Gas uniformizing device and gas treatment equipment

Abstract

The invention discloses a gas uniformizing device and gas treatment equipment, and relates to the technical field of semiconductor equipment, and the gas uniformizing device comprises a shell and a gas uniformizing part; the shell comprises a first enclosure part and a second enclosure part, the first enclosure part and the second enclosure part are enclosed to form a cavity, an air inlet hole is formed in the first enclosure part, and an air outlet hole is formed in the second enclosure part; the gas uniformizing part is located in the cavity and divides the cavity into two sub-cavities, and the gas uniformizing part is in sealed connection with the first enclosure part or the second enclosure part; a plurality of gas uniformizing holes are formed in the gas uniformizing part; the gas uniformizing part comprises a plurality of annular areas which are distributed in a nested manner inside and outside, and the areas of the gas uniformizing holes in the same annular area are equal; and in any two adjacent annular areas, the aperture ratio of the air uniformizing holes in the annular area of the outer ring is larger than that of the air uniformizing holes in the annular area of the inner ring. Gas can enter the first sub-cavity from the gas inlet hole in the first enclosure part, then enter the second sub-cavity through the gas homogenizing hole in the gas homogenizing part, and flow out from the gas outlet hole in the second enclosure part, so that the effect of homogenizing gas flow is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and particularly relates to a gas distribution device and a gas treatment equipment. Background Art

[0002] The thin film deposition process is one of the important processes in the semiconductor field. In the thin film deposition process, such as chemical vapor deposition and atomic layer deposition processes, gases flow through pipelines and enter the chamber through a gas distribution device such as a shower head, and a thin film is formed on the surface of the substrate. With the development of thin film preparation technology, the requirements for the gas distribution ability of the gas distribution device in the thin film deposition process are getting higher and higher. Achieving uniform gas supply is the key to obtaining a uniform thin film deposition morphology.

[0003] In the existing thin film deposition equipment, a gas distribution plate is arranged inside the gas distribution device. One way is that the gas distribution plate is fixed to the top or bottom through multiple columns. Usually, when the air flow passes through the fixed orientation of the columns, the local flow field is quite different from the orientation without columns, and finally the uniformity of the air flow passing through the air outlet plate is poor. Another way is that the gas distribution plate is only a simple uniform hole array distribution, and the effect that the pressure loss of the air flow is basically equal after passing through the gas distribution plate cannot be achieved, and the gas distribution ability is not good. Summary of the Invention

[0004] The present application provides a gas distribution device and a gas treatment equipment. Through the design of the gas distribution holes inside the gas distribution device, the effect that the pressure loss of the air flow is basically equal after passing through the gas distribution plate can be achieved, and the gas distribution effect is improved.

[0005] In a first aspect, the present application provides a gas distribution device, including a housing and a gas distribution part; the housing includes a first enclosing part and a second enclosing part, the first enclosing part and the second enclosing part enclose to form a cavity, an air inlet hole is arranged on the first enclosing part, and an air outlet hole is arranged on the second enclosing part; the gas distribution part is located inside the cavity and divides the cavity into two sub-cavities; the gas distribution part has a plurality of gas distribution holes; the plurality of gas distribution holes on the gas distribution part are distributed in an annular region with the air inlet hole as the center and nested inside and outside. In adjacent two annular regions, the opening ratio of the gas distribution holes in the outer annular region is greater than that of the gas distribution holes in the inner annular region. Through the design of the gas distribution part inside the gas distribution device, the gas distribution device provided by the present application can achieve uniform air flow supply.

[0006] In a possible implementation manner, in adjacent two annular regions, the number of the gas distribution holes in the outer annular region is greater than that of the gas distribution holes in the inner annular region, and / or the area of the gas distribution holes in the outer annular region is greater than that of the gas distribution holes in the inner annular region. The outer annular region is farther away from the air inlet hole. Using larger gas distribution holes or a larger number of gas distribution holes can achieve the effect that the pressure loss of the air flow is basically equal before reaching the air outlet panel after passing through the gas distribution plate.

[0007] In a possible implementation, the air distribution part is hermetically connected to the first enclosing part or the second enclosing part. The air distribution part divides the cavity into two sub-cavities. The gas entering from the air inlet hole must reach the air outlet hole through the air distribution holes of the air distribution part, preventing the gas from flowing out from the edge of the air distribution part.

[0008] In a possible implementation, the interval distance between any two adjacent air distribution holes in the same annular region is equal, and / or the annular region is an annular ring region, and the distance from the air distribution holes to the center of the annular ring region in the same annular region is equal. The interval distance between adjacent air distribution holes is equal, and the air distribution holes are evenly distributed in the annular region, and the air outlet speeds of the air distribution holes in the same annular region are basically equal.

[0009] In a possible implementation, among multiple annular regions, the number of air distribution holes in the innermost annular region ranges from 3 to 5, and the number of air distribution holes in the outermost annular region ranges from 6 to 40. A distribution trend is formed where from the inner circle to the outer circle, the number of air distribution holes in the inner annular region is small, and the number of air distribution holes in the outer annular region is large.

[0010] In a possible implementation, the air distribution holes are round holes; among multiple annular regions, the diameter of the air distribution holes in the innermost annular region ranges from 1 mm to 10 mm, and the diameter of the air distribution holes in the outermost annular region ranges from 15 mm to 30 mm. A distribution trend is formed where from the inner circle to the outer circle, the diameter of the air distribution holes in the inner annular region is small, and the diameter of the air distribution holes in the outer annular region is large.

[0011] In a possible implementation, the second enclosing part includes multiple second annular regions nested inside and outside each other; the areas of the air outlet holes in the same second annular region are equal; among two adjacent second annular regions, the number of air outlet holes in the outer second annular region is greater than the number of air outlet holes in the inner second annular region, and / or the area of the air outlet holes in the outer second annular region is greater than the area of the air outlet holes in the inner second annular region. The air outlet holes on the second enclosing part adopt an arrangement similar to that of the air distribution part to achieve the effect of basically uniform air flow at the air outlet holes.

