A vertical movement integrated device and a semiconductor device

Abstract

The present invention discloses a vertical motion integration device and a semiconductor device. The vertical motion integration device includes: a macro motion lifting mechanism, including a bottom plate, a first wedge member, a second wedge member, and a first driving member, the first driving member being configured to drive the first wedge member to move so that the second wedge member performs a vertical macro motion; a micro motion mechanism, including a second driving member, an elastic member, and a stage, the second driving member being configured to drive the stage to perform a vertical micro motion; a jacking mechanism, including a third driving member and a jacking member, the third driving member being configured to drive a plurality of jacking members to perform a vertical motion to jack up a test object carried by the stage. The present invention integrates macro and micro motion adjustment and jacking motion, can achieve millimeter-level macro motion of the wafer stage, nanometer-level micro motion leveling of the wafer, and jacking motion of the wafer. The three motions are independently controlled without interference with each other, and the overall structure is flat and compact, having a small vertical height, facilitating arrangement in a vacuum chamber, having high stiffness, stable in place, and capable of resisting electromagnetic interference.

Description

Technical Field

[0001] The present invention relates to a vertical motion integration device and a semiconductor device, belonging to the technical field of semiconductor devices. Background Art

[0002] In semiconductor front-end metrology equipment, after a wafer is transferred to a vacuum chamber, a lifting mechanism is required to receive and place the wafer. At the same time, in order to achieve focusing with a large depth of focus, the metrology equipment needs to perform vertical macro motion and micro motion to make the imaging on the best focal plane. With the development of semiconductor manufacturing technology, the resolution of optical inspection equipment has also been continuously improved, posing higher requirements for the vertical motion accuracy, overall height dimension, and electromagnetic shielding of the stage.

[0003] At present, most Z-direction stages can only achieve single motion adjustment. For example, the leveling and focusing device disclosed in the Chinese patent document with the publication number CN221687493U realizes vertical motion through four piezoelectric drive microstep motors and cannot achieve independent adjustment of macro motion and micro motion. There are also other motions realized in a stacked form. For example, a stage device for wafer inspection disclosed in the Chinese patent document with the publication number CN117080156A arranges the lifting mechanism above the rotating platform. However, such a stacked layout will increase the vertical height and Abbe error.

[0004] In addition, most of the existing lifting mechanisms use voice coil motors or set the motors outside and lift through a lever mechanism. For example, a Z-axis motion platform and its usage method disclosed in the Chinese patent document with the publication number CN119419167A. This lever-type lifting method will generate eccentric force, which is not conducive to the stability of the stage, and the structure is complex. It is necessary to open holes on the vacuum chamber to connect the external motor, which is not conducive to ensuring the airtightness of the vacuum chamber, and the voice coil motor also brings the problem of electromagnetic interference.

[0005] In view of the above problems in the prior art, no effective solution has been proposed yet. Summary of the Invention

[0006] To solve the above problems, the present invention provides a vertical motion integration device and a semiconductor device. The vertical motion integration device integrates macro and micro motion adjustment and lifting motion, and can realize millimeter-level macro motion, nanometer-level micro motion leveling, and wafer lifting motion of the wafer stage. The three motions are independently controlled without interference, and the overall structure is flat and compact, with a small vertical height, which is convenient for arrangement in the vacuum chamber, has high stiffness, stable in place, and can resist electromagnetic interference.

[0007] In a first aspect, the present invention provides a vertical motion integration device, including:

[0008] The macro lifting mechanism includes a bottom plate, a first wedge member connected to the bottom plate, a second wedge member connected to the first wedge member, and a first driving member drivingly connected to the first wedge member. The first driving member is used to drive the first wedge member to move so that the second wedge member makes a vertical macro movement;

[0009] The micro motion mechanism includes a second driving member fixedly connected to the second wedge member, an elastic member drivingly connected to the second driving member, and a stage connected to the elastic member and used to carry the object to be measured. The second driving member is used to drive the stage to make a vertical micro movement;

[0010] The jacking mechanism is disposed in the accommodation space provided in the first wedge member and the second wedge member, and includes a third driving member and a plurality of jacking members drivingly connected to the third driving member and passing through the stage. The third driving member is used to drive the plurality of jacking members to make a vertical movement to jack up the object to be measured carried by the stage.

