A dual-beam path cutting method based on a refractive-reflective laser beam collection system

Abstract

The application provides a double optical path cutting method based on a refraction-reflection laser beam collecting system, and relates to the technical field of laser cutting. S1: introducing a laser beam in an optical fiber into a starting point of an internal optical path of a laser; S2: guiding into an optical element assembly through an optical path mirror; S3: performing optical path correction on the laser beam by the optical element assembly; S4: performing total reflection collection on the refracted light beam and the reflected light beam by a total reflection mirror and a half-enclosed controllable angle total reflection mirror; S5: adjusting the incident laser beam by the laser beam of the main optical path, so that the focal point acts on the workpiece surface; S6: adjusting the refraction-reflection laser beam by a focusing lens of the auxiliary optical path, so that the focal point acts on the workpiece surface; The application sets the half-enclosed controllable angle total reflection mirror and the total reflection mirror, reduces the absorption of the laser energy by the internal elements of the laser, collects the collected laser, pre-processes the workpiece surface, reduces the reflection of the workpiece surface, and increases the utilization rate of the laser energy.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and in particular to a dual-path cutting method based on a refractive-reflective laser beam collecting system. Background Technology

[0002] Laser cutting is a high-precision machining technology that uses a high-power-density laser beam to irradiate the surface of a material, causing it to rapidly melt, vaporize, or reach its ignition point. The molten slag is then blown away by a high-pressure assist gas, achieving material separation. Its core principle is that a high-energy laser beam generated by a laser is focused by an optical system to form a high-power-density spot. When this spot irradiates the workpiece surface, it rapidly heats the material to its melting or vaporization point, and a high-speed gas flow carries away the molten or vaporized material, achieving high-precision cutting.

[0003] In the metal processing industry, laser cutting can precisely cut metal materials such as carbon steel, stainless steel, aluminum alloys, and copper alloys, and is applied in sheet metal processing, mechanical parts manufacturing, and precision instrument manufacturing to achieve high-precision manufacturing of complex parts and improve production efficiency. In the automotive manufacturing sector, laser cutting technology is widely used in the processing of body structural parts, chassis, exhaust pipes, engine components, etc. Its high precision and flexible processing capabilities make automobile production more efficient and can meet personalized manufacturing needs. In the aerospace field, laser cutting is widely used for the precision processing of high-strength, difficult-to-machine materials such as titanium alloys, aluminum alloys, stainless steel, and composite materials, such as aircraft structural parts, engine blades, and satellite components, to ensure lightweight, high strength, and high reliability of parts. In the electronics industry, laser cutting can be used in the manufacturing of precision circuit boards, semiconductor packaging, and microelectronic devices, ensuring high precision and high efficiency to meet the miniaturization and high performance requirements of electronic devices. In the medical device manufacturing field, laser cutting is used in the manufacturing of medical devices such as scalpels, implants, and stents, ensuring high precision, burr-free, and pollution-free production, improving the quality and safety of medical devices. In the architectural decoration industry, laser cutting is used for customized processing of metal curtain walls, engraved patterns, and stainless steel decorative components, making architectural designs more exquisite and complex while maintaining high processing precision and stability. Furthermore, laser cutting also has wide applications in industries such as energy equipment manufacturing, rail transportation, shipbuilding, and home appliance manufacturing.

[0004] However, in existing technologies, lasers are prone to severe heat generation during continuous processing. This heat generation primarily originates from energy conversion losses, the thermal effect of the gain medium, absorption heat from optical components, and power losses in electronic devices. The heat generation problem is largely due to laser absorption caused by refraction and reflection of the laser light by optical components within the laser optical path. Currently, the total internal reflection mirror within a laser can achieve a reflectivity of 99.5%, while the transmittance of the lens is only between 80% and 95%. Due to the physical characteristics of the lens, it is currently difficult to improve its performance. This indicates that a significant amount of laser energy is absorbed by the internal components of the laser during reflection and refraction, causing the laser temperature to rise, especially in high-power lasers. This not only wastes laser energy but also significantly impacts the lifespan of the laser.

