Display module and display device

Abstract

The invention discloses a display module and a display device. The display module comprises a display substrate, the display substrate comprises a display area, a bending area and a composite circuit area, the bending area and the composite circuit area are sequentially located on one side of the display area, and the bending area is arranged to bend the composite circuit area to the backlight side surface of the display substrate; the flexible circuit board comprises a device area located on the side away from the display substrate, and a plurality of electronic devices are arranged in the device area; the flexible circuit board is bound and connected to the composite circuit area and is bent to the backlight side surface of the display substrate; in the plane of the display substrate, the binding connection position of the flexible circuit board and the display substrate is located on the side, away from the bending area, of the device area. The covering film comprises a first sub-film and a second sub-film, and the first sub-film is located on the side, close to the bending area, of the flexible circuit board and connected with the display substrate; and the second sub-film is positioned on one side, far away from the display substrate, of the first sub-film and the flexible circuit board, and is used for fixing the flexible circuit board on the display substrate.

Description

Technical Field

[0001] This document relates to, but is not limited to, display technologies, and particularly to a display module and a display device. Background Art

[0002] An organic light-emitting diode (OLED) is an active light-emitting display device, which has the advantages of self-luminescence, wide viewing angle, high contrast ratio, low power consumption, extremely high response speed, etc. With the continuous development of display technologies, a display device using an OLED as a light-emitting element and controlled by thin film transistors (TFTs) has become the mainstream product in the current display field.

[0003] However, a display device is vulnerable to electrostatic influence, resulting in abnormal display. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this document. This overview is not intended to limit the scope of protection of the claims.

[0005] Embodiments of the present disclosure provide a display module and a display device to solve the problem that a display device is prone to abnormal display under the influence of static electricity.

[0006] On the one hand, embodiments of the present disclosure provide a display module, including: a display substrate, including a display area and a bending area and a composite circuit area sequentially located on one side of the display area, the bending area being configured to bend the composite circuit area to the backlight side surface of the display substrate; a flexible circuit board, including a device area located on the side away from the display substrate, and a plurality of electronic devices being arranged in the device area; the flexible circuit board being bonded and connected to the composite circuit area and being bent to the backlight side surface of the display substrate; in the plane of the display substrate, the position where the flexible circuit board is bonded and connected to the display substrate is located on the side of the device area away from the bending area; a cover film, including a first sub-film and a second sub-film, the first sub-film being located on the side of the flexible circuit board close to the bending area and being interconnected with the display substrate; the second sub-film being located on the side of the first sub-film and the flexible circuit board away from the display substrate, and being configured to fix the flexible circuit board on the display substrate.

[0007] In an exemplary embodiment, a protective adhesive layer is further included, the protective adhesive layer covering the bending area and at least partially overlapping with the composite circuit area; in a direction perpendicular to the display substrate, the first sub-film and the protective adhesive layer overlap each other, and in a direction from the display area to the bending area, the minimum overlapping dimension of the first sub-film and the protective adhesive layer is greater than or equal to 0.4 mm and less than or equal to 1.2 mm.

[0008] In an exemplary embodiment, a first adhesive layer is further included. The first adhesive layer is located on a side of the first sub-membrane away from the bending region, and the flexible circuit board is adhered to the display substrate through the first adhesive layer.

[0009] In an exemplary embodiment, the first adhesive layer and the first sub-membrane are connected to each other.

[0010] In an exemplary embodiment, the flexible circuit board includes an extension portion extending toward the bending region. A side of the extension portion away from the display substrate is a flat surface; the second sub-membrane is connected to the extension portion and the display substrate around the flexible circuit board to fix the flexible circuit board on the display substrate.

[0011] In an exemplary embodiment, in a direction perpendicular to the display substrate, the extension portion and the first sub-membrane are spaced apart from each other, and a positive projection of the extension portion on the display substrate and a positive projection of the first sub-membrane on the display substrate at least partially overlap.

[0012] In an exemplary embodiment, the second sub-membrane includes at least one hollowed-out portion. A positive projection of the at least one hollowed-out portion on the display substrate intersects with a contour edge of the device region, and the hollowed-out portion exposes the contour edge of the device region.

[0013] In an exemplary embodiment, the second sub-membrane includes a non-adhesive region surrounding the at least one hollowed-out portion; within the range of the non-adhesive region, the second sub-membrane is not adhered to the flexible circuit board.

[0014] In an exemplary embodiment, in a direction perpendicular to the display substrate, the first sub-membrane includes a stacked first insulating film, a first conductive film, and a second insulating film, and the first insulating film is located on a side away from the display substrate; the second sub-membrane includes a stacked third insulating film, a second conductive film, and a fourth insulating film, and the fourth insulating film is located on a side away from the display substrate.

