Multi-stage buffering column nail roller structure and preparation process

Abstract

The invention discloses a multi-stage buffering column nail roller structure and a preparation technology. The multi-stage buffering column nail roller structure is composed of column nail pieces, buffering pieces, nail holes and a roller sleeve structure. And the surface of the buffer piece is coated with fixing glue, and then the buffer piece is pressed into the bottom of the nail hole in a high-pressure press-fitting mode. The fixing glue can enable the buffering piece to be tightly combined with the bottom of the nail hole, and meanwhile the effect of buffering stress is achieved to a certain degree. High-pressure press fitting can ensure that the buffer piece is firmly mounted, and the buffer piece can better adapt to the shape and the size of a nail hole. And the surface of the column nail piece is coated with the fixing glue, and then the column nail piece is pressed into the nail hole in a high-pressure press-fitting mode. At the moment, the column nail piece is in close contact with the buffering piece, and the tiny gap between the column nail piece and the nail hole is filled with the fixing glue, so that the column nail piece, the buffering piece and the nail hole form a whole.

Description

Technical Field

[0001] The present invention belongs to the technical field of roller mills for mining, and specifically relates to a multi-stage buffer stud roller structure and a preparation process thereof. Background Art

[0002] Roller mills are developed based on the "laminated crushing principle" and are widely used in crushing industries such as mines, cement, and metallurgy. In order to improve the operation cycle and the service life of the roller surface of roller mills, most enterprises use stud roller sleeves and directly inlay studs in the stud holes of the roller sleeves. However, during the actual working process, the roller surface of the stud roller bears huge alternating loads, and the stress situation is very complex. Stud roller failure phenomena such as stud shedding, roller surface spalling, and roller sleeve cracking often occur. Summary of the Invention

[0003] The purpose of the present invention is to reduce the impact stress at the bottom of the stud hole and delay the cycle of generating fatigue cracks, thereby solving the problems of stud roller failure such as stud shedding, roller surface spalling, and roller sleeve cracking.

[0004] In order to solve the above technical problems, the inventor has obtained the technical solution of the present invention through practice and summary. The present invention adopts the following technical solution:

[0005] A multi-stage buffer stud roller structure, comprising:

[0006] A roller sleeve structure, on the surface of which stud holes are evenly distributed;

[0007] A buffer member, which is fitted at the root of the stud hole;

[0008] A stud member, which is fitted in the stud hole and its end is in close contact with the buffer member;

[0009] A holding glue is filled between the buffer member, the stud member and the stud hole.

[0010] Preferably, the thickness of the buffer member is 3 - 15 mm, the hardness is HB80 - HB230, and it is lower than the hardness of the roller sleeve structure.

[0011] Preferably, a ceramic coating is provided on the inner wall of the stud hole, and the thickness of the ceramic coating is controlled within 50 - 500 μm.

[0012] Preferably, the bottom shape of the buffer member is a flat bottom, a taper angle, a spherical shape or a hemispherical shape, and the bottom structure of the stud hole is adapted to the bottom structure of the buffer member;

[0013] The bottom shape of the stud member is a flat bottom, a taper angle, a spherical shape, a hemispherical shape, and the head of the buffer member is adapted to the bottom structure of the stud member.

[0014] Preferably, a first annular groove is provided on the inner wall at the root of the stud hole, and the depth of the first annular groove is 0.5 - 3 mm.

[0015] Preferably, a second annular groove is provided on the inner wall at the root of the ceramic coating, and the depth of the second annular groove is 25 - 250 μm.

[0016] Preferably, a connecting head is provided at the bottom of the stud member. The bottom of the connecting head has an arc-shaped surface structure. The bottom size of the connecting head is larger than the head size of the connecting head, and the taper of the connecting head is 1:10 - 30;

[0017] A connecting groove corresponding to the position of the connecting head is provided at the head of the buffer member.

[0018] A manufacturing process of a multi-stage buffer stud roller structure is as follows:

[0019] Step 1, Preparation

[0020] Check and clean the nail holes, stud members and buffer members to ensure that the surfaces are clean and free of impurities;

[0021] Step 2, Install the buffer member

[0022] Apply retaining glue on the surface of the buffer member, and then press the buffer member into the bottom of the nail hole by means of high-pressure press-fitting;

[0023] The retaining glue makes the buffer member closely combine with the bottom of the nail hole, and at the same time plays a role in buffering stress to a certain extent;

[0024] Step 3, Install the stud member

[0025] Apply retaining glue on the surface of the stud member, and then press the stud member into the nail hole by means of high-pressure press-fitting;

[0026] At this time, the stud member is in close contact with the buffer member, and the retaining glue fills the tiny gap between the stud member and the nail hole, making the three form a whole.

