Multi-level interactive modular system of micro-assembly production line

Abstract

The invention provides a multi-level interactive modular system of a micro-assembly production line, and belongs to the field of micro-assembly production lines of electronic information equipment. The system comprises a process splitting and matching module, a process module library, a process combination module and an inspection and test module, the multi-level interactive modular system for the micro-assembly production line of the electronic information equipment can be applied to flexible transformation of the production line of the electronic information equipment, and the flexible production requirement is met. The module splitting and reconstructing method for the micro-assembly production line can be used for production line design of micro-assembly related processes. A related module combination strategy and an interface design method ensure the normalization of the process and the interactivity and interoperability between the modules. Through the production process steps and operation procedures of the modular production line, the requirement for flexible construction of the production line is met, the production line remodeling and production efficiency is improved, and meanwhile the production line maintenance difficulty is reduced through the modular design.

Description

Technical Field

[0001] The present invention belongs to the field of micro-assembly production lines for electronic information equipment, and particularly relates to a multi-level interactive modular system for a micro-assembly production line. Background Art

[0002] The digital flexible assembly production line of electronic information equipment can significantly improve the automation, flexibility, and digital level of the production line of military electronic information equipment, greatly improve the manufacturing efficiency and synergy effect of military weapon equipment, and is a promising technology in current military technology characterized by informatization. This technology is an important part of the digital transformation of the military industry and is expected to be more widely applied in the national defense science and technology industry. However, there are still many deficiencies in the existing production system: the process flow of the electronic information flexible assembly production line is not standardized, the tool and equipment standards are not unified, the compatibility between production units is poor, the interoperability is low, and it is difficult to guarantee the product quality and production efficiency. Such a production system performs poorly under the condition of rapid changes in production requirements, and the overall coordination ability of electronic information equipment products cannot be guaranteed, affecting the overall combat readiness and response ability of national defense equipment.

[0003] Currently, for the relevant process flows, assembly sequences, and process flows of the micro-assembly production line for the digital, flexible, and intelligent transformation of electronic information equipment, they are based on the original production experience and have not been standardized and unified. Such a production line may be able to meet the current production needs of electronic information equipment, but it lacks flexibility and cannot meet the changing production needs. Moreover, there are differences in the line configuration methods, processing quality, equipment operation, and scale efficiency of different production lines, and it is difficult to maintain the consistency and high efficiency of the process, which poses certain challenges to operation management and standardized production. Summary of the Invention

[0004] To solve the above technical problems, the present invention designs a multi-level interactive modular system for a micro-assembly production line. First, a design method for a multi-level interactive modular micro-assembly production line is proposed, which modularly disassembles and reorganizes the general process of the micro-assembly production line of electronic information equipment, and standardizes and unifies the relevant data interfaces and line configuration problems. This system can be widely applied to the production line of electronic information equipment to ensure product quality and production efficiency, and the operation processes of each link of the modular production line can improve the flexibility of the production line while ensuring production efficiency, meeting the production of different electronic information equipment. The design method also has guiding significance for the process flow design and flexible transformation of the micro-assembly production line.

[0005] A multi-level interactive modular micro-assembly production line system for electronic information equipment proposed by the present invention is as follows:

[0006] The specific process of splitting and reconstructing the multi-level interactive modular combined micro-assembly production line is proposed. Based on this process design method, it is used for the flexible transformation of production lines for different types of sub-information equipment. An interactive modular system for multi-level micro-assembly production lines is invented. A general module library and a process module library for the micro-assembly production line are designed. The multi-level interactive modular micro-assembly production line constructed based on this system can call the required modules according to the production line during the production process, greatly improving the production line changeover efficiency and meeting the flexible production requirements. For module splitting and reconstruction, a module combination strategy and data interface design are added to ensure the reconfigurability and interoperability of the modules. The modular design and splitting and reconstruction methods of the micro-assembly production line are standardized.

[0007] The specific technical solution of the present invention is as follows:

[0008] An interactive modular system for multi-level micro-assembly production lines includes a process splitting and matching module, a process module library, a process combination module, an inspection and testing module; the process module library includes modules corresponding to each process step in the existing micro-assembly process flow, and each module includes the information characteristics of the process step where it is located; the process splitting and matching module splits the process flow to be reconstructed according to the process steps, clarifies the information characteristics of each process step, and corresponds the split process steps to the modules in the process module library one by one to obtain a process module group to be combined; the process combination module reconstructs the process module group to be combined according to the set rules to form a new process production line; the inspection and testing module makes a model assumption for the new process production line, conducts tests and verifications to ensure that all modules can work normally after being reconfigured and meet the production standards.

[0009] The information characteristics specifically include the name of the process operation, function, required equipment, process parameters, production requirements, and connection interface.

