Apparatus for power conversion and method of manufacturing power converter assembly

Abstract

The present disclosure includes an apparatus for power conversion including a power converter component and a method of manufacturing a power converter component. The power converter assembly includes: a stack of a plurality of circuit layers; a plurality of transformer windings disposed in the stack of the plurality of circuit layers, the plurality of transformer windings including one or more primary windings and one or more secondary windings; and a first connection interface operable to connect the stack of the plurality of circuit layers to the main substrate. The first connection interface may be disposed on a first surface of the stack of the plurality of circuit layers. A first surface, e.g., an edge of the plurality of circuit layers, may be disposed substantially orthogonal with respect to a planar surface of each of the plurality of circuit layers stacked to provide a favorable output of an output voltage generated by the power converter assembly to a load, e.g., through the main substrate.

Description

Technical Field

[0001] The present disclosure generally relates to the field of electronics and, more particularly, to power converter components. Background Art

[0002] A conventional printed circuit board (PCB) or printed wiring board is a laminated structure of conductive layers separated by insulating layers. Generally, a PCB has two functions. The first function is to fix electronic components at designated positions on the outer layer by soldering. An electronic circuit instantiated by the populated circuit board is designed to provide one or more specific functions. After manufacturing, the electronic circuit is powered to perform the desired functions.

[0003] Generally, a printed circuit board is a planar device, and multiple components thereon are interconnected via traces to provide the functions as previously discussed. Such an implementation of manufacturing a circuit on a planar circuit board component is limited in size.

[0004] Generally, current power converter designs utilize a VRD circuit from 12 volts intermediate voltage to 48 volts with a multiphase circuit to be mounted to a motherboard / substrate. These existing solutions provide a solution from a 12-volt intermediate rail with higher density and efficiency, but these solutions are driven by a combination of a 48-volt input rail to a 12-volt rail and 12 volts to the core with a VR module, and these two losses are added to the total loss.

[0005] Currently, conventional 48V to core power converter solutions are mounted laterally to power a processor, and due to the PDN circuit having a higher additional trace resistance, the lateral loss is high when power is supplied from the motherboard to the processor core substrate to power the processor. The lateral support of power also has a much higher inductance in series with the processor, which causes a higher transient of the processor due to the high di / dt of the current transient that must pass through this series inductance. Due to the series resistance and inductance, the efficiency is reduced and the transient is deteriorated. Currently, the 48-volt converter to the core uses a lossy series connection to connect laterally. Due to the higher series inductance of the load, higher density cannot be achieved, and the transient current requires more capacitors to meet the specifications. Summary of the Invention

[0006] The realization of clean energy (or green technology) is very important for reducing the impact of humans on the environment. Generally, clean energy includes any evolving methods and materials for reducing the overall toxicity of energy consumption on the environment.

[0007] The present disclosure includes the observation that raw energy, such as received from green or non - green energy sources, typically needs to be converted into a suitable form (e.g., a desired AC voltage, DC voltage, etc.) before it can be used to power end - devices such as servers, computers, mobile communication devices, etc. Whether the energy is received from green or non - green energy sources, it is desirable to most efficiently use the raw energy provided by such systems to reduce our impact on the environment. The present disclosure helps to reduce our carbon footprint (and green energy) through more efficient energy conversion and the implementation of circuits that support more efficient energy conversion.

[0008] As discussed herein, a fabricator produces one or more components to provide a higher - density circuit than conventional instantiations of circuits on a planar circuit board.

[0009] More specifically, the present disclosure includes apparatuses, systems, methods, etc. The apparatus can be configured to include a power - converter assembly that includes: a stack of a plurality of circuit layers; a plurality of transformer windings disposed in the stack of the plurality of circuit layers, the plurality of transformer windings including one or more primary windings and one or more secondary windings; and a first connection interface for connecting the stack of the plurality of circuit layers to a substrate. The first connection interface can be disposed on a first surface of the stack of the plurality of circuit layers. The first surface is disposed to be substantially orthogonal to the plurality of circuit layers of the stack for beneficial connection.

[0010] In one example, the plurality of transformer windings in the stack includes a plurality of primary windings and a plurality of secondary windings. The nodes of one or more of the secondary windings in the stack can terminate at the first surface of the stack. The nodes of the plurality of primary windings can terminate at a second surface of the power - converter assembly. The second surface can be disposed on the stack opposite the first surface.

[0011] As further discussed hereinafter, the plurality of transformer windings can be disposed between the plurality of circuit layers in the stack.

[0012] In addition, the apparatus discussed herein may include both a power converter assembly and a main substrate. Optionally, a first connection interface of the power converter assembly may be directly coupled to a first planar surface region of the main substrate. A plurality of circuit layers in a stack may be disposed orthogonal to the first planar surface region of the main substrate, to which the first connection interface of the power converter assembly is directly or indirectly coupled. As previously discussed, the plurality of transformer windings in the stack include a primary winding and a secondary winding. The secondary windings in the stack may be configured to collectively output an output voltage to power a load. Optionally, the load may be directly coupled to a second planar surface region of the main substrate. The second planar surface region of the main substrate may be disposed opposite the first planar surface region of the main substrate such that the main substrate is disposed between the load and the power converter assembly including the plurality of circuit layers.

[0013] According to a further example, as previously discussed, the plurality of transformer windings may include a primary winding and a secondary winding. The apparatus may also include an interposer substrate (also referred to as an intermediate substrate) disposed between the first connection interface of the power converter assembly and the first planar surface of the main substrate. In such a case, the power converter assembly is directly coupled to the surface of the main substrate. The interposer substrate (also referred to as a distribution board) may be configured to include a first circuit path that connects axial ends or nodes of the plurality of secondary windings in the stack to a first node disposed on the first planar surface (e.g., bottom surface) of the main substrate. In such a case, the first node may be disposed on the first planar surface of the main substrate and aligned with a second node disposed on the second planar surface of the main substrate. The second planar surface of the main substrate may be disposed opposite the first planar surface of the main substrate. A second circuit path may be disposed in the main substrate to provide a connection between the first node disposed on the first surface of the main substrate and the second node disposed on the second surface of the main substrate.

[0014] The apparatus as discussed herein may also include a load directly coupled to the second planar surface of the main substrate. The first circuit path may be configured to transfer power received from the power converter assembly to the main substrate. Additionally, the second circuit path of the main substrate may be configured to transfer power received from the first circuit path of the interposer (also referred to as the intermediate substrate or distribution board) through the main substrate to power the load.

[0015] In another example, a power converter assembly as discussed herein may be configured to include one or more magnetic structures extending through a stack of multiple circuit layers. Multiple transformer windings may be wound around one or more magnetic structures to provide magnetic coupling between each other. The respective axial length of each magnetic structure in the magnetic structures may be disposed parallel to the planar surface of the main substrate to which the first connection interface is attached. In such a case, the multiple circuit layers in the stack are disposed orthogonal (or perpendicular) to the planar surface of the main substrate (e.g., in a horizontal plane).

[0016] In yet another example, alternatively, if desired, the respective axial length of each magnetic structure in the magnetic structures may be set to be orthogonal to the planar surface of the main substrate to which the first connection interface is attached. In such a case, the multiple circuit layers of the stack are disposed parallel to the planar surface of the main substrate.

