Movement module and infrared imaging device

Abstract

The invention provides a machine core module and an infrared imaging device, relates to the technical field of infrared thermal imaging machine cores, and aims to further reduce the size of an infrared machine core. The machine core module comprises a machine core module front part, a heat dissipation plate and a machine core module rear part, the machine core module front part and the machine core module rear part are located on the two opposite sides of the heat dissipation plate respectively, a first installation hole is formed in the machine core module rear part, and / or a second installation hole used for being connected with the machine core module rear part is formed in the heat dissipation plate. A plurality of bonding pads are arranged on a first circuit board of the machine core module front part. And the projection of the first mounting hole and / or the second mounting hole on the first circuit board is overlapped with at least one part of the at least one bonding pad.

Description

Technical Field

[0001] The present invention relates to the technical field of infrared thermal imaging modules, and particularly relates to a module and an infrared imaging device. Background Art

[0002] The continuous maturity of thermal imaging technology has promoted the development of infrared modules towards lightweight, small size, and high performance. For example, in the high-end civilian market, such as drone pods, and in people's daily life, such as mobile phone modules, there are requirements for the miniaturized size of infrared modules.

[0003] Although existing infrared modules adopt wafer-level packaging, smaller pixel designs, and more advanced integrated circuit processes to reduce size, the size of infrared modules is still not ideal enough. Summary of the Invention

[0004] Embodiments of the present invention provide a module and an infrared imaging device, aiming to further reduce the size of the infrared module.

[0005] To achieve the above object, the embodiments of the present invention adopt the following technical solutions:

[0006] In a first aspect, the present application provides a module, which includes a front part of the module, a heat dissipation plate, and a rear part of the module. The front part of the module and the rear part of the module are respectively located on opposite sides of the heat dissipation plate. The rear part of the module is provided with a first mounting hole, and / or the heat dissipation plate is provided with a second mounting hole for connecting with the rear part of the module. The front part of the module includes a first circuit board. A pad group is arranged on the first circuit board, and the pad group includes a plurality of pads. The projection of the first mounting hole and / or the second mounting hole on the first circuit board overlaps at least a part of at least one pad..

[0007] The module provided by the present application can be successively divided into three parts, namely the front part of the module, the heat dissipation plate, and the rear part of the module. Since, in order to ensure the connection strength, during the process of connecting the heat dissipation plate and the rear part of the module, a way of cooperating the mounting hole and the fixing part is adopted. For example, the two components constituting the rear part of the module are provided with a first mounting hole, and fixation is achieved by passing the fixing part through the mounting hole. The projection of the mounting hole provided on the heat dissipation plate or the component constituting the rear part of the module on the first circuit board overlaps at least a part of at least one pad, which means that if the first circuit board and the heat dissipation plate are connected through the mounting hole and the fixing part, interference will occur, that is, the position of the mounting hole on the first circuit board will conflict with the position of the pad. Therefore, the first circuit board and the heat dissipation plate are not connected by the connection method of the mounting hole and the fixing part, and no additional space is required to install the connecting part. Therefore, the design can be more compact and can meet the requirements of miniaturization.

[0008] As a possible implementation, the first mounting holes are distributed in the edge area of the rear part of the movement module. When the second mounting holes for connecting with the rear part of the movement module are provided on the heat dissipation plate, the second mounting holes are distributed in the edge area of the heat dissipation plate.

[0009] As a possible implementation, the first circuit board is connected to the heat dissipation plate through a first glue layer.

[0010] As a possible implementation, the first glue layer is distributed in the edge area of the first circuit board, and the width of the edge area where the first glue layer is set is smaller than the width required for setting the mounting holes.

[0011] The front part of the movement module further includes a detector. The pad group is arranged in the edge area on one side of the first circuit board. The pad group includes a plurality of pads arranged in a row at intervals along a first direction, and the first direction is the extending direction of the side of the first circuit board where the pad group is located. Among the plurality of pads, at least two pads have unequal sizes along the first direction. The detector is arranged on one side of the first circuit board in its own thickness direction. A pin group is arranged on the detector. The pin group is arranged in the edge area on one side of the detector. The pin group includes a plurality of pins, and one pad is correspondingly connected to at least one pin.