[0012] In a possible implementation, the first enclosing part includes a top plate and a side plate, the second enclosing part includes a bottom plate, the air distribution part is connected to the side plate, the sub-cavity between the air distribution part and the top plate is the first sub-cavity, the connection between the top plate and the side plate in the first sub-cavity forms a first corner structure, the connection between the air distribution part and the side plate in the first sub-cavity forms a second corner structure, and a first anti-backflow structure is provided at the first corner structure and / or the second corner structure; and / or, the cavity between the air distribution part and the bottom plate is the second sub-cavity, the connection between the air distribution part and the side plate in the second sub-cavity forms a third corner structure, the connection between the bottom plate and the side plate in the second sub-cavity forms a fourth corner structure, and a second anti-backflow structure is provided at the third corner structure and / or the fourth corner structure. Gas backflow is likely to occur at the internal corner structures of the air distribution device, causing particulate deposition. The anti-backflow structure can be set to avoid particulate deposition at the corner structures of the air distribution device.

[0013] In a possible implementation, the direction of the outermost ring of air distribution holes on the air distribution part facing the side plate is the second direction, and the direction of the air distribution part facing the top plate is the first direction; the distance between the outermost ring of air distribution holes on the air distribution part and the side plate in the second direction is C1, the distance between the air distribution part and the top plate in the first direction is H1, and C1 is less than or equal to twice H1; and / or, the distance between the air outlet hole on the bottom plate close to the side plate and the side plate in the second direction is C2, the distance between the air distribution part and the bottom plate in the first direction is H2, and C2 is less than or equal to twice H2.

[0014] In a possible implementation, the length of the first anti-backflow structure in the first direction is R1, the length of the first anti-backflow structure in the second direction is R11, and the larger of R1 and R11 is greater than or equal to half of H1; and / or, the length of the second anti-backflow structure in the first direction is R2, the length of the second anti-backflow structure in the second direction is R22, and the larger of R2 and R22 is greater than or equal to half of H2.

[0015] In a possible implementation, a chamfer or fillet is provided on the side of the side wall of the air inlet hole close to the air distribution part to control the flow field at the side wall of the air inlet hole.

[0016] In a possible implementation, the direction of the air distribution part facing the air inlet hole is the third direction; the distance between the air distribution part and the air inlet hole in the third direction is H3, the length of the flow field control structure in the third direction is R3, and R3 is greater than or equal to half of H3.

[0017] In a possible implementation, the air distribution device further includes a temperature control device, and the temperature control device is connected to the first enclosing part to control the temperature of the first enclosing part. Installing a temperature control device on the air distribution device can heat or cool the air distribution device to achieve temperature control for thin film deposition.

[0018] In a second aspect, the present application provides a gas treatment device, which includes a gas distribution device and a tray in the first aspect and various implementation manners of the first aspect. The gas outlet direction of the gas distribution device faces the tray. The tray is located inside the accommodation cavity and is disposed opposite to the gas distribution device. The gas outlet of the gas distribution device can spray gas onto the object on the tray to provide a uniform air flow source. Description of the Drawings

[0019] Figure 1 is a cross-sectional view of the gas distribution device provided by an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of the first possible gas distribution part provided by an embodiment of the present application;

[0021] Figure 3 is a schematic diagram of the second possible gas distribution part provided by an embodiment of the present application;

[0022] Figure 4 is a schematic diagram of the third possible gas distribution part provided by an embodiment of the present application;

[0023] Figure 5 is a schematic diagram of the air outlet holes of the second enclosing part provided by an embodiment of the present application;

[0024] Figure 6 is a schematic diagram of the positions of the first corner structure and the second corner structure provided by an embodiment of the present application;

[0025] Figure 7(a) is a schematic diagram of a single first anti-backflow structure provided by an embodiment of the present application Figure 1 ;

[0026] Figure 7(b) is a schematic diagram of a single first anti-backflow structure provided by an embodiment of the present application Figure 2 ;

[0027] Figure 8 is a schematic diagram of a bidirectional first anti-backflow structure provided by an embodiment of the present application;

[0028] Figure 9 is a schematic diagram of the positions of the third corner structure and the fourth corner structure provided by an embodiment of the present application;

[0029] Figure 10(a) is a schematic diagram of a single second anti-backflow structure provided by an embodiment of the present application Figure 1 ;

[0030] Figure 10(b) is a schematic diagram of a single second anti-backflow structure provided by an embodiment of the present application Figure 2 ;

[0031] Figure 11 is a schematic diagram of a bidirectional second anti-backflow structure provided by an embodiment of the present application;

[0032] Figure 12 It is a schematic diagram of the side wall structure of the air inlet hole provided by the embodiment of the present application;

[0033] Figure 13 It is a schematic diagram of the temperature control device provided by the embodiment of the present application;

[0034] Figure 14 It is a schematic diagram of the gas treatment equipment provided by the embodiment of the present application.

[0035] Description of the reference numerals:

[0036] 100 - housing; 110 - first enclosing part; 111 - air inlet hole; 112 - top plate; 113 - side plate; 120 - second enclosing part; 121 - air outlet hole; 122 - second annular region; 123 - bottom plate;

[0037] 200 - gas - equalizing part; 210 - gas - equalizing holes; 230 - air inlet region; 240 - annular region;

[0038] 240a - annular region; 240b - annular region;

[0039] 300 - cavity; 310 - first sub - cavity; 320 - second sub - cavity;

[0040] 400 - air inlet direction; 410 - first direction; 420 - second direction; 430 - third direction; 440 - fourth direction; 450 - fifth direction; 460 - sixth direction;

[0041] 500 - temperature control device; 510 - first corner structure; 520 - second corner structure; 530 - third corner structure; 540 - fourth corner structure;

[0042] 600 - outer housing; 610 - first anti - reflux structure; 620 - second anti - reflux structure; 630 - flow field control structure;

[0043] 700 - tray. Detailed implementation manners

[0044] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0045] For the convenience of understanding, the following first explains and describes the English abbreviations and relevant technical terms involved in the embodiments of the present application.