[0011] In an embodiment of the present invention, the macro lifting mechanism further includes a crossed roller guide rail. A guide rail mounting seat is fixedly installed on the bottom plate. One branch of the crossed roller guide rail is fixedly installed on the side surface of the second wedge member, and the other branch is fixedly installed on the guide rail mounting seat. Multiple pairs of the crossed roller guide rails are respectively arranged at multiple corners of the second wedge member.

[0012] In an embodiment of the present invention, a friction member is installed on the side surface of the first wedge member. The first driving member is adapted to the friction member. The first driving member is used to drive the friction member and the first wedge member fixedly connected to the friction member to move horizontally. The plurality of first driving members are symmetrically arranged on both sides of the first wedge member.

[0013] In an embodiment of the present invention, the micro motion mechanism further includes a first mounting block fixedly installed on the side surface of the second wedge member, a first base fixedly installed on the first mounting block, and a second driving member installed between the first base and the elastic member. The elastic member is fixedly installed on the first base. The output end of the second driving member is connected to the elastic member. A tension spring is arranged between the elastic member and the second wedge member.

[0014] In an embodiment of the present invention, the elastic member includes a mounting portion, a protruding portion, and an extending portion that are connected to each other. The mounting portion is fixedly mounted on the first base. The protruding portion protrudes upward and is fixedly connected to the output end of the second driving member through a connecting member. The extending portion extends above the second wedge member. The carrier is fixedly connected to the extending portion. A gasket is fixedly mounted above the extending portion. The carrier is placed on the gasket. A first fixing member is fixedly mounted at the end of the extending portion. The second wedge member located below the first fixing member is provided with a mounting hole. A second fixing member is fixedly mounted in the mounting hole. The tension spring is disposed in the mounting hole and connected between the first fixing member and the second fixing member.

[0015] In an embodiment of the present invention, the bottom plate is provided with a first guide rail and a first slider slidably connected to the first guide rail. The first wedge member is fixedly mounted on the first slider. The top surface of the first wedge member is an inclined surface and is provided with a second guide rail and a second slider slidably connected to the second guide rail. The bottom surface of the second wedge member is an inclined surface and is fixedly mounted on the second slider. A first mounting plate is fixedly mounted on the bottom plate. The first driving member is mounted on the first mounting plate.

[0016] In an embodiment of the present invention, the macro motion lifting mechanism further includes a support structure and a measurement feedback mechanism. The support structure includes a support base fixedly mounted on the bottom plate. A compression spring and a pressure rod are disposed in the support base. The compression spring abuts between the support base and the pressure rod. One end of the pressure rod passes through the inner diameter of the compression spring, and the other end abuts against the second wedge member. The measurement feedback mechanism includes a reading head mounting seat fixedly mounted on the bottom plate and a reading head fixedly mounted on the reading head mounting seat. The second wedge member is provided with a through groove. A grating scale adapted to the reading head is fixed on the side surface of the through groove. The reading head is parallel to the grating scale. The reading head and the reading head mounting seat are located in the through groove.

[0017] In an embodiment of the present invention, the jacking mechanism includes a second mounting block and a fixed shaft fixedly mounted on the bottom plate. The third driving member is fixedly mounted on the second mounting block. The third driving member is drivingly connected to a moving member for driving the moving member to move. The moving member is fixedly connected to a lifting member. The lifting member is slidably connected outside the fixed shaft. A support frame is fixedly mounted on the lifting member. A plurality of jacking members are mounted on the support frame. A plurality of the moving members are symmetrically connected to both sides of the lifting member.

[0018] In one embodiment of the present invention, the first driving member is an ultrasonic motor; the second driving member is a piezoelectric ceramic actuator; the third driving member and the moving member constitute a piezoelectric micro-stepping motor, the third driving member is a piezoelectric block, and the moving member is a ceramic rod and is inserted into the third driving member.

[0019] In a second aspect, the present invention provides a semiconductor device, comprising the vertical motion integration device.

