Spring needle and manufacturing method thereof
By designing a structure that adjusts the insulating ring and plunger outer diameter in the spring pin, difficulties in matching impedance values of existing spring pins are solved, simplifying the assembly process and improving RF characteristics.
Patent Information
- Application Number
- CN202280101769.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-10
- Publication Date
- 2025-06-20
AI Technical Summary
Existing spring pins have difficulties in matching the appropriate impedance values, and increasing the outer diameter of the insulating ring can complicate the structure and assembly process.
A spring pin including a plunger, a barrel, a housing and an insulating ring is designed, the insulating ring is formed of a dielectric material, and its outer diameter may be the same as or smaller than the inner diameter of the outer shell, and its inner diameter may be the same as or larger than the outer diameter of the plunger portion. The insulating ring is arranged to surround the outer peripheral surface of the plunger portion, and a locking portion is formed by a caulking process to simplify assembly.
By adjusting the inner diameter of the insulating ring and the outer diameter of the plunger part, the impedance value can be adjusted to ensure that the outer diameter of the shell and the outer diameter of the insulating ring are constant, simplifying the design and assembly process and improving RF characteristics.
Smart Images

Figure CN120188050A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a pogo pin and a method for manufacturing the same, and more particularly, to a pogo pin and a method for manufacturing the same that are more convenient for matching a pre-designed impedance value. Background Art
[0002] A pogo pin means a device that is disposed between a semiconductor element and a test device and electrically connects the semiconductor element and the test device. In order to detect the electrical characteristics of a semiconductor element, it is necessary to smoothly achieve an electrical connection between the semiconductor element and the test device, and at this time, the pogo pin plays a main role.
[0003] The pogo pin includes: a plunger part that contacts the semiconductor element or the test device; a barrel into which a part of the plunger part is inserted; and a housing that houses the barrel inside. The inner circumferential surface of the housing and the outer circumferential surface of the barrel are spaced apart from each other to achieve insulation. At this time, the housing can be combined with the outer circumferential surface of the barrel in a spaced-apart state through an insulating ring.
[0004] The insulating ring is located between the inner circumferential surface of the housing and the outer circumferential surface of the plunger part. However, generally, the dielectric constant of the insulating ring is greater than the dielectric constant of air, and in order to maintain a specified impedance value, it is necessary to increase its outer diameter. Thus, without increasing the outer diameter of the housing or without reducing the outer diameter of the barrel, it is impossible to constantly maintain the impedance values in different sections. That is, there is difficulty in matching an appropriate impedance value.
[0005] Moreover, an increase in the outer diameter of the insulating ring can also change the outer diameter of the housing. This can complicate the manufacturing process and the assembly process of the structural elements of the pogo pin.
[0006] Korean Registered Patent Publication No. 10-2092674 discloses a detection probe assembly and a detection jack. Specifically, a detection probe assembly and a detection jack in which a probe support member is inserted between a pipe insertion part and a dilation part are disclosed.
[0007] However, for this type of detection probe assembly and detection jack, the outer diameters of the probe support member and the dilation part do not need to be constantly maintained, and in order to achieve matching of an appropriate impedance value, it is necessary to increase the outer diameter of the probe support member.
[0008] Patent Document 1: Korean Registered Patent Publication No. 10-2092674 (March 24, 2020) Summary of the Invention
[0009] Technical Problem
[0010] An object of the present invention is to provide a pogo pin and a method for manufacturing the same that are more convenient for matching a pre-designed impedance value.
[0011] Another object of the present invention is to provide a spring pin formed by extending an insulating ring with a specified diameter and a manufacturing method thereof.
[0012] Still another object of the present invention is to provide a spring pin and a manufacturing method thereof that can further simplify the assembly steps.
