Camera module and electronic equipment

Abstract

The invention relates to a camera module and electronic equipment, the camera module comprises a circuit board, a first photosensitive chip and a second photosensitive chip, the circuit board comprises a first substrate, a second substrate and a bending part, the bending part is connected between the first substrate and the second substrate, and two ends of the bending part can be close to or far away from each other along a first direction. The bending part can be folded around a second direction, the first direction is perpendicular to the second direction, the first photosensitive chip is arranged on the first substrate, the second photosensitive chip is arranged on the second substrate, and the second photosensitive chip and the first photosensitive chip are both electrically connected to the circuit board. According to the camera module and the electronic equipment, the relative positions of the first photosensitive chip and the second photosensitive chip can be adjusted along the first direction and around the second direction, so that flexible application in different electronic equipment or different types can be met, and therefore, the universality of the camera module in the electronic equipment is improved, and the use experience of the camera module in the electronic equipment is improved. And therefore, shooting requirements in different application scenes can be met.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and particularly to a camera module and an electronic device. Background Art

[0002] As a functional module for realizing the shooting function of electronic devices such as mobile phones, tablet computers, and smart watches, the imaging performance of the camera module directly affects the shooting experience of the electronic device.

[0003] In related technologies, a dual-camera structure is constructed by using a main camera and a secondary camera, or more cameras are set to improve the shooting experience. As the number of cameras increases, the configuration difficulty of the cameras in the electronic device becomes greater and greater. For this reason, an attempt has been made to set the cameras on the same circuit board and plan the setting positions of the cameras at the circuit board design stage.

[0004] However, this structural setting has poor versatility and is difficult to adapt to different electronic devices or different models, and cannot meet the shooting requirements in different application scenarios. Summary of the Invention

[0005] The present application provides a camera module and an electronic device to solve the technical problem of how to improve the versatility of the camera module in the electronic device to meet the shooting requirements in different application scenarios.

[0006] On the one hand, the present application provides a camera module, including:

[0007] A circuit board, including a first substrate, a second substrate, and a bending portion, the bending portion is connected between the first substrate and the second substrate, two ends of the bending portion can approach or move away from each other along a first direction, and the bending portion can be folded along a second direction, the first direction and the second direction are perpendicular to each other;

[0008] A first photosensitive chip, disposed on the first substrate;

[0009] A second photosensitive chip, disposed on the second substrate, and both the second photosensitive chip and the first photosensitive chip are electrically connected to the circuit board.

[0010] In one embodiment, the first substrate is provided with a plurality of first electrical connection points, and the first photosensitive chip is electrically connected to the circuit board through the plurality of first electrical connection points.

[0011] In one embodiment, the second substrate is provided with a plurality of second electrical connection points, and the second photosensitive chip is electrically connected to the circuit board through the plurality of second electrical connection points.

[0012] In one embodiment, the bending portion is provided with a conductive wire, and at least one of the first electrical connection points is electrically connected to at least one of the second electrical connection points through the conductive wire.

[0013] In one embodiment, the bending portion includes a plurality of flexible branches, and the plurality of flexible branches are arranged at intervals along the second direction.

[0014] In one embodiment, at least one flexible branch is arranged with a conductive wire, and electrically connects the first substrate to the second substrate.

[0015] In one embodiment, the camera module further includes a first lens assembly and a second lens assembly, wherein the first lens assembly is arranged along the imaging light path of the first photosensitive chip, and the second lens assembly is arranged along the imaging light path of the second photosensitive chip.

[0016] On the other hand, the present application provides an electronic device, including a device body and the above-mentioned camera module, wherein the camera module is connected to the device body.

[0017] In one embodiment, the device body includes a display screen, and the first substrate and the second substrate are arranged side by side in a direction parallel to a display surface of the display screen.

[0018] In one embodiment, the first photosensitive chip and the second photosensitive chip are both facing toward or facing away from the display screen, and are both capable of receiving external light for imaging.

[0019] In one embodiment, the device body is provided with a light-transmitting area, the first photosensitive chip is fixed in the device body and is opposite to the light-transmitting area, so that external light can be transmitted to the first photosensitive chip through the light-transmitting area; the side frame of the device body is provided with an opening, and the distance from the second photosensitive chip to the opening is smaller than the distance from the first photosensitive chip to the opening;

[0020] Among them, the second photosensitive chip faces the display screen or faces away from the display screen, the second substrate is movably arranged on the device body, and the second photosensitive chip and the light-transmitting area are staggered in the first direction; the electronic device also includes a telescopic mechanism, which is arranged in the device body, and is used to drive the second substrate to move relative to the first substrate along the first direction, so that the second photosensitive chip extends out of the device body from the opening or is retracted into the device body along with the second substrate.

[0021] In one embodiment, the device body is provided with a light-transmitting area, the first substrate and the second substrate are both movably provided on the device body, and the side frame of the device body is provided with an opening;

[0022] The electronic device further includes a first driving mechanism and a second driving mechanism. Both the first driving mechanism and the second driving mechanism are disposed inside the device body. The second driving mechanism is configured to drive the second substrate to move relative to the device body in a first direction, so that the second photosensitive chip extends out of the device body or retracts into the device body with the second substrate from the opening.

[0023] Wherein, when the second substrate is inside the device body, the second photosensitive chip is opposite to the light-transmitting area, so that external light can be transmitted through the light-transmitting area to the second photosensitive chip, and the distance from the second photosensitive chip to the opening is less than the distance from the first photosensitive chip to the opening; when the second photosensitive chip extends out of the device body with the second substrate from the opening, the first driving mechanism drives the first substrate to move from a first position to a second position in the first direction. When the first substrate is at the first position, the first photosensitive chip and the light-transmitting area are offset in the first direction. When the first substrate is at the second position, the first photosensitive chip is opposite to the light-transmitting area, so that external light can be transmitted through the light-transmitting area to the first photosensitive chip.

[0024] In one embodiment, the speed at which the second driving mechanism drives the second substrate to move is greater than the speed at which the first driving mechanism drives the first substrate to move.

[0025] In one embodiment, the device body includes a display screen and a back shell. The display screen is provided with a first light-transmitting area, and the back shell is provided with a second light-transmitting area.

