Power electronic radiator

Abstract

The invention relates to the technical field of power electronic heat dissipation, and discloses a power electronic radiator which comprises a mounting shell, a cooling mechanism is arranged in the mounting shell and comprises a power electronic equipment body, and a sliding frame is slidably connected to the outer surface of the mounting shell. And seven heat dissipation fans are fixedly mounted on the inner wall of the sliding frame. According to the power electronic radiator, heat generated by the power electronic equipment body can be dissipated by arranging the first cooling fins and the second cooling fins, so that the power electronic equipment body can be cooled during preliminary use, and cooling liquid after heat conduction can be conveyed into the condensation box again through the backflow pipe; according to the power electronic equipment, the cooling liquid can be recycled, so that when the power electronic equipment body is cooled, the radiator can be adjusted according to the amount of heat generated by the power electronic equipment, and the power electronic equipment can be adapted to heat dissipation of the power electronic equipment body in different working states.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronics heat dissipation, and particularly to a power electronics radiator. Background Art

[0002] With the development of economic technology, power electronics devices have emerged. Power electronics devices are devices with power electronics devices as the main functional components, including converters, electronic switches, and electronic AC power controllers. When power electronics devices work, a lot of heat will be generated. If the heat dissipation problem cannot be solved in time, it will damage some electronic component devices, and the heat will corrode the internal circuits of power electronics devices.

[0003] According to the publication number CN108882623A, a radiator for power electronics is disclosed, which includes a heat dissipation plate, a plurality of first heat dissipation fins, and a plurality of second heat dissipation fins; the heat dissipation plate is in a circular ring structure, and the circular ring structure includes an inner ring and an outer ring; a plurality of the first heat dissipation fins are evenly distributed on the inner ring, and a plurality of the second heat dissipation fins are evenly distributed on the outer ring; a plurality of the first heat dissipation fins and a plurality of the second heat dissipation fins are installed in a staggered manner. The cross-sections of the first heat dissipation fins and the second heat dissipation fins are both in a circular arc structure, and the circular arc structures of the first heat dissipation fins and the second heat dissipation fins are exactly arranged in the opposite direction. A plurality of assembly grooves matching with the second heat dissipation fins are evenly distributed on the edge surface of the inner ring. The cross-section shape of the assembly groove is in a dovetail structure, and a circular screw hole is provided at the bottom of the assembly groove. A circular hole matching with the circular screw hole is provided on the second heat dissipation fin.

[0004] Adopting the above technical solution, by installing the first heat dissipation fins on the inner ring and the second heat dissipation fins on the outer ring, during the rotation of the heat dissipation fins, a spiral channel for mutual convection is formed between the first heat dissipation fins and the second heat dissipation fins, increasing the heat dissipation area and improving the heat dissipation efficiency at the same time. However, in the above technical solution, when dissipating heat from power electronics devices, the radiator cannot be adjusted according to the amount of heat generated by the power electronics devices, making it impossible to adapt to the heat dissipation of power electronics devices in different working states. Summary of the Invention

[0005] The purpose of the present invention is to provide a power electronics radiator to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the present invention provides the following technical solution: A power electronics radiator includes an installation shell. A temperature reduction mechanism is arranged inside the installation shell. The temperature reduction mechanism includes a power electronics device body. A sliding frame is slidably connected to the outer surface of the installation shell. Seven heat dissipation fans are fixedly installed on the inner wall of the sliding frame. A temperature sensor is fixedly installed on the inner wall of the installation shell.

[0007] An adjustment mechanism is provided on the outer side of the installation shell. The adjustment mechanism includes a support plate. A condensation box is fixedly installed on the upper surface of the support plate. A liquid extraction pump is fixedly installed on the right side surface of the installation shell. The input end of the liquid extraction pump penetrates through the condensation box and extends into the interior of the condensation box. The output end of the liquid extraction pump is fixedly communicated with a heat conduction pipe. A first heat sink is fixedly installed on the inner wall of the installation shell. The left side surface of the first heat sink is in contact with the right side surface of the power electronic device body. Two second heat sinks are fixedly installed on the inner wall of the installation shell. The mutually approaching side surfaces of the two second heat sinks are respectively in contact with the front and back surfaces of the power electronic device body. The outer surface of the heat conduction pipe is fixedly connected to the outer surfaces of the first heat sink and the second heat sink. The end of the heat conduction pipe away from the liquid extraction pump is fixedly communicated with a return pipe. The end of the return pipe away from the heat conduction pipe penetrates through the condensation box and extends into the interior of the condensation box. The temperature sensor is electrically connected to the heat dissipation fan and the liquid extraction pump through wires.

