Laser induction and vision matching repairing method, device, equipment and medium

Abstract

The invention relates to the technical field of laser drilling, in particular to a laser induction and vision matching repairing method, device and equipment and a medium, and the method comprises the steps that according to preset hole position coordinates, a laser is controlled to conduct laser drilling on a sample in the current machining process; performing visual inspection on the punched sample to judge whether a blind hole exists or not; if the blind holes exist in the surface of the sample, secondary laser drilling is conducted on the blind holes in sequence; and completing laser repairing until all the blind holes are repaired into through holes. According to the method, the finished product through hole rate and the machining precision in the laser machining process can be remarkably improved.

Description

Technical Field

[0001] The present application relates to the field of laser drilling technology, and in particular to a laser-induced matching visual repair method, device, equipment and medium. Background Art

[0002] In modern industrial manufacturing, laser drilling technology is widely used due to its high precision and high efficiency. However, the existing technology has significant deficiencies in dealing with the problem of blind holes formed during the laser drilling process. Due to reasons such as material properties, improper laser parameter settings, or equipment aging, some holes often fail to completely penetrate the material, forming blind holes. These blind holes not only affect the functionality of the product, but may also cause quality problems in subsequent processes. The existing technology usually identifies blind holes through manual visual inspection or simple automated inspection equipment, but these methods cannot provide high-precision depth measurement and are prone to missing subtle blind holes. More importantly, even if blind holes are found, the existing technology often does not have an effective secondary drilling repair process, which makes it difficult to guarantee the through-hole rate. The low through-hole rate not only affects the performance and quality of the product during use, but also increases the rework rate and production costs, and prolongs the production cycle.

[0003] Therefore, the technical problem of blind holes being easily formed during laser drilling, resulting in low through-hole rate, needs to be solved urgently. Summary of the invention

[0004] The main purpose of this application is to provide a laser-induced visual repair method, device, equipment and medium, aiming to solve the technical problem that blind holes are easily formed during laser drilling, resulting in a low through-hole rate.

[0005] In order to achieve the above-mentioned invention object, the present application proposes a laser-induced collocation visual repair method, the method comprising: controlling a laser to perform laser drilling on a sample in the current processing process according to preset hole position coordinates;

[0006] Perform visual inspection on the punched samples to determine whether there are blind holes;

[0007] If there are blind holes on the surface of the sample, the blind holes are subjected to secondary laser drilling in sequence;

[0008] The laser repairing is completed until all the blind holes are repaired into through holes.

[0009] Furthermore, the step of controlling the laser to perform laser drilling on the sample currently being processed according to the preset hole position coordinates includes:

[0010] Acquire the position of the sample in a specified area based on a sensor camera;

[0011] Generating a drilling path plan including hole coordinate information based on the position of the sample;

[0012] Based on the preset initial parameters, start the laser to perform laser drilling on the surface of the sample in sequence according to the hole position coordinate information based on the drilling path planning.

[0013] Further, the step of visually inspecting the drilled sample to determine whether there are blind holes includes:

[0014] Obtain an image of the surface of the sample taken using backlight illumination;

[0015] Apply a filtering algorithm to remove noise from the image and enhance the contrast;

[0016] Use an edge detection algorithm to extract the edge contour of the enhanced image and determine the hole positions;

[0017] Set a brightness threshold to binarize the image and perform light transmittance analysis on the holes;

[0018] Based on the analysis results, determine whether there are blind holes.

[0019] Further, the step of sequentially performing secondary laser drilling on the blind holes if there are blind holes on the surface of the sample includes:

[0020] If there are blind holes on the surface of the sample, plan a secondary laser path based on the coordinate positions of the blind holes;

[0021] The control system drives the XY platform to move the laser head to the coordinate position of the first blind hole in the secondary laser path;

[0022] Start the laser to perform secondary drilling operations on the current blind hole based on the preset laser parameters;

[0023] Sequentially move to the next blind hole position in the secondary laser path and repeat the secondary drilling operation.

[0024] Further, before the step of starting the laser to perform secondary drilling operations on the current blind hole based on the preset laser parameters, it includes:

[0025] Identify the remaining thickness of the blind hole;

[0026] Calculate the corresponding laser pulse energy according to the remaining thickness to obtain the preset laser parameters.

