PCB positioning mechanism of chip mounter and positioning method thereof

Abstract

The invention belongs to the technical field of PCB chip mounting and positioning, and discloses a PCB positioning mechanism of a chip mounter and a positioning method thereof, the PCB positioning mechanism comprises a sliding seat and a carrier plate, pressure sensors are distributed on the top of the carrier plate in an array mode, supporting plates are symmetrically arranged on the two sides of the carrier plate, and a first clamping assembly and a second clamping assembly are arranged on the tops of the supporting plates respectively. When the PCB is detected and judged to be slightly bent, the PCB is clamped by two sides, and the clamping assembly I and the clamping assembly II on the two sides are reversely controlled to be far away from each other, so that the clamped PCB is stretched outwards, the positioning is completed, the forced tensioning is performed at the same time, the positioned PCB is kept in a good horizontal state, the subsequent soldering paste coating and surface mounting quality is improved, and the production efficiency is improved. The device adapts to the state of the PCB, completes the adaptability and enhances the surface mounting treatment, completes the correction work through the positioning conveying under the continuous and long-time forced tensioning in the subsequent continuous treatment process, and has the advantages of high positioning adaptability, PCB correction and accurate surface mounting treatment after correction.

Description

Technical Field

[0001] The present invention belongs to the technical field of PCB patch positioning, and specifically relates to a PCB positioning mechanism and a positioning method for a mounter. Background Art

[0002] The PCB positioning mechanism of a mounter is a device used to ensure the precise positioning of a printed circuit board (PCB) in the mounter. Its main function is to place the PCB in the correct position and fix it, so as to ensure stable transportation and perform component mounting after being transported to the target position.

[0003] In the existing PCB positioning mechanism of a mounter, during use, a single clamping and positioning method is usually adopted, and positioning after placement is achieved by clamping on both sides. Although it has the functions of position positioning and fixing, for different situations of some PCBs, adaptive positioning and clamping processing cannot be carried out. Especially for curved PCBs, accurate identification and processing cannot be performed. Moreover, when pasting components after positioning a curved PCB, it is easy to cause the problem of paste position deviation. For flexible PCBs, the method of clamping and positioning calibration and clamping on both sides is adopted, and the PCB actively bends under the action of pressure, which also causes uneven coating and paste offset after deformation. The actual positioning and pasting quality is poor, the scope of use is limited, and the use effect is not good. Summary of the Invention

[0004] The purpose of the present invention is to provide a PCB positioning mechanism and a positioning method for a mounter to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A PCB positioning mechanism and a positioning method for a mounter, including a sliding seat and a carrier plate. Pressure sensors are arranged in an array on the top of the carrier plate. Support plates are symmetrically arranged on both sides of the carrier plate. A clamping assembly one and a clamping assembly two are respectively arranged on the tops of the support plates. The side of the support plate is fixedly connected with a pushing assembly, and the other end of the pushing assembly is elastically connected inside the carrier plate. A control assembly is fixedly arranged at the bottom of the carrier plate, and the control assembly controls the lateral movement of the pushing assembly. A support assembly is fixedly connected to the bottom of the carrier plate, and the support assembly is elastically connected to the top of the sliding seat. An air supply assembly is fixedly arranged at the bottom of the carrier plate, and the air supply assembly is communicated with the clamping assembly one and the clamping assembly two.

[0006] The clamping assembly one includes a clamping seat one, an inclined slot, a positioning plate, a spring one, and a through hole one. The clamping seat one is fixed on the top of the support plate. The inclined slot is opened on the side of the clamping seat one. The positioning plate is movably sleeved inside the clamping seat one. One end of the spring one is fixedly connected in the inclined slot, and the other end is fixedly connected to the positioning plate. The through hole one is opened on the side of the clamping seat one.

[0007] Preferably, the second clamping assembly includes a second clamping seat, an assembly cavity, a fourth spring, and a second through hole. The second through hole is opened on the side surface of the support plate and communicates with the assembly cavity. The second clamping seat is movably sleeved in the assembly cavity. One end of the fourth spring is fixedly connected in the assembly cavity, and the upper end is fixedly connected to the bottom of the second clamping seat.

