Joint simulation management platform and simulation method based on chip packaging

Abstract

The invention discloses a joint simulation management platform and a simulation method based on chip packaging, and belongs to the technical field of integrated circuit simulation. The simulation management platform generates a chip packaging physical model configuration table according to a chip packaging design file, creates a packaging material database and a working condition database, solidifies a simulation process of a simulation task, and performs simulation on the chip packaging physical model configuration table according to the chip packaging design file; a user is guided to input simulation parameters in a user interface according to a simulation process, a command control is clicked, interaction with ANSYS is carried out through a PyAnsys library of python, input of the user and pre-generated configuration information are transmitted to the ANSYS, and the functions of simulation pretreatment, simulation material calling, boundary condition setting, solving and post-processing and simulation report generation are achieved. According to the technical scheme, management and sharing of simulation process data and process and standardization of a task execution process are achieved, a sustainable multi-physics field coupling joint simulation management platform is formed, and simulation efficiency and precision are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit simulation, and in particular to a co-simulation management platform and a simulation method based on chip packaging. Background Art

[0002] The integrated circuit packaging and testing industry is developing towards "one-stop semiconductor packaging and testing services", including packaging design, packaging simulation, substrate packaging, wafer-level packaging, wafer testing, and functional testing. As an indispensable part of packaging and testing, packaging simulation plays an irreplaceable role in system design optimization, R & D, and manufacturing cost reduction.

[0003] Advanced packaging is an important development direction of integrated circuit packaging technology. With the development of emerging industries such as intelligent mobile terminals, 5G networks, the Internet of Things, new energy vehicles, big data, artificial intelligence, and wearable devices, advanced packaging is developing towards system integration, high speed, high frequency, and three-dimensional directions. The challenges it faces are the regulation of multiple physical fields such as electromagnetism, temperature, and stress, the coordination of multiple performances such as signal / power integrity, heat, and force, and the integration of multiple materials such as silicon, compound semiconductors, and copper.

[0004] ANSYS is a commercial simulation software that can be used for chip packaging simulation. However, the usage threshold of ANSYS is relatively high, and the simulation result accuracy of non-professionals using ANSYS for packaging simulation is relatively low. In addition, when using ANSYS for manual simulation, the efficiency is low in aspects such as geometric modeling and mesh generation, and there is a large amount of repetitive work in the repeated design verification process, lacking the management and sharing of simulation process data. Therefore, there is an urgent need to establish a co-simulation management platform based on chip packaging to provide sustainable simulation platform construction and collaborative working environments, so as to shorten the R & D design verification time and new product introduction cycle and empower enterprise R & D design. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: aiming at the problems of low ANSYS simulation accuracy, low efficiency, and lack of management and sharing of simulation process data commonly existing in chip packaging simulation, to provide a co-simulation management platform and a simulation method based on chip packaging.

[0006] To achieve the above object, the present invention provides a co-simulation management platform based on chip packaging, including: The co-simulation management platform is developed based on the commercial simulation software ANSYS for the second time, and includes a chip packaging physical model configuration table, a packaging co-simulation project management module, a packaging material database, a working condition database, an ANSYS simulation analysis module, and a simulation result summary and analysis module:

[0007] The physical model configuration table of the chip package corresponds one-to-one with the chip package products, and includes the size information, position information, component association information, material information of each component of the chip package, as well as the boundary conditions and solution settings information corresponding to the simulation tasks; the information is automatically generated by an external program according to the chip package design file according to the defined rules;

[0008] The package material database contains the non-linear characteristics of thermal, electrical, and structural materials, and the package material database is shared by multiple chip package products;

[0009] The working condition database contains temperature loads, displacement loads, and pressure loads, and the working condition database is shared by multiple chip package products;

[0010] The package co-simulation project management module is used to provide a user interface for users to create simulation projects and simulation tasks, execute simulation tasks, view simulation reports, and upload simulation data; the simulation project corresponds to the chip package product; the simulation project management module interacts with Ansys through the PyAnsys library of python, transfers simulation data between different physical fields, and realizes the collaborative development and co-simulation of multi-physical field simulation tasks;