[0012] The movement module provided by the present application includes a detector and a first circuit board. One end of the gold wire is connected to the pin in the pin group on the detector, and the other end of the gold wire is connected to the pad in the pad group on the first circuit board, so as to realize the electrical connection between the detector and the first circuit board. The plurality of pads included in the pad group are arranged at intervals in the edge area on the first circuit board. Since at least two pads in the pad group have unequal sizes along the first direction, the pads can make full use of the size of the edge area of the first circuit board along the first direction, and the maximum utilization of space can be achieved in the size of the edge area of the first circuit board along the first direction, so that the plurality of pads included in one pad group can be arranged in a row in the edge area on one side of the first circuit board. The pad group should ensure that there are enough contact points to connect with each pin in the corresponding pin group, so as to ensure the communication between the detector and the first circuit board. Since the first circuit board has to accommodate all the pads, the arrangement of the pad group affects the size of the first circuit board. By using the movement module provided by the present application, the size of the edge area of the first circuit board along the first direction can be maximally utilized, so that only one row of pad groups is required in the edge area on one side of the first circuit board to realize the electrical connection between the detector and the first circuit board. Therefore, the size of the first circuit board is reduced, and thus the size of the movement module is reduced.

[0013] As a possible implementation, the plurality of pads include a first pad and a second pad, and the size of the first pad along the first direction is greater than the size of the second pad along the first direction. The number of pins correspondingly connected to the first pad is greater than the number of pins correspondingly connected to the second pad.

[0014] As a possible implementation, the size of the pad in the first direction is positively correlated with the number of pins connected to the pad.

[0015] As a possible implementation, the first circuit board includes a main area and an edge area surrounding the main area, and the detector is connected to the main area of the first circuit board. The front part of the movement module further includes a shutter. The shutter is provided with a first slot penetrating itself in the thickness direction. The shutter is connected to the edge area of the surface of the first circuit board facing the detector. The detector is accommodated in the first slot, and the shutter surrounds the detector. The edge area of the shutter covers the pin group and the pad group. Among them,

[0016] As a possible implementation, the shutter includes a first sub - part and a second sub - part arranged along the thickness of the first circuit board. The size of the first sub - part in the first direction is greater than or equal to the size of the first circuit board in the first direction, and the size of the second sub - part in the first direction is greater than the size of the first sub - part in the first direction. The movement module further includes a lens mount, and the lens mount is connected to the side of the second sub - part away from the first sub - part, and the first sub - part is connected to the first circuit board.

[0017] As a possible implementation, the first sub - part of the shutter is connected to the first circuit board through a second adhesive layer.

[0018] As a possible implementation, both the second sub - part of the shutter and the lens mount are provided with first mounting holes. The shutter and the lens mount are connected by a fixing member passing through the first mounting holes.

[0019] As a possible implementation, the rear part of the movement module includes a second circuit board. The heat dissipation plate is provided with a first opening. One side of the first circuit board away from the detector is provided with a first interface, and one side of the second circuit board facing the first circuit board is provided with a second interface. One of the first interface and the second interface passes through the first opening and is connected to the other of the first interface and the second interface.

[0020] As a possible implementation, a resistor - capacitor component is arranged on the side of the first circuit board away from the detector.

[0021] As a possible implementation, the rear part of the movement module further includes a third circuit board and a heat insulation board arranged on the side of the second circuit board away from the heat dissipation plate. The heat insulation board is arranged between the third circuit board and the second circuit board. The third circuit board is connected to the heat insulation board, and the heat insulation board is connected to the second circuit board. A resistor - capacitor component is arranged on the side of the second circuit board away from the first circuit board. And / or, a resistor - capacitor component is arranged on the side of the third circuit board away from the second circuit board.

[0022] In a second aspect, the present application further provides an infrared imaging device, including the movement module as described above and an image processor, and the movement module is connected to the image processor.

[0023] Among them, the beneficial effects of the second aspect can refer to those of the first aspect and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of some components of a movement module provided by an embodiment of the present application;

[0025] Figure 2 Schematic diagram of the front and back of a first circuit board provided by an embodiment of the present application;

[0026] Figure 3 Schematic diagram of some components of another movement module provided by an embodiment of the present application;

[0027] Figure 4 Schematic diagram of some components of another movement module provided by an embodiment of the present application;

[0028] Figure 5a Side schematic diagram of a heat dissipation plate provided by an embodiment of the present application;

[0029] Figure 5b Schematic diagram of the front and back of a heat dissipation plate provided by an embodiment of the present application;

[0030] Figure 6 Schematic diagram of the overlapping projection of a heat dissipation plate and the first circuit board 2 provided by an embodiment of the present application;

[0031] Figure 7 Schematic diagram of a movement module provided by an embodiment of the present application;

[0032] Figure 8 Schematic diagram of an infrared imaging device provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, "a plurality of" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, when describing the pipeline, the "connected" and "connection" used in the present invention have the meaning of conduction. The specific meaning needs to be understood in conjunction with the context.