[0027] Further, before the step of starting the laser to perform secondary drilling operations on the current blind hole based on the preset laser parameters, it also includes:

[0028] Identify the remaining thickness of the blind hole;

[0029] Calculate the corresponding spot focus position according to the remaining thickness;

[0030] Based on the position of the light spot focus, move the z-axis to compensate for the defocus amount caused by the current depth of the blind hole.

[0031] Further, the step of completing the laser repair until all the blind holes are repaired into through holes includes:

[0032] Perform a secondary repair operation on all the identified blind holes and monitor the through-hole rate in real time;

[0033] Judge whether the through-hole rate reaches a preset threshold;

[0034] If the through-hole rate reaches the preset threshold, it is determined that all the blind holes are repaired into through holes and the laser repair is completed.

[0035] The second aspect of the present application further provides a laser-induced combined with vision repair device, including:

[0036] An initial drilling module, configured to control a laser to perform laser drilling on a sample in the current processing according to preset hole position coordinates;

[0037] A detection module, configured to perform vision detection on the drilled sample to judge whether there are blind holes;

[0038] A secondary drilling module, configured to perform secondary laser drilling on the blind holes in sequence if there are blind holes on the surface of the sample;

[0039] A repair completion module, configured to complete the laser repair until all the blind holes are repaired into through holes. The third aspect of the present application further includes a computer device, including a memory and a processor, where the memory stores a computer program, and the processor implements the steps of the method described in any one of the above when executing the computer program.

[0040] The fourth aspect of the present application further includes a computer-readable storage medium, on which a computer program is stored, and the computer program implements the steps of the method described in any one of the above when executed by a processor.

[0041] Beneficial effects

[0042] The present application first precisely controls the laser to perform drilling operations by presetting hole position coordinates, ensuring high precision and consistency of the initial drilling. Using the vision system to detect the drilled sample can quickly and accurately identify whether there are blind holes, avoiding the inefficiency and errors of traditional manual inspection. For the identified blind holes, this method can perform efficient secondary laser drilling repair to ensure that each blind hole can be completely penetrated, thus greatly improving the through-hole rate. Description of the drawings

[0043] Figure 1Schematic flowchart of a laser-induced visual repair method according to an embodiment of the present application;

[0044] Figure 2 Schematic block diagram of the structure of a laser-induced visual repair system according to an embodiment of the present application;

[0045] Figure 3 Schematic block diagram of the structure of a computer device according to an embodiment of the present application.

[0046] The realization, functional features, and advantages of the purpose of the present application will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0047] In order to make the purpose, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0048] Those skilled in the art of the present technology can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the above", and "the" used herein may also include the plural forms. It should be further understood that the term "including" used in the specification of the present invention means the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components, and / or their groups. It should be understood that when an element is "connected" or "coupled" to another element, it can be directly connected or coupled to other elements, or there may also be intermediate elements. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The phrase "and / or" used herein includes all or any one of the listed items and all combinations of related items.

[0049] Those skilled in the art of the present technology can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as the general understanding of those of ordinary skill in the field to which the present invention belongs. It should also be understood that terms such as those defined in a general dictionary should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted with an idealized or overly formal meaning unless specifically defined as here.

[0050] Referring to Figure 1 , an embodiment of the present invention provides a laser-induced visual repair method, including steps S1-S4, specifically:

[0051] S1. According to the preset hole position coordinates, control the laser to punch holes in the sample during the current processing;

[0052] S2. Visually inspect the punched sample to determine if there are blind holes;

[0053] S3. If there are blind holes on the surface of the sample, perform secondary laser punching on the blind holes in sequence;

[0054] S4. Until all the blind holes are repaired into through holes, the laser repair is completed.

[0055] As described in step S1 above, first ensure that the high-precision laser and motion control system (such as an XY platform or robotic arm) are correctly installed and calibrated to ensure that the laser focus position is accurate and the motion control system can accurately move to the specified coordinates. Then, import the machining file containing the hole position coordinates (such as G-code) from CAD or other design software. These coordinates are preset by the design engineer and verified to meet the product specification requirements. Based on the imported design file, the system automatically generates a punching path plan to determine the specific position and order of each hole, and optimizes the punching order to reduce unnecessary movement time and improve efficiency. Then, fix the sample to be machined on the workbench, and confirm the actual position of the sample through a sensing camera or mechanical probe to ensure that it is consistent with the coordinate system in the design file. The control system drives the XY platform or robotic arm to move the laser head to the first hole position coordinate. After reaching the target position, start the laser and perform the punching operation according to the preset parameters (such as power, frequency, pulse width, etc.). Move to the next hole position coordinate in sequence and repeat the above punching operation until all the predetermined hole positions are punched. During the punching process, monitor the working status of the laser in real time, including key parameters such as power output and focus position, to ensure the punching quality; if any abnormal situation (such as power fluctuation, focus shift, etc.) is detected, the system will automatically adjust, and if necessary, pause the operation and recalibrate the equipment.

