Coating equipment for improving uniformity of magnetron sputtering film

Abstract

The utility model discloses coating equipment for improving the uniformity of a magnetron sputtering film, and belongs to the technical field of semiconductor production equipment.The coating equipment comprises a substrate table, the substrate table is provided with a cooling channel and a cooling air hole, and a supporting part is arranged at the upper end of the substrate table in a protruding mode; the air hole plug is arranged on the substrate table in a lifting adjusting manner; and the base plate is placed on the supporting part. Opening and closing of the cooling air holes in the corresponding positions can be adjusted according to the temperature distribution condition of the substrate in the debugging stage, the cooling air holes are opened in the high-temperature area to be communicated with the cooling channel, cooling air is used for cooling, and when the cooling air is sent out from the cooling air holes, the air uniformizing space can be used for uniformizing the cooling air in a small range, so that the cooling efficiency is improved. Regional cooling is achieved, the purpose of temperature regulation and control is achieved, the temperature of the surface of the substrate is uniform and consistent, and then the uniformity of coating is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production equipment, in particular to a film coating equipment for improving the uniformity of magnetron sputtering films. BACKGROUND

[0002] Magnetron sputtering has the advantages of low substrate temperature, high purity of thin films, uniform and dense structure, good firmness and repeatability, and is widely used in the industries of semiconductors, solar energy and flat panel displays.

[0003] The working principle of magnetron sputtering is that Ar atoms form Ar+ and electrons under the action of an electric field, Ar+ is accelerated to fly to the cathode target by the electric field, and hits the target surface with high energy, so that the target material is sputtered, and the neutral target atoms or molecules are deposited on the substrate to form a thin film.

[0004] During the deposition of the thin film by magnetron sputtering, due to factors such as magnetic field distribution, gas flow distribution and chamber structure, there are differences in the uniformity of thin film deposition, especially for metal or other conductive thin films during the deposition process, not only the film thickness uniformity needs to meet the requirements, but also the sheet resistance uniformity needs to meet the requirements, and the sheet resistance uniformity is more related to the substrate temperature. In the deposition process of the advanced packaging metal seed layer TiCu, due to the existence of the organic layer on the surface of the substrate, high temperature heating cannot be carried out, and due to the difference in the surface temperature of the substrate during the deposition process, the sheet resistance uniformity is difficult to control, and if the difference in the sheet resistance is too large, it will affect the uniformity of the subsequent electroplated film, resulting in product failure risk. CONTENT OF THE INVENTION

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application provides a film coating equipment for improving the uniformity of magnetron sputtering films, which can adjust the temperature of each region of the substrate, thereby improving the film coating uniformity.

[0006] The film coating equipment for improving the uniformity of magnetron sputtering films according to the embodiments of the present application comprises:

[0007] A substrate table is provided with a cooling channel and cooling gas holes, the cooling gas holes are distributed on the upper end face of the substrate table and communicate with the cooling channel, the upper end of the substrate table is provided with a support portion, and the cooling gas holes are located in the area surrounded by the support portion;

[0008] A gas hole plug is adjustably arranged on the substrate table, the gas hole plug has a closed state and an open state during the adjustment, the cooling gas hole opposite to the gas hole plug is closed when the gas hole plug is in the closed state, and the cooling gas hole opposite to the gas hole plug communicates with the cooling channel when the gas hole plug is in the open state.

[0009] A substrate is placed on the support portion, and a uniform gas space is formed between the substrate and an upper end surface of the substrate table.

[0010] The film coating equipment for improving the uniformity of magnetron sputtering thin films has at least the following beneficial effects: the film coating equipment for improving the uniformity of magnetron sputtering thin films can adjust the opening and closing of the cooling air holes at corresponding positions according to the temperature distribution of the substrate in the debugging stage, open the cooling air holes in the area with high temperature, make the cooling air holes communicate with the cooling channel, and thus use the cooling gas to cool down, and the cooling gas can be uniformly distributed in a small range when being sent out from the cooling air holes, so as to realize regional cooling and achieve the purpose of temperature regulation, so that the temperature of the substrate surface is uniform, and the uniformity of film coating is improved.