[0013] Solution to the problem
[0014] To achieve the above object, the spring pin according to an embodiment of the present invention includes: a plunger portion that contacts an external terminal; a barrel into which at least a part of the plunger portion is inserted; a housing that houses the barrel therein; and an insulating ring that is located between an outer circumferential surface of a part of the plunger portion exposed to the outside of the barrel and an inner circumferential surface of the housing and is formed of a dielectric material.
[0015] Moreover, an outer diameter of the insulating ring may be the same as or smaller than an inner diameter of the housing.
[0016] Moreover, an inner diameter of the insulating ring may be the same as or larger than an outer diameter of the part of the plunger portion.
[0017] Moreover, the plunger portion may include: a large-diameter portion that is housed inside the barrel; and a small-diameter portion that has a diameter smaller than that of the large-diameter portion and is exposed to the outside of the barrel.
[0018] Moreover, the insulating ring can be arranged so as to surround the outer circumferential surface of the small-diameter portion.
[0019] Moreover, in the housing, both ends can be bent radially inward to form a locking portion.
[0020] Moreover, the locking portion can be formed through a caulking process.
[0021] Moreover, in the locking portion, a part that contacts the insulating ring can be formed in a shape corresponding to the outer circumferential surface of the insulating ring.
[0022] Moreover, the insulating rings can be respectively provided at both ends of the housing.
[0023] Moreover, air can be filled between the two insulating rings provided at both ends of the housing.
[0024] Moreover, the present invention provides a manufacturing method of a spring pin, including: step (a) of combining an elastic member and a plunger portion in an inner space of a barrel; step (b) of penetratingly combining a part of the plunger portion exposed to the outside of the barrel with an insulating ring; and step (c) of inserting the barrel and the insulating ring into an inner space of a housing.
[0025] Further, after performing the step (c), step (d) may be performed, and caulking is performed on both ends of the housing.
[0026] Effects of the Invention
[0027] Among various effects of the present invention, the effects obtainable through the above solutions are as follows.
[0028] First, the spring pin includes: a plunger portion; a barrel into which a part of the plunger portion is inserted; a housing in which the barrel is received; and an insulating ring located between the plunger portion and the housing. At this time, the insulating ring is disposed so as to surround the outer circumferential surface of a part of the plunger portion exposed to the outside of the barrel. That is, the insulating ring is integrally formed through the driving section of the plunger portion.
[0029] Therefore, by adjusting the inner diameter of the insulating ring and the outer diameter of the part of the plunger portion, the impedance value can be adjusted. Thus, the housing can be extended with a predetermined outer diameter, and the impedance can also be maintained at a predetermined value throughout the entire section. To summarize, the matching of the pre-designed impedance value becomes easier. Further, the RF characteristics of the spring pin can be further improved.
[0030] In addition, locking portions bent radially inward are provided at both ends of the housing. At this time, the locking portions are formed through a caulking process.
[0031] Therefore, the insulating ring can be extended with a predetermined outer diameter. Thus, the impedance value of the insulating ring can be constantly maintained throughout the entire section, and when designing, the change in the impedance value caused by the change in the outer diameter can be omitted from the consideration. Finally, the manufacturing process of the spring pin can be further simplified.
[0032] In addition, as described above, the outer diameters of the housing and the insulating ring are constantly maintained and extended. That is, the shapes of the housing and the insulating ring can be further simplified.
[0033] Therefore, the manufacturing processes of the housing and the insulating ring can be further simplified. Further, the assembly processes of the plunger portion, the barrel, the housing, and the insulating ring can be further simplified. Description of the Drawings
[0034] Figure 1 A cross-sectional view of the spring pin showing an embodiment of the present invention.
[0035] Figure 2 To show Figure 1 An exploded cross-sectional view of the structural elements of the spring pin.
[0036] Figure 3 To showFigure 1 Cross-sectional views of the plunger portion of the spring pin before and after movement.
[0037] Figure 4 To show the setting in Figure 1 Enlarged cross-sectional view of the plunger portion and the insulating ring of the spring pin.