[0056] The function of this step is to achieve high-precision punching, ensure that the position of each hole is accurate and meets the design requirements; automatically generate a punching path plan and optimize the punching order to reduce unnecessary movement time and improve production efficiency; record the punching parameters and results of each hole for subsequent analysis and traceability, and enhance the ability of quality control and process improvement; the automated control system reduces manual intervention, reduces the possibility of human errors, and improves the reliability and stability of production; the system can handle complex hole layouts and machining requirements of different materials, adapt to a variety of application scenarios, and can efficiently complete both simple and complex punching tasks. Through these measures, the laser-induced combined with visual repair method proposed in this application achieves high-precision, high-efficiency, and high-consistency processing effects in the initial punching stage, laying a solid foundation for subsequent blind hole detection and repair. This method not only improves product quality but also significantly enhances production efficiency and controllability.

[0057] As described in step S2 above, during implementation, based on the high-resolution vision detection system, an image of the sample that has completed laser drilling is acquired within the current detection area. At this time, on the other side of the sample far from the vision detection system, preferably, there should be uniform illumination. At this time, an image of the sample surface is taken using backlight illumination to enhance the contrast between the holes and the background, ensuring that the light-transmitting areas (through holes) and light-blocking areas (blind holes) are clearly visible. After obtaining the corresponding image, a filtering algorithm (such as Gaussian filtering, median filtering, etc.) is applied to the image to remove noise, and the image quality is enhanced through histogram equalization or adaptive contrast adjustment. Next, the system uses an edge detection algorithm (such as the Canny operator) to extract the edge contours of the holes, determining the position and shape of each hole. Based on the edge contour information, a brightness threshold is set to binarize the image, distinguishing between the light-transmitting area and the light-blocking area. Through the connected component analysis method, the system identifies and marks each independent hole area and calculates its geometric features (such as area, perimeter, roundness, etc.). According to the binarization result, the system calculates the light transmittance of each hole, and then determines which holes are blind holes (i.e., holes with a light transmittance lower than the set threshold). Finally, the system marks the positions of these blind holes in the image and generates a detailed detection report, recording information such as the position, light transmittance, and whether it is a blind hole of each hole.

[0058] The function of this step is to accurately identify all the holes on the sample surface through the high-resolution vision detection system and accurately determine whether there are blind holes. By using backlight illumination and image processing technology, the accuracy and reliability of hole detection can be significantly improved, avoiding the inefficiency and errors of traditional manual inspection. Through the light transmittance analysis of each hole, the system can effectively distinguish through holes and blind holes, ensuring the pertinence and effectiveness of subsequent repair operations. In addition, this step realizes highly automated operation, reduces manual intervention, improves the detection efficiency and consistency. By recording the results of each detection and generating a detailed processing report, it is convenient for subsequent analysis and traceability, further enhancing the controllability and traceability of production. Ultimately, this method not only improves product quality but also significantly enhances production efficiency and reliability, laying a solid foundation for subsequent secondary drilling and repair.

[0059] As described in step S3 above, first, based on the position coordinates of all blind holes, the system uses a path planning algorithm (such as the TSP traveling salesman problem algorithm) to calculate an optimal path, enabling the laser head to access each blind hole position in the shortest path and the least time, thereby maximizing the drilling efficiency. Then, based on the optimal path, the control system drives the XY platform or robotic arm to accurately move the laser head to the first blind hole position, and starts the laser to perform the secondary drilling operation according to the adjusted parameters. Move to the next blind hole position in sequence and repeat the above drilling operation until all blind holes are processed. During the drilling process, the working state of the laser is monitored in real time, including key parameters such as power output and focus position, to ensure the drilling quality; if any abnormal conditions (such as power fluctuations, focus shifts, etc.) are detected, the system will automatically adjust, and if necessary, pause the operation and recalibrate the equipment. After completing the secondary drilling, the system performs visual inspection again to confirm whether the blind hole has been completely penetrated. This step realizes efficient and precise batch secondary drilling through the collaborative optimization of path planning and dynamic control. The path planning algorithm (such as TSP) reduces the idle travel time of the laser head by calculating the shortest movement path, increasing the processing efficiency by 20%-30%, especially suitable for high-density blind hole arrays. By continuously feeding back parameters such as laser power and focus position through sensors, the focus shift caused by the thermal lens effect or mechanical vibration can be automatically corrected (accuracy ±1μm), preventing overburning or residue caused by energy fluctuations. By verifying the integrity of the through holes, a penetration rate of 100% and no cracks on the hole wall are ensured (if an unpenetrated hole is detected, it can be marked for rework). This step forms a closed loop from efficiency optimization, process control to result verification, taking into account both production capacity and yield, and is suitable for the high-precision micro-hole processing requirements in fields such as semiconductors and aerospace.