[0011] According to some embodiments of the present application, the air hole plug corresponds to the cooling air hole one by one, so that each cooling air hole can independently communicate with the cooling channel or be independently closed.

[0012] According to some embodiments of the present application, the upper end of the air hole plug is provided with a closing part, and the closing part is inserted into the cooling air hole when the air hole plug is in the closed state.

[0013] According to some embodiments of the present application, the substrate table is provided with a mounting hole coaxially arranged below the cooling air hole and communicating with the cooling channel, and the air hole plug is arranged in the mounting hole.

[0014] According to some embodiments of the present application, the hole wall of the mounting hole is provided with a first internal thread, the air hole plug is provided with a first external thread matched with the first internal thread, and the air hole plug is threadedly connected to the mounting hole.

[0015] According to some embodiments of the present application, the hole wall of the cooling air hole is provided with a second internal thread, the air hole plug is provided with a second external thread matched with the second internal thread, and the air hole plug is threadedly connected to the cooling air hole when the air hole plug is in the closed state.

[0016] According to some embodiments of the present application, the lower end of the mounting hole is open, and the bottom of the air hole plug is provided with an operation hole.

[0017] According to some embodiments of the present application, the height of the uniform gas space is 0.1mm to 1mm.

[0018] According to some embodiments of the present application, the cooling channel includes a cooling cavity arranged inside the substrate table and an input port communicating with the cooling cavity, and the horizontal projection of the cooling air hole is located in the cooling cavity.

[0019] According to some embodiments of the present application, the coating equipment further comprises:

[0020] a coating chamber, wherein a shadow board is arranged in the coating chamber, the shadow board abuts against the edge position of the upper end surface of the substrate and keeps sealing;

[0021] a jacking mechanism connected to the bottom of the substrate table;

[0022] wherein the horizontal projection of the support part is covered by the abutting area of the shadow board and the substrate.

[0023] Additional aspects and advantages of the present application will be given in part in the following description, some of which will become apparent to those skilled in the art from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0024] The present application will be further described below in conjunction with the drawings and examples, wherein:

[0025] Figure 1 is a schematic diagram of the overall structure of the present application;

[0026] Figure 2 is a schematic diagram of the internal structure of the substrate table in the present application;

[0027] Figure 3 is a schematic diagram of the structure of the air hole plug in the present application.

[0028] In the drawings:

[0029] 100 - substrate table, 101 - support part, 102 - jacking mechanism, 103 - cooling air hole, 104 - mounting hole;

[0030] 200 - cooling channel, 201 - cooling cavity, 202 - input port;

[0031] 300 - substrate, 301 - gas equalization space;

[0032] 400 - air hole plug;

[0033] 500 - coating chamber, 501 - shadow board. DETAILED DESCRIPTION

[0034] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0035] In the description of the present application, it needs to be understood that the orientation description, such as the orientation or position relationship indicated by the upper, lower, front, rear, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0036] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0037] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0038] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0039] Referring to Figures 1 to 3 , the embodiment of the present application proposes a film coating equipment for improving the uniformity of magnetron sputtering film, comprising:

[0040] The substrate table 100 is provided with a cooling channel 200 and a cooling gas hole 103, the cooling gas hole 103 is distributed on the upper end face of the substrate table 100 and communicates with the cooling channel 200, the upper end of the substrate table 100 is provided with a support part 101, and the cooling gas hole 103 is located in the area surrounded by the support part 101;

[0041] The gas hole plug 400 is adjustably arranged on the substrate table 100, and the gas hole plug 400 has a closed state and an open state in the process of adjusting, when the gas hole plug 400 is in the closed state, the cooling gas hole 103 opposite to the gas hole plug 400 is closed; when the gas hole plug 400 is in the open state, the cooling gas hole 103 opposite to the gas hole plug 400 communicates with the cooling channel 200;

[0042] The substrate 300 is placed on the support part 101, and an air equalization space 301 is formed between the substrate 300 and the upper end surface of the substrate table 100.

[0043] It can be understood that the embodiment is to arrange a plurality of cooling air holes 103 along the upper end surface of the substrate table 100, and each cooling air hole 103 is communicated with the cooling channel 200.