[0008] Preferably, the outer surface of the power electronic device body is slidably connected to the inner wall of the installation shell. The left side surface of the temperature sensor is in contact with the right side surface of the power electronic device body. Four threaded rods are threadedly connected to the inner wall of the installation shell. Four clamping plates are slidably connected to the inner wall of the installation shell. One end of each threaded rod close to the clamping plate is in contact with the side surface of the clamping plate close to the threaded rod.

[0009] Preferably, a handle is fixedly installed at one end of each threaded rod away from the clamping plate. Anti-slip grooves are arranged at equal intervals on the outer surface of each handle. The inner wall of the support plate is fixedly connected to the outer surface of the installation shell. The upper surface of the support plate is in contact with the bottom surface of the sliding frame.

[0010] Preferably, a rubber pad is fixedly installed on the side surface of each clamping plate away from the threaded rod. The mutually approaching side surfaces of the two groups of rubber pads are respectively in contact with the front and back surfaces of the power electronic device body.

[0011] Preferably, seven blocking plates are fixedly installed on the inner wall of the sliding frame. Air inlet holes are arranged at equal intervals on the upper surface of each blocking plate.

[0012] Preferably, a sealing ring is fixedly installed on the outer surface of the return pipe. The outer surface of the sealing ring is fixedly connected to the inner wall of the condensation box.

[0013] Preferably, a liquid inlet pipe is fixedly communicated with the back surface of the condensation box. A sealing cover is sleeved on the end of the liquid inlet pipe away from the condensation box.

[0014] Preferably, four limit bolts are provided on the right side of the liquid extraction pump. The left end of each limit bolt penetrates through the liquid extraction pump and extends into the interior of the installation shell, and each limit bolt is threadedly connected to the inner wall of the installation shell.

[0015] Preferably, two first connection blocks are fixedly installed on the front and back of the sliding frame, and two second connection blocks are fixedly installed on the front and back of the support plate. The bottom surface of each first connection block is in contact with the upper surface of the second connection block.

[0016] Preferably, connection holes are provided on the upper surfaces of each first connection block and the second connection block, and fixing bolts are threadedly connected to the inner walls of each group of connection holes.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: First, the present invention can be connected to the power electronic device body through the installation shell, so that the first heat sink and the second heat sink can be in contact with the outer surface of the power electronic device. The heat generated by the power electronic device body can be dissipated through the first heat sink and the second heat sink, so that the power electronic device body can be cooled during the initial use. The temperature sensor can detect the temperature generated by the power electronic device body. When the temperature reaches a certain range value set by the temperature sensor, the temperature sensor transmits an electrical signal to the cooling fan through a wire, so that the cooling fan can blow the surfaces of the first heat sink and the second heat sink, thereby increasing the heat conduction efficiency of the first heat sink and the second heat sink.

[0018] Second, the present invention can detect the heat generated by the electronic power device body through the temperature sensor. When the temperature is relatively high and reaches another set value set by the temperature sensor, the temperature sensor can transmit an electrical signal to the liquid extraction pump. The pumping force provided by the liquid extraction pump can pump the coolant in the condensation box outwards, so that the coolant can enter the heat conduction pipe. The heat on the first heat sink and the second heat sink can be conducted to the coolant in the heat conduction pipe, so that the coolant can accelerate the dissipation of the temperature on the first heat sink and the second heat sink. The heat-conducted coolant can be re-transported to the condensation box through the return pipe, thereby realizing the recycling of the coolant. When cooling the power electronic device body, the radiator can be adjusted according to the amount of heat generated by the power electronic device, so as to adapt to the heat dissipation of the power electronic device body under different working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional structural schematic diagram of the overall power electronic radiator of the present invention; Figure 2 is a three-dimensional structural schematic diagram of the installation shell of the present invention; Figure 3 This is a three-dimensional structural schematic diagram of the right-side cross-section of the sliding frame of the present invention; Figure 4 This is a three-dimensional structural schematic diagram of the right view of the first heat sink of the present invention; Figure 5 This is a three-dimensional structural schematic diagram of the rear view of the condensation box of the present invention; Figure 6 This is a three-dimensional structural schematic diagram of the bottom view of the liquid extraction pump of the present invention.

