Horizontal magnetron sputtering coating slag falling defect control method

Abstract

The invention belongs to the technical field of coating, and particularly relates to a horizontal magnetron sputtering coating slag falling defect control method. Comprising the following steps: pretreating the cathode protective plate, detaching the cathode protective plate from an original mounting position, placing the cathode protective plate in a horizontal magnetron sputtering coating device, carrying out target coating operation to form a film layer, and remounting the cathode protective plate at the original position after the target coating operation is completed. Surface treatment is carried out on the cathode protective plate, and a film layer is formed by carrying out target coating on the cathode protective plate, so that in the subsequent glass coating process, a target sputtering object is attached to the film layer on the cathode protective plate, and the film layer can enhance the adhesive force with the target sputtering object; therefore, the phenomenon of slag falling in the horizontal magnetron sputtering coating process is greatly controlled, and the quality of glass is further ensured. And the maintenance period of the cathode protection plate is greatly prolonged.

Description

Technical Field

[0001] The present invention belongs to the technical field of coating, and particularly relates to a method for controlling the slag dropping defect in horizontal magnetron sputtering coating. Background Art

[0002] Slag dropping in coating is an inevitable stubborn defect in horizontal coating. During the process of large-area glass coating by horizontal magnetron sputtering, the glass is located below the cathode. The cathode shield is used to protect the cathode cover plate and prevent sputtered materials from splashing. The sputtered materials of the target adhere to the surface of the cathode shield. In the prior art, the adhesion between the cathode shield and the sputtered materials of the target is insufficient. Due to the inevitable gravity, the sputtered materials of the target are likely to fall off from the surface of the cathode shield onto the glass, forming the "slag dropping" phenomenon, which causes the subsequent coating at this place to be unable to adhere to the glass, affecting the quality of the coated glass.

[0003] However, with the continuous improvement of customers' requirements for the appearance quality of coated glass, it is urgent for us to improve the slag dropping quality through process and technical means to meet the quality needs of the market and at the same time improve the quality level of coated glass products.

[0004] Chinese Patent with Publication No. CN117817569A discloses a surface treatment method for a nickel-chromium target for reducing the slag dropping rate of coating. In this invention, the target manufacturer reduces slag dropping through target polishing treatment, shielding a certain area of the target sputtering region, and roughening sandblasting surface treatment method. Although this method can reduce the probability of target slag dropping, it will reduce the target sputtering rate, reduce the target utilization rate, and is not conducive to the surface maintenance of the target.

[0005] The patent with Publication No. CN215103505U discloses a plug-in type vacuum magnetron sputtering mechanism with less dust falling. This patent changes the existing cathode shield to a structure with a stainless steel screen, thus effectively increasing the contact area and adsorption force of the cathode shield and reducing the probability of dust falling on the coated glass. However, this patent has technical defects such as poor adsorption force and durability of the stainless steel screen. Summary of the Invention

[0006] The object of the present invention is to overcome the technical defect in the prior art that due to the inevitable gravity, the sputtered materials of the target are likely to fall off from the surface of the cathode shield onto the glass, forming the "slag dropping" phenomenon, which causes the subsequent coating at this place to be unable to adhere to the glass, affecting the quality of the coated glass, and to provide a method for controlling the slag dropping defect in horizontal magnetron sputtering coating.

[0007] In a first aspect, the present invention provides a method for controlling the slagging defect in horizontal magnetron sputtering coating, comprising the following steps: pretreating the cathode shield, then disassembling the cathode shield from its original installation position and placing it in a horizontal magnetron sputtering coating device for target coating operation to form a film layer on the cathode shield, and after completion, reinstalling the cathode shield at the original position.

[0008] In the technical solution of the present invention, in order to improve the technical defect that due to the poor adhesion between the cathode shield and the target sputtering material, the target sputtering material is likely to fall off from the surface of the cathode shield onto the glass, forming a "slagging" phenomenon and affecting the glass quality, the surface of the cathode shield is treated. By forming a film layer on the cathode shield during the target coating, during the subsequent glass coating process, the target sputtering material adheres to the film layer on the cathode shield, and this film layer can enhance the adhesion with the target sputtering material, which greatly controls the slagging phenomenon in the horizontal magnetron sputtering coating process and further ensures the quality of the glass. It also extends the maintenance cycle of the cathode shield.

