High-temperature photoetching silver paste suitable for narrow line width and line spacing

Abstract

The invention discloses high-temperature photoetching silver paste suitable for narrow line width and line spacing, which is prepared from the following components in parts by weight: 20-40 parts of photosensitive resin, 20-40 parts of ethoxylated 1, 2, 4-trimethyl-1, 3-pentanediol monoisobutyrate, 20-30 parts of a solvent and 1- The invention relates to a photocurable conductive coating which is prepared from the following components in parts by weight: 10 to 30 parts of 1, 6-hexanediol diacrylate, 5 to 15 parts of a photoinitiator, 0.5 to 1 part of an antioxidant, 0.5 to 1 part of 2-hydroxy-4-n-octyloxybenzophenone, 0.5 to 1.5 parts of a defoaming agent, 0.5 to 1.5 parts of a flatting agent, 0.5 to 1.5 parts of a dispersing agent, 5 to 20 parts of an organic solvent, 60 to 85 parts of conductive filler and 0.5 to 5 parts of glass powder. The selected photosensitive resin is formed by mixing alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin according to the weight part ratio of 10: (2-6). According to the high-temperature photoetching silver paste suitable for the narrow line width and line distance, the five steps of printing, baking, photoetching, developing and sintering are achieved, patterns which cannot be manufactured in a traditional printing mode can be manufactured, and a high-density circuit with the line width and the line distance reaching 20 micrometers / 20 micrometers can be manufactured.

Description

Technical Field

[0001] The present invention relates to the technical field of lithographic silver paste, and in particular to a high-temperature lithographic silver paste suitable for narrow line widths and line spacings. Background Art

[0002] With the progress of the times, touch screens are developing towards large sizes, ultra-narrow borders, etc. Especially nowadays, the proportion of large-size touch screens is increasing, the electrode circuit design is getting narrower, and the quality of laser lithographic silver paste will directly determine the success or failure of the entire touch screen production process. Existing printed silver paste is limited by the printing process and cannot produce highly dense, narrow line width, narrow line spacing, and low-thickness conductive circuits. Summary of the Invention

[0003] The purpose of the present invention is to provide a high-temperature lithographic silver paste suitable for narrow line widths and line spacings. The high-temperature lithographic silver paste suitable for narrow line widths and line spacings realizes the production of patterns that cannot be made by traditional printing methods through five steps: printing - baking - lithography - development - sintering, and the line width and line spacing reach a high-density circuit of 20μm / 20μm.

[0004] To achieve the above object, the technical solution adopted by the present invention is: a high-temperature lithographic silver paste suitable for narrow line widths and line spacings, which is composed of the following components in parts by weight: Photosensitive resin 20 - 40 parts, Ethoxylated 1,6-hexanediol diacrylate 10 - 30 parts, Photoinitiator 5 - 15 parts, Antioxidant 0.5 - 1 part, 2-Hydroxy-4-n-octyloxybenzophenone 0.5 - 1 part, Defoaming agent 0.5 - 1.5 parts, Leveling agent 0.5 - 1.5 parts, Dispersant 0.5 - 1.5 parts, Organic solvent 5 - 20 parts, Conductive filler 60 - 85 parts, Glass powder 0.5 - 5 parts; The selected photosensitive resin is composed of an alkali-soluble epoxy acrylate resin and an alkali-soluble polyurethane acrylate resin mixed in a ratio of 10:2 - 6 parts by weight.

[0005] The further improved technical solution in the above technical solution is as follows: 1. In the above solution, the photoinitiator is at least one of (2,4,6-trimethylbenzoyl) diphenylphosphine oxide, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxycyclohexyl phenyl ketone, and 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone.

[0006] 2. In the above solution, the antioxidant is at least one of tetra (methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate) methane, 2,4-dimethyl-6-(1-methylpentadecyl) -phenol, N,N'-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionyl) hexanediamine, and 2,6-di-tert-butyl-p-cresol.

[0007] 3. In the above solution, the defoamer is at least one of alcohol defoamers, phosphate ester defoamers, silicone defoamers, fluorine-containing defoamers, and polyether defoamers.

[0008] 4. In the above solution, the leveling agent is at least one of alkylbenzene leveling agents, polyether-modified silicone leveling agents, polyacrylate leveling agents, and silicone leveling agents.

[0009] 5. In the above solution, the dispersant is at least one of acrylate dispersants, organic phosphate dispersants, and polyether dispersants.

[0010] 6. In the above solution, the organic solvent is at least one of terpineol, dipentene, ethyl acetate, butyl acetate, diethylene glycol methyl ether acetate, and diethylene glycol ethyl ether acetate.