[0020] Wherein: 1. Installation shell; 2. Cooling mechanism; 201. Power electronic equipment body; 202. First heat sink; 203. Second heat sink; 204. Sliding frame; 205. Cooling fan; 206. Temperature sensor; 3. Adjusting mechanism; 301. Support plate; 302. Condensation box; 303. Liquid extraction pump; 304. Heat conduction pipe; 305. Return pipe; 4. Clamping plate; 5. Rubber pad; 6. Handle; 7. Anti-slip groove; 8. Baffle plate; 9. Air inlet hole; 10. Sealing ring; 11. Liquid inlet pipe; 12. Sealing cover; 13. Limit bolt; 14. First connection block; 15. Second connection block; 16. Connection hole; 17. Fixed bolt; 18. Threaded rod. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] Embodiment 1 Please refer to Figure 1-6 , a power electronic radiator, including an installation shell 1, a cooling mechanism 2 is arranged inside the installation shell 1, and an adjusting mechanism 3 is arranged outside the installation shell 1; The cooling mechanism 2 includes a power electronic equipment body 201, the outer surface of the power electronic equipment body 201 is slidably connected to the inner wall of the installation shell 1, the inner wall of the installation shell 1 is fixedly installed with a first heat sink 202, the left side surface of the first heat sink 202 is in contact with the right side surface of the power electronic equipment body 201, the inner wall of the installation shell 1 is fixedly installed with two second heat sinks 203, and the side surfaces of the two second heat sinks 203 close to each other are respectively in contact with the front and back surfaces of the power electronic equipment body 201. The outer surface of the installation shell 1 is slidably connected to a sliding frame 204, seven cooling fans 205 are fixedly installed inside the sliding frame 204, and a temperature sensor 206 is fixedly installed on the inner wall of the installation shell 1. The left side surface of the temperature sensor 206 is in contact with the right side surface of the power electronic equipment body 201.

[0023] The inner wall of the installation shell 1 is threadedly connected with four threaded rods 18. The inner wall of the installation shell 1 is slidably connected with four clamping plates 4. One end of each threaded rod 18 close to the clamping plate 4 is in contact with one side surface of the clamping plate 4 close to the threaded rod 18. The threaded rod 18 can be screwed out of the installation shell 1 to prevent the threaded rod 18 from blocking the sliding frame 204. By rotating the threaded rod 18, the clamping plate 4 can be driven to move, so that the clamping plate 4 can clamp and limit the power electronic device body 201, thus facilitating the installation of the installation shell 1 on the power electronic device body 201, making it convenient to install and disassemble the installation shell 1, and increasing the convenience of installing and disassembling the installation shell 1.

[0024] One end of each threaded rod 18 far from the clamping plate 4 is fixedly installed with a handle 6. The outer surface of each handle 6 is provided with anti-slip grooves 7 arranged at equal distances. Through the handle 6, it is convenient for personnel to hold, so as to facilitate the personnel to rotate the threaded rod 18, so that the threaded rod 18 can abut against the clamping plate 4. The anti-slip grooves 7 can increase the friction between the handle 6 and the personnel's hand, prevent the hand from slipping when the personnel rotates the threaded rod 18, and increase the convenience of rotating the threaded rod 18.

[0025] One side surface of each clamping plate 4 far from the threaded rod 18 is fixedly installed with a rubber pad 5. One side surfaces of the two groups of rubber pads 5 far from the clamping plate 4 are respectively in contact with the front and back surfaces of the power electronic device body 201. Through the rubber pad 5, the friction between the clamping plate 4 and the power electronic device body 201 can be increased, so that the clamping plate 4 clamps the power electronic device body 201 more firmly, thus preventing the power electronic device body 201 from slipping on the clamping plate 4 and increasing the stability of the installation of the installation shell 1.

[0026] Seven blocking plates 8 are fixedly installed on the inner wall of the sliding frame 204. The upper surface of each blocking plate 8 is provided with air inlet holes 9 arranged at equal distances. Through the blocking plates 8, larger impurities in the air drawn in by the cooling fan 205 can be blocked, so as to prevent the larger impurities from colliding and damaging the cooling fan 205. The air inlet holes 9 can convey the outside air to the surfaces of the first heat sink 202 and the second heat sink 203, increasing the protection of the device.