[0009] Preferably, in the target coating operation, the coating parameters are set to include the vacuum degree and the air pressure. Among them, the vacuum degree is 3.0×10 -6 mbar~9.0×10 -6 mbar, and the air pressure range is 3.0×10 -3 mbar~9.0×10 -3 mbar.

[0010] Preferably, the target includes at least one of zinc tin target, zinc aluminum target, silver target, copper target, chromium target, and nickel chromium target.

[0011] Considering that the cathode shield material is metal aluminum material and the bonding force of materials with the same property is strong, metal targets: silver, copper, chromium, and nickel chromium are considered for coating. Then, from the cost consideration, the silver and copper targets with higher costs and easy oxidation are excluded, and the chromium target and nickel chromium target are selected as the materials for coating the cathode shield. Further, the adhesion between the coating layer and the sputtering material is measured by the "cross-cut method", and finally it is found that the adhesion between the nickel chromium target, chromium target and the sputtering material is relatively excellent.

[0012] Further preferably, the target is preferably a chromium target or a nickel chromium target.

[0013] Introduction to the cross-cut method: The cross-cut method (Cross-Cut Test) is a semi-quantitative test method for evaluating the adhesion between a film layer and a substrate by physically cutting the film layer and applying an external force (tape peeling). Its core principle is:

[0014] 1. Mechanical cutting: Use a tool to draw regular grids on the surface of the film layer to break the continuity of the film layer.

[0015] 2. Peel test: Adhere and peel with tape to simulate the tendency of the film layer to fall off under external force.

[0016] 3. Analysis of the peeling area: Based on the peeling ratio of the film layer in the grid area, judge the strength of the adhesion. The stronger the adhesion, the less the film layer peels off after tape peeling.

[0017] The target sputtering products include materials such as silicon nitride, silicon oxide, zinc oxide, zinc oxide tin, silver, copper, nickel chromium, zirconium oxide, chromium nitride, etc. Through adhesion tests, it is found that the nickel-chromium film layer has the strongest comprehensive performance.

[0018] Preferably, the thickness range of the nickel-chromium film layer on the cathode shield is 50 - 200 nm. The nickel-chromium layer has a strong bonding force with the target sputtering products, which can enhance the adhesion between the target sputtering products and the cathode shield.

[0019] The thickness of the nickel-chromium film layer is closely related to the effect of preventing "slag falling". If the thickness is too small or too large, the effect of preventing "slag falling" is not obvious. Preferably, the thickness range of the nickel-chromium film layer plated by the nickel-chromium target on the cathode shield is 100 - 150 nm.

[0020] Preferably, the pretreatment of the cathode shield is: roughen the surface of the cathode shield to increase the contact area with the nickel-chromium layer and improve the bonding strength between the nickel-chromium layer and the cathode shield.

[0021] The roughening treatment is carried out as follows: Use a pressure sandblasting machine for sandblasting treatment. The sandblasting abrasive is alumina, the sandblasting pressure is 0.5 - 0.7 MPa, the sandblasting distance is 100 - 200 mm, and the spraying angle is 70 - 90°. The surface roughness Ra range of the cathode shield is 0.5 - 1.5 μm.

[0022] Preferably, the cathode shield is an aluminum plate.

[0023] Preferably, the nickel-chromium layer is deposited by a magnetron sputtering coating process to uniformly deposit a nickel-chromium layer on the surface of the aluminum plate of the cathode shield, and a good combination is formed between the nickel-chromium layer and the surface of the aluminum plate of the cathode shield.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] In the technical solution of the present invention, in order to improve the technical defect that due to the poor adhesion between the cathode shield and the target sputtering material, the target sputtering material is likely to fall off from the surface of the cathode shield onto the glass, resulting in the "slag dropping" phenomenon and affecting the glass quality, the surface of the cathode shield is treated. By depositing a film layer on the cathode shield during target coating, during the subsequent glass coating process, the target sputtering material adheres to the film layer on the cathode shield, and this film layer can enhance the adhesion to the target sputtering material, which greatly controls the slag dropping phenomenon in the horizontal magnetron sputtering coating process and further ensures the glass quality. The maintenance period of the cathode shield is extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a test chart of the adhesion of the cathode shield in Embodiment 1 of the present invention.