[0026] The first substrate and the second substrate are arranged in a 180° flip with respect to each other. Among them, the first photosensitive chip is opposite to the first light-transmitting area, so that external light can be transmitted through the first light-transmitting area to the first photosensitive chip; the second photosensitive chip is opposite to the second light-transmitting area, so that external light can be transmitted through the second light-transmitting area to the second photosensitive chip.

[0027] In one embodiment, the electronic device is a foldable electronic device. The device body includes a flexible screen and a folding mechanism, and both the flexible screen and the bending part can be folded around the folding mechanism.

[0028] The above-mentioned camera module and electronic device, the camera module includes a circuit board, a first photosensitive chip and a second photosensitive chip. The circuit board includes a first substrate, a second substrate and a bending portion. The first photosensitive chip is disposed on the first substrate, and the second photosensitive chip is disposed on the second substrate. Since the two ends of the bending portion can approach or move away from each other along the first direction, and the bending portion can be folded around the second direction, therefore, the first photosensitive chip and the second photosensitive chip can adjust the relative position between each other along the first direction, and can also be folded around the second direction with the bending portion, that is, the first photosensitive chip and the second photosensitive chip can be flipped around the second direction relative to each other. Thus, the first photosensitive chip and the second photosensitive chip can adjust the relative position between each other along the first direction and around the second direction, and then can meet the flexible application in different electronic devices or different models. Therefore, the solution of the present application improves the versatility of the camera module in the electronic device to adapt to the shooting requirements in different application scenarios. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0030] Figure 1 It is a schematic cross-sectional structure diagram of a camera module according to an embodiment.

[0031] Figure 2 For Figure 1 In the shown camera module, it is a schematic structural diagram when the first substrate approaches the second substrate along the first direction.

[0032] Figure 3 For Figure 1 In the shown camera module, it is a schematic structural diagram when the second substrate is flipped relative to the first substrate around the second direction.

[0033] Figure 4 It is a schematic structural diagram of the circuit board of a camera module according to an embodiment.

[0034] Figure 5 It is a schematic structural diagram of the circuit board of another camera module.

[0035] Figure 6 It is a three-dimensional schematic diagram of an electronic device according to an embodiment.

[0036] Figure 7 For Figure 6 In the shown electronic device, it is a schematic diagram of the installation position of the camera module in the back shell.

[0037] Figure 8 Schematic diagram of the three-dimensional structure of an electronic device according to another embodiment.

[0038] Figure 9 is Figure 8 Schematic cross-sectional structure diagram along the light direction of the camera module at the position corresponding to the camera module of the partial structure of the electronic device shown.

[0039] Figure 10 is Figure 9 Schematic diagram of the partial structure when the second substrate of the camera module and its corresponding structure extend out of the device body in the electronic device shown.

[0040] Figure 11 Schematic cross-sectional structure diagram along the light direction of the camera module at the position corresponding to the camera module of the partial structure of an electronic device according to another embodiment.

[0041] Figure 12 is Figure 11 Schematic diagram of the partial structure when the second substrate of the camera module and its corresponding structure extend out of the device body in the electronic device shown.

[0042] Figure 13 is Figure 12 Schematic diagram of the partial structure when the second substrate of the camera module and its corresponding structure extend out of the device body and then flip around the second direction relative to the first substrate in the electronic device shown.

[0043] Figure 14 Schematic cross-sectional structure diagram along the light direction of the camera module at the position corresponding to the camera module of the partial structure of an electronic device according to yet another embodiment.

[0044] Figure 15 Schematic diagram of the three-dimensional structure of an electronic device according to yet another embodiment.

[0045] Figure 16 is Figure 15 Schematic diagram of the three-dimensional structure when the electronic device shown is folded to another state.

[0046] Figure 17 Schematic diagram of the structure of the camera module arranged relative to the flexible screen in an electronic device according to an embodiment.

[0047] Figure 18 Schematic diagram of the arrangement structure of the camera module relative to the flexible screen and the housing assembly in an electronic device according to yet another embodiment.

[0048] Figure 19 Block diagram of the structure of the electronic device provided by the present application.

[0049] Explanation of the reference numerals in the drawings:

[0050] 10. Camera module; 11. Circuit board; 111. First substrate; 1111. First bonding area; 1112. First electrical connection point; 112. Second substrate; 1121. Second bonding area; 1122. Second electrical connection point; 113. Bending portion; 1131. Conductive wire; 1132. Flexible branch; 114. FPC cable; 115. Connector; 12. First photosensitive chip; 13. Second photosensitive chip; 14. First lens assembly; 15. Second lens assembly; 16. First filter; 17. Second filter; 18. First bracket; 19. Second bracket; 10a. First voice coil motor; 10b. Second voice coil motor; 20. Device body; 21. Display screen; 22. Translucent area; 221. First translucent area; 222. Second translucent area; 23. Opening; 24. Back shell; 25. Flexible screen; 26. Folding mechanism; 27. Housing assembly; 271. First housing; 272. Second housing. Detailed implementation manners

[0051] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0052] As used herein, an "electronic device" refers to a device capable of receiving and / or transmitting communication signals connected by any one or more of the following connection methods, including but not limited to:

[0053] (1) Via a wired connection method, such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0054] (2) Via a wireless interface method, such as a cellular network, Wireless Local Area Network (WLAN), digital television network such as DVB-H network, satellite network, or AM-FM broadcast transmitter.

[0055] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include but are not limited to the following electronic devices:

[0056] (1) Satellite phone or cellular phone;

[0057] (2) A Personal Communications System (PCS) terminal that can combine cellular radiotelephone with data processing, facsimile, and data communication capabilities;

[0058] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0059] (4) Conventional laptop and / or palmtop receivers;

[0060] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0061] Refer to Figure 1 As shown, the camera module 10 includes a circuit board 11, a first photosensitive chip 12, and a second photosensitive chip 13. Among them, the circuit board 11 includes a first substrate 111, a second substrate 112, and a bending portion 113. The bending portion 113 is connected between the first substrate 111 and the second substrate 112.

[0062] Combined with Figure 2 As shown, the two ends of the bending portion 113 can approach or move away from each other along a first direction. Combined with Figure 3 As shown, the bending portion 113 can be folded over a second direction. The first direction and the second direction are perpendicular to each other. The first direction can be understood as the length direction of the circuit board 11 when the bending portion 113 is flattened. Correspondingly, the second direction can be understood as the width direction of the circuit board 11 when the bending portion 113 is flattened.