[0036] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0037] Infrared thermal imaging technology is a technology that uses infrared detectors and optical imaging lenses to receive the infrared radiation energy distribution diagram of the target to be measured and reflect it on the photosensitive element of the infrared detector to obtain infrared thermal images. This technology can convert invisible infrared radiation energy into visible thermal images and intuitively display the temperature distribution on the surface of the object. Due to the advantages of infrared thermal imaging technology such as non-contact, real-time, fast and intuitive, it is widely used in various fields.

[0038] The core module, such as the infrared core module, is the core component of the equipment made by infrared thermal imaging technology. With the continuous development of technology, people's requirements for the core module are getting higher and higher, which has prompted the core module to continue to develop in the direction of lightweight, miniaturization and high performance. For example, the drone pods in the high-end civilian market and the mobile phone modules in people's daily life have put forward requirements for the miniaturization of infrared cores.

[0039] In view of this, the present application embodiment provides a movement module, exemplarily, such as Figure 1 and Figure 4 As shown. The movement module 100 includes a movement module front part 101, a heat sink 6 and a movement module rear part 102. The movement module front part 101 and the movement module rear part 102 are respectively located on opposite sides of the heat sink 6, and the movement module front part 101 includes a first circuit board 2. A pad group 21 is provided on the first circuit board 2, and the pad group 21 includes a plurality of pads 211. The movement module rear part is provided with a first mounting hole, such as Figure 4The one labeled 72 is the first mounting hole. And / or the heat dissipation plate 6 is provided with a second mounting hole 61 for connecting with the rear part 102 of the movement module. The projection of the first mounting hole and / or the second mounting hole on the first circuit board 2 overlaps at least a part of at least one pad 211.

[0040] It should be noted that the first mounting hole mentioned in the embodiments of the present application refers to all the mounting holes with mounting hole designs in the components constituting the rear part 102 of the movement module. For example Figure 4 the second circuit board 7 in [description] includes a first mounting hole 72, and the heat insulation plate 9 also includes a second mounting hole.

[0041] It should be understood that the rear part of the movement module is provided with a first mounting hole, which means that at least a pair, that is, two components in the components constituting the rear part 102 of the movement module are connected by a mounting hole and a fixing member. The present application does not limit the connection methods of the remaining components in the rear part 102 of the movement module. "The rear part of the movement module 102 is provided with a first mounting hole, and / or the heat dissipation plate 6 is provided with a second mounting hole 61 for connecting with the rear part 102 of the movement module" means the following two situations:

[0042] When the rear part of the movement module is provided with a first mounting hole, the heat dissipation plate 6 is provided with a second mounting hole 61 for connecting with the rear part 102 of the movement module.

[0043] The heat dissipation plate 6 is not provided with a second mounting hole 61 for connecting with the rear part 102 of the movement module, and the rear part of the movement module is provided with a first mounting hole.

[0044] The movement module provided by the present application can be sequentially divided into three parts, that is, the front part 101 of the movement module, the heat dissipation plate 6, and the rear part 102 of the movement module. Since in order to ensure the connection strength, a mounting hole and a fixing member are used in cooperation during the connection process of the heat dissipation plate 6 and the rear part 102 of the movement module. For example, the two components constituting the rear part of the movement module are provided with a first mounting hole, and the fixing is realized by passing the fixing member through the mounting hole. The projection of the mounting hole provided on the heat dissipation plate 6 or the components constituting the rear part 102 of the movement module on the first circuit board 2 overlaps at least a part of at least one pad, which means that if the first circuit board 2 and the heat dissipation plate 6 are connected by a mounting hole and a fixing member, interference will occur, that is, the position of the mounting hole on the first circuit board 2 will conflict with the position of the pad 211. Therefore, the first circuit board 2 and the heat dissipation plate 6 are not connected by a mounting hole and a fixing member, and no additional space is required to install the connecting member. Therefore, the design can be more compact and can meet the requirements of miniaturization.

[0045] As a possible implementation, the heat dissipation plate 2 is a heat sink (the following embodiments will be described with the heat dissipation plate 2 as the heat sink). The front part 101 and the rear part 102 of the movement module both include multiple components. The front part 101 and the rear part 102 of the movement module are respectively located on opposite sides of the heat dissipation plate 6, and the front part 101, the rear part 102 of the movement module and the heat dissipation plate 6 are connected to form an integral body. Among them, the component closest to the heat dissipation plate 6 in the front part 101 of the movement module is connected to one side of the heat dissipation plate 6, and the component closest to the heat dissipation plate 6 in the rear part 102 of the movement module is connected to the other side of the heat dissipation plate 6.