[0060] In addition, the originally set energy parameters are for penetrating thicker materials. When the hole thickness becomes thinner, excessive energy will cause over-etching in local areas. At the same time, the high energy density may cause the surface of the hole wall to become rough, affecting the smoothness and flatness of the hole wall.

[0061] In a preferred embodiment, during the secondary laser drilling process, in order to further improve the drilling effect, the laser parameters (such as power, frequency, and spot size) are dynamically adjusted according to the specific depth of each blind hole to ensure that sufficient energy can penetrate the bottom of the blind hole without causing problems such as over-etching, material deformation, expansion of the heat-affected zone, deterioration of the hole wall quality, reduction of processing efficiency, and instability of product quality due to excessive energy.

[0062] For example, the system measures the remaining thickness at the bottom of the blind hole by the change in the focusing position of the reflected light of the laser wavelength (such as 650 nm red light), with a resolution of up to ±0.1 μm. Or, through UV-LED backlight illumination, the transmitted light intensity is collected by a high-dynamic range (HDR) camera, and a light intensity-thickness relationship model is established (the extinction coefficient of the glass material needs to be pre-calibrated) to determine the remaining thickness; the control system selects different laser parameter combinations according to the different remaining thicknesses. For example, when the remaining thickness > 50% of the target depth: use the peak power (such as 80% of the rated power) to quickly penetrate. When the remaining thickness is 10 - 50%: the power decreases linearly (such as 80% → 40%) to avoid overburning at the bottom. When the remaining thickness < 10%: switch to the low-power mode (such as 20%), and cooperate with short pulses (< 10 ns) to reduce the thermal effect. Adjust the power output according to the real-time thickness feedback error to dynamically compensate for the energy fluctuation. For high-thickness areas: low frequency and high energy (such as 10 kHz) to increase the single-pulse removal amount. For the critical penetration stage: high frequency and low energy (such as 200 kHz) to improve the smoothness of the hole wall (Ra < 0.5 μm).

[0063] In another preferred embodiment, the laser focus position is dynamically adjusted according to the remaining thickness to ensure that the light spot is always accurately focused at the bottom of the blind hole. The depth of focus (the range of clear focus) of the laser beam determines the focus adjustment logic: the focus position (Z-axis) can be dynamically adjusted according to the remaining thickness to compensate for the conical effect caused by the laser beam divergence angle and achieve a straight hole effect. For example: according to the divergence angle of the laser beam (such as θ = 5°) and the remaining thickness (h), the compensation amount that needs to be moved along the Z-axis is dynamically calculated. When the laser penetrates the material, the divergence angle will cause the hole wall to tilt, and the amount of focus downward movement (Δz) needs to satisfy: Δz = h × tan(θ / 2). For example, when the remaining thickness is 100 μm, the focus needs to be moved downward by about 4.4 μm (θ = 5°) to keep the beam always focused at the bottom of the hole and offset the conical effect caused by the divergence. The Z-axis position of the laser head or the workpiece is moved in real time through a high-precision piezoelectric ceramic actuator or a linear motor, and the focus is adjusted according to the calculation result.

[0064] In one embodiment, the step of controlling the laser to drill holes in the sample during the current processing according to the preset hole position coordinates includes:

[0065] S10. Obtain the position of the sample in the specified area based on the sensing camera;

[0066] S11. Generate a drilling path plan containing hole position coordinate information based on the position of the sample;

[0067] S12. According to the preset initial parameters, start the laser to drill holes on the surface of the sample in sequence according to the hole position coordinate information based on the drilling path plan.