[0046] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0047] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0048] It should be understood that the term "and / or" used herein is merely a description of the same field of related objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the related objects before and after.

[0049] It should be understood that the "first", "second", etc. used in the present application are only for the purpose of distinguishing descriptions and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0050] In the description of the present application, the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0051] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or a contact connection or an integral connection; for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0052] The "within... range" used in the present application, unless specifically stated that the end values are not included, by default includes the two end values of the range. For example, within the range of 1 to 5, the two values of 1 and 5 are included.

[0053] The present application provides a gas distribution device. Refer to Figure 1 As shown, the gas distribution device provided by the present application includes a housing 100 and a gas distribution part 200. Among them, the housing 100 includes a first enclosing part 110 and a second enclosing part 120. The first enclosing part 110 and the second enclosing part 120 enclose to form a cavity 300. An air inlet hole 111 is provided on the first enclosing part 110, and an air outlet hole 121 is provided on the second enclosing part 120.

[0054] In the embodiment of the present application, the air distribution part 200 is located in the cavity 300, and divides the cavity 300 into a first sub-cavity 310 and a second sub-cavity 320; there are a plurality of air distribution holes 210 on the air distribution part 200. Gas can enter the first sub-cavity 310 through the air inlet hole 111 on the first enclosing part 110, then enter the second sub-cavity 320 through the air distribution holes 210 on the air distribution part 200, and flow out through the air outlet hole 121 on the second enclosing part 120.

[0055] In the embodiment of the present application, referring to Figure 2 As shown, there are multiple groups of air distribution holes 210 on the air distribution part 200, and the area of each group of air distribution holes 210 is equal. Taking the air distribution part 200 as a circular plate as an example, there are multiple groups of air distribution holes 210 on the air distribution part 200. The area of each group of air distribution holes 210 is equal and presents an annular distribution around the center of the circular plate. The air distribution holes 210 of different groups are nested inside and outside to form multiple annular regions 240. The air distribution part 200 includes multiple annular regions 240, and the multiple annular regions 240 are nested inside and outside. The area of the air distribution holes 210 in the same annular region 240 is equal. Figure 2 In the figure, taking the annular region 240 as an example of an annular region, the multiple concentric annular regions shown by the dotted line surrounding the central region are the annular regions 240. There are air distribution holes 210 in the multiple annular regions 240. The gas in the first sub-cavity 310 can enter the second sub-cavity 320 through the air distribution holes 210 on the air distribution part 200. Under the action of the air distribution part 200, the flow rate of the gas passing through the air distribution holes 210 is more uniform.

[0056] In the embodiment of the present application, the air distribution part 200 includes multiple annular regions 240 nested inside and outside, and the area of the air distribution holes 210 in the same annular region 240 is equal; in any two adjacent annular regions 240, the opening ratio of the air distribution holes 210 in the outer annular region 240 is greater than the opening ratio of the air distribution holes 210 in the inner annular region 240. That is to say, in an annular region 240, the ratio of the area of the air distribution holes 210 to the area of the annular region 240 where the air distribution holes 210 are located is the opening ratio. From the inner circle to the outer circle, the opening ratio of the annular region 240 gradually increases, that is, the opening ratio of the outer annular region 240 is greater than the opening ratio of the inner annular region 240.

[0057] In a possible implementation manner, referring to Figure 3 As shown, the multiple annular regions 240 are nested inside and outside. In the direction from the inner circle to the outer circle, in any two adjacent annular regions 240, the number of air distribution holes in the outer annular region 240 is greater than the number of air distribution holes in the inner annular region 240. Or referring to Figure 4 As shown, in any two adjacent annular regions 240, the area of the air distribution holes in the outer annular region 240 is greater than the area of the air distribution holes in the inner annular region 240.

[0058] In one embodiment, referring to Figure 2 As shown, a plurality of annular regions 240 are nested inside and outside each other. In the direction from the inner circle to the outer circle, the number of uniformly distributed air holes in the outer annular region is greater than that in the inner annular region, and the area of the uniformly distributed air holes in the outer annular region is greater than that in the inner annular region.

[0059] In the embodiment of the present application, the air equalizing part 200 is provided with uniformly distributed air holes 210. The size distribution trend of the uniformly distributed air holes 210 is that they are larger near the air inlet hole 111 and smaller away from the air inlet hole 111. The number distribution of the uniformly distributed air holes 210 is that they are fewer near the air inlet hole 111 and more away from the air inlet hole 111. The present application can achieve a better air equalizing effect, and the pressure losses of the air flow passing through the center and the edge of the air equalizing device are basically the same.

[0060] In a possible embodiment, reference can be made to Figure 1 As shown, the air equalizing part 200 in the embodiment of the present application is hermetically connected to the first enclosing part 110 or the second enclosing part 120. The gas in the first sub-chamber 310 must pass through the uniformly distributed air holes 210 on the air equalizing part 200 to reach the second sub-chamber 320, so as to prevent the gas entering from the air inlet hole 111 from directly reaching the air outlet hole 121 without passing through the air equalizing part 200.

[0061] In a possible embodiment, the projection area of the air inlet hole 111 on the air equalizing part 200 along the air inlet direction 400 is the air inlet area 230, Figure 1 and the air inlet direction 400 is shown in it. Taking the air inlet hole 111 as a circular hole as an example, the projection area of the air inlet hole 111 on the air equalizing part 200 along the air inlet direction 400, that is, Figure 2 the circular area located in the center of the air equalizing part 200 in it is the air inlet area 230; the uniformly distributed air holes 210 in the embodiment of the present application are located in a plurality of annular regions 240 outside the air inlet area 230. There are no uniformly distributed air holes 210 in the air inlet area 230 to prevent the gas from directly and quickly reaching the air outlet hole 121 after entering from the air inlet hole 111.

