Multilayer electronic component and external electrode for electronic component

Abstract

The invention provides a multilayer electronic component and an external electrode for an electronic component. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; an external electrode including an electrode layer disposed on the main body and connected to the internal electrode, and a plating portion disposed on the electrode layer and including two or more plating layers; and a sealing part provided between the plating part and the main body, including Sn, and in direct contact with the main body. By providing a sealing portion between the plated portion and the main body and controlling the composition and / or shape of the sealing portion, the multilayer electronic component may have improved moisture resistance reliability.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0183996, filed with the Korean Intellectual Property Office on December 18, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component and an external electrode for an electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), a type of multi-layer electronic component, is a chip capacitor mounted on a printed circuit board of various electronic products including display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, etc. to charge or discharge.

[0004] Multi-layer ceramic capacitors can be used as components in various electronic devices due to their small size, high capacitance, and ease of installation. As various electronic devices such as computers and mobile devices have become smaller and have been implemented with higher outputs, the demand for miniaturization and high capacitance of multi-layer ceramic capacitors has increased.

[0005] As the miniaturization, high capacitance, and high integration of multi-layer ceramic capacitors accelerate, the need to prevent deterioration of moisture resistance reliability increases. In particular, when the external electrode includes a plating layer, the bonding force between the plating layer and the body may be weak due to differences in composition, so the portion between the plating layer and the body may be a main path for external moisture penetration. In particular, when the base electrode layer of the external electrode is a sintered electrode layer, the base electrode layer may be oxidized by moisture penetrating into the portion between the plating layer and the body, which may exacerbate the problem of deterioration of the moisture resistance reliability of the multi-layer electronic component.

[0006] Therefore, structural improvements are needed that can effectively block the moisture penetration path between the plating layer and the body of the external electrode. Summary of the Invention

[0007] One aspect of the present disclosure aims to mitigate the problem of deterioration of moisture resistance reliability of a multi-layer electronic component due to moisture penetration between a plating layer and a body.

[0008] However, the object of the present disclosure is not limited to the above, and will be more easily understood during the description of specific exemplary embodiments of the present disclosure.

[0009] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body including a dielectric layer and inner electrodes alternately disposed with the dielectric layer; an outer electrode including an electrode layer disposed on the main body and connected to the inner electrodes and a plating portion disposed on the electrode layer and including two or more plating layers; and a sealing portion disposed between the plating portion and the main body, including Sn, and in direct contact with the main body.

[0010] According to another aspect of the present disclosure, a multilayer electronic component includes: a main body including a dielectric layer and inner electrodes alternately disposed with the dielectric layer; an outer electrode including an electrode layer disposed on the main body and connected to the inner electrodes and a plating portion disposed on the electrode layer and including two or more plating layers; and a sealing portion disposed between an end portion of the electrode layer and an end portion of the plating portion and having a recess recessed toward the electrode layer.

[0011] According to another aspect of the present disclosure, a multilayer electronic component includes: a main body including a dielectric layer and inner electrodes alternately disposed with the dielectric layer; an outer electrode including an electrode layer disposed on the main body and connected to the inner electrodes and a plating portion disposed on the electrode layer and including two or more plating layers; and a sealing portion disposed between an end portion of the plating portion and the main body, wherein the sealing portion is provided so as not to extend beyond an end of the plating layer disposed at the outermost portion of the plating portion.

[0012] According to another aspect of the present disclosure, an outer electrode for an electronic component includes: an electrode layer disposed on a main body of the electronic component and in direct contact with an inner electrode of the electronic component; a plating portion disposed on the electrode layer without contacting the main body; and a sealing portion disposed on the following regions: an end portion of the electrode layer, a surface of the main body where the end portion of the electrode layer is provided, and an end portion of the plating portion extending beyond at least a part of the end portion of the electrode layer on a surface of the plating portion opposite to the surface of the main body, wherein the sealing portion includes a material selected from Sn and fluorocarbon, and wherein the sealing portion does not extend along the surface of the main body where the end portion of the electrode layer is provided beyond an end of the plating layer disposed at the outermost portion. Description of the Drawings

[0013] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure; Figure 2 is along Figure 1 a schematic cross-sectional view taken along line I-I'; Figure 3 is a magnified view of region A schematically showing Figure 2 ; Figure 4 is a schematic magnified view corresponding to region A in a multi-layer electronic component according to an exemplary embodiment Figure 2 ; Figure 5 is a schematic magnified view corresponding to region A in a multi-layer electronic component according to an exemplary embodiment Figure 2 ; Figure 6 schematically shows a method of forming a sealing portion according to an exemplary embodiment Figure 7 is a cross-sectional view taken along line II-II' of Figure 1 ; Figure 8 is a schematic perspective view of a multi-layer electronic component according to another exemplary embodiment in the present disclosure Figure 9 is a schematic cross-sectional view taken along line III-III' of Figure 8 ; Figure 10 is Figure 9 a schematic magnified view of region A' Figure 11 is a schematic magnified view corresponding to region A' in a multi-layer electronic component according to an exemplary embodiment Figure 9 ; and Figure 12 schematically shows a method of forming a sealing portion according to an exemplary embodiment DETAILED DESCRIPTION

[0014] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. However, the inventive concept may be illustrated in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. On the contrary, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, for clarity, the shapes and dimensions of elements may be exaggerated, and the same reference numerals will always be used to denote the same or similar elements

[0015] To clarify the present disclosure, parts irrelevant to the description are omitted throughout the specification, and the same numerals refer to the same elements. In the drawings, for clarity, the thicknesses of layers, films, panels, regions, etc. are exaggerated. Further, in the drawings, although the same reference numerals are shown in different drawings, the same reference numerals denote the same elements. Throughout the specification, unless explicitly described to the contrary, the words "comprising" and variations such as "including" or "having" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0016] In the drawings, the first direction may be defined as the stacking direction or the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0017] Figure 1 is a schematic perspective view of a multi-layer electronic component according to an exemplary embodiment of the present disclosure.