[0011] 7. In the above solution, the conductive filler is a mixture of silver powder and other metal powders. The other metal powders are at least one of gold powder, nickel powder, platinum powder, and palladium powder. The silver powder content exceeds 90%, and the total content of other metal powders is less than 10%.

[0012] 8. In the above solution, the glass powder is at least 5 of magnesium oxide, aluminum oxide, silicon dioxide, copper oxide, bismuth oxide, iron oxide, zinc oxide, calcium carbonate, manganese oxide, sodium carbonate, potassium carbonate, titanium dioxide, and barium oxide.

[0013] Due to the application of the above technical solutions, the present invention has the following advantages compared with the prior art: The present invention is applicable to high-temperature lithography silver paste with narrow line widths and pitches. It is composed of an alkali-soluble epoxy acrylate resin and an alkali-soluble polyurethane acrylate resin mixed in a weight ratio of 10:2 - 6 to form a photosensitive resin, 10 - 30 parts of ethoxylated 1,6-hexanediol diacrylate, and 0.5 - 1 part of 2-hydroxy-4-n-octyloxybenzophenone. Through the five steps of printing - baking - lithography - development - sintering, patterns that cannot be made by traditional printing methods can be produced, and the line width and pitch reach a high-density circuit of 20μm / 20μm. Detailed Embodiments

[0014] The present patent can be further clearly understood through the following specific examples given, but they do not limit the present patent.

[0015] Example 1: A high-temperature photolithography silver paste suitable for narrow line widths and pitches, used in the field of high-power LED packaging. Its component combination by weight is: 17.5 parts of organic carrier, 82 parts of conductive filler, and 0.5 part of glass powder; Organic carrier: 25 parts of photosensitive resin B (solid content 38%), 20 parts of ethoxylated 1,6-hexanediol diacrylate, 7 parts of photoinitiator, 0.3 part of antioxidant, 0.5 part of 2-hydroxy-4-n-octyloxybenzophenone, 1.5 parts of defoamer, 1.5 parts of leveling agent, 0.5 part of dispersant, and 43.7 parts of organic solvent.

[0016] The preparation method of the above organic carrier: Add 25 parts of photosensitive resin B (solid content 38%), 20 parts of ethoxylated 1,6-hexanediol diacrylate, 7 parts of photoinitiator phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 0.3 part of antioxidant 2,4-dimethyl-6-(1-methylpentadecyl)-phenol, 0.5 part of 2-hydroxy-4-n-octyloxybenzophenone, 1.5 parts of defoamer CI-735, 1.5 parts of leveling agent BYK-333, 0.5 part of dispersant BYK163, and 43.7 parts of organic solvent propylene glycol butyl ether to a dispersion tank, mix evenly by high-speed mixing, and stir at high speed for more than 10 h under heating conditions of 50°C - 60°C to obtain an organic carrier for the field of high-power LED packaging.

[0017] The main components of the conductive filler: 15 parts of No. 1 spherical silver powder with a particle size D50 < 800 nm; 20 parts of No. 2 spherical silver powder with a particle size D50 < 1000 nm; 65 parts of No. 3 silver powder, spherical-like, with a particle size D50 < 2000 nm.

[0018] The main components of the glass powder: 4 parts of alumina, 9.5 parts of silica, 0.5 part of calcium oxide, 4.2 parts of manganese dioxide, 0.3 part of iron oxide, 26.5 parts of copper oxide, and 55 parts of bismuth oxide.

[0019] The preparation method of the above glass powder: Mix all powders evenly and pour them into an alumina crucible. Place it in a muffle furnace and melt at 1100°C for 1 hour. Pour the molten liquid into deionized water for water quenching. After cooling, take out the glass and break it. After screening, ball milling, baking, and sanding, the particle size meets the usage requirements.

[0020] The preparation method of the above high-temperature photolithography photosensitive silver paste: Mix the organic carrier, conductive filler, and glass powder, and mix them evenly by high-speed centrifugation and three-roll grinding to obtain a high-temperature photolithography silver paste for the field of high-power LED packaging.

[0021] Example 2: A high-temperature photolithography silver paste suitable for narrow line widths and pitches, used in high-density circuits with narrow line widths and pitches, such as the field of thermal print heads. Its component combination by weight is: 26 parts of organic carrier, 72 parts of conductive filler, and 2 parts of glass powder; The main components of the organic carrier are: 25.5 parts of photosensitive resin A (solid content 45 parts), 5.5 parts of photosensitive resin B (solid content 38%), 17.5 parts of ethoxylated 1,6 - hexanediol diacrylate, 5.5 parts of photoinitiator, 0.5 part of antioxidant, 0.5 part of 2 - hydroxy - 4 - n - octyloxybenzophenone, 1.5 parts of defoamer, 1.5 parts of leveling agent, 0.5 part of dispersant, and 41.5 parts of organic solvent.