[0062] In a possible embodiment, the annular region 240 in the embodiment of the present application is a circular ring region, and the annular region 240 is a region enclosed by two concentric circles. In the same annular region 240, the interval distance between any two adjacent uniformly distributed air holes 210 is equal, or the distances from the uniformly distributed air holes 210 in the same annular region 240 to the center of the circular ring region are equal.

[0063] In a possible implementation, the annular region 240 is an annular ring region, and the uniform air holes 210 within the same annular region 240 are evenly distributed. That is to say, the uniform air holes 210 within the same annular region 240 are evenly distributed along the circumferential direction of the annular ring, and the uniform air holes 210 within the same annular region 240 are also evenly distributed along the diameter direction of the annular ring. At this time, within the same annular region 240, the interval distance between any two adjacent uniform air holes 210 is equal, and the distances from the uniform air holes 210 within the same annular region 240 to the center of the annular ring region are equal.

[0064] In a possible implementation, referring to Figure 2 As shown, among the multiple annular regions 240 in the implementation of the present application, the number of uniform air holes in the innermost annular region is in the range of 3 to 5, and the number of uniform air holes in the outermost annular region is in the range of 6 to 40. As Figure 2 shown, the innermost annular region 240 is the annular region 240a adjacent to the air intake region 230, and the number of uniform air holes in the innermost annular region 240a can be 3, 4, or 5; the outermost annular region is the annular region 240b at the edge of the air distribution portion 200, and the number of uniform air holes in the outermost annular region 240 can be 18.

[0065] In a possible implementation, referring to Figure 2 As shown, the uniform air holes 210 in the implementation of the present application can be round holes; among the multiple annular regions 240, the diameter of the uniform air holes 210 in the innermost annular region is in the range of 1 mm to 10 mm, and the diameter of the uniform air holes in the outermost annular region 240 is in the range of 15 mm to 30 mm. As Figure 2 shown, the innermost annular region 240 is the annular region 240a adjacent to the air intake region 230, and the diameter of the uniform air holes 210 in the annular region 240a is in the range of 1 mm to 10 mm; the outermost annular region 240 is the annular region 240b at the edge of the air distribution portion 200, and the diameter of the uniform air holes 210 in the annular region 240b is in the range of 15 mm to 30 mm.

[0066] In a possible implementation, referring to Figure 5 As shown, the second enclosing portion 120 in the implementation of the present application includes multiple second annular regions 122 nested inside and outside each other; the second enclosing portion 120 in the implementation of the present application is taken as an example of a circular plate for illustration. Figure 5 The multiple concentric annular regions shown by the dashed lines in the figure surrounding the central region are the second annular regions 122. Air outlet holes 121 are provided in the multiple second annular regions 122, and the gas in the second sub-chamber 320 can flow out through the air outlet holes 121 on the second enclosing portion 120.

[0067] In an embodiment of the present application, the second enclosing portion 120 includes a plurality of concentric second annular regions 122, and the areas of the air outlet holes 121 within the same second annular region 122 are equal.

[0068] The plurality of second annular regions 122 are distributed in an inner and outer nested manner as Figure 5 shown. In the direction from the inner circle to the outer circle, in any two adjacent second annular regions 122, the number of evenly distributed air holes in the outer second annular region 122 is greater than the number of evenly distributed air holes in the inner second annular region 122. Or in any two adjacent second annular regions 122, the area of the evenly distributed air holes in the outer second annular region 122 is greater than the area of the evenly distributed air holes in the inner second annular region 122.

[0069] In one embodiment, referring to Figure 5 shown, the plurality of second annular regions 122 are distributed in an inner and outer nested manner. In the direction from the inner circle to the outer circle, the number of evenly distributed air holes in the outer annular region is greater than the number of evenly distributed air holes in the inner annular region, and the area of the evenly distributed air holes in the outer annular region is greater than the area of the evenly distributed air holes in the inner annular region.

[0070] In a possible embodiment, referring to Figure 6 shown, the first enclosing portion 110 in the embodiment of the present application includes a top plate 112 and a side plate 113, the second enclosing portion 120 includes a bottom plate 123, the air equalizing portion 200 is connected to the side plate 113, the sub-chamber between the air equalizing portion 200 and the top plate 112 is the first sub-chamber 310, and the connection between the top plate 112 and the side plate 113 in the first sub-chamber 310 forms a first corner structure 510, and the connection between the air equalizing portion 200 and the side plate 113 in the first sub-chamber 310 forms a second corner structure 520. Gas reflux is likely to occur at the internal corner structures of the air equalizing device, resulting in particulate deposition. In the embodiment of the present application, by designing an anti-reflux structure, particulate deposition can be reduced.

[0071] In a possible embodiment, referring to FIGS. 7(a) and 7(b) shown, the direction of the outermost ring of air holes 210 on the air equalizing portion 200 of the embodiment of the present application facing the side plate 113 is the second direction 420, and the direction of the air equalizing portion 200 facing the top plate 112 is the first direction 410; the distance along the second direction 420 between the outermost ring of air holes 210 on the air equalizing portion 200 and the side plate 113 is C1, and the distance along the first direction 410 between the air equalizing portion 200 and the top plate 112 is H1, and C1 is less than or equal to twice of H1.