[0011] The ANSYS simulation analysis module includes an electromagnetic simulation analysis module, a heat dissipation simulation analysis module, a structural simulation analysis module, and a reliability simulation analysis module. Each simulation analysis module includes multiple simulation task processing sub-modules; the simulation task processing sub-module corresponds to the simulation task type, solidifies the simulation processes of simulation tasks of different simulation types respectively, and through a page wizard, guides the user to input simulation parameters and click command controls in the user interface according to the simulation process, interacts with ANSYS through the PyAnsys library of python, and transfers the user's input and the relevant information in the chip package physical model configuration table, the package material database, and the working condition database to ANSYS, realizing the functions of pre-simulation processing, simulation material call, boundary condition setting, solution and post-processing, and generating simulation reports.

[0012] Preferably, the generation method of the physical model configuration table of the chip package is as follows: export the.txt file of the chip package design from the EDA software, read the.txt file through an external program, extract the size information, position information, component association information, material information of each component of the chip package, as well as the boundary conditions and solution settings information corresponding to the simulation tasks, and write them into multiple sheets of an.excel file according to the type.

[0013] Preferably, the simulation result summary and analysis module is used to collect the simulation data of all simulation tasks under a simulation project, analyze the simulation data uploaded by each simulation task in combination with the preset design indicators of each simulation task, and output a simulation result analysis report to indicate whether the simulation test result is successful or failed.

[0014] Preferably, the simulation task processing sub-module includes a multi-physics field coupling sub-module that solidifies the coupling simulation process and is used for the coupling simulation of multi-physics fields.

[0015] Preferably, the chip package physical model configuration table is extended according to the product type to form a chip package physical model library.

[0016] Preferably, the simulation task processing sub-module accesses the working condition data in the working condition database through the working condition name in the chip package physical model configuration table; accesses the material properties in the packaging material database through the material name in the chip package physical model configuration table, and transfers the working condition data and material properties to ANSYS.

[0017] Preferably, the co-simulation management platform further includes a data management module, and the data management module provides a user interface for the data management of the packaging material database, the working condition database, the simulation project, the simulation task, and the simulation data.

[0018] Preferably, the data management module further includes the management of the measured data of the chip package, and the packaging co-simulation project management module is also used for the comparison of the simulation data and the measured data of the chip package.

[0019] Preferably, the data management module further includes a user management interface for setting the access permissions of different users.

[0020] The present invention also provides a co-simulation method based on chip packaging. The co-simulation method is implemented based on the co-simulation management platform, and the method includes the following steps:

[0021] Step S1, creating a chip package physical model configuration table according to the chip package design file;

[0022] Step S2, on the co-simulation management platform page, create a simulation project and simulation tasks according to the page wizard, the project management and business requirements, set the multi-physics field coupling option as needed, and set the simulation task type; import the created chip package physical model configuration table into the simulation project, and perform pre-processing, boundary condition, solution, and post-processing settings for each simulation task;

[0023] Step S3, execute the simulation task on the co-simulation management platform page;

[0024] Step S4, after the simulation is completed, view the simulation report and upload the data to the simulation result summary and analysis module;

[0025] Step S5, the simulation result summary and analysis module collects the data of the simulation sub-modules and analyzes the simulation results according to the design indicators;

[0026] Step S6, adjust the product design according to the simulation result analysis report, regenerate the chip package physical model configuration table, import it into the simulation project of the co-simulation management platform, and perform the next round of simulation.