[0063] Both the first photosensitive chip 12 and the second photosensitive chip 13 are electrically connected to the circuit board 11. The first photosensitive chip 12 and the second photosensitive chip 13 can perform imaging when receiving light. The types of the first photosensitive chip 12 and the second photosensitive chip 13 are not limited here. Taking the first photosensitive chip 12 as an example, the types of the first photosensitive chip 12 can include Charge Coupled Device (CCD) elements, Complementary Metal Oxide Semiconductor (CMOS) devices, and photosensitive diodes, etc. Classified by color, the first photosensitive chip 12 can be a color light sensor, a monochromatic light sensor, an infrared light sensor, and a grayscale sensor, etc.

[0064] Combined with Figures 1 to 3As shown, the first photosensitive chip 12 is disposed on the first substrate 111, and the second photosensitive chip 13 is disposed on the second substrate 112. Since the two ends of the bending portion 113 can approach or move away from each other in the first direction, and the bending portion 113 can be folded around the second direction, the first substrate 111 and the second substrate 112 can be moved relative to each other in the first direction, so that the first photosensitive chip 12 and the second photosensitive chip 13 can adjust their relative positions in the first direction. They can also be folded around the second direction along with the bending portion 113 to realize the flipping of the first photosensitive chip 12 and the second photosensitive chip 13 around the second direction. In this way, the first photosensitive chip 12 and the second photosensitive chip 13 can adjust their relative positions along the first direction and around the second direction, thereby meeting the flexible application in different electronic devices or different models. Therefore, the solution of the present application improves the versatility of the camera module 10 in the electronic device to meet the shooting requirements in different application scenarios.

[0065] It should be noted that, in combination with Figure 2 As shown, when the two ends of the bending portion 113 approach each other in the first direction, the first photosensitive chip 12 and the second photosensitive chip 13 approach each other in the first direction; at the same time, the bending degree of the bending portion 113 gradually increases. Understandably, when the two ends of the bending portion 113 move away from each other in the first direction, the first photosensitive chip 12 and the second photosensitive chip 13 move away from each other in the first direction; at the same time, the bending degree of the bending portion 113 gradually decreases, that is, the bending portion 113 gradually flattens.

[0066] Referring again to Figure 1 As shown, the camera module 10 further includes a first lens assembly 14 and a second lens assembly 15. The first lens assembly 14 is disposed along the imaging optical path of the first photosensitive chip 12, and the second lens assembly 15 is disposed along the imaging optical path of the second photosensitive chip 13. In this way, the first lens assembly 14 can meet the needs of focusing and / or defocusing light in the imaging optical path of the first photosensitive chip 12, so that the first photosensitive chip 12 can obtain a good imaging effect. Correspondingly, the second lens assembly 15 can meet the needs of focusing and / or defocusing light in the imaging optical path of the second photosensitive chip 13, so that the second photosensitive chip 13 can obtain a good imaging effect.

[0067] The first lens assembly 14 and the second lens assembly 15 can be common lens groups. Taking the first lens assembly 14 as an example, in some embodiments, the first lens assembly 14 includes a plurality of lenses, and the plurality of lenses are linearly arranged along the optical axis direction. Some of the plurality of lenses have both convex surfaces or both concave surfaces, and some lenses have a convex surface on one side and a concave surface on the other side. The surface type of the lens is not limited herein.

[0068] Continuing to refer to Figure 1As shown, in some embodiments, the imaging module 10 further includes a first filter 16. The first filter 16 is located in the imaging optical path of the first photosensitive chip 12 to achieve a filtering effect, thereby improving the imaging quality of the first photosensitive chip 12.

[0069] The first filter 16 may be disposed between the first photosensitive chip 12 and the first lens assembly 14. For example, the imaging module 10 includes a first bracket 18, and the first bracket 18 is connected to the first substrate 111. The connection manner between the first bracket 18 and the first substrate 111 includes but is not limited to snap connection, hot melt connection, or connection by glue. The first filter 16 is connected to the first bracket 18 and is disposed on one side of the first photosensitive chip 12 facing the first lens assembly 14 under the support of the first bracket 18. The first lens assembly 14 is disposed on the side of the first bracket 18 facing away from the first substrate 111.

[0070] In this embodiment, after the first lens assembly 14 processes the external light, the light passes through the first filter 16 and is incident on the first photosensitive chip 12. The first photosensitive chip 12 receives the light irradiation and generates an electrical signal, which is then converted into a digital signal through analog-to-digital conversion, thereby realizing digital imaging.

[0071] In some embodiments, the imaging module 10 includes a first voice coil motor 10a that carries the first lens assembly 14. The first voice coil motor 10a is disposed between the first lens assembly 14 and the first bracket 18. The first voice coil motor 10a is used to move the first lens assembly 14 relative to the first bracket 18 along the imaging optical path, so that the first lens moves away from or closer to the first photosensitive chip 12 to achieve optical focusing.

[0072] It should be noted that the first filter 16 is not limited to being disposed in the imaging optical path of the first photosensitive chip 12 through a bracket. For example, in some embodiments, the first filter 16 may be attached to the side of the first photosensitive chip 12 facing the first lens assembly 14, that is to say, the first filter 16 is attached to the photosensitive surface of the first photosensitive chip 12.

[0073] Continue to refer to Figure 1 As shown, in some embodiments, the imaging module 10 further includes a second filter 17. The second filter 17 is located in the imaging optical path of the second photosensitive chip 13 to achieve a filtering effect, thereby improving the imaging quality of the second photosensitive chip 13.

[0074] The second filter 17 may be disposed between the second photosensitive chip 13 and the second lens assembly 15. For example, the imaging module 10 includes a second bracket 19, and the second bracket 19 is connected to the second substrate 112. The connection manner between the second bracket 19 and the second substrate 112 includes but is not limited to snap connection, thermal fusion connection, or connection by glue. The second filter 17 is connected to the second bracket 19 and is disposed on one side of the second photosensitive chip 13 facing the second lens assembly 15 under the support of the second bracket 19. The second lens assembly 15 is disposed on the side of the second bracket 19 facing away from the second substrate 112.

