Computer CPU protection device with overheating protection function

Abstract

The invention relates to the technical field of computers, and discloses a computer CPU protection device with overheating protection, which comprises a chip, the chip further comprises an overheating protection device, the overheating protection device comprises a heat dissipation structure and a mounting structure, the heat dissipation structure comprises a heat conductor, a condenser pipe and a radiator, the heat conductor is arranged above the chip, the condenser pipe is arranged above the heat conductor, and the radiator is arranged above the heat conductor. The condenser pipe is fixedly connected to the outer side of the heat conductor, the radiator is fixedly connected to the rear side of the condenser pipe, the mounting structure comprises a sleeve shell, a base, an arc-shaped insertion plate and an arc-shaped clamping plate, the sleeve shell is fixedly connected to the bottom of the surface of the heat conductor, and the base is connected to the inner side of the sleeve shell in a sleeving mode. According to the heat conduction device, more convenient operation is provided for a user, the user can check the heat conduction device conveniently, so that the situation that the heat conduction device has problems is reduced, the service life is prolonged, the chip can be protected, and the use cost is also saved.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and particularly to a computer CPU protection device with overheat protection. Background Art

[0002] The CPU, short for Central Processing Unit, is a very large-scale integrated circuit and also the operation and control center of a computer. It is the central nerve of the computer, and its main function is to analyze computer instructions and process data in computer software. The performance of a computer is determined by the performance of the central processing unit. Existing CPUs lack protection devices, have poor heat dissipation effects, and cannot provide overheat protection, which can lead to a reduction in the working efficiency of the CPU or even damage.

[0003] The invention patent with the patent number CN202121559278.4 discloses a computer CPU protection device. The intermittent meshing of the motor-driven incomplete gear and the sawteeth on the rectangular rod in this invention realizes the reciprocating movement of the rectangular rod, and then drives the reciprocating swing of the fan by pulling the rotating rod in the extension sleeve, so as to dissipate heat from the CPU in all directions, avoid high-load operation of the CPU, and improve the service life of the CPU at the same time. The detachable dust-proof cover can effectively prevent dust from adhering to the surface of the CPU, ensure the working efficiency of the CPU, and at the same time clean the dust on the dust-proof cover regularly by disassembling the dust-proof cover. Although this patent solves the above problems, there are still problems such as insufficient heat dissipation effect and troublesome installation and disassembly of the heat dissipation device. Therefore, it is necessary to design a computer CPU protection device with overheat protection that can both protect the chip and save the usage cost. Summary of the Invention

[0004] The purpose of the present invention is to provide a computer CPU protection device with overheat protection to solve the problems raised in the above background art.

[0005] To solve the above technical problems, the present invention provides the following technical solution: A computer CPU protection device with overheat protection, including a chip, the chip further includes an overheat protection device, the overheat protection device includes a heat dissipation structure and an installation structure, the heat dissipation structure includes a heat conductor, a condensation pipe, and a radiator, the heat conductor is arranged above the chip, the condensation pipe is fixedly connected to the outside of the heat conductor, the radiator is fixedly connected to the rear side of the condensation pipe, the installation structure includes a sleeve, a base, an arc-shaped insertion plate, and an arc-shaped clamping plate, the sleeve is fixedly connected to the bottom surface of the heat conductor, the base is sleeved inside the sleeve, the arc-shaped insertion plate is fixedly connected to the inner wall of the sleeve, the arc-shaped clamping plate is fixedly connected to the inner wall of the base, the bottom surface of the arc-shaped insertion plate is slidably connected to the bottom surface of the arc-shaped clamping plate, a notch is opened at the bottom of the base, a temperature sensor is arranged inside the base, when the temperature sensor in the base detects that the temperature of the chip is abnormal, it transmits data to the main board and increases the power transmitted to the radiator. At this time, the heat of the chip is absorbed by the heat conductor, and the heat in the heat conductor is absorbed by the condensed water again. The condensed water flows into the radiator through the condensation pipe, and the heat is dissipated into the external air through the radiator, so that the heat in the condensed water is dissipated, and the condensed water flows back into the heat conductor through the condensation pipe again for cyclic heat dissipation, avoiding damage to the chip due to excessive temperature. Sleeve the sleeve above the base and rotate the sleeve counterclockwise. The sleeve drives the arc-shaped insertion plate to rotate counterclockwise, so that the arc-shaped insertion plate is inserted into the bottom of the arc-shaped clamping plate, so that the sleeve is fixed, and then the heat conductor is installed on the base. Conversely, the heat conductor can be quickly disassembled. When it is necessary to check the heat conductor or replace the condensed water, it provides a more convenient operation for the user, facilitating the user's inspection, thereby reducing the occurrence of problems with the heat conductor, and further increasing the service life, that is, it can protect the chip and also save the use cost.