[0068] In this embodiment, first, the system obtains the position of the sample within the specified area based on the sensing camera. The surface image of the sample is captured by a high-resolution sensing camera, and image processing algorithms (such as edge detection and feature matching) are applied to accurately identify the actual position and orientation of the sample. This step ensures the accuracy of subsequent operations and avoids drilling errors caused by sample position deviations. Next, the system generates a drilling path plan containing hole position coordinate information based on the actual position of the sample. The path planning algorithm will automatically generate an optimal drilling path according to the imported design file (such as CAD file or G code) in combination with the actual position data of the sample. This path not only considers the specific coordinates of each hole position but also optimizes the movement sequence of the laser head to reduce unnecessary travel time and improve overall efficiency. In addition, the path planning also takes into account the geometric shape and boundary limitations of the sample to ensure that the laser head does not collide with the sample during movement. Then, the system starts the laser based on the preset initial parameters and sequentially performs laser drilling on the surface of the sample according to the generated drilling path plan. The initial parameters usually include key settings such as laser power, frequency, and pulse width, which are preset according to material characteristics and process requirements. The laser moves to each hole position coordinate in sequence according to the path plan and starts the laser beam at the corresponding position to complete the drilling operation. Throughout the process, the system monitors the working state of the laser in real time to ensure that the quality standard of each hole position can be achieved. This highly automated process not only improves production efficiency but also significantly enhances drilling accuracy and consistency, reduces errors caused by manual intervention, and lays a solid foundation for subsequent inspection and repair steps, ensuring the precise positioning and high-quality drilling effect of each hole position, thereby improving overall production efficiency and product quality.

[0069] In one embodiment, the step of visually inspecting the drilled sample to determine whether there are blind holes includes:

[0070] S20. Obtain the surface image of the sample taken using backlight illumination;

[0071] S21. Apply a filtering algorithm to remove noise from the image and enhance the contrast;

[0072] S22. Use an edge detection algorithm to extract the edge contour of the enhanced image and determine the hole positions;

[0073] S23. Set a brightness threshold to binarize the image and analyze the light transmittance of the holes;

[0074] S24. Based on the analysis results, determine whether there are blind holes.

[0075] In this embodiment, an image of the sample surface taken using backlight illumination is obtained. Backlight illumination can enhance the contrast between the holes and the background, making the light-transmitting regions (through-holes) and the light-impermeable regions (blind holes) clearly visible. This step provides high-quality basic data for subsequent image processing.

[0076] Next, the system applies a filtering algorithm to remove noise from the image and enhance the contrast. Methods such as Gaussian filtering or median filtering are used to remove the noise in the image to ensure the image quality. Then, histogram equalization or adaptive contrast adjustment techniques are used to further enhance the contrast of the image, making the edges of the holes clearer and facilitating subsequent processing.

[0077] Subsequently, the system uses an edge detection algorithm to extract the edge contours of the enhanced image and determine the positions of the holes. Common edge detection algorithms such as the Canny operator can effectively identify the edge contours of the holes and mark them. This contour information not only helps the system accurately locate the position of each hole but also provides basic data for subsequent light transmittance analysis.

[0078] Then, the system sets a brightness threshold to binarize the image and performs light transmittance analysis on the holes. By binarizing the image, the system can distinguish between the light-transmitting regions and the light-impermeable regions. Based on the brightness information of these regions, the system calculates the light transmittance of each hole. Regions with low light transmittance are determined to be blind holes, while regions with high light transmittance are determined to be through-holes.

[0079] Finally, based on the results of the light transmittance analysis, the system determines whether there are blind holes. If a hole with a light transmittance lower than the preset threshold is detected, it is identified as a blind hole, and its specific position is recorded. Throughout the process, the system monitors the detection results in real time to ensure that each hole can be accurately identified and classified. This highly automated visual detection method not only improves the detection accuracy and efficiency but also reduces the errors caused by manual intervention, laying a solid foundation for the subsequent secondary drilling and repair steps.

[0080] In one embodiment, the step of sequentially performing secondary laser drilling on the blind holes if there are blind holes on the surface of the sample includes:

[0081] S30. If there are blind holes on the surface of the sample, plan a secondary laser path based on the coordinate positions of the blind holes;

[0082] S31. Control the system to drive the XY platform to move the laser head to the coordinate position of the first blind hole in the secondary laser path;

[0083] S32. Start the laser to perform secondary drilling operations on the current blind hole based on the preset laser parameters;

[0084] S33. Move sequentially to the next blind hole position in the secondary laser path and repeat the secondary drilling operation.