[0005] Therefore, it is essential to invent a dual-path cutting method based on a refractive-reflective laser beam collection system. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a dual-path cutting method based on a refraction-reflection laser beam collection system. By setting up a semi-enclosed controllable angle total reflection mirror and a total reflection mirror, the laser beam reflected and refracted by each lens is collected through the total reflection mirror, thereby improving energy utilization, reducing the absorption of laser energy by internal components of the laser, reducing heat generation, and simultaneously converging the collected laser beam and guiding it to the secondary optical path to pre-treat the workpiece surface, reducing surface reflection and increasing the energy concentration rate of the main optical path spot, thus solving the problems mentioned in the background section.

[0007] A dual-path cutting system based on a refraction-reflection laser beam collection system includes a lens, a laser beam, an optical fiber, an optical path mirror, an optical element assembly, a main optical path, a main optical path focusing lens, and a workpiece. The lens is positioned on the optical path of the laser beam emitted from the optical fiber; the optical path mirror is positioned on the side of the lens facing away from the optical fiber; the workpiece is positioned on the optical path mirror; the main optical path focusing lens is installed between the workpiece and the optical path mirror; the optical element assembly is installed between the optical path mirror and the main optical path focusing lens; the main optical path is the optical path through which the laser beam passes through the lens, the optical path mirror, the optical element assembly, and the main optical path focusing lens.

[0008] A dual-path cutting system based on a refraction-reflection laser beam collecting system further includes a secondary optical path, a total reflection mirror, a semi-enclosed controllable angle total reflection mirror, an angle control mechanism, a controller, and a secondary optical path focusing lens. The semi-enclosed controllable angle total reflection mirror is installed on both sides of the primary optical path focusing lens. The controller is connected to the semi-enclosed controllable angle total reflection mirror through the angle control mechanism. The beam emitted from the semi-enclosed controllable angle total reflection mirror is reflected by the total reflection mirror onto the secondary optical path focusing lens. The secondary optical path is the optical path through which the collected beam is processed by the total reflection mirror and the secondary optical path focusing lens.

[0009] Furthermore, the optical component assembly includes a reflector, a focusing lens, a half-wave plate, a polarizing beam splitter, a timer shutter, a spatial light modulator, and a convex lens. The reflector, focusing lens, half-wave plate, polarizing beam splitter, timer shutter, spatial light modulator, and convex lens correct the optical path of the laser beam. The semi-enclosed controllable angle total reflection mirror and the total reflection mirror are both composed of multiple total reflection mirrors, and each total reflection mirror is connected to an angle control mechanism.

[0010] Furthermore, both the semi-enclosed controllable angle total reflection mirror and the total reflection mirror are equipped with patch sensors; the patch sensors are connected to the controller.

[0011] A dual-optical-path cutting method based on a refractive-reflective laser beam collecting system, using the aforementioned dual-optical-path cutting system based on a refractive-reflective laser beam collecting system, includes the following steps:

[0012] S1: Through the coordinated action of multiple components such as the take-up reel, fiber optic cassette, take-up orientation reel, and balancer, the laser beam inside the fiber is introduced into the starting point of the optical path inside the laser.

[0013] S2: The laser beam is flattened into a parallel beam by the lens, and then guided into the optical component assembly through the optical path reflector;

[0014] S3: Optical components correct the optical path of the laser beam;

[0015] S4: The laser beam passes through the focusing lens through the central opening of the semi-enclosed controllable angle total reflection mirror. At the same time, the refracted beam and the reflected beam will pass through the refracted-reflected beam collection optical path composed of multiple total reflection mirrors and semi-enclosed controllable angle total reflection mirrors, and the refracted beam and the reflected beam will be collected by total internal reflection.

[0016] S5: Adjust the incident laser beam in the main optical path so that its focal point acts on the workpiece surface;

[0017] S6: The secondary optical path focusing lens adjusts the refracted-reflected laser beam so that its focus acts on the workpiece surface and ensures that its focus is in front of the focus of the main optical path laser beam.

[0018] Furthermore, in step S4, when the laser beam passes through the focusing lens, the laser beam undergoes refraction and reflection, weakening the laser beam energy; in step S4, the semi-enclosed controllable angle total reflection mirror and the patch sensor of the total reflection mirror detect the incident beam and output the parameter of its incident angle.