[0027] The specific implementation manner of this embodiment is as follows: First, connect the power supply to the heat dissipation fan 205 and the temperature sensor 206. When a person holds the grip 6, the threaded rod 18 can be rotated. The anti-slip groove 7 can increase the friction between the grip 6 and the person's hand, preventing the hand from slipping when the person rotates the threaded rod 18, so that the threaded rod 18 can abut against the clamping plate 4. The clamping plate 4 can clamp and limit the power electronic device body 201, thus facilitating the installation of the installation shell 1 on the power electronic device body 201. The rubber pad 5 can increase the friction between the clamping plate 4 and the power electronic device body 201, making the clamping of the power electronic device body 201 by the clamping plate 4 more stable, thereby preventing the power electronic device body 201 from slipping on the clamping plate 4. The first heat sink 202 and the second heat sink 203 can be in contact with the outer surface of the power electronic device. Through the first heat sink 202 and the second heat sink 203, the heat generated by the power electronic device body 201 can be dissipated, so that the power electronic device body 201 can be cooled during its initial use. The temperature sensor 206 can detect the temperature generated by the power electronic device body 201. When the temperature reaches a certain range value set by the temperature sensor 206, the temperature sensor 206 transmits an electrical signal to the heat dissipation fan 205 through a wire, causing the heat dissipation fan 205 to work and blow the surfaces of the first heat sink 202 and the second heat sink 203, thereby increasing the heat conduction efficiency of the first heat sink 202 and the second heat sink 203. The baffle plate 8 can block larger impurities in the air drawn in by the heat dissipation fan 205, thus preventing the larger impurities from colliding and damaging the heat dissipation fan 205.

[0028] Embodiment Two Please refer to Figure 1-6 , the adjusting mechanism 3 includes a support plate 301. The inner wall of the support plate 301 is fixedly connected to the outer surface of the installation shell 1. The upper surface of the support plate 301 is in contact with the bottom surface of the sliding frame 204. A condensation box 302 is fixedly installed on the upper surface of the support plate 301. The working principle of the condensation box 302 is that the coolant stored in the water tank is sucked into the circulation system by a circulation pump, and the internal water circulation radiator and cooling fan can cool the incoming coolant. A liquid extraction pump 303 is fixedly installed on the right side surface of the installation shell 1. The input end of the liquid extraction pump 303 penetrates through the condensation box 302 and extends into the interior of the condensation box 302. The output end of the liquid extraction pump 303 is fixedly communicated with a heat conduction pipe 304. The outer surface of the heat conduction pipe 304 is fixedly connected to the outer surfaces of the first heat sink 202 and the second heat sink 203 respectively. One end of the heat conduction pipe 304 away from the liquid extraction pump 303 is fixedly communicated with a return pipe 305. One end of the return pipe 305 away from the heat conduction pipe 304 penetrates through the condensation box 302 and extends into the interior of the condensation box 302. The temperature sensor 206 is electrically connected to the heat dissipation fan 205 and the liquid extraction pump 303 through wires respectively.

[0029] A sealing ring 10 is fixedly installed on the outer surface of the return pipe 305. The outer surface of the sealing ring 10 is fixedly connected to the inner wall of the condensation box 302. Through the sealing ring 10, the gap between the return pipe 305 and the condensation box 302 can be sealed, thereby preventing the coolant from leaking out through the gap, and increasing the sealing performance between the return pipe 305 and the condensation box 302.

[0030] A liquid inlet pipe 11 is fixedly connected to the back of the condensation box 302. A sealing cover 12 is sleeved on the end of the liquid inlet pipe 11 away from the condensation box 302. Through the liquid inlet pipe 11, the coolant can be input into the condensation box 302. The sealing cover 12 can seal the sealing cover 12 after the coolant is put in, thereby preventing external dust or impurities from entering the condensation box 302, and increasing the sealing performance of the liquid inlet pipe 11.

[0031] Four limit bolts 13 are arranged on the right side of the liquid extraction pump 303. The left end of each limit bolt 13 passes through the liquid extraction pump 303 and extends into the interior of the installation shell 1. Each limit bolt 13 is threadedly connected to the inner wall of the installation shell 1. Through the limit bolts 13, the liquid extraction pump 303 can be limited and fixed, thereby preventing the liquid extraction pump 303 from shaking and shifting during operation, and increasing the stability of the liquid extraction pump 303.

[0032] Two first connection blocks 14 are fixedly installed on the front and back of the sliding frame 204. Two second connection blocks 15 are fixedly installed on the front and back of the support plate 301. The bottom surface of each first connection block 14 is in contact with the upper surface of the second connection block 15. Through the first connection blocks 14 and the second connection blocks 15, the sliding frame 204 can be limited and connected, thereby preventing the sliding frame 204 from shifting and falling, and increasing the stability of the sliding frame 204.

