Automatic positioning spot welding equipment based on PCBA circuit board and welding method

Abstract

The invention discloses automatic positioning spot welding equipment based on a PCBA circuit board and a welding method, and relates to the technical field of circuit board welding machining. Comprising an advancing base plate and a control panel which are arranged below the welding end of the spot welding machine. An automatic positioning structure combining mechanical clamping and pneumatic adsorption and an automatic positioning process are adopted, specifically, a flexible adsorption structure capable of achieving curve deformation is adopted to be assisted by a double-side opposite pressing structure to achieve the double limiting effect, and intelligent regulation and control in the mechanical clamping and pneumatic adsorption process can be conducted by arranging an intelligent control system. Finally, the spot welding deviation phenomenon is avoided in the spot welding process of the circuit board; the thermal deformation position of the current circuit board to be subjected to spot welding is obtained for real-time monitoring and area division, targeted intelligent sucker arrangement is conducted according to the area division result, and effective adsorption of the thermal deformation position of the circuit board is achieved through dynamic adjustment of the suction stroke of the suckers; and fixing is completed in combination with a double positioning mode of mechanical clamping, so that spot welding deviation is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of soldering and processing of circuit boards, and particularly to an automatic positioning spot welding device and a welding method based on a PCBA circuit board. Background Art

[0002] Spot welding is one of the processes of precisely soldering electronic components onto a PCB to form a PCBA, mainly including the following links: pre-welding preparation, component positioning, welding process, and post-welding treatment. In an automated production line, the precise fixation of the PCB directly affects the welding quality. Traditional PCB spot welding positioning includes various methods such as pre-positioning, mechanical positioning, and adsorption positioning. When the PCB undergoes spot welding process through vacuum adsorption positioning, although the positioning accuracy and automation level are improved, the following main defects still exist: poor contact between the suction cup and the PCB, residue contamination, and thermal deformation problems. Referring to the content disclosed in Chinese Patent Publication No. CN116782511A, it has the effect of overcoming the deformation influence of the circuit board to ensure stable adsorption of the circuit board, and making the bottom surface of the circuit board closely adhere to the top surface of the support positioning seat as much as possible.

[0003] Combined with the above disclosed technology, when the prior art uses vacuum adsorption to perform spot welding positioning of the PCB, if customized design of the suction cup layout is not carried out, local adsorption failure is likely to occur, and the thermal deformation generated during the spot welding process of the PCB thin plate cannot be predicted, so dynamic adjustment of the adsorption stroke cannot be made, ultimately resulting in spot welding deviation. For this reason, this application proposes a solution. Summary of the Invention

[0004] The purpose of the present invention is to provide an automatic positioning spot welding device and a welding method based on a PCBA circuit board, which are used to solve the problem of spot welding deviation caused by the lack of dynamic adjustment of the suction cup layout during the spot welding process.

[0005] The object of the present invention can be achieved by the following technical solutions: An automatic positioning spot welding device based on a PCBA circuit board, including a traveling substrate and a control panel arranged below the welding end of the spot welder. Slide rail rod seats are embedded and installed at both ends of the traveling substrate. A pair of pressure plates are jointly installed on a pair of slide rail rod seats on the same side. A pair of side pressing mechanisms for fixing the side ends of the circuit board are jointly installed on the upper ends of the pressure plates; An adaptive adsorption mechanism for adsorbing the bottom of the circuit board is arranged between the pair of pressure plates; The pair of side pressing mechanisms include fixed seats arranged on both sides of the upper ends of the pressure plates. A limiting support rod is jointly installed between the inner sides of the pair of fixed seats. A rotating rod is jointly installed on the outer sides of the pair of fixed seats close to the limiting support rod. Side pressing wedge rods are arranged at intervals on the rotating rod; The adaptive adsorption mechanism includes an installation box arranged below and in the middle of the pressure plate. A flexible tape reel is horizontally slidably installed in the installation box. The flexible tape reel is in a continuous horizontal "S" shape and is longitudinally inserted with bottom suction cups and top suction cups arranged at intervals and distributed.