[0046] In some embodiments, the component closest to the heat dissipation plate 6 in the front part 101 of the movement module is the first circuit board 2, and the component closest to the heat dissipation plate 6 in the rear part 102 of the movement module is the second circuit board 7. That is to say, the first circuit board 2 is connected to one side of the heat dissipation plate 6, and the second circuit board 7 is connected to the other side of the heat dissipation plate 6. The components of the rear part 102 of the movement module may also include a heat insulation plate 9 (such as a heat insulation pad, and the following embodiments will be described with the heat insulation plate 9 as the heat insulation pad) and a third circuit board 8. In addition to being connected through mounting holes and fixing parts between adjacent components of the rear part 102 of the movement module, they can also be connected by means of an adhesive layer and / or welding.

[0047] As mentioned above, since the projection of the mounting holes provided on the heat dissipation plate 6 or the components of the rear part 102 of the movement module on the first circuit board 2 overlaps at least a part of at least one pad, it means that if the first circuit board 2 and the heat dissipation plate 6 are connected through the mounting holes and fixing parts, interference will occur, that is, the position of the mounting holes on the first circuit board 2 will conflict with the position of the pads 211. Therefore, the first circuit board 2 and the heat dissipation plate 6 are not connected by means of mounting holes and fixing parts. So, the embodiments of the present application propose a possible implementation. The first circuit board 2 and the heat dissipation plate 6 are connected through a first adhesive layer.

[0048] As a possible implementation, as Figure 4 shown, the first mounting holes are distributed in the edge area of the rear part 102 of the movement module. When there are second mounting holes provided on the heat dissipation plate 6 for connecting with the rear part 102 of the movement module, the second mounting holes are distributed in the edge area of the heat dissipation plate 6. Arranging the mounting holes in the edge area can provide better fixing points, which helps to reduce the distortion and deformation of the components during assembly and use. Moreover, placing the mounting holes at the edge can maximize the internal space, making the layout of the internal components more compact, which is beneficial to realizing miniaturized design.

[0049] The first circuit board 2 has a pad group, and the area occupied by the pad group will compress the remaining available space on the first circuit board 2. Since the coating of the adhesive layer is more flexible and the size of the mounting holes is relatively fixed, using the first adhesive layer to connect the first circuit board 2 and the heat dissipation plate 6 can make full use of the remaining available space on the first circuit board 2 without causing conflicts with the pad group. As a possible implementation, the first adhesive layer is distributed in the edge area of the first circuit board, and the width of the edge area where the first adhesive layer is set is less than the width required for setting the mounting holes.

[0050] It should be understood that the mounting holes in "less than the width required for setting the mounting holes" refer to the first mounting hole and the second mounting hole. Exemplarily, referring to Figure 5a , taking the mounting hole set at the upper left corner of the heat dissipation plate 6 as an example, the width required for the mounting hole refers to the distance between the edge position of the mounting hole farthest from the upper surface of the heat dissipation plate 6 and the upper surface of the heat dissipation plate 6, that is, L5. Figure 5a The shaded part in is the projection of the first adhesive layer on the first circuit board on the heat dissipation plate 6, and the width of the edge area of the first adhesive layer is also L6. Setting the width of the edge area of the first adhesive layer to be less than the width required for setting the mounting hole means that L6 is less than L5.

[0051] More specifically, as shown in Figure 1 , the movement module 100 includes a detector 1 and a first circuit board 2. A pad group 21 is provided on the first circuit board 2, and the pad group 21 is arranged in the edge area on one side of the first circuit board 2. The pad group 21 includes a plurality of pads 211 arranged in a row at intervals along the first direction (the X direction in Figure 1 ), and the first direction is the extending direction of the side of the first circuit board 2 where the pad group 21 is located. Among the plurality of pads 211, at least two pads 211 have unequal dimensions along the first direction. As shown in Figure 1 , the dimensions of the pad 211a and the pad 211b in the first direction are not equal, and the dimension of the pad 211a along the first direction is greater than the dimension of the pad 211b along the first direction. The detector 1 is provided on one side of the first circuit board 2 in its own thickness direction. A pin group 11 is provided on the detector 1, and the pin group 11 is arranged in the edge area on one side of the detector 1. The pin group 11 includes a plurality of pins 111, and one pad 211 is correspondingly connected to at least one pin 111.