[0027] A manufacturing process of a multi-stage buffer stud roller structure is as follows:

[0028] Step 1, Preparation

[0029] Check and clean the nail holes, stud members and buffer members to ensure that the surfaces are clean and free of impurities.

[0030] Step 2, Spray the ceramic coating

[0031] Select a coating alloy powder with high hardness, wear resistance and strong bonding force with the metal matrix, and use plasma spraying or supersonic flame spraying process to evenly spray it on the inner wall of the nail hole;

[0032] The coating thickness is controlled within 50 - 500 μm to ensure that the coating is dense and pore-free, and has both high strength and impact resistance;

[0033] Through natural curing, a firm bond is formed between the coating and the hole wall;

[0034] After spraying, grinding is carried out to adjust the hole diameter to the design tolerance;

[0035] Step 3, grinding the ceramic coating

[0036] Uniformly reciprocate along the axial direction of the nail hole for grinding, reducing the surface roughness of the coating to Ra0.8 - 1.6μm, removing local protrusions or tumor-like defects, ensuring that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer, and avoiding insufficient coating thickness caused by excessive grinding;

[0037] Confirm that there is no residual grinding debris, blow the dust in the hole with compressed air, and finally wipe and clean with a cleaner;

[0038] Step 4, installing the buffer

[0039] Apply retaining glue on the surface of the buffer, and then press the buffer into the bottom of the nail hole by means of high-pressure press-fitting;

[0040] The retaining glue makes the buffer closely bond with the bottom of the nail hole, and at the same time plays a role in buffering stress to a certain extent;

[0041] Step 5, installing the stud

[0042] Apply retaining glue on the surface of the stud, and then press the stud into the nail hole by means of high-pressure press-fitting;

[0043] The stud is in close contact with the buffer, and the retaining glue fills the tiny gap between the stud and the nail hole, making the three form a whole.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] In one way, the structure of the present invention consists of a stud, a buffer, a nail hole, and a roller sleeve structure; apply retaining glue on the surface of the buffer, and then press the buffer into the bottom of the nail hole by means of high-pressure press-fitting. The retaining glue can make the buffer closely bond with the bottom of the nail hole, and at the same time plays a role in buffering stress to a certain extent. High-pressure press-fitting can ensure the firm installation of the buffer and can better adapt to the shape and size of the nail hole. Apply retaining glue on the surface of the stud as well, and then press the stud into the nail hole by means of high-pressure press-fitting. At this time, the stud is in close contact with the buffer, and the retaining glue fills the tiny gap between the stud and the nail hole, making the three form a whole.

[0046] In another way, the present invention first sprays a ceramic coating on the inner wall of the nail hole to enhance the strength of the inner wall of the nail hole while ensuring the toughness of the roll sleeve structure. On this basis, a buffer member is added between the stud member and the nail hole. When the stud member is subjected to extrusion force and alternating load, the impact kinetic energy is absorbed through the plastic deformation of the buffer member, and the concentrated stress field is converted into distributed energy and dissipated to the bottom of the nail hole. The amplitude of the alternating stress at the bottom of the nail hole is reduced below the fatigue limit of the roll sleeve structure material, greatly delaying the cycle of generating fatigue cracks, effectively avoiding the situation of roll surface peeling and roll sleeve cracking during the service life of the stud roll, and significantly improving the service life of the roll sleeve. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a schematic structural diagram of the first solution of the present invention;

[0048] Figure 2 It is a schematic diagram of the nail hole structure of the first solution of the present invention;

[0049] Figure 3 It is a schematic structural diagram of the second solution of the present invention;

[0050] Figure 4 It is a schematic diagram of the nail hole structure of the second solution of the present invention;

[0051] Figure 5 It is a schematic structural diagram of the third solution of the present invention;

[0052] Figure 6 It is a schematic diagram of the nail hole structure of the third solution of the present invention;

[0053] Figure 7 It is a schematic structural diagram of the fourth solution of the present invention;

[0054] Figure 8 It is a schematic diagram of the nail hole structure of the fourth solution of the present invention;