[0038] Figure 5 Sequential diagram showing the manufacturing method of the spring pin according to an embodiment of the present invention. Detailed Description of the Invention
[0039] Hereinafter, with reference to the accompanying drawings, the spring pin (pogo pin) 1 and its manufacturing method according to an embodiment of the present invention will be further described in detail.
[0040] In the following description, in order to clarify the features of the present invention, the description of some structural elements may be omitted.
[0041] In this specification, even in different embodiments, the same structural elements are given the same reference numerals, and the repeated description thereof is omitted.
[0042] The attached drawings are only for easily understanding the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings.
[0043] As long as there is no clear difference in meaning in the context, the singular expression includes the plural expression.
[0044] Hereinafter, with reference to Figures 1 to 2 , the spring pin 1 according to an embodiment of the present invention will be described.
[0045] The spring pin 1 is provided between the semiconductor element and the test device, and electrically connects the semiconductor element and the test device. For this purpose, the spring pin 1 is in contact with the semiconductor element and the test device, respectively.
[0046] The spring pin 1 extends in the direction towards the test device in the semiconductor element or in the direction towards the semiconductor element in the test device.
[0047] In the illustrated embodiment, the spring pin 1 includes a barrel 10, an elastic member 20, a plunger portion 30, a housing 40, and an insulating ring 50.
[0048] A part of the plunger portion 30 described later is inserted into the barrel 10, and the movement of the plunger portion 30 is guided.
[0049] The barrel 10 is formed in a column shape extending in one direction. In one embodiment, both ends of the barrel 10 can be bent radially inward. This is to prevent the elastic member 20 and the plunger portion 30 from being disengaged randomly.
[0050] Inside the barrel 10, a plunger receiving portion 11 is formed. After the elastic member 20 and a part of the plunger portion 30 described later are inserted into the plunger receiving portion 11.
[0051] An upper plunger hole 12 and a lower plunger hole 13 are respectively formed at the upper end and the lower end of the barrel 10. A detailed description thereof will be given later together with the description of the plunger portion 30.
[0052] The elastic member 20 is received in the plunger receiving portion 11 of the barrel 10.
[0053] When the plunger portion 30 described later moves, the elastic member 20 provides a restoring force.
[0054] The elastic member 20 is located at the central portion of the plunger receiving portion 11.
[0055] The elastic member 20 extends in the same direction as the extending direction of the barrel 10. And, the elastic member 20 applies a restoring force along the extending direction.
[0056] In the illustrated embodiment, the elastic member 20 is formed of a spring. However, the elastic member 20 is not limited to the illustrated form and can be formed into various shapes capable of providing a restoring force to the plunger portion 30.
[0057] The plunger portion 30 is in contact with both ends of the elastic member 20.
[0058] The plunger portion 30 is the part that directly contacts the semiconductor element or the test device in the spring needle 1.
[0059] The plunger portion 30 extends in the same direction as the extending direction of the barrel 10. And, a part of the plunger portion 30 is inserted into the plunger receiving portion 11 of the barrel 10, and the remaining part is exposed to the outside of the barrel 10. Thus, the plunger portion 30 can reciprocate along the extending direction of the barrel 10.
[0060] The plunger portion 30 is in contact with one end of the elastic member 20. Thus, when moving, the plunger portion 30 receives a restoring force from the elastic member 20. A detailed description thereof will be given later.
[0061] The plunger portion 30 is formed of a conductive material. In one embodiment, the plunger portion 30 is formed of a metal material.
[0062] A plurality of plunger portions 30 can be provided. In the illustrated embodiment, two plunger portions 30 are provided. Each plunger portion 30 is in through connection with the upper plunger hole 12 or the lower plunger hole 13.
[0063] In the illustrated embodiment, the plunger portion 30 includes a large-diameter portion 31 and a small-diameter portion 32.
[0064] The large-diameter portion 31 is the part where the plunger portion 30 directly contacts the elastic member 20.