[0008] Preferably, the air supply assembly includes a connecting frame, an air pump, and a connecting pipe. The air pump is fixed to the bottom of the carrier plate. The connecting frame is fixed to the outer side surfaces of the support plate and the first clamping seat. The connecting frame communicates with the first through hole and the second through hole at the same time. The connecting pipe is fixedly connected between the two connecting frames. The connecting pipe communicates with the air outlet end of the air pump. The connecting pipe is a flexible pipe.

[0009] Preferably, the pushing assembly includes a movable rod, a connecting plate, and a second spring. The movable rod is fixedly connected to the side surface of the support plate. The connecting plate is fixedly connected to the end surface of the movable rod and is fixedly connected to the second spring.

[0010] Preferably, the control assembly includes an electric push rod, a bottom frame, and a piston plate. The bottom frame is fixed to the bottom of the carrier plate. The piston plate is movably sleeved in the bottom frame. The electric push rod is located below the bottom frame. The movable end of the electric push rod passes through the bottom frame and is fixedly connected to the bottom of the piston plate.

[0011] Preferably, an installation hole is opened at the top of the sliding seat. The bottom end of the support assembly is movably sleeved in the installation hole. An electromagnet is fixedly installed inside the installation hole. A cam assembly is fixedly installed on the top of the sliding seat. The cam assembly controls the support assembly.

[0012] Preferably, the support assembly includes a support rod, a cross plate, and a third spring. The support rod is fixedly connected to the bottom of the carrier plate. The cross plate is fixedly sleeved on the outer surface of the support rod. The lower end of the support rod is movably sleeved in the installation hole. One end of the third spring is fixedly connected to the bottom surface of the cross plate, and the other end is fixedly connected to the top of the sliding seat.

[0013] Preferably, the cam assembly includes a mounting seat, a rotating shaft, a cam, and a vertical plate. The mounting seat and the vertical plate are both fixed on the sliding seat. The rotating shaft is rotatably sleeved in the vertical plate. A motor is fixedly provided inside the mounting seat. The output shaft of the motor is fixedly connected to the rotating shaft. The cam is fixedly sleeved on the rotating shaft.

[0014] Preferably, a communication chamber is provided inside the carrier plate. The communication chamber includes an internal chamber, a sleeve hole, and a communication port. The sleeve holes are opened on both sides of the carrier plate and communicate with the internal chamber. The internal chambers are symmetrically opened inside the carrier plate. The communication port is opened at the top of the carrier plate, and the upper and lower ends of the communication port communicate with the internal chamber and the bottom frame respectively. The connecting plate is movably sleeved in the internal chamber. One end of the second spring is fixed in the internal chamber. The inner wall of the sleeve hole is movably sleeved with the movable rod.

[0015] A positioning method for a PCB positioning mechanism of a chip mounter includes the following positioning steps:

[0016] The first step: The robotic arm places the PCB to be processed on the pressure sensor on the top of the carrier plate;

[0017] The second step: Multiple groups of pressure sensors sense the top contact pressure. When the pressure values are all sensed, the control component is started. The control component sucks the hydraulic oil in the communication chamber and drives the two pushing components to move closer, so that the two supporting plates move closer, and the PCB is clamped between the two clamping components I to complete the clamping positioning. The lead screw in the sliding seat rotates to drive the sliding seat located in the track frame to move to the coating area for solder paste coating, and after coating, it moves to the chip mounter for chip mounting;

[0018] The third step: When some pressure sensors cannot sense the pressure value, the air supply component is started. The air supply component inputs pressurized air into the two clamping components I and the clamping component II. As the inclined groove and the assembly cavity are filled with pressurized air, the positioning plate and the clamping seat II are pushed to move, and clamping and fixing are completed along the upper and lower surfaces at the edge of the PCB. Then the control component is started to further compress the hydraulic oil into the communication chamber and push the two pushing components to move synchronously away from each other, driving the clamped PCB on both sides to be pulled and tightened outward to complete the correction;

[0019] The fourth step: The lead screw in the sliding seat rotates to drive the sliding seat located in the track frame to move to the coating area for solder paste coating, and after coating, it moves to the chip mounter for chip mounting.