[0055] Figure 9 It is a schematic diagram of the buffer member in the second and fourth solutions of the present invention;

[0056] Figure 10 It is a schematic diagram of the stud member in the second and fourth solutions of the present invention;

[0057] Figure 11 It is a bottom view of the stud member in the second and fourth solutions of the present invention;

[0058] Figure 12 It is a schematic structural diagram of the fifth solution of the present invention;

[0059] Figure 13 It is a schematic diagram of the nail hole structure of the fifth solution of the present invention;

[0060] Figure 14Schematic diagram of the stud structure of Solution Five of the present invention;

[0061] Figure 15 Cross-sectional view of the stud of Solution Five of the present invention;

[0062] Figure 16 Cross-sectional view of the buffer of Solution Five of the present invention;

[0063] Figure 17 Schematic diagram of the structure of the assembly of Solution Five of the present invention. Detailed implementation manners

[0064] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0065] Roller mills are developed based on the "laminated crushing principle" and are widely used in the crushing industries such as mines, cement, and metallurgy. In order to improve the operating cycle and the service life of the roller surface of the roller mill, most enterprises use studded roller sleeves and directly inlay the studs in the stud holes of the roller sleeve; however, during the actual working process, the roller surface of the studded roller bears huge cyclic loads and the stress conditions are very complex. Stud detachment, roller surface spalling, and roller sleeve cracking and other studded roller failure phenomena often occur. Among them:

[0066] Stud detachment: When the stud hole and the stud adopt a clearance fit, since the hardness of the stud is much higher than that of the stud hole, when the stud is subjected to non-axial cyclic alternating loads, and when there are large hard materials or metal foreign objects mixed in the material, the extrusion stress is much greater than the strength that the retaining glue can withstand, and the retaining glue will gradually lose its connection function. When the retaining glue no longer works, the cyclic alternating stress generated by the extrusion of the material will directly act on the stud hole, continuously impact the stud hole with lower hardness, and under the continuous action of the alternating stress, the stud hole will be deformed and the hole diameter will be gradually stretched and increased. When the clearance between the stud and the stud hole reaches a certain degree, the stud will fall off from the stud hole.

[0067] Fatigue crack: Since the strength of the stud is much higher than that of the roller sleeve matrix, when the stud bears cyclic loads, and when there are large hard materials or metal foreign objects mixed in the material, when the stud transmits the force to the bottom of the stud hole on the roller surface and squeezes and rubs the sleeve body at the bottom of the hole, after repeated actions, due to the large stress concentration in the bottom area of the stud hole, fatigue cracks will occur.

[0068] Roller surface spalling: When the crack extends along the direction parallel to the roller surface, large-area cracks and hollowing phenomena will be formed in the bottom area of the stud hole, and the crack further extends to the roller surface, resulting in roller surface spalling.

[0069] Roll surface cracking: When the crack extends longitudinally at a certain angle to the roll surface, as the fatigue crack continuously expands, the load-bearing area of the roll sleeve decreases. When the crack expands to a certain extent, instantaneous cracking occurs under the action of the external load and residual stress.

[0070] Therefore, the inventor proposes the following technical solutions to solve the above problems.

[0071] Solution 1: As shown in Figure 1 and Figure 2 , a three-stage buffer stud roll structure composed of stud parts 20, buffer parts 30, stud holes 11, and roll sleeve structures 10; by adding a buffer part 30 between the stud parts 20 and the stud holes 11, when the stud parts 20 are subjected to extrusion pressure and alternating loads, the buffer part 30 plastically deforms to absorb the impact kinetic energy, converting the concentrated stress field into distributed energy and dissipating it to the bottom of the stud holes 11. The amplitude of the alternating stress at the bottom of the stud holes 11 is reduced below the fatigue limit of the material of the roll sleeve structure 10, greatly delaying the cycle of generating fatigue cracks; at the same time, due to the absorption of the buffer part 30 for the alternating load capacity, the time for the holding glue to fail is also delayed.