[0010] The process module library includes a general area module library and a process area module library;

[0011] The general area module library includes: a pressure control module library, a temperature control module library, an atmosphere control module library, a cleaning and cleaning module library, a quality inspection module library, a data acquisition and analysis module library; the modules in the general area module library are bundled with the modules in the process area module library according to the required process parameters;

[0012] The process area module library includes an epoxy die attach process area, an eutectic bonding process area, a reflow soldering process area, a flip chip bonding process area, a wire bonding area, and a hermetic sealing area; the modules in the process area module library are corresponded to the split process steps according to the process operation name or function to obtain a process module group to be combined.

[0013] The connection interfaces in the said information features include the physical form of the interfaces, electrical specifications, and logical interface standards;

[0014] Specifically, the interfaces between modules adopt standard communication protocols, and all modules use a consistent data format; the modules in the general area module library use a time synchronization protocol to maintain time consistency between modules;

[0015] The set rules in the said reconstruction according to set rules specifically include the temperature gradient principle, conventional assembly sequence, full-process inspection and protection principle, module redundancy design and area division principle;

[0016] Specifically, the temperature gradient principle sorts the modules in the process area module library in the order from high temperature to low temperature according to the process parameter of temperature;

[0017] The conventional assembly sequence is sorted in the order of the eutectic soldering process area, reflow soldering process area, flip-chip soldering process area, epoxy mounting process area, wire bonding area, and sealing area;

[0018] The full-process inspection and protection principle; process operation inspection or quality inspection modules must be inserted between the full-process technologies composed of module reconstruction. After all the process flows are completed, electrical performance testing is carried out;

[0019] The module redundancy design and area division principle; additional spare modules or devices are added; when a certain module is occupied, the spare module is used to complete the current task; at the same time, the production line is divided into respective areas according to different processes. In the case of multi-task parallel production, when a certain soldering process module needs to be used at a certain moment and one module is occupied, another spare module is activated for the production line.

[0020] The multi-level interactive modular system of the electronic information equipment micro-assembly production line provided by the present invention can be applied to the flexible transformation of the electronic information equipment production line to meet the flexible production requirements. The module splitting and reconstruction method for the micro-assembly production line can be used for the production line design of related micro-assembly processes. The related module combination strategy and interface design method ensure the standardization of the process, the interactivity and interoperability between modules. Through the production process steps and operation processes of the modular production line, the needs of the flexible construction of the production line are met, the efficiency of production line changeover and production is improved, and at the same time, the modular design reduces the difficulty of production line maintenance. Brief Description of the Drawings

[0021] Figure 1 It is the splitting and reconstruction flow chart for the hierarchical interactive modular combined production line design method;

[0022] Figure 2 It is the area division and module library distribution diagram of the micro-assembly production line. Detailed Embodiment

[0023] To better understand the purpose, structure, and function of the present invention, the following further describes in detail a design method for a multi-level interactive modular micro-assembly production line of an electronic information device of the present invention in conjunction with the accompanying drawings.

[0024] Micro-assembly refers to assembling integrated circuit chips, chip components, and various micro-components that make up an electronic circuit on a high-density substrate using surface mount and interconnection processes, and encapsulating them in the same housing to form a high-density, high-speed, and highly reliable advanced microelectronic component. The production line process covers a variety of welding and assembly technologies. To achieve production flexibility and compatibility and interoperability between devices, the present invention designs a multi-level interactive modular system. This system splits the production process into modules with independent operation functions, and each module, as the basic unit of production, can operate independently. In addition, a module combination strategy and a design method for data interfaces are proposed. The module combination strategy provides clear combination specifications for reconfiguration and defines the relative priorities of each module. The data interface design method sets a unified interface standard, including input, output, and control signals, to ensure compatibility and seamless connection between different modules, thereby effectively reducing the integration difficulty.

[0025] A multi-level interactive modular system for a micro-assembly production line specifically includes a process module library, a process splitting and matching module, a process combination module, and an inspection and testing module; the process module library includes modules corresponding to each process step in the existing micro-assembly process flow, and each module includes the information characteristics of the process step it is in; the process splitting and matching module splits the process flow to be reconstructed according to the process steps, clarifies the information characteristics of each process step, and corresponds the split process steps to the modules in the process module library one by one to obtain a group of process modules to be combined; the process combination module reconstructs the group of process modules to be combined according to the set rules to form a new process production line; the inspection and testing module makes a model assumption for the new process production line, conducts tests and verifications to ensure that all modules can work properly after reconfiguration and meet the production standards. The information characteristics specifically include the name of the process operation, function, required equipment, process parameters, production requirements, and connection interfaces.

[0026] Specifically, as Figure 1 shown, the working process of a multi-level interactive modular system for a micro-assembly production line is specifically as follows:

[0027] Step 1: Determine the current process flow: First, input the current micro-assembly process flow, determine the specific functions, required equipment, process parameters, and production requirements of each process step, clarify the key process links that need to be modularized, and perform regional division according to the process characteristics to provide a basis for subsequent splitting.