[0015] In an exemplary embodiment, the first insulating film includes at least one first through-hole exposing the first conductive film, and the fourth insulating film includes at least one second through-hole exposing the second conductive film; in a direction perpendicular to the display substrate, the second conductive film and the first conductive film are connected to each other through the first through-hole and the second through-hole.

[0016] In an exemplary embodiment, a heat dissipation layer is disposed on the backlight side surface of the display substrate; the fourth insulating film further includes at least one third through hole exposing the second conductive film, and the second conductive film is connected to the copper-exposed area of the heat dissipation layer through the third through hole.

[0017] In an exemplary embodiment, a first adhesive layer is further included. The first adhesive layer and the first sub-film are connected to each other, including: the first adhesive layer includes an outwardly extending portion located on the side of the flexible circuit board close to the bending area, and the first insulating film covers the outwardly extending portion of the first adhesive layer.

[0018] On the other hand, an embodiment of the present disclosure provides a display device; including the display module as described above.

[0019] For the display module provided by the embodiment of the present disclosure, the cover film includes a first sub-film and a second sub-film. The connection between the first sub-film and the display substrate is flatter and less likely to warp, which can better protect the fan-out wiring and avoid display abnormalities caused by static electricity. The second sub-film can protect the flexible circuit board. By setting the cover film as a segmented first sub-film and second sub-film, different sub-films are used to protect different positions and structures in a targeted manner, improving the adhesion and protection effects of the cover film. The problem that the display device is prone to display abnormalities under the influence of static electricity is solved.

[0020] Other aspects can be understood after reading and understanding the drawings and the detailed description. Description of the Drawings

[0021] The drawings are used to provide an understanding of the technical solutions of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solutions of the present application and do not constitute a limitation to the technical solutions of the present application.

[0022] Figure 1 It is a schematic structural diagram of a display substrate;

[0023] Figure 2 It is Figure 1 A side view of the display substrate after bending in

[0024] Figure 3 It is a top view of a display module in an exemplary embodiment;

[0025] Figure 4 It is in an exemplary embodiment Figure 3 A cross-sectional view along the AA direction;

[0026] Figure 5 It is a top view of a display module in another exemplary embodiment;

[0027] Figure 6 It is in an exemplary embodimentFigure 5 Cross-sectional view along AA direction;

[0028] Figure 7 In an exemplary embodiment Figure 6 Enlarged schematic view of the dashed area C in it;

[0029] Figure 8 In an exemplary embodiment Figure 6 Enlarged schematic view of the dashed area B in it;

[0030] Figure 9 In an exemplary embodiment Figure 5 Cross-sectional view along EE direction;

[0031] Figure 10 In yet another exemplary embodiment Figure 5 Cross-sectional view along AA direction;

[0032] Figure 11 In yet another exemplary embodiment Figure 5 Cross-sectional view along AA direction;

[0033] Figure 12 Top view of the cover film, flexible circuit board and integrated circuit in an exemplary embodiment;

[0034] Figure 13 In an exemplary embodiment Figure 12 Cross-sectional view along AA direction;

[0035] Figure 14 Cross-sectional view of the second sub-film in the non-adhesive area in an exemplary embodiment. Detailed implementation manners

[0036] The present disclosure describes multiple embodiments, but the description is exemplary rather than restrictive, and there can be more embodiments and implementation solutions within the scope of the embodiments described in the present disclosure for those of ordinary skill in the art. Although many possible feature combinations are shown in the drawings and discussed in the detailed implementation manners, many other combination ways of the disclosed features are also possible. Unless specifically restricted, any feature or element of any embodiment can be combined with any other feature or element in any other embodiment, or can replace any other feature or element in any other embodiment.

[0037] The present disclosure includes and contemplates combinations with features and elements known to those of ordinary skill in the art. The disclosed embodiments, features, and elements of the present disclosure may also be combined with any conventional features or elements to form a unique inventive solution defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other inventive solutions to form another unique inventive solution defined by the claims. Therefore, it should be understood that any feature shown and / or discussed in the present disclosure can be implemented alone or in any suitable combination. Therefore, the embodiments are not subject to other limitations except those made in accordance with the appended claims and their equivalents. In addition, various modifications and changes can be made within the scope of protection of the appended claims.

[0038] In the drawings, for clarity sometimes, the sizes of one or more constituent elements, the thicknesses of layers, or regions are exaggerated. Therefore, one aspect of the present disclosure is not necessarily limited to such dimensions, and the shapes and sizes of one or more components in the drawings do not reflect the true proportions. In addition, the drawings schematically show ideal examples, and one aspect of the present disclosure is not limited to the shapes or values shown in the drawings.

[0039] The ordinal numbers such as "first", "second", "third", etc. in this specification are provided to avoid confusion of constituent elements and are not intended to limit in terms of quantity. "A plurality" in the present disclosure means two or more quantities.