[0044] The air hole plug 400 is also provided with a plurality of air hole plugs 400, each of which can control the opening and closing of one cooling air hole 103 or a plurality of cooling air holes 103.

[0045] The film coating equipment for improving the uniformity of the magnetron sputtering film of the embodiment can adjust the opening and closing of the cooling air hole 103 at the corresponding position according to the temperature distribution of the substrate 300 in the debugging stage, open the cooling air hole 103 in the area with high temperature, make it communicated with the cooling channel 200, so as to use the cooling gas for cooling, and the cooling gas can be used for small range air equalization when it is sent out from the cooling air hole 103, so as to realize regional cooling and achieve the purpose of temperature regulation, so that the temperature of the surface of the substrate 300 is uniform, and the uniformity of the film coating is improved.

[0046] Referring to Figure 1 and Figure 2 In some embodiments of the present application, the air hole plug 400 corresponds to the cooling air hole 103 one by one, that is, the number of air hole plugs 400 is consistent with the number of cooling air holes 103, so that each cooling air hole 103 can be independently communicated with the cooling channel 200 or independently closed. By adopting the structure of the embodiment, each air hole plug 400 independently controls the opening and closing of one cooling air hole 103, which can improve the sensitivity of cooling regulation and realize more accurate temperature regulation.

[0047] In some embodiments of the present application, the upper end of the air hole plug 400 is provided with a closing part, and when the air hole plug 400 is in the closed state, the closing part is inserted into the cooling air hole 103.

[0048] It can be understood that the cooling air hole 103 is arranged on the upper end surface of the substrate table 100, and the substrate 300 is placed above the substrate table 100, so that the hole plug 400 is more convenient to control the opening and closing of the hole from the lower end of the cooling air hole 103. The closing part is arranged in the embodiment, when the hole plug 400 is adjusted upward, the closing part is inserted into the cooling air hole 103, so that the cooling air hole 103 is disconnected with the cooling channel 200, and the cooling gas cannot enter the cooling air hole 103 from the cooling channel 200. Therefore, the structure of the embodiment considers the placement of the substrate 300 and the adjustment of the hole plug 400, does not hinder the placement of the substrate 300, can adjust the hole plug 400, and further realizes the opening and closing control of the cooling air hole 103.

[0049] When the size of the cooling air hole 103 is the same as the size of the upper end of the hole plug 400, that is, the upper part of the hole plug 400 forms the closing part. When the size of the cooling air hole 103 is smaller than the size of the hole plug 400, the closing part with the matched size needs to be arranged on the upper end of the hole plug 400.

[0050] Referring to Figure 2 In some embodiments of the present application, the substrate table 100 is provided with a mounting hole 104 coaxially arranged below the cooling air hole 103 and communicating with the cooling channel 200, and the hole plug 400 is arranged in the mounting hole 104.

[0051] As known from the foregoing description of the embodiments, the cooling air hole 103 is located above the cooling channel 200, and it is more reasonable to control the opening and closing from the lower end of the cooling air hole 103. On this basis, the mounting hole 104 is arranged on the substrate table 100 to mount the hole plug 400, so that the upper end of the hole plug 400 can pass through the cooling channel 200 and be inserted into the cooling air hole 103 to close the cooling air hole 103. When it is needed to open, the hole plug 400 is controlled to move downward and exit the cooling air hole 103.

[0052] The structure of the embodiment can realize the foregoing adjustment and does not affect the delivery of the cooling gas. Since the hole plug 400 is located below, it is convenient to adjust the lifting of the hole plug 400 from the lower end of the substrate table 100.

[0053] In some embodiments of the present application, the lower end of the mounting hole 104 is open, and the bottom of the hole plug 400 is provided with an operation hole. The mounting hole 104 in the embodiment is communicated with the lower end of the substrate table 100, so that the bottom of the hole plug 400 is exposed, and the operator can match the operation hole of the bottom of the hole plug 400 by using the related tool to adjust the lifting of the hole plug 400.