[0028] Step 2: Divide process modules: The process splitting and matching module splits each process step into independent functional modules, such as the glue - sticking module, coating and dispensing module, welding module, post - welding cleaning module, inspection module, etc. Each module can operate independently, responsible for specific functions or steps. At the same time, it is convenient for re - configuration and combination in different production lines or processes;

[0029] Step 3: Module correspondence: Conduct a search and match in the system to correspond the process modules divided in Step 2 with the modules in the system module library;

[0030] Step 4: The process combination module recombines the modules obtained in Step 3 to form a new process production line;

[0031] Step 5: Before production, use the inspection and testing module to test and verify the newly combined production line to ensure that all modules can work properly after re - configuration and meet the production standards.

[0032] Step 6: Modular combination production line based on production requirements: According to the production task requirements, flexibly combine different modules to ensure smooth material flow, reduce change - over time and costs, so that the same production line can adapt to the production plans of multiple products.

[0033] Next, each module in this system will be elaborated in detail.

[0034] As Figure 2 shown, the module library in the system includes a general - area module library and a process - area module library.

[0035] The general - area module library includes: a pressure control module library, a temperature control module library, an atmosphere control module library, a cleaning and cleaning module library, a quality inspection module library, a data acquisition and analysis module library;

[0036] The function of the pressure control module library is to apply pressure to micro - assembly processing components, including but not limited to applying appropriate pressure during the epoxy glue curing process, welding and under - filling processes, and bonding processes. Ensure the bonding strength of components, welding or connection with the substrate. This module library includes a constant - pressure control module: real - time monitoring and adjustment of the pressure applied to components through a pressure sensor to ensure that the pressure remains constant throughout the processing; an adjustable - pressure module: flexibly adjust the pressure magnitude and duration according to process requirements. In specific implementation, clarify the pressure requirements in the process when splitting the current process flow. The system determines whether the constant - pressure control module or the adjustable - pressure module in this module library is required in the process according to specific process parameters such as pressure requirements. For example, constant pressure is suitable for stable processing. The adjustable - pressure module can be adjusted according to the size and material properties of the product, thereby reducing equipment adjustment time, having strong adaptability, and improving efficiency.

[0037] The function of the temperature control module library is to meet the temperature process parameter requirements during the processing, including but not limited to controlling the temperature in the reflow soldering furnace, the temperature during soldering and underfilling, the temperature during bonding, and the temperature during soldering and sealing.

[0038] Specifically, the temperature control module library includes:

[0039] Multi-zone reflow soldering furnace module: It can set multiple temperature zones and achieve precise control through gradual heating and cooling;

[0040] Single-zone hot plate module: Suitable for small-batch and experimental production, and can quickly adjust the temperature;

[0041] Precision temperature control module: Set precise temperature control curves according to different welding materials. Real-time monitor the temperature of the welding area and maintain a uniform temperature distribution;

[0042] Local heating module: Provide local heating solutions for welding processes that require local high temperatures;

[0043] Special heating module: Welding is carried out by resistance heating or laser heating;

[0044] Cooling module: Provide cooling after welding to avoid quality problems caused by overheating of materials.

[0045] In specific implementation, when splitting the current process flow, clarify the temperature requirements in the process. The process combination module combines the modules according to the temperature gradient principle, can be flexibly configured and adjusted according to different welding materials and process requirements, and supports a variety of welding application scenarios. The multi-zone and single-zone modules can be flexibly combined to adapt to different process requirements and production scales, and support different needs from small-batch experiments to large-batch production.

[0046] The function of the atmosphere control module library is to control the atmosphere conditions required during welding to ensure no oxidation during the welding process.

[0047] Specifically, this module library includes an inert gas protection module: Provide inert gases such as nitrogen and argon to prevent oxidation during welding; an atmosphere adjustment module: Can adjust the composition and flow rate of the gas according to the solder and process requirements.

[0048] In specific implementation, different gas protection schemes can be configured according to different process requirements.

[0049] The functions of the cleaning and cleaning module library include but are not limited to cleaning the components after welding to remove flux residues and other impurities, cleaning the surface of the workpieces to be welded before sealing to remove oxides, dirt and other contaminants, to ensure good welding effects.

[0050] Specifically, the module library includes an ultrasonic cleaning module: to remove tiny particulate residues after welding through ultrasonic waves. A chemical cleaning module: to remove the residual flux during the welding process using chemical solvents or specific cleaning agents. A physical cleaning module: to clean the surface through physical methods such as air flow and brushing to ensure the surface is pollution-free.

[0051] During specific implementation, it can be flexibly selected according to the type of residues after welding to ensure the appearance and quality of the product and to meet the requirements of different materials and welding processes.

