Wet etching machine for PCB (Printed Circuit Board)

Abstract

The invention discloses a PCB (Printed Circuit Board) wet etching machine, and relates to the technical field of etching equipment. The device comprises a bottom plate, a liquid tank box is fixed to the top of the bottom plate, a telescopic column is fixed to one side of the top of the bottom plate, an electric push rod is fixed to the other side of the top of the bottom plate, a fixing frame is fixed between the electric push rod and the top of the telescopic end of the telescopic column, a containing basket is fixed to the bottom of the fixing frame, and the containing basket comprises a Y-shaped frame. Through the arrangement of the impurity prevention device, a rotating rod and a belt are matched to drive a spiral blade to suck etching liquid in a liquid tank box into a fixed barrel, the fixed barrel can convey the sucked etching liquid into a filter screen box, and the filter screen box can filter impurities such as resin residues in the etching liquid; therefore, impurities such as resin residues are prevented from being accumulated in the etching liquid, the quality of the etching liquid is kept, and the stability and consistency of the etching process of the PCB are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of etching equipment, and particularly to a wet etching machine for PCB circuit boards. Background Art

[0002] A wet etching machine is a device used in microelectronics manufacturing. It mainly etches semiconductor materials through chemical solutions. In this process, the etching solution is used to remove materials in specific areas to form fine patterns. Wet etching is suitable for the processing of thin film materials and is widely used in fields such as integrated circuits, MEMS devices, and optoelectronics. This device has the characteristics of high precision and high efficiency, and can complete complex etching tasks in a short time.

[0003] Chinese Patent with Patent Publication No. CN207612475U discloses a wet etching machine for PCB circuit boards, including: a hydraulic rod, a hydraulic cylinder, and a device body; a hot air duct is arranged in the middle of the upper part of the device body, and the hot air duct is connected to the device body through penetration; the hydraulic cylinder and the second hydraulic cylinder are installed at both ends of the upper part of the device body, and the hydraulic cylinder and the second hydraulic cylinder are connected to the device body by an embedding method; a hydraulic rod and a second hydraulic rod are arranged in the middle of the bottom of the hydraulic cylinder and the second hydraulic cylinder, and the hydraulic cylinder and the second hydraulic cylinder are connected to the hydraulic rod and the second hydraulic rod by an embedding method. Through structural improvements and in combination with existing technologies, the present utility model has the advantages of excellent structure, strong practicability, and the ability to perform lifting operations during etching, solves the problems and deficiencies in the existing device technologies, and makes it more practical.

[0004] However, the current wet etching machine has the following problems: When the wet etching machine performs etching operations on PCB circuit boards, metal ions, resin residues, or other organic substances are released into the etching solution. With the long-term accumulation of these impurities, the chemical composition and etching efficiency of the etching solution will change. The impurities in the etching solution will cause a decrease in etching uniformity, making the etching process no longer precise and possibly affecting the quality of the circuit board. Therefore, we have proposed a wet etching machine for PCB circuit boards. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a wet etching machine for PCB circuit boards, which solves the problems raised in the above background art.

