area 112 of the first cover plate 11 and the first retaining wall 225 of the support plate 20.

[0203] Exemplarily, the retaining wall insulating member 71 may be insulating paint. The insulating paint may be disposed on the fourth connection area 112 of the first cover plate 11, or disposed on the first retaining wall 225. At this time, the insulating paint can insulate the fourth connection area 112 of the first cover plate 11 from the first retaining wall 225 of the support plate 20.

[0204] It can be understood that the foregoing has specifically introduced the scheme in which the third connection area 111 of the heat dissipation plate 10 is electrically connected to the first connection area 21 of the support plate 20 through the fastener 31, and the fourth connection area 112 of the heat dissipation plate 10 is insulated from the second connection area 22 of the support plate 20 through the back glue 32 and the glue layer 33 in combination with the relevant drawings. Below, several ways of electrically connecting the third connection area 111 of the heat dissipation plate 10 to the first connection area 21 of the support plate 20 will be specifically introduced in combination with the relevant drawings.

[0205] Such as Figure 18 As shown, in some embodiments, the thickness H of the first cover plate 11 of the heat dissipation plate 10 may be less than or equal to 0.2 mm. For example, the thickness H of the first cover plate 11 may be 0.2 mm, 0.15 mm, 0.14 mm, 0.13 mm, 0.12 mm or 0.1 mm, etc. In some embodiments, the thickness L of the first cover plate 11 may not be specifically limited either.

[0206] In some embodiments, the third connection region 111 of the first cover plate 11 of the heat dissipation plate 10 may be fixedly connected to the first connection region 21 of the support plate 20 through a welding process. At this time, a solder joint 52 is formed between the third connection region 111 of the first cover plate 11 and the first connection region 21 of the support plate 20. The solder joint 52 may be a conductive member 50. At this time, the third connection region 111 of the heat dissipation plate 10 may be electrically connected to the first connection region 21 of the support plate 20 through the solder joint 52. Since the first connection region 21 of the support plate 20 is the grounding position of the antenna 60, the third connection region 111 of the heat dissipation plate 10 may be grounded through the solder joint 52. In this way, the heat dissipation plate 10 is not likely to generate clutter to the surrounding antenna 60, thus not affecting the performance of the antenna 60.

[0207] It can be understood that, compared with the scheme in which the heat dissipation plate 10 is grounded through the fastener 31, the heat dissipation plate 10 of the embodiment of the present application is grounded through the solder joint 52. On the one hand, the electrical connection between the heat dissipation plate 10 and the support plate 20 is more firm and the reliability is better. On the other hand, neither the third connection region 111 of the heat dissipation plate 10 nor the first connection region 21 of the support plate 20 is easily damaged due to the opening of the hole, thus ensuring that the heat dissipation plate 10 and the support plate 20 have better structural strength.

[0208] As Figure 19 shown, in some embodiments, the middle frame 100 may include a third back glue 323. The material of the third back glue 323 includes a conductive material. For example, the third back glue 323 may be a conductive foam, a conductive adhesive, etc. Among them, the labels of the conductive foam and the conductive adhesive may be the same as the label of the third back glue 323. At this time, the third back glue 323 is a conductive member 50.

[0209] It can be understood that, since the third connection region 111 of the heat dissipation plate 10 is fixedly connected to the first connection region 21 of the support plate 20 through the third back glue 323, by setting the material of the third back glue 323 to include a conductive material and the first connection region 21 of the support plate 20 being the grounding position of the antenna 60, the third connection region 111 of the heat dissipation plate 10 can be electrically connected to the first connection region 21 of the support plate 20 through the third back glue 323, that is, the third connection region 111 of the heat dissipation plate 10 can be grounded through the third back glue 323. In this way, the heat dissipation plate 10 is not likely to generate clutter to the surrounding antenna 60, thus not affecting the performance of the antenna 60.