[0017] As previously discussed, the multiple transformer windings may include secondary windings that are magnetically or inductively coupled to corresponding primary windings. Note that the power converter assembly may be configured to include a first switching circuit, e.g., one or more switches operable to control the respective current through the primary winding. The stack of multiple layers may also include a second surface disposed opposite the first surface. The first switching circuit may be disposed in the power converter assembly closer to the second surface of the stack of multiple circuit layers than to the first surface.

[0018] In addition, a power converter assembly as discussed herein may be configured to include a second switching circuit operable to control the respective current through the secondary winding. The second switching circuit may be positioned in the power converter assembly closer to the first surface of the stack of multiple circuit layers than to the second surface.

[0019] It should also be noted that the device as discussed herein may be configured to include a main substrate (first circuit board) and a second circuit board. The power converter assembly may be disposed between the second circuit board and the main substrate. Additionally, in one arrangement, the main substrate is disposed between a load such as an electronic circuit and the power converter assembly. The load may be coupled to the main substrate; the load may be powered by the power converter assembly via the electric power transmitted from the power converter assembly through the main substrate to the load.

[0020] Another example of the device as discussed herein includes a second connection interface disposed on the second surface of the stack of multiple circuit layers. The second surface may be disposed opposite the first surface of the stack of multiple circuit layers. The power converter assembly may be configured to convert a DC input voltage received from the second connection interface into a DC output voltage output from the first connection interface of the power converter assembly.

[0021] In yet another example, the plurality of circuit layers in the stack includes any number of circuit layers, such as a first circuit board layer and a second circuit board layer. The plurality of circuit layers in the stack may include a first circuit board layer and a second circuit board layer. The first terminal of the first secondary winding of the plurality of transformer windings may be connected to a first circuit board edge node disposed on the edge of the first circuit board layer; and the first terminal of the second secondary winding of the plurality of transformer windings may be connected to a second circuit board edge node disposed on the edge of the second circuit board layer. The first circuit board edge node may be aligned with the second circuit board edge node.

[0022] Additional examples herein include a method of manufacturing a power converter assembly, the method including: manufacturing the power converter assembly to include a stack of a plurality of circuit layers, the stack of the plurality of circuit layers including a plurality of transformer windings, the transformer windings including one or more primary windings and one or more secondary windings; and manufacturing the stack of the plurality of circuit layers to include a first connection interface operable to connect the stack of the plurality of circuit layers to a main substrate, the first connection interface being disposed on a first surface of the power converter assembly.

[0023] It should be noted that the present disclosure includes useful technologies. For example, compared with conventional technologies, the novel circuits discussed herein provide a method for manufacturing high-density circuits to supply power to a load.

[0024] It should also be noted that any of the resources discussed herein may include one or more computerized devices, apparatuses, hardware, etc. that execute and / or support any or all of the method operations disclosed herein. In other words, one or more computerized devices or processors may be programmed and / or configured to operate as illustrated herein to implement the different technologies described herein.

[0025] Other aspects of the present disclosure include software programs and / or corresponding hardware for performing any of the operations summarized above and disclosed in detail below.

[0026] In addition, it should be noted that although each of the different features, technologies, configurations, etc. herein may be discussed in different places in the present disclosure, it is intended that, where appropriate, each of the concepts in the concept may be optionally executed independently of each other or in combination with each other. Therefore, one or more of the present inventions described herein may be implemented and observed in many different ways.

[0027] In addition, it should be noted that the initial discussion of the technology herein (Summary of the Invention) is not intended to identify every novel aspect of the present disclosure or the claimed invention. Instead, the Summary of the Invention only presents general aspects and corresponding points of novelty relative to conventional technology. For additional details and / or possible aspects (arrangements) of the present invention, the reader is referred to the Detailed Description section (which is a summary) of the present disclosure and the corresponding drawings, as discussed further below. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is an example diagram showing a power converter circuit including a power converter component as discussed herein.

[0029] Figure 2A and Figure 2B is an example diagram showing the manufacture of a power converter component as discussed herein.

[0030] Figure 3 is an example diagram showing a plurality of primary windings disposed in corresponding circuit layers of a power converter component as discussed herein.

[0031] Figure 4 is an example diagram showing a plurality of secondary windings disposed in a circuit layer of a power converter component as discussed herein.

[0032] Figure 5 is an example diagram showing the flow of magnetic flux in a power converter component as discussed herein.

[0033] Figure 6 is an example diagram showing the controlled current flow through corresponding primary and secondary windings of a power converter component as discussed herein.

[0034] Figure 7 is an example diagram showing different views of a corresponding power converter component as discussed herein.

[0035] Figure 8 is an example diagram showing an implementation of a plurality of arrays of power converter components for generating an output voltage to power a load as discussed herein.

[0036] Figure 9 is an example diagram showing the footprint of implementing a plurality of power converter components as discussed herein.

[0037] Figure 10 is an example diagram showing a power converter circuit as discussed herein.

[0038] Figure 11A and Figure 11B is an example diagram showing the manufacture of a power converter component as discussed herein.

[0039] Figure 12A and Figure 12B is an example diagram showing a controlled flow of current through corresponding windings of a power converter assembly as discussed herein.

[0040] Figure 13 is an example diagram showing a manufacturing method as discussed herein.

[0041] Figure 14 is an example side view showing an implementation of corresponding power converter assemblies for providing power to a load disposed on a main board as discussed herein.

[0042] Figure 15 is an example front view showing a plurality of surface pads disposed on an edge of a multi-layer assembly for coupling to a corresponding main substrate as discussed herein.

[0043] As shown in the drawings, the foregoing and other objects, features, and advantages of the present disclosure will become apparent from the following more specific description herein, in which like reference numerals refer to like parts in different views. The drawings are not necessarily to scale, but rather emphasize illustrating principles, concepts, aspects, technologies, etc. Detailed Description

[0044] As previously discussed, the present disclosure is more useful than conventional techniques. For example, compared to conventional techniques, the novel components discussed herein support the fabrication of high-density circuits (e.g., power converter circuits).

[0045] Now, more specifically, Figure 1 is an example diagram showing a power converter circuit as discussed herein.

[0046] As Figure 1 shown, a power supply 100 (e.g., a DC-DC power converter) includes a controller 140, a switch driver 111-1, a switch driver 111-2, switches SP1, SP2, capacitors C11, C12, a transformer T1, switches SS1, SS2, an output capacitor C111, and a load 118. The power converter assembly 101 includes a corresponding transformer T1.

[0047] Capacitors C11 and C12 are serially disposed between an input voltage source 121 and a ground reference voltage (potential). A node B of the transformer T1 is connected to a circuit path that serially connects the capacitor C11 to the capacitor C12.

[0048] As further shown, switches SP1 and SP2 are serially arranged between the input voltage source 121 and the ground reference voltage GND. For example, the drain (D) node of switch SP1 (e.g., a field effect transistor or other suitable entity) is connected to the input voltage source 121; the source node (S) of switch SP1 is connected to the drain node (D) of switch SP2 (e.g., a field effect transistor or other suitable entity); the source node (S) of switch SP2 is connected to the ground reference voltage (GND). Additionally, both the source node (S) of switch SP1 and the drain node (D) of switch SP2 are connected to node A of transformer T1.

[0049] Transformer T1 includes a corresponding first primary winding (e.g., implemented via one or more parallel windings) disposed between node A and node X, and a second primary winding (e.g., implemented via one or more parallel windings) disposed between node X and node B. Transformer T1 also includes a first secondary winding (e.g., implemented via one or more parallel windings) disposed between node C and node D1. Transformer T1 also includes a second secondary winding (e.g., implemented via one or more parallel windings) disposed between node D2 and node E.