[0006] According to the above technical solution, a dehumidification device is provided on the left side of the base. The dehumidification device includes a ventilation structure and a pressurization structure. The ventilation structure includes a transfer chamber, a first impeller, a fan, and an air outlet pipe. The transfer chamber is fixedly connected below the condenser tube. The first impeller is hingedly connected inside the transfer chamber. The fan is fixedly connected to the right side of the first impeller. The air outlet pipe is fixedly connected inside the base. The pressurization structure includes a partition plate, a pressurization chamber pipe, a connecting shaft, and an arc-shaped guide plate. The partition plate is fixedly connected inside the transfer chamber. The pressurization chamber pipe is fixedly connected to the right side of the transfer chamber. The connecting shaft is fixedly connected inside the pressurization chamber pipe. The arc-shaped guide plate is fixedly connected to the surface of the connecting shaft. The pressurization chamber pipe is fixedly connected to the left side of the base. The fan rotates through the inside of the partition plate. A dehumidifying agent is provided inside the base. After the condensed water enters the transfer chamber, the water pressure drives the first impeller to rotate. The first impeller drives the fan to rotate to generate an air flow. The air flow is blown into the base through the air outlet pipe, accelerating the air flow around the chip, enabling the moisture in the air to be quickly absorbed by the dehumidifying agent provided inside the base. After the air flow flows from the transfer chamber into the pressurization chamber pipe, it contacts the arc surface between the arc-shaped guide plates to generate a vortex, thereby aggregating the air flow. The aggregation of the air flow leads to an increase in density. The increase in density leads to an increase in air pressure. After the air pressure increases, the air flow in the base becomes faster, further improving the absorption efficiency of the dehumidifying agent and thus enhancing the dehumidification efficiency.

[0007] According to the above technical solution, a dust removal device is provided above the air outlet pipe. The dust removal device includes an adsorption structure and a pushing structure. The adsorption structure includes a placement cylinder, a filter screen, and a transmission housing. The placement cylinder is arranged above the chip. The filter screen is fixedly connected to the bottom of the placement cylinder. The transmission housing is fixedly connected above the placement cylinder. The pushing structure includes a semi-circular guide plate, an air inlet pipe, a second impeller, and a push plate. The semi-circular guide plate is fixedly connected to the inner side of the air outlet pipe. The air inlet pipe is fixedly connected above the air outlet pipe. The second impeller is rotatably connected to the inner side of the transmission housing. The push plate is fixedly connected below the second impeller. The transmission housing is fixedly connected below the heat conductor. The second impeller rotates through to the top end of the placement cylinder. Activated carbon is placed inside the placement cylinder. The air inlet pipe is fixedly connected to the bottom end of the transmission housing. The activated carbon placed in the placement cylinder adsorbs the dust around the chip inside the base. The dust enters the placement cylinder through the filter screen and is absorbed by the activated carbon, reducing the dust inside the base and avoiding excessive dust attaching to the chip and reducing the working efficiency of the chip. After the air flow enters the air inlet pipe, part of it is blocked by the semi-circular guide plate and flows upward along the inclined surface of the semi-circular guide plate into the air inlet pipe, and then flows into the transmission housing. The air flow flows into the included angle of the second impeller. Since the second impeller fits tightly with the upper and lower ends of the transmission housing without gaps, when the air flow fills the included angle of the second impeller, air pressure is generated, thereby driving the second impeller to rotate. The second impeller drives the push plate to rotate, and the push plate pushes the activated carbon in the placement cylinder to roll. When the activated carbon rolls, the contact area with the air increases, and it can more effectively absorb the dust in the air, thereby further improving the dust removal efficiency.