[0019] Furthermore, in step S4, based on the detection data from the patch sensor, the controller controls the angle control structure to rotate the position of the semi-enclosed controllable angle total reflection mirror and the total reflection mirror, so that the refracted-reflected beam is focused onto the secondary optical path focusing lens; in step S6, the workpiece is pre-processed using the secondary optical path focus, and the focus energy of the secondary optical path can reach 10%-15% of the focus energy of the main optical path.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. This invention, by setting a semi-enclosed controllable angle total reflection mirror and a total reflection mirror, collects the laser light reflected and refracted by each lens through the total reflection mirror, thereby improving energy utilization, reducing the absorption of laser energy by internal components of the laser, reducing heat generation, and simultaneously converging the collected laser light and guiding it to the secondary optical path to pre-treat the workpiece surface, reducing workpiece surface reflection and increasing the energy concentration rate of the main optical path spot.

[0022] 2. In this invention, by setting up a controller and a secondary optical path focusing lens, the controller controls the angle control mechanism based on the detection data of the patch sensor, rotating the position of the semi-enclosed controllable angle total reflection mirror and the total reflection mirror, so that the refracted-reflected beam is focused on the secondary optical path focusing lens. Then, through the action of the secondary optical path focusing lens, the focal point of the refracted-reflected laser beam acts on the workpiece. According to the existing lens refraction and reflection performance, the energy of the secondary optical path focal point can reach about 10%-15% of the energy of the main optical path focal point. At this time, the workpiece is pre-treated by the secondary optical path focal point, causing local melting and surface modification of the workpiece surface, increasing its surface roughness, reducing the laser beam reflection phenomenon during the processing of the main optical path, and further improving the absorption of laser beam energy in the processing area, thereby improving the material removal rate. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention.

[0024] Figure 2 This is a flowchart of the present invention.

[0025] In the picture:

[0026] 111. Secondary optical path; 112. Total reflection mirror; 113. Semi-enclosed controllable angle total reflection mirror; 114. Angle control mechanism; 115. Controller; 116. Lens; 117. Laser beam; 118. Optical fiber; 119. Optical path reflector; 1110. Optical component assembly; 1111. Main optical path; 1112. Main optical path focusing lens; 1113. Secondary optical path focusing lens; 1114. Workpiece. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings:

[0028] Example:

[0029] As attached Figure 1 To be continued Figure 2 As shown

[0030] This invention provides a dual-optical-path cutting system based on a refraction-reflection laser beam collection system, comprising a lens 116, a laser beam 117, an optical fiber 118, an optical path reflector 119, an optical element assembly 1110, a main optical path 1111, a main optical path focusing lens 1112, and a workpiece 1114. The lens 116 is disposed on the optical path of the laser beam 117 emitted from the optical fiber 118; the optical path reflector 119 is disposed on the side of the lens 116 facing away from the optical fiber 118; the workpiece 1114 is disposed on the optical path of the optical path reflector 119; the main optical path focusing lens 1112 is installed between the workpiece 1114 and the optical path reflector 119; the optical element assembly 1110 is installed between the optical path reflector 119 and the main optical path focusing lens 1112; the main optical path 1111 is the optical path through which the laser beam 117 is processed by the lens 116, the optical path reflector 119, the optical element assembly 1110, and the main optical path focusing lens 1112.

[0031] In this embodiment, the dual-optical-path cutting system based on the refraction-reflection laser beam collection system further includes a secondary optical path 111, a total reflection mirror 112, a semi-enclosed controllable angle total reflection mirror 113, an angle control mechanism 114, a controller 115, and a secondary optical path focusing lens 1113. The semi-enclosed controllable angle total reflection mirror 113 is installed on both sides of the main optical path focusing lens 1112. The controller 115 is connected to the semi-enclosed controllable angle total reflection mirror 113 through the angle control mechanism 114. The light beam emitted from the semi-enclosed controllable angle total reflection mirror 113 is reflected by the total reflection mirror 112 onto the secondary optical path focusing lens 1113. The secondary optical path 111 is the optical path through which the collected light beam is processed by the total reflection mirror 112 and the secondary optical path focusing lens 1113.