[0065] The large-diameter portion 31 is inserted into the plunger receiving portion 11 of the barrel 10. Therefore, preferably, the outer diameter of the large-diameter portion 31 is the same as or smaller than the inner diameter of the barrel 10.
[0066] The large-diameter portion 31 can reciprocate within the plunger receiving portion 11 along the extending direction of the barrel 10. In the illustrated embodiment, the large-diameter portion 31 is blocked from detaching to the outside of the barrel 10 by the bent portions formed at both ends of the barrel 10.
[0067] The small-diameter portion 32 is a part of the plunger portion 30 that is exposed to the outside of the barrel 10. In the illustrated embodiment, the small-diameter portion 32 is in through connection with the upper plunger hole 12 or the lower plunger hole 13.
[0068] The small-diameter portion 32 extends from the end of the large-diameter portion 31 opposite to the elastic member 20 in a direction away from the elastic member 20.
[0069] The diameter of the small-diameter portion 32 is smaller than the diameter of the large-diameter portion 31. Preferably, the outer diameter of the small-diameter portion 32 is the same as or smaller than the inner diameter of the end portion of the barrel 10.
[0070] A contact tip portion 321 that contacts a semiconductor element or a test device is formed at one end of the small-diameter portion 32 opposite to the large-diameter portion 31.
[0071] The barrel 10 combined with the elastic member 20 and the plunger portion 30 is received in the internal space of the housing 40.
[0072] The housing 40 forms the appearance of the spring pin 1 and electrically insulates the plunger portion 30 from the surrounding environment outside the semiconductor element or the test device.
[0073] The housing 40 is located radially outside the barrel 10. Thus, it can be understood that the inner diameter of the housing 40 is larger than the outer diameter of the barrel 10.
[0074] Moreover, the inner peripheral surface of the housing 40 and the outer peripheral surface of the barrel 10 are spaced apart from each other. In one embodiment, air is filled between the inner peripheral surface of the housing 40 and the outer peripheral surface of the barrel 10.
[0075] The housing 40 is formed in the shape of a column extending in one direction. At this time, the housing 40 extends in the same direction as the extending direction of the barrel 10.
[0076] The length in the longitudinal direction of the housing 40 is greater than the length of the barrel 10. And the upper end of the housing 40 is located more on the upper side than the upper end of the barrel 10, and the lower end is located more on the lower side than the lower end of the barrel 10. That is, the barrel 10 is inserted into the inside of the housing 40 and is masked.
[0077] Inside the housing 40, a bucket receiving portion 41 is formed. The bucket 10, the elastic member 20, and the plunger portion 30 are inserted into the bucket receiving portion 41.
[0078] An upper opening 42 and a lower opening 43 are respectively formed at the upper end and the lower end of the housing 40.
[0079] An upper locking portion 421 and a lower locking portion 431 are respectively formed at the boundaries of the upper opening 42 and the lower opening 43.
[0080] The upper locking portion 421 and the lower locking portion 431 are bent radially inward from the upper end or the lower end of the housing 40. In one embodiment, the upper locking portion 421 and the lower locking portion 431 are formed through a caulking process.
[0081] An insulating ring 50 is formed between the housing 40 and the plunger portion 30.
[0082] The insulating ring 50 fixes the plunger portion 30 so that it is located at the central portion of the housing 40.
[0083] The insulating ring 50 is located between the outer peripheral surface of the small-diameter portion 32 of the plunger portion 30 and the inner peripheral surface of the housing 40. And, the insulating ring 50 is arranged so as to surround the outer peripheral surface of the small-diameter portion 32. That is, the insulating ring 50 is through-bonded to the driving section of the plunger portion 30. A detailed description thereof will be given later.
[0084] The insulating ring 50 is located above or below the bucket 10. Therefore, the inner diameter of the insulating ring 50 is not affected by the outer diameter of the bucket 10.
[0085] The insulating ring 50 is formed in a cylindrical shape with a hollow portion 51 formed at the central portion. The extending direction of the insulating ring 50 is parallel to the extending directions of the plunger portion 30 and the housing 40.