[0072] By adding a buffer part 30 between the stud parts 20 and the stud holes 11, a three-stage buffer stud roll structure of "stud - buffer part - roll sleeve structure" is constructed, the stress at the root of the stud is reduced by 30% - 50%, the fatigue life of the matrix is extended by more than 1.5 - 3 times, effectively avoiding the situation of roll surface spalling and roll sleeve cracking during the service life of the stud roll. The service life of the roll sleeve is increased by 2 - 3 times compared to the traditional structure, and the stud detachment cycle is extended to 1.5 - 3 times that of the traditional structure;

[0073] When adding a buffer part 30 between the stud parts 20 and the stud holes 11, metals or multi-layer composite materials can be used, with a hardness between HB80 - HB230, lower than the hardness of the roll sleeve matrix;

[0074] The stud holes 11 and the buffer parts 30, and the stud holes 11 and the stud parts 20 can adopt interference fit, clearance fit, or transition fit methods;

[0075] Both the buffer parts 30 and the stud parts 20 are pressed into the stud holes by means of high-pressure pressing;

[0076] The outer diameter of the buffer part 30 is adapted to the outer diameter of the stud part 20, and the outer diameter is adapted to the inner diameter of the stud hole 11. The height of the buffer part 30 is 3 mm - 15 mm.

[0077] The bottom outer shape of the buffer part 30 can adopt flat bottom, taper angle, spherical, or hemispherical structures, and the bottom structure of the stud hole 11 is adapted to the bottom structure of the buffer part 30.

[0078] Preparation process:

[0079] Preparation: Inspect and clean the nail holes 11, stud parts 20, and buffer parts 30 to ensure the surfaces are clean and free of impurities.

[0080] Install the buffer part 30: Apply retaining glue on the surface of the buffer part 30, and then press the buffer part 30 into the bottom of the nail hole 11 by means of high-pressure press-fitting. The retaining glue can make the buffer part 30 closely combine with the bottom of the nail hole 11, and at the same time play a role in buffering stress to a certain extent. High-pressure press-fitting can ensure that the buffer part 30 is firmly installed and can better adapt to the shape and size of the nail hole 11.

[0081] Install the stud part 20: Also apply retaining glue on the surface of the stud part 20, and then press the stud part 20 into the nail hole 11 by means of high-pressure press-fitting. At this time, the stud part 20 is in close contact with the buffer part 30, and the retaining glue fills the tiny gap between the stud part 20 and the nail hole 11, making the three form a whole.

[0082] Solution 2: As Figure 5 and Figure 6 shown, it consists of a stud part 20, a buffer part 30, a ceramic coating 12, a nail hole 11, and a roller sleeve structure 10; First, spray the ceramic coating 12 on the inner wall of the nail hole 11 to enhance the strength of the inner wall of the nail hole 11 while ensuring the toughness of the roller sleeve structure 10; On this basis, add a buffer part 30 between the stud part 20 and the nail hole 11. When the stud part 30 is subjected to extrusion force and alternating load, the impact kinetic energy is absorbed through the plastic deformation of the buffer part 30, and the concentrated stress field is converted into distributed energy and dissipated to the bottom of the nail hole 11; By spraying the ceramic coating 12 on the inner wall of the nail hole 11, a four-level buffer stud-roller structure of "stud part - buffer part - ceramic coating - roller sleeve structure" is constructed. Compared with Solution 1, the fatigue life of the matrix is extended by 1.5 - 2 times, and the service life of the roller sleeve is increased by 3 - 4 times compared with the traditional structure;

[0083] When spraying the ceramic coating on the inner wall of the nail hole 11, tungsten carbide, alumina, chromium carbide, etc. can be used;

[0084] When adding a buffer part 30 between the stud part 20 and the nail hole 11, metals, multi-layer composite materials can be used, with a hardness between HB80 - HB230, lower than the hardness of the roller sleeve matrix;

[0085] The coating thickness is controlled within 50 - 500 μm, and grinding is carried out after spraying to adjust the hole diameter to the design tolerance;

[0086] The nail hole 11 and the buffer part 30, the nail hole 11 and the stud part 20 can adopt interference fit, clearance fit, or transition fit;

[0087] Both the buffer part 30 and the stud part 20 are pressed into the nail hole by means of high-pressure press-fitting;

[0088] The outer diameter of the buffer member 30 is adapted to the outer diameter of the stud member 20 and is also adapted to the inner diameter of the stud hole 11. The height of the buffer member 30 is 3 mm - 15 mm.