[0032] In this embodiment, the optical component assembly 1110 includes a reflector, a focusing lens, a half-wave plate, a polarizing beam splitter, a timer shutter, a spatial light modulator, and a convex lens. The reflector, focusing lens, half-wave plate, polarizing beam splitter, timer shutter, spatial light modulator, and convex lens correct the optical path of the laser beam 117. The semi-enclosed controllable angle total internal reflection mirror 113 and the total internal reflection mirror 112 are both composed of multiple total internal reflection mirrors, and each total internal reflection mirror is connected to the angle control mechanism 114. The semi-enclosed controllable angle total internal reflection mirror 113... Both the total reflection mirror 113 and the total reflection mirror 112 are equipped with patch sensors; the patch sensors are connected to the controller 115; by setting up semi-enclosed controllable angle total reflection mirrors 113 and 112, the laser reflected and refracted by each lens is collected by the total reflection mirror, which improves energy utilization, reduces the absorption of laser energy by internal components of the laser, reduces heat generation, and at the same time, the collected laser is focused and guided to the secondary optical path 111 to pre-treat the surface of the workpiece 1114, reduce the reflection of the workpiece surface, and increase the energy concentration rate of the main optical path spot.

[0033] A dual-optical-path cutting method based on a refractive-reflective laser beam collecting system, using the aforementioned dual-optical-path cutting system based on a refractive-reflective laser beam collecting system, includes the following steps:

[0034] S1: Through the coordinated action of multiple components such as the take-up reel, fiber optic cassette, take-up orientation reel, and balancer, the laser beam 117 inside the fiber 118 is introduced into the starting point of the optical path inside the laser.

[0035] S2: The laser beam 117 is flattened into a parallel beam by the lens 116, and then guided into the optical element assembly 1110 through the optical path reflector 119;

[0036] S3: Optical component assembly 1110 corrects the optical path of laser beam 117;

[0037] S4: The laser beam 117 passes through the focusing lens 1112 through the middle opening of the semi-enclosed controllable angle total reflection mirror 113. At the same time, the refracted beam and the reflected beam will pass through the refracted-reflected beam collecting optical path composed of multiple total reflection mirrors 112 and semi-enclosed controllable angle total reflection mirrors 113, and the refracted beam and the reflected beam will be collected by total reflection.

[0038] S5: The laser beam of the main optical path 1111 is adjusted to focus the incident laser beam on the surface of the workpiece 1114.

[0039] S6: The secondary optical path focusing lens 1113 adjusts the refracted-reflected laser beam so that its focus acts on the surface of the workpiece 1114, and ensures that its focus is in front of the focus of the main optical path laser beam.

[0040] In this embodiment, in step S4, when the laser beam 117 passes through the focusing lens 1112, the laser beam 117 undergoes refraction and reflection, weakening the laser beam energy; in step S4, the patch sensors of the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112 detect the incident beam and output the parameter of its incident angle; in step S4, according to the detection data of the patch sensor, the controller 115 controls the angle control structure 114 to rotate the position of the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112, so that the refracted-reflected beam is focused on the secondary optical path focusing lens 1113; in step S6, the workpiece 1114 is pre-processed using the focus of the secondary optical path 111, and the focus energy of the secondary optical path 111 can reach 10%-15% of the focus energy of the main optical path 1111; by setting the controller 115 and the secondary optical path focusing lens... Mirror 1113, based on the detection data of the patch sensor, controller 115 controls the angle control mechanism 114 to rotate the position of the semi-enclosed controllable angle total reflection mirror 113 and total reflection mirror 112, so that the refracted-reflected beam is focused on the secondary optical path focusing lens 1113. Then, through the action of the secondary optical path focusing lens 1113, the focal point of the refracted-reflected laser beam is applied to the workpiece 1114. According to the existing lens refraction and reflection performance, the focal energy of the secondary optical path 111 can reach about 10%-15% of the focal energy of the main optical path 1111. At this time, the focal point of the secondary optical path 111 is used to pre-treat the workpiece 1114, so that the surface of the workpiece 1114 produces local melting and surface modification, increases its surface roughness, reduces the laser beam reflection phenomenon during the processing of the main optical path 1111, and further improves the absorption of laser beam energy in the processing area, thereby improving the material removal rate.