[0210] It can be understood that, compared with the scheme in which the heat dissipation plate 10 is grounded through the fastener 31, the heat dissipation plate 10 of the embodiment of the present application can be grounded through the third back glue 323. Therefore, neither the third connection region 111 of the heat dissipation plate 10 nor the first connection region 21 of the support plate 20 is easily damaged due to the opening of the hole, thus ensuring that the heat dissipation plate 10 and the support plate 20 have better structural strength. In addition, the grounding method of the embodiment of the present application is relatively simple and the input of material cost is less.

[0211] The foregoing has specifically introduced, in combination with relevant accompanying drawings, the fixing method of the heat dissipation plate 10 and the middle plate 102, the grounding method of the heat dissipation plate 10 and the middle plate 102, and the insulation setting of the antenna 60 of the heat dissipation plate 10 and the middle plate 102. The following will specifically introduce, in combination with relevant accompanying drawings, the positioning method of the heat dissipation plate 10 and the middle plate 102 to ensure the precise connection of the heat dissipation plate 10 and the middle plate 102.

[0212] Figure 21 is Figure 2 A partial cross-sectional view of the middle frame 100 shown in some embodiments taken along the G-G.

[0213] As Figure 21 shown, in some embodiments, the support plate 20 may be provided with a plurality of first positioning holes 41. The number of the first positioning holes 41 may be two. The shape of the first positioning holes 41 may be round holes. It can be understood that the number, shape and position of the first positioning holes 41 are not specifically limited in this application and can be flexibly set according to requirements.

[0214] In some embodiments, the first cover plate 11 of the heat dissipation plate 10 may be provided with a plurality of second positioning holes 42. It can be understood that the number, shape and position of the second positioning holes 42 may match the number, shape and position of the first positioning holes 41.

[0215] In some embodiments, the second positioning holes 42 may be disposed opposite to the first positioning holes 41. It can be understood that when the number of the second positioning holes 42 and the first positioning holes 41 are both plural, the plurality of second positioning holes 42 may be disposed opposite to the plurality of first positioning holes 41 one by one.

[0216] It can be understood that since the first cover plate 11 of the heat dissipation plate 10 can be fixedly connected to the support plate 20 through a plurality of fasteners 31, during the assembly process of the heat dissipation plate 10 and the support plate 20, it is necessary for a plurality of fastening holes of the heat dissipation plate 10 to be precisely positioned with a plurality of fastening holes of the support plate 20. The implementation manner of this application can set the first positioning holes 41 on the support plate 20 and the second positioning holes 42 on the heat dissipation plate 10. Thus, during the assembly process of the heat dissipation plate 10 and the support plate 20, first align the first positioning holes 41 with the second positioning holes 42, and then insert the positioning posts of the assembly tool into the first positioning holes 41 and the second positioning holes 42 to fix the relative position of the heat dissipation plate 10 on the support plate 20. At this time, a plurality of fastening holes of the heat dissipation plate 10 and a plurality of fastening holes of the middle plate 102 can also be precisely positioned. In this way, on the one hand, the process of locking the fasteners 31 in the fastening holes of the heat dissipation plate 10 and the fastening holes of the support plate 20 is relatively simple; on the other hand, problems such as floating height, loose locking, and assembly deviation of the fasteners 31 are not likely to occur.

[0217] Figure 22 is Figure 2 The structural schematic diagram of an embodiment of the middle frame 100 shown in another perspective.

[0218] As Figure 22 shown, in some embodiments, a limiting boss 51 may be convexly provided on the inner side surface 104 of the frame 101. Figure 22 The frame 101 and the limiting boss 51 are schematically distinguished by a dashed line.

[0219] Wherein, the first cover plate 11 of the heat dissipation plate 10 may be arranged at an interval from the limiting boss 51 (that is, not in contact). At this time, the first cover plate 11 of the heat dissipation plate 10 and the frame 101 can be insulated, so as to avoid the problem of radiated spurious emission (RSE) of the antenna 60.