[0040] In this specification, for convenience, terms indicating orientation or positional relationships such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are used to describe the positional relationships of constituent elements with reference to the drawings, which are only for facilitating the description of this specification and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present disclosure. The positional relationships of the constituent elements are appropriately changed according to the directions of the described constituent elements. Therefore, it is not limited to the terms described in the specification and can be appropriately replaced according to the circumstances.

[0041] In this specification, unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate member, or the communication inside two elements. For those of ordinary skill in the art, the meanings of the above terms in this disclosure can be understood according to the circumstances. Among them, "electrical connection" includes the case where constituent elements are connected together through an element having a certain electrical effect. There is no particular limitation on the "element having a certain electrical effect" as long as it can transmit electrical signals between the constituent elements to be connected. Examples of the "element having a certain electrical effect" include not only electrodes and wirings, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0042] In this specification, "parallel" means a state where the angle formed by two straight lines is more than -10° and less than 10°, and thus also includes the state where the angle is more than -5° and less than 5°. In addition, "perpendicular" means a state where the angle formed by two straight lines is more than 80° and less than 100°, and thus also includes the state where the angle is more than 85° and less than 95°.

[0043] "About" in this disclosure means not strictly limiting the boundary and allowing values within the process and measurement errors.

[0044] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0045] Figure 1 It is a schematic structural diagram of a display substrate, showing the state of the bonding area before bending. Figure 2 is Figure 1 a side view of the display substrate after bending, showing the bent state of the bonding area after bending. As Figure 1 and Figure 2 shown, in the plane of the display substrate, the display substrate may at least include a display area 100, a bonding area 200 on one side of the display area 100, and a border area 300 on the other side of the display area 100. In an exemplary embodiment, the display area 100 may be a flat area, including a plurality of sub-pixels Pxij that make up a pixel array. The plurality of sub-pixels Pxij are configured to display dynamic pictures or still images, and the display area 100 may be referred to as an active area (AA). In an exemplary embodiment, the display substrate may be deformable, such as curling, bending, or folding.

[0046] In an exemplary embodiment, the display area 100 may be located on one side of the second direction Y of the bonding area 200, and the first direction X may intersect the second direction Y. In an exemplary embodiment, the bonding area 200 may include a wiring area 210, a bending area 220, and a composite circuit area 230 arranged in sequence along the direction away from the display area 100. The wiring area 210 may be connected to the display area 100 and may at least include a plurality of data transmission lines configured to connect to the data signal lines in the display area. The bending area 220 may be connected to the wiring area 210 and may include a composite insulating layer provided with grooves, configured to bend and fit the bonding area to the back surface of the display area 100 in a bending manner, so that the bonding area 200 may overlap the display area 100 in the direction perpendicular to the plane of the display area 100. The composite circuit area 230 may at least include a driving chip area 240 and a bonding pin area 250. An integrated circuit (IC) may be bonded and connected in the driving chip area 240, and a flexible circuit board may be bonded and connected in the bonding pin area 250.

[0047] In an exemplary embodiment, the integrated circuit may be bonded and connected in the driving chip area 240 by an anisotropic conductive film or other means. The integrated circuit may generate driving signals required to drive the sub-pixels and may provide the driving signals to the sub-pixels in the display area 100. For example, the driving signal may be a data signal for driving the emission brightness of the sub-pixels. In an exemplary embodiment, the bonding pin area 250 may include a plurality of pins (PINs), and the flexible circuit board may be bonded and connected to the plurality of pins. In an exemplary embodiment, a single display substrate may be bonded and connected to a plurality of integrated circuits, and a single display substrate may be bonded and connected to a plurality of flexible circuit boards.

[0048] Figure 3 It is a top view of the display module in an exemplary embodiment, showing the backlight side surface of the display module after bending. Figure 4 In an exemplary embodiment Figure 3 A cross-sectional view taken along the AA direction, showing the cross-sectional structure of the display module along the second direction Y near the bonding area 200. Combining Figure 3 and Figure 4As shown, the display module includes a display substrate 10, a flexible circuit board 20, an integrated circuit 30, and a cover film 40. The display substrate 10 includes a first side surface and a second side surface that are oppositely disposed. The first side surface can be the light-emitting side surface, and the second side surface can be the backlight side surface. A polarizer 11 and a cover plate 12 can be sequentially disposed on the first side surface of the display substrate 10. A back film (BackFilm, BF) layer 13, a heat dissipation layer (SCF or BKT) 14, and a spacer layer 15 can be sequentially disposed on the second side surface of the display substrate 10. The flexible circuit board 20 and the integrated circuit 30 can be bonded and connected to the first side surface of the display substrate 10 and bent to the second side surface of the display substrate 10.

