Chemical mechanical polishing equipment and wafer transmission method

Abstract

The invention relates to the technical field of semiconductor wafer processing, and provides chemical mechanical polishing equipment and a wafer transmission method, and the chemical mechanical polishing equipment comprises a polishing mechanism which comprises a bearing head; the loading and unloading mechanism comprises a driving assembly, a support and a loading and unloading assembly. The support comprises an L-shaped vertical frame, an L-shaped horizontal frame and a sliding block fixed to the vertical frame, and the loading and unloading assembly is arranged on the horizontal frame. The driving assembly is in sliding connection with the sliding block to drive the sliding block to move up and down so that the loading and unloading assembly can move between the low station and the high station. The transmission mechanism comprises a transmission base and a manipulator, and the manipulator comprises a mechanical arm and a clamping jaw used for clamping a wafer; the clamping jaw is configured to horizontally move above and align with the loading and unloading assembly at a height higher than that of the loading and unloading assembly when the loading and unloading assembly is in the low station; the loading and unloading assembly moves towards the clamping jaw to interact with the wafer after the clamping jaw moves in place, and moves upwards to a high station to interact with the bearing head after the clamping jaw avoids from the upper portion of the loading and unloading assembly.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor wafer processing, and in particular to a chemical mechanical polishing device and a wafer transmission method. Background Art

[0002] In existing CMP (Chemical Mechanical Polishing) equipment, the polishing head (or carrier head) places the polished wafer in the wafer loading and unloading cup, and then the transfer robot moves the wafer from the wafer loading and unloading cup to the transmission mechanism, or uses the reverse process to transfer the wafer from the transmission mechanism to the polishing head, thereby realizing the transfer of the wafer from the polishing head to the transmission mechanism.

[0003] In order to adapt to the rapid development of chip technology, advanced equipment is developing in the direction of increasing the number of polishing discs and polishing heads, while the equipment footprint is as small as possible, in order to achieve a significant improvement in wafer processing efficiency (WPH, Wafer Per Hour) and the optimal layout of equipment in the processing site. However, in the conventional transmission method mentioned above, the transfer manipulator, loading and unloading cup and transmission mechanism occupy the horizontal space respectively, which cannot meet the requirements of the most compact space layout, and the transmission process is lengthy, and the transmission accuracy and efficiency are low. Summary of the invention

[0004] The present application provides a chemical mechanical polishing device and a wafer transfer method to solve or alleviate at least some of the above-mentioned problems.

[0005] According to one aspect of the present application, a chemical mechanical polishing device is provided, comprising: A polishing mechanism, including a carrying head for carrying the wafer to the polishing plate for polishing; The loading and unloading mechanism comprises a driving assembly, a bracket and a loading and unloading assembly; the driving assembly is arranged at the side of the loading and unloading assembly; the bracket comprises an L-shaped vertical frame and a horizontal frame and a slider fixed to the vertical frame, and the loading and unloading assembly is arranged on the horizontal frame; the driving assembly is slidably connected with the slider to drive the slider to move up and down, so that the loading and unloading assembly moves between a low station and a high station; A transmission mechanism, comprising a transmission base disposed below the horizontal frame and a manipulator connected to the transmission base, wherein the manipulator comprises a mechanical arm and a clamping claw for clamping a wafer; The clamp is configured to move horizontally above the loading and unloading assembly and align with it when the loading and unloading assembly is in the low station; the loading and unloading assembly moves toward the clamp after the clamp moves into position to exchange wafers with the clamp, and moves upward to the high station to exchange wafers with the carrier head after the clamp moves away from above it.

[0006] Optionally, the loading and unloading assembly includes a bracket assembly and a loading and unloading cup disposed on the bracket assembly. The loading and unloading cup is used to carry a wafer to provide the wafer to the carrier head and receive the wafer unloaded from the carrier head. The bracket assembly includes a bracket plate, a plurality of support columns disposed on the bracket plate, and an elastic support member disposed between the bracket plate and the horizontal frame. The plurality of support columns are uniformly distributed in a circle concentric with the loading and unloading cup to support the loading and unloading cup, and the stiffness of the elastic support member is adjustable.

[0007] Optionally, the chemical mechanical polishing equipment includes a horizontal polishing platform, which divides the chemical mechanical polishing equipment into a polishing chamber located above and a transfer chamber located below; the polishing mechanism is located in the polishing chamber, the transfer mechanism is located in the transfer chamber, and the drive assembly and the bracket are located in the transfer chamber; the polishing platform is provided with an interaction port that penetrates the polishing chamber and the transfer chamber, and the loading and unloading assembly moves between a low position in the transfer chamber and a high position in the polishing chamber through the interaction port.

[0008] Optionally, the drive assembly includes a support frame and a driver. The support frame includes a cross plate installed on the lower surface of the polishing platform and a vertical plate vertically extending downward from one end of the cross plate facing the loading and unloading assembly. The driver includes an actuator installed on the side of the vertical plate facing the loading and unloading assembly, a motor provided on the other side of the vertical plate, and a transmission member that spans the vertical plate from the bottom to drive-connect the actuator and the motor. The motor, the vertical plate, and the actuator form a three-layer stacked structure to reduce the layout space; the actuator block of the actuator is fixedly connected to the slider, and the motor drives the actuator block to move up and down through the transmission member to drive the slider to move up and down.

[0009] Optionally, the actuator includes a lead screw extending vertically and the actuator block threadedly connected to the lead screw, and the motor drives the lead screw to rotate to make the actuator block move up and down along the lead screw.

[0010] Optionally, a low position detector and a high position detector are provided on the vertical plate at positions corresponding to the low position and the high position. A detection plate is provided on the actuator block, and the detection plate has a width t in the vertical direction; when the detection plate moves to the low position detector, the low position detector is triggered to determine that the loading and unloading assembly is within a threshold range near the low position to allow the gripper to move above the loading and unloading assembly; when the detection plate moves to the high position detector, the high position detector is triggered to determine that the loading and unloading assembly is within a threshold range near the high position to allow the gripper to move below the loading and unloading assembly; the threshold range is t.

[0011] Optionally, a nozzle is configured on the upper surface of the loading and unloading cup. The loading and unloading mechanism includes a liquid inlet pipe that is fluidly connected to the nozzle to supply liquid to the nozzle. The liquid inlet pipe is fixedly connected to the slider and moves up and down with the slider. At least a part of the liquid inlet pipe is configured in a spiral shape to expand and contract when moving up and down.

[0012] Optionally, the transfer base includes a slide rail. The manipulator is configured to be movable along the slide rail. The robotic arm includes a horizontal arm that horizontally extends from the slide rail beyond the loading and unloading assembly and a vertical arm that extends upward from the horizontal arm. The top of the vertical arm is connected to the jaw. When the jaw moves above the loading and unloading assembly, the horizontal arm, the vertical arm, and the jaw form a C shape that opens toward the loading and unloading assembly, and the loading and unloading assembly is located in the open space of the C shape.