[0006] Further set as: A driving component is installed below the pressure plate. The driving component includes a rotating pin seat connected to the bottom of the pressure plate. A swing rod is rotatably installed on the rotating pin seat. A friction wheel is fixedly installed at the bottom end of the swing rod.

[0007] Further set as: The upper end of the swing rod is rotatably connected to a follow-up rod facing upward. The follow-up rod penetrates through the pressure plate and the end extending upward is connected to the rotating rod. Motors are symmetrically embedded below the traveling substrate corresponding to the friction wheel. A driving runner tangent to the friction wheel is installed at the output end of the motor.

[0008] Further set as: Adjusting components for driving the expansion and contraction of the flexible tape reel are installed on both sides inside the installation box. The adjusting components include linear cylinders arranged symmetrically. The output ends of the linear cylinders are respectively connected to both ends of the flexible tape reel through straight plates. A guiding rod is jointly installed between both ends of the installation box. Each pair of guiding rods is jointly inserted into the horizontal middle position of the flexible tape reel.

[0009] Further set as: The flexible tape reel is formed by stacking in a continuous "S" shape to form a valley area and a peak area. The bottom suction cups are spaced apart in the valley area and their tops are flush. The top suction cups are spaced apart in the peak area and their tops are flush. The bottom ends of the bottom suction cups and the top suction cups are both connected to a pneumatic suction device.

[0010] Further set as: The top end of the limiting support rod is flush with the upper end of the top suction cup in the peak area on the flexible tape reel, and the side pressing wedge rod extends above the limiting support rod in an "L" shape.

[0011] Further set as: A support wheel is installed in the middle of the lower surface of the pressure plate. The bottom of the support wheel is in contact with the upper surface of the traveling substrate.

[0012] Further set as: The control panel is internally provided with an arrangement intelligent control system communicatively connected to the opposite-side pressing mechanism and the adaptive adsorption mechanism. The arrangement intelligent control system includes a processor, a shape and position monitoring end, a heat deformation monitoring end, a deployment and analysis end, and an execution and regulation end.

[0013] Further set as: The shape and position monitoring end is used to measure the displacement size value WCz during the soldering of the circuit board and send the displacement deformation value WCz to the deployment and analysis end. The heat deformation monitoring end is used to obtain the deformation distribution value XBz during the soldering of the circuit board and send it to the deployment and analysis end. The deployment and analysis end compares and analyzes the received displacement size value WCz and deformation distribution value XBz, outputs a normal signal and an abnormal signal, and sends the abnormal signal to the execution and regulation end to perform relevant actions.

[0014] An automatic positioning soldering method based on a PCBA circuit board includes an automatic positioning process of the circuit board, a process of selecting the pressing and adsorption positions according to the deformation, and a spot welding process.

[0015] The present invention has the following beneficial effects:

[0016] 1. Aiming at the problem of spot welding deviation caused by the lack of dynamic adjustment of the sucker arrangement in the spot welding process, the present invention uses an automatic positioning structure and an automatic positioning process that combine mechanical clamping and pneumatic adsorption. Specifically, a flexible adsorption structure that can be deformed in a curve is used in combination with a bilateral pressing structure to achieve a double limiting effect. It can also perform intelligent control during the mechanical clamping and pneumatic adsorption processes through the arrangement intelligent control system, ultimately avoiding the occurrence of spot welding deviation during the spot welding of the circuit board. Moreover, by obtaining the thermally deformed positions of the current circuit board to be spot welded for real-time monitoring and regional division, and making targeted intelligent arrangements of the suckers according to the regional division results, the effective adsorption of the thermally deformed positions of the circuit board is achieved through the dynamic adjustment of the sucker adsorption stroke, and then the double positioning method of mechanical clamping is combined to complete the fixation, avoiding the occurrence of spot welding deviation.