[0022] The preparation method of the above - mentioned organic carrier: Add 25.5 parts of photosensitive resin A (solid content 45%), 5.5 parts of photosensitive resin B (solid content 38%), 17.5 parts of ethoxylated 1,6 - hexanediol diacrylate, 5.5 parts of photoinitiator including 2 parts of (2,4,6 - trimethylbenzoyl) diphenyl oxide and 3.5 parts of phenylbis(2,4,6 - trimethylbenzoyl) phosphine oxide, 0.5 part of antioxidant 2,4 - dimethyl - 6 - (1 - methylpentadecyl) - phenol, 0.5 part of 2 - hydroxy - 4 - n - octyloxybenzophenone, 1.5 parts of defoamer BYK - 065, 1.5 parts of leveling agent BYK - 333, 0.5 part of dispersant BYK - 163, and 41.5 parts of organic solvent propylene glycol monobutyl ether into a dispersion tank, mix evenly by high - speed mixing, and stir at a high speed for more than 10 h under the heating condition of 50°C - 60°C to obtain an organic carrier for narrow line pitch high - density circuits.

[0023] The main components of the conductive filler are: 30 parts of No. 1 spherical silver powder with particle size D50 < 300 nm; 30 parts of No. 2 spherical silver powder with particle size D50 < 400 nm; 38.5 parts of No. 3 spherical silver powder with particle size D50 < 800 nm; 1.5 parts of platinum powder with particle size D50 < 100 nm.

[0024] The main components of the glass powder are: 45 parts of alumina, 33.5 parts of silica, 2.4 parts of copper oxide, 0.3 part of zinc oxide, 0.3 part of calcium oxide, and 18.5 parts of bismuth oxide.

[0025] The preparation method of the above - mentioned glass powder: Mix all the powders evenly and pour them into an alumina crucible, place it in a muffle furnace and melt at 1100°C for 1.2 hours, pour the molten liquid into deionized water for water quenching, take out the glass after cooling and break it, and after screening, ball milling, baking, and sanding, the particle size meets the use requirements.

[0026] The preparation method of the above - mentioned high - temperature photolithography photosensitive silver paste: Mix the organic carrier, conductive filler, and glass powder, and mix them evenly by high - speed centrifugation and three - roll grinding to obtain a high - temperature photolithography silver paste for narrow line pitch high - density circuits.

[0027] Example 3: A high - temperature photolithography silver paste applicable to narrow line width and pitch, used in the field of stacked inductors, and its component combination in parts by weight is: 20 parts of organic carrier, 78 parts of conductive filler, and 2 parts of glass powder; The main components of the organic carrier are: 22.5 parts of photosensitive resin A (solid content 45%), 7.5 parts of photosensitive resin A (solid content 38%), 13 parts of ethoxylated 1,6 - hexanediol diacrylate, 10 parts of photoinitiator, 0.5 part of antioxidant, 0.5 part of 2 - hydroxy - 4 - n - octyloxybenzophenone, 1.5 parts of defoamer, 1.5 parts of leveling agent, 0.5 part of dispersant, and 42.5 parts of organic solvent.

[0028] The preparation method of the above - mentioned organic carrier: 22.5 parts of photosensitive resin A (solid content 45%), 7.5 parts of photosensitive resin B (solid content 38%), 13 parts of dipentaerythritol hexaacrylate, 10 parts of photoinitiator including 2.5 parts of (2,4,6 - trimethylbenzoyl) diphenylphosphine oxide and 5 parts of 1 - [9 - ethyl - 6 - (2 - methylbenzoyl) - 9H - carbazol - 3 - yl] ethanone 1 - (O - acetoxime) and 2.5 parts of 2,2 - di - o - phenyl - 4,4,5,5 - tetraphenyl - 1,2 - bisimidazole, 0.5 part of antioxidant 2,4 - dimethyl - 6 - (1 - methylpentadecyl) - phenol, 0.5 part of 2 - hydroxy - 4 - n - octyloxybenzophenone, 1.5 parts of defoamer BYK - 065, 1.5 parts of leveling agent BYK - 333, 0.5 part of dispersant BYK - 163, 18 parts of organic solvent ethyl acetate are added to a dispersion tank, mixed evenly by high - speed mixing, and stirred at a high speed for more than 10 h under the heating condition of 50℃ - 60℃ to obtain an organic carrier for the field of laminated inductors.

[0029] The main components of the conductive filler are: 15 parts of No. 1 spherical silver powder with particle size D50 < 500 nm; 25 parts of No. 2 spherical silver powder with particle size D50 < 1500 nm; 38 parts of No. 3 amorphous silver powder with particle size D50 < 3000 nm.