[0008] According to the above technical solution, a fixing device is provided under the filter, and the fixing device includes a limiting structure and a self-locking structure. The limiting structure includes a connecting seat, a socket, and a slot. The connecting seat is fixedly connected under the chip, the socket is fixedly connected to the inner side of the base, and the slot is opened on the inner side of the socket. The self-locking structure includes a groove, a telescopic groove, a fan-shaped latch, and a telescopic spring. The groove is opened on both sides of the connecting seat, the telescopic groove is opened on the inner side of the socket, the fan-shaped latch is slidably connected to the inner side of the telescopic groove, the telescopic spring is fixedly connected to one side of the fan-shaped latch, the telescopic spring is fixedly connected to the inner side of the telescopic groove, the connecting seat is slidably connected to the inner side of the slot, and the fan-shaped latch is movably connected to the inner side of the groove. The chip is pinched and the connecting seat is aligned with the slot in the socket and inserted into it, so that the chip is fixed to prevent shaking. At the same time, a notch is opened in the center of the connecting seat, and the chip passes through the groove The connector is connected to the pin port, and at the same time, the connector seat prevents the fluid from entering between the chip and the pin and causing the chip to break contact. After the connector seat is inserted into the slot, the connector seat contacts the arc surface of the fan-shaped pin. When the connector seat continues to slide down, the arc surface is squeezed to cause the fan-shaped pin to retract into the telescopic groove. When the connector seat is fully inserted into the slot, the grooves on both sides are aligned with the fan-shaped pin. At this time, the fan-shaped pin is not squeezed, and is pushed out of the telescopic groove by the telescopic spring. The pushed-out fan-shaped pin is inserted into and stuck between the connector seat and the socket, so that the connector seat is fixed, further improving the stability of the chip. After the connector seat is locked, there is still room for descending between the connector seat and the bottom surface of the socket. When the chip needs to be removed, just continue to press the connector seat downward, and the connector seat squeezes the fan-shaped pin to retract it into the telescopic groove again. At this time, the chip can be removed by bending the connector seat through the gap between the connector seat and the socket so that one side is tilted up. Disassembly and installation are very convenient.

[0009] Compared with the prior art, the beneficial effects achieved by the present invention are: The present invention is provided with a casing, a base, an arc-shaped plug plate, and an arc-shaped clamping plate. The casing drives the arc-shaped plug plate to rotate counterclockwise, so that the arc-shaped plug plate is inserted into the bottom of the arc-shaped clamping plate, so that the casing is fixed, and then the heat conductor is installed on the base. Otherwise, the heat conductor can be quickly disassembled. When the heat conductor needs to be inspected or condensed water needs to be replaced, a more convenient operation is provided to the user, and the inspection is convenient for the user, thereby reducing the situation where the heat conductor has problems, thereby prolonging the service life, that is, the chip can be protected, and the use cost is saved. The present invention is provided with a partition, a pressurizing cavity tube, a connecting shaft, and an arc-shaped guide plate. After the airflow flows from the transfer cavity into the pressurizing cavity tube, it contacts the arc surface of the arc-shaped guide plate to generate vortices, thereby converging the airflow. The converging of the airflow leads to an increase in density, and the increase in density leads to an increase in air pressure. After the air pressure is increased, the air in the base flows faster, thereby further improving the absorption efficiency of the dehumidifier, and further improving the dehumidification efficiency. The present invention is provided with a semicircular guide plate, an air inlet pipe, a second impeller, and a push plate. When the airflow fills the angle of the second impeller, air pressure is generated, thereby driving the second impeller to rotate. The second impeller drives the push plate to rotate. The push plate drives the activated carbon placed in the cylinder to roll. When the activated carbon rolls, the contact area with the air increases, and the dust in the air can be more effectively absorbed, thereby further improving the dust removal efficiency. The present invention is provided with grooves, telescopic grooves, fan-shaped latches and telescopic springs, so that there is still downward space between the connecting seat and the bottom surface of the socket after the connecting seat is locked. When the chip needs to be removed, the connecting seat is pressed downward, and the connecting seat squeezes the fan-shaped latch to retract it into the telescopic groove again. At this time, the chip can be removed by bending the connecting seat through the gap between the connecting seat and the socket so that one side of the connecting seat is tilted, and the removal and installation are very convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0011] In the attached picture: Figure 1 It is a schematic diagram of the overall structure of the regular triaxial plane of the present invention; Figure 2 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the present invention; Figure 3 It is a schematic diagram of the three-dimensional split structure of the front top section of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the positive triaxial section of the present invention; Figure 5 The present invention Figure 4 A is a schematic diagram of the enlarged structure of the middle part; Figure 6 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the present invention; Figure 7 The present invention Figure 6 A schematic diagram of the enlarged structure of B; Figure 8 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the present invention; In the figure: 1. Chip; 2. Overheat protection device; 21. Heat conductor; 22. Condensation pipe; 23. Radiator; 24. Sheath; 25. Base; 26. Arc-shaped insertion plate; 27. Arc-shaped clamping plate; 3. Dehumidification device; 31. Transfer cavity; 32. First impeller; 33. Fan; 34. Air outlet pipe; 35. Partition board; 36. Boosting cavity pipe; 37. Connecting shaft; 38. Arc-shaped deflector; 4. Dust removal device; 41. Placing cylinder; 42. Filter screen; 43. Transmission housing; 44. Semi-circular deflector; 45. Air inlet pipe; 46. Second impeller; 47. Pusher plate; 5. Fixing device; 51. Connecting seat; 52. Socket; 53. Slot; 54. Groove; 55. Telescopic groove; 56. Sector-shaped pin; 57. Telescopic spring. Detailed implementation manners