[0020] The beneficial effects of the present invention are as follows:

[0021] (1) By using pressure sensors distributed in an array, in cooperation with clamping assembly one and clamping assembly two connected to the air supply assembly, for a PCB to be positioned, the present invention can achieve the state evaluation of the PCB. For a flat PCB, it can directly clamp and position the outer side edge. When it is detected by the pressure sensors that the PCB has a little bending, by clamping the PCB on both sides and reversely controlling clamping assembly one and clamping assembly two on both sides to move away, the clamped PCB is stretched outwards, achieving forced tensioning during positioning, ensuring that the positioned PCB maintains a good horizontal state, improving the subsequent solder paste coating and chip placement quality, adapting to the state of the PCB, completing the adaptive and enhanced chip placement process, and during the subsequent continuous processing, through the positioning and transportation under forced tension for a long time, the calibration work is completed, having strong positioning adaptability, combining PCB calibration and accurate chip placement processing after calibration.

[0022] (2) By using multiple groups of pressure sensors on the top of the carrier plate again, in cooperation with the contact between the pressure sensors and the placed PCB, by sensing the contact pressure and in an array manner, the flatness detection of the placed PCB is completed. When the number of pressure sensors with actual detected pressure changes is small, the quality detection of the PCB is completed, and when it is judged that the PCB is overly warped during positioning, the waste material treatment is carried out, avoiding chip placement processing on PCBs with quality problems and reducing the rejection rate; and for flexible PCBs, the method of clamping and opening on both sides is adopted to avoid the active bending situation caused by approaching extrusion and positioning, and the use effect is good.

[0023] (3) By cooperating with the cooperation between the cam assembly and the support assembly, using the magnetic attraction control of the electromagnet and the support assembly, when vibration is required, the magnetic attraction controls the support assembly to move down and contact and cooperate with the cam assembly, and through the rotation of the cam assembly, the vibration of the support assembly is achieved, thereby achieving the vibration of the carrier plate and the positioned PCB, vibrating the coated solder paste after positioning, strengthening the solder paste homogenization process, avoiding local solder paste accumulation, thereby improving the subsequent chip placement processing, ensuring stable chip placement, avoiding excessive solder paste covering the outside of the chip components, and providing the final chip placement quality. Description of the Drawings

[0024] Figure 1 is the structural schematic diagram of the present invention;

[0025] Figure 2 is the sectional schematic diagram of the present invention;

[0026] Figure 3 is the schematic diagram of the air supply assembly and the support assembly of the present invention;

[0027] Figure 4 is the sectional schematic diagram of the control assembly and the pushing assembly of the present invention;

[0028] Figure 5 Schematic diagram of the connection between the support plate and the pushing component of the present invention;

[0029] Figure 6 Cross-sectional schematic diagram of the first clamping component and the second clamping component of the present invention;

[0030] Figure 7 Cross-sectional schematic diagram of the carrier plate and the control component of the present invention;

[0031] Figure 8 Schematic diagram of the cam component of the present invention;

[0032] Figure 9 Cross-sectional schematic diagram of the sliding seat of the present invention.

[0033] In the figure: 1. Sliding seat; 2. Carrier plate; 3. Pressure sensor; 4. Support plate; 5. First clamping component; 51. First clamping seat; 52. Inclined groove; 53. Positioning plate; 54. First spring; 55. First through hole; 6. Pushing component; 61. Movable rod; 62. Connecting plate; 63. Second spring; 7. Air supply component; 71. Connecting frame; 72. Air pump; 73. Connecting pipe; 8. Support component; 81. Support rod; 82. Cross plate; 83. Third spring; 9. Control component; 91. Electric push rod; 92. Bottom frame; 93. Piston plate; 10. Cam component; 101. Mounting seat; 102. Rotating shaft; 103. Cam; 104. Vertical plate; 11. Second clamping component; 111. Second clamping seat; 112. Assembly cavity; 113. Fourth spring; 114. Second through hole; 12. Internal cavity; 13. Sleeve hole; 14. Connecting port; 15. Mounting hole; 16. Electromagnet. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Such as Figures 1 to 9As shown in the figure, an embodiment of the present invention provides a PCB positioning mechanism and a positioning method for a mounter, including a sliding seat 1 and a carrier plate 2. Pressure sensors 3 are arranged in an array on the top of the carrier plate 2. Support plates 4 are symmetrically arranged on both sides of the carrier plate 2. A clamping assembly one 5 and a clamping assembly two 11 are respectively arranged on the tops of the support plates 4. A pushing assembly 6 is fixedly connected to the side surface of the support plate 4, and the other end of the pushing assembly 6 is elastically connected to the inside of the carrier plate 2. A control assembly 9 is fixedly arranged at the bottom of the carrier plate 2, and the control assembly 9 controls the lateral movement of the pushing assembly 6. A support assembly 8 is fixedly connected to the bottom of the carrier plate 2, and the support assembly 8 is elastically connected to the top of the sliding seat 1. An air supply assembly 7 is fixedly arranged at the bottom of the carrier plate 2, and the air supply assembly 7 is communicated with the clamping assembly one 5 and the clamping assembly two 11. The clamping assembly one 5 includes a clamping seat one 51, an inclined slot 52, a positioning plate 53, a spring one 54, and a through hole one 55. The clamping seat one 51 is fixed on the top of the support plate 4. The inclined slot 52 is opened on the side surface of the clamping seat one 51. The positioning plate 53 is movably sleeved inside the clamping seat one 51. One end of the spring one 54 is fixedly connected to the inclined slot 52, and the other end is fixedly connected to the positioning plate 53. The through hole one 55 is opened on the side surface of the clamping seat one 51.