[0006] To achieve the above object, the present invention is realized through the following technical solutions: A wet etching machine for a PCB circuit board, including a bottom plate, a liquid tank box is fixed on the top of the bottom plate, a telescopic column is fixed on one side of the top of the bottom plate, an electric push rod is fixed on the other side of the top of the bottom plate, a fixed frame is fixed between the top ends of the telescopic ends of the electric push rod and the telescopic column, a placement basket is fixed at the bottom of the fixed frame, the placement basket includes a Y-shaped frame, the Y-shaped frame is fixed at the bottom of the fixed frame, a placement box is fixed at the bottom of the Y-shaped frame, a plurality of notch plates are evenly and equidistantly fixed on both sides of the inner wall of the placement box, a plurality of through holes are evenly and equidistantly opened at the bottom of the inner wall of the placement box, an anti-impurity device is arranged inside the liquid tank box, the anti-impurity device includes a filter screen box, two fixed cylinders, two rotating rods, the filter screen box is fixed at the inner wall of the liquid tank box, the two fixed cylinders are respectively embedded on both sides of the side of the filter screen box away from the inner wall of the liquid tank box, the two rotating rods are respectively rotatably installed on both sides of the inner wall of the liquid tank box, and the two rotating rods are respectively located inside the two fixed cylinders, spiral blades are fixed on the outer parts of the two rotating rods, the two rotating rods are connected by a belt drive, and a single rotating rod is driven by a motor. When the rotating rod driven by the motor rotates, under the action of the belt drive, the rotating rod on one side will drive the rotating rod on the other side to rotate. When the rotating rod rotates, it will drive the spiral blade to rotate. During the rotation of the spiral blade, the etching liquid in the liquid tank box will be attracted into the fixed cylinder, and the fixed cylinder will transmit the attracted etching liquid into the filter screen box, and the filter screen box will filter impurities such as resin residues in the etching liquid.

[0007] According to the above technical solution, a plurality of L-shaped plates are evenly and equidistantly fixed on the outer walls of the two rotating rods, and a plurality of L-shaped plates are all located outside the fixed cylinder. At the same time, the rotating rod drives the L-shaped plate to rotate, and the L-shaped plate will stir the etching liquid in the liquid tank box. The rotation of the L-shaped plate will cause the etching liquid in the liquid tank box to flow and be stirred.

[0008] According to the above technical solution, an anti-precipitation device is arranged between the two fixed cylinders. The anti-precipitation device includes a reciprocating lead screw, a gear, a toothed ring, a sliding rod, a U-shaped shoveling plate. The reciprocating lead screw is rotatably installed on one side of the inner wall of the liquid tank box, the sliding rod is fixed on the other side of the inner wall of the liquid tank box, the gear is fixed at the end of the reciprocating lead screw away from the liquid tank box, the toothed ring is fixed on the outer wall of the end of a single rotating rod away from the liquid tank box, and the gear meshes with the toothed ring. One end of the U-shaped shoveling plate is threadedly connected to the outside of the reciprocating lead screw, the other end of the U-shaped shoveling plate is slidably installed on the outside of the sliding rod, and the U-shaped shoveling plate is in contact with the bottom of the inner wall of the liquid tank box. When the rotating rod rotates, it will drive the toothed ring to rotate, the toothed ring drives the gear to rotate, the gear drives the reciprocating lead screw to rotate, and the reciprocating lead screw drives the U-shaped shoveling plate to reciprocate along the outside of the sliding rod. During the movement of the U-shaped shoveling plate, it will shovel the bottom of the inner wall of the liquid tank box.

[0009] According to the above technical solution, push plates are hinged to both sides of the top of the U-shaped shovel plate. A torsion spring is arranged between the push plate and the U-shaped shovel plate. Limiting rods are fixed to both sides of the top of the U-shaped shovel plate, and the limiting rods are located on the side of the U-shaped shovel plate close to the filter box. The limiting rods are used to limit the swinging direction of the push plate. At the same time, every time the U-shaped shovel plate drives the push plate to move towards the liquid tank box, under the thrust of the etching liquid, the etching liquid pushes the push plate to swing towards the liquid tank box. Every time the U-shaped shovel plate drives the push plate to move away from the liquid tank box, the swinging track of the push plate is restricted by the limiting rods. Under the thrust of the etching liquid, the etching liquid will not push the push plate to swing. At this time, the push plate pushes the etching liquid in the liquid tank box to flow towards the liquid inlet of the fixed cylinder.

[0010] According to the above technical solution, the anti-precipitation device further includes two shaft rods. The two shaft rods are respectively rotatably installed on both sides of the U-shaped shovel plate through brackets. A number of blades are uniformly fixed on the outer circumferences of the two shaft rods. Friction wheels are fixed to both sides of the two shaft rods. The outer wall of the friction wheel is set to be a rough surface. The outer wall of the friction wheel is in contact with the inner wall bottom of the liquid tank box. At the same time, when the U-shaped shovel plate moves, the U-shaped shovel plate drives the friction wheel to move along with it through the shaft rod. Under the action of the friction force between the friction wheel and the bottom of the liquid tank box, the friction wheel drives the blades to rotate through the shaft rod, and the blades will stir the etching liquid around the U-shaped shovel plate.