[0027] The technical solution of the present invention is based on the secondary development of the commercial simulation software ANSYS. According to the chip package design file, a chip package physical model configuration table is generated, and a package material database and a working condition database are created. The user creates electromagnetic, thermal, structural, and reliability simulation projects and simulation tasks according to the project needs on the user interface provided by the package co-simulation project management module. The simulation tasks correspond to the simulation task processing sub-modules. The simulation task processing sub-modules solidify the simulation processes of the simulation tasks, guide the user to input simulation parameters and click command controls in the user interface according to the simulation processes, interact with ANSYS through the PyAnsys library of python, and transfer the user's input and the relevant information in the chip package physical model configuration table, the package material database, and the working condition database to ANSYS, realizing the functions of pre-simulation processing, simulation material call, boundary condition setting, solution and post-processing, and generating simulation reports. The technical solution of the present invention constructs a package physical model configuration table, a package material database, and a working condition database in advance, centralizes all the simulation tasks of the same product through the simulation project, solidifies the simulation processes, calls the ANSYS interface to implement the simulation task processing, realizes the management and sharing of the simulation process data and the processization and standardization of the task execution process, forms a sustainable multi-physics field coupling co-simulation management platform, improves the simulation efficiency and accuracy, and shortens the R & D design verification time and the new product introduction cycle. Description of the Drawings

[0028] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0029] Figure 1 It is a block diagram of a co-simulation management platform based on chip package provided by an embodiment of the present invention.

[0030] Figure 2 It is a deployment schematic diagram of a co-simulation management platform based on chip package provided by an embodiment of the present invention.

[0031] Figure 3The flowchart of steps of a co - simulation method based on chip packaging provided by an embodiment of the present invention.

[0032] Figure 4 The geometric model diagram of the warpage simulation of the Unit package provided by an embodiment of the present invention.

[0033] Figure 5 The simulation nephogram of the warpage simulation of the Unit package provided by an embodiment of the present invention. Detailed implementation manners

[0034] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] The general idea of the present invention is: based on the secondary development of the commercial simulation software ANSYS, generate a physical model configuration table of the chip package according to the chip package design file, and create a package material database and a working condition database. The user creates electromagnetic, thermal, structural, and reliability simulation projects and simulation tasks according to the project needs in the user interface provided by the package co - simulation project management module. The simulation tasks correspond to the simulation task processing sub - modules. The simulation task processing sub - modules solidify the simulation processes of the simulation tasks, guide the user to input simulation parameters and click command controls in the user interface according to the simulation processes, interact with ANSYS through the PyAnsys library of python, and transfer the user's input and relevant information in the physical model configuration table of the chip package, the package material database, and the working condition database to ANSYS to implement the functions of pre - simulation processing, simulation material calling, boundary condition setting, solution and post - processing, and generating simulation reports.

[0036] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings of the specification. It should be understood that the embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0037] The present invention is applicable to single - item, multi - item, and multi - physical - field co - simulations of electromagnetic, thermal, structural, and reliability of chip packaging.

[0038] The finite element method, also known as the finite element approach, its basic idea is to divide a continuous entity into multiple small subdomains, making the entity a discrete body. There is no intersection between each subdomain within the body. Subsequently, separate analyses are carried out on each of the discretized subdomains. The discretized subdomains after division are used as small equations representing the entity model to handle boundary values. Finite element analysis is a numerical method for solving partial differential equations and is an efficient and commonly used calculation method.

[0039] ANSYS is a commonly used finite element analysis software. The simulation based on ANSYS mainly consists of the following three parts:

[0040] (1) Preprocessing: The preprocessing part is an entity modeling and meshing module with integrated multiple functions. Users can set the simulation model in the visualization interface, set material parameters such as thermal conductivity, specific heat capacity, density, etc. Subsequently, it automatically processes to generate a subsequent analyzable model that includes all nodes and all elements. If the size of the established model and the meshing are fine enough, the results calculated by the finite element method will be more accurate and more persuasive;

[0041] (2) Loading and solving: Set constraints, apply loads to the model established in the preprocessing, set analysis requirements and solve;

[0042] (3) Postprocessing: The module can extract the aforementioned calculation results and analyze the performance of the material thermal conductivity, temperature, magnetic field, etc. of the established model. The postprocessing part of the analysis can display the obtained results in two forms: data or graphics, and can also display or output the calculation results in the form of two-dimensional charts and broken lines.

[0043] Multi-physics field coupling analysis considers physical phenomena formed by the interaction between two or more physical fields and belongs to a relatively complex physical analysis method. The emergence of the physical field coupling simulation method can objectively explain the influence between fields. ANSYS multi-physics field solutions provide two recognized solution techniques to solve multi-physics field problems, including direct coupling solution and sequential coupling solution. These two approaches provide flexible simulation methods to solve a wide range of direct coupling and sequential coupling multi-physics field problems.