[0027] Figure 2 It is a test chart of the adhesion of the cathode shield in Embodiment 1 of the present invention.

[0028] Figure 3 It is a test chart of the adhesion of the cathode shield in Embodiment 1 of the present invention.

[0029] Figure 4 It is a test chart of the adhesion of the cathode shield in Embodiment 1 of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0030] The present invention will be further described in detail below in conjunction with specific embodiments. However, this should not be construed as limiting the scope of the above-mentioned subject matter of the present invention to the following embodiments. Any technology implemented based on the content of the present invention falls within the scope of the present invention.

[0031] In the description of the specific embodiments of the present invention, without special instructions, the expression terms indicating the orientation or position relationship such as "upper", "lower", "left", "right", "center", "inner", "outer", etc. are all based on the orientation or position relationship shown in the drawings, or the orientation or position relationship when the invention product / device / device is usually used and placed. These terms of orientation or position relationship are only for the convenience of describing the solution of the present invention or simplifying the description in the specific embodiments, so as to facilitate technicians to quickly understand the solution, rather than indicating or implying that a specific device / component / element must have a specific orientation or be constructed and operated in a specific position relationship. Therefore, it should not be construed as a limitation to the present invention.

[0032] In addition, when terms such as "horizontal", "vertical", "hanging", "parallel" appear, it does not mean that the corresponding device / component / element is required to be absolutely horizontal or vertical or hanging or parallel, but it can be slightly inclined or deviated. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and it does not mean that the structure must be completely horizontal, but it can be slightly inclined. Or, it can be simply understood that the corresponding device / component / element is arranged in directions such as "horizontal", "vertical", "hanging", "parallel", and can have an error / deviation of ±10% relative to the corresponding direction setting, more preferably an error / deviation within ±8%, more preferably an error / deviation within ±6%, more preferably an error / deviation within ±5%, more preferably an error / deviation within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the solution of the present invention.

[0033] In addition, when expressions such as "first", "second", "third" appear in the terms, they are only used to distinguish the description of the same or similar components, and should not be understood as emphasizing or implying the relative importance of specific components.

[0034] In addition, in the description of the embodiments of the present invention, "several", "multiple", "a number of" represent at least 2. It can be any situation such as 2, 3, 4, 5, 6, 7, 8, 9, etc., and even can be a situation of more than 9.

[0035] In addition, in the description of the technical solution of the present invention, unless otherwise clearly specified / defined / restricted, when terms such as "set", "installed", "connected", "connected", "provided with", "laid", "arranged" appear, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be connection means commonly used in the art such as welding, riveting, bolting, and threaded connection. Such a connection can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components.

[0036] Embodiment 1

[0037] This embodiment provides a method for controlling the slag dropping defect in horizontal magnetron sputtering coating, including the following steps: pre-treating the cathode shield, and the cathode shield is an aluminum plate.

[0038] In the technical solution of the present invention, the cathode shield is arranged at the top position of the horizontal magnetron sputtering coating machine, the cathode shield is horizontally arranged, and the target structure is below the cathode shield. During the glass coating process, the glass is arranged below the target structure.

[0039] Specifically, the pretreatment is as follows: roughen the surface of the cathode guard plate to increase the contact area with the nickel-chromium layer and improve the bonding strength between the nickel-chromium layer and the cathode guard plate. Among them, the specific setting method of the roughness is: perform sandblasting treatment with a pressure sandblaster: the sandblasting abrasive is alumina, the sandblasting pressure is 05.-0.7 MPa, the sandblasting distance is 100-200 mm, and the spraying angle is 70-90°. The Ra range of the roughness of the surface of the cathode guard plate is 0.5-1.5 μm.

[0040] Then disassemble the cathode guard plate from its original installation position and place it in a horizontal magnetron sputtering coating device for target coating operation to form a film layer on the cathode guard plate, and then reinstall the cathode guard plate at its original installation position after completion.

[0041] The target is preferably a nickel-chromium target. In the target coating operation, the nickel-chromium film layer is deposited by a magnetron sputtering coating process to uniformly deposit a nickel-chromium layer on the surface of the aluminum plate of the cathode guard plate, and a good bond is formed between the nickel-chromium layer and the surface of the aluminum plate of the cathode guard plate.