[0020] The beneficial effects of the present invention are:

[0021] The present invention provides a vertical motion integrated device and semiconductor equipment, which integrates a micro-motion mechanism and a lifting mechanism on a macro-motion lifting mechanism. The micro-motion mechanism is arranged on the side of the second wedge-shaped member, and the lifting mechanism is arranged in the accommodation space between the first wedge-shaped member and the second wedge-shaped member, which fully utilizes the space and reduces the vertical height. Through the macro-motion lifting mechanism, macro-motion adjustment can be performed to achieve millimeter-level macro-motion of the wafer stage, and through the micro-motion mechanism, micro-motion adjustment can be performed to achieve nanometer-level micro-motion leveling of the wafer stage. Through the coordinated use of the macro-motion lifting mechanism and the micro-motion mechanism, the wafer stage can be stably lifted to a specified height, thereby meeting different wafer quantity detection requirements. The wafer is lifted upward by the lifting mechanism to facilitate the reception of the wafer, and a smooth lifting movement of the wafer can be achieved. Therefore, the vertical motion integrated device integrates macro- and micro-motion adjustment and lifting motion, and can realize millimeter-level macro-motion of the wafer stage, nanometer-level micro-motion leveling, and lifting motion of the wafer. The three motions are independently controlled without interfering with each other. The overall structure is flat and compact, with a small vertical height, which is convenient for arrangement in the vacuum chamber. It has high rigidity, is stable in place, and can resist electromagnetic interference.

[0022] Moreover, the macro-motion lifting mechanism adopts a wedge mechanism composed of a first wedge and a second wedge, which can drive a larger load movement with a smaller output force, and at the same time greatly reduces the height in the Z movement direction, making the structure more compact and convenient for modular integration. Guide rails are provided between each motion mechanism to reduce friction, make the movement smoother, reduce the output force of the corresponding motor, and select a smaller motor. In addition, the motors all use vacuum-compatible piezoelectric motors, which are arranged inside the vacuum cavity and directly driven as actuators, eliminating the complex intermediate transmission links, and are more efficient. There is no need to design an interface on the vacuum cavity, eliminating the risk of seal leakage. In addition, the piezoelectric motor will not introduce electromagnetic compatibility issues, and there is no need to set up electromagnetic shielding. After reaching the preset position, the piezoelectric motor can remain relatively stationary, and will not perform frequent servo control jitter, so it can achieve higher positioning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional diagram of a vertical motion integration device provided in an embodiment of the present invention.

[0024] Figure 2 The perspective view of the vertical motion integrated device provided by the embodiment of the present invention without a stage.

[0025] Figure 3 The perspective view of the macro motion lifting mechanism provided by the embodiment of the present invention.

[0026] Figure 4 The perspective view of the macro motion lifting mechanism provided by the embodiment of the present invention without the second wedge.

[0027] Figure 5 The side view of the macro motion lifting mechanism provided by the embodiment of the present invention without the second wedge.

[0028] Figure 6 The top view of the macro motion lifting mechanism provided by the embodiment of the present invention without the second wedge.

[0029] Figure 7 The side view of the vertical motion integrated device provided by the embodiment of the present invention.

[0030] Figure 8 The perspective view of the fine motion mechanism provided by the embodiment of the present invention.

[0031] Figure 9 The perspective view of the fine motion mechanism from another perspective provided by the embodiment of the present invention.

[0032] Figure 10 The front view of the jacking mechanism provided by the embodiment of the present invention.

[0033] Figure 11 The perspective view of the jacking mechanism provided by the embodiment of the present invention.

[0034] In the figure: 1. Macro moving and lifting mechanism; 11. Base plate; 111. First guide rail; 112. Groove; 113. First slider; 12. First wedge member; 121. Second guide rail; 122. Second slider; 13. Second wedge member; 131. Through groove; 132. Mounting hole; 14. First driving member; 141. First mounting plate; 15. Friction member; 16. Cross roller guide rail; 161. Guide rail mounting seat; 17. Support structure; 171. Support base; 172. Compression spring; 173. Pressing rod; 18. Measurement feedback mechanism; 181. Reading head; 182. Reading head mounting seat; 183. Grating scale; 19. Accommodating space; 2. Micro motion mechanism; 21. First mounting block; 22. First base; 23. Second driving member; 231. Connecting member; 24. Elastic member; 241. Mounting portion; 242. Protruding portion; 243. Extending portion; 25. Spacer; 26. Carrier; 27. First fixing member; 28. Second fixing member; 3. Jacking mechanism; 31. Second mounting block; 32. Third driving member; 33. Moving member; 34. Lifting member; 35. Support frame; 36. Jacking member; 37. Fixed shaft. Detailed implementation manners

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0037] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mount", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the connection inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0038] Please refer to Figure 1 、 Figure 2 and Figure 3 , embodiments of the present invention provide a vertical motion integration device, which includes a macro motion lifting mechanism 1, a micro motion mechanism 2 and a jacking mechanism 3. The jacking mechanism 3 and several micro motion mechanisms 2 are arranged on the macro motion lifting mechanism 1.