[0012] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0013] Please refer to Figures 1-3, an embodiment of the present invention is: a computer CPU protection device with overheat protection, including a chip 1. The chip 1 further includes an overheat protection device 2. The overheat protection device 2 includes a heat dissipation structure and a mounting structure. The heat dissipation structure includes a heat conductor 21, a condensation pipe 22, and a radiator 23. The heat conductor 21 is disposed above the chip 1. The condensation pipe 22 is fixedly connected to the outside of the heat conductor 21. The radiator 23 is fixedly connected to the rear side of the condensation pipe 22. When the temperature sensor in the base 25 detects abnormal temperature of the chip 1, it transmits data to the main board and increases the power supplied to the radiator 23. At this time, the heat of the chip 1 is absorbed by the heat conductor 21, and the heat in the heat conductor 21 is absorbed by the condensed water. The condensed water flows into the radiator 23 through the condensation pipe 22, and the heat is dissipated into the external air through the radiator 23, so that the heat in the condensed water is dissipated. The condensed water then flows back into the heat conductor 21 through the condensation pipe 22 for cyclic heat dissipation, avoiding damage to the chip 1 due to overheating. The mounting structure includes a housing 24, a base 25, an arc-shaped insertion plate 26, and an arc-shaped clamping plate 27. The housing 24 is fixedly connected to the bottom surface of the heat conductor 21. The base 25 is sleeved inside the housing 24. The arc-shaped insertion plate 26 is fixedly connected to the inner wall of the housing 24. The arc-shaped clamping plate 27 is fixedly connected to the inner wall of the base 25. The bottom surface of the arc-shaped insertion plate 26 is slidably connected to the bottom surface of the arc-shaped clamping plate 27. A notch is formed at the bottom of the base 25, and a temperature sensor is disposed inside the base 25. When the housing 24 is sleeved above the base 25 and the housing 24 is rotated counterclockwise, the housing 24 drives the arc-shaped insertion plate 26 to rotate counterclockwise, so that the arc-shaped insertion plate 26 is inserted into the bottom of the arc-shaped clamping plate 27, thereby fixing the housing 24, and further mounting the heat conductor 21 on the base 25. Conversely, the heat conductor 21 can be quickly disassembled. When it is necessary to check the heat conductor 21 or replace the condensed water, it provides a more convenient operation for the user, facilitating the user's inspection, thereby reducing the occurrence of problems with the heat conductor 21, and further improving the service life, that is, it can protect the chip 1 and also save the usage cost.