[0033] A connection hole 16 is formed in the upper surface of each first connection block 14 and the second connection block 15. A fixing bolt 17 is threadedly connected to the inner wall of each group of connection holes 16. Through the fixing bolt 17, the first connection block 14 and the second connection block 15 can be limited and fixed, thereby facilitating the installation and disassembly of the first connection block 14, enabling the sliding frame 204 to slide out upwards, facilitating the maintenance of the first heat sink 202 and the second heat sink 203, and at the same time enabling the coolant to be replenished, increasing the convenience of the device.

[0034] The specific implementation manner of this embodiment is as follows: First, connect the liquid extraction pump 303 to the power supply. The temperature sensor 206 can detect the heat generated by the electronic power equipment body. When the temperature is relatively high and reaches another set value set by the temperature sensor 206, the temperature sensor 206 can transmit an electrical signal to the liquid extraction pump 303. The suction force provided by the liquid extraction pump 303 can extract the coolant in the condensation box 302 outwards, so that the coolant can enter the heat conduction tube 304. The heat on the first heat sink 202 and the second heat sink 203 can be conducted to the coolant in the heat conduction tube 304, enabling the coolant to accelerate the dissipation of the temperature on the first heat sink 202 and the second heat sink 203. The heat-conducted coolant can be re-transmitted to the condensation box 302 through the return pipe 305, thereby realizing the recycling of the coolant. The sealing ring 10 can seal the gap between the return pipe 305 and the condensation box 302, thereby preventing the coolant from leaking out through the gap. When dissipating heat from the power electronic equipment body 201, the radiator can be adjusted according to the amount of heat generated by the power electronic equipment, so as to adapt to the heat dissipation of the power electronic equipment body 201 under different working conditions.

[0035] The working principle of the present invention is as follows: When in use, first connect the cooling fan 205, temperature sensor 206 and liquid extraction pump 303 to the power supply. When a person holds the grip 6, the threaded rod 18 can be rotated. The anti-slip groove 7 can increase the friction between the grip 6 and the human hand, preventing the hand from slipping when the person rotates the threaded rod 18, so that the threaded rod 18 can abut against the clamping plate 4, and the clamping plate 4 can clamp and limit the power electronic device body 201, thus facilitating the installation of the installation shell 1 on the power electronic device body 201. The rubber pad 5 can increase the friction between the clamping plate 4 and the power electronic device body 201, making the clamping of the clamping plate 4 on the power electronic device body 201 more stable, thereby preventing the power electronic device body 201 from slipping on the clamping plate 4. The first heat sink 202 and the second heat sink 203 can be in contact with the outer surface of the power electronic device. Through the first heat sink 202 and the second heat sink 203, the heat generated by the power electronic device body 201 can be dissipated, so that the power electronic device body 201 can be cooled during its initial use. The temperature sensor 206 can detect the temperature generated by the power electronic device body 201. When the temperature reaches a certain range value set by the temperature sensor 206, the temperature sensor 206 transmits an electrical signal to the cooling fan 205 through a wire, causing the cooling fan 205 to operate and blow the surfaces of the first heat sink 202 and the second heat sink 203, thereby increasing the heat conduction efficiency of the first heat sink 202 and the second heat sink 203. The baffle plate 8 can block larger impurities in the air drawn in by the cooling fan 205, thus preventing the larger impurities from colliding and damaging the cooling fan 205. The temperature sensor 206 can detect the heat generated by the power electronic device body. When the temperature is relatively high and reaches another set value set by the temperature sensor 206, the temperature sensor 206 can transmit an electrical signal to the liquid extraction pump 303. The suction force provided by the liquid extraction pump 303 can draw out the coolant in the condensation box 302, so that the coolant can enter the heat conduction tube 304. The heat on the first heat sink 202 and the second heat sink 203 can be conducted to the coolant in the heat conduction tube 304, enabling the coolant to accelerate the dissipation of the temperature on the first heat sink 202 and the second heat sink 203. The heat-conducted coolant can be re-transported to the condensation box 302 through the return pipe 305, thus realizing the recycling of the coolant. The sealing ring 10 can seal the gap between the return pipe 305 and the condensation box 302, thereby preventing the coolant from leaking out through the gap. When cooling the power electronic device body 201, the radiator can be adjusted according to the amount of heat generated by the power electronic device, so as to adapt to the heat dissipation of the power electronic device body 201 in different working states.