[0075] In this embodiment, after the second lens assembly 15 processes the external light, the light passes through the second filter 17 and is incident on the second photosensitive chip 13. The second photosensitive chip 13 receives the light irradiation and generates an electrical signal, which is then converted into a digital signal through analog-to-digital conversion, thereby realizing digital imaging.

[0076] In some embodiments, the imaging module 10 includes a second voice coil motor 10b that bears the second lens assembly 15. The second voice coil motor 10b is disposed between the second lens assembly 15 and the second bracket 19. The second voice coil motor 10b is used to move the second lens assembly 15 relative to the second bracket 19 along the imaging optical path, so that the second lens moves away from or closer to the second photosensitive chip 13 to achieve optical focusing.

[0077] It should be noted that the second filter 17 is not limited to being disposed in the imaging optical path of the second photosensitive chip 13 through a bracket. For example, in some embodiments, the second filter 17 may be attached to the side of the second photosensitive chip 13 facing the second lens assembly 15, that is to say, the second filter 17 is attached to the photosensitive surface of the second photosensitive chip 13.

[0078] In some embodiments, the circuit board 11 further includes an FPC cable 114 and a connector 115. One end of the FPC cable 114 is electrically connected to the first substrate 111, and the other end is connected to the connector 115. The connector 115 can be used to conveniently connect the circuit board 11 to the main board or the secondary board in the electronic device.

[0079] The first photosensitive chip 12 and the second photosensitive chip 13 may be connected to the circuit board 11 through a chip mounting process.

[0080] Combined Figure 4As shown, the first substrate 111 has a first bonding area 1111 and a plurality of first electrical connection points 1112 arranged on both sides of the first bonding area 1111 in the first direction. In this embodiment, the first photosensitive chip 12 can be bonded to the first bonding area 1111 by glue. The first electrical connection points 1112 can be pads or exposed copper contacts on the surface of the first substrate 111, as long as they can meet the requirements for electrical connection with the first photosensitive chip 12. The type and shape of the first electrical connection points 1112 are not limited herein. The gold fingers on the first photosensitive chip 12 are correspondingly welded to the plurality of first electrical connection points 1112 through metal wires, so as to electrically connect the respective gold fingers of the first photosensitive chip 12 to the plurality of first electrical connection points 1112 on the first substrate 111, so as to use the circuit board 11 to electrically connect the first photosensitive chip 12 to the main board or the secondary board of the electronic device, thereby meeting the signal transmission requirements of the electronic device for the first photosensitive chip 12.

[0081] Continuing to combine Figure 4 As shown, the second substrate 112 has a second bonding area 1121 and a plurality of second electrical connection points 1122 arranged on both sides of the second bonding area 1121 in the second direction. In this embodiment, the second photosensitive chip 13 can be bonded to the second bonding area 1121 by glue. The second electrical connection points 1122 can be pads or exposed copper contacts on the surface of the second substrate 112, as long as they can meet the requirements for electrical connection with the second photosensitive chip 13. The type and shape of the second electrical connection points 1122 are not limited herein. The gold fingers on the second photosensitive chip 13 are correspondingly welded to the plurality of second electrical connection points 1122 through metal wires, so as to electrically connect the respective gold fingers of the second photosensitive chip 13 to the plurality of second electrical connection points 1122 on the second substrate 112, so as to use the circuit board 11 to electrically connect the second photosensitive chip 13 to the main board or the secondary board of the electronic device, thereby meeting the signal transmission requirements of the electronic device for the second photosensitive chip 13.

[0082] The bending portion 113 is provided with a wire 1131, and at least one first electrical connection point 1112 is electrically connected to at least one second electrical connection point 1122 through the wire 1131. In this way, a part of the gold fingers between the first photosensitive chip 12 and the second photosensitive chip 13 are electrically connected. For example, the power supply metal fingers required to supply power to the first photosensitive chip 12 and the power supply metal fingers required to supply power to the second photosensitive chip 13 are electrically connected through the wire 1131. Through this structural arrangement, it is possible to realize that the first photosensitive chip 12 and the second photosensitive chip 13 share a part of the circuit of the circuit board 11, so as to reduce the wiring in the circuit board 11, thereby facilitating the reduction of the wiring difficulty of the circuit board 11, and reducing the board surface space required for wiring, thereby facilitating the miniaturization of the circuit board 11.

[0083] Combined with Figure 4As shown, the bending portion 113 can be a single piece of flexible sheet material. In some embodiments, the bending portion 113 can also be divided into multiple strips to facilitate improving the bending performance of the bending portion 113. For example, in combination with Figure 5 As shown, the bending portion 113 includes a plurality of flexible branches 1132, and the plurality of flexible branches 1132 are arranged at intervals in the second direction. Compared with the setting of using a single piece of flexible sheet material for the bending portion 113, the use of the plurality of flexible branches 1132 can better adapt to the bending requirements.

[0084] Continuing in combination with Figure 5 As shown, in the embodiment where the bending portion 113 includes a plurality of flexible branches 1132, at least one flexible branch 1132 is provided with a wire 1131, and the first substrate 111 is electrically connected to the second substrate 112. In this embodiment, the flexible branch 1132 can meet the need for arranging the wire 1131, and the wire 1131 electrically connects the first substrate 111 and the second substrate 112, so that the first substrate 111 and the second substrate 112 are connected to each other in the overall circuit of the circuit board 11, so that the peripheral circuits of the first photosensitive chip 12 and the second photosensitive chip 13 in the camera module 10 are not isolated. This structural setting can facilitate the overall wiring of the circuit board 11 to reduce the wiring difficulty.

[0085] In the camera module 10 according to the embodiments of the present application, the first photosensitive chip 12 and the second photosensitive chip 13 can adjust their relative positions with respect to each other in the first direction and around the second direction. Therefore, the camera module 10 according to the embodiments of the present application can meet the flexible use in different electronic devices or different models, and then improve the versatility of the camera module 10 in the electronic device and can adapt to the shooting requirements in different application scenarios.

[0086] For the sake of easy understanding, the application of the camera module 10 in the electronic device will be described below, but it does not mean that the camera module 10 of the present application and the electronic device including the camera module 10 are limited thereto.

[0087] In combination with Figure 6 As shown, another embodiment of the present application provides an electronic device, including a device body 20 and the above-mentioned camera module 10, and the camera module 10 is connected to the device body 20. Based on the fact that the camera module 10 includes the first photosensitive chip 12 and the second photosensitive chip 13, the electronic device is configured as an electronic device with a dual-camera structure by using the first photosensitive chip 12 and the second photosensitive chip 13.