[0089] The bottom shape of the buffer member 30 can adopt a flat bottom, a taper angle, a spherical shape, or a hemispherical shape, and the bottom of the stud hole 11 is adapted to the bottom structure of the buffer member 30;

[0090] The bottom shape of the stud member 20 can adopt a flat bottom, a taper angle, a spherical shape, or a hemispherical shape, and the head of the buffer member 30 is adapted to the bottom structure of the stud member 20;

[0091] Preparation process:

[0092] Preparation work: Inspect and clean the stud hole 11, the stud member 20, and the buffer member 30 to ensure that the surfaces are clean and free of impurities.

[0093] Spray the ceramic coating 12: Select a coating with high hardness, wear resistance, and strong bonding force with the metal matrix (such as tungsten carbide, alumina, chromium carbide, etc.), and use the plasma spraying or supersonic flame spraying process to evenly spray it on the inner wall of the stud hole. The coating thickness is controlled within 50 - 500 μm to ensure that the coating is dense and pore-free, with both high strength and impact resistance. Through natural curing, the coating forms a firm bond with the hole wall. After spraying, grinding is carried out to adjust the hole diameter to the design tolerance;

[0094] Grind the ceramic coating 12: Grind it back and forth uniformly along the axis of the stud hole 11 to reduce the surface roughness of the coating to Ra 0.8 - 1.6 μm, remove local protrusions or tumor-like defects, ensure that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer member 30, and avoid insufficient coating thickness caused by excessive grinding. Confirm that there is no residual grinding debris, blow the dust in the hole with compressed air, and finally wipe and clean it with a cleaner.

[0095] Install the buffer member 30: Apply retaining glue on the surface of the buffer member 30, and then press the buffer member 30 into the bottom of the stud hole by means of high-pressure press-fitting. The retaining glue can make the buffer member 30 tightly bond with the bottom of the stud hole 11, and at the same time play a role in buffering stress to a certain extent. High-pressure press-fitting can ensure that the buffer member 30 is firmly installed and can better adapt to the shape and size of the stud hole 11.

[0096] Install the stud member 20: Apply retaining glue on the surface of the stud member 20 as well, and then press the stud member 20 into the stud hole 11 by means of high-pressure press-fitting. At this time, the stud member 20 is in close contact with the buffer member 30, and the retaining glue fills the tiny gap between the stud member 20 and the stud hole 11, making the three form a whole.

[0097] Solution three: As Figure 5 and Figure 6 、 Figures 9 to 11As shown, in Solution One, a first annular groove 111 is provided on the inner wall at the root of the nail hole 11, and the depth of the first annular groove 111 is 0.5 - 3 mm.

[0098] A connecting head 21 is provided at the bottom of the stud member 20. The bottom of the connecting head 21 has an arc-shaped surface structure. The bottom size of the connecting head 21 is larger than the head size of the connecting head 21, and the taper of the connecting head 21 is 1:10 - 30.

[0099] A connecting groove 31 corresponding to the position of the connecting head 21 is provided at the head of the buffer member 30, and a wrapping portion is provided at the notch of the connecting groove 31.

[0100] Preparation process:

[0101] Preparation work: Machine the first annular groove 111 at the root of the nail hole 11, with the depth of the first annular groove 111 being 0.5 - 3 mm. Inspect and clean the nail hole 11, the stud member 20, and the buffer member 30 to ensure the surfaces are clean and free of impurities.

[0102] Install the buffer member 30: Apply retaining glue on the surface of the buffer member 30, and then press the buffer member 30 into the bottom of the nail hole 11 by means of high-pressure press-fitting. The retaining glue can make the buffer member 30 tightly combine with the bottom of the nail hole 11, and at the same time play a role in buffering stress to a certain extent. High-pressure press-fitting can ensure that the buffer member 30 is firmly installed and can better adapt to the shape and size of the nail hole 11.

[0103] Install the stud member 20: Apply retaining glue on the surface of the stud member 20 as well. Align the connecting head 21 and the connecting groove 31 axially, and then press the stud member 20 into the nail hole 11 by means of high-pressure press-fitting. When the connecting head 21 enters the connecting groove 31, it forces the buffer pad 30 to be embedded in the first annular groove 111. Subsequently, the end face of the stud member 20 squeezes the wrapping portion to wrap the wrapping portion outside the connecting head 21 to restrain the connecting head 21. The upward projection of the connecting head 21 can be square or circular, preventing the problem of the stud member 20 falling off after the retaining glue fails. The greater the plastic deformation of the buffer member 30, the better the anti-falling performance. At the same time, it increases the anti-rotation ability of the stud member 20 in an alternating stress environment, and it is not easy to fall off even when the retaining glue ages. At this time, the stud member 20 and the buffer member 30 are axially connected, and the retaining glue fills the small gap between the stud member 20 and the nail hole 11, making the three form a whole.