[0050] The combination of the primary windings of transformer T1 is serially arranged between node A and node B. The combination of the secondary windings of transformer T1 is serially arranged between node C and node E.

[0051] Furthermore, the secondary windings of transformer T1 are magnetically or inductively coupled to the primary windings of transformer T1. Each of the center nodes D1 and D2 generates a corresponding output voltage (Vout) to power a corresponding load 118.

[0052] In this example, controller 140 generates corresponding signals S1, S2, S3, and S4. Signal S1 controls the operation of switch SP1; signal S2 controls the operation of switch SP2; signal S3 controls the operation of switch SS1; signal S4 controls the operation of switch SS2.

[0053] Based on the appropriate switching of switches SP1, SP2, SS1, and SS2, the power converter assembly 101 converts the input voltage Vin (e.g., a DC input voltage) into a corresponding output voltage Vout (e.g., a DC output voltage) and output current 108 to power a corresponding load 118.

[0054] More specifically, during power conversion operation, switches SP1 and SP2 are switched by controller 140 to control the flow of current 107 through the primary winding of transformer T1, thereby transferring energy from the primary winding serially disposed between node A and node B to the secondary winding of transformer T1. The switching of switches SS1 and SS2 controls the transfer of output current 108 and output voltage Vout from the secondary winding and node D (e.g., a center tap node or a node of the corresponding transformer T1 providing a series connection of the secondary winding) to load 118 and corresponding output capacitor C111.

[0055] Thus, power supply 100 illustrates the conversion of an input voltage Vin such as 48 volts DC or other suitable magnitude to a corresponding output voltage Vout such as 1 volt DC or other suitable magnitude.

[0056] Figure 2A and Figure 2B is an example diagram showing the manufacture of a power converter assembly as discussed herein.

[0057] In Figure 2A the example of, fabricator 150 produces power converter assembly 101 to include a plurality of circuit layers 210, each circuit layer separated by a corresponding insulating material. Each layer in the multi - layer can be a layer of conductive material such as metal and a layer of insulating material such as a circuit board, or include a layer of conductive material such as metal and a layer of insulating material such as a circuit board. The combination of conductive materials (separated by insulating materials) associated with the plurality of different circuit layers 210 forms the windings of transformer T1.

[0058] As further shown, power converter assembly 101 includes a plurality of cores (e.g., cylinders or other suitable shapes) of magnetic material (P1, P2, P3) extending through the stack of the plurality of circuit layers 210. For example, power converter assembly 101 includes magnetic material P1 extending axially along the z - axis through each of the plurality of circuit layers 210; power converter assembly 101 includes magnetic material P2 extending axially along the z - axis through each of the plurality of circuit layers 210; power converter assembly 101 includes magnetic material P3 extending axially along the z - axis through each of the plurality of circuit layers 210.

[0059] As further shown, magnetic material P1, magnetic material P2, and magnetic material P3 are arranged parallel to each other and spaced apart from each other along the x - axis.

[0060] The power converter assembly 101 includes a plurality of circuit layers 210 stacked along the z-axis. Note that the power converter assembly 101 and the corresponding plurality of circuit layers 210 may include any number of circuit layers; each planar-shaped circuit layer in the planar-shaped circuit layers is disposed in the X-Y plane. For example, the power converter assembly 101 includes a stack of circuit layers 210, and the circuit layers 210 include a circuit layer CB1 (e.g., a first circuit board layer and corresponding conductive material), a circuit layer CB2 (e.g., a second circuit board layer and corresponding conductive material), a circuit layer CB3 (e.g., a third circuit board layer and corresponding conductive material), etc.

[0061] Figure 2B Further fabrication of the power converter assembly 101 is shown to include a magnetic material strip PB1 in contact with each of the magnetic material columns (P1, P2, and P3). As shown in other figures, note that the power converter assembly 101 also includes a corresponding magnetic material strip PB2 on the bottom side of the power converter assembly 101. Each of the top surfaces associated with the magnetic materials P1, P2, P3 may be in contact with the magnetic material strip PB1. Each of the bottom surfaces associated with the magnetic materials P1, P2, P3 may be in contact with the magnetic material strip PB2 of the power converter assembly 101. Thus, the stack of the plurality of circuit layers 210 associated with the power converter assembly is disposed or sandwiched between the magnetic material strip PB1 and the magnetic material strip PB2, wherein the structures of the magnetic materials P1, P2, and P3 extend through each of the plurality of circuit layers 210.

[0062] As discussed herein, for example, in Figure 6 each of the magnetic material strips provides a path for supporting the flow of magnetic flux generated due to current flowing through the corresponding primary winding of the transformer T1 between node A and node B.

[0063] In addition, note that Figure 2B the power converter assembly 101 in

[0064] Figure 3 is an example exploded view showing a plurality of primary windings disposed in the corresponding circuit layers of the power converter assembly as discussed herein.

[0065] As previously discussed, a stack of multiple circuit layers 210 (e.g., a circuit board or other suitable type of component and corresponding metal layers) can be configured to include a first circuit layer CB1, a second circuit layer CB2, etc. A primary winding disposed on one or more of the circuit layers CB1, CB3, CB5, … can be staggered relative to a secondary winding disposed on one or more of the circuit layers CB2, CB4, CB6, …. Note that any interleaved combination is possible.

[0066] In this example, the first circuit layer CB1 includes corresponding conductive paths 311 (a first primary winding, e.g., one turn or more) disposed on at least one planar substrate 320-1 (non-conductive material or insulator material) disposed in the X-Y plane.

[0067] The conductive paths 311 associated with one or more circuit layers extend counterclockwise from node A around the magnetic material P1 at one or more layers of the stack of layers 210. Note that the conductive paths can be configured to wind around the magnetic material P1 one or more times, e.g., via the conductive path 311-1 disposed on the substrate 320-1, the conductive path 311-2 disposed on the substrate 320-3, etc. Thus, as previously discussed, the primary winding implemented by the conductive paths 311-1, 311-2, etc. can include any number of turns.

[0068] As further shown, after winding counterclockwise around the magnetic material P1 one or more times at one or more circuit layers such as circuit layers CB1, CB3, etc., the conductive path 311 (e.g., via the conductive path 311-4, the conductive path 311-3, etc.) extends to further include one or more clockwise turns around the magnetic material P3 at one or more circuit layers. After winding around the magnetic material P3 one or more times at one or more circuit layers, the conductive path 311 finally terminates at node B. Node X corresponding to the conductive path 311 of the corresponding transformer T1 corresponds to the midpoint between one or more turns of the conductive path around the magnetic material P1 and one or more turns of the conductive path around the magnetic material P3.

[0069] As previously discussed, the power converter assembly 101 can be configured to include one or more instances of primary windings disposed in parallel, each instance being implemented at one or more circuit board layers of the power converter assembly 101.

[0070] The flow of current through one or more instances of the corresponding conductive path 311 from node A through node X to node B causes magnetic flux to pass through the corresponding magnetic materials P1 and P3.

[0071] As previously discussed, the second circuit layer CB2 of the stack of layer 210 is disposed between the first circuit layer CB1, the third circuit layer CB3, and so on. Thus, as further discussed herein, a secondary winding at one or more of the circuit layers 210 can be interleaved with a primary winding disposed at one or more layers of the power converter assembly 101 in any manner.