[0039] In this embodiment, four micro motion mechanisms 2 are arranged at the four corners of the macro motion lifting mechanism 1, and the jacking mechanism 3 is arranged in the middle of the macro motion lifting mechanism 1.

[0040] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , in some embodiments, the macro motion lifting mechanism 1 includes a bottom plate 11, a first wedge 12 slidably connected to the bottom plate 11, and a second wedge 13 slidably connected to the first wedge 12; grooves 112 are provided on both sides of the bottom plate 11, and a first guide rail 111 and a first slider 113 slidably connected to the first guide rail 111 are installed in the grooves 112. The first wedge 12 is fixedly installed on the first slider 113. The top surface of the first wedge 12 is an inclined surface and is provided with a second guide rail 121 and a second slider 122 slidably connected to the second guide rail 121. The bottom surface of the second wedge 13 is an inclined surface and is fixedly installed on the second slider 122.

[0041] In this embodiment, the first guide rail 111 is a horizontal guide rail, the second guide rail 121 is an inclined guide rail, the bottom surface of the first wedge 12 is a plane and is slidably connected to the horizontal guide rail. The top surface of the first wedge 12 is an inclined surface and is provided with an inclined guide rail. The bottom surface of the second wedge 13 is an inclined surface and is slidably connected to the inclined guide rail. Thus, the macro motion lifting effect is achieved through the mutual sliding cooperation between the two wedges.

[0042] Optionally, a first mounting plate 141 is fixedly installed on the bottom plate 11, a first driving member 14 is installed on the first mounting plate 141, a friction member 15 is installed on the side surface of the first wedge 12, the first driving member 14 is adapted to the friction member 15, and the first driving member 14 is used to drive the friction member 15 and the first wedge 12 fixedly connected to the friction member 15 to move along the first guide rail 111.

[0043] Optionally, two first driving members 14 are symmetrically arranged on both sides of the first wedge 12.

[0044] In this embodiment, a friction member 15 is adhered to the side surface of the first wedge member 12. The friction member 15 can be in a strip structure. The first driving member 14 is installed on the first mounting plate 141, and the first mounting plate 141 is fixed to the bottom plate 11. There are two first driving members 14, and the two first driving members 14 are symmetrically arranged on both sides of the first wedge member 12. Such an arrangement can balance the force and avoid generating a deflection moment in the horizontal direction.

[0045] Optionally, the macro motion lifting mechanism 1 further includes a crossed roller guide 16. A guide rail mounting seat 161 is fixedly installed on the bottom plate 11. One branch of the crossed roller guide 16 is fixedly installed on the side surface of the second wedge member 13, and the other branch is fixedly installed on the guide rail mounting seat 161.

[0046] In this embodiment, one branch of the crossed roller guide 16 is installed on the side surface of the second wedge member 13, and the other branch is installed on the guide rail mounting seat 161. The guide rail mounting seat 161 is fixed to the bottom plate 11. Four pairs of crossed roller guides 16 are arranged at the four corners of the second wedge member 13. The first driving member 14 is an ultrasonic motor. When the ultrasonic motor works, the contact head of the ultrasonic motor abuts against the friction member 15, driving the friction member 15 and the first wedge member 12 to perform a linear motion in the horizontal direction along the first guide rail 111. The horizontal motion of the second wedge member 13 is restricted by the crossed roller guide 16, and only the lifting motion in the Z direction is retained, thereby driving the second wedge member 13 to perform a vertical lifting motion. Thus, through the guiding action of the four pairs of crossed roller guides 16, the parasitic motions of the second wedge member 13 in the horizontal motion in the XY direction and the rotation in the Z direction are restricted, and only the single-degree-of-freedom in the Z direction is retained.