[0052] The function of the quality inspection module library is to conduct quality inspections on components that have completed processes such as chip mounting, welding, and bonding to ensure the reliability of bonding, welding, and bonding points.

[0053] Specifically, this module library includes: a microscope inspection module: used for visual inspection of the epoxy adhesive bonding effect after chip mounting to identify appearance defects and poor bonding conditions. A vision inspection module: to automatically detect the quality of solder joints through an image processing system and identify welding defects. A function test module: to detect whether the electrical connections of components are normal, ensure that the electrical performance is not affected during the processing, and ensure no short circuits or open circuits. A mechanical strength test module: to test the mechanical strength after underfilling to ensure the durability of the product. A tensile test module: to conduct mechanical strength tests on solder joints to ensure the firmness of lead connections.

[0054] When establishing this module library, each module in the module library is bundled with the specific process flow, enabling it to automatically correspond to the specific module when combining the process flows, ensuring that there is corresponding quality inspection after the completion of the current process in the specific process flow and guaranteeing the product quality.

[0055] The function of the data acquisition and analysis module library is to monitor the key parameters during the processing in real time, conduct data acquisition and analysis, and optimize the process parameters.

[0056] This module library specifically includes: a sensor acquisition module, which records key process parameters such as temperature, atmosphere, and welding time; a data analysis and feedback module, which analyzes the data in real time and automatically adjusts the temperature zone and atmosphere parameters to improve the processing stability.

[0057] The intelligent data analysis and feedback module can promptly optimize the process, improving production efficiency and product consistency.

[0058] The process area module library divides the process areas based on the purpose of a multi-level reconfigurable production line design; the process area module library specifically includes an epoxy chip mounting process area, an eutectic soldering process area, a reflow soldering process area, a flip chip soldering process area, a wire bonding area, and a sealing area;

[0059] The function of the epoxy mounting process area is to mount bare chips and / or chip resistors and capacitors on a substrate using conductive or insulating epoxy resin glue, and to achieve physical connection between the chip (component) and the substrate by heating and curing the epoxy resin; according to the process steps, it is split into an epoxy glue preparation module library, a coating and dispensing module library, a component mounting module library, and a curing module library.

[0060] The function of the epoxy glue preparation module library is to prepare and process epoxy glue to ensure the consistency of its viscosity and composition; specifically, it includes a stirring and automatic proportioning module, corresponding to a vacuum degassing device, which has independent stirring and degassing modules and can adjust the stirring time and speed according to needs to ensure the uniformity of the epoxy glue. The automatic proportioning system can automatically proportion the components of the epoxy glue according to the requirements of different products, reducing human error. Specifically, when implementing, the components and characteristics of the epoxy glue can be quickly adjusted when switching products.

[0061] The process flow corresponding to the coating and dispensing module library is: evenly coat the epoxy glue on the surface of the chip carrier to ensure a stable bonding effect.

[0062] Specifically, this module library includes a dispensing machine module: suitable for small batch production and scenarios where precise control of the glue volume is required, and the module can flexibly adjust the position and speed of the dispensing head; a screen printing machine module: suitable for rapid coating during large batch production, and the module design supports the replacement of different types of screen plates to adapt to the glue patterns of different products. These two modules can be switched according to the production volume and product requirements to improve the versatility of the production line.

[0063] The process flow corresponding to the component mounting module library is to accurately place the components to be installed on the carrier coated with epoxy glue.

[0064] This module library includes an automatic chip mounter module: equipped with a vision recognition system that can identify the position of components and automatically mount them precisely, suitable for large-scale production; a manual operation workstation: for manual mounting in small batch or customized production, equipped with an auxiliary alignment device to ensure simple and precise operation. These two modules can be flexibly configured according to the complexity of the product and the production batch to improve the equipment utilization rate.

[0065] The process flow corresponding to the curing module library is to heat or irradiate the UV light on the mounted epoxy glue to complete its curing.

[0066] This module includes: a thermal curing oven module: curing the epoxy glue by heating, and the temperature and time can be adjusted to adapt to different types of epoxy glue materials. The UV curing module: used for epoxy glue that can be quickly cured under ultraviolet light irradiation, which can quickly complete the curing process and improve production efficiency. By configuring different curing modules, the curing requirements of different glues can be met, and at the same time, the production of different products can be quickly switched.

[0067] Eutectic soldering process area: Heat a binary or ternary alloy solder to no less than its eutectic temperature (i.e., the eutectic point) until it melts, and then cool it to directly solidify from the liquid eutectic alloy to form a solid eutectic alloy, achieving the soldering of components such as chips. According to the process steps, it is split into a soldering preparation module library and an eutectic soldering module library.

[0068] The function of the soldering preparation module library is to prepare for the soldering process, including cleaning the substrate and the chip, cutting the solder pads, preprocessing the soldering materials, etc. Specifically, it includes a solder cutting module: cutting the alloy solder pads according to the requirements of different chips. A solder preprocessing module: preheating the solder or removing the oxide layer.