[0018] Figure 2 is along Figure 1 a schematic cross-sectional view taken along line I-I'.

[0019] Figure 7 is along Figure 1 a cross-sectional view taken along line II-II'.

[0020] Figure 8 is a schematic perspective view of a multi-layer electronic component according to another exemplary embodiment of the present disclosure.

[0021] Hereinafter, reference will be made to Figure 1 , Figure 2 , Figure 7 and Figure 8 to describe in detail the components commonly included in the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure and the multi-layer electronic component 100' according to another exemplary embodiment of the present disclosure. A multi-layer ceramic capacitor (hereinafter referred to as "MLCC") is described as an example of the multi-layer electronic component, but the present disclosure is not limited thereto.

[0022] Hereinafter, each component included in the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure will be described.

[0023] In the body 110, dielectric layers 111 and internal electrodes 121 and 122 may be alternately provided.

[0024] The dielectric layers 111 and the internal electrodes 121 and 122 may be alternately stacked, and in the present specification, the direction along which the dielectric layers 111 and the internal electrodes 121 and 122 are stacked may be defined as the first direction.

[0025] There is no particular limitation on the specific shape of the main body 110, but as Figure 1 and Figure 8 shown, the main body 110 may have a hexahedron shape or a shape similar to a hexahedron. Due to the shrinkage of the ceramic powder included in the main body 110 during the sintering process, the main body 110 may not have a hexahedron shape with perfect straight lines, but may generally have a hexahedron shape.

[0026] The main body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2 and are connected to the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0027] In addition, since the edge regions of the dielectric layer 111 where the inner electrodes 121 and 122 are not provided overlap in the first direction, a step difference due to the thickness of the inner electrodes 121 and 122 appears, so that the corners connecting the first surface to the third to sixth surfaces and / or the corners connecting the second surface to the third to sixth surfaces may contract toward the center of the main body 110 in the first direction based on the first surface or the second surface. Optionally, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may contract toward the center of the main body 110 in the first direction based on the first surface or the second surface. Optionally, in order to prevent cracking defects, the corners of the main body 110 connecting each surface may be rounded by performing a separate process, so that the corners connecting the first surface to the third to sixth surfaces and / or the corners connecting the second surface to the third to sixth surfaces may be rounded.

[0028] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and adjacent dielectric layers 111 may be integrated to the extent that it is difficult to distinguish the boundary between them without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited, and may be determined in consideration of the size of the multilayer electronic component. For example, the main body may be formed by stacking 400 or more dielectric layers.

[0029] The dielectric layer 111 can be formed by the following method: preparing a ceramic slurry including ceramic powder, an organic solvent, and a binder, coating the slurry on a carrier film and drying it to prepare a green ceramic sheet, and then sintering the green ceramic sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. However, for example, barium titanate (BaTiO3)-based powder and CaZrO3-based paraelectric powder can be used as the ceramic powder. For more specific examples, the barium titanate (BaTiO3)-based powder can be one or more of BaTiO3, (Ba 1- x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1- y Zr y )O3 (0 < y < 1), and the CaZrO3-based paraelectric powder can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0030] Therefore, the dielectric layer 111 can include one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0031] The average thickness td of the dielectric layer 111 is not particularly limited.

[0032] For the purpose of miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and for improving the reliability of the multilayer electronic component 100 under high temperature and high voltage, the average thickness of the dielectric layer 111 can be 3 μm or more.

[0033] The average thickness td of the dielectric layer 111 can be measured by scanning an image of a cross-section of the main body 110 in the first direction and the second direction with a scanning electron microscope (SEM).

[0034] For example, the average thickness td of the dielectric layer 111 can be obtained as follows: among the dielectric layers extracted from an image obtained by scanning a cross-section in the length direction and the thickness direction cut at the central portion in the width direction of the main body 110 with a scanning electron microscope (SEM), with respect to a total of five dielectric layers (including one dielectric layer at the intersection of the center line of the main body in the length direction and the center line of the main body in the thickness direction, and two dielectric layers above the one dielectric layer and two dielectric layers below the one dielectric layer), based on the intersection point of the center line of the main body in the length direction and the center line of the main body in the thickness direction as a reference point, five points are set on the one dielectric layer (i.e., the reference point and two points located at equal intervals to the left of the reference point centered on the reference point and two points located at equal intervals to the right of the reference point), and five points that are stacked with the above five points of the one dielectric layer in the thickness direction are respectively set on each of the other four dielectric layers, then the thicknesses of the five dielectric layers at these points are measured, and their average value is calculated.

[0035] The main body 110 may include: a capacitance forming portion Ac provided inside the main body 110 and forming a capacitance by including a first internal electrode 121 and a second internal electrode 122 alternately provided with the dielectric layer 111; and covering portions 112 and 113 formed above and below the capacitance forming portion Ac in the first direction.

[0036] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the multilayer ceramic capacitor, and may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122, and the capacitance forming portion Ac may refer to the region where the first internal electrode 121 and the second internal electrode 122 are stacked in the first direction. In addition, as Figure 2 shown, the first internal electrode 121 may be provided at the top of the capacitance forming portion Ac in the first direction, and the second internal electrode 122 may be provided at the bottom of the capacitance forming portion Ac in the first direction.

[0037] The internal electrodes 121 and 122 may include the first internal electrode 121 and the second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 may be alternately provided opposite to each other with the dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122, and the first internal electrode 121 and the second internal electrode 122 may be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0038] The first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed to the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed to the fourth surface 4. The first external electrode 130 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 140 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0039] That is, the first internal electrode 121 is not connected to the second external electrode 140 but to the first external electrode 130, and the second internal electrode 122 is not connected to the first external electrode 130 but to the second external electrode 140. Accordingly, the first internal electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance. In addition, the first internal electrode 121 and the second internal electrode 122 may be disposed to be spaced apart from the fifth surface and the sixth surface of the main body 110.

[0040] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and their alloys, but the present disclosure is not limited thereto.