[0011] According to the above technical solution, a surging device is arranged above the U-shaped shovel plate. The surging device includes a surging plate, two wavy groove plates, and two L-shaped column rods. The surging plate is vertically slidably installed on the inner wall of the liquid tank box. The bottom of the telescopic surging plate is set to be an arc surface. The two wavy groove plates are respectively fixed to both sides of the surging plate, and wavy grooves are formed on the outer walls of the wavy groove plates. The two L-shaped column rods are respectively fixed to both sides of the top of the U-shaped shovel plate. The ends of the L-shaped column rods away from the U-shaped shovel plate are slidably installed inside the wavy grooves of the wavy groove plates. When the U-shaped shovel plate moves, it will drive the L-shaped column rods to move along with it. The L-shaped column rods slide inside the wavy grooves of the wavy groove plates, and the L-shaped column rods push the wavy groove plates to drive the surging plate to move up and down reciprocally. Every time the surging plate moves upward, the surging plate pushes the etching liquid to surge upward from the middle position below the PCB circuit board; every time the surging plate moves downward, the arc surface of the surging plate pushes the etching liquid to surge towards the fixed cylinders on both sides.

[0012] The present invention provides a wet etching machine for PCB circuit boards. It has the following beneficial effects: (1) Through the setting of the anti-impurity device, the present invention enables the rotating rod and the belt to cooperate to drive the spiral blade to suck the etching solution in the liquid tank into the fixed cylinder, and the fixed cylinder will transfer the sucked etching solution to the inside of the filter box. The filter box will filter impurities such as resin residues in the etching solution, thereby preventing the accumulation of impurities such as resin residues in the etching solution, maintaining the quality of the etching solution, and ensuring the stability and consistency of the PCB circuit board etching process. At the same time, the rotating rod drives the L-shaped plate to stir the etching solution in the liquid tank. The rotation of the L-shaped plate will cause the etching solution in the liquid tank to flow and be stirred, ensuring the uniform distribution of the etching solution, so that the chemical components in the etching solution can contact the PCB circuit board more evenly, avoiding inconsistent etching effects caused by uneven liquid, and at the same time, the stirring effect of the L-shaped plate can keep the impurities in the etching solution in a suspended state, so that the impurities can be more easily sucked into the fixed cylinder and transferred to the filter box for filtration.

[0013] (2) Through the setting of the anti-precipitation device, the present invention enables the rotating rod, the toothed ring, the gear, the reciprocating lead screw, and the sliding rod to cooperate to drive the U-shaped shovel plate to effectively shovel the sediment from the bottom of the liquid tank and bring it into the flowing etching solution, which can avoid the long-term accumulation of impurities at the bottom of the liquid tank and reduce the impact of the sediment at the bottom of the liquid tank on the quality of the etching solution. At the same time, the U-shaped shovel plate, the push plate, the liquid tank, and the limit rod cooperate to drive the push plate to push the etching solution in the liquid tank towards the liquid inlet of the fixed cylinder, promoting the circulation of the etching solution inside the liquid tank, which helps to maintain the freshness and activity of the etching solution, avoid the accumulation of sediment in the etching solution, and at the same time is conducive to ensuring the uniformity and stability of the etching solution. At the same time, the U-shaped shovel plate, the shaft rod, the friction wheel, and the liquid tank cooperate to drive the blade to stir the etching solution around the U-shaped shovel plate. This stirring effect can help lift the sediment at the bottom of the liquid tank from the bottom, reduce the retention and concentration of the sediment, and prevent these substances from accumulating around the U-shaped shovel plate.