[0072] The embodiment of the present application is illustrated by taking the top plate 112 as a circular plate and the air - equalizing part 200 also as a circular plate. The top plate 112 and the air - equalizing part 200 are arranged in parallel. The top plate 112, the air - equalizing part 200 and a part of the side plate 113 enclose to form a first sub - cavity 310. The direction from the air - equalizing part 200 towards the top plate 112 is the first direction 410. At this time, the first direction 410 is perpendicular to the air - equalizing part 200 from the air - equalizing part 200 towards the top plate 112, as shown by the first direction 410 in Fig. 7(b). The direction of the outermost ring of air - equalizing holes 210 on the air - equalizing part 200 towards the side plate 113 is the second direction 420. At this time, the second direction 420 can be perpendicular to the first direction, from the air - equalizing part 200 towards the side plate 113, as shown by the second direction 420 in Fig. 7(b).

[0073] In the embodiment of the present application, the height of the edge space of the upper space formed by the top plate 112 and the air - equalizing part 200 is H1, that is, in the first sub - cavity 310, the distance between the air - equalizing part 200 and the top plate 112 along the first direction 410 is H1. The distance from the outermost ring of air - equalizing holes 210 on the air - equalizing part 200 to the edge space along the second direction 420 is C1, that is, the distance between the outermost ring of air - equalizing holes 210 on the air - equalizing part 200 and the side plate 113 along the second direction 420 is C1. If C1 is too large, there will be a back - flow in the edge space inside the air - equalizing device, resulting in particulate deposition. In the embodiment of the present application, the distance between the outermost - circle holes and the edge should be less than or equal to twice the height of the edge space, that is, C1 is less than or equal to twice H1 in Fig. 7(a) and Fig. 7(b).

[0074] In a possible embodiment, referring to Figure 9 as shown, the first enclosing part 110 in the embodiment of the present application includes a top plate 112 and a side plate 113, the second enclosing part 120 includes a bottom plate 123, the air - equalizing part 200 is connected to the side plate 113, the sub - cavity between the air - equalizing part 200 and the bottom plate 123 is the second sub - cavity 320, and the connection between the air - equalizing part 200 and the side plate 113 in the second sub - cavity 320 forms a third corner structure 530, and the connection between the bottom plate 123 and the side plate 113 in the second sub - cavity 320 forms a fourth corner structure 540. Gas back - flow is likely to occur at the corner structures inside the air - equalizing device, causing particulate deposition. In the embodiment of the present application, by designing an anti - back - flow structure, particulate deposition can be reduced.

[0075] In a possible embodiment, referring to Fig. 10(a) and Fig. 10(b) as shown, the direction of the outermost air - outlet hole 121 on the bottom plate 123 of the embodiment of the present application towards the side plate 113 is the fourth direction 440, and the direction of the air - equalizing part 200 towards the bottom plate 123 is the third direction 430. The distance between the outermost air - outlet hole 121 on the bottom plate 123 and the side plate 113 along the fourth direction 440 is C2, and the distance between the air - equalizing part 200 and the bottom plate 123 along the third direction 430 is H2, and C2 is less than or equal to twice H1.

[0076] In the embodiment of the present application, the air distribution part 200 and the bottom plate 123 are taken as circular plates for illustration. The bottom plate 123 and the air distribution part 200 are arranged in parallel. The air distribution part 200, the bottom plate 123 and part of the side plate 113 enclose to form a second sub-cavity 320. The direction from the air distribution part 200 towards the bottom plate 123 is the third direction 430. At this time, the third direction 430 is perpendicular to the air distribution part 200 and faces the bottom plate 123 from the air distribution part 200, as shown by the third direction 430 in Fig. 10(b). The direction from the outermost air outlet hole 121 on the bottom plate 123 towards the side plate 113 is the fourth direction 440. At this time, the fourth direction 440 can be perpendicular to the first direction and faces the side plate 113 from the outermost air outlet hole 121 on the bottom plate 123, as shown by the fourth direction 440 in Fig. 10(b).

[0077] In the embodiment of the present application, the height of the lower edge space formed by the air distribution part 200 and the bottom plate 123 is H2, that is, in the second sub-cavity 320, the distance between the air distribution part 200 and the bottom plate 123 along the third direction 430 is H2. The distance from the outermost air outlet hole 121 on the bottom plate 123 to the edge space along the fourth direction 440 is C2, that is, the distance between the outermost air outlet hole 121 on the bottom plate 123 and the side plate 113 along the fourth direction 440 is C2. If C2 is too large, there will be a backflow in the edge space inside the air distribution device, resulting in particle deposition. In the embodiment of the present application, the distance between the outermost air outlet hole 121 and the edge should be less than or equal to twice the height of the edge space, that is, C2 is less than or equal to twice H2 in Fig. 10(a) and Fig. 10(b).

[0078] In a possible embodiment, as shown in Fig. 7(a), a first anti-backflow structure 610 is provided at the first corner structure 510 in the embodiment of the present application, or, as shown in Fig. 7(b), a first anti-backflow structure 610 is provided at the second corner structure 520. The first anti-backflow structure 610 in the embodiment of the present application is located in the edge space of the first sub-cavity 310. Specifically, the first anti-backflow structure 610 can be a rounded corner or a chamfer, which is filled at the corner structure of the edge space of the sub-cavity. The first anti-backflow structure 610 is located at the connection between the top plate 112 and the side plate 113 in the first sub-cavity 310, or the first anti-backflow structure 610 is located at the connection between the air distribution part 200 and the side plate 113 in the first sub-cavity 310.