[0049] In an exemplary embodiment, the orthographic projection of the polarizer 11 on the display substrate 10 can cover the display area 100 and the wiring area 210, and the cover plate 12 can cover the bent display substrate 10. The display substrate 10, the polarizer 11, and the cover plate 12 can be connected by an adhesive. For example, a pressure-sensitive adhesive (PSA) can be used to paste the polarizer 11 on the first side surface of the display substrate 10, and an optically clear adhesive (OCA) can be used to paste the cover plate 12 on the polarizer 11. The cover plate 12 can be a cover glass (Cover Glass, CG) or a flexible plastic colorless polyimide (Colorless Polyimide, CPI).

[0050] In an exemplary embodiment, the back film layer 13 is configured to support the display substrate 10 and can be disposed in the display area 100 and the bonding area 200. A back film opening 13-1 is formed in the back film layer 13 of the bonding area 200. The position of the back film opening 13-1 can correspond to the bending area 220. The back film layer 13 in the back film opening 13-1 is removed, that is, the back film layer 13 in the bonding area 200 is respectively disposed in the wiring area 210 and the composite circuit area 230. In an exemplary embodiment, the back film layer 13 can be made of a polymer low-modulus film material, such as a flexible film material such as polyolefin, polyimide, and polyurethane.

[0051] In an exemplary embodiment, the heat dissipation layer 14 is configured to dissipate the heat generated by the display substrate 10 during operation and can be only located in the display area 100 and the wiring area 210. In an exemplary embodiment, the heat dissipation layer 14 can include a first heat dissipation layer (not shown in the figure) and a second heat dissipation layer (not shown in the figure) sequentially disposed in a direction away from the cover plate 12. The first heat dissipation layer can include a grid adhesive layer and a buffer layer. The buffer layer can be made of a foam material, for example. The second heat dissipation layer can include a copper foil layer.

[0052] In an exemplary embodiment, the spacer layer 15 is configured to be attached to the heat dissipation layer 14 of the wiring area 210 and the back film layer 13 of the composite circuit area 230 respectively, and may be located only in the display area 100 and the wiring area 210.

[0053] In an exemplary embodiment, the bending area 220 of the display substrate 10 includes a protective adhesive layer 16 provided on the first side surface of the display substrate 10. The protective adhesive layer 16 may extend from the wiring area 210 to the composite circuit area 230 to cover the display substrate of the bending area 220. In an exemplary embodiment, the protective adhesive layer 16 of the wiring area 210 may be located on the side of the polarizer 11 away from the display area 100, and the protective adhesive layer 16 of the composite circuit area 230 may cover a part of the composite circuit area 230; in other embodiments, the protective adhesive layer 16 of the composite circuit area 230 may cover the entire composite circuit area 230. The protective adhesive layer 16 may provide protection for the bending arc area of the display substrate 10, and the protective adhesive layer 16 may be made of metal conductive lacquer (MCL) or micro coating layer (MCL).

[0054] In an exemplary embodiment, as Figure 4 shown, after the flexible circuit board 20 is bonded and connected to the bonding pin area 250 of the display substrate 10, it is bent to the second side surface of the display substrate 10. The flexible circuit board 20 may be pasted on the first side surface of the display substrate 10 through the first adhesive layer 21. The position where the flexible circuit board 20 is bonded and connected to the display substrate 10 may be located on the side of the integrated circuit 30 away from the bending area 220, that is, the flexible circuit board 20 may be reversely bonded to the display substrate 10, and the first adhesive layer 21 may be located on the side of the integrated circuit 30 close to the bending area 220. The first adhesive layer 21 may be made of pressure-sensitive adhesive, and the first adhesive layer 21 may be pasted on the display substrate 10 before bending. A receiving space may be provided on the side of the flexible circuit board 20 close to the display substrate 10, and the integrated circuit 30 may be located in the receiving space. The flexible circuit board 20 includes a device area 22 located on the side away from the display substrate 10, and electronic devices are provided in the device area 22. By attaching a cover film 40 to the side of the flexible circuit board 20 away from the display substrate 10, the flexible circuit board 20 can be firmly fixed on the display substrate 10. The cover film 40 has the function of shielding electromagnetic interference (EMI), and can protect the flexible circuit board 20 and the wiring on the display substrate 10 from the influence of electromagnetic interference.

[0055] As Figure 4As shown, since electronic devices are provided in the device area 22 of the flexible circuit board 20, the height of the flexible circuit board 20 in the third direction Z perpendicular to the display substrate 10 is relatively high, and the surface of the side of the flexible circuit board 20 away from the display substrate 10 is uneven. The cover film 40 has to span a large height difference to be connected to the display substrate 10, and the cover film 40 is prone to wrinkles and warping. The display substrate 10 is provided with fanout traces (not shown in the figure) near the bending area 220, such as traces provided in the composite circuit area 230. In the case where the cover film 40 warps, the protection of the fanout traces is insufficient, and static electricity is likely to break down the fanout traces, resulting in abnormal bright lines or other display abnormalities when the display substrate is displaying.