[0017] 2. During the automatic positioning process, first, the motor drives the driving runner to rotate. After the driving runner rotates, it drives the friction wheel to roll. Since the structure between the friction wheel and the swing rod is fixed, the rolling of the friction wheel generates the swinging effect of the swing rod. Then, through the follower rod, the deflection of the side pressing wedge rod is completed, and finally, the side fixing of the circuit board is achieved. The relative displacement of the pressure plate on both sides is realized by the sliding rail rod seat. During this process, the circuit board is mechanically clamped more precisely. Then, the linear cylinder drives the flexible tape reel to achieve bending regulation, thereby changing the contact quantity and position of the bottom suction cup and the top suction cup at the bottom of the circuit board. Moreover, for the thermal deformation that occurs during the welding process of the circuit board, the adsorption stroke can be dynamically adjusted, which is conducive to achieving a stable adsorption and fixing effect. Combined with the mechanical clamping effect, the two jointly achieve the precise positioning of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 Structural schematic diagram of the present invention;

[0020] Figure 2 Side view of the present invention;

[0021] Figure 3 Bottom-up structural schematic diagram of the present invention;

[0022] Figure 4 Structural schematic diagram of the opposite-side pressing mechanism of the present invention;

[0023] Figure 5 Installation schematic diagram of the driving component of the present invention;

[0024] Figure 6 Partial structural diagram of the driving component of the present invention;

[0025] Figure 7 Structural schematic diagram of the adaptable adsorption mechanism of the present invention;

[0026] Figure 8 Partial installation structural diagram of the adjustment component of the adaptable adsorption mechanism of the present invention;

[0027] Figure 9 Front view of the present invention.

[0028] In the figure: 1, traveling substrate; 2, slide rail rod seat; 3, opposing pressure plate; 4, mounting box; 5, opposing side pressing mechanism; 6, adaptive adsorption mechanism; 7, drive assembly; 8, fixed seat; 9, side pressing wedge rod; 10, guide rod; 11, flexible tape reel; 12, bottom suction cup; 13, top suction cup; 14, rotating rod; 15, limiting support rod; 16, support wheel; 17, rotating pin seat; 18, swinging rod; 19, follower rod; 20, friction wheel; 21, drive runner; 22, motor; 23, linear cylinder. Detailed implementation manners

[0029] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Embodiment 1: Aiming at the problem of welding deviation caused by the lack of dynamic adjustment of the suction cup arrangement during the spot welding process, the following technical solutions are proposed:

[0031] Refer to Figure 1 - Figure 9 As shown, in this embodiment, the automatic positioning spot welding device based on the PCBA circuit board includes a traveling substrate 1 and a control panel arranged below the welding end of the spot welder. Slide rail rod seats 2 are embedded and installed at both ends of the traveling substrate 1. An opposing pressure plate 3 is commonly installed on a pair of slide rail rod seats 2 on the same side. An opposing side pressing mechanism 5 for fixing the side of the circuit board is commonly installed on the upper end of the opposing pressure plate 3. An adaptive adsorption mechanism 6 for adsorbing the bottom of the circuit board is arranged between a pair of opposing pressure plates 3. Among them, the opposing side pressing mechanism 5 realizes the auxiliary positioning during the spot welding process of the circuit board by mechanical clamping, while the adaptive adsorption mechanism 6 is the main positioning structure made to adapt to the thermal deformation during the spot welding process of the circuit board. The specific content will be described in detail below:

[0032] Refer to Figure 1 , Figure 4 and Figure 5As shown, the opposite pressing mechanism 5 includes fixed seats 8 arranged on both sides of the upper end of the opposite pressing plate 3. A limiting support rod 15 is commonly installed between the inner sides of a pair of fixed seats 8. A rotating rod 14 is commonly installed on the outer sides of a pair of fixed seats 8 close to the limiting support rod 15. Side pressing wedge rods 9 are arranged at intervals on the rotating rod 14; the adaptive adsorption mechanism 6 includes an installation box 4 arranged below and in the middle of the opposite pressing plate 3. A flexible tape reel 11 is horizontally slidably installed in the installation box 4. The flexible tape reel 11 is in a continuous horizontal "S" shape and longitudinally inserted with bottom suction cups 12 and top suction cups 13 arranged at intervals. During the positioning in the process of spot welding the circuit board: The circuit board is continuously conveyed by a conveying device and corresponds to the upper part of the installation box 4. This setting is a conventional continuous conveying method in the prior art, and the corresponding grasping structure or lifting structure is also easy to think of by those skilled in the art, so it will not be elaborated here; then it drops above the flexible tape reel 11, and the bilateral position correspondence is completed by the movable opposite pressing plates 3 on both sides. Then, in combination with the flexible tape reel 11 at the bottom, the bottom of the circuit board is corresponded. The pneumatic suction device jointly completes the adsorption and fixation by the bottom suction cups 12 and the top suction cups 13;