[0014] (3) Through the setting of the surging device, the present invention enables the U-shaped shovel plate, the L-shaped column rod, and the wavy groove plate to cooperate to drive the surging plate to move up and down reciprocally. Each time the surging plate moves upward, the surging plate pushes the etching solution to surge upward from the middle position below the PCB circuit board, which helps to increase the contact area between the etching solution and the surface of the PCB circuit board. The continuous surging of the etching solution can effectively ensure the full contact between the liquid and the circuit board surface, thereby improving the etching efficiency and etching uniformity. Each time the surging plate moves downward, the arc surface of the surging plate pushes the etching solution to surge towards the fixed cylinders on both sides, which helps the circulation and re-distribution of the filtered etching solution. This distribution can ensure the uniform renewal of the liquid in the tank and reduce the situation of local over-etching or under-etching caused by uneven liquid distribution. Brief Description of the Drawings

[0015] Figure 1 Schematic diagram of the whole of the present inventionFigure 1 ; Figure 2 Schematic of the whole of the present invention Figure 2 ; Figure 3 Schematic of the placement basket of the present invention; Figure 4 Schematic of the cross-section of the partial structure of the present invention; Figure 5 Partial cross-sectional schematic of the impurity prevention device of the present invention; Figure 6 Schematic of the sediment prevention device of the present invention; Figure 7 Partial structure schematic of the sediment prevention device of the present invention; Figure 8 Schematic of the tumbling device of the present invention Figure 1 ; Figure 9 Schematic of the tumbling device of the present invention Figure 2 .

[0016] In the figure: 1, bottom plate; 2, liquid tank box; 3, telescopic column; 4, electric push rod; 5, fixing frame; 6, placement basket; 61, Y-shaped frame; 62, placement box; 63, notch plate; 64, through port; 7, impurity prevention device; 71, filter box; 72, fixing cylinder; 73, rotating rod; 74, belt; 75, spiral blade; 76, L-shaped plate; 8, sediment prevention device; 81, reciprocating lead screw; 82, gear; 83, toothed ring; 84, slide bar; 85, U-shaped shovel plate; 86, push plate; 87, limiting rod; 88, shaft rod; 89, blade; 810, friction wheel; 9, tumbling device; 91, tumbling plate; 92, corrugated groove plate; 93, L-shaped column rod. Detailed implementation manners

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0018] Please refer to Figure 1 - Figure 9, an embodiment of the present invention is: a wet etching machine for a PCB circuit board, including a bottom plate 1. A liquid tank box 2 is fixed on the top of the bottom plate 1. A telescopic column 3 is fixed on one side of the top of the bottom plate 1. An electric push rod 4 is fixed on the other side of the top of the bottom plate 1. A fixing frame 5 is fixed between the top of the telescopic ends of the electric push rod 4 and the telescopic column 3. A placement basket 6 is fixed at the bottom of the fixing frame 5. The placement basket 6 includes a Y-shaped frame 61. The Y-shaped frame 61 is fixed at the bottom of the fixing frame 5. A placement box 62 is fixed at the bottom of the Y-shaped frame 61. A number of notch plates 63 are evenly and equidistantly fixed on both sides of the inner wall of the placement box 62. A number of through openings 64 are evenly and equidistantly formed at the bottom of the inner wall of the placement box 62. An anti-impurity device 7 is arranged inside the liquid tank box 2. The anti-impurity device 7 includes a filter screen box 71, two fixing cylinders 72, and two rotating rods 73. The filter screen box 71 is fixed at the inner wall of the liquid tank box 2. The two fixing cylinders 72 are respectively embedded on both sides of one side of the filter screen box 71 away from the inner wall of the liquid tank box 2. The two rotating rods 73 are respectively rotatably installed on both sides of the inner wall of the liquid tank box 2, and the two rotating rods 73 are respectively located inside the two fixing cylinders 72. Helical blades 75 are fixed on the outer parts of the two rotating rods 73. The two rotating rods 73 are connected by a belt 74 in a transmission manner, and a single rotating rod 73 is driven by a motor. Through the setting of the above structure, when the helical blades 75 rotate, the etching liquid in the liquid tank box 2 will be attracted into the fixing cylinder 72, and the fixing cylinder 72 will transmit the attracted etching liquid into the filter screen box 71. The filter screen box 71 will filter impurities such as resin residues in the etching liquid, thereby preventing the accumulation of impurities such as resin residues in the etching liquid, maintaining the quality of the etching liquid, and ensuring the stability and consistency of the PCB circuit board etching process.