[0056] An embodiment of the present disclosure provides a display module, including:

[0057] A display substrate, including a display area and a bending area and a composite circuit area sequentially located on one side of the display area, the bending area is configured to bend the composite circuit area to the backlight side surface of the display substrate;

[0058] A flexible circuit board, including a device area located on the side away from the display substrate, and a plurality of electronic devices are provided in the device area; the flexible circuit board is bonded and connected to the composite circuit area and is bent to the backlight side surface of the display substrate; in the plane of the display substrate, the position where the flexible circuit board is bonded and connected to the display substrate is located on the side of the device area away from the bending area;

[0059] A cover film, including a first sub-film and a second sub-film, the first sub-film is located on the side of the flexible circuit board close to the bending area and is interconnected with the display substrate; the second sub-film is located on the side of the first sub-film and the flexible circuit board away from the display substrate, and is configured to fix the flexible circuit board on the display substrate.

[0060] In the display module provided by the embodiment of the present disclosure, the cover film includes a first sub-film and a second sub-film. The connection between the first sub-film and the display substrate is smoother and less prone to warping, which can provide better protection for the fanout traces and avoid display abnormalities caused by static electricity. The second sub-film can protect the flexible circuit board. By setting the cover film as a segmented first sub-film and second sub-film, different sub-films are used to protect different positions and structures in a targeted manner, improving the attachment and protection effects of the cover film.

[0061] Figure 5 It is a top view of the display module in another exemplary embodiment, showing the backlight side surface of the display module after bending. Figure 6 For an exemplary embodiment Figure 5A cross-sectional view along AA shows the cross-sectional structure of the display module along the second direction Y near the bonding area 200. Figure 5 and Figure 3 The difference lies in the structure of the cover film 40. For the rest, reference can be made to the foregoing description of Figure 3 . Figure 6 and Figure 4 The difference lies in the structure of the cover film 40. For the rest, reference can be made to the foregoing description of Figure 4 . Details are not described herein again.

[0062] As Figure 5 and Figure 6 shown, the flexible circuit board 20 is bonded and connected to the display substrate 10 on the side of the device area 22 away from the bending area 220, and is pasted on the display substrate 10 on the side of the device area 22 close to the bending area 220 through the first adhesive layer 21. The cover film 40 includes a first sub-film 41 and a second sub-film 42. The first sub-film 41 is located on the side of the flexible circuit board 20 close to the bending area 220 and is interconnected with the display substrate 10. The second sub-film 42 is located on the side of the first sub-film 41 and the flexible circuit board 20 away from the display substrate 10, and is connected to the first sub-film 41 and the display substrate 10 around the flexible circuit board 20 to fix the flexible circuit board 20 on the display substrate 10. As Figure 6 shown, one end of the second sub-film 42 can overlap with the surface of the heat dissipation layer 14 away from the display substrate 10, and the other end of the second sub-film 42 can overlap with the surface of the first sub-film 41 away from the display substrate 10. The second sub-film 42 can protect the entire device area 22 and the composite circuit area 230 of the flexible circuit board 20. Since the first sub-film 41 is directly connected to the display substrate 10, the bonding surface is relatively flat and does not need to cross a large height difference. The connection between the first sub-film 41 and the display substrate 10 is stable, and it can provide good protection for the fan-out traces near the bending area 220, preventing damage caused by static electricity and display abnormalities. Moreover, a part of the second sub-film 42 is connected through the first sub-film 41 and the display substrate 10, and the other part of the second sub-film 42 is directly connected to the display substrate 10. This connection method makes the connection between the second sub-film 42 and the display substrate 10 more stable, and overall improves the connection stability between the cover film 40 and the display substrate 10.

[0063] In an exemplary embodiment, the first sub-film 41 can overlap with the protective adhesive layer 80. Since the overlapping surface of the first sub-film 41 and the protective adhesive layer 80 is flat, the connection is more stable and it is not easy to occur wrinkling and warping phenomena. By setting the overlapping between the first sub-film 41 and the protective adhesive layer 80, the first sub-film 41 can cover the fan-out traces between the bending area 220 and the flexible circuit board 20, achieving a better protection effect.

[0064] In an exemplary embodiment, in the second direction Y, the minimum overlapping dimension between the first sub-film 41 and the protective adhesive layer 80 may be a first width d1, and the first width d1 may be greater than or equal to 0.4 mm and less than or equal to 1.2 mm. For example, the first width d1 may be greater than or equal to 0.5 mm and less than or equal to 1 mm.