[0220] In some embodiments, the distance M1 between the first cover plate 11 of the heat dissipation plate 10 and the limiting boss 51 may be less than the distance M2 between the first cover plate 11 of the heat dissipation plate 10 and the inner side surface 104 of the frame 101. In this way, since the distance between the first cover plate 11 of the heat dissipation plate 10 and the limiting boss 51 is small, to a certain extent, the positioning of the heat dissipation plate 10 and the frame 101 can be realized through the mutual cooperation between the first cover plate 11 of the heat dissipation plate 10 and the limiting boss 51. At this time, the plurality of fastening holes of the heat dissipation plate 10 and the plurality of fastening holes of the support plate 20 can also be accurately positioned. On the one hand, the process of locking the fasteners 31 in the fastening holes of the heat dissipation plate 10 and the support plate 20 is relatively simple; on the other hand, the fasteners 31 are not prone to problems such as floating height, loose locking, and assembly deviation.

[0221] It can be understood that, without conflict, the embodiments and features in the embodiments in this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the above-described multiple embodiments can also be arbitrarily combined according to actual needs.

[0222] It can be understood that all the above drawings are exemplary illustrations of this application and do not represent the actual size of the product. And the dimensional proportional relationship between the components in the drawings is not used as a limitation to the actual product of this application. The above is only some embodiments and implementation manners of this application, and the protection scope of this application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application, and all should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation plate (10), characterized in that, It includes a first cover plate (11), a second cover plate (12), a capillary structure (13), and a cooling medium (14); The second cover plate (12) includes an intermediate region (121) and an edge region (122) disposed around the intermediate region (121). The intermediate region (121) includes a shaping area (1211) and a receiving area (1212) connecting the shaping area (1211); The edge region (122) is fixedly connected to the first cover plate (11). The receiving area (1212) of the intermediate region (121) is spaced from the first cover plate (11) and encloses a receiving cavity (15); The capillary structure (13) is fixedly connected to the first cover plate (11) and is located within the receiving cavity (15). The cooling medium (14) is disposed within the receiving cavity (15); The shaping area (1211) of the intermediate region (121) is fixedly connected to the first cover plate (11).

2. The heat dissipation plate (10) according to claim 1, characterized in that, The shaping area (1211) is recessed in a direction approaching the first cover plate (11) and is fixedly connected to the first cover plate (11).

3. The heat dissipation plate (10) according to claim 1, characterized in that, The receiving area (1212) is disposed around the shaping area (1211).

4. The heat dissipation plate (10) according to any one of claims 1 to 3, characterized in that, The number of the shaping areas (1211) is multiple, and the multiple shaping areas (1211) are arranged at intervals along the length direction of the heat dissipation plate (10); 5. The heat dissipation plate (10) according to claim 4, characterized in that, The edge region (122) of the second cover plate (12) includes a first edge (1221) and a second edge (1222) arranged along the length direction of the heat dissipation plate (10). The shortest distance between the first edge (1221) and the second edge (1222) is a; The number of the shaping areas (1211) is two. The distance between the center of the first shaping area (1211) and the center of the second shaping area (1211) is b. Among them, a and b satisfy: 0.25a ≤ b ≤ 0.4a.

6. The heat dissipation plate (10) according to claim 5, characterized in that, The edge region (122) of the second cover plate (12) includes a third edge (1223) and a fourth edge (1224) arranged along the width direction of the heat dissipation plate (10). The third edge (1223) and the fourth edge (1224) are connected between the first edge (1221) and the second edge (1222). The shortest distance between the third edge (1223) and the fourth edge (1224) is c; The distance between the center of the first shaping area (1211) and the third edge (1223) is d. Among them, c and d satisfy: 0.4c ≤ d ≤ 0.6c.