[0072] As previously discussed, transformer T1 can include any number of instances of a primary winding (e.g., implemented by conductive path 311) extending between node A and node B.

[0073] Additionally, note that one or more instances of a corresponding conductive path, such as conductive path 311, can be of any shape or thickness.

[0074] Figure 4 is an example exploded view showing a plurality of secondary windings disposed in corresponding circuit layers of a power converter assembly as discussed herein.

[0075] In this example, the second circuit layer CB2 includes a corresponding conductive path 411-1 (e.g., a first secondary winding disposed on a planar substrate 320-2 (non-conductive material) of the power converter assembly 101) and a corresponding layer in the stack in the X-Y plane. In this example, the conductive path 411-1 extends counterclockwise around the magnetic material P1 from node C and returns to node D1 (e.g., an edge node of the circuit board 320-2) disposed on the surface 222 of the power converter assembly 101.

[0076] As further shown, the second circuit layer CB2 also includes a corresponding conductive path 411-2, such as a second secondary winding disposed on the planar substrate 320-2 (non-conductive material) in the X-Y plane. The conductive path 411-2 extends counterclockwise around the magnetic material P3 from node E and returns to node D2 (e.g., an edge node of the circuit board 320-2) disposed on the surface 222 of the power converter assembly 101.

[0077] As further shown, the second circuit layer CB4 also includes a corresponding conductive path 411-3, such as a third secondary winding disposed on a planar substrate 320-4 (non-conductive material) in the X-Y plane. The conductive path 411-3 extends counterclockwise around the magnetic material P1 from node C and returns to node D1 (e.g., an edge node of the circuit board 320-4) disposed on the surface 222 of the power converter assembly 101.

[0078] As further shown, the second circuit layer CB4 also includes corresponding conductive paths 411-4, such as a fourth secondary winding disposed on a planar substrate 320-4 (non-conductive material) in the X-Y plane. The conductive path 411-4 extends counterclockwise from node E around the magnetic conductive material P3 and returns to node D2 (e.g., an edge node of the circuit board 320-4) disposed on the surface 222 of the power converter assembly 101.

[0079] As previously discussed, the flow of current through one or more instances of the corresponding conductive path 311 causes magnetic flux to pass through the corresponding magnetic conductive materials P1, P2, and P3. Since the secondary windings (one or more instances of the conductive paths 411-1, 411-2, etc. at multiple circuit board layers) are magnetically coupled to the primary winding (one or more instances of the conductive path 311), the magnetic flux passing through the magnetic conductive material P1 and the magnetic conductive material P3 causes current to flow through the secondary windings (e.g., the conductive path 411-1, the conductive path 411-2, the conductive path 413-3, the conductive path 411-4, etc.).

[0080] More specifically, one or more parallel secondary windings implemented via the conductive paths 411-1, 411-3, etc. in different layers of the power converter assembly 101 generate an output current 108-1 from node D1 of the power converter assembly 101. One or more parallel secondary windings implemented via the conductive paths 411-2, 411-4, etc. in different layers of the power converter assembly 101 generate an output current 108-2 from node D2 of the power converter assembly 101. The total output current 108 from the combination of nodes D1 and D2 is the sum of the output current 108-1 and the output current 108-2.

[0081] As previously discussed, the second circuit layer CB2 is disposed between the first circuit layer CB1 and the third circuit layer CB3; the fourth circuit layer CB4 is disposed between the third circuit layer CB3 and the fifth circuit layer CB5; and so on.

[0082] As previously discussed, the power converter assembly can be configured to include any number of circuit layers that include corresponding secondary windings. Additionally, note that the corresponding conductive paths, such as the conductive paths 411-1, 411-2, 411-3, 411-4, etc., can be of any shape or thickness.

[0083] Referring again to Figure 1 , as previously discussed, the controller 140 controls the flow of current 107 supplied to node A and through each combination of one or more instances of the primary winding in the power converter assembly 101. For example, as previously discussed, on the input side of the power converter assembly 101, the controller 140 controls the operation of the switches SP1 and SP2.

[0084] In addition, on the output side of the power converter assembly 101, the controller 140 controls the operation of switches SS1 and SS2, and thus controls the combination of the respective currents through the conductive paths (secondary windings) such as conductive path 411-1, conductive path 411-2, conductive path 411-3, conductive path 411-4, etc., to generate the respective output current 108 and output voltage Vout that power the load 118.

[0085] Figure 5 is an example side view showing the flow of magnetic flux in the power converter assembly as discussed herein.

[0086] As previously discussed, the flow of current 107 through the primary winding of transformer T1 causes the generation of magnetic flux MF2-1, which passes through the magnetic material P3, magnetic material strip PB1, magnetic material P2, and magnetic material strip PB2 in the Figure 5 manner shown.

[0087] The flow of current 107 through the primary winding of transformer T1 also causes the generation of magnetic flux MF2-2, which passes through the magnetic material P1, magnetic material strip PB1, magnetic material P2, and magnetic material strip PB2 in the Figure 5 manner shown. The combination of the fluxes can cancel out in the magnetic material P2.

[0088] Figure 6 is an example diagram showing the control of the flow of current through the respective windings of the power converter assembly as discussed herein.

[0089] As previously discussed, the controller 140 controls the flow of current 107 supplied to node A and through one or more instances (a series connection of one or more primary windings) of the conductive path 311 in the power converter assembly 101 in parallel combination. For example, as previously discussed, on the input side of the power supply 100, the controller 140 controls the operation of switches SP1 and SP2. In this example, switches SP1 and SP2 and corresponding capacitors C11 and C12 are located in or on the power converter assembly 101 itself. Nodes A and B are located internally relative to the surface 221 of the power converter assembly 101. The power converter assembly receives an input voltage Vin and a corresponding ground reference (GND) from any suitable entity. For example, the power converter assembly 101 can be configured to receive a ground reference potential from surface 222 and convey it through the power converter assembly 101 to node 202 disposed on the surface 221 of the power converter assembly 101. The power converter assembly 101 can be configured to receive an input voltage from node 201 disposed on surface 221. Alternatively, the power converter assembly 101 can be configured to receive an input voltage from surface 222. One or more layers in the power converter assembly 101 can be configured to convey the input voltage to switch SP1. One or more layers in the power converter semiconductor are configured to convey the ground reference voltage to switch SP2. An additional circuit path in the power converter assembly 101 is in series with switch SP2 through the connection of switch SP1.

[0090] In addition, the power converter assembly 101 can be configured to include switches SS1 and SS2 on the output side of the power converter assembly 101. In the manner previously discussed, the controller 140 controls the operation of switches SS1 and SS2 and the corresponding currents 108-1 and 108-2 through one or more instances of the conductive paths 411-1 and 411-2 (secondary windings) to generate a corresponding output voltage Vout and current 108 for powering the load 118.

[0091] More specifically, node D1 can be a first surface pad disposed on surface 222 (the edge of circuit layer CB2, circuit layer CB4, circuit layer CB6, etc.) for connecting the power converter assembly 101 to another component, such as a main circuit board substrate, as further discussed herein. Node D1 outputs the output voltage Vout and the output current 108-1. As previously discussed, node D1 (e.g., a common node or surface pad disposed on one or more edges of a circuit board associated with the power converter assembly 101) can be configured to output the output voltage Vout and the corresponding output current 108-1.