[0013] Optionally, the horizontal arm is configured to be horizontally extendable and retractable, the vertical arm is configured to be vertically extendable and retractable, and the jaw is configured to be horizontally rotatable around the vertical arm.

[0014] Optionally, the chemical mechanical polishing equipment further includes a water receiving tray that is fixedly connected to the bracket and located below the horizontal frame. The projection of the water receiving tray onto the polishing platform covers the interaction port. The outer edge of the water receiving tray has a vertically upward flanging. When the loading and unloading assembly moves to the high working position, the water receiving tray moves to a position where the flanging is 2 mm - 5 mm away from the lower surface of the polishing platform, and the height of the water receiving tray is set to allow the manipulator to pass below it.

[0015] Optionally, the water receiving tray is provided with a drain port. A drain pipe that is extendable and retractable as the water receiving tray moves is connected below the drain port. The water receiving tray receives the liquid that enters the transfer chamber from the polishing chamber through the interaction port and discharges the liquid through the drain pipe.

[0016] Optionally, the lower end of the drain pipe is connected to a suction water source and a water supply source. When the water receiving tray moves to the high working position with the loading and unloading assembly, the suction water source is activated to suck the liquid in the water receiving tray. When the water receiving tray moves to the low working position with the loading and unloading assembly, the suction water source stops, and the water supply source is activated to supply a moisturizing liquid to the water receiving tray. The supply amount of the moisturizing liquid is such that a liquid film with a thickness of 0.5 mm to 1 mm is formed on the surface of the water receiving tray to moisturize the water receiving tray and adsorb pollutants.

[0017] Optionally, a hydrophobic coating is provided on the inner surface of the water receiving tray to cause the received liquid to roll down into the drain pipe and prevent back-splash; or a hydrophilic coating is provided on the inner surface of the water receiving tray, and the hydrophilic coating is configured to cause the liquid droplets dripping onto it to spread into a liquid film to disperse and absorb the kinetic energy of the liquid droplets and prevent back-splash.

[0018] Optionally, a receiving portion adapted to the shape of the horizontal frame is formed at the edge of the interaction port on the lower surface of the polishing platform. The receiving portion is recessed upward so that when the bracket moves upward, it can be received in the receiving portion. The edge of the receiving portion close to the interaction port is higher than the opposite edge. The receiving portion has a first lower blocking edge extending downward along the edge of the interaction port. The upper surface of the horizontal frame has an upper blocking edge extending upward. The upper blocking edge is provided outside the first lower blocking edge so that the two form an interleaved structure to prevent the liquid from flowing out of the water receiving tray through the upper surface of the horizontal frame.

[0019] Optionally, two side blocking edges are provided on both sides of the upper blocking edge, which abut against the side surface of the horizontal frame and extend vertically to the water receiving tray to guide the liquid to flow into the water receiving tray.

[0020] Optionally, the slider is configured to have a "concave" horizontal cross-section, and one side of the driving assembly facing the slider is surrounded in the concave opening of the slider; the slider is configured with a C-shaped gap that is consistent with the shape of its "concave" cross-section and penetrates it in the vertical direction; the chemical mechanical polishing equipment further includes a waterproof assembly extending vertically for protecting the driving assembly. The waterproof assembly includes a first waterproof plate that matches the shape of the C-shaped gap, and a second waterproof plate and a third waterproof plate that respectively surround the two side portions of the slider. The first waterproof plate vertically passes through the C-shaped gap; the first waterproof plate, the second waterproof plate and the third waterproof plate are connected to the driving assembly via an adapter plate at the top to keep the gap between the first waterproof plate, the second waterproof plate, the third waterproof plate and the slider constant when the slider slides up and down.

[0021] According to another aspect of the present application, a wafer transfer method is provided for the chemical mechanical polishing equipment as described in the foregoing aspect. The method includes the following steps: Move the loading and unloading mechanism downward to the low working position; Move the manipulator to the loading and unloading mechanism, and horizontally move the gripper above the loading and unloading assembly so that the wafer held by the gripper is centered with the loading and unloading cup of the loading and unloading assembly; Move the loading and unloading assembly upward to the gripper, and the gripper releases the wafer into the loading and unloading cup; Move the loading and unloading assembly downward to the low working position; Move the gripper to avoid it from above the loading and unloading assembly; Move the loading and unloading component upward to the high working position; Interact the carrier head of the polishing mechanism with the loading and unloading cup to pick up the wafer from the loading and unloading cup.

[0022] Optionally, when the loading and unloading mechanism is in the high working position, the manipulator can move along the track of the transfer mechanism and pass under the loading and unloading component to transfer the wafer to other mechanisms.

[0023] According to the chemical mechanical polishing equipment and wafer transfer method of the present application, the large-stroke movement of the loading and unloading component between the vertically arranged polishing chamber and transfer chamber endows it with the function of wafer handling, eliminating the need for an additional transfer manipulator, reducing the number of wafer interactions, shortening the wafer transfer path, and significantly improving the accuracy and transfer efficiency of wafer transfer; the side-mounted arrangement of the cantilever bracket and the drive component can make full use of the space under the loading and unloading component, enabling the loading and unloading mechanism and the transfer mechanism to share an area in the chemical mechanical polishing equipment. When interacting, they are vertically overlapped to make full use of the vertically arranged space, which is conducive to saving the floor area of the chemical mechanical polishing equipment, optimizing the equipment layout structure, facilitating the arrangement of other modules, and conducive to the efficient operation of the chemical mechanical polishing equipment, thereby improving the processing efficiency of the wafer. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a partial schematic diagram of a chemical mechanical polishing equipment according to an embodiment of the present application, which shows the loading and unloading mechanism and the transfer mechanism of the chemical mechanical polishing equipment; Figure 2 Shows Figure 1 A schematic diagram of another angle and state of the loading and unloading mechanism and the transfer mechanism in Figure 3 Shows Figure 1 A side view of the loading and unloading mechanism and the transfer mechanism in Figure 4 Shows Figure 1 A three-dimensional schematic diagram of the loading and unloading mechanism in Figure 5 Shows a schematic diagram of a chemical mechanical polishing equipment according to an embodiment of the present application; Figure 6 Shows a flowchart of a wafer transfer method according to an embodiment of the present application; Figure 7 Partial schematic view of a chemical mechanical polishing apparatus according to another embodiment of the present application; Figure 8 Shows Figure 7 Schematic view of another angle and state of the chemical mechanical polishing apparatus; Figure 9 Shows Figure 7 Schematic view of the loading and unloading mechanism in; Figure 10 Shows Figure 9 Enlarged schematic view of the water receiving tray in; Figure 11 Shows Figure 10 Top view of the water receiving tray in; Figure 12 Shows Figure 7 Bottom view of the polishing platform in; Figure 13 Is Figure 7 Vertical cross-sectional view of the chemical mechanical polishing apparatus in; Figure 14 Is Figure 13 Enlarged view of location A in; Figure 15 Shows Figure 7 Three-dimensional view of the slider in; Figure 16 Shows Figure 7 Three-dimensional view of the slider and the waterproof assembly in; Figure 17 Shows Figure 16 Horizontal cross-sectional view of the slider and the waterproof assembly in.