[0088] In combination with Figure 6 and Figure 7As shown, the device body 20 includes a display screen 21. The first substrate 111 and the second substrate 112 are arranged side by side in a direction parallel to the display surface of the display screen 21. In this embodiment, both the first photosensitive chip 12 and the second photosensitive chip 13 face the display screen 21 and can receive external light for imaging. Thus, both the first photosensitive chip 12 and the second photosensitive chip 13 can meet the needs of front camera shooting. Understandably, the positions of the display screen 21 corresponding to the first photosensitive chip 12 and the second photosensitive chip 13 need to be light-transmissive to adapt to the shooting requirements. For ease of understanding, as Figure 6 shown, two light-transmissive areas 22 are adaptively shown on the light-emitting surface of the display screen 21. The two light-transmissive areas 22 respectively meet the needs of the first photosensitive chip 12 and the second photosensitive chip 13 to receive external light. Of course, the two light-transmissive areas 22 can also be joined in contour with each other to form a large light-transmissive area that can simultaneously meet the light transmission to the first photosensitive chip 12 and the second photosensitive chip 13.

[0089] In some other embodiments, both the first photosensitive chip 12 and the second photosensitive chip 13 can face away from the display screen 21. As long as both the first photosensitive chip 12 and the second photosensitive chip 13 can receive external light for imaging, the electronic device configured with the camera module 10 can achieve dual cameras.

[0090] Here, it should be noted that for an electronic device, the first photosensitive chip 12 and the second photosensitive chip 13 can act as a front camera to achieve front dual cameras, or can act as a rear camera to achieve rear dual cameras. In some dual-camera modes, the first photosensitive chip 12 and the second photosensitive chip 13 can also face different directions, so that one of them can achieve front shooting and the other can achieve rear shooting. For example, if the first photosensitive chip 12 faces the display screen 21 and the second photosensitive chip 13 faces away from the display, the first photosensitive chip 12 can meet the needs of front shooting, and the second photosensitive chip 13 can meet the needs of rear shooting.

[0091] The electronic device can have multiple shooting modes. For example, in one shooting mode, only one of the first photosensitive chip 12 and the second photosensitive chip 13 can receive light to adapt to the shooting requirements; in another shooting mode, both the first photosensitive chip 12 and the second photosensitive chip 13 can receive light to adapt to the shooting requirements.

[0092] For ease of understanding, the structure of the electronic device will be further described below in conjunction with some embodiments.

[0093] Combined with Figure 8As shown, the device body 20 is provided with a light-transmitting area 22. The first photosensitive chip 12 is fixed in the device body 20 and is opposite to the light-transmitting area 22, so that external light can be transmitted to the first photosensitive chip 12 through the light-transmitting area 22. Based on this, since the first photosensitive chip 12 is fixed to the device body 20 and is opposite to the light-transmitting area 22, the first photosensitive chip 12 can receive light from the light-transmitting area 22 when shooting to meet the shooting needs.

[0094] The light-transmitting area 22 may be disposed on the side where the display screen 21 is located, or may be disposed on the side of the device body 20 facing away from the display screen 21 .

[0095] Combination Figure 9 and Figure 10 As shown, the second photosensitive chip 13 and the light-transmitting area 22 are staggered in the first direction. An opening 23 is provided on the side frame of the device body 20, and the distance from the second photosensitive chip 13 to the opening 23 is smaller than the distance from the first photosensitive chip 12 to the opening 23. The second substrate 112 is movably arranged in the device body 20. Among them, the electronic device also includes a telescopic mechanism, which is arranged in the device body 20, and the telescopic mechanism is used to drive the second substrate 112 to move relative to the first substrate 111 along the first direction, so that the second photosensitive chip 13 extends out of the device body 20 or is retracted into the device body 20 with the second substrate 112 from the opening 23. In this embodiment, the second photosensitive chip 13 is extended out of the device body 20 under the drive of the telescopic mechanism to meet the shooting needs, and can be retracted into the device body 20 under the drive of the telescopic mechanism, so that the second photosensitive chip 13 can be hidden in the device body 20 when not shooting, so as to maintain the overall aesthetic appearance of the electronic device.

[0096] Since in the above embodiment, when the second photosensitive chip 13 takes pictures, the second photosensitive chip 13 extends out of the device body 20 from the opening 23 without the need for the light-transmitting area 22 to receive light, in this embodiment, the light-transmitting area 22 only needs to satisfy the need for light to be transmitted to the first photosensitive chip 12. Compared with setting two light-transmitting areas 22 on the device body 20 to respectively satisfy the need for the first photosensitive chip 12 and the second photosensitive chip 13 to receive external light, or setting a large light-transmitting area 22 to simultaneously satisfy the need for light to be transmitted to the first photosensitive chip 12 and the second photosensitive chip 13. This structural setting of the present application is conducive to reducing the area of ​​the light-transmitting area 22 set on the device body 20.

[0097] The light-transmitting area 22 can be formed by digging holes in a structure that blocks the light path as long as it can meet the need for light transmission. When the light-transmitting area 22 is set on the display screen 21, the light-transmitting area 22 can also be specially designed for the film structure of the display screen 21 to meet the layout requirements of the under-screen camera.

[0098] For the light-transmitting area 22 formed by digging holes in the corresponding structural parts of the device body 20, the reduction in the area of ​​the light-transmitting area 22 means that the hole digging area is small, which is conducive to improving the appearance and aesthetics of the device body 20. For the application scenario where the light-transmitting area 22 is located on the side where the display screen 21 is located and meets the layout requirements of the under-screen camera, the reduction in the area of ​​the light-transmitting area 22 means that the area of ​​the film structure of the display screen 21 that needs to be specially designed for light transmission is reduced, which is conducive to reducing the process difficulty of forming the light-transmitting area 22 of the display screen 21, thereby reducing the overall manufacturing cost.

[0099] In addition, in the above implementation, the need of the electronic device to shoot only through the second photosensitive chip 13 can be met, and the need of the electronic device to perform dual-camera shooting through the first photosensitive chip 12 and the second photosensitive chip 13 can also be met, thereby enriching the shooting application scenarios of the electronic device.