[0092] Node D2 can be a second surface pad disposed on surface 222 (the edge of circuit layer CB2, circuit layer CB4, circuit layer CB6, etc.) for connecting the power converter assembly 101 to another component, such as a main circuit board substrate. Node D2 outputs output voltage Vout and corresponding output current 108-2. Thus, as previously discussed, node D2 (e.g., a common node or surface pad disposed on the edge of the circuit board associated with the power converter assembly 101) can be configured to output output voltage Vout and corresponding output current 108-2.

[0093] In one example, in the case where the power converter assembly 101 is connected to a corresponding substrate such as a motherboard, an interposer, etc., node D1 is electrically connected to node D2 via one or more conductive paths of the main substrate, or an insertion connection node D1 is connected without connecting D2. Otherwise, node D1 and D2 can be electrically isolated from each other. The presence of node D1 as the first surface pad of the power converter assembly and node D2 as the second surface pad of the power converter assembly provides the ability to provide direct connections of the output nodes D1 and D2 of the secondary winding in the power converter assembly 101 to the substrate and / or corresponding load. As further discussed herein, multiple instances of the power converter assembly 101 can operate in parallel to provide corresponding output current and output voltage to the load.

[0094] Figure 15 is an example front view showing multiple surface pads disposed on the edge of a multi-layer component for coupling to a corresponding main substrate discussed herein.

[0095] As shown in this example, and as previously discussed, as Figure 15 shown, the front surface 222 of the power converter assembly 101 is broken into blocks or surface pads, such as V+ (e.g., surface pads D1, D2) and Vgnd (e.g., surface pads G1, G2, etc.). As previously discussed, each of the nodes D1, D2, G1, G2, etc. disposed on the edge of the power converter assembly 101 is connected to a corresponding one or more layers of the circuit board 210. The corresponding nodes on surface 222 are ultimately soldered to the main circuit board. In one example, the surface (e.g., made of metal as previously discussed) associated with each of the nodes can be copper-etched to provide good soldering to the corresponding main circuit board to which it is attached.

[0096] Therefore, it should be noted that the corresponding nodes V+ and Vgnd can be etched, such as surface nodes D1, D2, G1, G2, etc. Etching these exposed surface nodes D1, D2, G1, G2, etc. on the edge of the power converter assembly 101 makes it excellent to solder the power converter assembly 101 and the corresponding nodes to any corresponding main substrate to which the power converter assembly 101 is attached.

[0097] Figure 7 are example diagrams showing different views of corresponding power converter assemblies as discussed herein.

[0098] As Figure 7 shown, the power converter assembly 101 can be configured to include a combination of multiple circuit layers 210, magnetic materials (e.g., magnetic material PB1, magnetic material PB2, magnetic material P1, magnetic material P2, magnetic material P3), switches SP1, SP2, SS1, and SS2. The power converter assembly 101 can also include a substrate 821. A surface 222 (e.g., including nodes D1 and D2) of the power converter assembly 101 can be directly coupled to a surface 821-1 of the substrate 821. A surface 821-2 of the substrate 821 can be directly coupled to a bottom surface of the substrate 841.

[0099] More specifically, as shown in view 811 (at the lower left of Figure 7 ), the surface 222 of the power converter assembly 101 can be coupled to the surface 821-1 of the substrate 821. In such a case, in the presence of the substrate 821 (e.g., an insertion board or a power distribution board), the substrate 821 is disposed between the surface 222 of the power converter assembly 101 and the substrate 841. In the absence of the substrate 821, as Figure 14 shown, the surface 222 of the power converter assembly 101 is directly coupled to the substrate 841. In such a case, the substrate 841 is disposed between the load 118 and the surface 222 of the power converter assembly 101.

[0100] Referring again to Figure 7 and the corresponding view 811, a load 118 such as an electronic circuit (e.g., a microprocessor or other electronic circuit) can be attached to the corresponding substrate 841 via a conductive node 852 (e.g., a surface pad, a solder ball, etc.).

[0101] The substrate 841 can be configured to include surface pads and corresponding conductive paths 851 that provide connections between conductive nodes 825 (e.g., surface pads, solder balls, etc.) disposed on a surface 821-2 of the substrate 821 and corresponding conductive nodes 852 of the load 118.

[0102] To simplify the routing of the corresponding output voltage, ground reference voltage, or other signals transmitted from the power converter assembly 101 to the load 118 or the substrate 841, the combination of nodes 825, conductive paths 851, and conductive nodes 852 can be configured to be aligned with each other along the y-axis. In such a case, the substrate or interposer 821 is a so-called power distribution board that provides conductive paths and appropriate circuit routing between the power converter assembly 101 and the substrate 841.

[0103] Note that the conductive path 851 can be configured to transfer any signal such as ground, output voltage Vout, etc. from the power converter assembly 101 and / or the substrate 841 to the load 118, and vice versa. One or more additional circuit paths in the substrate 821 can be configured to transfer the ground reference voltage from the substrate 841 to the power converter assembly 101. Additionally, note that, if desired, the power converter assembly can be configured to receive an input voltage at or via the substrate 831. In such a case, the substrate 831 provides the input voltage to the power converter assembly 101. Additionally or alternatively, the power converter assembly 101 can be configured to receive the input voltage from the substrate 841 through the substrate 821.

[0104] As further shown, the heat sink 815 is attached to the substrate 831 to provide heat dissipation associated with the power converter assembly 101.

[0105] As previously discussed, the power converter assembly 101 includes a surface 222. The surface 222 can be directly coupled to the surface 821-1 of the substrate 821. View 810 ( Figure 7 upper left in) shows the surface 821-1 of the substrate 821. In one example, via the connection from the surface 222 to the substrate 821, the substrate 821 receives the generated output voltage (e.g., via node D1 and node D2). Via one or more conductive paths in the substrate 821, the substrate 821 transfers the generated output voltage and / or the ground reference voltage to the surface nodes provided on the surface 821-2 of the substrate 821. Thus, in this example, each + box (Vout) or - box (ground) is etched with copper on the outer surface disk of the power converter assembly 101 to provide the connection of the corresponding nodes (e.g., node D1, node D2, node G1, node G2, etc.) of the power converter assembly 101 to the substrate 841 or the substrate 821. In one example, the substrate 841 provides the ground reference voltage to the power converter assembly through the ground node G1 and the ground node G2 (see Figure 6 and the corresponding surface disks G1 and G2 provided on the surface 222 of the power converter 101).

[0106] Referring again to Figure 7 , alternatively, note that the substrate 821 may not be included in the power converter assembly 101. In such a case, the surface 222 of the power converter assembly 101 can be directly connected to the corresponding nodes (825) on the bottom side (surface) of the substrate 841. In other words, if desired, for example, the port of the surface 222 of the power converter assembly 101 can be directly coupled to the first planar surface area of the main substrate 841 (see Figure 14)。Multiple circuit layers 210 in the stack can be arranged orthogonal to the first planar surface area of the main substrate 841, and the surface 222 of the power converter assembly is directly coupled to this first planar surface area.

[0107] In addition, in Figure 7 this example of, note that the load 118 is directly coupled to the planar surface area of the main substrate 841. The planar surface area of the main substrate 841 to which the load 118 is attached is disposed opposite to the planar surface area of the main substrate 841 to which the substrate 821 is attached. In such a case, the main substrate 841 is disposed between the load 118 and the corresponding combination of the substrate 821 and the power converter assembly 101.