[0047] Among them, both the first wedge member 12 and the second wedge member 13 are wedge-shaped plate structures. The wedge angle θ of the wedge member determines the wedge ratio of the motion distance L in the horizontal direction and the lifting height H in the vertical direction of the macro motion lifting mechanism 1, and their relationship is , and a fixed lifting height H can be obtained by controlling the motion distance L in the horizontal direction. Assuming that the thrust required by the motor is F, G is the load gravity, θ is the wedge angle, α is the friction angle, and the friction coefficient μ = tanα. It can be deduced that the thrust F needs to satisfy . Compared with directly lifting the load G, the wedge-shaped structure can play a role in saving force. The smaller the wedge angle, the smaller the friction force, and the smaller the thrust required by the motor.

[0048] Optionally, the macro motion lifting mechanism 1 further includes a support structure 17. The support structure 17 includes a support base 171 fixedly installed on the bottom plate 11. A compression spring 172 and a pressure rod 173 are arranged inside the support base 171. The compression spring 172 abuts between the support base 171 and the pressure rod 173. One end of the pressure rod 173 passes through the inner diameter of the compression spring 172, and the other end abuts in a hole groove provided on the second wedge member 13. When the macro motion lifting mechanism 1 works, the deformation amount of the compression spring 172 will change with the movement of the second wedge member 13, but it is always in a compressed state to provide an upward support force to offset part of the load gravity.

[0049] Optionally, the macro motion lifting mechanism 1 further includes a measurement feedback mechanism 18. The measurement feedback mechanism 18 includes a reading head mounting seat 182 fixedly installed on the bottom plate 11 and a reading head 181 fixedly installed on the reading head mounting seat 182. A through groove 131 is provided on the second wedge member 13, and a grating scale 183 adapted to the reading head 181 is fixed on the side of the through groove 131. The reading head 181 is parallel to the grating scale 183, and the reading head 181 and the reading head mounting seat 182 are located in the through groove 131.

[0050] In this embodiment, the grating scale 183 can be pasted on the side of the through groove 131. The mounting hole provided on the reading head mounting seat 182 for fixing the reading head 181 can be set as a waist-shaped hole. The position of the reading head 181 is adjusted through the waist-shaped hole to ensure that the reading head 181 and the grating scale 183 are parallel. When the second wedge member 13 is lifted to a specified height, the distance information is measured, and the first driving member 14 performs closed-loop control through the measurement result to ensure the motion accuracy. Thus, high-precision closed-loop feedback control can be achieved by the cooperation of the first driving member 14 and the grating scale 183.

[0051] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 7 、 Figure 8 and Figure 9 In some embodiments, the micro motion mechanism 2 includes a first mounting block 21 fixedly installed on the side of the second wedge member 13, a first base 22 fixedly installed on the first mounting block 21, an elastic member 24 fixedly installed on the first base 22, and a second driving member 23 installed between the first base 22 and the elastic member 24. The output end of the second driving member 23 is connected to the elastic member 24, and a carrier 26 is fixedly connected to the elastic member 24. A tension spring is arranged between the elastic member 24 and the second wedge member 13.

[0052] Optionally, the elastic member 24 is a sheet-like structure, including a mounting portion 241, a convex portion 242, and an extending portion 243 that are connected to each other. The mounting portion 241 is fixedly mounted on the first base 22. The convex portion 242 protrudes upward and is fixedly connected to the output end of the second driving member 23 through a connecting member 231. The extending portion 243 extends above the second wedge member 13, and the stage 26 is fixedly connected to the extending portion 243.

[0053] Optionally, a gasket 25 is fixedly mounted above the extending portion 243, and the stage 26 is placed on the gasket 25.

[0054] Optionally, a first fixing member 27 is fixedly mounted at the end of the extending portion 243. The second wedge member 13 located below the first fixing member 27 is provided with a mounting hole 132. A second fixing member 28 is fixedly mounted in the mounting hole 132. A tension spring is disposed in the mounting hole 132 and is connected between the first fixing member 27 and the second fixing member 28.

[0055] In this embodiment, the first mounting block 21 is fixedly mounted on the side surface of the second wedge member 13. This mounting structure can save height space. The stage 26 can be set as a honeycomb structure, which can ensure sufficient support strength and reduce deformation. The number of the micro-motion mechanisms 2 is four, and the four micro-motion mechanisms 2 are disposed below the four corners of the stage 26 to play a role in supporting and micro-motion leveling. The tension spring is connected between the first fixing member 27 and the second fixing member 28 to provide a vertical pulling force. Optionally, the second driving member 23 is a stacked piezoelectric ceramic brake.