[0026] Reference numerals: Loading and unloading mechanism 100; driving assembly 110; support frame 111; cross plate 111a; vertical plate 111b; driver 112; actuator 112a; motor 112b; transmission member 112c; low-level detector 113a; high-level detector 113b; bracket 120; vertical frame 121; horizontal frame 122; upper retaining edge 122a; side retaining edge 122b; slider 123; bump 1231; C-shaped gap 1232; loading and unloading assembly 101; bracket assembly 130; bracket plate 131; support column 132; elastic support member 133; loading and unloading cup 140; nozzle 141; liquid inlet pipe 142; water receiving tray 150; drain port 151; drain pipe 152; vertical connecting plate 153; first waterproof plate 161; second waterproof plate 162; third waterproof plate 163; fourth waterproof plate 164; fifth waterproof plate 165; adapter plate 166; Transfer mechanism 200; manipulator 210; robotic arm 211; horizontal arm 211a; vertical arm 211b; gripper 212; slide rail 220; Polishing mechanism 300; polishing platform 310; interaction port 311; accommodation part 312; first lower blocking edge 310a; second lower blocking edge 310b; carrier head 320; polishing disc 330. Detailed implementation manners

[0027] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art shall fall within the scope of protection of the embodiments of the present application.

[0028] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0029] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the communication inside two elements. It can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0030] Figure 1 The schematic diagram of the loading and unloading mechanism 100 and the transmission mechanism 200 in an implementation manner of the present application is shown, where the loading and unloading component 101 is in the low working position. Figure 2 Shown Figure 1 Another perspective and state schematic diagram of the loading and unloading mechanism 100 and the transmission mechanism 200 in [reference] is shown, where the loading and unloading component 101 is in the high working position. The loading and unloading mechanism 100 and the transmission mechanism 200 can be arranged in a chemical mechanical polishing device. Figure 3 Shown Figure 1 The side view of the loading and unloading mechanism 100 and the transmission mechanism 200 in [reference] is shown, where the loading and unloading component 101 in the low working position is shown by a dashed line. As Figures 1 to 3The figure also shows a polishing platform 310 of the chemical mechanical polishing device and a polishing mechanism 300 including a carrier head 320. The polishing platform 310 divides the interior of the chemical mechanical polishing device into two upper and lower chambers, the upper part is a polishing chamber, and the lower part is a transmission chamber. The polishing platform 310 is provided with an interactive port 311 that connects the polishing chamber and the transmission chamber. A polishing mechanism can be set in the polishing chamber, and the polishing mechanism includes a polishing plate 330 (see Figure 5 ) and a carrier head 320, the carrier head 320 is used to absorb the wafer and move the wafer to the polishing plate 330 for chemical mechanical polishing.

[0031] The loading and unloading mechanism 100 includes a driving assembly 110, a bracket 120 and a loading and unloading assembly 101. The loading and unloading assembly 101 mainly includes a bracket assembly 130 and a loading and unloading cup 140 disposed on the bracket assembly 130. The loading and unloading cup 140 is used to carry wafers to provide wafers to the carrier head 320 and receive wafers unloaded from the carrier head 320. The loading and unloading cup 140 is concentrically disposed with the interaction port 311. Figure 1 , the driving assembly 110 is arranged on the side of the loading and unloading assembly 101, specifically, it is arranged below the side of the interaction port 311. The bracket 120 includes a vertical frame 121 and a horizontal frame 122. The vertical frame 121 is arranged close to the driving assembly, and the horizontal frame extends horizontally from the top of the vertical frame 121 away from the driving assembly 110. The vertical frame 121 and the horizontal frame 122 form an L-shaped cantilever structure, and the loading and unloading assembly 101 is arranged on the horizontal frame 122. The bracket 120 also includes a slider 123 fixed to the side of the vertical frame 121 facing the driving assembly 110. The slider 123 is slidably connected to the driving assembly 110, and the driving assembly 110 drives the slider 123 to move up and down, so that the bracket 120 moves up and down, thereby driving the loading and unloading assembly 101 to move between the low station and the high station through the interaction port 311.

[0032] The offset setting of the driving assembly 110 creates a layout space below the loading and unloading assembly 101, so that the transmission mechanism 200 can be set below the loading and unloading assembly 101, and does not have to be set to the side of the loading and unloading assembly 101 to occupy equipment space and increase the equipment floor area. Specifically, the transmission mechanism 200 includes a transmission base set below the horizontal frame 122 and a robot 210 connected to the transmission base. The robot 210 can specifically include a robot arm 211 and a clamp 212 for clamping a wafer. The clamp 212 is configured to move horizontally to the top of the loading and unloading assembly 101 at a height higher than the loading and unloading assembly 101 and align with it when the loading and unloading assembly 101 is in a low position (such as Figure 1 ); the handling assembly 101 moves toward the clamp 212 after the clamp 212 moves into position to interact with the clamp 212 wafer, and then moves upward to the high station after the clamp 212 avoids from above it to interact with the carrier head 320 wafer (such as Figure 2)(so as to transfer the wafer from the transfer mechanism 200 to the carrier head 320 for polishing, and after the polishing is completed, transfer the wafer from the carrier head 320 to the transfer mechanism through the reverse operation process. "Moving into place" may refer to moving above and aligning with the loading and unloading component 101. Specifically, in the case where the jaw 212 transfers the wafer to the loading and unloading cup 140, the jaw 212 carries the wafer and moves above the loading and unloading cup 140, and the center of the wafer is aligned with the center of the loading and unloading cup 140. Or in the case where the jaw 212 picks up the wafer from the loading and unloading cup 140, the jaw 212 moves above the loading and unloading cup 140, and the clamping space of the jaw 212 is aligned with the center of the loading and unloading cup 140.)

[0033] According to the technical solution of the present application, the large-stroke movement of the loading and unloading component 101 between the vertically arranged polishing chamber and transfer chamber endows it with the function of wafer handling, eliminating the need for an additional transfer manipulator, reducing the number of wafer interactions and shortening the wafer transfer path, significantly improving the accuracy and transfer efficiency of wafer transfer; the side-mounted setting of the cantilever bracket 120 and the drive component 110 can make full use of the space below the loading and unloading component 101, enabling the loading and unloading mechanism 100 and the transfer mechanism 200 to share an area in the chemical mechanical polishing equipment. When interacting, they are vertically overlapped to make full use of the vertically arranged space, which is beneficial to saving the floor area of the chemical mechanical polishing equipment, optimizing the equipment layout structure, facilitating the arrangement of other modules, and being beneficial to the efficient operation of the chemical mechanical polishing equipment, thereby improving the processing efficiency of the wafer.)