[0019] A number of L-shaped plates 76 are evenly and equidistantly fixed on the outer walls of the two rotating rods 73, and a number of L-shaped plates 76 are all located outside the fixing cylinders 72. Through the setting of the above structure, the rotation of the L-shaped plates 76 will cause the flow and stirring of the etching liquid in the liquid tank box 2, ensuring the uniform distribution of the etching liquid, so that the chemical components in the etching liquid can contact the PCB circuit board more evenly, avoiding inconsistent etching effects caused by uneven liquid, and at the same time, the stirring effect of the L-shaped plates 76 can keep the impurities in the etching liquid in a suspended state, so that the impurities can be more easily sucked into the fixing cylinder 72 and transmitted to the filter screen box 71 for filtering.

[0020] There is a sediment prevention device 8 arranged between two fixed cylinders 72. The sediment prevention device 8 includes a reciprocating lead screw 81, a gear 82, a toothed ring 83, a slide bar 84, and a U-shaped shovel plate 85. The reciprocating lead screw 81 is rotatably installed on one side of the inner wall of the liquid tank 2, the slide bar 84 is fixed on the other side of the inner wall of the liquid tank 2, the gear 82 is fixed at one end of the reciprocating lead screw 81 away from the liquid tank 2, the toothed ring 83 is fixed on the outer wall of one end of a single rotating rod 73 away from the liquid tank 2, and the gear 82 meshes with the toothed ring 83. One end of the U-shaped shovel plate 85 is threadedly connected to the outside of the reciprocating lead screw 81, and the other end of the U-shaped shovel plate 85 is slidably installed on the outside of the slide bar 84. The U-shaped shovel plate 85 is in contact with the bottom of the inner wall of the liquid tank 2. Through the setting of the above structure, during the movement of the U-shaped shovel plate 85, it will shovel the bottom of the inner wall of the liquid tank 2. The reciprocating shoveling of the U-shaped shovel plate 85 can effectively shovel up the sediment from the bottom of the liquid tank 2 and bring it into the flowing etching solution, which can avoid the long-term accumulation of impurities at the bottom of the liquid tank 2 and reduce the influence of the sediment at the bottom of the liquid tank 2 on the quality of the etching solution.

[0021] On both sides of the top of the U-shaped shovel plate 85, there are hinge-connected push plates 86. There is a torsion spring between the push plates 86 and the U-shaped shovel plate 85. On both sides of the top of the U-shaped shovel plate 85, there are fixed limit rods 87, and the limit rods 87 are located on the side of the U-shaped shovel plate 85 close to the filter box 71. The limit rods 87 are used to limit the swinging direction of the push plates 86. Through the setting of the above structure, the push plates 86 push the etching solution in the liquid tank 2 to flow towards the liquid inlet of the fixed cylinder 72, promoting the circulation of the etching solution inside the liquid tank 2. This helps to maintain the freshness and activity of the etching solution, avoid the accumulation of sediment in the etching solution, and at the same time is conducive to ensuring the uniformity and stability of the etching solution.

[0022] The sediment prevention device 8 also includes two shaft rods 88. The two shaft rods 88 are respectively rotatably installed on both sides of the U-shaped shovel plate 85 through brackets. On the outside of the two shaft rods 88, a number of blades 89 are evenly fixed in a circumferential manner. On both sides of the two shaft rods 88, there are fixed friction wheels 810. The outer wall of the friction wheels 810 is set to be a rough surface, and the outer wall of the friction wheels 810 is in contact with the bottom of the inner wall of the liquid tank 2. Through the setting of the above structure, the friction wheels 810 drive the blades 89 to rotate through the shaft rods 88, and the blades 89 will stir the etching solution around the U-shaped shovel plate 85. This stirring effect can help to bring up the sediment at the bottom of the liquid tank 2 from the bottom, reduce the retention and concentration of the sediment, and prevent these substances from accumulating around the U-shaped shovel plate 85.