[0044] ANSYS has relatively complete finite element analysis functions and good openness. Users can perform secondary development such as function expansion and system integration on ANSYS according to their own needs. The secondary development of ANSYS can realize the encapsulation of the entire process of preprocessing, solving, and postprocessing of finite element analysis. Users input geometric parameters, physical material property parameters, load parameters, etc. of the component to be analyzed in the operation interface, and ANSYS can automatically call the calculation program, automatically perform mesh division, force loading, and automatic solution, simplifying the solution process and improving work efficiency.

[0045] Figure 1 The following is a block diagram of a co - simulation management platform based on chip packaging provided by an embodiment of the present invention. As Figure 1 shown, an embodiment of the present invention provides a co - simulation management platform based on chip packaging. The co - simulation management platform is developed based on the commercial simulation software ANSYS, and includes a chip packaging physical model configuration table, a packaging co - simulation project management module, a packaging material database, a working condition database, an ANSYS simulation analysis module, and a simulation result summary and analysis module:

[0046] The chip packaging physical model configuration table corresponds one - to - one with chip packaging products, and includes size information, position information, component association information, material information of each component of the chip packaging, as well as boundary conditions and solution settings information corresponding to the simulation task; the information is automatically generated by an external program according to the chip packaging design file according to defined rules.

[0047] The chip packaging physical model configuration table is extended according to product types to form a chip packaging physical model library.

[0048] In the embodiment of the present invention, the generation method of the chip packaging physical model configuration table is as follows: export the.txt file of the chip packaging design from the EDA (Electronic Design Automation) software, read the.txt file through an external program, extract the size information, position information, component association information, material information of each component of the chip packaging, as well as the boundary conditions and solution settings information corresponding to the simulation task, and write them into multiple sheets of an.excel file according to types. The finally formed.excel file is the chip packaging physical model configuration table. The chip packaging physical model configuration table corresponds one - to - one with chip packaging products and contains the structural information of chip packaging products. By extending the chip packaging physical model configuration table according to product types, such as SIP, FCCSP, FCBGA, a chip packaging physical model library is formed, and the sharing and management of the physical model configuration table can be realized.

[0049] The packaging material database contains the non - linear characteristics of thermal, electrical, and structural materials, and the packaging material database is shared by multiple chip packaging products.

[0050] In the embodiments of the present invention, the encapsulation material database includes the characteristics of common encapsulation materials, which are obtained by summarizing and de-duplicating the materials used in chip packaging products, so that they can be shared among multiple chip packaging products, achieving resource sharing and improving work efficiency. The encapsulation material database includes TDS characteristics, E-CTE characteristics, Anand model, and Viscoelastic model. Among them, the TDS characteristics include the basic physical properties, structure, heat, electromagnetic and other properties of the material; the E-CTE characteristics are the elastic modulus and coefficient of thermal expansion properties of the encapsulation material that change with temperature; the Anand model and Viscoelastic model are material constitutive models. The above characteristics can all be called according to the material name and passed into ANSYS for use.

[0051] The working condition database includes temperature load, displacement load, and pressure load, and the working condition database is shared by multiple chip packaging products.

[0052] In the embodiments of the present invention, the working condition database includes common working condition data, which is continuously improved as the product expands, so that it can be shared among multiple chip packaging products.

[0053] The encapsulation co-simulation project management module is used to provide a user interface for users to create simulation projects and simulation tasks, execute simulation tasks, view simulation reports, and upload simulation data; the simulation project corresponds to the chip packaging product; the simulation project management module interacts with Ansys through the PyAnsys library of python to transfer simulation data between different physical fields, realizing the collaborative development and co-simulation of multi-physical field simulation tasks.

[0054] In the embodiments of the present invention, the user first creates a simulation project for the chip packaging product in the user interface, sets the basic information of the project, including setting the multi-physical field coupling option, and then creates a simulation task in the simulation project, and then sets each simulation task, including setting the simulation task type. Through the co-simulation project management platform, the simulation projects and simulation tasks are centrally managed, and the simulation execution status is recorded, forming a sustainable and traceable co-simulation management platform.