[0036] Embodiment 1: The robotic arm places the PCB to be processed on the pressure sensors 3 on the top of the carrier plate 2. Multiple groups of pressure sensors 3 sense the top contact pressure. When the pressure values are all sensed, the control assembly 9 is started. The electric push rod 91 drives the piston plate 93 to move in the bottom frame 92, and sucks the hydraulic oil in the communication chamber when moving downward. The internal pressure in the internal cavity 12 decreases, and drives the connecting plates 62 in the two pushing assemblies 6 to be sucked and move closer, so that the two support plates 4 move closer, and the PCB is clamped between the clamping seats one 51 of the two clamping assemblies one 5 on both sides, completing the outer clamping and positioning. The lead screw in the sliding seat 1 rotates, driving the sliding seat 1 located in the track frame to move, moving to the coating area for solder paste coating, and moving to the chip mounter for chip mounting after coating;

[0037] When some of the pressure sensors 3 cannot sense the pressure value, the air supply assembly 7 is started. The air pump 72 in the air supply assembly 7 conveys the compressed air to the through hole one 55 and the through hole two 114 through the connecting pipe 73 and the connecting frame 71 respectively, and then inputs them into the inclined slot 52 and the assembly cavity 112 respectively, filling the two clamping assemblies one 5 and the clamping assembly two 11 on both sides. As the inclined slot 52 and the assembly cavity 112 are filled with compressed air, the positioning plate 53 and the clamping seat two 111 are pushed to move, and both the spring one 54 and the spring four 113 are stretched, and the positioning plate 53 and the clamping seat two 111 complete the clamping and positioning along the upper and lower surfaces at the edge of the PCB. Then the control assembly 9 is started, and the electric push rod 91 drives the piston plate 93 to move upward, further compressing the hydraulic oil into the communication chamber, so that the internal pressure in the internal cavity 12 increases, and pushes the two pushing assemblies 6 on both sides to move outward synchronously away, driving the PCB clamped on both sides to be tightened and tensioned outward, completing the correction;

[0038] When most of the pressure sensors 3 on the carrier plate 2 cannot sense the pressure value, it is determined that the placed PCB has serious warping deformation, the quality inspection is completed, it is determined as a defective PCB, recorded and replaced, and the next group of PCBs is switched for detection and positioning.

[0039] First, by using the pressure sensors 3 distributed in an array, cooperating with the first clamping assembly 5 and the second clamping assembly 11 connected to the air supply assembly 7, for the PCB to be positioned, the state evaluation of the PCB can be realized. For a flat PCB, the outer side edge is directly clamped and positioned. When it is detected by the pressure sensor 3 that the PCB has a little bending, by clamping the PCB on both sides and reversely controlling the first clamping assembly 5 and the second clamping assembly 11 on both sides to move away, the clamped PCB is stretched outwards, and the forced tensioning during positioning is completed, ensuring that the positioned PCB maintains a good horizontal state, improving the subsequent solder paste coating and chip mounting quality, adapting to the state of the PCB, completing the adaptive and enhanced chip mounting process, and during the subsequent continuous processing process, through the positioning and transportation under continuous long-term forced tensioning, the calibration work is completed, with strong positioning adaptability, combining PCB calibration and accurate chip mounting processing after calibration.