[0056] When the device moves, first, the macro-motion lifting mechanism 1 will drive the micro-motion mechanism 2 to rise together. When the rough adjustment of the macro-motion lifting mechanism 1 ends, it will be fixed at a certain height. At this time, the four stacked piezoelectric ceramic brakes are powered on for micro-motion and leveling. The elastic member 24 is a flexible hinge structure, which has weak rigidity in the vertical direction and high rigidity in the horizontal direction, and can reduce parasitic motion in the horizontal direction; at the same time, the extending portion 243 of the elastic member 24 is similar to a lever mechanism, which plays a role in displacement amplification. The tension spring provides a vertically pre-tightened pulling force, which can make the micro-motion rising of the stage 26 more stable. The setting of the elastic member 24 and the tension spring of the micro-motion mechanism 2 ensures high rigidity in the XY direction while releasing the vertical degree of freedom, which helps the stage 26 to rise smoothly. Thus, by the combined use of the macro-motion lifting mechanism 1 and the micro-motion mechanism 2, the stage 26 for carrying the wafer can be stably lifted to a specified height, so as to meet the detection requirements of different wafer quantities.

[0057] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 10 and Figure 11In some embodiments, a receiving space 19 is provided in the first wedge-shaped member 12 and the second wedge-shaped member 13 of the macro-motion lifting mechanism 1 , and the lifting mechanism 3 is provided in the receiving space 19 .

[0058] In this embodiment, the first wedge-shaped member 12 and the second wedge-shaped member 13 of the macro-motion lifting mechanism 1 are provided with a hollow accommodation space 19 inside, which can accommodate the arrangement of the entire lifting mechanism 3, further reducing the height in the Z direction.

[0059] In some embodiments, the lifting mechanism 3 includes a second mounting block 31 and a fixed shaft 37 fixedly mounted on the base plate 11, the second mounting block 31 is mounted with a third driving member 32, the third driving member 32 is drivingly connected to a moving member 33, and is used to drive the moving member 33 to move, the moving member 33 is fixedly connected to a lifting member 34, the lifting member 34 is slidably connected to the outside of the fixed shaft 37, a support frame 35 is fixedly mounted on the lifting member 34, a plurality of lifting members 36 are mounted on the support frame 35, and the plurality of lifting members 36 are penetrated through the carrier 26.

[0060] Optionally, the support frame 35 is a tripod mounted on the lifting member 34, and the support frame 35 is set as a hollow structure to reduce the load. In this embodiment, three lifting members 36 are respectively installed at the three corners of the tripod, and the lifting members 36 pass through the platform 26 and the avoidance holes set between the insulating support plate and the electrostatic chuck located above the platform 26 to lift the wafer. Among them, the insulating support plate and the electrostatic chuck above the platform 26 are not shown in the figure.

[0061] Optionally, the third driving member 32 and the moving member 33 form a piezoelectric micro-stepping motor, the third driving member 32 is a piezoelectric block, and the moving member 33 is a ceramic rod, the ceramic rod passes through the piezoelectric block, and threaded holes are provided at both ends of the ceramic rod for connection with the lifting member 34. The piezoelectric micro-stepping motor is set as a pair, symmetrically connected to the two ends of the lifting member 34, which can offset the deflection of the support frame 35, make the force uniform, and ensure the stable force during lifting.

[0062] In this embodiment, the lifting member 34 can be slidably connected to the outside of the fixed shaft 37 through a sliding bearing so that it can slide smoothly. The centroid of the line connecting the three lifting members 36 must pass through the center of gravity of the wafer to ensure that the wafer is stably lifted without tilting. When the third driving member 32 is energized, the moving member 33 drives the lifting member 34 and the support frame 35 to move upward, and the three lifting members 36 lift the wafer upward to facilitate the reception of the wafer. The piezoelectric micro-stepping motor used here utilizes the walking principle of piezoelectric ceramics, and can be small in size and large in travel. It is also vacuum compatible and can be directly driven in the vacuum chamber, eliminating unnecessary structural transmission.