[0079] In a possible embodiment, as shown in Fig. 7(a) and Fig. 7(b), the direction from the air distribution part 200 towards the top plate 112 is the first direction 410 in the embodiment of the present application, and the direction from the outermost ring of air holes 210 on the air distribution part 200 towards the side plate 113 is the second direction 420;

[0080] In the embodiment of the present application, the length of the first anti-backflow structure 610 in the first direction 410 is R1, and the length of the first anti-backflow structure 610 in the second direction 420 is R11. The larger of R1 and R11 is greater than or equal to half of H1. The first anti-backflow structure 610 is filled at the corner structure of the edge space of the first sub-cavity 310 and can be in a shape similar to a rounded corner or a chamfer as shown in FIGS. 7(a) and 7(b). The length of the part of the first anti-backflow structure 610 in contact with the side plate 113 in the first direction 410 is R1, and the length of the part of the first anti-backflow structure 610 in contact with the top plate 112 in the second direction 420 is R11. R1 can be equal to or unequal to R11. When R1 is equal to R11 and R1 is greater than or equal to half of H1, that is, the length of the first anti-backflow structure 610 in the first direction 410 is equal to the length of the first anti-backflow structure 610 in the second direction 420 and is greater than or equal to the distance between the air distribution part 200 and the top plate 112 in the first direction 410. When R1 is not equal to R11, the larger of R1 and R11 is greater than or equal to half of H1, that is, the larger of the length R1 of the first anti-backflow structure 610 in the first direction 410 and the length R11 of the first anti-backflow structure 610 in the second direction 420 is greater than or equal to the distance between the air distribution part 200 and the top plate 112 in the first direction 410.

[0081] In a possible implementation manner, referring to Figure 8 as shown, the first anti-backflow structure 610 is provided at both the first corner structure 510 and the second corner structure 520 in the embodiment of the present application. At this time, the length R1 of the first anti-backflow structure 610 in the first direction 410 is the sum of the lengths of the two first anti-backflow structures 610 at the first corner structure 510 and the second corner structure 520 in the first direction 410, that is Figure 8 in which R1 is equal to the sum of R1a and R1b. The length R11 of the first anti-backflow structure 610 in the second direction 420 is the sum of the lengths of the two first anti-backflow structures 610 at the first corner structure 510 and the second corner structure 520 in the second direction 420, that is Figure 8 in which R11 is equal to the sum of R11a and R11b.

[0082] R1 may be equal to or different from R11; when R1 is equal to R11, R1 is greater than or equal to half of H1, that is, the length of the first anti-backflow structure 610 in the first direction 410 is equal to the length of the first anti-backflow structure 610 in the second direction 420, and is greater than or equal to the distance between the air distribution part 200 and the top plate 112 along the first direction 410. When R1 is different from R11, the larger one of R1 and R11 is greater than or equal to half of H1, that is, the larger one of the length R1 of the first anti-backflow structure 610 in the first direction 410 and the length R11 of the first anti-backflow structure 610 in the second direction 420 is greater than or equal to the distance between the air distribution part 200 and the top plate 112 along the first direction 410.

[0083] In a possible implementation manner, as shown in FIG. 10(a), a second anti-backflow structure 620 is provided at the third corner structure 530 in the embodiment of the present application; or, as shown in FIG. 10(b), a second anti-backflow structure 620 is provided at the fourth corner structure 540 in the embodiment of the present application. The second anti-backflow structure 620 in the embodiment of the present application is located in the edge space of the second sub-cavity 320. Specifically, the second anti-backflow structure 620 may be a rounded corner or a chamfer, and is filled at the corner structure of the edge space of the sub-cavity. The second anti-backflow structure 620 is located at the connection between the air distribution part 200 and the side plate 113 in the second sub-cavity 320, or the second anti-backflow structure 620 is located at the connection between the bottom plate 123 and the side plate 113 in the second sub-cavity 320.

[0084] In a possible implementation manner, as shown in FIGS. 10(a) and 10(b), the direction in which the air distribution part 200 of the embodiment of the present application faces the bottom plate 123 is the third direction 430, and the direction in which the outermost ring of air outlet holes 121 on the bottom plate 123 faces the side plate 113 is the fourth direction 440.

[0085] In the embodiment of the present application, the length of the second anti-backflow structure 620 in the third direction 430 is R2, and the length of the second anti-backflow structure 620 in the fourth direction 440 is R22. The larger one of R2 and R22 is greater than or equal to half of H2. The second anti-backflow structure 620 is filled at the corner structure of the edge space of the second sub-cavity 320 and can be in a shape similar to a rounded corner or a chamfer as shown in FIGS. 10(a) and 10(b). The length of the portion of the second anti-backflow structure 620 in contact with the side plate 113 in the third direction 430 is R2, and the length of the portion of the second anti-backflow structure 620 in contact with the air distribution portion 200 in the fourth direction 440 is R22. R2 may or may not be equal to R22. When R2 is equal to R22, R2 is greater than or equal to half of H1, that is, the length of the second anti-backflow structure 620 in the third direction 430 is equal to the length of the second anti-backflow structure 620 in the fourth direction 440 and is greater than or equal to the distance between the air distribution portion 200 and the top plate 112 in the third direction 430. When R2 and R22 are not equal, the larger one of R2 and R22 is greater than or equal to half of H2, that is, the larger one of the length R2 of the second anti-backflow structure 620 in the third direction 430 and the length R22 of the second anti-backflow structure 620 in the fourth direction 440 is greater than or equal to the distance between the air distribution portion 200 and the bottom plate 123 in the third direction 430.

[0086] In a possible implementation, referring to Figure 11 as shown, the second anti-backflow structure 620 is provided at both the third corner structure 530 and the fourth corner structure 540 in the embodiment of the present application. At this time, the length R2 of the second anti-backflow structure 620 in the third direction 430 is the sum of the lengths of the two second anti-backflow structures 620 at the third corner structure 530 and the fourth corner structure 540 in the third direction 430, that is Figure 11 in which R2 is equal to the sum of R2a and R2b.