[0041] Working principle

[0042] In this invention, through the coordinated action of multiple components including a take-up reel, fiber optic cassette, take-up orientation reel, and balancer, the laser beam 117 within the fiber optic cable 118 is introduced to the starting point of the optical path inside the laser. The laser beam 117 is flattened into a parallel beam by the lens 116, and then guided into the optical element assembly 1110 through the optical path reflector 119. The optical element assembly 1110 corrects the optical path of the laser beam 117. The laser beam 117 passes through the central opening of the semi-enclosed controllable angle total reflection mirror 113 and is focused. Lens 1112 allows both refracted and reflected beams to pass through a refracted-reflected beam collecting optical path composed of multiple total reflection mirrors 112 and a semi-enclosed controllable angle total reflection mirror 113, thus collecting the refracted and reflected beams through total internal reflection. The laser beam in the main optical path 1111 adjusts the incident laser beam so that its focus acts on the surface of the workpiece 1114. The focusing lens 1113 in the secondary optical path adjusts the refracted-reflected laser beam so that its focus acts on the surface of the workpiece 1114, and ensures that its focus is in front of the focus of the laser beam in the main optical path.

[0043] The total internal reflection mirror collects the laser light reflected and refracted by each lens, improving energy utilization, reducing the absorption of laser energy by internal laser components, and reducing heat generation. Simultaneously, the collected laser light is focused and guided to the secondary optical path 111 to pre-treat the surface of the workpiece 1114, reducing surface reflection and increasing the energy concentration rate of the main optical path spot. Based on the detection data from the patch sensor, the controller 115 controls the angle control mechanism 114 to rotate the positions of the semi-enclosed controllable angle total internal reflection mirror 113 and the total internal reflection mirror 112, causing the refracted-reflected beam to focus onto the secondary optical path focusing lens 1113. Through the function of the secondary optical path focusing lens 1113, the focal point of the refracted-reflected laser beam is focused onto the workpiece 1114. Based on the existing lens refraction and reflection performance, the focal energy of the secondary optical path 111 can reach about 10%-15% of the focal energy of the main optical path 1111. At this time, the workpiece 1114 is pre-treated by the focal point of the secondary optical path 111, causing local melting and surface modification on the surface of the workpiece 1114, increasing its surface roughness, reducing the reflection of the laser beam during the processing of the main optical path 1111, and further improving the absorption of laser beam energy in the processing area, thereby improving the material removal rate.

[0044] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solutions described in this invention, or by designing similar technical solutions by those skilled in the art under the inspiration of the technical solutions described in this invention, falls within the protection scope of this invention.

Claims

1. A dual-optical-path cutting system based on a refractive-reflective laser beam collecting system, characterized in that: The optical path assembly includes a lens (116), a laser beam (117), an optical fiber (118), an optical path reflector (119), an optical element assembly (1110), a main optical path (1111), a main optical path focusing lens (1112), and a workpiece (1114). The lens (116) is disposed on the optical path of the laser beam (117) emitted by the optical fiber (118); the optical path reflector (119) is disposed on the side of the lens (116) away from the optical fiber (118); and the workpiece (1114) is disposed on the optical path. The optical path of the reflector (119); the main optical path focusing lens (1112) is installed between the workpiece (1114) and the optical path reflector (119); the optical element assembly (1110) is installed between the optical path reflector (119) and the main optical path focusing lens (1112); the main optical path (1111) is the optical path through which the laser beam (117) is processed by the lens (116), the optical path reflector (119), the optical element assembly (1110) and the main optical path focusing lens (1112); It also includes a secondary optical path (111), a total reflection mirror (112), a semi-enclosed controllable angle total reflection mirror (113), an angle control mechanism (114), a controller (115), and a secondary optical path focusing lens (1113). The semi-enclosed controllable angle total reflection mirror (113) is installed on both sides of the main optical path focusing lens (1112). The controller (115) is connected to the semi-enclosed controllable angle total reflection mirror (113) through the angle control mechanism (114). The light beam emitted by the semi-enclosed controllable angle total reflection mirror (113) is reflected by the total reflection mirror (112) onto the secondary optical path focusing lens (1113). The secondary optical path (111) is the optical path through which the collected light beam is processed by the total reflection mirror (112) and the secondary optical path focusing lens (1113).