[0052] It should be understood that Figure 1 shows two pad groups 21, and each pad group 21 corresponds to a pin group 11. The gold wire 112 connects the pad 211 and the pin 111. The corresponding connection of one pad 211 to at least one pin 111 means that at least one gold wire 112 can be connected to one pad 211, that is, one gold wire 112 can be connected to one pad 211, and multiple gold wires 112 can also be connected.

[0053] The movement module 100 provided by the present application includes a detector 1 and a first circuit board 2. One end of a gold wire 112 is connected to a pin 111 in a pin group 11 on the detector 1, and the other end of the gold wire 112 is connected to a pad 211 in a pad group 21 on the first circuit board 2, thereby realizing the electrical connection between the detector 1 and the first circuit board 2. The plurality of pads 211 included in the pad group 21 are arranged at intervals in the edge area of the first circuit board 2. Since at least two pads 211 in the pad group 21 have unequal sizes in the first direction, the pads 21 can make full use of the size of the edge area of the first circuit board 2 in the first direction, and the maximum utilization of space can be achieved in the size of the edge area of the first circuit board 2 in the first direction, so that the plurality of pads 211 included in a pad group 21 can be arranged in a row in the edge area on one side of the first circuit board 2.

[0054] The pad group 21 should ensure that there are a sufficient number of contact points to connect to each pin 111 in the corresponding pin group 11, so as to ensure the communication between the detector 1 and the first circuit board 2. Since the first circuit board 2 needs to accommodate all the pads 211, the arrangement of the pad group 21 affects the size of the first circuit board 2. By using the movement module 100 provided by the present application, the space in the edge area of the first circuit board 2 can be utilized more flexibly, the size of the edge area of the first circuit board 2 in the first direction can be utilized to the greatest extent, the waste of space is avoided, so that the electrical connection between the detector 1 and the first circuit board 2 can be realized only by one row of pad groups 21 in the edge area on one side of the first circuit board 2. Therefore, the size of the first circuit board 2 is reduced, and thus the size of the movement module 100 is reduced.

[0055] As a possible implementation, referring to Figure 1 , the plurality of pads 211 include a first pad 211a and a second pad 211b. The size of the first pad 211a in the first direction is larger than the size of the second pad 211b in the first direction. The number of pins 111 connected to the first pad 211a correspondingly is larger than the number of pins 111 connected to the second pad 211b correspondingly. For example, the number of pins 111 that the second pad 211b can support for connection is 1 to 3. Since the size of the first pad 211a in the first direction is larger than the size of the second pad 211b, the number of pins that the second pad 211b can support for connection is more than three.

[0056] It should be understood that the number of pins 111 that the pad 211 can support for connection may not be the same as the number of pins 111 actually connected. For example, a pad 211 that can support the connection of 3 pins 111 may only be connected to 2 pins 111 in actual connection. However, in any case, the maximum number of pins 111 that the pad 211 can support for connection is the maximum number of pins 111 that can be connected in the pad 211 in actual connection, and the number of pins 111 connected cannot exceed the maximum number of pins 111 that the pad 211 can support for connection. In order to ensure the maximum utilization of space, the embodiments provided in the present application plan and set the number and size of the pads 211 according to the number of pins 111.

[0057] As a possible implementation manner, the size of the pad 211 in the first direction is positively correlated with the number of pins 111 corresponding to the pad 211 for connection. The number of pins 111 is related to the design of the detector 1 and is usually not evenly distributed. That is to say, in the edge area of the detector 1, the number of pins 111 is concentrated at some positions, and at some other positions in the edge area of the detector 1, the number of pins 111 is less. For example, a pad 211 with a size of 1 mm in the first dimension direction can connect one pin 111. The number of pins 111 is concentrated near position A in the edge area of the detector 1, and there are 12 pins. Then the size of the pad 211 corresponding to and connected to position A in the first direction is designed to be 12 mm. For another example, the number of pins 111 is less near position B in the edge area of the detector 1, and only 2 pins need to be connected. Then the size of the pad 211 corresponding to and connected to position B in the first direction is designed to be 2 mm. Therefore, not only the electrical connection between the detector 1 and the first circuit board 2 is ensured, but also the space of the pad 211 is maximally utilized, thereby avoiding the situation where multiple pads 211 in a pad group 21 are arranged in multiple rows at the edge position of the first circuit board 2, and the optimization of the size of the movement module 100 is realized.