[0040] In addition, by using the multiple groups of pressure sensors 3 on the top of the carrier plate 2 again, cooperating with the contact between the pressure sensor 3 and the placed PCB, by sensing the contact pressure and in an array manner, the flatness detection of the placed PCB is completed. When the number of pressure sensors 3 with actual detected pressure changes is small, the PCB quality inspection is completed, and it is judged that the PCB is overly warped during positioning, and the waste material treatment is carried out, avoiding chip mounting processing for PCBs with quality problems and reducing the scrap rate; and for flexible PCBs, the method of clamping and opening on both sides is adopted to avoid the active bending situation caused by approaching extrusion and positioning, and the use effect is good.

[0041] Embodiment 2: After the positioning and fixing of the PCB before chip mounting are completed, as the external power mechanism drives the lead screw to rotate, the slide block 1 moves horizontally in the track frame to the coating area. And after the solder paste is coated, before the PCB coated with solder paste is transported to the chip mounting mechanism area under the mounter, the electromagnet 16 is started. The electromagnet 16 is energized to generate magnetic suction and adsorbs the support rod 81 in the mounting hole 15, so that the support assembly 8 drives the carrier plate 2 to move downward magnetically under the magnetic suction. Then the cam assembly 10 is started, so that the rotating shaft 102 drives the cam 103 to rotate. The cam 103 rotates along the bottom of the cross plate 82 and intermittently pushes the cross plate 82, so that the support assembly 8 drives the carrier plate 2 and the PCB positioned on the top to vibrate, so that the coated solder paste vibrates and evenly spreads on the top of the PCB, and subsequent chip mounting processing is carried out after moving under the mounter.

[0042] First, through the cooperation of the cam assembly 10 and the support assembly 8, and by using the magnetic attraction control of the electromagnet 16 and the support assembly 8, when vibration is required, the support assembly 8 is magnetically attracted and controlled to move downward and come into contact and cooperation with the cam assembly 10. And through the rotation of the cam assembly 10, the vibration of the support assembly 8 is realized, thereby realizing the vibration of the carrier plate 2 and the positioning PCB. After positioning, the applied solder paste is vibrated to strengthen the homogenization treatment of the solder paste, avoid local accumulation of the solder paste, thereby improving the subsequent chip mounter processing, ensuring stable chip mounter, avoiding excessive solder paste from covering the outside of the chip components, and providing the final chip mounter quality.

[0043] Among them, the second clamping assembly 11 includes a second clamping seat 111, an assembly cavity 112, a fourth spring 113 and a second through hole 114. The second through hole 114 is opened on the side surface of the support plate 4 and communicates with the assembly cavity 112. The second clamping seat 111 is movably sleeved in the assembly cavity 112. One end of the fourth spring 113 is fixedly connected in the assembly cavity 112, and the upper end is fixedly connected to the bottom of the second clamping seat 111.

[0044] By using the second clamping assembly 11 to cooperate with the internal air supply to push upward, and at the same time cooperating with the positioning plate 53 that is pushed and tilted in the inclined groove 52, the clamping and fixing at the edge of the PCB are realized, which is convenient for the correction after tensioning and stretching the PCB after clamping and positioning.

[0045] Among them, the air supply assembly 7 includes a connecting frame 71, an air pump 72 and a connecting pipe 73. The air pump 72 is fixed at the bottom of the carrier plate 2. The connecting frame 71 is fixed on the outer side surfaces of the support plate 4 and the first clamping seat 51. The connecting frame 71 communicates with the first through hole 55 and the second through hole 114 at the same time. The connecting pipe 73 is fixedly connected between the two connecting frames 71. The connecting pipe 73 is communicated with the air outlet end of the air pump 72. The connecting pipe 73 is a flexible pipe.

[0046] The air supply assembly 7 provides compressed air to realize the power for positioning and clamping. The flexible connecting pipe 73 is convenient for adapting to the moving support plate 4.