2. The dual-path cutting system based on a refractive-reflective laser beam collecting system as described in claim 1, characterized in that: The optical component assembly (1110) includes a reflector, a focusing lens, a half-wave plate, a polarizing beam splitter, a timer shutter, a spatial light modulator, and a convex lens, which correct the optical path of the laser beam (117).

3. The dual-path cutting system based on a refractive-reflective laser beam collecting system as described in claim 2, characterized in that: The semi-enclosed controllable angle total reflection mirror (113) and total reflection mirror (112) are both composed of multiple total reflection mirrors, and each total reflection mirror is connected to the angle control mechanism (114).

4. The dual-path cutting system based on a refractive-reflective laser beam collecting system as described in claim 3, characterized in that: Both the semi-enclosed controllable angle total reflection mirror (113) and the total reflection mirror (112) are equipped with patch sensors.

5. The dual-path cutting system based on a refractive-reflective laser beam collecting system as described in claim 3, characterized in that: The patch sensor is connected to the controller (115).

6. A dual-optical-path cutting method based on a refractive-reflective laser beam collecting system, using the dual-optical-path cutting system based on a refractive-reflective laser beam collecting system as described in claim 5, characterized in that: Includes the following steps: S1: Through the coordinated action of multiple components such as the take-up reel, fiber optic cassette, take-up orientation reel, and balancer, the laser beam (117) inside the fiber (118) is introduced into the starting point of the optical path inside the laser. S2: The laser beam (117) is flattened into a parallel beam by the lens (116), and then guided into the optical element assembly (1110) through the optical path reflector (119); S3: The optical component assembly (1110) corrects the optical path of the laser beam (117); S4: The laser beam (117) passes through the focusing lens (1112) through the middle opening of the semi-enclosed controllable angle total reflection mirror (113). At the same time, the refracted beam and the reflected beam will pass through the refracted-reflected beam collection optical path composed of multiple total reflection mirrors (112) and the semi-enclosed controllable angle total reflection mirror (113) to collect the refracted beam and the reflected beam through total reflection. S5: The laser beam of the main optical path (1111) adjusts the incident laser beam so that its focus acts on the surface of the workpiece (1114); S6: The secondary optical path focusing lens (1113) adjusts the refracted-reflected laser beam so that its focus acts on the surface of the workpiece (1114) and ensures that its focus is in front of the focus of the main optical path laser beam.

7. The dual-path cutting method based on a refraction-reflection laser beam collecting system as described in claim 6, characterized in that: In step S4, when the laser beam (117) passes through the focusing lens (1112), the laser beam (117) undergoes refraction and reflection, which weakens the laser beam energy.

8. The dual-path cutting method based on a refractive-reflective laser beam collecting system as described in claim 6, characterized in that: In step S4, the patch sensors of the semi-enclosed controllable angle total reflection mirror (113) and total reflection mirror (112) detect the incident light beam and output the parameters of its incident angle.

9. The dual-path cutting method based on a refractive-reflective laser beam collecting system as described in claim 6, characterized in that: In step S4, based on the detection data from the patch sensor, the controller (115) controls the angle control structure (114) to rotate the position of the semi-enclosed controllable angle total reflection mirror (113) and the total reflection mirror (112) so that the refracted-reflected beam is focused onto the secondary optical path focusing lens (1113).

10. The dual-optical-path cutting method based on a refraction-reflection laser beam collecting system as described in claim 6, characterized in that: In step S6, the workpiece (1114) is pre-processed using the focal point of the secondary optical path (111), and the focal energy of the secondary optical path (111) can reach 10%-15% of the focal energy of the main optical path (1111).

Images