[0055] The ANSYS simulation analysis module includes an electromagnetic simulation analysis module, a heat dissipation simulation analysis module, a structural simulation analysis module, and a reliability simulation analysis module. Each of the simulation analysis modules includes multiple simulation task processing sub-modules. The simulation task processing sub-modules correspond to the types of simulation tasks, and solidify the simulation processes of simulation tasks of different simulation types respectively. Through a page wizard, the user is guided to input simulation parameters and click command controls in the user interface according to the simulation process, interact with ANSYS through the PyAnsys library of Python, and transfer the user's input and relevant information in the chip package physical model configuration table, the package material database, and the working condition database to ANSYS, so as to realize the functions of pre-simulation processing, simulation material call, boundary condition setting, solution and post-processing, and generation of simulation reports.

[0056] In the embodiment of the present invention, different simulation task processing sub-modules correspond to different simulation functions. The simulation task processing sub-modules under the electromagnetic simulation analysis module include an RLC parameter extraction sub-module and an S parameter extraction sub-module; the simulation task processing sub-modules under the heat dissipation simulation analysis module include a JEDEC thermal resistance extraction sub-module and a thermal resistance matrix model extraction sub-module; the simulation task processing sub-modules under the structural simulation analysis module include a Unit warpage prediction sub-module, a Strip warpage prediction sub-module, and a 3PB strength analysis sub-module; the simulation task processing sub-modules under the reliability analysis module include a uHAST sub-module, a TST sub-module, and a TCT sub-module. The simulation task processing sub-modules can be extended according to requirements.

[0057] The simulation task processing sub-module includes a multi-physics field coupling sub-module, which solidifies the coupling simulation process and is used for the coupling simulation of multi-physics fields. For example, in the electromagnetic simulation analysis module, a thermoelectric co-simulation task processing sub-module is set up to perform the coupling simulation of thermal and electric fields. The thermoelectric co-simulation task processing sub-module solidifies the process of the thermal and electric field coupling simulation, calls the interface of ANSYS, and transfers the thermal field simulation results to the electric field.

[0058] The simulation result summary and analysis module is used to collect the simulation data of all simulation tasks under a simulation project, analyze the simulation data uploaded by each simulation task in combination with the preset design indicators of each simulation task, and output a simulation result analysis report, indicating whether the simulation test result is successful or failed. R & D engineers adjust the product design according to the simulation result analysis report, such as adjusting the chip stacking position, size information, and material selection. The simulation engineer regenerates the chip package physical model configuration table according to the adjusted design file, enters it into the simulation project of the co-simulation management platform, and conducts the next round of simulation.

[0059] In the embodiment of the present invention, the design indicators are the design indicators corresponding to the design tasks, such as the chip three-point bending strain index, the single-package high and low temperature warpage index, the process large board warpage index, etc.

[0060] The simulation task processing sub-module accesses the working condition data in the working condition database through the working condition name in the chip package physical model configuration table, and accesses the material properties in the packaging material database through the material name in the chip package physical model configuration table, and transfers the working condition data and material properties to ANSYS.

[0061] In the embodiment of the present invention, the user enters the chip package physical model configuration table in the simulation project, and then performs pre-processing on the simulation project. Modeling is carried out according to the chip package physical model configuration table to generate a 3D model. The user can export the 3D model through the page control for reuse in subsequent simulations. After the 3D model is established, material parameters are set for the model. The simulation task processing sub-module accesses the corresponding material parameters in the packaging material database through the material name in the chip package physical model configuration table and transfers them to ANSYS. After specifying the material parameters, the simulation task processing sub-module calls the open interface of ANSYS for mesh generation according to the parameters input by the user in the interface. Manually performing 3D modeling and mesh generation in ANSYS is very time-consuming. The co-simulation management platform of the present invention interacts with ANSYS through the PyAnsys library of python, reads the configuration information in the chip package physical model configuration table, packages the steps of 3D modeling and mesh generation, and the user only needs to input a small number of parameters in the interface to achieve 3D modeling and mesh generation, realizing the standardization of pre-processing of simulations, effectively improving the simulation efficiency and accuracy. In the loading and solution stage, the simulation task processing sub-module will access the working condition data in the working condition database through the working condition name in the chip package physical model configuration table and apply loads to the model established in the pre-processing.