[0086] The outer diameter of the insulating ring 50 is the same as or smaller than the inner diameter of the housing 40. And, the inner diameter of the insulating ring 50 is the same as or larger than the outer diameter of the small-diameter portion 32 of the plunger portion 30.
[0087] In one embodiment, the outer peripheral surface of the insulating ring 50 may be in contact with a part of the upper locking portion 421 and the lower locking portion 431 formed through the caulking process, and may be formed in a shape corresponding to the upper locking portion 421 and the lower locking portion 431.
[0088] Therefore, the insulating ring 50 can be extended with a specified outer diameter. Thus, the impedance value of the insulating ring 50 can be constantly maintained throughout the entire section, and when designing, the change in the impedance value caused by the change in the outer diameter can be omitted from the consideration object. Finally, the manufacturing steps of the spring pin 1 can be further simplified.
[0089] In another embodiment, the insulating ring 50 can be inserted into the interior of the housing 40 through a press-fitting process. In this embodiment, the locking portions 421 and 431 may not be formed at both ends of the housing 40.
[0090] A plurality of insulating rings 50 may be provided. In the illustrated embodiment, a total of two insulating rings 50 are provided at the upper and lower ends of the housing 40. In one embodiment, air may be filled between the two insulating rings 50 provided at both ends of the housing 40.
[0091] The insulating ring 50 is formed of an electrically insulating material. In one embodiment, the insulating ring 50 is formed of a polyetheretherketone (PEEK) material. In another embodiment, the insulating ring 50 is formed of a dielectric material having a dielectric constant higher than that of air.
[0092] Hereinafter, with reference to Figure 3 , the movement process of the plunger portion 30 will be described.
[0093] The spring pin 1 is disposed between the semiconductor element and the test device, and its length can be adjusted corresponding to the distance between the semiconductor element and the test device. The length adjustment process can be achieved by the movement of the plunger portion 30.
[0094] In the illustrated embodiment, two plunger portions 30 are disposed opposite to each other with the elastic member 20 interposed therebetween. Contact tip portions 321 that come into contact with the semiconductor element or the test device are formed at one end of each plunger portion 30 opposite to the elastic member 20.
[0095] Figure 3 Part (a) of
[0096] Figure 3 shows the spring pin 1 in a state where the elastic member 20 is at its maximum length before the plunger portion 30 moves.
[0097] When the plunger portion 30 moves toward the elastic member 20, the elastic member 20 is compressed and a restoring force is applied to the plunger portion 30. Thus, the plunger portion 30 can be in close contact with the semiconductor element or the test device.
[0098] During this process, it can be confirmed that the small-diameter portion 32 of the plunger portion 30 is exposed to the upper or lower side of the barrel 10. That is, the driving range of the plunger portion 30 is formed in the upper or lower space of the barrel 10.
[0099] Hereinafter, with reference to Figure 4 , the relationship among the insulating ring 50, the plunger portion 30, and the housing 40 will be described.
[0100] Hereinafter, the diameter of the small-diameter portion 32 of the plunger portion 30 is defined as the first diameter D1, and the outer diameter of the insulating ring 50 is defined as the second diameter D2.
[0101] The first diameter D1 is the same as the inner diameter of the insulating ring 50, but preferably, it should be smaller than the inner diameter of the insulating ring 50. Also, preferably, the second diameter D2 is the same as or smaller than the inner diameter of the housing 40.
[0102] The insulating ring 50 is integrally joined through the driving section of the plunger portion 30. Specifically, the insulating ring 50 is inserted between the outer peripheral surface of the small-diameter portion 32 of the plunger portion 30 and the inner peripheral surface of the housing 40.
[0103] Therefore, by adjusting the first diameter D1 and the second diameter D2, the impedance value can be adjusted. Thus, the housing 40 can be extended with a specified outer diameter, and the impedance can also be maintained at a specified value throughout the entire section. Summarized as follows, the matching of the pre-designed impedance value becomes easier. Further, the RF characteristics of the spring pin 1 can be further improved.