[0069] The solder preprocessing module and the solder cutting module can operate independently, and can be quickly switched or combined according to production needs to adapt to different types of substrates and solders.

[0070] The function of the eutectic soldering module library is to form an alloy of two different metals in a certain weight ratio, and can achieve alloy soldering at a temperature far lower than their respective melting points. According to the soldering process characteristics of different products, it is divided into a vacuum reflow soldering module, a gold ball ultrasonic thermocompression soldering module, and a gold-tin alloy eutectic soldering module.

[0071] The vacuum reflow soldering module is suitable for soldering materials such as PbSn, pure Sn, SnAg, etc., provides a vacuum environment with a low oxygen concentration, reduces oxidation and improves the soldering quality.

[0072] The gold ball ultrasonic thermocompression soldering module is suitable for the soldering method using gold ball bonding, and realizes soldering through the combination of ultrasonic vibration and heating, especially suitable for precise and high-reliability soldering requirements.

[0073] The gold-tin alloy eutectic soldering module uses a gold-tin alloy for eutectic soldering, and quickly forms a firm connection by controlling the temperature in the range of 280 - 310°C. The mechanical strength and conductivity of the solder joints of this method are both excellent, suitable for the connection of high-end electronic devices.

[0074] The process flow corresponding to the reflow soldering process area is surface mounting of components on the substrate or soldering the substrate in the housing base. This process is divided into a solder paste preparation module library and a component placement module library.

[0075] The function of the solder paste preparation module library is to prepare the solder paste to ensure the consistency of its viscosity and composition. It includes a solder paste stirring module: automatically stirring the solder paste to ensure uniformity, suitable for large-scale production. A dispensing device module: precisely controlling the dispensing amount of the solder paste according to product requirements to reduce errors. The solder paste stirring and dispensing modules can operate independently, facilitating the quick adjustment of the usage amount and composition of the solder paste to adapt to different product requirements.

[0076] The function of the component placement module library is to accurately place components on the substrate coated with solder paste. Specifically, it includes an automatic pick-and-place machine module: equipped with a vision recognition system, it can automatically detect components and accurately place them on the solder paste, suitable for large-scale production; a manual placement module: a manual placement solution provided for small-batch or customized production, equipped with an auxiliary alignment device to ensure easy and accurate operation. The automatic and manual placement modules can be switched according to the production batch and complexity, improving production flexibility and efficiency.

[0077] The corresponding process flow of the flip-chip soldering process area is to place the chip face down, and through methods such as heating, pressurizing, and ultrasonic, the bumps pre-made on the chip electrodes or the solder pads on the substrate are deformed (or melted and collapsed) to achieve the corresponding interconnection soldering between the chip electrodes and the substrate solder pads. It is split and reconstructed into a chip electrode preparation module library, an alignment and soldering module library, and an underfill module library.

[0078] The function of the chip electrode preparation module library is to preprocess the chip electrodes, including making a metal transition layer and bumps, to ensure the reliability and stability of soldering. Specifically, it includes a metal transition layer making module: plating the surface of the chip electrodes to ensure good electrical connection. A bump making module: making bumps of appropriate size and material according to the chip requirements. These two sub-modules can operate independently to adapt to different chip specifications and electrode design requirements.

[0079] The process flow corresponding to the alignment and soldering module library is to place the electrode surface of the chip face down, align it with the substrate and perform soldering to achieve the electrical connection between the chip and the substrate. Specifically, it includes a vision alignment module: using a high-precision vision recognition system to accurately align the chip and the substrate. A soldering equipment module: controlling the temperature, time, and pressure of soldering to ensure the reliability of soldering. The alignment module and the soldering equipment can be configured separately to adapt to different process requirements and product specifications, improving production flexibility.

[0080] The module function of the underfill module library is to use underfill materials to fill the gap between the chip and the substrate after flip-chip soldering is completed, improving mechanical strength and heat dissipation performance, and being able to flexibly adjust the material type and application method to adapt to different chip and substrate combinations. Specifically, it includes an underfill material preparation module: selecting a suitable underfill material according to product requirements and performing preprocessing. An underfill application module: controlling the filling speed and amount of the material, and filling the material into the gap between the chip and the substrate through capillary action.

[0081] The function of the wire bonding area is to attach the two ends of an extremely fine metal wire to the chip, substrate, or housing leads respectively, thereby forming an electrical connection between them. According to the process steps, it is split into a wire preparation module library, an inner and outer wire bonding module library, and a capillary and soldering head control module library.

[0082] The function of the lead preparation module library is to prepare metal leads (such as aluminum wires, gold wires), ensure that the quality and dimensions of the leads meet the requirements, and can be independently adjusted and configured to adapt to different product specifications and welding requirements. Specifically, it includes a lead material selection module: selecting appropriate lead materials according to product requirements, such as aluminum wires, gold wires or other alloys. A lead length and thickness adjustment module: adjusting the length and thickness of the leads according to the welding process requirements.