[0033] In the process of fixing the circuit board described above, the following technical solution is given for how to achieve bilateral tightening of the circuit board: Refer to Figure 4 - Figure 6 As shown, a driving assembly 7 is installed below the opposite pressing plate 3. The driving assembly 7 includes a rotating pin seat 17 connected to the bottom of the opposite pressing plate 3. A swing rod 18 is rotatably installed on the rotating pin seat 17. A friction wheel 20 is fixedly installed at the bottom end of the swing rod 18. The upper end of the swing rod 18 is rotatably connected to a follow-up rod 19 facing upward. The follow-up rod 19 passes through the opposite pressing plate 3 and is connected to the rotating rod 14 at the end extending upward. Motors 22 are symmetrically embedded below the friction wheel 20 corresponding to the traveling substrate 1. A driving runner 21 tangent to the friction wheel 20 is installed at the output end of the motor 22. The motor 22 drives the driving runner 21 to rotate. After the driving runner 21 rotates, it drives the friction wheel 20 to roll. Since the friction wheel 20 and the swing rod 18 are in a fixed structure, the rolling of the friction wheel 20 generates the swinging effect of the swing rod 18. Then, the deflection of the side pressing wedge rod 9 is completed through the follow-up rod 19. Finally, the side of the circuit board is fixed. The relative displacement of the opposite pressing plates 3 is realized by the sliding rail rod seat 2 driving the opposite pressing plates 3 on both sides to move relative to each other. In this process, the circuit board is mechanically clamped more precisely;

[0034] Regarding how to achieve the pneumatic adsorption of the circuit board, it is realized through the following technical solution: Refer to Figure 7 and Figure 8As shown in the figure, adjusting components for driving the expansion and contraction of the flexible tape reel 11 are installed on both sides inside the installation box 4. The flexible tape reel 11 is made of rubber material with deformation function, and can realize the stable support for the circuit board after bending regulation. The adjusting components include symmetrically arranged linear cylinders 23. The output ends of the linear cylinders 23 are both connected to the two ends of the flexible tape reel 11 through straight plates. A guide rod 10 is commonly installed between the two ends of the installation box 4. Each pair of guide rods 10 is commonly inserted into the horizontal middle position of the flexible tape reel 11. The flexible tape reel 11 is stacked in a continuous "S" shape to form valley areas and peak areas. The bottom suction cups 12 are spaced apart in the valley areas and their tops are flush. The top suction cups 13 are spaced apart in the peak areas and their tops are flush. The bottoms of the bottom suction cups 12 and the top suction cups 13 are both connected to a pneumatic suction device, and the pneumatic suction device realizes the suction function of the bottom suction cups 12 and the top suction cups 13, and adjusts the pneumatic suction position according to the positions of the components to be soldered on the circuit board, specifically including the position adjustment of the bottom suction cups 12 and the top suction cups 13. The linear cylinders 23 drive the flexible tape reel 11 to realize bending regulation, thereby changing the contact quantity and positions of the bottom suction cups 12 and the top suction cups 13 on the bottom surface of the circuit board, and can make dynamic adjustment of the suction stroke for the thermal deformation that occurs during the soldering process of the circuit board, which is beneficial to achieving a stable suction and fixation effect. Combined with the mechanical clamping function, the two together realize the precise positioning of the circuit board;

[0035] Referring to Figure 2 and Figure 4 As shown in the figure, the top end of the limit support rod 15 is flush with the upper end of the top suction cup 13 on the peak area of the flexible tape reel 11. The side pressure wedge rod 9 extends in an "L" shape above the limit support rod 15. A support wheel 16 is installed in the middle of the lower surface of the pressure plate 3. The bottom of the support wheel 16 contacts the upper surface of the traveling substrate 1. When the circuit board is bilaterally clamped by the side pressure wedge rod 9, specifically, it presses on the side of the circuit board without covering the surface of the circuit board. Combined with the bottom limit support rod 15, it realizes triple fixation of bilateral clamping, bottom support and bottom suction of the circuit board, which is beneficial to achieving the precise positioning of the circuit board and avoiding the problem of deviation during the spot welding process.