[0062] The co-simulation management platform further includes a data management module, and the data management module provides a user interface for data management of the packaging material database, the working condition database, the chip package physical model library, the simulation project, the simulation task, and the simulation data.

[0063] In the embodiment of the present invention, the data management module provides a user interface for operations of adding, deleting, modifying, and querying specific data.

[0064] The data management module further includes the management of measured data of chip packaging. The packaging co-simulation project management module is also used for comparing the simulation data and measured data of chip packaging, and the simulation engineer optimizes the simulation process according to the comparison results.

[0065] The data management module further includes a user management interface for managing user data and setting access permissions for different users.

[0066] In the embodiments of the present invention, different roles are assigned to different users, and access permissions are distinguished by roles. The specific roles include system administrator, project manager, materials engineer, R & D engineer, and simulation engineer. The project manager creates simulation projects and simulation tasks, and the simulation engineer sets up and executes the simulation tasks.

[0067] Figure 2 It is a deployment schematic diagram of a co-simulation management platform based on chip packaging provided by an embodiment of the present invention. As Figure 2 shown, the software system of the co-simulation management platform based on chip packaging provided by the embodiments of the present invention adopts a C / S architecture, including CoSim Server, CoSim Client, and a database. Among them, CoSim Server and the database are deployed on the cloud server, CoSim-Client and ANSYS simulation software are deployed together on the workstation. The workstation is connected to the company's office network through a secure network, and the company's office network is connected to the cloud. The database provides data storage for the co-simulation management platform. CoSimServer is responsible for providing data forwarding and control, uploading and downloading of data files. CoSim Client is responsible for providing an operation interface. Users operate according to the process in the interface to create simulation projects and simulation tasks, and control the configuration and operation of the simulation software. CoSim Client is developed in the python language and interacts with ANSYS by calling the interface of ANSYS through PyAnsys. The simulation result summary and analysis module is a part of CoSim Server and is deployed on the cloud.

[0068] Figure 3 It is a step flow chart of a co-simulation method based on chip packaging provided by an embodiment of the present invention. As Figure 3 shown, the embodiments of the present invention provide a co-simulation method based on chip packaging. The co-simulation method is implemented based on the co-simulation management platform, and the method includes the following steps:

[0069] Step S1, create a chip packaging physical model configuration table according to the chip packaging design file;

[0070] Step S2, on the co-simulation management platform page, according to the page wizard, create simulation projects and simulation tasks according to project management and business requirements, set multi-physics field coupling options as needed, and set the simulation task type; import the created chip packaging physical model configuration table into the simulation project, and perform pre-processing, boundary conditions, solution, and post-processing settings for each simulation task;

[0071] Step S3, execute the simulation task on the co-simulation management platform page;

[0072] Step S4, after the simulation is completed, view the simulation report and upload the data to the simulation result summary and analysis module;

[0073] Step S5, the simulation result summary and analysis module collects the data of the simulation sub-modules and analyzes the simulation results according to the design indicators;

[0074] Step S6, adjust the product design according to the simulation result analysis report, regenerate the chip package physical model configuration table, import it into the simulation project of the co-simulation management platform, and perform the next round of simulation.

[0075] Taking the Unit warpage prediction simulation sub-module in structural simulation as an example, the specific simulation implementation process is described below. The Unit warpage simulation uses WorkBench, SpaceClaim, and Mechanical in ANSYS, and its simulation implementation process is as follows:

[0076] (1) WorkBench preparation: Start WorkBench, SpaceClaim, and Mechanical, and select the structural type of the simulation.