[0100] It should be noted that, in the above-mentioned embodiment, the second photosensitive chip 13 can be facing the display screen 21 or facing away from the side where the display screen 21 is located, which is not limited here.

[0101] Based on the first photosensitive chip 12 being fixed in the device body 20, the first bracket 18 and the first lens assembly 14 corresponding to the first photosensitive chip 12 are fixed relative to the device body 20, and the light is incident from the light-transmitting area 22 to the first lens assembly 14 and then to the first photosensitive chip 12. Accordingly, since the second substrate 112 is movably disposed in the device body 20, the second bracket 19 and the second lens assembly 15 corresponding to the second photosensitive chip 13 will move with the second substrate 112.

[0102] The telescopic mechanism may be disposed between the first bracket 18 and the second bracket 19 , so as to fully utilize the space between the first bracket 18 and the second bracket 19 and reduce space waste in the device body 20 .

[0103] In some embodiments, the telescopic mechanism is an electrostrictive film, and the electrostrictive film can be attached to the bending portion 113. In this way, the electrostrictive film can not only drive the second substrate 112 to move relative to the first substrate 111 along the first direction, but also achieve the synchronous bending of the bending portion 113, so that the movement of the second substrate 112 is smoother. Further, the control circuit of the electrostrictive film is integrated into the circuit board 11, so that the electrostrictive film, as a part of the bending portion 113, performs telescopic movement when receiving the corresponding control signal, thereby driving the second substrate 112 to move relative to the first substrate 111 along the first direction, thereby adjusting the relative position of the second photosensitive chip 13 with respect to the first photosensitive chip 12.

[0104] It should be noted that in some embodiments, the position of the first substrate 111 in the device body 20 is not fixed.

[0105] For example, as shown in combination with Figure 11 and Figure 12 , in some embodiments, both the first substrate 111 and the second substrate 112 are movably arranged in the device body 20, and an opening 23 is formed in the side frame of the device body 20.

[0106] The electronic device further includes a first driving mechanism and a second driving mechanism. The first driving mechanism and the second driving mechanism are both arranged in the device body 20. The second driving mechanism is used to drive the second substrate 112 to move relative to the device body 20 in a first direction, so that the second photosensitive chip 13 extends out of the device body 20 or retracts into the device body 20 along with the second substrate 112 from the opening 23.

[0107] Wherein, the device body 20 is provided with a light-transmitting area 22. When the second substrate 112 is located in the device body 20, the second photosensitive chip 13 is opposite to the light-transmitting area 22, so that external light can be transmitted to the second photosensitive chip 13 through the light-transmitting area 22. It should be noted that the distance from the second photosensitive chip 13 to the opening 23 is less than the distance from the first photosensitive chip 12 to the opening 23.

[0108] When the second photosensitive chip 13 extends out of the device body 20 from the opening 23 along with the second substrate 112, the first driving mechanism drives the first substrate 111 to move from a first position to a second position in the first direction. When the first substrate 111 is located at the first position, the first photosensitive chip 12 and the light-transmitting area 22 are arranged staggeredly in the first direction. When the first substrate 111 is located at the second position, the first photosensitive chip 12 is opposite to the light-transmitting area 22, so that external light can be transmitted to the first photosensitive chip 12 through the light-transmitting area 22.

[0109] In the above embodiments, the need for the electronic device to take pictures only through the second photosensitive chip 13 can be satisfied, and the need for the electronic device to perform dual-camera shooting through the first photosensitive chip 12 and the second photosensitive chip 13 can also be satisfied. Not only is the application scenario rich, but also since the light-transmitting area 22 corresponds to the second photosensitive chip 13 that is closer to the opening 23, the distance from the light-transmitting area 22 to the side frame of the device body 20 where the opening 23 is provided is small. Whether the light-transmitting area 22 is formed by hollowing out the display screen 21 or by setting a film layer structure, this solution of reducing the distance between the light-transmitting area 22 and the side frame where the opening 23 is provided is beneficial to realizing the narrow bezel design of the display screen 21.

[0110] Further, the speed at which the second driving mechanism drives the second substrate 112 to move is greater than the speed at which the first driving mechanism drives the first substrate 111 to move. Thus, when the second photosensitive chip 13 extends out of the device body 20 with the second substrate 112 from the opening 23, the first substrate 111 and the second substrate 112 move away from each other to stretch the bent portion 113 therebetween. Correspondingly, when the second photosensitive chip 13 is retracted into the device body 20 with the second substrate 112 from the opening 23, the first substrate 111 and the second substrate 112 move closer to each other to squeeze the bent portion 113 therebetween, so that the bent portion 113 is folded between the first bracket 18 and the second bracket 19. With this structural arrangement, the structures are compactly arranged within the device body 20, improving the space utilization rate of the device body 20, which is conducive to realizing the miniaturization of the electronic device.

[0111] Combined with Figure 13 As shown, in some embodiments, after the second photosensitive chip 13 extends out of the device body 20 with the second substrate 112 from the opening 23, the bent portion 113 can be flipped around the second direction to adjust the orientation of the second photosensitive chip 13, so as to be able to flexibly adjust the shooting direction of the second photosensitive chip 13 to achieve multi-directional shooting.

[0112] The first driving mechanism and the second driving mechanism can adopt a lead screw transmission structure or a telescopic motor, which is not limited herein.

[0113] It should be noted that, in some embodiments, both the second photosensitive chip 13 and the first photosensitive chip 12 are fixedly arranged relative to the device body 20. Since the two ends of the bent portion 113 can move closer to or away from each other along the first direction, and the bent portion 113 can be flipped around the second direction, the bent portion 113 can be bent according to the installation needs to adjust the installation positions of the first photosensitive chip 12 and the second photosensitive chip 13 to meet the assembly needs in different electronic devices.

[0114] Combined with Figure 14 As shown, the device body 20 includes a display screen 21 and a back shell 24. The display screen 21 is provided with a first light-transmitting area 221, and the back shell 24 is provided with a second light-transmitting area 222. The first substrate 111 and the second substrate 112 are arranged in a 180° flip with respect to each other. Among them, the first photosensitive chip 12 is opposite to the first light-transmitting area 221, so that external light can be transmitted to the first photosensitive chip 12 through the first light-transmitting area 221. The second photosensitive chip 13 is opposite to the second light-transmitting area 222, so that external light can be transmitted to the second photosensitive chip 13 through the second light-transmitting area 222. In this embodiment, the first photosensitive chip 12 can act as a front camera of the electronic device to meet the needs of front shooting, and the second photosensitive chip 13 can act as a rear camera of the electronic device to meet the needs of rear shooting.