[0108] As previously discussed, a substrate 821 such as an interposer substrate or an intermediate circuit board can be disposed between the first connection interface (e.g., surface 222) of the power converter assembly 101 and the first planar surface of the main substrate 841. In addition, as previously discussed, the substrate 821 includes conductive circuit paths that connect the axial ends or terminals of multiple secondary windings (e.g., nodes D1, D2, etc.) in the stack to nodes 825 disposed on the first planar surface of the main substrate 841. As previously discussed, the nodes (825) disposed on the planar surface of the main substrate 841 can be aligned with the second nodes (852) disposed on the second planar surface of the main substrate 841. As previously discussed, the conductive circuit path 851 in the main substrate 841 provides a connection between the first node 825 disposed on the main substrate 841 and the second node 852 disposed on the second surface of the main substrate 841, thereby supporting the connection to the load 118.

[0109] As shown in ([ Figure 7 the lower right of) view 812, multiple circuit layers 210 in the stack are arranged orthogonal to the planar surfaces of the substrate 841 and the substrate 821. As previously discussed, the power converter assembly 101 can be configured to include a first switch circuit operable to control the respective currents through the primary windings of the transformer T1, such as switches SP1 and SP2. Switches SP1 and SP2 are disposed closer to the surface 221 of the power converter assembly 101 than the surface 222.

[0110] In addition, as shown in view 812 and as previously discussed, the power converter assembly 101 includes a switch circuit that controls the respective currents through the secondary windings of the transformer T1, such as switches SS2 and SS1. Switches SS1 and SS2 are disposed closer to the surface 222 of the power converter assembly 101 than the surface 221 of the power converter assembly 101.

[0111] As further shown, the power converter assembly 101 can be disposed between substrate 831 and substrate 841. Substrate 841 can be disposed between the load 118 and the power converter assembly 101.

[0112] As previously discussed, magnetic structures such as magnetic material P1, magnetic material P2, and magnetic material P3 extend through a stack of multiple circuit layers 210. The axial length (e.g., along the z-axis) of the magnetic structure is disposed parallel to the planar surface (e.g., in the X-Z plane) of the main substrate 841 or substrate 821 to which the first connection interface (e.g., surface 222) can be attached.

[0113] It should also be noted that output capacitors (e.g., capacitor C111) (one or more capacitors) associated with the power circuit as discussed herein can be mounted to any surface of substrate 831, the power converter assembly 101, substrate 821, and / or substrate 841.

[0114] Figure 14 is an example side view showing an implementation of a corresponding power converter assembly for supplying power to a load on a main board as discussed herein.

[0115] In this example, the surface 222 of the power converter assembly 101 includes a connection interface that includes surface disk DP1 (also referred to as node D1), surface disk GP1 (also referred to as node G1), surface disk DP2 (also referred to as node D2), and surface disk GP2 (also referred to as node G2). Both surface disk DP1 and surface disk DP2 (e.g., disposed on the corresponding edges of surface 222 and the multiple circuit layers) can be configured to receive output voltages from nodes D1 and D2 generated at multiple different circuit layers of the power converter assembly 101. Substrate 841 can be configured to transmit the output voltage Vout and the corresponding output currents 108-1 and 108-2 received from surface disk DP1 and surface disk DP2 for output to the load 118 via one or more conductive paths passing through substrate 841. Substrate 841 can be configured to transmit the GND voltage received from surface disk GP1 and surface disk GP2 to the load 118 via one or more conductive paths passing through substrate 841. Alternatively, substrate 841 can be configured to provide a ground reference potential to the power converter assembly 101 via the corresponding surface disks GP1 and GP2.

[0116] As further shown, and as previously discussed, the surface 221 disposed on the power converter substrate 101 may be configured to include corresponding surface pads 201 to receive an input voltage from the substrate 831. Additionally, the power converter assembly 101 may be configured to include corresponding surface pads 202 to receive a ground voltage from the substrate 831, or to provide a ground reference voltage received from the power converter assembly 101 to the substrate 831. Alternatively, as previously discussed, the power converter assembly may be configured to include additional surface pads disposed on the surface 222 to receive an input voltage and a ground signal from the substrate 841. Thus, the power converter assembly 101 may be configured to receive an input voltage Vin and GND from any source.

[0117] Figure 8 FIG. is an example diagram showing an implementation of multiple arrays of power converter assemblies for powering a load as discussed herein.

[0118] Note that multiple instances of the power converter assembly 101 may be implemented to produce an array of power converter assemblies. For example, each instance of the power converter assembly 921-X includes six instances of the power converter assembly 101 arranged in parallel (e.g., a 3 by 2 matrix). Additionally, the combination of power converter assemblies in the power converter assembly 921-X (e.g., power converter assembly 921-1, power converter assembly 921-2, power converter assembly 921-3, and power converter assembly 921-4) of the power supply 900 together produce a corresponding output voltage to power the load 118.

[0119] Thus, as Figure 8 shown, the power supply 900 may be configured to include a parallel combination of multiple instances of the power converter array 921, e.g., power converter arrays 921-1, 921-2, 921-3, and 921-4 arranged in parallel. In a similar manner as previously discussed, each power converter array 921 in the power converter array 921 produces a corresponding output voltage Vout to power the load 118.

[0120] Figure 9 FIG. is an example diagram showing the footprint of implementing multiple power converter assemblies as discussed herein.

[0121] As previously discussed, the corresponding surface 821-2 of the power converter assembly 101 associated with the substrate 821 may be configured to include multiple nodes in which one or more signals, such as a corresponding output voltage Vout, a ground reference voltage GND, etc., are input / output or transmitted. Figure 9Shows the corresponding footprint of the power converter array 921-X, where X is a corresponding instance of the power converter array, such as power converter array 921-1, power converter array 921-2, power converter array 921-3, or power converter array 921-4. The positive node (+) of the surface 222 of the power converter component 101 outputs the output voltage from the corresponding nodes D1 and D2. The negative node (-) of the surface 222 of the power converter component 101 receives the ground reference voltage from the substrate 841 or the substrate 821.

[0122] Figure 10 Is an example diagram showing a power converter circuit as discussed herein.

[0123] In this example, the power supply 1100 includes power converters 1100-1 and 1100-2 connected in parallel to generate corresponding output voltages at the output terminals. Generally, each of the power converters 1100-1 and 1100-2 includes multiple instances of the power converter component 101. For example, nodes D11, D12, D21, D22, D31, D32, D41, D42, D51, D52, D61, and D62 are all connected to each other and output corresponding output voltages Vout.

[0124] The power converter 1100-1 includes a plurality of transformers arranged in series. For example, the power converter 1100-1 includes a plurality of transformers, such as transformer T11, transformer T12, and transformer T13. Transformer T11 includes one or more corresponding primary windings connected in series between node A1 and node B1; transformer T12 includes one or more primary windings connected in series between node A2 and node B2; transformer T13 includes one or more primary windings connected in series between node A3 and node B3.

[0125] As shown, the combination of the primary windings associated with transformers T11, T12, and T13 is connected in series between node 11-1 and node 11-2.

[0126] In a similar manner as previously discussed, switch SP11 and switch SP12 are arranged in series between node N11 and the ground reference voltage. Switch SP11 is coupled to switch SP12 via node 11-1.