[0034] In a specific embodiment, also as Figure 1 , the bracket assembly 130 includes a bracket plate 131 and a plurality of support columns 132 arranged on the bracket plate 131. The plurality of support columns 132 are evenly distributed in a circle concentric with the loading and unloading cup 140 to support the loading and unloading cup 140. For example Figure 1The bracket plate 131 therein is arranged to be generally equilateral triangle-shaped, and three support columns 132 are arranged at three corners of the equilateral triangle. The bracket plate 131 and the loading and unloading cup 140 are coaxially arranged below the loading and unloading cup 140 to provide stable support for the loading and unloading cup 140 and ensure the stability when the loading and unloading cup 140 interacts with the manipulator 210 or the carrier head 320 for wafers. The bracket assembly 130 may further include an elastic support member 133 arranged between the bracket plate 131 and the horizontal frame 122. The stiffness of the elastic support member 133 is adjustable to provide buffer support for the loading and unloading cup 140 and ensure the stability and accuracy requirements when the loading and unloading cup 140 interacts with the transfer mechanism 200 and the carrier head 320 for wafers respectively. For example, the elastic support member 133 may include an inflatable annular airbag, which is coaxially arranged between the bracket plate 131 and the horizontal frame 122 of the bracket 120 with respect to the loading and unloading cup 140. The annular airbag always remains in contact with the bracket plate 131 and the horizontal frame 122 to adjust the rigidity of the annular airbag by inflating and deflating, so as to meet different requirements when the loading and unloading cup 140 interacts with the manipulator 210 of the transfer mechanism 200 and the carrier head 320. Specifically, when the loading and unloading cup 140 interacts with the manipulator 210 at a low station, the annular airbag is inflated and pressurized to bulge, and its rigidity is enhanced, which can improve the horizontal accuracy of the loading and unloading cup 140, ensure the stability of the horizontal pose of the loading and unloading cup 140, facilitate the manipulator 210 to pick and place wafers, and avoid jitter and skew during the interaction process; when the loading and unloading cup 140 interacts with the carrier head 320 at a high station, the coaxial accuracy requirement for the loading and unloading cup 140 and the carrier head 320 is high. Otherwise, when the carrier head 320 adsorbs the wafer by the air film in the middle thereof, the eccentric wafer is easily broken by the hard retaining ring around the air film, and the carrier head 320 presses against the loading and unloading cup 140 with its weight. If the support structure below the loading and unloading cup 140 still has a high stiffness, it is easy to be pressed and damaged by the carrier head 320 or crush the wafer. Therefore, in this interaction case, the annular airbag exhausts and decompresses, and its flexibility is improved, so as to form buffer support for the loading and unloading assembly 101 and enhance the adaptability to interact with the carrier head. After the interaction with the carrier head 320 ends, the annular airbag can be inflated again to make the loading and unloading cup 140 return to horizontal again.

[0035] In an alternative embodiment, as Figure 1 and Figure 2 shown, the transfer base of the transfer mechanism 200 includes a slide rail 220. In as Figure 5In the chemical mechanical polishing equipment shown with two or more juxtaposed loading and unloading mechanisms 100 and two or more carrier heads 320, the slide rail 220 can extend between the juxtaposed loading and unloading mechanisms 100 and can also extend to other transfer manipulators of the chemical mechanical polishing equipment to transfer wafers between two or more loading and unloading mechanisms 100 and other transfer manipulators. When the current loading and unloading component 101 is at the high position, the manipulator 210 of the transfer mechanism 200 can pass under the current loading and unloading component 101 along the slide rail 220 for wafer transfer. Thus, multiple loading and unloading components 101 and their corresponding carrier heads 320 can perform wafer handling and polishing in parallel, improving the processing efficiency of the chemical mechanical polishing equipment. The manipulator 210 of the transfer mechanism 200 is configured to be movable along the slide rail 220. The robotic arm 211 includes a horizontal arm 211a that horizontally extends from the slide rail 220 beyond the loading and unloading component 101 and a vertical arm 211b that extends upward from the horizontal arm 211a. The top of the vertical arm 211b is connected to a jaw 212. When the jaw 212 moves above the loading and unloading component 101, the horizontal arm 211a, the vertical arm 211b, and the jaw 212 form a C shape opening towards the loading and unloading component 101, and the loading and unloading component 101 is in the opening space of the C shape, realizing the overlap of the loading and unloading component 101 and the manipulator 210 in the vertical direction. The horizontal arm 211a can be configured to be horizontally telescopic, the vertical arm 211b can be configured to be vertically telescopic, and the jaw 212 can be configured to horizontally rotate in the horizontal plane around the vertical arm 211b to realize multiple degrees of freedom of the manipulator 210 to adapt to the interaction positions with multiple loading and unloading mechanisms 100 or other transfer manipulators. Additionally, in Figure 1 and Figure 2 In the shown embodiment, the horizontal arm 211a, the vertical arm 211b, and the jaw 212 relatively fixedly form a C shape opening towards the loading and unloading component 101 and only slide along the slide rail 220, thereby simplifying the design, manufacturing, and control complexity of the manipulator 210. It should be understood that the C shape referred to herein includes a [ shape similar to a bracket shape with straight edges and a bent part.

[0036] Figure 4 shows Figure 1 a schematic diagram of the loading and unloading component 101 in Figure 3As can be seen, the driving assembly 110 includes a support frame 111 and a driver 112. The support frame 111 includes a horizontal plate 111a mounted on the lower surface of the polishing platform 310 and a vertical plate 111b vertically extending downward from one end of the horizontal plate 111a facing the loading and unloading assembly 101. The driver 112 includes an actuator 112a mounted on one side of the vertical plate 111b facing the loading and unloading assembly 101, a motor 112b provided on the other side of the vertical plate 111b, and a transmission member 112c that crosses the vertical plate 111b from the bottom to drive and connect the actuator 112a and the motor 112b. In the figure, the motor 112b, the actuator 112a, and the transmission member 112c are respectively encapsulated in their respective housings. Thus, the motor 112b, the vertical plate 111b, and the actuator 112a form a three-layer stacked structure to reduce the layout space. An actuator block (not shown) of the actuator 112a is fixedly connected to the slider 123. The motor 112b drives the actuator block to move up and down via the transmission member 112c to drive the slider 123 to move up and down, thereby driving the bracket 120 and the loading and unloading assembly 101 to move up and down. In a specific embodiment, the actuator 112a may include a vertically extending lead screw and an actuator block threadedly connected to the lead screw. The motor 112b drives the lead screw to rotate to make the actuator block move up and down along the lead screw. In an alternative embodiment, the transmission member 112c may be a plurality of meshing gears or a timing belt sleeved on the output shaft of the motor 112b and the actuator 112a.