[0083] The function of the inner lead and outer lead bonding module library is to interconnect the leads of the chip, substrate and housing to achieve electrical connection, and can be used independently or jointly operated according to product requirements, with high flexibility. Specifically, it includes an inner lead bonding module: first making an electrical connection between the chip and the substrate to ensure the stability of the welding points. An outer lead bonding module: then connecting the housing pins and the substrate to complete the construction of the external electrical interface.

[0084] The function of the capillary and soldering head control module library is to control the capillary or soldering head used in the lead bonding process to ensure the correct placement and welding of the leads, and can be flexibly configured according to different welding materials and lead types. Specifically, it includes a capillary pressure adjustment module: adjusting the pressure applied by the capillary to ensure the stable connection of the leads. A soldering head temperature control module: controlling the temperature of the soldering head to adapt to the fusion requirements of different materials.

[0085] The sealing area seals the electronic components in the protective housing by using methods such as welding, laser welding or seam welding to ensure its reliability and durability in various environments. This process step is split into: a welding equipment module area, electrodes, and a beam control module area.

[0086] The function of the welding equipment module area is to provide equipment for seam welding or laser welding to achieve high-quality sealing connections. According to the specific requirements of the product, different welding equipment can be flexibly selected to adapt to various sealing needs. Specifically, it includes a seam welding machine module: used for the seam welding process, which can provide uniform current pulses and appropriate electrode pressure. A laser welding machine module: suitable for the precisely controlled laser welding process, and can perform high-precision welding through a focused beam.

[0087] The function of the electrode / beam control module area is to control the movement of the electrodes for seam welding or the beam path for laser welding to ensure the consistency of welding; different operation modes can be flexibly configured to adapt to various processes such as seam welding and laser welding. Specifically, it includes an electrode movement control module: controlling the movement rate, pressure and pulse intensity of the electrodes to ensure smooth welding; a laser beam adjustment module: adjusting the focal length, power and movement path of the laser beam according to the welding requirements to achieve precise welding.

[0088] When the process combination module of the system reconstructs the process flow, it follows certain technical principles and is designed according to interactivity and interoperability to meet flexible production. It is specifically implemented according to the following strategies:

[0089] Temperature gradient principle; the arrangement of modules related to welding should be carried out in the order from high temperature to low temperature. This means that in the production process, high-temperature welding processes (such as eutectic soldering) should be completed first, and then low-temperature processes (such as die bonding and wire bonding) should be carried out step by step, and finally sealing. During specific implementation, process parameters such as temperature should be extracted and recorded when splitting the process flow to ensure error-free matching with the module library modules in the subsequent process flow.

[0090] Conventional assembly sequence; the process of the micro-assembly production line should meet the conventional assembly sequence: eutectic soldering → reflow soldering (surface mounting) → flip chip bonding → epoxy mounting (die bonding) → wire bonding (including internal and external leads) → sealing, corresponding to the eutectic soldering process area, reflow soldering process area, flip chip bonding process area, epoxy mounting process area, wire bonding area, and sealing area in the process area module library. For wire bonding, internal wire bonding must be carried out first and then external wire bonding. During specific implementation, the process combination module sorts the specific process flow according to the above conventional assembly sequence, and one or more other process area modules can be inserted into each process.

[0091] Full-process inspection and protection principle; process inspection or quality inspection modules must be inserted between the full-process technologies composed of module reconstruction, and corresponding protection measures must be ensured. After all the process flows are completed, electrical performance tests should be carried out to verify the functions and performance of the products. During specific implementation, since the modules in the quality inspection module library have been bundled with specific process flows, a quality inspection module library will definitely be allocated after the corresponding process flow; the process combination module will allocate process inspection modules to the process modules that have not been bundled with the quality inspection module library to ensure that defective products do not circulate between all process flows.

[0092] Module redundancy design and area division principle; Considering that some general modules may be occupied and unavailable for calling during multi-task production, the system design performs redundancy design on modules with high calling frequencies during system design. That is, additional standby modules or devices are added. When a certain module is occupied, the standby module can be used to complete the current task. At the same time, the production line is divided into respective areas according to different processes, such as eutectic soldering area, reflow soldering area, flip-chip soldering area, wire bonding area, sealing area, etc. Each area contains a corresponding process-level module library. The area division principle is based on setting up the module library for areas with high usage frequencies or dedicated modules. For example, in the case of multi-task parallel production, a certain soldering process module is required at a certain moment. When one module is occupied, another standby module can be activated for the production line. This can effectively reduce the waiting time of downstream modules in production and improve equipment utilization rate.