[0036] Basic principle: The principle of the present invention is the same as that of the spot welding equipment in the prior art. The difference lies in providing an automatic positioning structure and an automatic positioning process combining mechanical clamping and pneumatic suction. Specifically, a flexible adsorption structure that can be deformed in a curve is adopted and supplemented with a bilateral pressing structure to realize a double limiting function. It can also perform intelligent regulation during the mechanical clamping and pneumatic suction processes through an arranged intelligent control system, and finally avoid the phenomenon of spot welding deviation during the spot welding process of the circuit board.

[0037] Embodiment 2: This embodiment further optimizes the arranged intelligent control process in Embodiment 1;

[0038] The control panel is equipped with an arrangement intelligent control system that is connected to the opposite side pressing mechanism 5 and the adaptive adsorption mechanism 6. The arrangement intelligent control system includes a processor, a shape and position monitoring terminal, a heat deformation monitoring terminal, a deployment analysis terminal and an execution control terminal.

[0039] The shape and position monitoring end is used to measure the displacement dimension value WCz during the welding of the circuit board, and send the displacement deformation value WCz to the deployment analysis end. The thermal deformation monitoring end is used to obtain the deformation distribution value XBz during the welding of the circuit board, and send it to the deployment analysis end, wherein the displacement dimension value WCz is measured by the infrared sensor and displacement sensor set on the spot welding equipment, specifically expressed as the length value, width value and thickness value of the circuit board, and the deformation distribution value is measured by the infrared sensor vertically set at the bottom of the installation box 4, specifically expressed as the coordinate value of the position where the circuit board is deformed;

[0040] The deployment and analysis end compares and analyzes the received displacement size value WCz and deformation distribution value XBz, outputs normal signals and abnormal signals, and sends the abnormal signal to the execution and control end to perform related actions: the deployment and analysis end divides the displacement size value WCz into several sub-areas according to the region, and synchronously obtains the deformation distribution value in each sub-area. If no deformation state occurs in the sub-area, a normal signal is output; if a deformation state occurs, an abnormal signal is output and sent to the execution and control end.

[0041] After receiving the abnormal signal, the execution control end converts it into a control signal and sends it to the slide rail rod seat 2, the motor 22 and the linear cylinder 23. The slide rail rod seat 2 drives the pressure plate 3 to move relatively, first pre-aligning with the end side of the circuit board, and then the motor 22 is started according to the current size, length, width and thickness of the circuit board, and drives the friction wheel 20 and the swing rod 18 to swing by driving the rotating wheel 21, and then drives the side pressure wedge rod 9 to complete the preliminary fixation of the circuit board; the linear cylinder 23 starts to drive the flexible belt disk 11 to produce an expansion and contraction action, so that the bottom suction cup 12 or the top suction cup 13 forms a stable contact with the bottom surface of the circuit board corresponding to the sub-area that should generate the abnormal signal, and then the corresponding adsorption is completed through the pneumatic suction device, and finally the stable positioning of the circuit board during the spot welding process is achieved to avoid the phenomenon of spot welding deviation;

[0042] In combination with the above: the intelligent control arrangement system can perform stable adsorption and fixation in combination with the spot welding status of the circuit board. Specifically, it obtains the thermal deformation position of the circuit board to be spot welded for real-time monitoring and area division, and makes targeted intelligent arrangement of suction cups according to the area division results. The dynamic adjustment of the suction cup adsorption stroke can realize effective adsorption of the thermal deformation position of the circuit board, and then combines the dual positioning method of mechanical clamping to complete the fixation, avoiding spot welding deviation.