[0041] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary according to its purpose. For example, in order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high voltage, the average thickness te of the internal electrodes 121 and 122 may be 3 μm or more.

[0042] The average thickness te of the internal electrodes 121 and 122 may be obtained as follows: Among the internal electrodes extracted from an image obtained by scanning a cross-section in the length and thickness directions of a portion cut at the central portion in the width direction of the main body 110 with a scanning electron microscope (SEM), with respect to a total of five internal electrodes (including one internal electrode at the intersection of the center line in the length direction of the main body and the center line in the thickness direction of the main body and two internal electrodes above the one internal electrode and two internal electrodes below the one internal electrode), based on the intersection of the center line in the length direction of the main body and the center line in the thickness direction of the main body as a reference point, five points are set on the one internal electrode (i.e., the reference point and two points located at equal intervals to the left of the reference point centered on the reference point and two points located at equal intervals to the right of the reference point), and five points that are stacked in the thickness direction with the above five points of the one internal electrode are respectively set on each of the other four internal electrodes, and then the thicknesses of the five internal electrodes at these points are measured and their average value is calculated.

[0043] The covering parts 112 and 113 can be disposed on the upper surface and the lower surface of the capacitor forming part Ac in the first direction.

[0044] The covering parts 112 and 113 can be mainly used to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0045] The covering parts 112 and 113 can include the same material as the dielectric layer 111. That is to say, the covering parts 112 and 113 can include ceramic materials, for example, barium titanate (BaTiO3)-based ceramic materials.

[0046] In addition, the thickness of the covering parts 112 and 113 can not be particularly limited. For example, the thickness tc of the covering parts 112 and 113 can each be 20 μm or less.

[0047] The average thickness tc of the covering parts 112 and 113 can refer to the dimension in the first direction, and can be a value obtained by averaging the dimensions of the covering parts 112 and 113 measured at five points with equal intervals above or below the capacitor forming part Ac.

[0048] In addition, the edge parts 114 and 115 can be disposed on the side surfaces of the capacitor forming part Ac.

[0049] The edge parts 114 and 115 can include a first edge part 114 disposed on one side surface of the capacitor forming part Ac in the third direction and a second edge part 115 disposed on the other side surface of the capacitor forming part Ac in the third direction. That is to say, the edge parts 114 and 115 can be disposed on the two side surfaces of the capacitor forming part Ac in the third direction.

[0050] As Figure 7 shown, the edge parts 114 and 115 can refer to: in the cross-section of the main body 110 in the width direction and the thickness direction, the regions between the two ends of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the main body 110.

[0051] The edge parts 114 and 115 can be mainly used to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0052] The edge parts 114 and 115 can be formed by coating a conductive paste on the regions of the green sheet except for the regions where the edge parts are to be formed to form the inner electrodes.

[0053] In addition, the width of the edge parts 114 and 115 can not be particularly limited. For example, the average width of the edge parts 114 and 115 can each be 20 μm or less.

[0054] The average widths of the edge portions 114 and 115 may respectively refer to the average dimensions in the third direction of the regions where the inner electrodes are spaced apart from the fifth surface and the average dimensions in the third direction of the regions where the inner electrodes are spaced apart from the sixth surface, and may be the average values of the dimensions of the edge portions 114 and 115 in the third direction measured at five points having equal intervals on the side surface of the capacitance forming portion Ac.

[0055] The outer electrodes 130 and 140 may be provided on the main body 110, and specifically, may be provided on the third surface 3 and the fourth surface 4 of the main body 110.

[0056] The outer electrodes 130 and 140 may include a first outer electrode 130 and a second outer electrode 140 that are respectively provided on the third surface 3 and the fourth surface 4 of the main body 110 and are respectively connected to the first inner electrode 121 and the second inner electrode 122.

[0057] In addition, it is not necessary to limit the outer electrodes 130 and 140 to be provided only on the third surface 3 and the fourth surface 4 of the main body. Referring to Figure 1 and Figure 2 , the first outer electrode 130 may extend from the third surface 3 of the main body 110 to be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6, and the second outer electrode 140 may extend from the fourth surface 4 to be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6.

[0058] In the present exemplary embodiment, a structure in which the multilayer electronic component 100 has two outer electrodes 130 and 140 is described, but the number and shape of the outer electrodes 130 and 140 may be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

[0059] The outer electrodes 130, 140, 130' and 140' may include electrode layers 131, 141, 131' and 141' that are provided on the main body 110 and are connected to the inner electrodes 121 and 122.

[0060] Specifically, the electrode layers 131, 141, 131' and 141' may include a first electrode layer 131 and 131' that are provided on the main body 110 and are connected to the first inner electrode 121 and a second electrode layer 141 and 141' that are provided on the main body 110 and are connected to the second inner electrode 122.

[0061] The first electrode layer 131 and 131' and the second electrode layer 141 and 141' may be respectively connected to the inner electrodes 121 and 122, and may be used to ensure the electrical connection between the outer electrodes 130 and 140 and the inner electrodes 121 and 122.

[0062] The first electrode layers 131 and 131' and the second electrode layers 141 and 141' may include a conductive metal. As the conductive metal, any material having excellent conductivity may be used and there is no particular limitation. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0063] In addition, when the internal electrodes 121 and 122 include Ni and the first electrode layers 131 and 131' and the second electrode layers 141 and 141' include Cu, a Ni-Cu alloy may be formed between the internal electrodes 121 and 122 and the first electrode layers 131 and 131' and the second electrode layers 141 and 141', thereby improving the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130, 140, 130', and 140'.

[0064] In an exemplary embodiment, as a more specific example of the first electrode layers 131 and 131' and the second electrode layers 141 and 141', the electrode layers may be a sintered electrode including a conductive metal (e.g., copper) and glass or may be a resin-based electrode including a conductive metal and a resin.

[0065] Furthermore, the first electrode layers 131 and 131' and the second electrode layers 141 and 141' may be formed by sequentially forming a sintered electrode and a resin-based electrode on the body. Additionally, the electrode layers may be formed by transferring a sheet including a conductive metal onto the body, or may be formed by transferring a sheet including a conductive metal onto the sintered electrode.