[0037] See Figure 3, a low position detector 113a and a high position detector 113b are provided on the vertical plate 111b at positions corresponding to the low position and the high position, and a detection plate is provided on the actuating block, and the detection plate has a width t in the vertical direction. When the detection plate moves to the low position detector 113a, the low position detector 113a is triggered to determine that the loading and unloading assembly 101 is within a threshold range near the low position, so as to allow the clamping jaw 212 to move above the loading and unloading assembly 101; when the detection plate moves to the high position detector 113b, the high position detector 113b is triggered to determine that the loading and unloading assembly 101 is within a threshold range near the high position, so as to allow the clamping jaw 212 to move below the loading and unloading assembly 101; the threshold range is t. Thus, by setting the low position detector 113a, the high position detector 113b and the detection plate, the upper and lower positions of the loading and unloading assembly 101 can be indicated, providing accurate guidance for the movement of the transmission mechanism 200, effectively avoiding the movement interference between the loading and unloading assembly 101 and the transmission mechanism 200, and improving the smoothness and safety of the equipment operation. The width of the detection plate is set so that when the loading and unloading assembly 101 is within the threshold range near the low position or the high position, the manipulator 210 can be allowed to move the claws above the loading and unloading assembly 101 for wafer exchange, or the manipulator 210 can be allowed to move below the loading and unloading assembly 101 to transfer and exchange wafers between the manipulator 210 and other loading and unloading assemblies 101 or other transmission mechanisms 200, so that the movement of the manipulator 210 can be executed after the loading and unloading assembly 101 has made room for the manipulator 210 to move, without having to wait until the loading and unloading assembly 101 is at the low position or the high position, thereby improving the operation efficiency of the equipment.

[0038] Depend on Figure 4 It can also be seen that the upper surface of the loading and unloading cup 140 is configured with a nozzle 141, and the loading and unloading mechanism 100 includes a liquid inlet pipe 142, which is fluidically connected to the nozzle 141 to provide liquid to the nozzle 141, so as to be used for rinsing the carrier head 320 or the wafer to keep the carrier head 320 or the wafer clean, or to moisturize the carrier head 320 or the wafer to prevent the polishing liquid containing chemical components on the two from drying and crystallizing, thereby scratching the wafer. The liquid inlet pipe 142 is fixedly connected to the slider 123 to move up and down with the slider 123, so as to remain relatively fixed with the loading and unloading cup 140. For this purpose, the liquid inlet pipe 142 is at least partially configured in a spiral shape to be retracted when moving up and down.

[0039] Figure 6 A flow chart of a wafer transfer method according to an embodiment of the present application is shown, the method is used in the aforementioned chemical mechanical polishing equipment, and the method comprises the following steps: S1: Move the loading and unloading mechanism 100 downward to a low position; S2: Move the manipulator 210 to the loading and unloading mechanism 100, and horizontally move the jaw 212 above the loading and unloading component 101 so that the wafer held by the jaw 212 is centered with the loading and unloading cup 140 of the loading and unloading component 101; S3: Move the loading and unloading component 101 upward to the jaw 212, and the jaw 212 releases the wafer into the loading and unloading cup 140; S4: Move the loading and unloading component 101 downward to the low station; S5: Move the jaw 212 to avoid it from above the loading and unloading component 101; S6: Move the loading and unloading component 101 upward to the high station; S7: Interact the carrier head 320 of the polishing mechanism 300 with the loading and unloading cup 140 to pick up the wafer from the loading and unloading cup 140.

[0040] Further, a judgment step of judging whether the low position detector 113a is triggered may be included between step S1 and step S2. If so, execute step S2; if not, do not execute the moving action of the manipulator 210. A judgment step of judging whether the low position detector 113a is triggered may also be included between step S4 and step S5. If so, execute step S5; if not, do not execute the moving action of the manipulator 210. A judgment step of judging whether the high position detector 113b is triggered may be included between step S6 and step S7. If so, execute step S7, and the manipulator 210 moves to any position below the loading and unloading component 101 for wafer transfer; if not, prohibit the manipulator 210 from moving to the loading and unloading mechanism 100. In addition, steps S1 - S7 describe the steps of transporting the wafer from the transfer mechanism 200 to the polishing mechanism 300. The wafer transfer method of the present application may further include steps opposite thereto for transporting the polished wafer from the polishing mechanism 300 to the transfer mechanism 200.

[0041] The present application also provides a wafer processing method for the foregoing chemical mechanical polishing equipment. The wafer processing method includes a wafer transfer step that uses the foregoing wafer transfer method for wafer transfer, and further includes a wafer processing step. The wafer processing step includes moving the wafer loaded from the loading and unloading cup 140 by the carrier head 320 to the polishing platen 330 for polishing.

[0042] According to the chemical mechanical polishing equipment, wafer transmission method and wafer processing method of the present application, the polishing mechanism is located in the upper polishing chamber, and the transmission mechanism 200 is located in the lower transmission chamber. The transmission mechanism 200 and the loading and unloading mechanism 100 are arranged so that the manipulator 210 and the loading and unloading assembly 101 are vertically overlapped when the wafer interacts, rather than horizontally interacting, which can greatly compress the horizontal footprint of the chemical mechanical polishing equipment, optimize the spatial layout of the equipment, improve the overall processing efficiency of the equipment, and thus improve the market competitiveness of the equipment. In addition, the cantilever bracket 120 of the loading and unloading mechanism 100 is arranged to realize an unobstructed space below the loading and unloading assembly 101, so that when the loading and unloading assembly 101 interacts with the carrier head 320 in the polishing chamber, it can not affect the transmission movement below the manipulator 210, thereby improving the transmission efficiency of the whole machine. In addition, the loading and unloading assembly 101 can directly transfer the wafer up and down between the carrier head 320 of the polishing chamber and the manipulator 210 of the transmission chamber through a large stroke up and down movement, reducing the setting of an additional transfer manipulator between the two, and significantly improving the wafer transfer efficiency.

[0043] In the chemical mechanical polishing equipment, the function of the loading and unloading cup 140 is to interact with the carrier head 320 to pick and place wafers, interact with the transmission mechanism 200 to pick and place wafers, and rinse and / or moisturize the wafers and the carrier head 320. When working inside the polishing chamber, a large amount of liquid will be sprayed, such as the polishing liquid used for chemical mechanical polishing. The loading and unloading component 101 will also spray a large amount of moisturizing liquid to rinse or moisturize the wafer or the carrier head 320 when it is at a high position. These liquids in the polishing chamber will flow to the transmission chamber through the interaction port 311 on the polishing platform 310, causing the robot 210 of the transmission mechanism 200 to be contaminated by the dripping liquid when carrying the wafer under the interaction port 311, reducing the yield rate of wafer processing, and also causing the drive component 110 of the loading and unloading mechanism 100 to be damaged by water, affecting the operation of the equipment.