[0065] During the preparation process of the display module, the first sub-film 41 and the first adhesive layer 21 can be attached to the display substrate 10 together before bending. After bending, the second sub-film 42 can be directly attached. Alternatively, the first adhesive layer 21 can be attached before bending. After bending, the first sub-film 41 can be attached first, and then the second sub-film 42 can be attached. The attachment can be carried out according to the actual preparation situation, and the present disclosure does not limit this.

[0066] Figure 7 In an exemplary embodiment Figure 6 is an enlarged schematic view of the dashed-line area C in, showing the structure of the connection between the second sub-film 42 and the first sub-film 41. As Figure 7 shown, in the third direction Z, the first sub-film 41 may include a stacked first insulating film 411, a first conductive film 412, and a second insulating film 413, and the second sub-film 42 may include a stacked third insulating film 421, a second conductive film 422, and a fourth insulating film 423. Among these film layers, the material of the insulating film may be a tough polyester polymer, such as Mylar insulating tape, and the material of the conductive film may include copper foil and graphite, etc. The first insulating film 411 may include at least one first through-hole exposing the first conductive film 412, and the fourth insulating film 423 may include at least one second through-hole exposing the second conductive film 422. The first through-hole and the second through-hole may be correspondingly arranged so that the second conductive film 412 is connected to the first conductive film 422 of the second sub-film 42 to realize the grounding of the first sub-film 41 and the second sub-film 42.

[0067] Figure 8 In an exemplary embodiment Figure 6 is an enlarged schematic view of the dashed-line area B in, showing the structure of the connection between the second sub-film 42 and the heat dissipation layer 14. As Figure 8 shown, the fourth insulating film 423 may further include at least one third through-hole exposing the second conductive film 422, and the second conductive film 422 may be connected to the copper-exposed area of the heat dissipation layer 14 through the third through-hole to realize grounding, thereby improving the antistatic ability of the cover film 40.

[0068] In an exemplary embodiment, the fourth insulating film 423 may further include at least one fourth through-hole exposing the second conductive film 422, and the second sub-film 42 may be connected to the copper-exposed area of the flexible circuit board 20 through the fourth through-hole to improve the antistatic ability of the cover film 40.

[0069] Figure 9 In an exemplary embodiment Figure 5 A cross-sectional view along the EE direction, with the second sub-film 42 schematically omitted. As Figure 9 shown, the first sub-film 41 can be connected to the heat dissipation layers 14 located on both sides of the composite circuit region 230 along the first direction X. The second insulating film 413 can include at least one fifth through-hole exposing the first conductive film 412. The first conductive film 412 can be connected to the copper-exposed area of the heat dissipation layer 14 through the fifth through-hole to achieve grounding.

[0070] In an exemplary embodiment, when the first sub-film 41 is connected to the copper-exposed area of the heat dissipation layer 14, the second sub-film 42 can be grounded by connecting to the first sub-film 41. It can be set that the second sub-film 42 is not connected to the copper-exposed area of the heat dissipation layer 14 or the copper-exposed area of the flexible circuit board 20. Appropriate grounding methods can be set as needed, and the present disclosure does not limit this.

[0071] Figure 10 In another exemplary embodiment Figure 5 A cross-sectional view along the AA direction schematically shows the cross-sectional structure of the display module along the second direction Y near the bonding area 200. Figure 10 The difference from Figure 6 is that the first sub-film 41 and the first adhesive layer 21 are connected to each other, and the rest can be referred to the description of Figure 6 above, and will not be elaborated here.

[0072] As Figure 10 shown, the first insulating film 411 of the first sub-film 41 can overlap with the first adhesive layer 21 on the side of the first adhesive layer 21 away from the display substrate 10 to achieve the connection between the first sub-film 41 and the first adhesive layer 21. In the structure shown in Figure 10 the first sub-film 41 and the first adhesive layer 21 can be provided in one piece and pasted simultaneously, which can save a pasting process and improve production efficiency. Moreover, after connecting the first sub-film 41 and the first adhesive layer 21, it is equivalent to increasing the width of the first adhesive layer 21 in the second direction Y. This not only improves the connection strength between the first sub-film 41 and the first adhesive layer 21 and the display substrate 10, making the first adhesive layer 21 not easily pulled and deformed, but also improves the connection strength between the flexible circuit board 20 and the display substrate 10.

[0073] In an exemplary embodiment, as Figure 10 shown, compared with the flexible circuit board 20, the first adhesive layer 21 extends towards the bending area 220 in the second direction Y, that is, the first adhesive layer 21 extends outwards towards the bending area 220 compared with the flexible circuit board 20. The first insulating film 411 can cover the extended part of the first adhesive layer 21, so that there is no adhesive on the extended part of the first adhesive layer 21, thus avoiding sticking to foreign objects during the manufacturing process.