[0014] Working principle: When the temperature sensor inside the base 25 detects that the temperature of the chip 1 is abnormal, it transmits the data to the main board and increases the power transmitted to the radiator 23. At this time, the heat of the chip 1 is absorbed by the heat conductor 21, and the heat in the heat conductor 21 is absorbed by the condensed water. The condensed water flows into the radiator 23 through the condensate pipe 22, and the heat is dissipated into the external air through the radiator 23, so that the heat in the condensed water is dissipated. The condensed water then flows back into the heat conductor 21 through the condensate pipe 22 for cyclic heat dissipation, avoiding damage to the chip 1 due to overheating. Socket the housing 24 above the base 25 and rotate the housing 24 counterclockwise. The housing 24 drives the arc-shaped insertion plate 26 to rotate counterclockwise, so that the arc-shaped insertion plate 26 is inserted into the bottom of the arc-shaped clamping plate 27, thus fixing the housing 24, and further installing the heat conductor 21 on the base 25. Conversely, the heat conductor 21 can be quickly disassembled. When it is necessary to check the heat conductor 21 or replace the condensed water, it provides a more convenient operation for the user, facilitating the user's inspection, thus reducing the problems of the heat conductor 21 and further extending the service life, which can protect the chip 1 and save the usage cost.

[0015] Please refer to Figures 4-5 , on the basis of the above embodiments, in another embodiment of the present invention, it includes a dehumidifying device 3. The dehumidifying device 3 includes a ventilation structure and a pressurization structure. The ventilation structure includes a transfer chamber 31, a first impeller 32, a fan 33, and an air outlet pipe 34. The transfer chamber 31 is fixedly connected below the condensate pipe 22. The first impeller 32 is hingedly connected inside the transfer chamber 31. The fan 33 is fixedly connected to the right side of the first impeller 32. The air outlet pipe 34 is fixedly connected inside the base 25. After the condensed water enters the transfer chamber 31, the water pressure pushes the first impeller 32 to rotate. The first impeller 32 drives the fan 33 to rotate to generate an air flow. The air flow blows into the base 25 through the air outlet pipe 34, accelerating the air flow around the chip 1, enabling the moisture in the air to be quickly absorbed by the desiccant provided inside the base 25. The pressurization structure includes a partition plate 35, a pressurization chamber pipe 36, a connecting shaft 37, and an arc-shaped guide plate 38. The partition plate 35 is fixedly connected inside the transfer chamber 31. The pressurization chamber pipe 36 is fixedly connected to the right side of the transfer chamber 31. The connecting shaft 37 is fixedly connected inside the pressurization chamber pipe 36. The arc-shaped guide plate 38 is fixedly connected to the surface of the connecting shaft 37. The pressurization chamber pipe 36 is fixedly connected to the left side of the base 25. The fan 33 rotates through the inside of the partition plate 35. A desiccant is provided inside the base 25. When the air flow flows from the transfer chamber 31 into the pressurization chamber pipe 36 and contacts the arc surface between the arc-shaped guide plate 38 to generate a vortex, the air flow is aggregated. The aggregation of the air flow leads to an increase in density, and the increase in density leads to an increase in air pressure. After the air pressure increases, the air flow in the base 25 becomes faster, further improving the absorption efficiency of the desiccant and thus enhancing the dehumidification efficiency.

[0016] Working principle: After the condensed water enters the transfer cavity 31, the water pressure drives the first impeller 32 to rotate. The first impeller 32 drives the fan 33 to rotate to generate an air flow. The air flow is blown into the base 25 through the air outlet pipe 34, accelerating the air flow around the chip 1, enabling the moisture in the air to be quickly absorbed by the desiccant provided in the base 25. The air flow flows from the transfer cavity 31 into the pressure boosting cavity pipe 36 and contacts the arc surface between the arc-shaped guide plates 38 to generate a vortex, thereby aggregating the air flow. The aggregation of the air flow leads to an increase in density, the increase in density leads to an increase in air pressure, and after the air pressure increases, the air flow in the base 25 becomes faster, further improving the absorption efficiency of the desiccant and thus enhancing the dehumidification efficiency.