[0047] Among them, the pushing assembly 6 includes a movable rod 61, a connecting plate 62 and a second spring 63. The movable rod 61 is fixedly connected to the side surface of the support plate 4. The connecting plate 62 is fixedly connected to the end surface of the movable rod 61 and is fixedly connected to the second spring 63.

[0048] The pushing assembly 6 bears the hydraulic action and cooperates with the elasticity of the second spring 63 to realize the lateral movement and reset, and controls the movement of the support plate 4.

[0049] Among them, the control assembly 9 includes an electric push rod 91, a bottom frame 92 and a piston plate 93. The bottom frame 92 is fixed at the bottom of the carrier plate 2. The piston plate 93 is movably sleeved in the bottom frame 92. The electric push rod 91 is located below the bottom frame 92. The movable end of the electric push rod 91 passes through the bottom frame 92 and is fixedly connected to the bottom of the piston plate 93.

[0050] The control component 9 realizes hydraulic control. When squeezing upwards, it makes the two side support plates 4 move away from each other. When sucking downwards, it controls the two side support plates 4 to move closer to each other, completing the positioning process of the PCB under different conditions.

[0051] Among them, a mounting hole 15 is opened at the top of the sliding seat 1. The bottom end of the support component 8 is movably sleeved in the mounting hole 15. An electromagnet 16 is fixedly installed inside the mounting hole 15. A cam component 10 is fixedly installed on the top of the sliding seat 1. The cam component 10 controls the support component 8. The support component 8 includes a support rod 81, a cross plate 82 and a third spring 83. The support rod 81 is fixedly connected to the bottom of the carrier plate 2. The cross plate 82 is fixedly sleeved on the outer surface of the support rod 81. The lower end of the support rod 81 is movably sleeved in the mounting hole 15. One end of the third spring 83 is fixedly connected to the bottom surface of the cross plate 82, and the other end is fixedly connected to the top of the sliding seat 1. The cam component 10 includes a mounting seat 101, a rotating shaft 102, a cam 103 and a vertical plate 104. The mounting seat 101 and the vertical plate 104 are both fixed on the sliding seat 1. The rotating shaft 102 is rotatably sleeved in the vertical plate 104. A motor is fixedly arranged inside the mounting seat 101. The output shaft of the motor is fixedly connected to the rotating shaft 102. The cam 103 is fixedly sleeved on the rotating shaft 102.

[0052] By using the support component 8 to support the carrier plate 2 and cooperating with the magnetic attraction of the electromagnet 16, the up and down height adjustment can be realized, the position fine adjustment can be realized, and when adsorbing and moving downwards, it cooperates with the cam component 10. By using the reciprocating push of the cam component 10, the support component 8 drives the vibration of the carrier plate 2, realizing the uniform treatment after the automatic vibration of the coated solder paste.

[0053] Among them, a communication chamber is arranged inside the carrier plate 2. The communication chamber includes an internal chamber 12, a sleeve hole 13 and a communication port 14. The sleeve hole 13 is opened on both sides of the carrier plate 2 and communicates with the internal chamber 12. The internal chamber 12 is symmetrically opened inside the carrier plate 2. The communication port 14 is opened at the top of the carrier plate 2. The upper and lower ends of the communication port 14 are respectively communicated with the internal chamber 12 and the bottom frame 92. The connecting plate 62 is movably sleeved in the internal chamber 12. One end of the second spring 63 is fixed in the internal chamber 12. The inner wall of the sleeve hole 13 is movably sleeved with the movable rod 61.

[0054] The communication chamber is adapted to the assembly connection of the pushing component 6, and cooperates with the control component 9 to realize the internal hydraulic control and complete the movement control of the pushing component 6.