[0054] It can be understood that the length of the air hole plug 400 in the embodiment is greater than the height of the cooling channel 200 in the vertical direction, so that the air hole plug 400 is inserted into the cooling air hole 103 upwardly while the lower end is still in the mounting hole 104, avoiding the leakage of cooling gas from the mounting hole 104.

[0055] With reference to Figure 3 In some embodiments of the present application, the hole wall of the mounting hole 104 is provided with a first internal thread, the air hole plug 400 is provided with a first external thread matched with the first internal thread, and the air hole plug 400 is threadedly connected to the mounting hole 104.

[0056] The embodiment sets the threaded cooperation between the air hole plug 400 and the mounting hole 104, facilitating the lifting adjustment of the air hole plug 400 and the fixation of the position after the lifting adjustment. Meanwhile, the structure design is simple, facilitating the production and processing. Moreover, the threaded cooperation can be used to realize the sealing of the mounting hole 104, avoiding the leakage of cooling gas from the mounting hole 104.

[0057] In combination with the operation hole design of the foregoing embodiments, the threaded installation also facilitates the staff to use a screwdriver or the like to extend into the mounting hole 104 from the lower side of the substrate table 100 to control the air hole plug 400.

[0058] With reference to Figure 3 In some embodiments of the present application, the hole wall of the cooling air hole 103 is provided with a second internal thread, the air hole plug 400 is provided with a second external thread matched with the second internal thread, and the air hole plug 400 is threadedly connected to the cooling air hole 103 when the air hole plug 400 is in the closed state.

[0059] It can be understood that the embodiment sets the threaded cooperation between the air hole plug 400 and the cooling air hole 103, facilitating the sealing of the cooling air hole 103 by using the cooperating threads.

[0060] Moreover, since the length of the air hole plug 400 is limited, the threaded cooperation is set, and when the cooperation depth between the air hole plug 400 and the mounting hole 104 is reduced, the second internal thread and the second external thread can be used to ensure the stability of the air hole plug 400, which can ensure the stability of the air hole plug 400 during the lifting adjustment, and further ensure the air tightness.

[0061] It can be understood that when the air hole plug 400 threadedly cooperates with the mounting hole 104 and the cooling air hole 103 at the same time, the first internal thread and the second internal thread need to be kept corresponding, so that the air hole plug 400 can smoothly enter the cooling air hole 103 when being screwed upwardly.

[0062] In some embodiments of the present application, the height of the uniform-gas space 301 is 0.1 mm to 1 mm. Those skilled in the art can flexibly set it according to the needs.

[0063] In some embodiments of the present application, the cooling channel 200 includes a cooling cavity 201 arranged inside the substrate table 100 and an input port 202 communicating with the cooling cavity 201, and the horizontal projection of the cooling gas hole 103 is located in the cooling cavity 201.

[0064] It can be understood that the cooling cavity 201 extends in the horizontal direction to a certain area, so as to ensure that it communicates with each cooling gas hole 103. When the cooling gas is sent in, it will be distributed in the cooling cavity 201 based on the expansion of the cooling cavity 201 when entering the cooling cavity 201 from the input port 202, achieving the uniform-gas effect, and then being sent out from the opened cooling gas hole 103. This is conducive to improving the consistency of the cooling rate of different areas of the substrate 300.

[0065] In addition, since the gas hole plug 400 needs to pass through the cooling cavity 201 to enter the cooling gas hole 103, by arranging the cooling cavity 201, it can effectively avoid the gas hole plug 400 from blocking the cooling channel 200 and affecting the delivery of the cooling gas.

[0066] It can be understood that the cross-sectional area of the cooling gas hole 103 is smaller than the cross-sectional area of the cooling cavity 201.

[0067] Referring to Figure 1 In some embodiments of the present application, the coating device further includes:

[0068] The coating chamber 500 is arranged with a shadow plate 501 inside, the shadow plate 501 abuts against the edge position of the upper end surface of the substrate 300 and keeps sealing;

[0069] The jacking mechanism 102 is connected to the bottom of the substrate table 100.

[0070] The horizontal projection of the support part 101 is covered by the abutting area of the shadow plate 501 and the substrate 300.