[0042] Set the coating parameters including the vacuum degree and air pressure. Among them, the vacuum degree is 5.0×10 -6 mbar, and the air pressure range is 3.0×10 -3 mbar. The thickness range of the nickel-chromium film layer on the cathode guard plate is 50-200 nm. In this embodiment, the thickness of the nickel-chromium film layer on the cathode guard plate is 50 nm.

[0043] Example 2

[0044] This embodiment provides a method for controlling the slagging defect in horizontal magnetron sputtering coating, including the following steps: perform pretreatment on the cathode guard plate, and the cathode guard plate is an aluminum plate. Specifically, the pretreatment is as follows: roughen the surface of the cathode guard plate to increase the contact area with the nickel-chromium layer and improve the bonding strength between the nickel-chromium layer and the cathode guard plate. Among them, the specific setting method of the roughness is: sandblast the cathode guard plate to control the roughness between Ra = 0.5 and 1.5 μm.

[0045] Then disassemble the cathode guard plate from its original installation position and place it in a horizontal magnetron sputtering coating device for target coating operation to form a film layer on the cathode guard plate, and then reinstall the cathode guard plate at its original installation position after completion.

[0046] The target is preferably a chromium target. In the target coating operation, the chromium film layer is deposited by a magnetron sputtering coating process to uniformly deposit a chromium layer on the surface of the aluminum plate of the cathode guard plate, and a good bond is formed between the chromium layer and the surface of the aluminum plate of the cathode guard plate.

[0047] Set the coating parameters including the vacuum degree and air pressure. Among them, the vacuum degree is 5.0×10 -6 mbar, and the air pressure range is 3.0×10 -3 mbar. The thickness range of the chromium film layer on the cathode shield is 50 - 200 nm. In this embodiment, the thickness of the chromium film layer on the cathode shield is 150 nm.

[0048] Example 3

[0049] This embodiment provides a method for controlling the slag - shedding defect in horizontal magnetron sputtering coating, which includes the following steps: Pretreat the cathode shield, and the cathode shield is an aluminum plate. Specifically, the pretreatment is: roughen the surface of the cathode shield to increase the contact area with the nickel - chromium layer and improve the bonding strength between the nickel - chromium layer and the cathode shield. Among them, the specific setting method of the roughness is: use sandblasting and shot peening to treat the cathode shield, and control the roughness at Ra = 0.5 - 1.5 μm.

[0050] Then disassemble the cathode shield from its original installation position and place it in a horizontal magnetron sputtering coating device for target coating operation to form a film layer on the cathode shield, and reinstall the cathode shield at its original installation position after completion.

[0051] The target is preferably a nickel - chromium target. In the target coating operation, the plating method of the chromium film layer adopts the magnetron sputtering coating process to uniformly deposit a nickel - chromium layer on the surface of the aluminum - plate cathode shield, and a good combination is formed between the nickel - chromium layer and the surface of the aluminum - plate cathode shield.

[0052] Set the coating parameters including the vacuum degree and air pressure. Among them, the vacuum degree is 5.0×10 -6 mbar, and the air pressure range is 3.0×10 -3 mbar. The thickness range of the nickel - chromium layer on the cathode shield is 50 - 200 nm. In this embodiment, the thickness of the nickel - chromium layer on the cathode shield is 150 nm.

[0053] Example 4

[0054] This embodiment provides a method for controlling the slag - shedding defect in horizontal magnetron sputtering coating, which includes the following steps: Pretreat the cathode shield, and the cathode shield is an aluminum plate. Specifically, the pretreatment is: roughen the surface of the cathode shield to increase the contact area with the nickel - chromium layer and improve the bonding strength between the nickel - chromium layer and the cathode shield. Among them, the specific setting method of the roughness is: use sandblasting and shot peening to treat the cathode shield, and control the roughness at Ra = 0.5 - 1.5 μm.

[0055] Then, the cathode shield is removed from its original installation position and placed in a horizontal magnetron sputtering coating device for target coating operation. A film layer is formed on the cathode shield, and after completion, the cathode shield is reinstalled at its original installation position.