[0085] In this embodiment, based on the detected blind hole coordinate positions, the secondary laser path is planned to ensure that the laser head can access each blind hole in the most optimized order and path, thereby improving efficiency and reducing unnecessary movement time. Then, the control system drives the XY platform to accurately move the laser head to the coordinate position of the first blind hole in the secondary laser path to ensure that the laser beam is accurately aligned with the target hole position.

[0086] After starting the laser, the system performs a secondary drilling operation on the current blind hole according to the preset laser parameters. After completing the drilling operation of one blind hole, the system sequentially moves to the next blind hole position and repeats the above secondary drilling operation until all blind holes are processed. During the whole process, the system monitors the working state of the laser in real time to ensure that each blind hole can meet the expected quality standard.

[0087] In one embodiment, before the step of starting the laser to perform a secondary drilling operation on the current blind hole based on the preset laser parameters, it includes:

[0088] S40. Identify the remaining thickness of the blind hole;

[0089] S41. Calculate the corresponding laser pulse energy according to the remaining thickness to obtain the preset laser parameters.

[0090] In this embodiment, first, the remaining thickness of each blind hole is accurately identified through a high-resolution vision detection system or a 3D sensor, that is, the distance from the bottom of the blind hole to the other side of the sample. This data is crucial for determining the required laser energy because the remaining thickness directly affects the penetration depth of the laser beam in the material and the energy requirement. The identified remaining thickness data is fed back to the control system for subsequent parameter adjustment. Next, the system calculates the corresponding laser pulse energy according to the remaining thickness of the blind hole. This process involves a complex energy model, which is usually optimized based on experimental data and material properties. For example, for blind holes with a larger remaining thickness, the system calculates a higher laser pulse energy relative to blind holes with a smaller remaining thickness to ensure sufficient energy to penetrate deeper material layers; while for blind holes with a smaller remaining thickness, the system calculates a lower laser pulse energy relative to blind holes with a larger remaining thickness to avoid over-etching or energy waste, and the energy calculation is adjusted based on the initial energy parameters. According to the calculated energy requirement, the system further determines specific laser parameters such as power, frequency, and focal depth. Through this dynamic adjustment mechanism, the system can accurately set the laser parameters according to the specific situation of each blind hole to ensure high-quality secondary drilling results.

[0091] In one embodiment, before the step of the starting laser performing a secondary drilling operation on the current blind hole based on preset laser parameters, the following steps are further included:

[0092] S50. Identify the remaining thickness of the blind hole;

[0093] S51. Calculate the corresponding spot focus position according to the remaining thickness;

[0094] S52. Based on the spot focus position, move the z-axis to compensate for the defocus amount caused by the current depth of the blind hole.

[0095] In this embodiment, by dynamically compensating the defocus amount, it is ensured that the laser energy acts precisely on the bottom of the blind hole, avoiding problems such as energy dispersion or residue caused by changes in the hole depth. Measure the remaining thickness of the blind hole to accurately quantify the amount of material to be penetrated currently (with an accuracy of ±1μm). Based on the remaining thickness and the laser beam divergence angle (such as θ = 5°), calculate the compensation amount that the Z-axis needs to move, so that the spot is always focused on the bottom of the hole (for example, when the thickness is 100μm, compensate the Z-axis by 4.4μm). Drive a high-precision Z-axis platform (such as a piezoelectric ceramic or a linear motor) to adjust the focus position, eliminate the attenuation of the spot energy density caused by the increase in the hole depth, compress the hole wall taper angle from the conventional 5° - 10° to <1°, and reduce the surface roughness (Ra) to below 0.3μm.

[0096] In one embodiment, the step of until all the blind holes are repaired into through holes and the laser repair is completed includes:

[0097] S60. Perform a secondary repair operation on all the identified blind holes and monitor the through-hole rate in real time;

[0098] S61. Determine whether the through-hole rate reaches a preset threshold;

[0099] S62. If the through-hole rate reaches the preset threshold, it is determined that all the blind holes are repaired into through holes and the laser repair is completed.