[0017] Please refer to Figures 6-8, on the basis of the above embodiments, in another embodiment of the present invention, it includes a dust removal device 4. The dust removal device 4 includes an adsorption structure and a pushing structure. The adsorption structure includes a placement cylinder 41, a filter screen 42, and a transmission housing 43. The placement cylinder 41 is arranged above the chip 1. The filter screen 42 is fixedly connected to the bottom of the placement cylinder 41. The transmission housing 43 is fixedly connected above the placement cylinder 41. The activated carbon placed in the placement cylinder 41 adsorbs the dust around the chip 1 inside the base 25. The dust enters the placement cylinder 41 through the filter screen 42 and is absorbed by the activated carbon, reducing the dust inside the base 25 and avoiding excessive dust attaching to the chip 1 and reducing the working efficiency of the chip 1. The pushing structure includes a semi-circular guide plate 44, an air inlet pipe 45, a second impeller 46, and a push plate 47. The semi-circular guide plate 44 is fixedly connected to the inside of the air outlet pipe 34. The air inlet pipe 45 is fixedly connected above the air outlet pipe 34. The second impeller 46 is rotatably connected to the inside of the transmission housing 43. The push plate 47 is fixedly connected below the second impeller 46. The transmission housing 43 is fixedly connected below the heat conductor 21. The second impeller 46 rotates through to the top of the placement cylinder 41. Activated carbon is placed inside the placement cylinder 41. The air inlet pipe 45 is fixedly connected to the bottom end of the transmission housing 43. After the air flow enters the air inlet pipe 45, part of it is blocked by the semi-circular guide plate 44 and flows upward along the inclined surface of the semi-circular guide plate 44 into the air inlet pipe 45, and then flows into the transmission housing 43. The air flow flows into the included angle of the second impeller 46. Because the second impeller 46 fits tightly with the upper and lower ends of the transmission housing 43 without gaps, when the air flow fills the included angle of the second impeller 46, air pressure is generated, thereby driving the second impeller 46 to rotate. The second impeller 46 drives the push plate 47 to rotate. The push plate 47 pushes the activated carbon in the placement cylinder 41 to roll. When the activated carbon rolls, the contact area with the air increases, and it can more effectively absorb the dust in the air, thereby further improving the dust removal efficiency. A fixing device 5 is arranged below the filter screen 42. The fixing device 5 includes a limiting structure and a self-locking structure. The limiting structure includes a connecting seat 51, a socket 52, and a slot 53. The connecting seat 51 is fixedly connected below the chip 1. The socket 52 is fixedly connected to the inside of the base 25. The slot 53 is opened inside the socket 52. Hold the chip 1 and insert the connecting seat 51 into the slot 53 in the socket 52 to fix the chip 1 and prevent it from shaking. At the same time, a notch is opened in the center of the connecting seat 51. The chip 1 is connected to the pins through the notch. At the same time, the connecting seat 51 prevents fluid from entering between the chip 1 and the pins and causing the chip 1 to lose contact. The self-locking structure includes a groove 54, a telescopic groove 55, a sector-shaped latch 56, and a telescopic spring 57. The groove 54 is opened on both sides of the connecting seat 51. The telescopic groove 55 is opened inside the socket 52. The sector-shaped latch 56 is slidably connected to the inside of the telescopic groove 55. The telescopic spring 57 is fixedly connected to one side of the sector-shaped latch 56. The telescopic spring 57 is fixedly connected to the inside of the telescopic groove 55. The connecting seat 51 is slidably connected to the inside of the slot 53. The sector-shaped latch 56 is movably connected to the inside of the groove 54. After inserting the connecting seat 51 into the slot 53, the connecting seat 51 contacts the arc surface of the sector-shaped latch 56.When the connection seat 51 continues to slide down, the arc surface is squeezed to cause the fan-shaped pin 56 to retract into the telescopic groove 55. When the connection seat 51 is fully inserted into the slot 53, the grooves 54 opened on both sides thereof are aligned with the fan-shaped pin 56. At this time, the fan-shaped pin 56 is not squeezed, and is pushed out of the telescopic groove 55 by the telescopic spring 57. The pushed-out fan-shaped pin 56 is inserted into and stuck between the connection seat 51 and the socket 52, so that the connection seat 51 is fixed, further improving the stability of the chip 1. After the connection seat 51 is locked, there is still a downward space between the bottom surface of the socket 52. When the chip 1 needs to be removed, just continue to press the connection seat 51 downward, and the connection seat 51 squeezes the fan-shaped pin 56 to retract it into the telescopic groove 55 again. At this time, the connection seat 51 can be moved through the gap between the connection seat 51 and the socket 52 to make one side tilt up, so that the chip 1 can be removed, and both removal and installation are very convenient.