[0056] The target is preferably a nickel-chromium target. In the target coating operation, the nickel-chromium layer is deposited by a magnetron sputtering coating process, and a nickel-chromium layer is evenly deposited on the surface of the aluminum plate of the cathode shield, forming a good bond with the surface of the aluminum plate of the cathode shield.

[0057] Set the coating parameters including vacuum degree and air pressure. Among them, the vacuum degree is 5.0×10 -6 mbar, and the air pressure range is 3.0×10 -3 mbar. The thickness range of the nickel-chromium layer on the cathode shield is 50 - 200 nm. In this embodiment, the thickness of the nickel-chromium layer on the cathode shield is 200 nm.

[0058] Adhesion grade tests are respectively carried out on the cathode shields of Examples 1 - 4: The results are shown in Table 1, and the adhesion diagram is shown in Figures 1-4 .

[0059] Table 1 shows the adhesion test results of the cathode shields of Examples 1 - 4

[0060] Coating material Coating thickness Adhesion grade Nickel-chromium 50nm 3 Chromium target 150nm 2 Nickel-chromium 150nm 1 Nickel-chromium 200nm 3

[0061] The adhesion grades in Table 1 show that: The adhesion of the nickel-chromium layer plated with 150 nm is the best, and the adhesion grade is Grade 1.

[0062] Comparative Example 1

[0063] The glass coating process is carried out under the same conditions using a horizontal magnetron sputtering coating device without treating the cathode shield.

[0064] Furthermore, in addition to the above adhesion test, the glass coating process is carried out on Examples 1 - 4, as well as the existing glass coating process, and the number of slag spots is counted, as shown in Table 2 below:

[0065] Table 2 shows the slag spot statistical data of the coated glass of the examples and comparative examples

[0066] <![CDATA[Number of slag points per meter 2 > Example 1 10 Example 2 5 Example 3 2 Example 4 8 Comparative example 1 40

[0067] By counting the number of slag spots, it can be clearly seen that by coating the cathode shield, during the glass coating process, the sputtered matter from the target forms a strong adsorption with the chromium film or nickel-chromium film on the cathode shield, greatly reducing the number of slag spots on the glass and improving the quality of the coated glass.

[0068] In the technical solution of the present invention, by performing target coating treatment on the cathode shield, the maintenance cycle of the cathode shield can be further extended. Compared with the existing cathode shield treatment methods, the maintenance cycle is extended by no less than twice. And within one usage cycle, the number of slag spots on the glass can be stably controlled within 20. In the prior art, within one usage cycle, the closer to the maintenance deadline, the more slag spots there are, up to 40 - 50, which seriously affects the quality of the coated glass.

[0069] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for controlling slag defects in horizontal magnetron sputtering coating, characterized in that: The method comprises the following steps: pre-treating the cathode shield plate, then removing the cathode shield plate from the original installation position and placing it in a horizontal magnetron sputtering coating device to perform target coating operation to form a film layer on the cathode shield plate, and after completion, reinstalling the cathode shield plate to the original position.

2. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 1, characterized in that: In the target coating operation, the vacuum range is set to 3.0×10 -6 mbar~9.0×10 -6 mbar, set the gas pressure range to 3.0×10 - 3 mbar~9.0×10 -3 mbar.

3. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 1, characterized in that: The target material includes at least one of a zinc-tin target, a zinc-aluminum target, a silver target, a copper target, a chromium target, and a nickel-chromium target.

4. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 3 is characterized in that: The target material is a chromium target or a nickel-chromium target.

5. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 4, characterized in that: The coating thickness of the target material on the cathode shield is in the range of 50-200 nm.

6. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 5, characterized in that: The coating thickness of the target material on the cathode shield is in the range of 100-150nm.

7. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 1, characterized in that: The cathode shield is an aluminum plate.

8. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 7, characterized in that: The pretreatment of the cathode protective plate is: roughening the surface of the cathode protective plate, and the roughening is performed in the following manner: sandblasting the cathode protective plate with a pressure sandblasting machine.

9. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 8, characterized in that: The sandblasting abrasive is aluminum oxide, the sandblasting pressure is 05.-0.7MPa, the sandblasting distance is 100-200mm, and the spraying angle is 70-90°.

10. The method for controlling slag defects in horizontal magnetron sputtering coating according to claim 8, characterized in that: The roughness Ra of the cathode shield surface is in the range of 0.5-1.5 μm.

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