[0023] During use, place the PCB circuit board to be etched into the placement basket 6, start the electric push rod 4, and the telescopic end of the electric push rod 4 drives the placement basket 6 to move downward through the fixing frame 5. The placement basket 6 brings the PCB circuit board into the etching solution in the liquid tank 2. At this time, the PCB circuit board can perform the etching operation. At the same time, drive the rotating rod 73 on one side to rotate through the motor. Under the driving action of the belt 74, the rotating rod 73 on one side will drive the rotating rod 73 on the other side to rotate. When the rotating rod 73 rotates, it will drive the spiral blade 75 to rotate. During the rotation of the spiral blade 75, it will suck the etching solution in the liquid tank 2 into the fixing cylinder 72, and the fixing cylinder 72 will transmit the sucked etching solution to the inside of the filter box 71. The filter box 71 will filter impurities such as resin residues in the etching solution, thereby preventing the accumulation of impurities such as resin residues in the etching solution, maintaining the quality of the etching solution, and ensuring the stability and consistency of the PCB circuit board etching process; at the same time, the rotating rod 73 drives the L-shaped plate 76 to rotate, and the L-shaped plate 76 will stir the etching solution in the liquid tank 2. The rotation of the L-shaped plate 76 will cause the flow and stirring of the etching solution in the liquid tank 2, ensuring the uniform distribution of the etching solution, so that the chemical components in the etching solution can contact the PCB circuit board more evenly, avoiding inconsistent etching effects caused by uneven liquid. At the same time, the stirring action of the L-shaped plate 76 can keep the impurities in the etching solution in a suspended state, so that the impurities can be more easily sucked into the fixing cylinder 72 and transmitted to the filter box 71 for filtering.

[0024] When the rotating rod 73 rotates, it drives the toothed ring 83 to rotate. The toothed ring 83 drives the gear 82 to rotate, and the gear 82 drives the reciprocating lead screw 81 to rotate. The reciprocating lead screw 81 drives the U-shaped shovel plate 85 to reciprocate along the outside of the slide bar 84. During the movement of the U-shaped shovel plate 85, it shovels the inner bottom wall of the liquid tank 2. The reciprocating shoveling of the U-shaped shovel plate 85 can effectively shovel up the sediment from the bottom of the liquid tank 2 and bring it into the flowing etching solution, thus avoiding the long-term accumulation of impurities at the bottom of the liquid tank 2 and reducing the impact of the sediment at the bottom of the liquid tank 2 on the quality of the etching solution. At the same time, each time the U-shaped shovel plate 85 drives the push plate 86 to move towards the liquid tank 2, under the thrust of the etching solution, the etching solution pushes the push plate 86 to swing towards the liquid tank 2. Each time the U-shaped shovel plate 85 drives the push plate 86 to move away from the liquid tank 2, the swinging trajectory of the push plate 86 is restricted by the limiting rod 87. Under the thrust of the etching solution, the etching solution does not push the push plate 86 to swing. At this time, the push plate 86 pushes the etching solution in the liquid tank 2 to flow towards the liquid inlet of the fixed cylinder 72, promoting the circulation of the etching solution inside the liquid tank 2. This helps to maintain the freshness and activity of the etching solution, avoid the accumulation of sediment in the etching solution, and at the same time is conducive to ensuring the uniformity and stability of the etching solution. At the same time, when the U-shaped shovel plate 85 moves, the U-shaped shovel plate 85 drives the friction wheel 810 to move along with it through the shaft rod 88. Under the friction force between the friction wheel 810 and the bottom of the liquid tank 2, the friction wheel 810 drives the blade 89 to rotate through the shaft rod 88. The blade 89 stirs the etching solution around the U-shaped shovel plate 85. This stirring effect can help lift the sediment at the bottom of the liquid tank 2 from the bottom, reduce the retention and concentration of sediment, and prevent these substances from accumulating around the U-shaped shovel plate 85.