[0100] In this embodiment, based on the dynamically adjusted parameters, perform secondary laser drilling on all the blind holes, and at the same time, through optical detection, statistically count the proportion of the through holes in real time to identify the unpenetrated or defective hole positions. Set the acceptance standard for the through-hole rate (such as ≥99.9%), and the system automatically compares the real-time data. If the standard is met, it is determined that the batch is qualified; otherwise, a rework mechanism is triggered. For example, semiconductor packaging requires a through-hole rate of 100% to avoid signal transmission interruption. After reaching the standard, the processing is automatically terminated to avoid overprocessing (such as damage to the hole wall caused by repeated hitting of the through holes), and at the same time, a quality report (such as hole position coordinates, hole diameter error) is generated.

[0101] Referring to Figure 2 , in one embodiment, the present application also proposes a laser-induced and vision repair device, including:

[0102] The primary drilling module 100 is used to control a laser to perform laser drilling on a sample during the current processing according to preset hole position coordinates;

[0103] The detection module 200 is used to perform visual inspection on the drilled sample to determine whether there are blind holes;

[0104] The secondary drilling module 300 is used to, if there are blind holes on the surface of the sample, sequentially perform secondary laser drilling on the blind holes;

[0105] The repair completion module 400 is used to complete laser repair until all the blind holes are repaired into through holes.

[0106] In one embodiment, the primary drilling module 100 includes: a primary path planning unit, which is used to:

[0107] Obtain the position of the sample within a specified area based on a sensing camera;

[0108] Generate a drilling path plan containing hole position coordinate information based on the position of the sample;

[0109] Start the laser based on the preset initial parameters to sequentially perform laser drilling on the surface of the sample according to the hole position coordinate information in the drilling path plan.

[0110] In one embodiment, the detection module 200 includes: a blind hole detection unit, which is used to:

[0111] Obtain an image of the surface of the sample taken using backlight illumination;

[0112] Apply a filtering algorithm to remove noise from the image and enhance the contrast;

[0113] Use an edge detection algorithm to extract the edge contour of the enhanced image to determine the hole positions;

[0114] Set a brightness threshold to binarize the image and perform light transmittance analysis on the holes;

[0115] Based on the analysis results, determine whether there are blind holes.

[0116] In one embodiment, the secondary drilling module 300 includes: a secondary positioning execution unit, which is used to:

[0117] If there are blind holes on the surface of the sample, plan a secondary laser path based on the coordinate positions of the blind holes;

[0118] The control system drives the XY platform to move the laser head to the coordinate position of the first blind hole in the secondary laser path;

[0119] The laser is activated to perform a secondary drilling operation on the current blind hole based on preset laser parameters;

[0120] Move sequentially to the next blind hole position in the secondary laser path and repeat the secondary drilling operation.

[0121] In one embodiment, the secondary drilling module 300 further includes: an energy adjustment unit for:

[0122] Identify the remaining thickness of the blind hole;

[0123] Calculate the corresponding laser pulse energy according to the remaining thickness to obtain the preset laser parameters.

[0124] In one embodiment, the secondary drilling module 300 further includes: a focus compensation unit for:

[0125] Identify the remaining thickness of the blind hole;

[0126] Calculate the corresponding spot focus position according to the remaining thickness;

[0127] Based on the spot focus position, move the z-axis to compensate for the defocus amount caused by the depth of the current blind hole.

[0128] In one embodiment, the repair completion module 400 includes: a through-hole acceptance unit for:

[0129] Perform secondary repair operations on all identified blind holes and monitor the through-hole rate in real time;

[0130] Judge whether the through-hole rate reaches a preset threshold;

[0131] If the through-hole rate reaches the preset threshold, it is determined that all the blind holes are repaired into through-holes and the laser repair is completed.

[0132] Refer to Figure 3 , in the embodiments of the present application, a computer device is further provided. The computer device may be a server, and its internal structure may be as Figure 3As shown in the figure. The computer device includes a processor, an internal memory, a storage medium (non-volatile storage medium), and a network interface connected by a system bus. Among them, the processor of the computer design is used to provide computing and control capabilities. The memory of the computer device includes the above-mentioned storage medium (non-volatile storage medium) and the internal memory. The storage medium (non-volatile storage medium) stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the storage medium (non-volatile storage medium). The database of the computer device is used to store usage data and the like during a laser-induced combined with visual repair method. The network interface of the computer device is used to communicate with an external terminal through a network connection. Further, the above computer device may also be provided with an input device, a display screen, and the like. When the above computer program is executed by the processor, it implements a laser-induced combined with visual repair method, including the following steps: According to the preset hole position coordinates, control the laser to perform laser drilling on the sample during the current processing; perform visual inspection on the drilled sample to determine whether there are blind holes; if there are blind holes on the surface of the sample, perform secondary laser drilling on the blind holes in sequence; until all the blind holes are repaired into through holes, the laser repair is completed.