[0077] (2) SpaceClaim modeling: Read the chip package physical model configuration table, confirm the coordinate positions of the modeled devices, and create a SpaceClaim model through the data in the chip package physical model configuration table according to the basic parameters such as whether the BUMP is suppressed, whether the Solder Ball is suppressed, and whether the RLC device is generated input through the user interface.

[0078] (3) SpaceClaim Boolean operation, topology and grouping: According to the parameters input through the user interface, perform Boolean operations to remove the contact between devices, confirm the topology of sharing between devices, and uniformly divide the type groups of different devices through SpaceClaim on the created model.

[0079] (4) WorkBench material creation: Different devices correspond to different material types. Through WorkBench, all the materials required for the simulation are unified and duplicates are removed to create a package material database.

[0080] (5) Mechanical material assignment: Synchronize the materials created by WorkBench through Mechanical, uniformly assign materials to the devices in batches, and confirm the different materials corresponding to each device.

[0081] (6) Mechanical constraint creation: Set the different constraint points, temperature library, solution settings, etc. during the simulation process through Mechanical.

[0082] (7)Mechanical Solution: Solve the simulation model through Mechanical to obtain the effective values corresponding to different stages.

[0083] (8)Result Data Arrangement, Report Generation and Report Upload to the Cloud: Arrange the data obtained from the solution, upload the arranged data to the cloud for storage, generate a simulation report corresponding to the simulation task according to the solution results, basic information of the simulation project and simulation task, and upload the simulation report to the cloud.

[0084] In the embodiments of the present invention, the simulation report includes project and task information, geometric model, material properties, boundary conditions, load conditions, and simulation results. Figure 4 The figure shows the geometric model diagram of the Unit package warpage simulation provided by the embodiments of the present invention. Figure 5 It is the simulation nephogram of the Unit package warpage simulation provided by the embodiments of the present invention.

[0085] The technical solution of the present invention is based on the secondary development of the commercial simulation software ANSYS. Generate a physical model configuration table for chip packaging according to the chip packaging design file, and create a packaging material database and a working condition database. Users create electromagnetic, thermal, structural, and reliability simulation projects and simulation tasks according to project needs on the user interface provided by the packaging co-simulation project management module. The simulation task corresponds to the simulation task processing sub-module. The simulation task processing sub-module solidifies the simulation process of the simulation task, guides the user to input simulation parameters and click command controls in the user interface according to the simulation process, interacts with ANSYS through the PyAnsys library of python, and transfers the user input and relevant information in the physical model configuration table for chip packaging, packaging material database and working condition database to ANSYS to implement the functions of pre-simulation processing, simulation material call, boundary condition setting, solution and post-processing, and generation of simulation reports. The technical solution of the present invention constructs a physical model configuration table for packaging, a packaging material database and a working condition database in advance, centralizes all simulation tasks of the same product through simulation projects, solidifies the simulation process, calls the ANSYS interface to implement simulation task processing, realizes the management and sharing of simulation process data and the processization and standardization of the task execution process, forms a sustainable multi-physics field coupling co-simulation management platform, improves simulation efficiency and accuracy, and shortens the R & D design verification time and new product introduction cycle. The above is only the specific implementation manner of the present invention and cannot be used to limit the scope of the present invention. Equivalent changes made by those of ordinary skill in the art according to this creation, as well as changes well-known to those skilled in the art, should still fall within the scope covered by the present invention.