[0074] Figure 11 In yet another exemplary embodiment Figure 5 A cross-sectional view along the AA direction schematically shows the cross-sectional structure of the display module along the second direction Y near the bonding area 200. Figure 11 Differing from Figure 6 is that the flexible circuit board 20 further includes an extension portion 251, the second sub-membrane 42 is connected to the extension portion 251, and the second sub-membrane 42 is not connected to the first sub-membrane 41. For the remaining content, reference can be made to the foregoing description of Figure 6 which will not be elaborated herein.

[0075] As Figure 11 shown, the first sub-membrane 41 is located on the side of the flexible circuit board 20 close to the bending area 220 and is connected to the display substrate 10. The connection between the first sub-membrane 41 and the display substrate 10 is stable, which can provide good protection for the fan-out traces near the bending area 220 and prevent damage and display abnormalities caused by static electricity. The flexible circuit board 20 further includes an extension portion 251 extending toward the bending area 220 along the second direction Y. In the third direction Z, the extension portion 251 is spaced from the first sub-membrane 41, and the orthographic projection of the extension portion 251 on the display substrate 10 at least partially overlaps with the orthographic projection of the first sub-membrane 41 on the display substrate 10. For example, the orthographic projection of the extension portion 251 on the display substrate 10 may coincide with the orthographic projection of the first sub-membrane 41 on the display substrate 10. The surface of the extension portion 251 away from the display substrate 10 is a plane. The second sub-membrane 42 is connected to the extension portion 251 and the display substrate 10 surrounding the flexible circuit board 20 to fix the flexible circuit board 20 on the display substrate 10. By providing the extension portion 251 on the flexible circuit board 20 and the surface of the extension portion 251 away from the display substrate 10 being a plane, the step difference that the second sub-membrane 42 needs to cross for connection is smaller, the connection between the second sub-membrane 42 and the flexible circuit board 20 and the display substrate 10 is more stable, the attachment effect of the second sub-membrane 42 is better, and the protection effect of the second sub-membrane 42 on the flexible circuit board 20 is better.

[0076] In the exemplary embodiment, in the third direction Z, the flexible circuit board 20 may be a multi-layer board structure, such as a six-layer board, and the extension portion 251 may be a single-layer board or multi-layer board structure. The structure, thickness and other parameters of the extension portion 251 can be set as required.

[0077] In this embodiment, by using the first sub-membrane 41 to protect the fan-out traces near the bending area 220 and using the second sub-membrane 42 to protect the flexible circuit board 20, the attachment effects of the first sub-membrane 41 and the second sub-membrane 42 can be better, which helps to avoid display abnormalities caused by static electricity.

[0078] Figure 12A top view of the cover film, flexible circuit board, and integrated circuit in an exemplary embodiment, with the remaining structure of the display module omitted for illustration. As Figure 12 shown, the second sub-film 42 further includes at least one hollowed-out portion 421. The orthographic projection of at least one hollowed-out portion 421 on the display substrate 10 intersects with the contour edge of the device area 22. The second sub-film 42 within the hollowed-out portion 421 is removed, exposing the contour edge of the device area 22. Since the height of the device area 22 in the third direction Z is relatively high, by providing at least one hollowed-out portion 421 at the corner position of the device area 22, the internal stress of the second sub-film 42 can be released, which helps to avoid wrinkles in the second sub-film 42 and improve the adhesion effect.

[0079] In an exemplary embodiment, as Figure 12 shown, at least one hollowed-out portion 421 can be distributed at intervals along the contour edge of the device area 22. Parameters such as the number and size of the hollowed-out portions 421 can be set according to needs to facilitate obtaining a suitable stress release effect.

[0080] Figure 13 For an exemplary embodiment Figure 12 a cross-sectional view along the AA direction, showing the cross-sectional structure of the display module along the second direction Y near the bonding area 200. Figure 13 Differing from Figure 6 is that the second sub-film 42 further includes a hollowed-out portion 421 and a non-adhesive area 404 provided around the hollowed-out portion 421. The remaining content can be referred to the description of Figure 6 above and will not be elaborated here.

[0081] As Figure 13 shown, the hollowed-out portion 421 is provided corresponding to the corner position of the device area 22, which can reduce the internal stress of the second sub-film 42. The second sub-film 42 further includes a non-adhesive area 404 on the side facing the display substrate 10. The non-adhesive area 404 surrounds the hollowed-out portion 421, preventing the second sub-film 42 from sticking to the side of the flexible circuit board 20 perpendicular to the display substrate 10 in the direction. By providing the non-adhesive area 404 at the position where the second sub-film 42 needs to cross a large step, abnormal noises during pressing of the whole machine can be prevented, improving the user experience.