[0104] On the contrary, when the insulating ring 50 is integrally joined through the non-driving section of the plunger portion 30, that is, the outer peripheral surface of the barrel 10, the impedance value in different sections cannot be constantly maintained without increasing the outer diameter of the housing 40 or reducing the outer diameter of the barrel 10.
[0105] Also, the respective outer diameters of the housing 40 and the insulating ring 50 are constantly maintained and extended. That is, the shapes of the housing 40 and the insulating ring 50 can be further simplified.
[0106] Therefore, the manufacturing processes of the housing 40 and the insulating ring 50 can be further simplified. Further, the assembly steps of the plunger portion 30, the barrel 10, the housing 40, and the insulating ring 50 can be further simplified.
[0107] Hereinafter, with reference to Figure 5 , the manufacturing method of the spring pin 1 according to an embodiment of the present invention will be described.
[0108] The manufacturing method of the spring pin 1 according to an embodiment of the present invention includes: a step S100 of joining the elastic member 20 and the plunger portion 30 in the internal space of the barrel 10; a step S200 of integrally joining a part of the plunger portion 30 exposed to the outside of the barrel 10 with the insulating ring 50; a step S300 of inserting the barrel 10 and the insulating ring 50 into the internal space of the housing 40; and a step S400 of caulking both ends of the housing 40.
[0109] First, the step S100 of joining the elastic member 20 and the plunger portion 30 in the internal space of the barrel 10 will be described.
[0110] The barrel 10 is formed in a cylindrical shape extending with a prescribed diameter, and a plunger accommodating portion 11 is formed inside. An elastic member 20 is accommodated in the central portion of the plunger accommodating portion 11. Further, large-diameter portions 31 of a plunger portion 30 are inserted into both ends of the plunger accommodating portion 11.
[0111] At this time, the large-diameter portions 31 are in contact with the elastic member 20. Further, a small-diameter portion 32 of the plunger portion 30 is exposed to the outside of the barrel 10.
[0112] If the elastic member 20 and the plunger portion 30 are combined inside the barrel 10, then a step S200 of through-combining a part of the plunger portion 30 exposed to the outside of the barrel 10 with an insulating ring 50 and a step S300 of inserting the barrel 10 and the insulating ring 50 into the internal space of a housing 40 are performed.
[0113] First, the step S200 of through-combining a part of the plunger portion 30 exposed to the outside of the barrel 10 with the insulating ring 50 will be described.
[0114] An insulating ring 50 is formed in a cylindrical shape having a hollow portion 51 formed inside. Then, the small-diameter portion 32 of the plunger portion 30 exposed to the outside of the barrel 10 is through-combined with the hollow portion 51 of the insulating ring 50. At this time, preferably, the outer diameter of the small-diameter portion 32 is the same as or smaller than the inner diameter of the hollow portion 51.
[0115] Next, the step S300 of inserting the barrel 10 and the insulating ring 50 into the internal space of the housing 40 will be described.
[0116] If the plunger portion 30 and the insulating ring 50 are combined, then the barrel 10 and a structure body including a polyetheretherketone ring are inserted into the internal space of the housing 40. At this time, the outer peripheral surface of the barrel 10 and the inner peripheral surface of the housing 40 are spaced apart from each other, and the barrel 10 is accommodated inside the housing 40 and is shielded.
[0117] Further, the outer diameter of the insulating ring 50 is the same as or smaller than the inner diameter of the housing 40.
[0118] However, the order of the step S200 of through-combining a part of the plunger portion 30 exposed to the outside of the barrel 10 with the insulating ring 50 and the step S300 of inserting the barrel 10 and the insulating ring 50 into the internal space of the housing 40 may be changed, and one of the two steps may be performed after the other step.
[0119] Finally, a step S400 of caulking both end portions of the housing 40 is performed.