Claims

1. A co-simulation management platform based on chip packaging, characterized in that The joint simulation management platform is developed based on the commercial simulation software ANSYS, including a chip package physical model configuration table, a package joint simulation project management module, a package material database, a working condition database, an ANSYS simulation analysis module, and a simulation result summary and analysis module: The chip package physical model configuration table corresponds one-to-one with the chip package products, including the size information, position information, component association information, material information of each component of the chip package, and the boundary conditions and solution settings information corresponding to the simulation tasks; the information is automatically generated by an external program according to the chip package design file according to the defined rules; The package material database contains the non-linear characteristics of thermal, electrical, and structural materials, and the package material database is shared by multiple chip package products; The working condition database contains temperature loads, displacement loads, and pressure loads, and the working condition database is shared by multiple chip package products; The package joint simulation project management module is used to provide a user interface for users to create simulation projects and simulation tasks, execute simulation tasks, view simulation reports, and upload simulation data; the simulation projects correspond to the chip package products; the simulation project management module interacts with Ansys through the PyAnsys library of python, transfers simulation data between different physical fields, and realizes the collaborative development and joint simulation of simulation tasks in multiple physical fields; The ANSYS simulation analysis module includes an electromagnetic simulation analysis module, a heat dissipation simulation analysis module, a structural simulation analysis module, and a reliability simulation analysis module, and each simulation analysis module includes multiple simulation task processing sub-modules; the simulation task processing sub-modules correspond to the simulation task types, solidify the simulation processes of simulation tasks of different simulation types respectively, and through the page wizard, guide users to input simulation parameters and click command controls in the user interface according to the simulation process, interact with ANSYS through the PyAnsys library of python, and transfer the user's input and the relevant information in the chip package physical model configuration table, the package material database, and the working condition database to ANSYS, so as to realize the functions of pre-simulation processing, simulation material calling, boundary condition setting, solution and post-processing, and generating simulation reports.

2. The co-simulation management platform based on chip packaging according to claim 1, characterized in that The generation method of the chip package physical model configuration table is as follows: export the.txt file of the chip package design from the EDA software, read the.txt file through an external program, extract the size information, position information, component association information, material information of each component of the chip package, and the boundary conditions and solution settings information corresponding to the simulation tasks, and write them into multiple sheets of an.excel file according to the types.

3. The co-simulation management platform based on chip packaging according to claim 1, characterized in that The simulation result summary and analysis module is used to collect the simulation data of all simulation tasks under the simulation project, analyze the simulation data uploaded by each simulation task in combination with the preset design indicators of each simulation task, output a simulation result analysis report, and indicate whether the simulation test result is successful or failed.

4. The co-simulation management platform based on chip packaging according to claim 1, characterized in that The simulation task processing sub-module includes a multi-physical field coupling sub-module, which solidifies the coupling simulation process and is used for the coupling simulation of multiple physical fields.

5. The co-simulation management platform based on chip packaging according to claim 1, characterized in that The chip package physical model configuration table is extended according to the product type to form a chip package physical model library.

6. The co-simulation management platform based on chip packaging according to claim 1, characterized in that The simulation task processing sub-module accesses the working condition data in the working condition database through the working condition name in the chip package physical model configuration table; accesses the material properties in the packaging material database through the material name in the chip package physical model configuration table, and transfers the working condition data and material properties to ANSYS.

7. The co-simulation management platform based on chip packaging according to claim 1, characterized in that The co-simulation management platform further includes a data management module, and the data management module provides a user interface for data management of the packaging material database, the working condition database, the simulation project, the simulation task, and the simulation data.

8. The co-simulation management platform based on chip packaging according to claim 7, characterized in that The data management module further includes the management of the measured data of the chip package, and the packaging co-simulation project management module is also used for the comparison between the simulation data and the measured data of the chip package.

9. The co-simulation management platform based on chip packaging according to claim 7, characterized in that The data management module further includes a user management interface for setting the access rights of different users.

10. A co-simulation method based on chip packaging, the co-simulation method is implemented based on the co-simulation management platform according to any one of claims 1-9, and the method includes the following steps: Step S1: Create a chip package physical model configuration table according to the chip package design document; Step S2: On the co-simulation management platform page, create a simulation project and simulation tasks according to the page wizard, the project management and business requirements, set the multi-physics coupling option as needed, and set the simulation task type; import the created chip package physical model configuration table into the simulation project, and perform pre-processing, boundary condition, solution, and post-processing settings for each simulation task; Step S3: Execute the simulation task on the co-simulation management platform page; Step S4: After the simulation is completed, view the simulation report and upload the data to the simulation result summary and analysis module; Step S5: The simulation result summary and analysis module collects the data of the simulation sub-module and analyzes the simulation results according to the design indicators; Step S6: Adjust the product design according to the simulation result analysis report, regenerate the chip package physical model configuration table, import it into the simulation project of the co-simulation management platform, and perform the next round of simulation.

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