[0043] Embodiment 3: This embodiment combines Embodiment 1 and Embodiment 2 to form an automatic positioning and soldering method based on a PCBA circuit board, including the following steps:

[0044] Automatic positioning process of the circuit board: The size and thermal deformation position of the circuit board are obtained in real time by sensors. The driving wheel 21 is rotated by the motor 22, and the friction wheel 20 rolls after the driving wheel 21 rotates. Since the structure between the friction wheel 20 and the swing rod 18 is fixed, the rolling of the friction wheel 20 generates the swinging effect of the swing rod 18, and then the deflection of the side pressure wedge rod 9 is completed through the follower rod 19. Finally, the side fixing of the circuit board is completed, and the relative displacement of the pressure plate 3 is realized by the displacement of the two sides driven by the slide rail rod seat 2. During this process, the circuit board is mechanically clamped more precisely; the bending adjustment is realized by driving the flexible belt reel 11 by the linear cylinder 23, so as to change the contact quantity and position of the bottom suction cup 12 and the top suction cup 13 at the bottom of the circuit board, and the dynamic adjustment of the adsorption stroke can be made for the thermal deformation of the circuit board during the soldering process, which is beneficial to achieving a stable adsorption and fixing effect. Combined with the mechanical clamping effect, the two jointly realize the precise positioning of the circuit board;

[0045] Process of selecting the pressing and adsorption positions according to the deformation: The shape and position monitoring end and the heat deformation monitoring end respectively obtain the length value, width value and thickness value of the circuit board and the coordinate value of the position where the thermal deformation occurs. The circuit board is divided into several sub-regions according to the area, and the deformation distribution value in each sub-region is obtained synchronously. If there is no deformation state in the sub-region, a normal signal is output. If a deformation state appears, an abnormal signal is output and sent to the execution control end; after receiving the abnormal signal, the execution control end is converted into a control signal and sent to the slide rail rod seat 2, the motor 22 and the linear cylinder 23. The slide rail rod seat 2 drives the pressure plate 3 to move relatively. First, the pre-alignment with the end side of the circuit board is carried out. Then the motor 22 is started according to the current size, length, width and thickness of the circuit board. The friction wheel 20 and the swing rod 18 are driven to swing by the driving wheel 21, and then the side pressure wedge rod 9 is driven to complete the preliminary fixation of the circuit board; the linear cylinder 23 is started to drive the flexible belt reel 11 to expand and contract, so that the bottom suction cup 12 or the top suction cup 13 forms a stable contact with the bottom surface of the circuit board corresponding to the sub-region where the abnormal signal is generated, and then the corresponding adsorption is completed through the pneumatic suction device, and finally the stable positioning of the circuit board during the spot welding process is realized;

[0046] Spot welding process: After the circuit board is automatically positioned, the spot welding operation is completed through the welding end of the spot welding equipment. After the spot welding is completed, the positioning is released immediately, the circuit board after welding is unloaded, and finally the feeding is continued to cycle for continuous spot welding operation of the circuit board.

[0047] In summary, based on the spot welding process of the circuit board, the present invention adopts an automatic positioning structure and an automatic positioning process that combine mechanical clamping and pneumatic adsorption. Specifically, a flexible adsorption structure that can be curved is supplemented by a bilateral pressing structure to achieve a dual limiting effect. It can also be intelligently controlled through the arrangement of an intelligent control system during the mechanical clamping and pneumatic adsorption processes, ultimately avoiding the occurrence of spot welding deviation during the spot welding of the circuit board.

[0048] Moreover, it can monitor and divide the area in real time by obtaining the thermal deformation position of the current circuit board to be spot welded, and make targeted intelligent arrangements of the suction cups according to the area division results. The effective adsorption of the thermal deformation position of the circuit board is achieved through the dynamic adjustment of the suction cup adsorption stroke, and then fixed by combining the dual positioning methods of mechanical clamping to avoid spot welding deviation.

[0049] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

[0050] In the description of this specification, the description with reference to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the present invention to only the specific embodiments.