[0082] Figure 14 A cross-sectional view of the second sub-film in the non-adhesive area for an exemplary embodiment. In an exemplary embodiment, as Figure 14 shown, the second sub-film 42 further includes a non-adhesive film 424 in the non-adhesive area 404. The non-adhesive film 424 can be made of the same material as the insulating film. For example, Mylar insulating tape can be reversely attached to the fourth insulating film 423 to make the side of the non-adhesive film 424 away from the fourth insulating film 423 non-adhesive.

[0083] In an exemplary embodiment, Figures 5 to 14The solutions in [it] can be arbitrarily combined with each other.

[0084] The embodiments of the present disclosure also provide a display device, including the display module described in any of the above embodiments. The display device may be: an OLED display, a mobile phone, a tablet computer, a television set, a display, a laptop computer, a digital photo frame, a navigator, or any product or component with a display function, and the embodiments of the present disclosure are not limited thereto.

[0085] Although the embodiments of the present disclosure have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present disclosure.

Claims

1. A display module, characterized in that: include: A display substrate comprises a display area, a bending area and a composite circuit area sequentially located on one side of the display area, wherein the bending area is configured to bend the composite circuit area to a backlight side surface of the display substrate; A flexible circuit board, comprising a device area located at a side away from the display substrate, wherein a plurality of electronic devices are arranged in the device area; the flexible circuit board is bound and connected to the composite circuit area and is bent to the backlight side surface of the display substrate; within the plane of the display substrate, the position where the flexible circuit board is bound and connected to the display substrate is located at a side of the device area away from the bending area; The covering film includes a first sub-film and a second sub-film, wherein the first sub-film is located on a side of the flexible circuit board close to the bending area and is interconnected with the display substrate; the second sub-film is located on a side of the first sub-film and the flexible circuit board away from the display substrate, and is configured to fix the flexible circuit board on the display substrate.

2. The display module according to claim 1, characterized in that: It also includes a protective adhesive layer, the protective adhesive layer covers the bending area and at least partially overlaps with the composite circuit area; In a direction perpendicular to the display substrate, the first sub-membrane and the protective adhesive layer overlap each other, and in a direction from the display area to the bending area, a minimum overlap size of the first sub-membrane and the protective adhesive layer is greater than or equal to 0.4 mm and less than or equal to 1.2 mm.

3. The display module according to claim 1, characterized in that: It also includes a first adhesive layer, which is located on a side of the first sub-film away from the bending area, and the flexible circuit board is adhered to the display substrate through the first adhesive layer.

4. The display module according to claim 3, characterized in that: The first adhesive layer and the first sub-film are connected to each other.

5. The display module according to claim 1, characterized in that: The flexible circuit board includes an extension portion extending toward one side of the bending area, and the side of the extension portion away from the display substrate is a flat surface; the second sub-membrane is connected to the extension portion and the display substrate located around the flexible circuit board to fix the flexible circuit board on the display substrate.

6. The display module according to claim 5, characterized in that: In a direction perpendicular to the display substrate, the extension portion and the first sub-film are spaced apart from each other, and an orthographic projection of the extension portion on the display substrate at least partially overlaps with an orthographic projection of the first sub-film on the display substrate.

7. The display module according to claim 1, characterized in that: The second sub-film includes at least one hollow portion, the orthographic projection of the at least one hollow portion on the display substrate overlaps with the contour edge of the device area, and the hollow portion exposes the contour edge of the device area.

8. The display module according to claim 7, characterized in that: The second sub-film includes a non-glue area, and the non-glue area surrounds the at least one hollow portion; within the scope of the non-glue area, the second sub-film and the flexible circuit board are not adhered.

9. The display module according to any one of claims 1 to 8, characterized in that: In a direction perpendicular to the display substrate, the first sub-film includes a stacked first insulating film, a first conductive film, and a second insulating film, and the first insulating film is located on a side away from the display substrate; the second sub-film includes a stacked third insulating film, a second conductive film, and a fourth insulating film, and the fourth insulating film is located on a side away from the display substrate.

10. The display module according to claim 9, characterized in that: The first insulating film includes at least one first through hole exposing the first conductive film, and the fourth insulating film includes at least one second through hole exposing the second conductive film; in a direction perpendicular to the display substrate, the second conductive film and the first conductive film are interconnected through the first through hole and the second through hole.

11. The display module according to claim 9, characterized in that: A heat dissipation layer is disposed on the backlight side surface of the display substrate; the fourth insulating film further comprises at least one third through hole exposing the second conductive film, and the second conductive film is connected to the copper exposed area of ​​the heat dissipation layer through the third through hole.

12. The display module according to claim 9, characterized in that: Also includes a first adhesive layer, wherein the first adhesive layer and the first sub-film are connected to each other, including: The first adhesive layer includes an outwardly extending portion located on a side of the flexible circuit board close to the bending area, and the first insulating film covers the outwardly extending portion of the first adhesive layer.

13. A display device, characterized in that: Comprising a display module as described in any one of claims 1-12.

Images