[0066] There is no particular limitation on the size of the multilayer electronic components 100 and 100'. For example, the length of the multilayer electronic component 100 may be greater than or equal to 0.85 mm and less than or equal to 1.15 mm, the thickness of the multilayer electronic component 100 may be greater than or equal to 0.35 mm and less than or equal to 0.65 mm, and the width of the multilayer electronic component 100 may be greater than or equal to 0.35 mm and less than or equal to 0.65 mm.

[0067] Here, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, the thickness of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the first direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0068] Figure 2 is a schematic cross-sectional view taken along Figure 1 the line I-I'.

[0069] Figure 3 is a schematic illustration of Figure 2 an enlarged view of the region A.

[0070] Figure 4 is a schematic enlarged view of region A corresponding to Figure 2 in a multi-layer electronic component according to an exemplary embodiment.

[0071] Figure 5 is a schematic enlarged view of region A corresponding to Figure 2 in a multi-layer electronic component according to an exemplary embodiment.

[0072] Figure 6 Schematically shows a method of forming a sealing portion according to an exemplary embodiment.

[0073] Hereinafter, components of the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure will be described in detail with reference to Figures 2 to 6 The outer electrodes 130 and 140 of the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure may include plating portions provided on electrode layers 131 and 141 and including two or more plating layers 132, 133, 134, 142, 143, and 144. The type of each of the two or more plating layers is not particularly limited, and each of the two or more plating layers may be a plating layer including one or more of nickel (Ni), tin (Sn), palladium (Pd), and their alloys.

[0074] Specifically, the plating portion may include a first plating portion and a second plating portion. The first plating portion includes two or more plating layers 132, 133, and 134 provided on the first electrode layer 131, and the second plating portion includes two or more plating layers 142, 143, and 144 provided on the second electrode layer 141.

[0075] In the drawings of the present disclosure, it is shown that the two or more plating layers include three layers, but the plating portion of the present disclosure is not limited to including three plating layers.

[0076] In an exemplary embodiment, the plating portion may include Cu plating layers 132 and 142 provided on electrode layers 131 and 141, Ni plating layers 133 and 143 provided on the Cu plating layers, and Sn plating layers 134 and 144 provided on the Ni plating layers.

[0077] The Cu plating layers 132 and 142 can be used to reduce the stress between the plating portion and the electrode layers 131 and 141, the Ni plating layers 133 and 143 can be used to improve the sealing performance and mechanical strength of the outer electrodes 130 and 140, and the Sn plating layers 134 and 144 can be used to improve the mountability of the multi-layer electronic component 100.

[0078]

[0079] ​Accordingly, according to an exemplary embodiment, when the plating portions include Cu plating layers 132 and 142 provided on the electrode layers 131 and 141, Ni plating layers 133 and 143 provided on the Cu plating layers, and Sn plating layers 134 and 144 provided on the Ni plating layers, the mechanical strength, moisture resistance reliability, and mountability of the multilayer electronic component 100 can be improved.

[0080] Referring to Figure 2 and Figure 3 , the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include sealing portions 151 and 152 that are provided between the plating layers 132, 133, 142, and 143 and the main body 110, include Sn, and are in direct contact with the main body 110.

[0081] The adhesion between the plating layers 132, 133, 142, and 143 and the main body 110 may be weak due to differences in their components. Therefore, gaps may occur between the ends of the plating layers and the main body 110. The gaps may serve as a main penetration path for external moisture or plating solution and may deteriorate the moisture resistance reliability of the multilayer electronic component 100.

[0082] Therefore, since the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure includes the sealing portions 151 and 152 that include Sn and are in direct contact with the main body 110 between the plating layers 132, 133, 142, and 143, gaps between the ends of the plating layers 132, 133, 142, and 143 and the main body 110 can be blocked, thereby improving the moisture resistance reliability of the multilayer electronic component 100. In particular, since the plating portions of the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure include two or more plating layers and the sealing portions 151 and 152 including Sn are provided between the plating layers 132, 133, 142, and 143 and the main body, the moisture resistance reliability of the multilayer electronic component 100 can be further improved.

[0083] Referring to Figure 2 , the ends of the electrode layers 131 and 141 may be in contact with the surface of the main body 110, and when the electrode layers 131 and 141 extend to be provided on at least one of the first surface 1, second surface 2, fifth surface 5, and sixth surface 6 of the main body 110, the ends of the electrode layers 131 and 141 may be in contact with a part of at least one of the first surface 1, second surface 2, fifth surface 5, and sixth surface 6 of the main body 110.

[0084] In an exemplary embodiment, the sealing portions 151 and 152 may be in contact with the ends of the electrode layers 131 and 141. Therefore, it is possible to prevent the electrode layers 131 and 141 from being damaged by the penetrated external moisture or plating solution.

[0085] Referring to Figure 3, the first sealing part 151 can be set not to extend beyond the end of the plating layer 134 provided at the outermost part of the plating part. At this time, the plating layer 134 provided on the outermost part can be in contact with one side surface of the first sealing part 151. Refer to Figure 3 , according to the position of the first sealing part 151 in the region between the plating layers 132 and 133 and the second surface 2 of the main body 110, the first sealing part 151 can be divided into a first region 151a and a second region 151b, and the same can also be true for the second sealing part 152.

[0086] In an exemplary embodiment, the sealing parts 151 and 152 can be set not to extend beyond the end of the plating layer provided at the outermost part of the plating part. Therefore, while reducing the proportion of the outer electrodes 130 and 140 in the entire component, the moisture resistance reliability of the multilayer electronic component 100 can be ensured.

[0087] In addition, refer to Figure 3 , the plating part according to the exemplary embodiment can completely cover the sealing part 151. Therefore, the adhesion strength of the outer electrode can be improved.

[0088] Refer to Figure 4 , the sealing part 151 can extend from the end of the electrode layer 131 to be provided between the end of the plating layer 134 provided at the outermost part of the plating part and the second surface 2 of the main body 110.