[0087] The length R2 of the second anti-backflow structure 620 in the fourth direction 440 is the sum of the lengths of the two second anti-backflow structures 620 at the third corner structure 530 and the fourth corner structure 540 in the fourth direction 440, that is Figure 11In this case, R22 is equal to the sum of R22a and R22b. R2 may or may not be equal to R22; when R2 is equal to R22, R2 is greater than or equal to half of H2, that is to say, the length of the second anti-backflow structure 620 in the third direction 430 is equal to the length of the second anti-backflow structure 620 in the fourth direction 440, and is greater than or equal to the distance between the air distribution part 200 and the top plate 112 along the third direction 430. When R2 is not equal to R22, the larger one of R2 and R22 is greater than or equal to half of H2, that is to say, the larger one of the length R3 of the second anti-backflow structure 620 in the third direction 430 and the length R33 of the second anti-backflow structure 620 in the fourth direction 440 is greater than or equal to the distance between the air distribution part 200 and the top plate 112 along the third direction 430.

[0088] In a possible implementation manner, referring to Figure 12 as shown, on the side wall of the air inlet hole 111 in the embodiment of the present application close to the air distribution part 200, there is a flow field control structure 630. The flow field control structure 630 may be a chamfer or a fillet on the side wall of the air inlet hole 111 close to the air distribution part 200. The flow field control structure 630 can reduce the volume of the vortex generated in the inner edge space of the cavity 300. It should be noted that Figure 12 only shows the relative positional relationship between the top plate 112, the air inlet hole 111 and the air distribution part 200, only shows the components related to the flow field control structure 630, and other components are omitted.

[0089] In a possible implementation manner, referring to Figure 12 as shown, in the embodiment of the present application, the direction of the air distribution part 200 facing the air inlet hole 111 is the fifth direction 450; in the embodiment of the present application, it is exemplified that the top plate 112 is a circular plate and the air distribution part 200 is also a circular plate. The top plate 112 and the air distribution part 200 are arranged in parallel. There is an air inlet hole 111 on the top plate 112. The direction of the area of the air distribution part 200 facing the air inlet hole towards the top plate 112 is the fifth direction 450. At this time, the fifth direction 450 is perpendicular to the air distribution part 200. From the air distribution part 200 towards the air inlet hole 111, referring to Figure 12 the fifth direction 450 shown in; the direction parallel to the air distribution part 200 perpendicular to the fifth direction 450 is the sixth direction 460.

[0090] In the embodiment of the present application, the height of the upper space edge space formed by the air inlet hole 111 on the top plate 112 and the air distribution part 200 is H3, that is, at the air inlet hole 111, the distance between the air distribution part 200 and the top plate 112 along the fifth direction 450 is H3.

[0091] In the flow field control structure 630 in the embodiment of the present application, the length in the fifth direction 450 is R3, and the length in the sixth direction 460 is R33. The larger of R3 and R33 is greater than or equal to half of H3. The flow field control structure 630 is located on the side of the side wall of the air inlet hole 111 close to the air distribution part 200, and can be in a shape similar to a rounded corner or a chamfer as shown in Figure 12 . The length of the flow field control structure 630 in the fifth direction 450 is R3, and the length of the flow field control structure 630 in the sixth direction 460 is R33. R3 can be equal to or not equal to R33. When R3 is equal to R33, R3 is greater than or equal to half of H3, that is to say, the length of the flow field control structure 630 in the fifth direction 450 is equal to the length of the flow field control structure 630 in the sixth direction 460, and is greater than or equal to half of the distance between the air distribution part 200 and the air inlet hole 111 along the fifth direction 450. When R3 is not equal to R33, the larger of R3 and R33 is greater than or equal to half of H3, that is to say, the larger of the length R1 of the flow field control structure 630 in the fifth direction 450 and the length R11 of the flow field control structure 630 in the sixth direction 460 is greater than or equal to half of the distance between the air distribution part 200 and the air inlet hole 111 along the fifth direction 450.

[0092] In a possible implementation manner, referring to Figure 13 , the air distribution device in the embodiment of the present application further includes a temperature control device 500. The temperature control device 500 is connected to the housing 100 and is used to control the temperature of the housing 100.

[0093] In some application scenarios, it is necessary to adjust and control the temperature of the air distribution device, including heating or cooling the air distribution device, etc. The temperature control device 500 can heat or cool the air distribution device according to process requirements. The temperature control device 500 in the embodiment of the present application includes a heating unit and a cooling unit. The heating unit can be an electric heating tube, and the cooling unit can be components such as a coolant circuit. The heating unit and the cooling unit can be integrated on one component to form a temperature control board. The two units and the temperature control board are designed to be detachable or integrated. At the contact interface between the heating unit, the cooling unit and the temperature control board, an interface heat conduction material can be optionally installed, including graphite sheets, thermal conductive silicone or silicone grease materials, etc.

[0094] In a possible implementation manner, the embodiment of the present application provides a gas processing device. The gas processing device in the embodiment of the present application may be a semiconductor device, including the gas distribution device in any of the above embodiments. The gas processing device further includes a tray 700. The gas processing device provided by the embodiment of the present application can be used for thin film deposition, such as chemical vapor deposition and atomic layer deposition, etc.; or the gas processing device provided by the embodiment of the present application can also be used in the etching field.

[0095] This embodiment will be described by taking a thin film deposition device as an example. Refer to Figure 14 As shown, the gas processing device in the embodiment of the present application includes the gas distribution device in any of the above embodiments, and further includes an outer casing 600 and a tray 700. The outer casing 600 can be hermetically connected to the gas distribution device. The outer casing 600 has a receiving cavity. The air outlet hole 121 of the gas distribution device and the tray 700 are located in the receiving cavity. The air outlet direction of the air outlet hole 121 of the gas distribution device faces the tray 700. The gas distribution device can spray gas onto the object in the tray 700 for thin film deposition. For example, in processes such as chemical vapor deposition and atomic layer deposition, wafers can be placed on the tray 700 in the receiving cavity. The gas flows through the gas distribution device through a pipeline. Under the action of the gas distribution part 200 in the gas distribution device, the gas enters the receiving cavity through the gas distribution device, reaches the surface of the wafer, and forms a thin layer on the surface of the substrate under the action of factors such as temperature.