[0104] Solution Four: As Figure 7 and Figures 8 to 11 As shown, in Solution Two, a second annular groove 121 is provided on the inner wall at the root of the ceramic coating 12, and the depth of the second annular groove 121 is 25 - 250 μm.

[0105] A connecting head 21 is provided at the bottom of the stud 20. The bottom of the connecting head 21 is of an arc-shaped surface structure. The bottom size of the connecting head 21 is larger than the head size of the connecting head 21, and the taper of the connecting head 21 is 1:10 - 30;

[0106] A connecting groove 31 corresponding to the position of the connecting head 21 is provided at the head of the buffer member 30, and a wrapping portion is provided at the notch of the connecting groove 31.

[0107] Preparation process:

[0108] Preparation work: Inspect and clean the nail hole 11, the stud 20 and the buffer member 30 to ensure that the surface is clean and free of impurities.

[0109] Spray the ceramic coating 12: Select a coating with high hardness, wear resistance and strong bonding force with the metal matrix (such as tungsten carbide, alumina, chromium carbide, etc.), and use the plasma spraying or supersonic flame spraying process to evenly spray it on the inner wall of the stud hole. The coating thickness is controlled within 50 - 500 μmmm to ensure that the coating is dense and pore-free, with both high strength and impact resistance. Through natural curing, the coating forms a firm bond with the hole wall. After spraying, grinding is carried out to adjust the hole diameter to the design tolerance;

[0110] Machine the second annular groove 121: Machine the second annular groove 121 on the ceramic coating 12 at the root position of the nail hole 11, and the depth of the second annular groove 121 is 25 - 250 μm;

[0111] Polish the ceramic coating 12: Uniformly reciprocate along the axial direction of the nail hole 11 to reduce the surface roughness of the coating to Ra0.8 - 1.6 μm, remove local protrusions or tumor-like defects, ensure that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer member 30, and avoid insufficient coating thickness caused by excessive polishing. Confirm that there is no residual grinding debris, blow the dust in the hole with compressed air, and finally wipe and clean with a cleaner.

[0112] Install the buffer member 30: Apply a retaining adhesive on the surface of the buffer member 30, and then press the buffer member 30 into the bottom of the stud hole by means of high-pressure press-fitting. The retaining adhesive can make the buffer member 30 tightly bond with the bottom of the nail hole 11, and at the same time play a role in buffering stress to a certain extent. High-pressure press-fitting can ensure that the buffer member 30 is firmly installed and can better adapt to the shape and size of the nail hole 11.

[0113] Install the stud part 20: Apply retaining glue on the surface of the stud part 20 as well. Align the positions of the connecting head 21 and the connecting groove 31 axially, and then press the stud part 20 into the nail hole 11 by means of high-pressure press-fitting. When the connecting head 21 enters the connecting groove 31, it forces the buffer pad 30 to be embedded in the first annular groove 111. Subsequently, the end face of the stud part 20 squeezes the wrapping part to wrap the wrapping part around the outside of the connecting head 21 to restrain the connecting head 21. The upward projection of the connecting head 21 can be square or circular, which can prevent the problem of the stud part 20 falling off after the retaining glue fails. The greater the plastic deformation of the buffer part 30, the better the anti-falling performance. At the same time, it increases the anti-rotation ability of the stud part 20 in an alternating stress environment, and it is not easy to fall off even when the retaining glue ages. At this time, the stud part 20 is axially connected to the buffer part 30, and the retaining glue fills the tiny gap between the stud part 20 and the nail hole 11, making the three form a whole.

[0114] Solution Five: As Figures 12 to 17 shown, a multi-stage buffer stud roller structure includes:

[0115] A roller sleeve structure 10, on the surface of which nail holes 11 are evenly distributed;

[0116] A buffer part 30, which is fitted at the root of the nail hole 11;

[0117] A stud part 20, which is fitted in the nail hole 11 and its end is in close contact with the buffer part 12;

[0118] Retaining glue is filled between the buffer part 30, the stud part 20 and the nail hole 11.