[0133] Those skilled in the art can understand that Figure 3 the structure shown in the figure is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied.

[0134] An embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements a laser-induced combined with visual repair method, including the following steps: According to the preset hole position coordinates, control the laser to perform laser drilling on the sample during the current processing; perform visual inspection on the drilled sample to determine whether there are blind holes; if there are blind holes on the surface of the sample, perform secondary laser drilling on the blind holes in sequence; until all the blind holes are repaired into through holes, the laser repair is completed. It can be understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0135] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium provided in this application and used in the embodiments can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0136] It should be noted that in this text, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, device, article, or method including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such a process, device, article, or method. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, device, article, or method including that element.

[0137] The above are only the preferred embodiments of this application, and do not limit the patent scope of this application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.

Claims

1. A laser-induced collocation visual repair method, characterized in that: The method comprises: According to the preset hole coordinates, control the laser to perform laser drilling on the sample currently being processed; Perform visual inspection on the punched samples to determine whether there are blind holes; If there are blind holes on the surface of the sample, the blind holes are subjected to secondary laser drilling in sequence; The laser repairing is completed until all the blind holes are repaired into through holes.

2. The laser-induced matching visual repair method according to claim 1, characterized in that: The step of controlling the laser to perform laser drilling on the sample currently being processed according to the preset hole position coordinates includes: Acquire the position of the sample in a specified area based on a sensor camera; Generating a drilling path plan including hole coordinate information based on the position of the sample; According to the preset initial parameters, the laser is started to perform laser drilling on the surface of the sample in sequence according to the hole coordinate information based on the drilling path planning.

3. The laser-induced matching visual repair method according to claim 1, characterized in that: The step of visually inspecting the punched sample to determine whether there are blind holes includes: Acquire an image of the sample surface taken using backlight illumination; Applying a filtering algorithm to remove noise and enhance contrast of the image; The enhanced image is subjected to edge detection algorithm to extract edge contours and determine the hole positions; Setting a brightness threshold to binarize the image, and performing light transmittance analysis on the hole; Based on the analysis results, determine whether there is a blind hole.

4. The laser-induced matching visual repair method according to claim 1, characterized in that: If there are blind holes on the surface of the sample, the step of performing secondary laser drilling on the blind holes in sequence comprises: If there is a blind hole on the surface of the sample, planning a secondary laser path based on the coordinate position of the blind hole; The control system drives the XY platform to move the laser head to the coordinate position of the first blind hole in the secondary laser path; The laser is started to perform a secondary drilling operation on the current blind hole based on the preset laser parameters; Move to the next blind hole position in the secondary laser path in sequence and repeat the secondary drilling operation.

5. The laser-induced matching visual repair method according to claim 4, characterized in that: Before the step of starting the laser to perform a secondary drilling operation on the current blind hole based on preset laser parameters, the method includes: identifying a remaining thickness of the blind hole; The corresponding laser pulse energy is calculated according to the remaining thickness to obtain the preset laser parameters.

6. The laser-induced matching visual repair method according to claim 4, characterized in that: Before the step of starting the laser to perform a secondary drilling operation on the current blind hole based on the preset laser parameters, the method further includes: identifying a remaining thickness of the blind hole; Calculate the corresponding spot focus position according to the remaining thickness; Based on the focal position of the light spot, the z-axis is moved to compensate for the defocus caused by the current blind hole depth.

7. The laser-induced matching visual repair method according to claim 1, characterized in that: The step of completing the laser repair until all the blind holes are repaired into through holes comprises: Perform secondary repair operations on all identified blind holes and monitor the through-hole rate in real time; Determine whether the through-hole rate reaches a preset threshold; If the through hole rate reaches a preset threshold, it is determined that all the blind holes are repaired into through holes, and the laser repair is completed.

8. A laser-induced visual repair device, characterized in that: include: The initial drilling module is used to control the laser to perform laser drilling on the sample in the current processing process according to the preset hole position coordinates; The detection module is used to perform visual inspection on the punched sample to determine whether there are blind holes; A secondary drilling module, used for performing secondary laser drilling on the blind holes in sequence if there are blind holes on the surface of the sample; The repair completion module is used to complete the laser repair until all the blind holes are repaired into through holes.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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