[0044] To solve at least one of the above problems, in a further embodiment of the present application, Figures 7 - 9 As shown, a water receiving tray 150 is provided below the loading and unloading assembly 101. The water receiving tray 150 moves up and down with the loading and unloading assembly 101, and the water receiving tray 150 is always in the transmission chamber. Figure 7 When the loading and unloading assembly 101 moves to the high position, the water receiving tray 150 is close to the lower surface of the polishing platform 310, and the projection of the water receiving tray 150 to the polishing platform 310 covers the interaction port 311 to receive the liquid flowing into the transmission chamber from the interaction port 311. Figure 10 , Figure 11An enlarged view of the water receiving tray 150 and a top view of the water receiving tray 150 are shown. The water receiving tray 150 is fixed to the horizontal frame 122 of the bracket 120 via the vertical connecting plates 153 on both sides of the horizontal frame 122 and is located below the horizontal frame 122. The outer edge of the water receiving tray 150 has a vertically upward flanging. When the loading and unloading assembly 101 moves to the high position, the water receiving tray 150 moves to a position where the distance between the flanging and the lower surface of the polishing platform 310 is 2 mm - 5 mm. The setting of the flanging can effectively intercept the splashing of liquid in all directions. And the height of the water receiving tray 150 is set to allow the manipulator 210 to pass under it when the loading and unloading assembly 101 moves to the high position, that is, the bottom surface of the water receiving tray 150 is higher than the height of the manipulator 210. As Figure 11 , the water receiving tray 150 is provided with a drain port 151, and a drain pipe 152 that can be telescopic along with the movement of the water receiving tray 150 is connected below the drain port 151 ( Figures 7 - 9 ). The drain pipe 152 can be two sleeved pipe segments, the thin pipe above is sleeved into the thick pipe below, the thick pipe can be fixed, and the thin pipe can be telescopic in the thick pipe. The water receiving tray 150 receives the liquid entering the transfer chamber from the polishing chamber through the interaction port 311 and discharges the liquid through the drain pipe 152. The water receiving tray 150 has a shape of a semi-track formed by combining a rectangle and a semicircle. The semicircular part of the water receiving tray 150 is centered with the interaction port 311 and the loading and unloading cup 140 and the radius is greater than the radius of the interaction port 311. The rectangular part of the water receiving tray 150 is arranged on the side of the water receiving tray 150 close to the slider 123, so that the edge of the rectangular part can abut against the slider 123 and the driving assembly 110 for water receiving and protection. By setting the water receiving tray 150, a large amount of liquid can be prevented from falling on the wafers carried by the lower transfer mechanism 200, the wafers can be prevented from being contaminated, and the cleanliness of the wafers can be ensured.

[0045] In a preferred embodiment, the lower end of the drain pipe 152 may be connected to a suction source and a water supply source. When the water receiving tray 150 moves to the high position along with the loading and unloading assembly 101, the suction source is activated to suck the liquid in the water receiving tray 150, thereby promoting the rapid drainage of the liquid splashed from the polishing chamber to the transfer chamber received by the water receiving tray 150, and avoiding overflow or back-splash. Additionally, since the liquid received in the water receiving tray 150 contains the polishing liquid in the polishing chamber, which contains chemical components and a small amount of polishing debris, etc., therefore, if the liquid in the water receiving tray 150 is drained completely, when the remaining small amount of liquid dries, crystallization or solidification of pollutants may occur. For this reason, when the water receiving tray 150 moves to the low position along with the loading and unloading assembly 101, the suction source stops, and the water supply source is activated to supply liquid to the water receiving tray 150, such as a moisturizing liquid. The supply amount of the moisturizing liquid is such that a liquid film with a thickness of 0.5 mm to 1 mm is formed on the surface of the water receiving tray 150 to moisturize the water receiving tray 150, prevent crystallization from occurring after the undrained liquid in the water receiving tray 150 dries, and adsorb pollutants through the liquid film, so that the pollutants can be drained away with the liquid when the suction source is activated next time, preventing secondary pollution of the wafer. Additionally, since the liquid film on the water receiving tray can also dissipate static electricity, reduce the accumulation of static charges on the water receiving tray, and prevent arc damage to the wafer.

[0046] In an alternative embodiment, a hydrophobic coating may be provided on the inner surface of the water receiving tray 150 to promote the rapid rolling of the received liquid onto the drain pipe 152 and prevent back-splash. Alternatively, a hydrophilic coating may be provided on the inner surface of the water receiving tray 150. The hydrophilic coating is configured such that the spreading speed of the edge of the liquid droplet dripping onto it is much greater than the retraction speed, so that the liquid droplet quickly spreads into a liquid film to disperse and absorb the kinetic energy of the liquid droplet, thereby preventing back-splash. In addition, the continuous liquid film formed by the spreading of the liquid droplet can also carry away the pollutants on the surface of the water receiving tray 150. In a further preferred embodiment, the hydrophilic coating may be configured with a nano-scale or sub-nano-scale micro-flow guiding structure that extends towards the drain opening 151 to guide the liquid towards the drain opening 151. The micro-flow guiding structure can also accelerate the penetration and diffusion of the liquid droplet, playing a role in reducing liquid splash.

[0047] Further, as Figure 12 shows the bottom view of the polishing platform 310. It can be seen that a receiving portion 312 adapted to the shape of the horizontal frame 122 is formed at the edge of the interaction port 311 on the lower surface of the polishing platform 310. The receiving portion 312 is recessed upward so that the bracket 120 can be received in the receiving portion 312 when it moves upward. Thereby, the stroke of the up and down movement of the loading and unloading assembly 101 can be increased, and the distance between the bracket 120 and the loading and unloading cup 140 can be designed to be smaller (i.e., the vertical dimension of the bracket assembly 130 is designed to be smaller), so that the loading and unloading cup 140 can have a height for interacting with the carrier head 320 at the high position, which can increase the structural stability of the loading and unloading assembly 101. On this basis, combined withFigure 13 The cross-sectional view shown and Figure 14 the Figure 13 enlarged view at A in Figure 10 and Figure 11 , the accommodating portion 312 has a first lower blocking edge 310a extending downward along the edge of the interaction port 311. Correspondingly, as shown in Figure 14 and Figure 10 , the upper surface of the horizontal frame 122 has an upper blocking edge 122a extending upward. Since the interaction port 311 is circular, the first lower blocking edge 310a is arc-shaped, and the upper blocking edge 122a is also an arc-shaped dimensionally adapted thereto. As shown in