[0089] That is to say, the sealing parts 151 and 152 according to the exemplary embodiment can be provided between the plating layers 134 and 144 provided in the outermost part of the plating part and the main body 110. Therefore, by forming the sealing parts 151 and 152 between the ends of all the plating layers 132, 133, 134, 142, 143 and 144 and the main body, the effect of improving the adhesion strength of the outer electrode can be further improved.

[0090] Refer to Figure 5 , the sealing part 151 can be set to extend beyond the end of the plating layer 134 provided at the outermost part of the plating part. In this case, the effect of further improving the barrier to the penetration of external moisture or the effect of extending the penetration path of external moisture can be achieved.

[0091] That is to say, the sealing parts 151 and 152 according to the exemplary embodiment can be set to extend beyond the ends of the plating layers 134 and 144 provided at the outermost part of the plating part. Therefore, the moisture resistance reliability of the multilayer electronic component 100 can be further improved.

[0092] Refer to Figure 4, according to the position of the first sealing portion 151 in the region between two or more plating layers 132, 133, and 134 and the second surface 2 of the main body 110, the first sealing portion 151 can be divided into a first region 151a, a second region 151b, and a third region 151c, and the same can also apply to the second sealing portion 152.

[0093] Specifically, the first region 151a can refer to the region of the sealing portion provided between the first plating layer 132 and the main body 110, the second region 151b can refer to the region of the sealing portion provided between the second plating layer 133 and the main body 110, and the third region 151c can refer to the region of the sealing portion provided between the third plating layer 134 and the main body 110.

[0094] Figure 4 The case where the first region 151a, the second region 151b, and the third region 151c are arranged in sequence is shown, but the present disclosure is not limited thereto, and at least two of the first region 151a, the second region 151b, and the third region 151c can be arranged to be spaced apart from each other in the second direction. Additionally, referring to Figure 5 , the first sealing portion 151 may further include a fourth region 151d that extends beyond the end of the plating layer 134 provided at the outermost portion of the plating portion.

[0095] Additionally, referring to Figure 3 , the average thickness of the sealing portion 151 is denoted as tp. In Figure 3 , the average thickness tp is shown based on the first sealing portion 151, but the average thickness of the second sealing portion 152 may also be shown as tp.

[0096] There is no particular limitation on the lower limit value of the average thickness tp of the sealing portions 151 and 152. For example, when the average thickness tp of the sealing portions 151 and 152 is 1 μm or more, the moisture resistance reliability of the multilayer electronic component 100 can be sufficiently improved. Additionally, there is no particular limitation on the upper limit value of the average thickness tp of the sealing portions 151 and 152. For example, the average thickness tp of the sealing portions 151 and 152 can be 8 μm or less, that is, it can be 1 μm to 8 μm.

[0097] Additionally, the end portions of the electrode layers 131 and 141 can refer to the boundary lines between the electrode layers 131 and 141 and the surfaces of the main body 110 where no electrode layers are formed, and the end portions of the plating layers can refer to the end surfaces of the plating layers facing the main body.

[0098] There is no particular limitation on the method of forming the sealing portions 151 and 152. For example, the sealing portions 151 and 152 can be Sn plating layers. Referring to Figure 6, as a specific example of a method for forming the sealing portions 151 and 152, the following method may be provided: Form an electrode layer 131 on the main body, immerse it in a solution in which Sn is dissolved, remove regions other than the region where the first region 151a is formed with an alkaline solution or an acidic solution, form a first plating layer 132, immerse it again in a solution in which Sn is dissolved, remove regions other than the region where the second region 151b is formed with an alkaline solution or an acidic solution, form a second plating layer 133, and then form the third region 151c and the third plating layer 134 in the same manner. At this time, the formation region of the sealing portion 151 may vary according to the thickness of each plating layer forming the plating portion and / or the shape of each of the regions 151a, 151b, and 151c.

[0099] Figure 8 is a schematic perspective view of a multi-layer electronic component according to another exemplary embodiment in the present disclosure.

[0100] Figure 9 is along Figure 8 taken along line III-III' of the schematic cross-sectional view.

[0101] Figure 10 is Figure 9 schematic enlarged view of region A' of.

[0102] Figure 11 is a multi-layer electronic component according to an exemplary embodiment corresponding to Figure 9 schematic enlarged view of region A' of.

[0103] Figure 12 schematically shows a method for forming a sealing portion according to an exemplary embodiment.

[0104] Hereinafter, a multi-layer electronic component 100' according to another exemplary embodiment in the present disclosure will be described in detail with reference to Figures 8 to 12 , but the content repeated with the multi-layer electronic component 100 according to the exemplary embodiment in the present disclosure is omitted.

[0105] In addition, in Figures 10 to 12 , another exemplary embodiment in the present disclosure is described based on the first external electrode 130' and the first sealing portion 161, but this can also be similarly applied to the second external electrode 140' and the second sealing portion 162.

[0106] According to another exemplary embodiment in the present disclosure, the multi-layer electronic component 100' may include: a main body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately arranged with the dielectric layer; outer electrodes 130' and 140' including electrode layers 131' and 141' disposed on the main body and connected to the inner electrodes, and a plating portion disposed on the electrode layers and including two or more plating layers 132', 133', 134', 142', 143' and 144'; and sealing portions 161 and 162 disposed between the end EP1 of the electrode layer and the end EP2 of the plating portion or between the end EP2 of the plating portion and the main body, and having a recess R2 recessed toward the electrode layer.

[0107] The outer electrodes 130' and 140' of the multi-layer electronic component 100' according to another exemplary embodiment in the present disclosure may include a plating portion disposed on the electrode layers 131' and 141' and having two or more plating layers 132', 133', 134', 142', 143' and 144'. The type of each of the two or more plating layers is not particularly limited, and each of the two or more plating layers may be a plating layer including one or more of nickel (Ni), tin (Sn), palladium (Pd), and their alloys.