7. The heat dissipation plate (10) according to any one of claims 1 to 6, characterized in that, A part of the receiving area (1212) is recessed in the direction of the first cover plate (11) and is fixedly connected to the capillary structure (13).

8. A middle frame (100), characterized in that, It includes a frame (101) and a middle plate (102). The middle plate (102) is fixedly connected to the inner side surface (104) of the frame (101). The middle plate (102) includes a support plate (20) and a heat dissipation plate (10) as described in any one of claims 1 to 7; The support plate (20) is provided with a hollowed-out area (20a). The first cover plate (11) is fixedly connected to the support plate (20). The first cover plate (11) covers the hollowed-out area (20a) and encloses a battery compartment (103).

9. The middle frame (100) according to claim 8, characterized in that, The number of the shaping areas (1211) is two. The first shaping area (1211) is opposite to the junction of the battery compartment (103) and the support plate (20), and the second shaping area (1211) is opposite to the battery compartment (103).

10. The middle frame (100) according to claim 8 or 9, characterized in that, The support plate (20) includes a first connection area (21) and a second connection area (22). The second connection area (22) is fixedly connected to the first connection area (21). The first cover plate (11) includes a third connection area (111) and a fourth connection area (112). The fourth connection area (112) is fixedly connected to the third connection area (111); The third connection area (111) of the heat dissipation plate (10) is fixedly connected to the first connection area (21) of the support plate (20) through a fastener (31). The fourth connection area (112) of the heat dissipation plate (10) is fixedly connected to the second connection area (22) of the support plate (20) through a back glue (32) and / or an adhesive layer (33).

11. The middle frame (100) according to claim 10, characterized in that, The first connection area (21) of the support plate (20) is provided with a first groove (212). The fastening hole (211) of the support plate (20) is located in the first groove (212). At least a part of the third connection area (111) of the first cover plate (11) is recessed towards the bottom wall of the first groove (212) to form a second groove (114). The fastening hole (113) of the first cover plate (11) is located in the second groove (114); A part of the fastener (31) is located in the second groove (114).

12. The middle frame (100) according to claim 10 or 11, characterized in that, The third connection area (111) includes a plurality of convex hulls (115) arranged at intervals. The plurality of convex hulls (115) are arranged around the fastening hole (113) of the first cover plate (11). The plurality of convex hulls (115) abut against the first connection area (21).

13. The middle frame (100) according to claim 12, characterized in that, The second connection area (22) includes a first plate area (221). The back glue (32) includes a first back glue (321). The adhesive layer (33) includes a first adhesive layer (331); The fourth connection area (112) of the first cover plate (11) is fixedly connected to the first plate area (221) of the support plate (20) of the support plate (20) through the mutual cooperation of the first back glue (321) and the first adhesive layer (331).

14. The middle frame (100) according to claim 13, characterized in that, The first back glue (321) is provided with a glue dispensing hole (3211). The first adhesive layer (331) is arranged in the glue dispensing hole (3211).

15. The middle frame (100) according to claim 13 or 14, characterized in that, The second connection area (22) includes a first edge area (223). The first edge area (223) is fixedly connected to the first plate area (221); The glue layer (33) includes a second glue layer (332), and the fourth connection area (112) of the first cover plate (11) is fixedly connected to the first edge area (223) of the support plate (20) through the second glue layer (332).

16. The middle frame (100) according to claim 15, characterized in that, A first retaining wall (225) protrudes from the first edge area (223) of the support plate (20), and the first retaining wall (225) is located between the second glue layer (332) and the battery compartment (103); The middle frame 100 further includes a retaining wall insulating member (71), and the retaining wall insulating member (71) is connected between the fourth connection area (112) of the first cover plate (11) and the first retaining wall (225).