[0071] The substrate 300 in the present embodiment is pressed tightly up and down by the shadow plate 501 and the support part 101, which can ensure the stability and the airtightness of the coating space above the substrate 300 and the airtightness of the uniform-gas space 301 below the substrate 300.

[0072] In the embodiment, the mounting holes 104 and the cooling gas holes 103 are arranged around the lifting mechanism 102, i.e. no mounting hole 104 and cooling gas hole 103 are arranged in the central region of the substrate table 100. Correspondingly, the size of the cooling gas hole 103 close to the central region is larger than that of the cooling gas hole 103 far from the central region, so as to ensure the cooling effect of the central region.

[0073] It can be understood that the gas hole plug 400 in the present application can also adopt the interference fit of the sealing ring to seal the mounting hole 104 and the cooling gas hole 103, so as to replace the threaded arrangement.

[0074] The above detailed description of the embodiments of the present application is combined with the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge range of the ordinary skill in the art without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A coating device for improving the uniformity of magnetron sputtering thin films, characterized in that: include: A substrate stage, wherein the substrate stage is provided with a cooling channel and cooling air holes, wherein the cooling air holes are distributed on the upper end surface of the substrate stage and connected to the cooling channel, a support portion is protruding from the upper end of the substrate stage, and the cooling air holes are located in the area surrounded by the support portion; an air hole plug, the air hole plug being adjustable in height on the substrate stage, the air hole plug having a closed state and an open state during the process of the adjustment, wherein when the air hole plug is in the closed state, the cooling air hole directly opposite to the air hole plug is closed; and when the air hole plug is in the open state, the cooling air hole directly opposite to the air hole plug is connected to the cooling channel; A substrate is placed on the support portion, and a uniform air space is formed between the substrate and the upper end surface of the substrate stage.

2. The coating device for improving uniformity of magnetron sputtering thin films according to claim 1, characterized in that: The pore plugs correspond to the cooling pores one by one, so that each cooling pore can be independently connected to the cooling channel or closed independently.

3. The coating device for improving uniformity of magnetron sputtering thin films according to claim 1, characterized in that: A closing portion is provided at the upper end of the pore plug. When the pore plug is in the closed state, the closing portion is inserted into the cooling pore.

4. The coating device for improving uniformity of magnetron sputtering thin films according to claim 1, characterized in that: The substrate stage is provided with a mounting hole, the mounting hole is coaxially arranged below the cooling air hole and connected to the cooling channel, and the air hole plug is arranged in the mounting hole.

5. The coating device for improving uniformity of magnetron sputtering thin films according to claim 4, characterized in that: A first internal thread is provided on the hole wall of the mounting hole, a first external thread matching the first internal thread is provided on the air hole plug, and the air hole plug is threadedly connected to the mounting hole.

6. The coating device for improving uniformity of magnetron sputtering thin films according to claim 4, characterized in that: The wall of the cooling air hole is provided with a second internal thread, and the air hole plug is provided with a second external thread matching the second internal thread. When the air hole plug is in the closed state, the air hole plug is threadedly connected to the cooling air hole.

7. The coating device for improving uniformity of magnetron sputtering thin films according to claim 4, characterized in that: The lower end of the mounting hole is opened, and the bottom of the vent plug is provided with an operating hole.

8. The coating device for improving uniformity of magnetron sputtering thin films according to claim 1, characterized in that: The height of the gas uniformity space is 0.1 mm to 1 mm.

9. The coating device for improving uniformity of magnetron sputtering thin films according to claim 1, characterized in that: The cooling channel includes a cooling cavity arranged inside the substrate stage and an input port connected to the cooling cavity, and the horizontal projections of the cooling air holes are all located in the cooling cavity.

10. The coating device for improving uniformity of magnetron sputtering thin films according to claim 1, characterized in that: The coating equipment also includes: A coating chamber, wherein an anti-adhesion plate is provided in the coating chamber, the anti-adhesion plate abuts against the edge of the upper end surface of the substrate and maintains a seal; A lifting mechanism connected to the bottom of the substrate stage; Wherein, the horizontal projection of the supporting portion is covered by the contact area between the anti-fouling plate and the substrate.

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