[0018] Working principle: the activated carbon placed in the placement tube 41 absorbs the dust around the chip 1 inside the base 25, and the dust enters the placement tube 41 through the filter 42 and is absorbed by the activated carbon, so that the dust in the base 25 is reduced, and excessive dust is prevented from adhering to the chip 1 and reducing the working efficiency of the chip 1. After the airflow enters the air inlet pipe 45, it is partially blocked by the semicircular guide plate 44 and flows upward along the inclined surface of the semicircular guide plate 44 into the air inlet pipe 45, and then flows into the transmission shell 43, and the airflow flows into the angle of the second impeller 46. Because the second impeller 46 and the upper and lower ends of the transmission shell 43 fit together without a gap, when the airflow fills the angle of the second impeller 46, air pressure is generated, thereby driving the second impeller 46 to rotate, and the second impeller 46 drives the push plate 47 to rotate, and the push plate 47 drives the activated carbon in the placement tube 41 to roll. When the activated carbon rolls, the contact area with the air increases, which can more effectively absorb dust in the air, thereby further improving the dust removal efficiency; Hold the chip 1 and align the connector 51 with the slot 53 in the socket 52 and insert it into the socket 52 to fix the chip 1 and prevent it from shaking. At the same time, a notch is provided in the center of the connector 51, and the chip 1 is connected to the pin through the notch. At the same time, the connector 51 prevents the fluid from entering between the chip 1 and the pin and causing the chip 1 to break contact. After the connector 51 is inserted into the slot 53, the connector 51 contacts the arc surface of the fan-shaped plug 56. When the connector 51 continues to slide down, the arc surface is squeezed to cause the fan-shaped plug 56 to retract into the telescopic groove 55. When the connector 51 is fully inserted into the slot 53, the grooves 54 on both sides thereof are aligned with the fan-shaped plug 56. At this time, the fan-shaped plug 56 is 6 is not squeezed, and is pushed out of the telescopic groove 55 by the telescopic spring 57. The pushed out fan-shaped pin 56 is inserted into and stuck between the connecting seat 51 and the socket 52, so that the connecting seat 51 is fixed, and the stability of the chip 1 is further improved. After the connecting seat 51 is locked, there is still a downward space between the bottom surface of the socket 52 and the connecting seat 51. When the chip 1 needs to be removed, just continue to press the connecting seat 51 downward, and the connecting seat 51 squeezes the fan-shaped pin 56 to retract it into the telescopic groove 55 again. At this time, the connecting seat 51 can be moved through the gap between the connecting seat 51 and the socket 52 to make one side tilt up, so that the chip 1 can be removed, and both removal and installation are very convenient.

[0019] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0020] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A computer CPU protection device with overheat protection, comprising a chip (1), characterized in that: Also included is an overheat protection device (2), the overheat protection device (2) comprising a heat dissipation structure and a mounting structure; The heat dissipation structure comprises a heat conductor (21), a condenser (22), and a radiator (23); the heat conductor (21) is arranged above the chip (1); the condenser (22) is fixedly connected to the outside of the heat conductor (21); and the radiator (23) is fixedly connected to the rear side of the condenser (22); The mounting structure comprises a casing (24), a base (25), an arc-shaped plug plate (26), and an arc-shaped clamping plate (27); the casing (24) is fixedly connected to the bottom of the surface of the heat conductor (21); the base (25) is sleeved on the inner side of the casing (24); the arc-shaped plug plate (26) is fixedly connected to the inner wall of the casing (24); and the arc-shaped clamping plate (27) is fixedly connected to the inner wall of the base (25).