[0025] Please refer to Figure 1 - Figure 9, on the basis of the above embodiments, in another embodiment of the present invention, a surging device 9 is provided above the U-shaped shovel plate 85. The surging device 9 includes a surging plate 91, two corrugated trough plates 92, and two L-shaped column rods 93. The surging plate 91 is vertically and slidably installed on the inner wall of the liquid tank 2. The bottom of the telescopic surging plate 91 is arc-shaped. The two corrugated trough plates 92 are respectively fixed on both sides of the surging plate 91, and the outer wall of the corrugated trough plate 92 is provided with corrugated troughs. The two L-shaped column rods 93 are respectively fixed on both sides of the top of the U-shaped shovel plate 85. The end of the L-shaped column rod 93 away from the U-shaped shovel plate 85 is slidably installed inside the corrugated trough of the corrugated trough plate 92. Through the above structural arrangement, the surging plate 91 moves up and down reciprocally. Each time the surging plate 91 moves upward, the surging plate 91 pushes the etching solution to surge upward from the middle position below the PCB circuit board, which helps to increase the contact area between the etching solution and the surface of the PCB circuit board. The continuous surging of the etching solution can effectively ensure the full contact between the liquid and the circuit board surface, thereby improving the etching efficiency and etching uniformity. Each time the surging plate 91 moves downward, the arc surface of the surging plate 91 pushes the etching solution to surge towards the fixed cylinders 72 on both sides, which helps the circulation and re-distribution of the etching solution after filtration. This distribution can ensure the uniform update of the liquid in the tank and reduce the situation of local over-etching or under-etching caused by uneven liquid distribution.

[0026] During use, when the U-shaped shovel plate 85 moves, it will drive the L-shaped column rod 93 to move accordingly. The L-shaped column rod 93 slides inside the corrugated trough of the corrugated trough plate 92, and the L-shaped column rod 93 pushes the corrugated trough plate 92 to drive the surging plate 91 to move up and down reciprocally. Each time the surging plate 91 moves upward, the surging plate 91 pushes the etching solution to surge upward from the middle position below the PCB circuit board, which helps to increase the contact area between the etching solution and the surface of the PCB circuit board. The continuous surging of the etching solution can effectively ensure the full contact between the liquid and the circuit board surface, thereby improving the etching efficiency and etching uniformity. Each time the surging plate 91 moves downward, the arc surface of the surging plate 91 pushes the etching solution to surge towards the fixed cylinders 72 on both sides, which helps the circulation and re-distribution of the etching solution after filtration. This distribution can ensure the uniform update of the liquid in the tank and reduce the situation of local over-etching or under-etching caused by uneven liquid distribution.

[0027] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A PCB circuit board wet etching machine, comprising a bottom plate (1), characterized in that: A liquid tank box (2) is fixed on the top of the bottom plate (1), a telescopic column (3) is fixed on one side of the top of the bottom plate (1), an electric push rod (4) is fixed on the other side of the top of the bottom plate (1), a fixing frame (5) is fixed between the electric push rod (4) and the top of the telescopic end of the telescopic column (3), a placement basket (6) is fixed on the bottom of the fixing frame (5), and an impurity prevention device (7) is provided inside the liquid tank box (2), and the impurity prevention device (7) comprises a filter box (71), two fixing cylinders (72), and two rotating rods (73). The filter box (71) is fixed to the inner wall of the liquid tank box (2), the two fixed cylinders (72) are respectively embedded on both sides of the filter box (71) away from the inner wall of the liquid tank box (2), the two rotating rods (73) are respectively rotatably mounted on both sides of the inner wall of the liquid tank box (2), and the two rotating rods (73) are respectively located inside the two fixed cylinders (72), and spiral blades (75) are fixed to the outside of the two rotating rods (73), the two rotating rods (73) are connected by a belt (74), and a single rotating rod (73) is driven by a motor.