[0093] To make the split modules have reconfigurability and at the same time meet the interactivity and reconfigurability between modules, we followed some specific principles when designing the data interfaces of the split modules to ensure that each module can exchange information and control instructions efficiently and safely.

[0094] The interfaces between modules adopt standard communication protocols (such as Modbus, EtherCAT, CAN, RS485, etc.) to ensure that data can be exchanged between modules under the same protocol.

[0095] Each module follows a unified data interface specification, including the physical form of the interface (such as USB, RJ45, optical fiber), electrical specifications (such as voltage, current), and logical interface standards (such as signal timing, data format). There is no need for a complex conversion process when different modules are connected. All modules use a consistent data format, define standard data frame formats and communication protocols, such as defining the start bit, end bit, check code, etc. of the data packet to ensure the integrity of data during transmission.

[0096] The interfaces between modules have compatibility and scalability. During design, redundant interfaces and standby channels are reserved to facilitate adding new modules or functions in the future without having to redesign the entire interface system. At the same time, it has an adaptive ability and can automatically identify and adjust the communication method according to the type of module and the configuration of the production line. When a new module is connected, the system can automatically detect the module and perform data configuration.

[0097] For some modules with high real-time requirements that require synchronous operations (such as temperature control and pressure control), time synchronization protocols (such as NTP, PTP) are used to maintain the time consistency of all modules to ensure synchronous operations of the process flow.

[0098] Through the module splitting and reconstruction process of this method, the related processing technologies of the micro-assembly production line are further modularized. The data interface design meets the reconfigurability of the production line and the interoperability between modules, and the module combination strategy ensures the rationality of the process flow. These interactive modules are hierarchically differentiated, enhancing the flexibility of the micro-assembly production line and meeting the production requirements of different products. For example, when manufacturing integrated circuit chips that require high-density packaging, flip-chip soldering is needed and then sealing is carried out. Sub-modules from the chip electrode preparation module library, alignment and soldering module library, and underfill module library can be selected from the module library according to the product characteristics to form a new flip-chip soldering processing unit. The sealing process can also be used to form a new unit by selecting modules in the same way. General modules are inserted in the middle to ensure process parameters and quality inspection. After flip-chip soldering, it directly enters the sealing module, reducing the steps of transportation and reprocessing, and improving production efficiency and product reliability. For a production line that needs to flexibly handle mass standardized production and small-batch customized production, different module combinations can be quickly replaced at the end of the production line to adapt to the rapid switch from mass production to customized production, reducing the equipment idle time. Flexible module combinations can also enable the production line to be adjusted according to product types and performance requirements, supporting the manufacturing of diverse products.

[0099] It can be understood that the present invention is described through some embodiments. Those skilled in the art know that without departing from the spirit and scope of the present invention, various changes or equivalent replacements can be made to these features and embodiments. Additionally, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the scope protected by the present invention.

Claims

1. A multi-level interactive modular system for a micro-assembly production line, characterized in that: Including process splitting and matching module, process module library, process combination module, inspection and testing module; Specifically, the process module library includes modules corresponding to each process step in the existing micro-assembly process flow, and each module includes information features of the process step; The process splitting and matching module splits the process flow to be reconstructed according to process steps, clarifies the information characteristics of each process step, and matches the split process steps with the modules of the process module library one by one to obtain the process module group to be combined; The process combination module reconstructs the process module group to be combined according to the set rules to form a new process production line; The inspection and testing module models, assumes, tests and verifies the new process production line to ensure that all modules can work normally and meet production standards after reconfiguration.

2. A multi-level interactive modular system for a micro-assembly production line according to claim 1, characterized in that: The information characteristics specifically include the name of the process step, function, required equipment, process parameters, production requirements, and connection interface.

3. A multi-level interactive modular system for a micro-assembly production line according to claim 2, characterized in that: The process module library includes a general area module library and a process area module library; The general area module library includes: a pressure control module library, a temperature control module library, an atmosphere control module library, a cleaning module library, a quality inspection module library, and a data acquisition and analysis module library; The modules in the general area module library and the modules in the process area module library are bundled according to the required process parameters; The process area module library includes an epoxy mounting process area, a eutectic welding process area, a reflow soldering process area, a flip chip welding process area, a wire bonding area, and a sealing area; the modules of the process area module library correspond to the split process steps according to the process procedure name or function to obtain a process module group to be combined.

4. A multi-level interactive modular system for a micro-assembly production line according to claim 3, characterized in that: The connection interface in the information feature includes the physical form, electrical specifications and logical interface standards of the interface; Specifically, the interfaces between modules use standard communication protocols, and all modules use consistent data formats; the modules in the general area module library use a time synchronization protocol to maintain time consistency between modules.