[0096] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A gas homogenizing device, characterized in that: include: The housing comprises a first enclosure and a second enclosure, wherein the first enclosure and the second enclosure form a cavity, the first enclosure is provided with an air inlet, and the second enclosure is provided with an air outlet; An air-uniform part, located in the cavity and dividing the cavity into two sub-cavities, and having a plurality of air-uniform holes; The multiple air uniforming holes on the air uniforming portion are distributed in annular areas surrounding the air inlet and nested inside and outside. In two adjacent annular areas, the opening rate of the air uniforming holes in the outer annular area is greater than the opening rate of the air uniforming holes in the inner annular area.

2. The gas homogenizing device according to claim 1, characterized in that: In any two adjacent annular regions, the number of the uniform air holes in the outer annular region is greater than the number of the uniform air holes in the inner annular region; And / or, the area of ​​the air-uniform holes in the outer annular region is larger than the area of ​​the air-uniform holes in the inner annular region.

3. The gas homogenizing device according to claim 1 or 2, characterized in that: The air uniforming portion is sealed and connected to the first enclosure portion or the second enclosure portion.

4. The gas homogenizing device according to any one of claims 1 to 3, characterized in that: An air intake area is provided on the air uniforming portion, and a projection area of ​​the air intake hole on the air uniforming portion along the air intake direction is located in the air intake area.

5. The gas homogenizing device according to any one of claims 1 to 4, characterized in that: The spacing between any two adjacent air-uniform holes in the same annular region is equal; And / or, the annular region includes a circular region, and in the same annular region, the distances from the air-uniform holes to the center of the circular region are equal.

6. The gas homogenizing device according to any one of claims 1 to 5, characterized in that: Among the multiple annular regions, the number of the air-uniform holes in the innermost annular region is in the range of 3 to 5, and the number of the air-uniform holes in the outermost annular region is in the range of 6 to 40.

7. The gas homogenizing device according to any one of claims 1 to 6, characterized in that: The air-uniform holes include circular holes. Among the multiple annular areas, the diameter of the air-uniform holes in the innermost annular area is in the range of 1 mm to 10 mm, and the diameter of the air-uniform holes in the outermost annular area is in the range of 15 mm to 30 mm.

8. The gas homogenizing device according to any one of claims 1 to 7, characterized in that: The second enclosing portion includes a plurality of the air outlet holes; The plurality of air outlet holes on the second enclosing portion are arranged in an annular manner with inner and outer nesting, and the area where the air outlet holes in a circle of annular distribution are located is a second annular area, and the areas of the air outlet holes in the same second annular area are equal; In two adjacent second annular regions, the number of the air outlet holes in the outer second annular region is greater than the number of the air outlet holes in the inner second annular region, and / or the area of ​​the air outlet holes in the outer second annular region is greater than the area of ​​the air outlet holes in the inner second annular region.

9. The gas homogenizing device according to any one of claims 1 to 8, characterized in that: The first enclosure portion includes a top plate and a side plate, the air uniforming portion is connected to the side plate, the sub-cavity between the air uniforming portion and the top plate is a first sub-cavity, the top plate and the side plate are connected in the first sub-cavity to form a first corner structure, the air uniforming portion and the side plate are connected in the first sub-cavity to form a second corner structure, and the first corner structure and / or the second corner structure are provided with a first anti-backflow structure; And / or, the first enclosure portion includes a side panel, the second enclosure portion includes a bottom plate, the cavity between the air uniforming portion and the bottom plate is a second sub-cavity, the air uniforming portion and the side panel are connected in the second sub-cavity to form a third corner structure, the bottom plate and the side panel are connected in the second sub-cavity to form a fourth corner structure, and a second anti-backflow structure is provided at the third corner structure and / or the fourth corner structure.

10. The gas homogenizing device according to claim 9, characterized in that: The direction of the air uniformity holes on the outermost ring of the air uniformity part toward the side plate is the second direction, and the direction of the air uniformity part toward the top plate is the first direction; The distance between the air-leveling holes in the outermost ring of the air-leveling part and the side plate along the second direction is C1, and the distance between the air-leveling part and the top plate along the first direction is H1, and C1 is less than or equal to twice of H1; And / or, the distance between the air outlet on the bottom plate close to the side plate and the side plate along the second direction is C2, the distance between the air uniforming portion and the bottom plate along the first direction is H2, and C2 is less than or equal to twice H2.

11. The gas homogenizing device according to claim 9 or 10, characterized in that: The length of the first anti-backflow structure in the first direction is R1, and the length of the first anti-backflow structure in the second direction is R11, and the larger one of R1 and R11 is greater than or equal to half of H1; And / or, the length of the second anti-backflow structure in the first direction is R2, the length of the second anti-backflow structure in the second direction is R22, and the larger one of R2 and R22 is greater than or equal to half of H2.

12. The gas homogenizing device according to any one of claims 1 to 11, characterized in that: A side wall of the air inlet hole close to the air uniforming portion is provided with a chamfer or a rounded corner.

13. The gas homogenizing device according to claim 12, characterized in that: The direction of the air uniforming portion toward the air inlet is a third direction; the distance between the air uniforming portion and the air inlet in the third direction is H3; The length of the chamfer or rounded corner in the third direction is R3, and R3 is greater than or equal to half of H3.

14. The gas homogenizing device according to any one of claims 1 to 13, characterized in that: The gas homogenizing device further comprises a temperature control device, which is connected to the shell and is used to control the temperature of the shell.

15. A gas processing device, characterized in that: The gas treatment device comprises the gas homogenizing device according to any one of claims 1 to 14, wherein the gas treatment equipment further comprises a tray, and the gas outlet direction of the gas outlet hole of the gas homogenizing device is toward the tray.

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