[0058] In some embodiments, as Figure 2 and Figure 3 shown, the first circuit board 2 includes a main area 22 and an edge area 23 surrounding the main area 22, and the detector 1 is connected to the main area 22 of the first circuit board 2. The movement module 100 further includes a shutter 3. The shutter 3 is provided with a first slot 31 that penetrates itself in the thickness direction ( Figure 3 the Z direction indicated by the arrow in

[0059] To ensure the stability and reliability of the pins and pads connected by the gold wire, a gold wire protection glue is usually used to enclose and protect the pin group, pad group, and the area between the pin group and the corresponding pad group. Due to the swelling characteristics, traditional gold wire protection glue occupies a large space, and there is more or less an overflow phenomenon, that is, it is difficult to accurately cover the area to be protected, and the overflowing gold wire protection glue will occupy more space.

[0060] The detector 1 provided in this application is accommodated in the first slot 31 of the shutter 3. The edge area of the shutter 3 covers the pin group and the pad group. Equivalent to the shutter 3 becoming a protective shell for the detector pin group and pad group, while preventing the gold wire from being collided and affecting the stability and reliability of the connection between the pins and pads, no new materials or components are introduced. In addition, the design of the slot in the shutter 3 enables the detector 1 to be accommodated in the first slot 31, so that the overall formed after the shutter 3 is connected to the detector 1 and the first circuit board 2 has a smaller size in the thickness direction of the detector 1 than the sum of the sizes of the shutter 3, the detector 1, and the first circuit board 2 in the thickness direction of the detector 1. Therefore, the size of the movement module 100 is reduced. Since no gold wire protection glue is used and the original structure required by the movement module 100 is used to enclose the pin group and the pad group, the size of the movement module 100 is further reduced.

[0061] In some embodiments, by way of example, as Figure 3 shown. The shutter 3 includes a first sub - part 32 and a second sub - part 33 arranged along the thickness of the first circuit board 2 (i.e., in the Z - direction). The size L1 of the first sub - part 32 in the first direction is greater than or equal to the size L2 of the first circuit board 2 in the first direction, and the size of the second sub - part 33 in the first direction is greater than the size of the first sub - part in the first direction. As a possible implementation, the size L3 of the first sub - part 32 in Figure 3 the Y - direction shown in Figure 3 is greater than or equal to the size L4 of the first circuit board 2 in Figure 3 the Y - direction shown in Figure 3 and the size of the second sub - part 33 in

[0062] the Y - direction shown in Figure 3 is greater than the size of the first sub - part 32 in Figure 3 the Y - direction shown in Figure 3 By the above design, it can be ensured that the first sub - part 32 of the shutter 3 completely covers the detector 1 and protects the pin group located on the detector 1. When the size of the first sub - part 32 in the first direction and the size in Figure 3 the Y - direction shown in Figure 3 are equal to the size of the first circuit board 2 in the first direction and the size in Figure 3 the Y - direction shown in Figure 3 , the outer frame of the first sub - part 32 fits with the outer frame of the edge area of the first circuit board 2, protecting the pad group located in the edge area of the first circuit board 2.

[0063] In some embodiments, by way of example, such as Figure 4 shown. The movement module 100 further includes a lens mount 4 and a lens 5. The lens mount 4 is connected to a side of the second sub - part 33 away from the first sub - part 32, and the first sub - part 32 is connected to the first circuit board 2. The lens 5 is connected to the lens mount 4. As a possible implementation, the first sub - part 32 of the shutter 3 and the first circuit board 2 are connected through a second adhesive layer. For example, by coating a room - temperature curable adhesive on the area of the first sub - part 32 of the shutter 3 and the edge area of the first circuit board 2, the connection between the shutter 3 and the first circuit board 2 is achieved.

[0064] In some embodiments, the first adhesive layer and the second adhesive layer are room - temperature curable adhesives and can conduct electricity.

[0065] As a possible implementation, both the second sub - part 33 of the shutter 3 and the lens mount 4 are provided with first mounting holes. The shutter 3 and the lens mount 4 are connected through a fixing member passing through the first mounting holes. For example, the first mounting holes are screw holes, the fixing member is a screw, and the shutter 3 and the lens mount 4 are connected through the screw holes and the matching screws.

[0066] In some embodiments, by way of example, refer to Figure 4 . The movement module 100 further includes a second circuit board 7 located on a side of the heat sink 6 away from the first circuit board 2. Both the heat sink 6 and the second circuit board 7 are provided with second mounting holes 61, and the heat sink 6 and the second circuit board 7 are connected through a fixing member passing through the second mounting holes 61. The projection of the mounting hole on the heat sink 6 on the first circuit board 2 overlaps at least a part of at least one pad.