5. A multi-level interactive modular system for a micro-assembly production line according to claim 4, characterized in that: The setting rules in the reconstruction according to the setting rules specifically include the temperature gradient principle, the conventional assembly sequence, the whole process inspection and protection principle, the module redundancy design and the area division principle; Specifically, the temperature gradient principle sorts the modules in the process area module library from high temperature to low temperature according to the process parameter of temperature; The conventional assembly sequence is arranged in the order of eutectic soldering process area, reflow soldering process area, flip chip soldering process area, epoxy mounting process area, wire bonding area, and sealing area; The principle of full-process inspection and protection: the process inspection or quality inspection module must be inserted between the full-process processes composed of module reconstruction, and the electrical performance test shall be carried out after all process flows are completed; Module redundancy design and regional division principles; adding spare modules or equipment; When a module is occupied, the spare module is used to complete the current task; at the same time, the production line is divided into respective areas according to different processes. In the case of multi-task parallel production, a certain welding process module is needed at a certain moment. When a module is occupied, another spare module is activated for the production line.

6. A multi-level interactive modular system for a micro-assembly production line according to claim 5, characterized in that: The pressure control module library has the function of applying pressure to the micro-assembly processing parts, including a constant pressure control module and an adjustable pressure module; The function of the temperature control module library is to meet the temperature process parameter requirements during the processing, including multi-temperature zone reflow soldering furnace module, single temperature zone hot plate module: suitable for small batch and experimental production, can quickly adjust the temperature, precision temperature control module, local heating module, special heating module, cooling module; The function of the atmosphere control module library is to control the atmosphere conditions required during the welding process, including an inert gas protection module and an atmosphere adjustment module; The functions of the cleaning module library include but are not limited to cleaning components after welding, removing flux residues and other impurities, cleaning the surface of welded parts before sealing, removing oxides, dirt and other contaminants; Including ultrasonic cleaning module and physical cleaning module; The quality inspection module library performs quality inspection on components that have completed the processes of mounting, welding, bonding, etc.; including a microscope inspection module, which is used after the epoxy adhesive bonding process; a visual inspection module, which is used after the welding process; a functional test module, which is used for electrical connection inspection; and a mechanical strength test module, which is used after the filling process. Tensile test module, used after welding process; The data acquisition and analysis module library includes: a sensor acquisition module, which collects and records the process parameters distributed on the production line; Data analysis and feedback module, real-time data analysis, automatic adjustment of temperature zone and atmosphere parameters.

7. A multi-level interactive modular system for a micro-assembly production line according to claim 6, characterized in that: The epoxy mounting process area is divided into an epoxy glue preparation module library, a coating and dispensing module library, a component mounting module library, and a curing module library according to the process steps; The epoxy adhesive preparation module library includes stirring and automatic proportioning modules, corresponding to the vacuum defoaming equipment. The vacuum defoaming equipment has independent stirring and defoaming modules, and the stirring time and speed can be adjusted according to needs; The coating and dispensing module library includes dispensing machine modules and screen printing machine modules, which are allocated according to production batch size and product requirements; The component placement module library includes automatic placement machine modules and manual operation workstations, which are configured according to the complexity of the product and the production batch; The curing module library includes heat curing box module and UV curing module, which are configured according to the curing requirements of different glues; The eutectic welding process area is divided into welding preparation module library and eutectic welding module library according to the process steps; The welding preparation module library includes solder cutting module and solder pretreatment module; The eutectic welding module library includes vacuum reflow welding module, gold ball ultrasonic hot pressing welding module and gold-tin alloy eutectic welding module; it is configured according to the welding process characteristics of different products; The reflow process area includes a solder paste preparation module library and a component placement module library; The solder paste preparation module library includes solder paste stirring module and dispensing device module; it can be configured according to product requirements; The component placement module library includes automatic placement machine modules and manual placement modules, which are configured according to production batch and complexity; The flip chip process area includes the chip electrode preparation module library, the alignment and welding module library, and the underfill module library; The chip electrode preparation module library includes a metal transition layer production module and a bump production module configured according to different chip specifications and electrode design requirements; The alignment and welding module library includes visual alignment module and welding equipment module, which are configured according to process requirements and product specifications; The lower filling module library includes a lower filling material preparation module and a lower filling application module; they are configured in sequence; The wire bonding area includes a wire preparation module library, an inner lead and outer lead bonding module library, and a splitter and welding head control module library; The lead preparation module library includes a lead material selection module, a lead length and thickness adjustment module; configured in sequence; The inner lead and outer lead bonding module library includes an inner lead bonding module and an outer lead bonding module, and is configured in an inner-outer order; The splitter and welding head control module library includes splitter pressure adjustment module and welding head temperature control module; they are configured according to different welding materials and lead types; The sealing area includes welding equipment module library and electrode / beam control module library; The welding equipment module library includes parallel seam welding machine module and laser welding machine module; they are configured according to sealing requirements; The electrode / beam control module library includes electrode movement control module and laser beam adjustment module; they are configured according to welding requirements.

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