[0063] In summary, the vertical motion integrated device provided by the present invention integrates a micro-motion mechanism 2 and a lifting mechanism 3 on a macro-motion lifting mechanism 1, wherein the micro-motion mechanism 2 is arranged on the side of the second wedge 13, and the lifting mechanism 3 is arranged in the accommodating space 19 between the first wedge 12 and the second wedge 13, so as to make full use of the space and reduce the vertical height. Through the macro-motion lifting mechanism 1, macro-motion adjustment can be performed to achieve the macro-motion of the wafer stage 26 at the millimeter level, and through the micro-motion adjustment of the micro-motion mechanism 2, micro-motion leveling of the wafer stage 26 at the nanometer level can be achieved. Through the coordinated use of the macro-motion lifting mechanism 1 and the micro-motion mechanism 2, the wafer stage 26 can be stably lifted to a specified height, thereby adapting to different wafer quantity detection requirements. The wafer is lifted upward by the lifting mechanism 3 to facilitate the reception of the wafer, so that the wafer can be lifted smoothly. Therefore, the vertical motion integrated device integrates macro- and micro-motion adjustment and lifting motion, and can realize millimeter-level macro-motion of the wafer stage, nanometer-level micro-motion leveling, and lifting motion of the wafer. The three motions are independently controlled without interfering with each other. The overall structure is flat and compact, with a small vertical height, which is convenient for arrangement in the vacuum chamber. It has high rigidity, is stable in place, and can resist electromagnetic interference.

[0064] Moreover, the macro-motion lifting mechanism 1 adopts a wedge mechanism composed of a first wedge 12 and a second wedge 13, which can drive a larger load movement with a smaller output force, and at the same time greatly reduce the height in the Z movement direction, making the structure more compact and convenient for modular integration. Guide rails are arranged between each motion mechanism to reduce friction, make the movement smoother, reduce the output force of the corresponding motor, and select a smaller motor. In addition, the motors all use vacuum-compatible piezoelectric motors, which are arranged inside the vacuum cavity and directly driven as actuators, eliminating the complex intermediate transmission links, and are more efficient. There is no need to design an interface on the vacuum cavity, eliminating the risk of sealing leakage. Moreover, the piezoelectric motor will not introduce electromagnetic compatibility problems, and there is no need to set up electromagnetic shielding. After reaching the preset position, the piezoelectric motor can remain relatively stationary, and will not perform frequent servo control jitter, so that higher positioning accuracy can be achieved.

[0065] In addition, an embodiment of the present invention further provides a semiconductor device, which includes the vertical motion integration device described above. Since the semiconductor device uses any one of the vertical motion integration devices described above, it has all the advantages described above.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A vertical motion integration device, characterized in that, Comprising: A macro motion lifting mechanism (1), including a bottom plate (11), a first wedge member (12) connected to the bottom plate (11), a second wedge member (13) connected to the first wedge member (12), and a first driving member (14) drivingly connected to the first wedge member (12), the first driving member (14) being configured to drive the first wedge member (12) to move so that the second wedge member (13) performs a vertical macro motion; A micro motion mechanism (2), including a second driving member (23) fixedly connected to the second wedge member (13), an elastic member (24) drivingly connected to the second driving member (23), and a stage (26) connected to the elastic member (24) and for carrying a test object, the second driving member (23) being configured to drive the stage (26) to perform a vertical micro motion; A jacking mechanism (3), disposed in a receiving space (19) provided in the first wedge member (12) and the second wedge member (13), including a third driving member (32), and a plurality of jacking members (36) drivingly connected to the third driving member (32) and passing through the stage (26), the third driving member (32) being configured to drive the plurality of jacking members (36) to perform a vertical motion to jack up the test object carried by the stage (26); The micro motion mechanism (2) further includes a first mounting block (21) fixedly installed on the side surface of the second wedge member (13), a first base (22) fixedly installed on the first mounting block (21), and a second driving member (23) installed between the first base (22) and the elastic member (24), the elastic member (24) being fixedly installed on the first base (22), an output end of the second driving member (23) being connected to the elastic member (24), and a tension spring being provided between the elastic member (24) and the second wedge member (13).