[0067] As a possible implementation, the second mounting holes 61 and the fixing member are respectively a screw hole and a screw corresponding to the screw hole. The second mounting holes are respectively located at the corners of the heat sink 6 and the second circuit board 7, and the second circuit board 7 and the heat sink 6 are connected by screws. By way of example, such as Figure 6 shown. Figure 6 Shows the overlapping projection of the heat sink and the first circuit board 2. According to Figure 6 it can be seen that since the projection of the mounting hole on the heat sink 6 on the first circuit board 2 overlaps at least a part of at least one pad 21. Therefore, using the method of dispensing assembly to connect the heat sink 6 and the first circuit board 2 instead of using screws to connect the heat sink 6 and the first circuit board 2 can not only reduce the size of the movement module, but also will not affect the pad group on the first circuit board 2, thus ensuring the reliability of the connection between the first circuit board 2 and the detector 1.

[0068] As a possible implementation, refer to Figure 2 , Figure 4 and Figure 5b, a first opening 62 is provided on the heat sink 6, a first interface 24 is provided on the side of the first circuit board 2 away from the detector 1, and a second interface 71 is provided on the side of the second circuit board 7 facing the first circuit board 2. One of the first interface 24 and the second interface 71 passes through the first opening 62 and is connected to the other of the first interface 24 and the second interface 71.

[0069] Figure 2 and Figure 4 The situation where the second interface 71 passes through the first opening 62 and is connected to the first interface 24 is shown in FIG. In this case, the second interface 71 on the second circuit board 7 is a male head, and the first interface 24 on the first circuit board 2 is a female head. The bidirectional transmission of signals and data between the first circuit board 2 and the second circuit board 7 is realized through the connection of the male head and the female head. In some other embodiments, the first interface 24 on the first circuit board 2 is a male head, and the second interface 71 on the second circuit board 7 is a female head. In this case, the first interface 24 passes through the first opening 62 and is connected to the second interface 71.

[0070] As a possible implementation manner, a resistor-capacitor component is provided on the side of the first circuit board away from the detector. Arranging the resistor-capacitor component on the back of the first circuit board can make full use of the space of the first circuit board, avoiding the situation where the space is insufficient when arranged on the front of the first circuit board and the size needs to be increased, thus reducing the size of the movement module.

[0071] In some embodiments, referring to Figure 4 , the movement module 100 further includes a third circuit board 8 and a heat insulation pad 9 provided on the side of the second circuit board 7 away from the heat sink. The heat insulation pad 9 is provided between the third circuit board 8 and the second circuit board 7. The third circuit board 8 is connected to the heat insulation pad 9, and the heat insulation pad 9 is connected to the second circuit board 7. After the components in the movement module are assembled, as shown in Figure 7 FIG.

[0072] A resistor-capacitor component is provided on the side of the second circuit board 7 away from the first circuit board 2 and a resistor-capacitor component is provided on the side of the third circuit board 8 away from the second circuit board 7; or a resistor-capacitor component is provided on the side of the second circuit board 7 away from the first circuit board 2. Or a resistor-capacitor component is provided on the side of the third circuit board 8 away from the second circuit board 7.

[0073] As a possible implementation manner, the first circuit board 2, the second circuit board 7, and the third circuit board 8 are respectively a detector circuit board, a power supply circuit board, and a main control circuit board. The detector circuit board is connected to the detector, the main control circuit board is responsible for controlling the movement module, and the power supply circuit board supplies power.

[0074] The embodiment of the present application further provides an infrared imaging device. Exemplarily, as shown in Figure 8As shown in the figure. The infrared imaging device 200 includes the movement module 100 and the image processor 50 as described above, and the movement module 100 and the image processor 50 are connected. Since the movement module 100 provided in this application adopts the setting of a single-row pad group and cancels the gold wire protection glue, and uses the shutter as the protective shell for the pad group, the pin group and the gold wire, the size of the movement module is effectively reduced. By means of dispensing, the connection between the shutter and the first circuit board and the connection between the first circuit board and the heat sink are completed, solving the problem of interference between the gold wire connection point and the screw projection on the heat sink shutter, and further reducing the size of the movement module. Therefore, the size of the infrared imaging device is also more miniaturized, meeting the user's demand for miniaturization.

[0075] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application.