[0119] As Figure 12 、 Figure 16 、 Figure 17As shown, the buffer member 30 includes, from the bottom to the head, an outward expansion portion 301, a deformation portion 302, and an extrusion portion 303. The cross-section of the deformation portion 302 is a wavy structure. The inner diameter at the position of the inner wave crest of the deformation portion 302 before deformation is equal to or slightly larger than the outer wall of the stud member 20, and the outer diameter at the position of the outer wave crest is equal to or slightly smaller than the inner diameter of the nail hole 11. The positions where the outward expansion portion 301, the extrusion portion 303, and the deformation portion 302 are connected are all connected by a tapered section. Moreover, the thicknesses of the outward expansion portion 301 and the extrusion portion 303 are both greater than the thickness of the deformation portion 302, approximately 1.5 - 3 times the thickness of the deformation portion 302. Annular grooves 202 are provided on the outer wall of the stud member 20 and the inner wall of the nail hole 11 corresponding to the deformation portion 302. An outer extrusion head 201 is provided at the bottom of the stud member 20. The outer extrusion head 201 is used to extrude the outward expansion portion 301 so that it expands outward into the third annular groove 13 of the roller sleeve structure 10. At the same time, the top surface of the outer extrusion head 201 is a slope that slopes downward at an angle of 1 - 3°. After the deformation portion 302 is deformed, it can wrap around the top surface of the outer extrusion head 201, and the adjacent two wave crests present a water-drop-shaped sandwich (filled with holding glue) buffer structure. The number of wave troughs of the annular groove 202 is at least equal to the number of corresponding wave crests of the deformation portion 302. Compared with the first solution, the fatigue life of the base body is extended by 3.5 - 4 times, the service life of the roller sleeve is increased by 5 - 6 times compared with the traditional structure, and the stud is not easily detached. During the period when the stud member 20 bears alternating stress, by using the plastic deformation of the buffer member 30, on the one hand, the stud member 20 can be wrapped more tightly (especially the outer extrusion head 201), improving the anti-detachment performance. On the other hand, the buffer performance of the side portion of the buffer member 30, especially the deformation portion 302 area, can be better released. While bearing the alternating stress, the stress will be dispersed from the stress-bearing point position to the surrounding of the buffer member 30, avoiding the problem of cracking caused by local stress concentration. The better the buffer performance is released, the better the wrapping property is, resulting in better anti-detachment performance.

[0120] As Figure 13 shown, a third annular groove 13 is provided at the root of the nail hole 11, and the depth of the third annular groove 13 is 0.5 - 3 mm.

[0121] Preparation process:

[0122] Preparation work: Inspect and clean the nail hole 11, the stud member 20, and the buffer member 30 to ensure that the surfaces are clean and free of impurities.

[0123] As Figure 17 shown, assemble the buffer member 30 and the stud member 20. Set the stud member 20 inside the buffer member 30 to obtain an assembly. Of course, holding glue can also be applied to the surface before the stud member 20 is inserted into the buffer member 20;

[0124] Installation assembly: Apply retaining glue on the surface of the buffer member 30, and then press the assembly into the bottom of the nail hole 11 axially along the nail hole 11 by means of high-pressure pressing. The end of the stud member 20 will first act on the outward expansion portion 301, so that the outward expansion portion 301 enters into the third annular groove 13, maintain the pressing force of the stud 20, and press on the extrusion portion 303. The deformation portion 302 is deformed by force, resulting in the peaks on the inner wall of the deformation portion shifting inward and the valleys shifting outward, and the peaks on the outer wall shifting outward and the valleys shifting inward. At the same time, the adjacent inner wall peaks and outer wall peaks approach each other, and the deformation portion 302 fills the corresponding annular groove 202 on the inner wall of the stud member 20 and the nail hole 11. The retaining glue can tightly bond the buffer member 30 to the bottom of the nail hole 11, and at the same time play a role in buffering stress to a certain extent. High-pressure pressing can ensure that the buffer member 30 is firmly installed and can better adapt to the shape and size of the nail hole 11, and use the retaining glue and the deformation portion 302 to form an integral whole of the three.

[0125] As described above, only the preferred specific embodiments of the present invention are provided, but the protection scope of the present invention is not limited thereto. The substitution may be a substitution of part of the structure, device, method step, or a complete technical solution. Any equivalent substitution or change made according to the technical solution of the present invention and its inventive concept should be covered within the protection scope of the present invention.