[0048] , the upper blocking edge 122a is provided on the radially outer side of the first lower blocking edge 310a so that the two form an interleaved structure. The liquid flowing from the interaction port 311 to the transfer chamber can be blocked by the first lower blocking edge 310a at the first lower blocking edge 310a and flow downward along the first lower blocking edge 310a. The liquid falling on the upper surface of the horizontal frame 122 or the liquid splashing outward from below the first lower blocking edge 310a can be further blocked by the upper blocking edge 122a, thereby preventing the liquid from flowing out of the water receiving tray 150 through the upper surface of the horizontal frame 122 and dripping to contaminate the wafer on the lower transfer mechanism 200. More preferably, as shown in Figure 15 , both sides of the upper blocking edge 122a may further have two side blocking edges 122b that abut against the side surface of the horizontal frame 122 and extend vertically to the water receiving tray 150 to prevent the liquid from flowing to the side surface of the horizontal frame 122 from both sides of the upper blocking edge 122a and dripping, and guiding the liquid to flow to the water receiving tray 150. Figure 16 、 Figure 17 , the waterproof component includes a C-shaped first waterproof plate 161 that matches the shape of the C-shaped gap 1232, and the first waterproof plate 161 vertically passes through the C-shaped gap 1232. The waterproof component further includes a second waterproof plate 162 and a third waterproof plate 163 that respectively surround the two side portions of the slider 123. For example Figure 17, the second waterproof plate 162 starts from the surface of the slider 123 facing away from the driving assembly 110, bends 90 degrees to the side surface of the slider 123, then bends 90 degrees to the surface facing away from the bracket assembly 130, and finally bends 90 degrees into the notch of the slider 123, thereby forming a winding shape surrounding the side portion of the slider 123. The shape of the third waterproof plate 163 is symmetrical to that of the second waterproof plate 162. As Figure 14 or Figure 16 , the first waterproof plate 161, the second waterproof plate 162 and the third waterproof plate 163 are connected to the driving assembly 110 via a transfer plate 166 at the top. The three waterproof plates and the slider 123 are all positioned relative to the driving assembly 110. When the slider 123 slides up and down, the gaps between the first waterproof plate 161, the second waterproof plate 162, the third waterproof plate 163 and the slider 123 can be kept constant, ensuring the smooth movement of the slider 123 and avoiding interference and impact caused by changes in the gap during the movement due to different positioning references of the slider 123 and the three waterproof plates. The first waterproof plate 161, the second waterproof plate 162 and the third waterproof plate 163 form a labyrinth-type waterproof structure, and the vertical extension length of the waterproof assembly covers the vertical length of the driving assembly 110 to provide effective waterproof protection for the driving assembly 110.

[0049] Further, as Figure 17 , the waterproof assembly may further include a fourth waterproof plate 164 and a fifth waterproof plate 165 respectively extending away from the side surfaces of the second waterproof plate 162 and the third waterproof plate 163 away from the slider 123. The fourth waterproof plate 164 and the fifth waterproof plate 165 may be in the same plane as the side surface of the first waterproof plate 161 parallel to the driving assembly 110. Correspondingly, as Figure 8 , Figure 12 and Figure 14 , at a position closer to the loading and unloading assembly 101 than the fourth waterproof plate 164 and the fifth waterproof plate 165, the lower surface of the polishing platform 310 is provided with a second lower retaining edge 310b extending downward. The second lower retaining edge 310b extends parallel to the fourth waterproof plate 164 and the fifth waterproof plate 165 and partially overlaps with the first waterproof plate 161, the fourth waterproof plate 164 and the fifth waterproof plate 165 in the vertical direction to form an overlapping structure, further preventing liquid from entering the driving assembly 110 through the gap at the top of the waterproof assembly.

[0050] According to the technical solution of the present application, by providing a water receiving tray 150, when the loading and unloading component 101 is at the high working position, a large amount of liquid in the polishing chamber will flow into the water receiving tray 150 and will not flow into the lower transfer chamber, preventing the liquid from falling onto the wafers carried by the transfer mechanism 200 and ensuring the cleanliness of wafer transfer in the transfer chamber. In addition, by providing a waterproof component in a labyrinth form, vertical waterproofing of the driving component 110 can be achieved when the loading and unloading component 101 moves with a large stroke in a very small space. When the loading and unloading component 101 is at the low working position in the transfer chamber, the water receiving tray 150 will move away from the polishing platform 310, and a small amount of splashed water in the polishing chamber will drip into the transfer chamber. The labyrinth-style waterproof component can prevent the liquid from entering the inside of the driving component 110, ensuring the safe and stable operation of the equipment.

[0051] The above embodiments are only used to illustrate the embodiments of the present application, rather than to limit the embodiments of the present application. Those of ordinary skill in the relevant technical fields can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The patent protection scope of the embodiments of the present application shall be defined by the claims.

Claims

1. A chemical mechanical polishing device, characterized in that: include: A polishing mechanism, including a carrying head for carrying the wafer to the polishing plate for polishing; The loading and unloading mechanism comprises a driving assembly, a bracket and a loading and unloading assembly; the driving assembly is arranged at the side of the loading and unloading assembly; the bracket comprises an L-shaped vertical frame and a horizontal frame and a slider fixed to the vertical frame, and the loading and unloading assembly is arranged on the horizontal frame; the driving assembly is slidably connected with the slider to drive the slider to move up and down, so that the loading and unloading assembly moves between a low station and a high station; A transmission mechanism, comprising a transmission base disposed below the horizontal frame and a manipulator connected to the transmission base, wherein the manipulator comprises a mechanical arm and a clamping claw for clamping a wafer; The clamp is configured to move horizontally above the loading and unloading assembly and align with it when the loading and unloading assembly is in the low station; the loading and unloading assembly moves toward the clamp after the clamp moves into position to exchange wafers with the clamp, and moves upward to the high station to exchange wafers with the carrier head after the clamp moves away from above it.

2. The chemical mechanical polishing equipment according to claim 1, characterized in that: The loading and unloading assembly includes a bracket assembly and a loading and unloading cup arranged on the bracket assembly, the loading and unloading cup is used to carry wafers to provide wafers to the carrier head and receive wafers unloaded from the carrier head, the bracket assembly includes a bracket plate, a plurality of support columns arranged on the bracket plate and an elastic support member arranged between the bracket plate and the horizontal frame, the plurality of support columns are evenly distributed along a circle concentric with the loading and unloading cup to support the loading and unloading cup, and the stiffness of the elastic support member is adjustable.

3. The chemical mechanical polishing equipment according to claim 1, characterized in that: The chemical mechanical polishing device comprises a horizontal polishing platform, wherein the polishing platform divides the chemical mechanical polishing device into a polishing chamber located at an upper portion and a transfer chamber located at a lower portion; The polishing mechanism is located in the polishing chamber, the transmission mechanism is located in the transmission chamber, and the driving assembly and the bracket are located in the transmission chamber; The polishing platform is provided with an interaction port which connects the polishing chamber and the transmission chamber, and the loading and unloading assembly moves between a low station in the transmission chamber and a high station in the polishing chamber through the interaction port.