[0115] In some embodiments, the electronic device is a foldable electronic device. The device body 20 includes a flexible screen 25 and a folding mechanism 26. Both the flexible screen 25 and the bending portion 113 can be folded around the folding mechanism 26.

[0116] It should be noted that the electronic device is not limited to flat mobile phones or tablet computers, etc. In the electronic device of another embodiment of the present application, the electronic device can be a wearable device such as a smart bracelet or a smart watch, or can also be a tablet computer, a laptop computer, a smart helmet, a smart glasses, etc., which is not limited herein.

[0117] Combined with Figures 15 to 17 As shown, the electronic device is a foldable electronic device. The device body 20 includes a flexible screen 25 and a folding mechanism 26. Both the flexible screen 25 and the bending portion 113 can be folded around the folding mechanism 26.

[0118] The folding mechanism 26 is used to meet the folding use requirements of the electronic device. For example, the device body 20 includes a shell assembly 27. The shell assembly 27 includes a first shell 271 and a second shell 272 connected to each other. The flexible screen 25 is connected to the first shell 271 and the second shell 272. The folding mechanism 26 is connected between the first shell 271 and the second shell 272, so that the first shell 271 and the second shell 272 can rotate relative to each other to drive the flexible screen 25 to rotate, thereby realizing the switching of the flexible screen 25 between the unfolded state and the folded state.

[0119] Both the first photosensitive chip 12 and the second photosensitive chip 13 can face the flexible screen 25, and a first light-transmitting area 221 and a second light-transmitting area 222 are correspondingly arranged on the flexible screen 25. The first photosensitive chip 12 is opposite to the first light-transmitting area 221, so that external light can be transmitted through the first light-transmitting area 221 to the first photosensitive chip 12. The second photosensitive chip 13 is opposite to the second light-transmitting area 222, so that external light can be transmitted through the second light-transmitting area 222 to the second photosensitive chip 13.

[0120] Combined with Figure 18 As shown, in some other embodiments, one of the first photosensitive chip 12 and the second photosensitive chip 13 can face the flexible screen 25, and the other can face the back shell 24. In this embodiment, the first light-transmitting area 221 is arranged on the flexible screen 25, and the second light-transmitting area 222 is arranged on the back shell 24.

[0121] Combined with Figure 19 , Figure 19This is a circuit module block diagram of the device body 100 of the electronic device provided by the embodiments of the present application. The device body 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509, etc. Those skilled in the art can understand that Figure 19 the structure of the device body 100 shown in

[0122] does not constitute a limitation on the device body 100, and may include more or fewer components than shown in the figure, or combine certain components, or have different component arrangements. The RF circuit 501 can be used to receive and send information, or receive and send signals during a call. Specifically, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Usually, the RF circuit 501 includes, but is not limited to, antennas, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the RF circuit 501 can also communicate with the network and other devices through wireless communication. This wireless communication can use any communication standard or protocol, including but not limited to the global system of mobile communication (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), long term evolution (LTE), email, short messaging service (SMS), etc.

[0123] The memory 502 can be used to store application programs and data. The application programs stored in the memory 502 contain executable codes. The application programs can form various functional modules. The processor 508 executes various functional applications and data processing by running the application programs stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area. Among them, the program storage area can store an operating system, application programs required for at least one function (such as a sound playback function, an image playback function, etc.); the data storage area can store data created according to the use of the device body 100 (such as audio data, phone book, etc.). In addition, the memory 502 can include high-speed random access memory, and can also include non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices. Correspondingly, the memory 502 can also include a memory controller to provide access to the memory 502 for the processor 508 and the input unit 503.

[0124] The input unit 503 can be used to receive input digital, character information or user characteristic information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function controls. Specifically, in a specific embodiment, the input unit 503 can include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch panel or a touchpad, can collect touch operations of the user on or near it (such as operations of the user using a finger, a stylus or any suitable object or accessory on or near the touch-sensitive surface), and drive the corresponding connection device according to a preset program. Optionally, the touch-sensitive surface can include two parts: a touch detection device and a touch controller. Among them, the touch detection device detects the touch position of the user and detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute the commands sent by the processor 508.

[0125] Further, the touch-sensitive surface can cover the liquid crystal panel. After the touch-sensitive surface detects a touch operation on or near it, it transmits it to the processor 508 to determine the type of touch event. Subsequently, the processor 508 provides a corresponding visual output on the liquid crystal panel according to the type of touch event.

[0126] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the device body 100. These graphical user interfaces can be composed of graphics, text, icons, videos and any combination thereof.

[0127] Although in Figure 19In this case, the touch-sensitive surface and the liquid crystal panel are implemented as two independent components to perform input and input functions. However, in some embodiments, the touch-sensitive surface and the liquid crystal panel can be integrated to achieve input and output functions. It can be understood that the device body 100 may include an input unit 503 and a display unit 504.

[0128] The device body 100 may further include at least one sensor 505, such as a proximity sensor, a motion sensor, and other sensors. Among them, the proximity sensor can turn off the liquid crystal panel and / or the backlight when the device body 100 is moved to the ear. As a kind of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary, and can be used in applications for identifying the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, and infrared sensors that the device body 100 can also be configured with, they will not be elaborated here.

[0129] The audio circuit 506 can provide an audio interface between the user and the device body 100 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal and transmit it to the speaker, which converts it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and then converted into audio data. After the audio data is output to the processor 508 for processing, it is sent through the radio frequency circuit 501 to, for example, another device body 100, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include a headphone jack to provide communication between the peripheral headphone and the device body 100.

[0130] Wireless Fidelity (WiFi) belongs to short-range wireless transmission technology. The device body 100 can help users send and receive emails, browse the web, and access streaming media through the WiFi module 507, which provides users with wireless broadband Internet access. Although Figure 19 the WiFi module 507 is shown, it can be understood that it does not belong to an essential component of the device body 100 and can be completely omitted according to needs within the scope of not changing the essence of the invention.