2. A computer CPU protection device with overheat protection according to claim 1, characterized in that: The arc-shaped insert plate (26) is slidably connected to the bottom surface of the arc-shaped clamping plate (27); a notch is provided at the bottom of the base (25); and a temperature sensor is provided inside the base (25).

3. A computer CPU protection device with overheat protection according to claim 2, characterized in that: A dehumidification device (3) is arranged on the left side of the base (25), the dehumidification device (3) comprising a ventilation structure and a pressurization structure, the ventilation structure comprising a transfer chamber (31), a first impeller (32), a fan (33), and an air outlet pipe (34), the transfer chamber (31) being fixedly connected below the condensation pipe (22), the first impeller (32) being hingedly connected to the inner side of the transfer chamber (31), the fan (33) being fixedly connected to the right side of the first impeller (32), and the air outlet pipe (34). The tube (34) is fixedly connected to the inner side of the base (25); the boosting structure comprises a partition (35), a boosting cavity tube (36), a connecting shaft (37), and an arc-shaped guide plate (38); the partition (35) is fixedly connected to the inner side of the transfer cavity (31); the boosting cavity tube (36) is fixedly connected to the right side of the transfer cavity (31); the connecting shaft (37) is fixedly connected to the inner side of the boosting cavity tube (36); and the arc-shaped guide plate (38) is fixedly connected to the surface of the connecting shaft (37).

4. A computer CPU protection device with overheat protection according to claim 3, characterized in that: The pressurizing cavity tube (36) is fixedly connected to the left side of the base (25); the fan (33) rotates and penetrates the inner side of the partition (35); and a dehumidifier is arranged inside the base (25).

5. A computer CPU protection device with overheat protection according to claim 4, characterized in that: A dust removal device (4) is arranged above the air outlet pipe (34), the dust removal device (4) comprising an adsorption structure and a pushing structure, the adsorption structure comprising a placement cylinder (41), a filter screen (42), and a transmission protective shell (43), the placement cylinder (41) being arranged above the chip (1), the filter screen (42) being fixedly connected to the bottom of the placement cylinder (41), the transmission protective shell (43) being fixedly connected above the placement cylinder (41), the pushing structure comprising a semicircular guide plate (44), an air inlet pipe (45), a second impeller (46), and a push plate (47), the semicircular guide plate (44) being fixedly connected to the inner side of the air outlet pipe (34), the air inlet pipe (45) being fixedly connected above the air outlet pipe (34), the second impeller (46) being rotatably connected to the inner side of the transmission protective shell (43), and the push plate (47) being fixedly connected below the second impeller (46).

6. A computer CPU protection device with overheat protection according to claim 5, characterized in that: The transmission protective shell (43) is fixedly connected below the heat conductor (21); the second impeller (46) rotates and penetrates to the top of the placement tube (41); activated carbon is placed inside the placement tube (41); and the air inlet pipe (45) is fixedly connected to the bottom end of the transmission protective shell (43).

7. A computer CPU protection device with overheat protection according to claim 6, characterized in that: A fixing device (5) is provided below the filter screen (42), the fixing device (5) comprising a limiting structure and a self-locking structure, the limiting structure comprising a connecting seat (51), a socket (52), and a slot (53), the connecting seat (51) being fixedly connected below the chip (1), the socket (52) being fixedly connected to the inner side of the base (25), the slot (53) being opened inside the socket (52), the self-locking structure comprising a groove (54), a telescopic groove (55), a fan-shaped latch (56), and a telescopic spring (57), the groove (54) being opened on both sides of the connecting seat (51), the telescopic groove (55) being opened inside the socket (52), the fan-shaped latch (56) being slidably connected to the inner side of the telescopic groove (55), and the telescopic spring (57) being fixedly connected to one side of the fan-shaped latch (56).

8. A computer CPU protection device with overheat protection according to claim 7, characterized in that: The telescopic spring (57) is fixedly connected to the inner side of the telescopic slot (55), the connecting seat (51) is slidably connected to the inner side of the slot (53), and the fan-shaped latch (56) is movably connected to the inner side of the groove (54).

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