4. The chemical mechanical polishing equipment according to claim 3, characterized in that: The driving assembly includes a support frame and a driver, the support frame includes a horizontal plate mounted on the lower surface of the polishing platform and a vertical plate extending vertically downward from one end of the horizontal plate facing the loading and unloading assembly, the driver includes an actuator mounted on one side of the vertical plate facing the loading and unloading assembly, a motor arranged on the other side of the vertical plate, and a transmission member crossing the vertical plate from the bottom to drive the actuator and the motor, the motor, the vertical plate, and the actuator form a three-layer stacked structure to reduce the layout space; The actuating block of the actuating member is fixedly connected to the sliding block, and the motor drives the actuating block to move up and down via the transmission member to drive the sliding block to move up and down.

5. The chemical mechanical polishing equipment according to claim 4, characterized in that: The actuating member includes a vertically extending lead screw and the actuating block threadably connected to the lead screw. The motor drives the lead screw to rotate so that the actuating block moves up and down along the lead screw.

6. The chemical mechanical polishing equipment according to claim 4, characterized in that: A low position detector and a high position detector are arranged on the vertical plate at positions corresponding to the low position and the high position, and a detection plate is arranged on the actuating block, and the detection plate has a width t along the vertical direction; When the detection plate moves to the low position detector, the low position detector is triggered to determine that the loading and unloading assembly is within a threshold range near the low position, so as to allow the clamp to move above the loading and unloading assembly; When the detection plate moves to the high position detector, the high position detector is triggered to determine that the loading and unloading assembly is within a threshold range near the high position, so as to allow the clamp to move under the loading and unloading assembly; The threshold range is t.

7. The chemical mechanical polishing equipment according to claim 2, characterized in that: A nozzle is configured on the upper surface of the loading and unloading cup, and the loading and unloading mechanism includes a liquid inlet pipe, which is fluidically connected to the nozzle to provide liquid to the nozzle; the liquid inlet pipe is fixedly connected to the slider to move up and down with the slider, and the liquid inlet pipe is at least partially configured in a spiral shape so as to be retracted and contracted when moving up and down.

8. The chemical mechanical polishing equipment according to claim 1, characterized in that: The transmission base includes a slide rail, the robot is configured to move along the slide rail, the robot arm includes a horizontal arm extending horizontally from the slide rail beyond the loading and unloading assembly and a vertical arm extending upward from the horizontal arm, and the top of the vertical arm is connected to the clamp; when the clamp moves to above the loading and unloading assembly, the horizontal arm, the vertical arm and the clamp form a C-shape opening toward the loading and unloading assembly, and the loading and unloading assembly is located in the C-shaped opening space.

9. The chemical mechanical polishing equipment according to claim 8, characterized in that: The horizontal arm is configured to be horizontally retractable, the vertical arm is configured to be vertically retractable, and the clamping claw is configured to be horizontally rotatable around the vertical arm.

10. The chemical mechanical polishing equipment according to claim 3, characterized in that: The chemical mechanical polishing equipment also includes a water receiving tray, which is fixedly connected to the bracket and located below the horizontal frame. The projection of the water receiving tray to the polishing platform covers the interaction port, and the outer edge of the water receiving tray has a vertically upward flange; when the loading and unloading assembly moves to the high workstation, the water receiving tray moves to a distance of 2mm-5mm between the flange and the lower surface of the polishing platform, and the height of the water receiving tray is set to allow a robot to pass under it.

11. The chemical mechanical polishing equipment according to claim 10, characterized in that: The water receiving tray is provided with a drain port, and a drain pipe which is retractable as the water receiving tray moves is connected below the drain port. The water receiving tray receives liquid which enters the transmission chamber from the polishing chamber through the interaction port, and discharges the liquid through the drain pipe.

12. The chemical mechanical polishing equipment according to claim 11, characterized in that: The lower end of the drain pipe is connected to a water absorption source and a water supply source. When the water receiving tray moves to a high position along with the loading and unloading assembly, the water absorption source is started to absorb the liquid in the water receiving tray. When the water receiving tray moves to a low position along with the loading and unloading assembly, the water absorption source is stopped, and the water supply source is started to supply moisturizing liquid to the water receiving tray. The supply amount of the moisturizing liquid is such that the moisturizing liquid forms a liquid film of 0.5 mm to 1 mm on the surface of the water receiving tray to moisturize the water receiving tray and adsorb pollutants.

13. The chemical mechanical polishing equipment according to claim 10, characterized in that: A hydrophobic coating is provided on the inner surface of the water receiving tray to promote the received liquid to roll down to the drain pipe to prevent splashing; or a hydrophilic coating is provided on the inner surface of the water receiving tray, and the hydrophilic coating is configured to spread the droplets dripping thereon into a liquid film to disperse the kinetic energy of the absorbed droplets to prevent splashing.

14. The chemical mechanical polishing equipment according to claim 10, characterized in that: The slider is configured to have a "concave" shape in horizontal cross section, and the side of the drive assembly facing the slider is enclosed in the notch of the slider; the slider is configured to have a C-shaped gap that is consistent with its "concave" cross section and penetrates it in the vertical direction; The chemical mechanical polishing device also includes a vertically extending waterproof component for protecting the driving component, the waterproof component includes a first waterproof plate matching the shape of the C-shaped gap and a second waterproof plate and a third waterproof plate respectively surrounding two side portions of the slider, the first waterproof plate vertically passing through the C-shaped gap; The first waterproof plate, the second waterproof plate and the third waterproof plate are connected to the driving assembly via an adapter plate at the top so that the gaps between the first waterproof plate, the second waterproof plate and the third waterproof plate and the slider are constant when the slider slides up and down.

15. A wafer transfer method, used in the chemical mechanical polishing equipment according to any one of claims 1 to 14, characterized in that: The method comprises the following steps: Move the loading and unloading mechanism downward to the low working position; Move the robot to the loading and unloading mechanism, and move the clamp horizontally to above the loading and unloading assembly, so that the wafer clamped by the clamp is aligned with the loading and unloading cup of the loading and unloading assembly; moving the handling assembly upward to the clamping jaws, which release the wafer into the handling cup; Moving the loading and unloading assembly downward to the low working position; moving the clamping jaws to clear the top of the loading and unloading assembly; Moving the loading and unloading assembly upward to the high working position; A carrier head of a polishing mechanism interacts with the load and unload cup to remove a wafer from the load and unload cup.

16. The wafer transfer method according to claim 15, characterized in that: When the loading and unloading mechanism is at the high position, the robot arm can move along the track of the transmission mechanism and pass under the loading and unloading assembly to transfer wafers to other mechanisms.

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