[0131] The processor 508 is the control center of the device body 100, connecting various parts of the entire device body 100 through various interfaces and circuits. By running or executing the application programs stored in the memory 502 and calling the data stored in the memory 502, it executes various functions of the device body 100 and processes data, thereby monitoring the device body 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor. Among them, the application processor mainly processes the operating system, user interface, application programs, etc., and the modem processor mainly processes wireless communication. It can be understood that the above-mentioned modem processor may not be integrated into the processor 508 either.

[0132] The device body 100 further includes a power supply 509 for supplying power to each component. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so as to realize functions such as management of charging, discharging, and power consumption management through the power management system. The power supply 509 may also include any components such as one or more DC or AC power supplies, a recharge system, a power failure detection circuit, a power converter or inverter, and a power status indicator.

[0133] Although Figure 19 not shown in the figure, the device body 100 may also include a Bluetooth module, etc., which will not be elaborated here. In specific implementation, the above-mentioned each module can be implemented as an independent entity, or can be combined arbitrarily to be implemented as the same or several entities. For the specific implementation of the above-mentioned each module, reference can be made to the method embodiments described above, which will not be elaborated here.

[0134] The technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as the combinations of these technical features do not conflict, they should all be considered as the scope recorded in this specification.

[0135] The above-mentioned embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A camera module, characterized in that: include: A circuit board, comprising a first substrate, a second substrate and a bending portion, wherein the bending portion is connected between the first substrate and the second substrate, two ends of the bending portion can be close to or away from each other along a first direction, and the bending portion can be folded around a second direction, and the first direction and the second direction are perpendicular; A first photosensitive chip, disposed on the first substrate; A second photosensitive chip is disposed on the second substrate, and the second photosensitive chip and the first photosensitive chip are both electrically connected to the circuit board.

2. The camera module according to claim 1, characterized in that: The first substrate is provided with a plurality of first electrical connection points, and the first photosensitive chip is electrically connected to the circuit board through the plurality of first electrical connection points.

3. The camera module according to claim 2, characterized in that: The second substrate is provided with a plurality of second electrical connection points, and the second photosensitive chip is electrically connected to the circuit board through the plurality of second electrical connection points.

4. The camera module according to claim 3, characterized in that: The bending portion is provided with a conductive wire, and at least one of the first electrical connection points is electrically connected to at least one of the second electrical connection points through the conductive wire.

5. The camera module according to claim 1, characterized in that: The bending portion includes a plurality of flexible branches, and the plurality of flexible branches are arranged at intervals along the second direction.

6. The camera module according to claim 5, characterized in that: At least one flexible branch is arranged with a conductive line and electrically connects the first substrate to the second substrate.

7. The camera module according to claim 1, characterized in that: The camera module also includes a first lens assembly and a second lens assembly. The first lens assembly is arranged along the imaging light path of the first photosensitive chip, and the second lens assembly is arranged along the imaging light path of the second photosensitive chip.

8. An electronic device, characterized in that: It comprises a device body and a camera module as described in any one of claims 1 to 7, wherein the camera module is connected to the device body.

9. The electronic device according to claim 8, characterized in that: The device body includes a display screen, and the first substrate and the second substrate are arranged side by side in a direction parallel to a display surface of the display screen.

10. The electronic device according to claim 9, characterized in that: The first photosensitive chip and the second photosensitive chip are both facing toward or facing away from the display screen, and are both capable of receiving external light to perform imaging.

11. The electronic device according to claim 9, characterized in that: The device body is provided with a light-transmitting area, the first photosensitive chip is fixed in the device body and is opposite to the light-transmitting area, so that external light can be transmitted to the first photosensitive chip through the light-transmitting area; the side frame of the device body is provided with an opening, and the distance from the second photosensitive chip to the opening is smaller than the distance from the first photosensitive chip to the opening; Among them, the second photosensitive chip faces the display screen or faces away from the display screen, the second substrate is movably arranged on the device body, and the second photosensitive chip and the light-transmitting area are staggered in the first direction; the electronic device also includes a telescopic mechanism, which is arranged in the device body, and is used to drive the second substrate to move relative to the first substrate along the first direction, so that the second photosensitive chip extends out of the device body from the opening or is retracted into the device body along with the second substrate.

12. The electronic device according to claim 9, characterized in that: The device body is provided with a light-transmitting area, the first substrate and the second substrate are both movably arranged on the device body, and a side frame of the device body is provided with an opening; The electronic device further comprises a first driving mechanism and a second driving mechanism, wherein the first driving mechanism and the second driving mechanism are both disposed in the device body, and the second driving mechanism is used to drive the second substrate to move relative to the device body along a first direction, so that the second photosensitive chip extends out of the opening into the device body or is retracted into the device body along with the second substrate; Among them, when the second substrate is located in the device body, the second photosensitive chip is opposite to the light-transmitting area, so that external light can be transmitted to the second photosensitive chip through the light-transmitting area, and the distance from the second photosensitive chip to the opening is smaller than the distance from the first photosensitive chip to the opening; when the second photosensitive chip extends out of the device body from the opening along with the second substrate, the first driving mechanism drives the first substrate to move from the first position to the second position along the first direction, when the first substrate is located at the first position, the first photosensitive chip and the light-transmitting area are staggered in the first direction, and when the first substrate is located at the second position, the first photosensitive chip is opposite to the light-transmitting area, so that external light can be transmitted to the first photosensitive chip through the light-transmitting area.

13. The electronic device according to claim 12, characterized in that: The speed at which the second driving mechanism drives the second substrate to move is greater than the speed at which the first driving mechanism drives the first substrate to move.

14. The electronic device according to claim 8, characterized in that: The device body comprises a display screen and a back shell, the display screen is provided with a first light-transmitting area, and the back shell is provided with a second light-transmitting area; The first substrate and the second substrate are flipped 180° to each other, wherein the first photosensitive chip is opposite to the first light-transmitting area, so that external light can be transmitted to the first photosensitive chip through the first light-transmitting area; the second photosensitive chip is opposite to the second light-transmitting area, so that external light can be transmitted to the second photosensitive chip through the second light-transmitting area.

15. The electronic device according to claim 8, characterized in that: The electronic device is a foldable electronic device, the device body comprises a flexible screen and a folding mechanism, and both the flexible screen and the bending portion can be folded around the folding mechanism.

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