[0030] The main components of the glass powder are: 1 part of magnesium oxide, 3 parts of sodium carbonate, 10 parts of aluminum oxide, 6.4 parts of copper oxide, 2.4 parts of zinc oxide, 5 parts of calcium oxide, 18.6 parts of potassium carbonate, 46.6 parts of silicon dioxide, 1.8 parts of barium oxide, and 5.2 parts of titanium dioxide The preparation method of the above - mentioned glass powder: After mixing all powders evenly, pour them into an alumina crucible, place it in a muffle furnace and melt at 1100℃ for 2 hours. Pour the molten liquid into deionized water for water quenching. After cooling, take out the glass and crush it. After screening, ball - milling, baking, and sand - grinding, the particle size meets the use requirements.

[0031] The preparation method of the above - mentioned high - temperature photolithography photosensitive silver paste: Mix the organic carrier, conductive filler, and glass powder, and mix them evenly by high - speed centrifugation and three - roll grinding to obtain a high - temperature photolithography silver paste for ferrite laminated inductors.

[0032] Bake in an environment of 60 - 120 °C for 5 - 15 min, cover with a mask for exposure, and the part irradiated by ultraviolet light will be cured. Spray and wash away the uncured part with 0.1 - 1% alkali solution to obtain the required graphic lines. Finally, perform sintering metallization to make a dense circuit with a line width and pitch of 20 / 20 μm.

[0033] Using the above high-temperature lithography silver paste applicable to narrow line widths and pitches, which is composed of an alkali-soluble epoxy acrylate resin and an alkali-soluble polyurethane acrylate resin mixed in a weight ratio of 10:2 - 6 to form a photosensitive resin, 10 - 30 parts of ethoxylated 1,6-hexanediol diacrylate, and 0.5 - 1 part of 2-hydroxy-4-n-octyloxybenzophenone, it is possible to produce patterns that cannot be made by traditional printing methods through five steps of printing - baking - lithography - development - sintering, and achieve a high-density circuit with a line width and pitch of 20 μm / 20 μm.

[0034] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and shall not be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit and essence of the present invention shall be covered within the protection scope of the present invention.

Claims

1. A high temperature photolithography silver paste suitable for narrow line width and line spacing, characterized in that: It is composed of the following components in parts by weight: 20~40 parts of photosensitive resin, 10-30 parts of ethoxylated 1,6-hexanediol diacrylate, Photoinitiator 5~15 parts, 0.5~1 part of antioxidant, 0.5~1 part of 2-hydroxy-4-n-octyloxybenzophenone, Defoaming agent 0.5~1.5 parts, 0.5~1.5 parts of leveling agent, Dispersant 0.5~1.5 parts, 5~20 parts of organic solvent, Conductive filler 60~85 parts, 0.5~5 parts of glass powder; The selected photosensitive resin is prepared by mixing alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin in a ratio of 10:2 to 6 parts by weight.

2. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The photoinitiator is at least one of (2,4,6-trimethylbenzoyl) diphenylphosphine oxide, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 1-hydroxycyclohexyl phenyl ketone, and 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl) butanone.

3. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The antioxidant is at least one of tetrakis(methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate)methane, 2,4-dimethyl-6-(1-methylpentadecyl)-phenol, N,N'-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)hexanediamine, and 2,6-di-tert-butyl-p-methylphenol.

4. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The defoamer is at least one of an alcohol defoamer, a phosphate defoamer, a silicone defoamer, a fluorine-containing defoamer, and a polyether defoamer.

5. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The leveling agent is at least one of an alkylbenzene leveling agent, a polyether-modified silicone oil leveling agent, a polyacrylic acid leveling agent, and an organosilicon leveling agent.

6. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The dispersant is at least one of an acrylate dispersant, an organic phosphoric acid dispersant, and a polyether dispersant.

7. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The organic solvent is at least one of terpineol, dioctyl terpine, ethyl acetate, butyl acetate, diethylene glycol methyl ether acetate, and diethylene glycol ethyl ether acetate.

8. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The conductive filler is a mixture of silver powder and other metal powders, the other metal powders are at least one of gold powder, nickel powder, platinum powder and palladium powder, the silver powder content exceeds 90%, and the total content of other metal powders is less than 10%.

9. The high temperature photolithography silver paste suitable for narrow line width and line spacing according to claim 1, characterized in that: The glass powder is at least five of magnesium oxide, aluminum oxide, silicon dioxide, copper oxide, bismuth oxide, iron oxide, zinc oxide, calcium carbonate, manganese oxide, sodium carbonate, potassium carbonate, titanium dioxide, and barium oxide.