[0108] Specifically, the plating portion may include a first plating portion and a second plating portion. The first plating portion includes two or more plating layers 132', 133' and 134' disposed on the first electrode layer 131', and the second plating portion includes two or more plating layers 142', 143' and 144' disposed on the second electrode layer 141'.

[0109] In the drawings of the present disclosure, the two or more plating layers are shown as including three layers, but the plating portion of the present disclosure is not limited to including three plating layers.

[0110] In an exemplary embodiment, the plating portion may include Cu plating layers 132' and 142' disposed on the electrode layers 131' and 141', Ni plating layers 133' and 143' disposed on the Cu plating layers, and Sn plating layers 134' and 144' disposed on the Ni plating layers.

[0111] The Cu plating layers 132' and 142' may be used to relieve the stress between the plating portion and the electrode layers 131' and 141'. The Ni plating layers 133' and 143' may be used to improve the sealing performance and mechanical strength of the outer electrodes 130' and 140'. And the Sn plating layers 134' and 144' may be used to improve the mountability of the multi-layer electronic component 100'.

[0112] Thus, according to an exemplary embodiment, when the plating part includes Cu plating layers 132' and 142' provided on electrode layers 131' and 141', Ni plating layers 133' and 143' provided on the Cu plating layers, and Sn plating layers 134' and 144' provided on the Ni plating layers, the mechanical strength, moisture resistance reliability, and mountability of the multilayer electronic component 100' can be improved.

[0113] Referring to Figure 9 and Figure 10 , the electrode layers 131' and 141' and the plating part may be respectively formed with end portions EP1 and EP2. Additionally, the adhesion force between the end portions EP1 of the electrode layers 131' and 141' and the end portion EP2 of the plating part and the main body 110 may be weak due to differences in their components, and since the end portion of the plating part does not contact the main body 110 or the electrode layers 131' and 141', the electrode layers 131' and 141' and the plating part may be respectively formed with end portions EP1 and EP2 that are outwardly exposed. Additionally, the end portions EP1 of the electrode layers 131' and 141' are vulnerable to external moisture penetration, and thus when the electrode layers 131' and 141' and the plating part are respectively formed with outwardly exposed end portions EP1 and EP2, it may be difficult to ensure the moisture resistance reliability of the multilayer electronic component 100'. Therefore, since the multilayer electronic component 100' according to another exemplary embodiment in the present disclosure includes a sealing part provided between the end portions EP1 of the electrode layers 131' and 141' and the end portion EP2 of the plating part and having a recessed portion R2 that is recessed toward the electrode layers 131' and 141', the moisture resistance reliability of the multilayer electronic component 100' is improved.

[0114] Additionally, the sealing parts 161 and 162 of the multilayer electronic component 100' according to another exemplary embodiment in the present disclosure may have recessed portions that are recessed toward the electrode layers 131' and 141'. The fact that the sealing parts 161 and 162 have recessed portions that are recessed toward the electrode layers 131' and 141' may mean that the sealing parts 161 and 162 have recessed portions that are recessed in the direction toward the electrode layers 131' and 141' in the second direction. Therefore, the moisture resistance reliability of the multilayer electronic component 100' can be ensured while minimizing the proportion of the outer electrodes 130' and 140' and the sealing parts 161 and 162 in the entire component.

[0115] In an exemplary embodiment, the sealing parts 161 and 162 may be arranged not to extend beyond the ends of the outermost plating layer among the plating layers 132', 133', and 134'. Therefore, the moisture resistance reliability of the multilayer electronic component 100' can be ensured while reducing the proportion of the outer electrodes 130 and 140 in the entire component.

[0116] In an exemplary embodiment, the end EP1 of the electrode layers 131' and 141' may refer to the region where the electrode layers 131' and 141' are spaced apart from the plating portion, and the end EP2 of the plating portion may refer to the region where the plating portion is spaced apart from the electrode layers 131' and 141'. As described above, the end EP1 of the electrode layers 131' and 141' may be vulnerable to external moisture penetration. Therefore, in the exemplary embodiment, since the sealing portions 161 and 162 cover the end EP1 of the electrode layer, the moisture resistance reliability of the multilayer electronic component 100' can be further improved.

[0117] Referring Figure 10 , a recess R1 recessed in the second direction from the end E of the electrode layer 131' may be provided between the electrode layer 131' and the plating portion.

[0118] When the electrode layer 131' is a sintered electrode including glass, due to the difference in components, no plating portion is formed at the end EP1 of the electrode layer 131', and thus the recess R1 can be formed.

[0119] When the recess R1 is formed, the end EP1 of the electrode layer 131' may be exposed to the outside. Therefore, there is a risk that the electrode layer 131' may be damaged by external moisture. In particular, since the recess R1 is formed adjacent to the interface intersecting the end EP1 of the electrode layer 131' and the end EP2 of the plating portion, when external moisture penetrates into the recess R1, the adhesion between the electrode layer 131' and the plating portion may be reduced.

[0120] Therefore, by arranging the sealing portions 161 and 162 of the multilayer electronic component 100' according to another exemplary embodiment of the present disclosure to fill the recess R1, damage to the electrode layers 131' and 141' caused by external moisture and a decrease in the adhesion between the electrode layers 131' and 141' and the plating portion can be prevented.

[0121] In addition, in order to further improve the moisture resistance reliability of the multilayer electronic component 100', the sealing portions 161 and 162 may be formed to have a sufficient thickness in the portion vulnerable to moisture penetration.

[0122] Referring Figure 10 , the minimum dimension from the point I where the electrode layer 131', the plating portion, and the sealing portion 161 all contact to the surface of the sealing portion 161 in the second direction is denoted as lp.