Claims

1. An automatic positioning spot welding device based on a PCBA circuit board, comprising a traveling substrate (1) and a control panel arranged below a welding end of a spot welding machine, characterized in that: The two ends of the traveling substrate (1) are embedded with slide rail rod seats (2), and a pair of the slide rail rod seats (2) on the same side are commonly installed with a pressure plate (3), and the upper ends of the pressure plates (3) are commonly installed with a side clamping mechanism (5) for fixing the end side of the circuit board; an adaptive adsorption mechanism (6) for adsorbing the bottom of the circuit board is arranged between the pair of pressure plates (3); the side clamping mechanism (5) includes a fixing seat (8) arranged on both sides of the upper end of the pressure plate (3), and the inner sides of the pair of fixing seats (8) are commonly installed between them. A limiting support rod (15) is installed together, and a pair of the fixing seats (8) are jointly installed with a rotating rod (14) near the outer side of the limiting support rod (15), and a side pressure wedge rod (9) is arranged at intervals on the rotating rod (14); the adaptive adsorption mechanism (6) includes a mounting box (4) arranged at the lower middle of the pressure plate (3), and a flexible belt reel (11) is horizontally slidably installed in the mounting box (4), and the flexible belt reel (11) is in a continuous horizontal "S" shape and is longitudinally inserted with a bottom suction cup (12) and a top suction cup (13) arranged and distributed at intervals.

2. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 1 is characterized in that: A driving assembly (7) is installed below the pressure plate (3), and the driving assembly (7) includes a rotating pin seat (17) connected to the bottom of the pressure plate (3), a swing rod (18) is rotatably installed on the rotating pin seat (17), and a friction wheel (20) is fixedly installed at the bottom end of the swing rod (18).

3. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 2 is characterized in that: The upper end of the swing rod (18) is rotatably connected to a follower rod (19) facing upwards, and the follower rod (19) extends through the pressure plate (3) to the upper end and is connected to the rotating rod (14). The moving base plate (1) is symmetrically embedded with a motor (22) below the corresponding friction wheel (20), and the output end of the motor (22) is installed with a driving wheel (21) tangential to the friction wheel (20).

4. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 1 is characterized in that: Adjustment components for driving the flexible belt reel (11) to expand and contract are installed on both sides of the interior of the installation box (4), and the adjustment components include symmetrically arranged linear cylinders (23). The output ends of the linear cylinders (23) are connected to the two ends of the flexible belt reel (11) through straight plates. A guide rod (10) is installed between the two ends of the installation box (4), and each pair of the guide rods (10) is inserted into the horizontal middle position of the flexible belt reel (11).

5. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 4 is characterized in that: The flexible belt disc (11) is stacked in a continuous "S" shape to form a valley area and a peak area, the bottom suction cups (12) are distributed in the valley area at intervals and the tops are flush with each other, the top suction cups (13) are distributed in the peak area at intervals and the tops are flush with each other, and the bottom ends of the bottom suction cups (12) and the top suction cups (13) are both connected to a pneumatic suction device.

6. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 5 is characterized in that: The top end of the limiting support rod (15) is flush with the upper end of the top suction cup (13) in the peak area of ​​the flexible belt reel (11), and the side pressure wedge rod (9) extends in an "L" shape to the top of the limiting support rod (15).

7. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 1 is characterized in that: A support wheel (16) is installed in the middle of the lower surface of the pressing plate (3), and the bottom of the support wheel (16) is in contact with the upper surface of the traveling base plate (1).

8. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 1 is characterized in that: The control panel has a built-in layout intelligent control system that is communicatively connected to the opposite side pressing mechanism (5) and the adaptive adsorption mechanism (6), and the layout intelligent control system includes a processor, a shape and position monitoring terminal, a thermal deformation monitoring terminal, a deployment analysis terminal, and an execution and control terminal.

9. The automatic positioning spot welding equipment based on PCBA circuit board according to claim 8, characterized in that: The shape and position monitoring end is used to measure the displacement dimension value WCz during the circuit board welding, and send the displacement deformation value WCz to the deployment analysis end. The thermal deformation monitoring end is used to obtain the deformation distribution value XBz during the circuit board welding, and send it to the deployment analysis end; the deployment analysis end compares and analyzes the received displacement dimension value WCz and deformation distribution value XBz, outputs normal signals and abnormal signals, and sends the abnormal signal to the execution and control end to perform related actions.

10. An automatic positioning welding method based on a PCBA circuit board, using the automatic positioning spot welding device based on a PCBA circuit board as claimed in any one of claims 1 to 9, characterized in that: It includes the automatic positioning process of the circuit board, the process of selecting the pressing and adsorption position according to the deformation, and the spot welding process.

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