2. The integrated device for vertical movement according to claim 1, characterized in that The macro motion lifting mechanism (1) further includes a crossed roller guide (16), a guide rail mounting seat (161) being fixedly installed on the bottom plate (11), one branch of the crossed roller guide (16) being fixedly installed on the side surface of the second wedge member (13), and the other branch being fixedly installed on the guide rail mounting seat (161), and a plurality of pairs of the crossed roller guides (16) being respectively disposed at multiple corners of the second wedge member (13).

3. The integrated device for vertical movement according to claim 1, characterized in that, A friction member (15) is installed on the side surface of the first wedge member (12), the first driving member (14) is adapted to the friction member (15), the first driving member (14) is configured to drive the friction member (15) and the first wedge member (12) fixedly connected to the friction member (15) to move horizontally, and a plurality of the first driving members (14) are symmetrically arranged on both sides of the first wedge member (12).

4. The integrated device for vertical movement according to claim 1, wherein The elastic member (24) includes a mounting portion (241), a convex portion (242), and an extending portion (243) that are connected to each other. The mounting portion (241) is fixedly mounted on the first base (22). The convex portion (242) protrudes upward and is fixedly connected to the output end of the second driving member (23) through a connecting member (231). The extending portion (243) extends above the second wedge member (13). The carrier table (26) is fixedly connected to the extending portion (243). A gasket (25) is fixedly mounted above the extending portion (243). The carrier table (26) is placed on the gasket (25). A first fixing member (27) is fixedly mounted at the end of the extending portion (243). An installation hole (132) is provided on the second wedge member (13) below the first fixing member (27). A second fixing member (28) is fixedly mounted in the installation hole (132). The tension spring is disposed in the installation hole (132) and is connected between the first fixing member (27) and the second fixing member (28).

5. The integrated device for vertical movement according to claim 1, wherein The bottom plate (11) is provided with a first guide rail (111) and a first slider (113) slidably connected to the first guide rail (111). The first wedge member (12) is fixedly mounted on the first slider (113). The top surface of the first wedge member (12) is an inclined surface and is provided with a second guide rail (121) and a second slider (122) slidably connected to the second guide rail (121). The bottom surface of the second wedge member (13) is an inclined surface and is fixedly mounted on the second slider (122). A first mounting plate (141) is fixedly mounted on the bottom plate (11). The first driving member (14) is mounted on the first mounting plate (141).

6. The integrated device for vertical movement according to claim 1, wherein The macro motion lifting mechanism (1) further includes a support structure (17) and a measurement feedback mechanism (18). The support structure (17) includes a support base (171) fixedly mounted on the bottom plate (11). A compression spring (172) and a pressure rod (173) are disposed in the support base (171). The compression spring (172) abuts between the support base (171) and the pressure rod (173). One end of the pressure rod (173) passes through the inner diameter of the compression spring (172), and the other end abuts against the second wedge member (13). The measurement feedback mechanism (18) includes a reading head mounting seat (182) fixedly mounted on the bottom plate (11) and a reading head (181) fixedly mounted on the reading head mounting seat (182). A through groove (131) is provided on the second wedge member (13). A grating scale (183) adapted to the reading head (181) is fixed to the side of the through groove (131). The reading head (181) is parallel to the grating scale (183). The reading head (181) and the reading head mounting seat (182) are located in the through groove (131).

7. The integrated device for vertical movement according to claim 1, wherein The jacking mechanism (3) includes a second mounting block (31) and a fixed shaft (37) fixedly mounted on the bottom plate (11). The third driving member (32) is fixedly mounted on the second mounting block (31). The third driving member (32) is drivingly connected to a moving member (33) for driving the moving member (33) to move. The moving member (33) is fixedly connected to a lifting member (34). The lifting member (34) is slidably connected to the outside of the fixed shaft (37). A support frame (35) is fixedly mounted on the lifting member (34). A plurality of jacking members (36) are mounted on the support frame (35). The plurality of moving members (33) are symmetrically connected to both sides of the lifting member (34).

8. The integrated device for vertical movement according to claim 7, wherein, The first driving member (14) is an ultrasonic motor; the second driving member (23) is a piezoelectric ceramic actuator; the third driving member (32) and the moving member (33) form a piezoelectric micro-step motor. The third driving member (32) is a piezoelectric block, and the moving member (33) is a ceramic rod and is disposed through the third driving member (32).

9. A semiconductor device, characterized in that, It includes a vertical movement integration device according to any one of claims 1-8.

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