[0123] The point where the electrode layer 131' and the plating portion contact is the point where the electrode layer 131' and the plating portion start to separate from each other. Therefore, it is vulnerable to external moisture penetration and may become the main path for external moisture penetration. It is desirable to form the sealing portion 161 as Figure 10It is thick enough in the second direction to prevent moisture from penetrating from the position where the electrode layers 131' and the plating portion are in contact. Therefore, in the exemplary embodiment, the minimum dimension lp from the point I where the electrode layers 131' and 141', the plating portion, and the sealing portions 161 and 162 are in contact simultaneously to the surface of the sealing portions 161 and 162 in the second direction can be adjusted to 10 nm or more, thereby sufficiently preventing moisture from penetrating from the position where the electrode layers 131' and 141' are in contact with the plating portion.

[0124] Referring to Figure 10 , the sealing portion 161 can extend from the end EP1 of the electrode layer 131' to be disposed on a part of the second surface 2 (the surface of the main body adjacent to the end (e.g., the end E) of the electrode layer 131'). That is, the sealing portion 161 according to the exemplary embodiment can extend from the ends EP1 of the electrode layers 131' and 141' to be disposed on the part of the surface of the main body adjacent to the ends E of the electrode layers 131' and 141'. Therefore, the adhesion between the electrode layers 131' and 141' and the main body 110 can be improved.

[0125] Referring to Figure 10 , the sealing portion 161 can be disposed on the following regions: the end of the electrode layer 131', the surface of the main body 110 where the end of the electrode layer 131' is disposed, and at least a part of the end of the plating portion that extends beyond the end of the electrode layer 131' on the surface of the plating portion opposite to the surface of the main body 110 where the end of the electrode layer 131' is disposed. In addition, a part of the end of the plating portion may not be provided with the sealing portion 161. Referring to Figure 10 , the sealing portion 161 can be disposed so as not to extend beyond the end of the coating layer disposed at the outermost part of the plating portion.

[0126] Referring to Figure 10 , although the recess R2 of the sealing portion 161 that is recessed toward the electrode layer 131' is shown to extend (recess) beyond the end E of the electrode layer 131' in the second direction, the present disclosure is not limited thereto.

[0127] Referring to Figure 11 , the recess R2 of the sealing portion 161 that is recessed toward the electrode layer 131' can be disposed so as not to extend (recess) beyond the end E of the electrode layer 131' in the second direction. In this case, since the sealing portion 161 can cover the space between the electrode layer 131' and the plating portion (the space is vulnerable to external moisture penetration) thick enough, the moisture resistance reliability of the multilayer electronic component 100' can be further improved. That is, in the exemplary embodiment, the recesses R2 of the sealing portions 161 and 162 that are recessed toward the electrode layers 131' and 141' are disposed so as not to extend beyond the ends E of the electrode layers 131' and 141' in the second direction, thereby further improving the moisture resistance reliability of the multilayer electronic component 100'.

[0128] In an exemplary embodiment, the second coatings 133' and 143' and the third coatings 134' and 144' of the plating portion may not be provided on the sealing portions 161 and 162. After forming the electrode layers 131' and 141' and the first coatings 132' and 142' and forming the sealing portions 161 and 162, when forming the second coatings 133' and 143' and the third coatings 134' and 144', according to the components of the sealing portions 161 and 162, the second coatings 133' and 143' and the third coatings 134' and 144' may not be provided on the sealing portions 161 and 162. Specifically, when the sealing portions 161 and 162 include an insulating material and the second coatings 133' and 143' and the third coatings 134' and 144' are formed by electroplating, due to the difference in components, the second coatings 133' and 143' and the third coatings 134' and 144' may not be provided on the sealing portions 161 and 162.

[0129] In an exemplary embodiment, the sealing portions 161 and 162 may include a fluorocarbon. The fluorocarbon has excellent chemical resistance and can be formed densely, so it can effectively prevent the penetration of external moisture. In addition, the type of the fluorocarbon is not particularly limited as long as it can form the dense and uniform sealing portions 161 and 162.

[0130] For example, the sealing portions 161 and 162 are fluorocarbons and may include one or more of CF2-, CF3-, and CF-based fluorocarbons.

[0131] The sealing portions 161 and 162 including one or more of CF2-, CF3-, and CF-based fluorocarbons may be formed by an atmospheric pressure plasma coating method.

[0132] Referring to Figure 12 , the sealing portion 161 according to the exemplary embodiment may be formed by an atmospheric pressure plasma coating method after forming the electrode layer 131' and the first coating 132'. Thereafter, the second coating 133' and / or the third coating 134' may be formed, and when the sealing portion 161 includes a fluorocarbon, due to the insulating property of the sealing portion 161, the second coating 133' and / or the third coating 134' may not be provided on the sealing portion 161.

[0133] One of the various effects of the present disclosure is to improve the moisture resistance reliability of the multilayer electronic component by forming a sealing portion between two or more coatings and the main body and adjusting the shape of the sealing portion.

[0134] Although the exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: A main body, comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer; an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a plated portion disposed on the electrode layer and including two or more plated layers; as well as The sealing portion is disposed between the plated portion and the main body, includes Sn, and is in direct contact with the main body.

2. The multilayer electronic component according to claim 1, wherein The sealing portion is in contact with an end portion of the electrode layer.

3. The multilayer electronic component according to claim 1, wherein: The sealing portion is provided so as not to extend beyond a distal end of the plating layer provided at an outermost portion of the plated portion.

4. The multilayer electronic component according to claim 1, wherein: The plated portion completely covers the electrode layer and the sealing portion.

5. The multilayer electronic component according to claim 1, wherein The sealing portion is provided to extend beyond a distal end of the plating layer provided at an outermost portion of the plated portion.

6. The multilayer electronic component according to claim 1, wherein: The inner electrode comprises Ni, The electrode layer comprises Cu and glass, The plated portion includes a Cu plated layer provided on the electrode layer, a Ni plated layer provided on the Cu plated layer, and a Sn plated layer provided on the Ni plated layer.

7. The multilayer electronic component according to claim 1, wherein: The sealing portion is a Sn plating layer.

8. The multilayer electronic component according to claim 1, wherein The average thickness of the sealing portion is in the range from 1 μm to 8 μm.