[0036] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0037] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A power electronic heat sink, comprising a mounting shell (1), characterized in that: A cooling mechanism (2) is provided inside the installation shell (1), the cooling mechanism (2) comprising a power electronic device body (201), a sliding frame (204) is slidably connected to the outer surface of the installation shell (1), seven cooling fans (205) are fixedly mounted on the inner wall of the sliding frame (204), and a temperature sensor (206) is fixedly mounted on the inner wall of the installation shell (1); An adjustment mechanism (3) is arranged on the outside of the installation shell (1), the adjustment mechanism (3) comprising a support plate (301), a condensation box (302) being fixedly mounted on the upper surface of the support plate (301), a liquid pump (303) being fixedly mounted on the right side surface of the installation shell (1), an input end of the liquid pump (303) passing through the condensation box (302) and extending into the interior of the condensation box (302), an output end of the liquid pump (303) being fixedly connected to a heat conducting pipe (304), a first heat sink (202) being fixedly mounted on the inner wall of the installation shell (1), a left side surface of the first heat sink (202) being in contact with a right side surface of a power electronic device body (201), and an inner wall of the installation shell (1) Two second heat sinks (203) are fixedly installed, and the side surfaces of the two second heat sinks (203) close to each other are respectively in contact with the front and back surfaces of the power electronic device body (201); the outer surfaces of the heat pipe (304) are respectively fixedly connected to the outer surfaces of the first heat sink (202) and the second heat sink (203); one end of the heat pipe (304) away from the liquid pump (303) is fixedly connected to a return pipe (305); one end of the return pipe (305) away from the heat pipe (304) passes through the condensation box (302) and extends to the interior of the condensation box (302); and the temperature sensor (206) is respectively electrically connected to the heat dissipation fan (205) and the liquid pump (303) through wires.

2. A power electronic radiator according to claim 1, characterized in that: The outer surface of the power electronic device body (201) is slidably connected to the inner wall of the mounting shell (1); the left side surface of the temperature sensor (206) is in contact with the right side surface of the power electronic device body (201); four threaded rods (18) are threadedly connected to the inner wall of the mounting shell (1); four clamping plates (4) are slidably connected to the inner wall of the mounting shell (1); and one end of each threaded rod (18) close to the clamping plate (4) is in contact with a side surface of the clamping plate (4) close to the threaded rod (18).

3. A power electronic radiator according to claim 2, characterized in that: A handle (6) is fixedly mounted on one end of each threaded rod (18) away from the clamping plate (4), and an outer surface of each handle (6) is provided with anti-slip grooves (7) arranged at equal distances. The inner wall of the support plate (301) is fixedly connected to the outer surface of the mounting shell (1), and the upper surface of the support plate (301) is in contact with the bottom surface of the sliding frame (204).

4. A power electronic radiator according to claim 2, characterized in that: A rubber pad (5) is fixedly mounted on a side of each clamping plate (4) away from the threaded rod (18), and the side of two groups of rubber pads (5) away from the clamping plates (4) are in contact with the front and back sides of the power electronic device body (201) respectively.

5. The power electronic heat sink according to claim 1, characterized in that: Seven blocking plates (8) are fixedly mounted on the inner wall of the sliding frame (204), and each of the blocking plates (8) has an upper surface provided with air inlet holes (9) arranged at equal distances.

6. A power electronic heat sink according to claim 1, characterized in that: A sealing ring (10) is fixedly mounted on the outer surface of the return pipe (305), and the outer surface of the sealing ring (10) is fixedly connected to the inner wall of the condensation box (302).

7. A power electronic heat sink according to claim 1, characterized in that: The back side of the condensation box (302) is fixedly connected to a liquid inlet pipe (11), and one end of the liquid inlet pipe (11) away from the condensation box (302) is sleeved with a sealing cover (12).

8. The power electronic heat sink according to claim 1, characterized in that: Four limiting bolts (13) are arranged on the right side of the liquid pump (303), the left end of each limiting bolt (13) passes through the liquid pump (303) and extends to the inside of the mounting shell (1), and each limiting bolt (13) is threadedly connected to the inner wall of the mounting shell (1).

9. The power electronic heat sink according to claim 1, characterized in that: Two first connection blocks (14) are fixedly mounted on the front and back sides of the sliding frame (204), and two second connection blocks (15) are fixedly mounted on the front and back sides of the support plate (301), and the bottom surface of each first connection block (14) is in contact with the upper surface of the second connection block (15).

10. A power electronic heat sink according to claim 9, characterized in that: The upper surface of each of the first connecting block (14) and the second connecting block (15) is provided with connecting holes (16), and the inner wall of each group of the connecting holes (16) is threadedly connected with a fixing bolt (17).

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