[0055] A positioning method for the PCB positioning mechanism of a mounter includes the following positioning steps:

[0056] The first step: The robotic arm places the PCB to be processed on the pressure sensor 3 on the top of the carrier plate 2;

[0057] Step 2: Multiple groups of pressure sensors 3 sense the top contact pressure. After all sense the pressure values, the control component 9 is activated. The control component 9 sucks the hydraulic oil in the communication chamber and drives the two-side pushing components 6 to move closer, causing the two-side support plates 4 to move closer, so that the PCB is clamped between the two clamping components I 5, completing the clamping and positioning. The lead screw in the slide base 1 rotates, driving the slide base 1 located in the track frame to move, moving to the coating area for solder paste coating, and moving to the chip mounting mechanism for chip mounting after coating;

[0058] Step 3: When some of the pressure sensors 3 cannot sense the pressure value, the air supply component 7 is activated. The air supply component 7 inputs pressurized air into the two-side clamping components I 5 and the clamping components II 11. As the inclined groove 52 and the assembly cavity 112 are filled with pressurized air, the positioning plate 53 and the clamping seat II 111 are pushed to move, completing the clamping and fixing along the upper and lower surfaces at the edge of the PCB. Subsequently, the control component 9 is activated to further compress the hydraulic oil into the communication chamber and push the two-side pushing components 6 to move synchronously away from each other, driving the clamped PCB on both sides to be pulled and tightened outward, completing the calibration;

[0059] Step 4: The lead screw in the slide base 1 rotates, driving the slide base 1 located in the track frame to move, moving to the coating area for solder paste coating, and moving to the chip mounting mechanism for chip mounting after coating.

[0060] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB positioning mechanism for a chip mounter, comprising a slide seat (1) and a carrier plate (2), characterized in that: The top of the carrier plate (2) is provided with an array of pressure sensors (3); support plates (4) are symmetrically provided on both sides of the carrier plate (2); a clamping assembly (5) and a clamping assembly (11) are provided on the top of the support plate (4), respectively; a pushing assembly (6) is fixedly connected to the side of the support plate (4); the other end of the pushing assembly (6) is elastically connected to the inside of the carrier plate (2); a control assembly (9) is fixedly provided at the bottom of the carrier plate (2); the control assembly (9) controls the lateral movement of the pushing assembly (6); a support assembly (8) is fixedly connected to the bottom of the carrier plate (2); the support assembly (8) is elastically connected to the top of the slide seat (1); an air supply assembly (7) is fixedly provided at the bottom of the carrier plate (2); the air supply assembly (7) is connected to the clamping assembly (5) and the clamping assembly (11); The clamping assembly (5) comprises a clamping seat (51), an inclined groove (52), a positioning plate (53), a spring (54) and a through hole (55); the clamping seat (51) is fixed on the top of the support plate (4); the inclined groove (52) is provided on the side of the clamping seat (51); the positioning plate (53) is movably sleeved inside the clamping seat (51); one end of the spring (54) is fixedly connected in the inclined groove (52) and the other end is fixedly connected to the positioning plate (53); and the through hole (55) is provided on the side of the clamping seat (51).

2. The PCB positioning mechanism of a chip mounter according to claim 1, characterized in that: The clamping assembly 2 (11) comprises a clamping seat 2 (111), an assembly cavity (112), a spring 4 (113) and a through hole 2 (114); the through hole 2 (114) is provided on the side of the support plate (4) and is communicated with the assembly cavity (112); the clamping seat 2 (111) is movably sleeved in the assembly cavity (112); one end of the spring 4 (113) is fixedly connected in the assembly cavity (112), and the upper end is fixedly connected to the bottom of the clamping seat 2 (111).

3. The PCB positioning mechanism of a chip mounter according to claim 2, characterized in that: The air supply assembly (7) comprises a connecting frame (71), an air pump (72) and a connecting pipe (73); the air pump (72) is fixed to the bottom of the carrier plate (2); the connecting frame (71) is fixed to the outer side surfaces of the support plate (4) and the clamping seat (51); the connecting frame (71) is connected to the through hole (55) and the through hole (114) at the same time; the connecting pipe (73) is fixedly connected between the two connecting frames (71); the connecting pipe (73) is connected to the air outlet end of the air pump (72); and the connecting pipe (73) is a flexible pipe.

4. The PCB positioning mechanism of a chip mounter according to claim 3, characterized in that: The pushing assembly (6) comprises a movable rod (61), a connecting plate (62) and a second spring (63); the movable rod (61) is fixedly connected to the side surface of the support plate (4); the connecting plate (62) is fixedly connected to the end surface of the movable rod (61) and is fixedly connected to the second spring (63).