[0120] After inserting the insulating rings 50 into the upper and lower ends of the barrel receiving portion 41 within the housing 40, there is a specified height difference between the ends of the housing 40 and the ends of the insulating rings 50. Subsequently, as the two ends of the housing 40 are caulked, the two ends are bent radially inward, and the locking portions 421 and 431 are formed.
[0121] Thus, the upper or lower end of the insulating ring 50 can be supported by the locking portions 421 and 431 of the housing 40, preventing it from being randomly detached from the outside of the housing 40.
[0122] As described above, although the preferred embodiments of the present invention have been described, the present invention is not limited to the structures of the above-described embodiments.
[0123] Moreover, those of ordinary skill in the technical field to which the present invention pertains can make various modifications and alterations to the present invention without departing from the spirit and scope of the present invention as recited in the claims.
[0124] Furthermore, all or a part of each embodiment can be selectively combined to form the embodiments, so as to enable various deformations.
[0125] Description of Reference Numerals
[0126] 1: Pogo pin
[0127] 10: Barrel
[0128] 11: Plunger Receiving Portion
[0129] 12: Upper Plunger Hole
[0130] 13: Lower Plunger Hole
[0131] 20: Elastic Member
[0132] 30: Plunger Portion
[0133] 31: Large Diameter Portion
[0134] 32: Small Diameter Portion
[0135] 321: Contact Tip Portion
[0136] 40: Housing
[0137] 41: Barrel Receiving Portion
[0138] 42: Upper Opening
[0139] 421: Upper Locking Portion
[0140] 43: Lower Opening
[0141] 431: Lower Locking Portion
[0142] 50: Insulating ring
[0143] 51: Hollow part
Claims
1. A spring pin, characterized in that, Comprising: A plunger part, which is in contact with an external terminal; A barrel, at least a part of the plunger part being inserted into the interior of the barrel; A housing, the barrel being received in the interior of the housing; And An insulating ring, which is located between the outer peripheral surface of a part of the plunger part that is exposed to the outside of the barrel and the inner peripheral surface of the housing and is formed of a dielectric material.
2. The spring pin according to claim 1, characterized in that, The outer diameter of the insulating ring is the same as or smaller than the inner diameter of the housing.
3. The spring pin according to claim 2, characterized in that, The inner diameter of the insulating ring is the same as or larger than the outer diameter of the said part of the plunger part.
4. The spring pin according to claim 1, characterized in that, The plunger part comprises: A large-diameter part, which is received in the interior of the barrel; and A small-diameter part, the diameter of which is smaller than that of the large-diameter part and which is exposed to the outside of the barrel.
5. The spring pin according to claim 4, characterized in that, The insulating ring is arranged so as to surround the outer peripheral surface of the small-diameter part.
6. The spring pin according to claim 1, characterized in that, In the housing, both ends are bent radially inwards to form a locking part.
7. The spring pin according to claim 6, characterized in that, The locking part is formed by a caulking process.
8. The spring pin according to claim 6, characterized in that, In the locking part, a part that is in contact with the insulating ring is formed into a shape corresponding to the outer peripheral surface of the insulating ring.
9. The spring pin according to claim 1, characterized in that, The insulating rings are respectively provided at both ends of the housing.
10. The spring pin according to claim 9, characterized in that, Air is filled between the two insulating rings provided at both ends of the housing.
11. A manufacturing method of a spring pin, characterized in that, Comprising: Step (a), combining an elastic member and a plunger part in the internal space of the barrel; Step (b), making a through-combination of a part of the plunger part that is exposed to the outside of the barrel and an insulating ring; And Step (c), inserting the barrel and the insulating ring into the internal space of the housing.
12. The manufacturing method of the spring pin according to claim 11, characterized in that, After the step (c), step (d) is carried out, and both ends of the housing are caulked.
Citation Information
Patent Citations
A test probe assembly and test socket
KR102092674B1