17. The middle frame (100) according to claim 13 or 14, characterized in that, The second connection area (22) includes a first edge area (223), the first edge area (223) is fixedly connected to the first plate area (221), and in the width direction of the middle frame (100), the width D of the first edge area (223) is greater than or equal to 1.5 millimeters; The back glue (32) includes a second back glue (322), and the fourth connection area (112) of the first cover plate (11) is fixedly connected to the first edge area (223) of the support plate (20) through the second back glue (322).

18. The middle frame (100) according to claim 8 or 9, characterized in that, The support plate (20) includes a first connection area (21) and a second connection area (22), the second connection area (22) is fixedly connected to the first connection area (21), the first cover plate (11) includes a third connection area (111) and a fourth connection area (112), the fourth connection area (112) is fixedly connected to the third connection area (111), and the thickness H of the first cover plate (11) is less than or equal to 0.2 mm; The third connection area (111) of the heat dissipation plate (10) is fixedly connected to the first connection area (21) of the support plate (20) through a solder joint (52), and the fourth connection area (112) of the heat dissipation plate (10) is fixedly connected to the second connection area (22) of the support plate (20) through the back glue (32) and / or the glue layer (33).

19. The middle frame (100) according to any one of claims 8 to 18, characterized in that, A part of the frame (101) forms a radiator (61) of the antenna (60), or the radiator (61) of the antenna (60) is fixed to the inner side surface (104) of the frame (101); The support plate (20) includes a first connection area (21) and a second connection area (22), the second connection area (22) is fixedly connected to the first connection area (21), and the first connection area (21) is the grounding position of the radiator (61) of the antenna (60); The first cover plate (11) includes a third connection area (111) and a fourth connection area (112), and the fourth connection area (112) is fixedly connected to the third connection area (111); The third connection area (111) of the heat dissipation plate (10) is electrically connected to the first connection area (21) of the support plate (20) through a conductive member (50), and the fourth connection area (112) of the heat dissipation plate (10) is insulated from the second connection area (22) of the support plate (20) through an insulating member (70).

20. The middle frame (100) according to claim 19, characterized in that, The conductive member (50) includes a fastener (31), a solder joint (52), or a conductive foam (323). Among them, the material of the fastener (31) includes a conductive material, the insulating member (70) includes an adhesive (32) or an adhesive layer (33), and the materials of the adhesive (32) and the adhesive layer (33) include insulating materials.

21. The middle frame (100) according to claim 19 or 20, characterized in that, A limiting boss (51) protrudes from the inner side surface (104) of the frame (101). The distance between the heat dissipation plate (10) and the limiting boss (51) is less than the distance between the heat dissipation plate (10) and the inner side surface (104) of the frame (101).

22. The middle frame (100) according to any one of claims 8 to 21, characterized in that, The support plate (20) is provided with a plurality of first positioning holes (41), and the first cover plate (11) is provided with a plurality of second positioning holes (42). The plurality of second positioning holes (42) are disposed opposite to the plurality of first positioning holes (41) in a one-to-one correspondence.

23. An electronic device (1000), characterized in that, It includes a rear cover (200), a display screen (300), a battery (500), and a middle frame (100) according to any one of claims 8 to 22; At least a part of the display screen (300) is fixedly connected to the second cover plate (12) of the heat dissipation plate (10), the battery (500) is fixedly connected to the first cover plate (11) of the heat dissipation plate (10), and the battery (500) is located in the battery compartment (103); The rear cover (200) is fixedly connected to the frame (101) of the middle frame (100). The rear cover (200) is located on the side of the middle plate (102) of the middle frame (100) away from the display screen (300), and the rear cover (200) covers the battery (500).

24. The electronic device (1000) according to claim 23, characterized in that, The electronic device (1000) further includes a display screen insulating member (80), and the display screen insulating member (80) is located between the display screen and the second cover plate (12).

25. The electronic device (1000) according to claim 23 or 24, characterized in that, The electronic device (1000) further includes a circuit board (400). The circuit board (400) is fixedly connected to the support plate (20) and is located on the side of the support plate (20) away from the first cover plate (11).

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