5. The PCB positioning mechanism of a chip mounter according to claim 4, characterized in that: The control assembly (9) comprises an electric push rod (91), a bottom frame (92) and a piston plate (93); the bottom frame (92) is fixed to the bottom of the carrier plate (2); the piston plate (93) is movably sleeved in the bottom frame (92); the electric push rod (91) is located below the bottom frame (92); the movable end of the electric push rod (91) passes through the bottom frame (92) and is fixedly connected to the bottom of the piston plate (93).

6. The PCB positioning mechanism of a chip mounter according to claim 1, characterized in that: The top of the slide seat (1) is provided with a mounting hole (15), the bottom end of the support assembly (8) is movably sleeved in the mounting hole (15), an electromagnet (16) is fixedly mounted inside the mounting hole (15), and a cam assembly (10) is fixedly mounted on the top of the slide seat (1), and the cam assembly (10) controls the support assembly (8).

7. The PCB positioning mechanism of a chip mounter according to claim 6, characterized in that: The support assembly (8) comprises a support rod (81), a transverse plate (82) and a spring three (83); the support rod (81) is fixedly connected to the lower part of the carrier plate (2); the transverse plate (82) is fixedly sleeved on the outer surface of the support rod (81); the lower end of the support rod (81) is movably sleeved in the mounting hole (15); one end of the spring three (83) is fixedly connected to the bottom surface of the transverse plate (82), and the other end is fixedly connected to the top of the slide seat (1).

8. The PCB positioning mechanism of a chip mounter according to claim 7, characterized in that: The cam assembly (10) comprises a mounting seat (101), a rotating shaft (102), a cam (103) and a vertical plate (104); the mounting seat (101) and the vertical plate (104) are both fixed on the slide seat (1); the rotating shaft (102) is rotatably sleeved in the vertical plate (104); a motor is fixedly arranged inside the mounting seat (101); the output shaft of the motor is fixedly connected to the rotating shaft (102); and the cam (103) is fixedly sleeved on the rotating shaft (102).

9. The PCB positioning mechanism of a chip mounter according to claim 5, characterized in that: A communicating chamber is provided inside the carrier plate (2), and the communicating chamber comprises an internal chamber (12), a sleeve hole (13) and a communicating port (14); the sleeve hole (13) is provided on both sides of the carrier plate (2) and is communicated with the internal chamber (12); the internal chamber (12) is symmetrically provided inside the carrier plate (2); the communicating port (14) is provided on the top of the carrier plate (2); the upper and lower ends of the communicating port (14) are respectively communicated with the internal chamber (12) and the bottom frame (92); the connecting plate (62) is movably sleeved in the internal chamber (12); one end of the second spring (63) is fixed in the internal chamber (12); and the inner wall of the sleeve hole (13) is movably sleeved with the movable rod (61).

10. A positioning method for a PCB positioning mechanism of a placement machine according to any one of claims 1 to 9, characterized in that: The positioning steps include: Step 1: The robot arm places the PCB to be processed on the pressure sensor (3) on top of the carrier (2); Step 2: Multiple groups of pressure sensors (3) sense the top contact pressure. When all pressure values ​​are sensed, the control component (9) is started. The control component (9) sucks the hydraulic oil in the connecting chamber and drives the push components (6) on both sides to move closer, so that the support plates (4) on both sides move closer, so that the PCB is clamped between the clamping components (5) on both sides to complete the clamping positioning. The lead screw in the slide (1) rotates, driving the slide (1) located in the track frame to move, move to the coating area for solder paste coating, and move to the patch mechanism after coating for patch mounting; Step 3: When some of the pressure sensors (3) cannot sense the pressure value, the air supply component (7) is started, and the air supply component (7) inputs the pressurized air into the clamping component 1 (5) and the clamping component 2 (11) on both sides. As the pressurized air is filled in the inclined groove (52) and the assembly cavity (112), the positioning plate (53) and the clamping seat 2 (111) are pushed to move, and the clamping and fixing are completed along the upper and lower surfaces of the edge of the PCB. Then, the control component (9) is started to further compress the hydraulic oil into the connecting chamber, and the pushing components (6) on both sides are pushed to move outward synchronously, so as to pull and tension the clamped PCBs on both sides outward, and the calibration is completed; Step 4: The lead screw in the slide (1) rotates, driving the slide (1) located in the track frame to move to the coating area for solder paste coating, and after coating, moves to the patch mechanism for patching.

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