2. A PCB circuit board wet etching machine according to claim 1, characterized in that: A plurality of L-shaped plates (76) are evenly and equidistantly fixed on the outer walls of the two rotating rods (73), and the plurality of L-shaped plates (76) are all located outside the fixing cylinder (72).

3. A PCB circuit board wet etching machine according to claim 1, characterized in that: The placement basket (6) comprises a Y-shaped frame (61), the Y-shaped frame (61) being fixed to the bottom of the fixed frame (5), a placement box (62) being fixed to the bottom of the Y-shaped frame (61), a plurality of notched plates (63) being evenly and equidistantly fixed to both sides of the inner wall of the placement box (62), and a plurality of through openings (64) being evenly and equidistantly opened at the bottom of the inner wall of the placement box (62).

4. A PCB circuit board wet etching machine according to claim 1, characterized in that: An anti-sedimentation device (8) is provided between the two fixed cylinders (72), and the anti-sedimentation device (8) comprises a reciprocating screw (81), a gear (82), a toothed ring (83), a sliding rod (84), and a U-shaped shovel plate (85). The reciprocating screw (81) is rotatably mounted on one side of the inner wall of the liquid tank box (2), the sliding rod (84) is fixed on the other side of the inner wall of the liquid tank box (2), the gear (82) is fixed on one end of the reciprocating screw (81) away from the liquid tank box (2), the toothed ring (83) is fixed on the outer wall of one end of the single rotating rod (73) away from the liquid tank box (2), and the gear (82) is meshed with the toothed ring (83), one end of the U-shaped shovel plate (85) is threadedly connected to the outside of the reciprocating screw (81), and the other end of the U-shaped shovel plate (85) is slidably mounted on the outside of the sliding rod (84), and the U-shaped shovel plate (85) contacts the bottom of the inner wall of the liquid tank box (2).

5. A PCB circuit board wet etching machine according to claim 4, characterized in that: Push plates (86) are hingedly connected to both sides of the top of the U-shaped shovel plate (85), a torsion spring is provided between the push plate (86) and the U-shaped shovel plate (85), and limiting rods (87) are fixed to both sides of the top of the U-shaped shovel plate (85), and the limiting rods (87) are located on a side of the U-shaped shovel plate (85) close to the filter box (71), and the limiting rods (87) are used to limit the swinging direction of the push plate (86).

6. A PCB circuit board wet etching machine according to claim 4, characterized in that: The anti-sedimentation device (8) further comprises two shafts (88), the two shafts (88) being rotatably mounted on both sides of the U-shaped shovel plate (85) via brackets, a plurality of blades (89) being evenly fixed on the outside of the two shafts (88), and friction wheels (810) being fixed on both sides of the two shafts (88).

7. A PCB circuit board wet etching machine according to claim 6, characterized in that: The outer wall of the friction wheel (810) is provided with a rough surface, and the outer wall of the friction wheel (810) is in contact with the bottom of the inner wall of the liquid tank box (2).

8. A PCB circuit board wet etching machine according to claim 4, characterized in that: A surging device (9) is arranged above the U-shaped shovel plate (85), and the surging device (9) comprises a surging plate (91), two wavy groove plates (92), and two L-shaped pillars (93). The surging plate (91) is vertically slidably mounted on the inner wall of the liquid tank box (2), and the bottom of the telescopic surging plate (91) is arranged in an arc surface. The two wavy groove plates (92) are respectively fixed on both sides of the surging plate (91), and the outer wall of the wavy groove plate (92) is provided with a wavy groove. The two L-shaped pillars (93) are respectively fixed on both sides of the top of the U-shaped shovel plate (85), and one end of the L-shaped pillar (93) away from the U-shaped shovel plate (85) is slidably mounted inside the wavy groove of the wavy groove plate (92).

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