[0127] Capacitors C11 and C12 are arranged in series between node N11 and the ground reference voltage. Capacitor C11 is coupled to capacitor C12 via node 11-2.

[0128] As further shown, transformer T11 includes a first secondary winding connected between node C1 and node D11; transformer T11 also includes a second secondary winding connected between node E1 and node D12. As previously discussed, both node D11 and node D12 output corresponding output voltages to power load 118.

[0129] Transformer T12 includes a first secondary winding connected between node C2 and node D21; transformer T12 also includes a second secondary winding connected between node E2 and node D22. As previously discussed, both node D21 and node D22 output corresponding output voltages to power load 118.

[0130] Transformer T13 includes a first secondary winding connected between node C3 and node D31; transformer T13 also includes a second secondary winding connected between node E3 and node D32. As previously discussed, both node D31 and node D32 output corresponding output voltages to power load 118.

[0131] Power supply 1100 also includes a power converter 1100-2 similar to power converter 1100-1.

[0132] Controller 140-1 controls the operation of switches SP11, SP12, SS11, SS12, SS21, SS22, SS31 and SS32. Controller 140-1 controls the operation of switches SP21, SP22, SS41, SS42, SS51, SS52, SS61 and SS62.

[0133] Figure 11A and Figure 11B is an example diagram showing the manufacture of a power converter assembly as discussed herein.

[0134] In Figure 11A this example, fabricator 150 fabricates power converter assembly 1101-1 in a similar manner as previously discussed to include a plurality of circuit layers 210, each circuit layer 210 separated by a corresponding insulating material. Each layer in the plurality of layers can be a conductive material layer such as metal or include a conductive material layer such as metal. The combination of conductive materials associated with the plurality of different circuit layers 210 forms the windings of transformers T11, T12 and T13. For example, power converter assembly 1101 includes 3 instances of power converter assembly 101 in a single power converter assembly.

[0135] As further shown, the power converter assembly 1101 includes a plurality of cores of magnetic conductive materials P11, P12, P13, P21, P22, P23, P31, P32, P33 that extend through a stack of a plurality of circuit layers 210. For example, the power converter assembly 101 includes the magnetic conductive material P11 that axially extends along the z-axis through the plurality of circuit layers 210; the power converter assembly 1101 includes the magnetic conductive material P12 that axially extends along the z-axis through the plurality of circuit layers 210; the power converter assembly 1101 includes the magnetic conductive material P13 that axially extends along the z-axis through the plurality of circuit layers 210.

[0136] As further shown, the magnetic conductive material P11, the magnetic conductive material P12, and the magnetic conductive material P13 are arranged parallel to each other and spaced apart from each other along the x-axis.

[0137] The magnetic conductive material P21, the magnetic conductive material P22, and the magnetic conductive material P23 are arranged parallel to each other and spaced apart from each other along the x-axis.

[0138] The magnetic conductive material P31, the magnetic conductive material P32, and the magnetic conductive material P33 are arranged parallel to each other and spaced apart from each other along the x-axis.

[0139] The power converter assembly 1101 includes a plurality of circuit layers 210 stacked along the z-axis in the manner discussed previously. Note that the power converter assembly 101 and the corresponding plurality of circuit layers 210 may include any number of circuit layers; each circuit layer is disposed in the X-Y plane. Each layer 210 includes one or more primary windings and / or secondary windings.

[0140] Figure 11B A further fabrication of the power converter assembly 1101-1 is shown to include a magnetic conductive material strip PB11 that contacts each of the columns of the magnetic conductive materials P11, P12, P13, P21, P22, P23, P31, P32, and P33. Note that the power converter assembly 1101-1 also includes a corresponding magnetic conductive material strip PB12 on the bottom side of the power converter assembly 1101-1. Thus, the plurality of circuit layers 210 are disposed or sandwiched between the magnetic conductive material strip PB11 and the magnetic conductive material strip PB12.

[0141] Figure 12A and 12B are example diagrams showing the controlled flow of current through the corresponding windings of the power converter as discussed herein.

[0142] In this example, one or more circuit layers of the power converter assembly 1101-1 include primary windings and secondary windings associated with each of the transformers T11, T12, and T13. Each transformer operates in a similar manner as previously discussed. However, in this example, the power converter assembly 1101-1 includes a series connection of corresponding primary windings. For example, node A1 is connected to node 11-1, node B1 is connected to node A2, node B2 is connected to node A3, and node B3 is connected to node 11-2 in the manner previously discussed. Nodes 11-1 and 11-2 are shown in Figure 10 . Nodes D11, D12, D21, D22, D31, D32, etc. are connected together to produce an output voltage.

[0143] In a similar manner as previously discussed, the power converter assembly 1101-1 can be configured to include one or more secondary windings in one or more of the circuit layers 1210 extending between node C1 and node D11. It should also be noted that node D11 can be configured as a surface pad disposed on the surface 1222 to provide a good connection to a corresponding substrate such as an interposer or a main substrate in the manner previously discussed.

[0144] The power converter assembly 1101-1 can be configured to include one or more secondary windings in one or more of the circuit layers 1210 extending between node E1 and node D12. It should also be noted that node D12 can be configured as a surface pad disposed on the surface 1222 to provide a good connection to a corresponding substrate such as an interposer or a main substrate in the manner previously discussed.

[0145] The power converter assembly 1101-1 can be configured to include one or more secondary windings in one or more of the circuit layers 1210 extending between node C2 and node D21. It should also be noted that node D21 can be configured as a surface pad disposed on the surface 1222 to provide a good connection to a corresponding substrate such as an interposer or a main substrate in the manner previously discussed.

[0146] The power converter assembly 1101-1 can be configured to include one or more secondary windings in one or more of the circuit layers 1210 extending between node E2 and node D22. It should also be noted that node D22 can be configured as a surface pad disposed on the surface 1222 to provide a good connection to a corresponding substrate such as an interposer or a main substrate in the manner previously discussed.

[0147] The power converter assembly 1101-1 can be configured to include one or more secondary windings in one or more circuit layers 1210 extending between node C3 and node D31. It should also be noted that node D31 can be configured as a surface pad on surface 1222 to provide good connection to a corresponding substrate such as an interposer or a main substrate in the manner discussed previously.

[0148] The power converter assembly 1101-1 can be configured to include one or more secondary windings in one or more circuit layers 1210 extending between node E3 and node D32. It should also be noted that node D32 can be configured as a surface pad on surface 1222 to provide good connection to a corresponding substrate such as an interposer or a main substrate in the manner discussed previously.

[0149] In a similar manner as discussed previously, note that surface 1222 can include corresponding ground pads to receive corresponding ground reference voltages from corresponding components attached to surface 1222. For example, a corresponding first ground pad can be disposed on surface 1222 between corresponding nodes D11 and D12, a corresponding second ground pad can be disposed on surface 1222 between corresponding nodes D12 and D21, a corresponding third ground pad can be disposed on surface 1222 between corresponding nodes D21 and D22, and so on.

[0150] Referring again to Figure 12A and Figure 12B , note that the power converter assembly 1100-1 is manufactured similarly to the power converter assembly 1100-2. Again, Figure 10 shows that the combination of the power converter assembly 1100-1 and the power converter assembly 1100-2 generates a corresponding output voltage to power a load.

[0151] Referring again to Figure 10 , the controller 140 controls the flow of current through the corresponding primary and secondary windings of each transformer in the transformer associated with the power converter assembly 1100-1. In a similar manner, the controller 140 controls the flow of current through the corresponding primary and secondary windings of each transformer in the transformer associated with the power converter assembly 1100-2.