[0076] Finally, it should be noted that the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A movement module, characterized in that: The movement module comprises a movement module front part, a heat sink and a movement module rear part; The movement module front piece and the movement module rear piece are respectively located on opposite sides of the heat sink, the movement module rear piece is provided with a first mounting hole, and / or the heat sink is provided with a second mounting hole for connecting with the movement module rear piece; The movement module front part includes a first circuit board, a pad group is arranged on the first circuit board, and the pad group includes a plurality of pads; the projection of the first mounting hole and / or the second mounting hole on the first circuit board overlaps with at least a portion of at least one of the pads.

2. The movement module according to claim 1, characterized in that: The first circuit board is connected to the heat dissipation plate via a first adhesive layer.

3. The movement module according to claim 2, characterized in that: The first mounting holes are distributed in the edge area of ​​the movement module rear part; when the heat sink is provided with second mounting holes for connecting with the movement module rear part, the second mounting holes are distributed in the edge area of ​​the heat sink.

4. The movement module according to claim 3, characterized in that: The first adhesive layer is distributed in an edge region of the first circuit board, and a width of the edge region of the first adhesive layer is smaller than a width required for setting the mounting hole.

5. The movement module according to any one of claims 1 to 4, characterized in that: The movement module front part also includes a detector; The pad group is arranged at an edge region of one side of the first circuit board, and the pad group includes a plurality of pads arranged in a row along a first direction, wherein the first direction is an extension direction of an edge of the first circuit board where the pad group is located; at least two of the plurality of pads have unequal sizes along the first direction; The detector is arranged on one side of the first circuit board in its thickness direction; a pin group is arranged on the detector, the pin group is arranged in an edge area of ​​one side of the detector, the pin group includes a plurality of pins, and one pad is correspondingly connected to at least one of the pins.

6. The movement module according to claim 5, characterized in that: The plurality of pads include a first pad and a second pad, wherein a size of the first pad along the first direction is greater than a size of the second pad along the first direction; The number of pins connected corresponding to the first pad is greater than the number of pins connected corresponding to the second pad.

7. The movement module according to claim 6, characterized in that: The size of the pad along the first direction is positively correlated with the number of pins connected to the pad.

8. The movement module according to claim 5, characterized in that: The first circuit board includes a main area and an edge area surrounding the main area, and the detector is connected to the main area of ​​the first circuit board; The movement module front part also includes a shutter; The shutter is provided with a first slot penetrating through the shutter in the thickness direction. The shutter is connected to an edge area of ​​the surface of the first circuit board facing the detector. The detector is accommodated in the first slot, and the shutter surrounds the detector.

9. The movement module according to claim 8, characterized in that: The shutter includes a first sub-portion and a second sub-portion disposed along a thickness of the first circuit board; The size of the first sub-section in the first direction is greater than or equal to the size of the first circuit board in the first direction, and the size of the second sub-section in the first direction is greater than the size of the first sub-section in the first direction; The movement module also includes a lens mount, which is connected to a side of the second sub-section away from the first sub-section, and the first sub-section is connected to the first circuit board.

10. The movement module according to claim 9, characterized in that: The first sub-portion of the shutter is connected to the first circuit board via a second adhesive layer.

11. The movement module according to claim 10, characterized in that: The second sub-portion of the shutter and the lens mount are both provided with a third mounting hole; The shutter is connected to the lens mount via a fixing member passing through the third mounting hole.

12. The movement module according to claim 5, characterized in that: The movement module rear part comprises a second circuit board, the heat dissipation plate is provided with a first opening, a first interface is provided on a side of the first circuit board away from the detector, and a second interface is provided on a side of the second circuit board facing the first circuit board; One of the first interface and the second interface passes through the first opening and is connected to the other of the first interface and the second interface.

13. The movement module according to claim 5, characterized in that: A resistor and a capacitor are arranged on a side of the first circuit board away from the detector.

14. The movement module according to claim 12, characterized in that: The movement module rear part also includes a third circuit board and a heat insulation board arranged on a side of the second circuit board away from the heat sink, wherein the heat insulation board is arranged between the third circuit board and the second circuit board; the third circuit board is connected to the heat insulation board, and the heat insulation board is connected to the second circuit board; A resistor and a capacitor are disposed on a side of the second circuit board away from the first circuit board; and / or, A resistor and a capacitor are disposed on a side of the third circuit board away from the second circuit board.

15. An infrared imaging device, characterized in that: The infrared imaging device comprises an image processor and a core module as claimed in any one of claims 1 to 14, and the infrared core is connected to the image processor.

Images