9. A multilayer electronic component comprising: A main body, comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer; an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a plated portion disposed on the electrode layer and including two or more plated layers; as well as The sealing portion is provided between an end portion of the electrode layer and an end portion of the plated portion and has a first recessed portion recessed toward the electrode layer.

10. The multilayer electronic component according to claim 9, wherein The end portion of the electrode layer is a region where the electrode layer is spaced apart from the plated portion, the end portion of the plated portion is a region where the plated portion is spaced apart from the electrode layer, and the sealing portion covers the end portion of the electrode layer.

11. The multilayer electronic component according to claim 10, wherein: The sealing portion is provided to extend from the end portion of the electrode layer to a portion of the surface of the body adjacent to the end portion of the electrode layer.

12. The multilayer electronic component according to claim 9, wherein When the direction along which the dielectric layers and the internal electrodes are alternately arranged is a first direction and a direction perpendicular to the first direction is a second direction, A second recessed portion recessed from a distal end of the electrode layer in the second direction is provided between the electrode layer and the plated portion, and the sealing portion is provided to fill the second recessed portion.

13. The multilayer electronic component according to claim 9, wherein: When the direction along which the dielectric layers and the internal electrodes are alternately arranged is a first direction and a direction perpendicular to the first direction is a second direction, The minimum dimension from a point where the electrode layer, the plated portion, and the sealing portion are all in contact to a surface of the sealing portion in the second direction is 10 nm or more.

14. The multilayer electronic component according to claim 9, wherein: The seal includes a fluorocarbon.

15. The multilayer electronic component according to claim 9, wherein The sealing part includes one or more of CF2-, CF3- and CF-based fluorocarbon compounds.

16. The multilayer electronic component according to claim 9, wherein The plated portion includes a first plated layer disposed on the electrode layer, a second plated layer disposed on the first plated layer, and a third plated layer disposed on the second plated layer, and The second plating layer and the third plating layer are not provided on the sealing portion.

17. The multilayer electronic component according to claim 9, wherein: When the direction along which the dielectric layers and the internal electrodes are alternately arranged is a first direction and a direction perpendicular to the first direction is a second direction, The first recessed portion of the sealing portion is provided so as not to extend beyond a distal end of the electrode layer in the second direction.

18. The multilayer electronic component according to claim 9, wherein The inner electrode comprises Ni, The electrode layer comprises Cu and glass, The plated portion includes a Cu plated layer provided on the electrode layer, a Ni plated layer provided on the Cu plated layer, and a Sn plated layer provided on the Ni plated layer.

19. A multilayer electronic component comprising: A main body, comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer; an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a plated portion disposed on the electrode layer and including two or more plated layers; and a sealing portion provided between an end of the plated portion and the main body, The sealing portion is configured not to extend beyond an end of the plating layer disposed at an outermost portion of the plating portion.

20. The multilayer electronic component according to claim 19, wherein The end of the electrode layer is a region where the electrode layer is spaced apart from the plated portion, the end of the plated portion is a region where the plated portion is spaced apart from the electrode layer, and The sealing portion covers the end portion of the electrode layer.

21. The multilayer electronic component according to claim 20, wherein The sealing portion extends from the end portion of the electrode layer to be disposed on a portion of the surface of the body adjacent to the end portion of the electrode layer.

22. The multilayer electronic assembly of claim 19, wherein: When the direction along which the dielectric layers and the internal electrodes are alternately arranged is a first direction and a direction perpendicular to the first direction is a second direction, A recessed portion recessed from a distal end of the electrode layer in the second direction is provided between the electrode layer and the plated portion, and the sealing portion is provided to fill the recessed portion.

23. The multilayer electronic assembly of claim 19, wherein: When the direction along which the dielectric layers and the internal electrodes are alternately arranged is a first direction and a direction perpendicular to the first direction is a second direction, The minimum dimension from a point where the electrode layer, the plated portion, and the sealing portion are all in contact to a surface of the sealing portion in the second direction is 10 nm or more.

24. The multilayer electronic assembly of claim 19, wherein: The seal includes a fluorocarbon.

25. The multilayer electronic assembly of claim 19, wherein: The sealing part includes one or more of CF2-, CF3- and CF-based fluorocarbon compounds.

26. The multilayer electronic assembly of claim 19, wherein: The plated portion includes a first plated layer disposed on the electrode layer, a second plated layer disposed on the first plated layer, and a third plated layer disposed on the second plated layer, and The second plating layer and the third plating layer are not provided on the sealing portion.

27. The multilayer electronic assembly of claim 19, wherein: The inner electrode comprises Ni, The electrode layer comprises Cu and glass, The plated portion includes a Cu plated layer provided on the electrode layer, a Ni plated layer provided on the Cu plated layer, and a Sn plated layer provided on the Ni plated layer.

28. An external electrode for an electronic component, comprising: an electrode layer, disposed on the body of the electronic component and directly contacting the internal electrode of the electronic component; a plating portion, disposed on the electrode layer without contacting the main body; as well as a sealing portion, the sealing portion being provided on the following regions: an end portion of the electrode layer, a surface of the main body on which the end portion of the electrode layer is provided, and a surface of the plating portion opposite to the surface of the main body in which the end portion of the plating portion extends beyond at least a portion of the end portion of the electrode layer, wherein the sealing portion comprises a material selected from Sn and fluorocarbons, and The sealing portion does not extend beyond a terminal end of the plated portion disposed at an outermost portion along the surface of the end portion of the body where the electrode layer is disposed.

29. The outer electrode according to claim 28, wherein A portion of the end portion of the plated portion is not provided with the sealing portion.

30. The outer electrode according to claim 28, wherein The entire sealing portion is located between the plated portion and the surface of the end portion of the body where the electrode layer is provided.

31. The outer electrode according to claim 28, wherein The sealing portion includes a recessed portion shaped to be recessed toward the end portion of the electrode layer.

32. The outer electrode according to claim 28, wherein The plated portion includes a plurality of plated layers, and at least one of the plurality of plated layers includes Cu.

33. The outer electrode according to claim 28, wherein The electrode layer includes a sintered electrode including Cu and glass.

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