[0152] Now, the functions supported by different resources will be discussed through the Figure 13 flowchart in. Note that the operations in the following flowchart can be executed in any suitable order.

[0153] Figure 13 is flowchart 1300 showing the example method discussed above. Note that there will be some overlap regarding the concepts discussed above.

[0154] In processing operation 1310, fabricator 150 fabricates a power converter assembly to include a stack of multiple circuit layers, the stack of multiple circuit layers including multiple transformer windings, the multiple transformer windings including one or more primary windings and one or more secondary windings.

[0155] In processing operation 1320, fabricator 150 fabricates the stack of multiple circuit layers to include a first connection interface operable to connect the stack of multiple circuit board layers to a substrate. The first connection interface is disposed on a first surface of the power converter assembly.

[0156] Again, the techniques herein are well suited for circuit assembly applications, such as applications that provide power transfer to one or more loads. However, it should be noted that the disclosure herein is not limited to use in such applications, and the techniques discussed herein are also well suited for other applications.

[0157] Although the present invention has been specifically shown and described with reference to preferred aspects thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the present application as defined by the appended claims. Such variations are intended to be covered by the scope of the present application. Accordingly, the foregoing description in the present disclosure is not intended to be limiting. Rather, any limitation of the present invention is presented in the appended claims.

Claims

1. A device for power conversion, comprising: A power converter assembly, the power converter assembly comprising: Stacking of multiple circuit layers; a plurality of transformer windings disposed in a stack of the plurality of circuit layers, the plurality of transformer windings comprising one or more primary windings and one or more secondary windings; and A first connection interface is operable to connect the stack of the multiple circuit layers to the main substrate, and the first connection interface is arranged on a first surface of the stack of the multiple circuit layers, wherein the first surface is arranged to be orthogonal to the multiple circuit layers in the stack.

2. The device according to claim 1, wherein: The plurality of transformer windings in the stack include a plurality of primary windings and a plurality of secondary windings; and The nodes of the plurality of secondary windings in the stack extend to the first surface of the stack.

3. The device according to claim 2, wherein: The plurality of primary windings are magnetically coupled to the plurality of secondary windings via magnetically permeable material disposed in the power converter assembly; wherein the first portion of the magnetically conductive material extends through the stack of the plurality of circuit layers; and Wherein, the plurality of circuit layers are arranged between the second portion of the magnetic conductive material and the third portion of the magnetic conductive material.

4. The device according to claim 1, wherein: A node of each of the one or more secondary windings is coupled to the first connection interface.

5. The apparatus according to claim 1, further comprising: the main substrate; and The first connection interface of the power converter assembly is directly coupled to a first planar surface area of ​​the main substrate, and the plurality of circuit layers in the stack are arranged to be orthogonal to the first planar surface area of ​​the main substrate.

6. The device according to claim 5, wherein: The plurality of transformer windings in the stack include a plurality of primary windings and a plurality of secondary windings; and Wherein, the multiple secondary windings in the stack are capable of operating to collectively output an output voltage to power a load, and the load is directly coupled to a second planar surface area of ​​the main substrate, and the second planar surface area of ​​the main substrate is arranged relative to the first planar surface area of ​​the main substrate, so that the main substrate is arranged between the load and the power converter assembly.

7. The device according to claim 1, wherein: The plurality of transformer windings include a plurality of primary windings and a plurality of secondary windings, and the device further includes: An interposer substrate is disposed between the first connection interface of the power converter assembly and the first planar surface of the main substrate, the interposer substrate comprising a first circuit path connecting the plurality of secondary windings in the stack to a first node disposed on the first planar surface of the main substrate.

8. The device according to claim 7, wherein: The first node disposed on a first planar surface of the main substrate is aligned with a second node disposed on a second planar surface of the main substrate, and the second planar surface of the main substrate is disposed opposite to the first planar surface of the main substrate.

9. The device according to claim 8, wherein: A second circuit path disposed in the main substrate provides a connection between the first node disposed on a first planar surface of the main substrate and the second node disposed on a second planar surface of the main substrate.

10. The apparatus according to claim 9, further comprising: A load is directly coupled to the second planar surface of the main substrate, the first circuit path is operable to transmit power received from the power converter assembly to the main substrate, and the second circuit path is also operable to transmit power received from the first circuit path through the main substrate to power the load.

11. The device according to claim 1, wherein: The power converter assembly includes a magnetically conductive structure extending through the stack of the plurality of circuit layers, the plurality of transformer windings being wound around the magnetically conductive structure; and Wherein, the axial length of the magnetic conductive structure is set to be parallel to the planar surface to which the first connection interface of the main substrate is attached.

12. The device according to claim 11, wherein The plurality of circuit layers in the stack are arranged orthogonally to the planar surface of the host substrate.

13. The device according to claim 1, wherein: The plurality of transformer windings include a plurality of primary windings and a plurality of secondary windings; and Wherein, the power converter assembly further comprises: A first switching circuit operable to control corresponding currents passing through the plurality of primary windings, the first switching circuit being disposed in the power converter assembly to be closer to a second surface of the stack of the plurality of circuit layers than the first surface, the second surface being disposed opposite to the first surface in the power converter assembly.

14. The device according to claim 13, wherein: The power converter assembly further comprises: A second switching circuit is operable to control respective currents through the plurality of secondary windings, the second switching circuit being disposed in the power converter assembly closer to a first surface of the stack of the plurality of circuit layers than to the second surface.

15. The device according to claim 1, wherein: The main substrate is a first circuit board, and the device further comprises a second circuit board; and Wherein, the power converter assembly is arranged between the second circuit board and the first circuit board.

16. The device according to claim 15, wherein: The first circuit board is disposed between the load and the power converter assembly; wherein the load is coupled to the first circuit board; and The power converter assembly is operable to supply power to the load through the first circuit board.

17. The apparatus according to claim 1, further comprising: A second connection interface is disposed on a second surface of the stack of the plurality of circuit layers, the second surface being disposed opposite to the first surface of the stack of the plurality of circuit layers; and The power converter assembly is operable to convert a DC input voltage received from the second connection interface into a DC output voltage output from the first connection interface of the power converter assembly, wherein the DC output voltage is output from the secondary winding of the transformer winding.

18. The device according to claim 1, wherein: The plurality of circuit layers in the stack include a first circuit board layer and a second circuit board layer; wherein a first terminal of a first secondary winding of the plurality of transformer windings is connected to a first circuit board edge node, and the first circuit board edge node is disposed on an edge of the first circuit board layer; and Wherein, a first terminal of a second secondary winding among the plurality of transformer windings is connected to a second circuit board edge node, and the second circuit board edge node is arranged on an edge of the second circuit board layer.

19. The device according to claim 18, wherein: The first circuit board edge node is aligned with the second circuit board edge node in the stack.

20. A method of manufacturing a power converter assembly, the method comprising: manufacturing the power converter assembly to include a stack of a plurality of circuit layers, the stack of a plurality of circuit layers including a plurality of transformer windings, the plurality of transformer windings including one or more primary windings and one or more secondary windings; as well as The stack of the plurality of circuit layers is fabricated to include a first connection interface operable to connect the stack of the plurality of circuit layers to a host substrate, the first connection interface being disposed on a first surface of the power converter assembly.

Images