Claims

1. A multi-stage buffer column nail roller structure, characterized in that: include: Roller sleeve structure, the surface of the roller sleeve structure is evenly distributed with nail holes; A buffer piece, the buffer piece is matched at the root of the nail hole; A post nail piece, the post nail piece is fitted in the nail hole and the end of the post nail piece is in close contact with the buffer piece; The buffer, the column nail and the nail hole are filled with retaining glue.

2. A multi-stage buffer column spike roller structure according to claim 1, characterized in that: The buffer has a thickness of 3-15 mm and a hardness of HB80-HB230, which is lower than the hardness of the roller sleeve structure.

3. The multi-stage buffer column spike roller structure according to claim 1, characterized in that: The inner wall of the nail hole is provided with a ceramic coating, and the thickness of the ceramic coating is controlled to be 50-500 μm.

4. The multi-stage buffer column spike roller structure according to claim 1, characterized in that: The bottom shape of the buffer is a flat bottom, a cone, a spherical or a hemispherical structure, and the bottom of the nail hole is adapted to the bottom structure of the buffer; The bottom shape of the column nail piece is a flat bottom, a cone angle, a spherical shape, or a hemispherical structure, and the head of the buffer piece is adapted to the bottom structure of the column nail piece.

5. The multi-stage buffer column spike roller structure according to claim 2, characterized in that: A first annular groove is arranged on the inner wall of the root of the nail hole, and the depth of the first annular groove is 0.5-3mm.

6. The multi-stage buffer column spike roller structure according to claim 4, characterized in that: A second annular groove is arranged on the inner wall of the root of the ceramic coating, and the depth of the second annular groove is 25-250 μm.

7. A multi-stage buffer column spike roller structure according to claim 5 or 6, characterized in that: A connecting head is provided at the bottom of the column nail piece, the bottom of the connecting head is an arc-shaped surface structure, the bottom size of the connecting head is larger than the head size of the connecting head, and the taper of the connecting head is 1:10-30; The head of the buffer is provided with a connecting groove corresponding to the position of the connecting head.

8. A manufacturing process of the multi-stage buffer column spike roller structure as claimed in claim 2, characterized in that: Here are the steps: Step 1. Preparation Check and clean the nail holes, studs and buffers to ensure the surfaces are clean and free of impurities; Step 2: Install the buffer Apply retaining glue on the surface of the buffer, and then press the buffer into the bottom of the nail hole by high-pressure pressing; The retaining glue makes the buffer part tightly bonded to the bottom of the nail hole, and also plays a role in buffering stress to a certain extent; Step 3: Install the studs Apply retaining glue on the surface of the column nail, and then press the column nail into the nail hole by high-pressure pressing; At this time, the post nail piece and the buffer piece are in close contact, and the retaining glue fills the tiny gap between the post nail piece and the nail hole, so that the three form a whole.

9. A manufacturing process of the multi-stage buffer column spike roller structure as claimed in claim 3, characterized in that: Here are the steps: Step 1. Preparation Check and clean the nail holes, studs and buffers to ensure that the surface is clean and free of impurities. Step 2: Spray ceramic coating Select coating alloy powder with high hardness, wear resistance and strong bonding with metal matrix, and use plasma spraying or supersonic flame spraying process to evenly spray it on the inner wall of nail hole; The coating thickness is controlled at 50-500μm, ensuring that the coating is dense and free of pores, with both high strength and impact resistance; Through natural curing, the coating forms a strong bond with the hole wall; Grinding is performed after spraying to adjust the hole diameter to the design tolerance; Step 3: Polishing the ceramic coating Grind back and forth at a uniform speed along the axial direction of the nail hole to reduce the surface roughness of the coating to Ra0.8-1.6μm, remove local protrusions or tumor-like defects, ensure that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer, and avoid excessive grinding that leads to insufficient coating thickness; Make sure there is no residual grinding debris, blow away the dust in the hole with compressed air, and finally wipe it clean with a detergent; Step 4: Install the buffer Apply retaining glue on the surface of the buffer, and then press the buffer into the bottom of the nail hole by high-pressure pressing; The retaining glue makes the buffer part tightly bonded to the bottom of the nail hole, and also plays a role in buffering stress to a certain extent; Step 5: Install the studs Apply retaining glue on the surface of the column nail, and then press the column nail into the nail hole by high-pressure pressing; The column nail piece is in close contact with the buffer piece, and the retaining glue fills the tiny gap between the column nail and the nail hole, so that the three form a whole.

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