Thermal image camera

Abstract

Disclosed is a thermal image camera (100) having a housing (110), having an infrared structure group (140) for detecting infrared radiation, having a visual structure group (160) for receiving visual radiation, and having at least one cooling element (180) at least for cooling the infrared structure group (140), the set of infrared structures (140) and the set of visual structures (160) are substantially disposed within the housing (110). According to the invention, the thermal image camera (100) has a sensor holder (500), which is designed to connect the infrared group (140) to the cooling element (180).

Description

Field of the Invention

[0001] The present invention relates to a thermal imaging camera. Background Art

[0002] A handheld thermal imaging camera for non-contact acquisition of two-dimensional temperature information of a scene is known from DE 10 2016 219 388 A1. The handheld thermal imaging camera has a housing which has at least one infrared detector array composed of a plurality of pixels sensitive to infrared radiation. Summary of the Invention

[0003] The present invention starts from a thermal imaging camera which has a housing, an infrared structure group for detecting infrared radiation, a visual structure group for receiving visual radiation and at least one cooling element which is at least used for cooling the infrared structure group, wherein the infrared structure group and the visual structure group are basically arranged in the housing. It is proposed that the thermal imaging camera has a sensor support which is configured to connect the infrared structure group with the cooling element.

[0004] The present invention provides a thermal imaging camera in which thermal influence can be reduced in such a way that the sensor support connects the infrared structure group with the cooling element.

[0005] A "thermal imaging camera" refers to a device for non-contact measurement of two-dimensional temperature information of a scene when at least outputting information related to two-dimensional temperature information, for example when outputting one or more temperature specifications. The one or more temperature specifications are advantageously two or more temperature values, temperature distributions or the like. In one embodiment of the thermal imaging camera, the two-dimensional temperature information can exist in the form of a thermal image which consists of a plurality of location-resolved and / or spatially angularly resolved temperature measurement values.

[0006] The thermal imaging camera can be configured as a handheld thermal imaging camera. A "handheld" thermal imaging camera should in particular be understood to mean that the thermal imaging camera can be transported only by means of the user's hand, in particular by means of one hand of the user, without the assistance of a transport device. In particular, the thermal imaging camera can also be guided through space in a handheld manner during the measurement process in a movement freely performed by the user of the thermal imaging camera. The mass of the handheld thermal imaging camera is in particular less than 5 kg, advantageously less than 3 kg and particularly advantageously less than 1 kg.

[0007] The housing can be configured as a housing-type housing having two half-shells. The housing has a handle or a handle area by means of which the thermal imaging camera can be guided by the user. The housing receives at least the important functional components of the thermal imaging camera. Thus, the infrared structure group and the visual structure group are basically arranged within the housing. In addition, the front support, the cooling element, the positioning device and / or the sensor support can be basically arranged within the housing. In addition, the housing receives at least one control unit, an input device and / or an output device (in particular a display device), an energy supply unit and an analysis and processing unit. The thermal imaging camera can have at least one operating element which is configured to operate the thermal imaging camera. In addition, the housing can have at least one access opening into which visual radiation and / or infrared radiation can enter.

[0008] The front support can be received by the housing. Here, the front support can enclose the housing with respect to the environment. The functional components of the thermal imaging camera can be basically protected within the housing against environmental influences. The front support has openings for the infrared structure group and the visual structure group. The front support has a receiving portion for the visual structure group. The receiving portion for the visual structure group is configured to at least partially surround the visual structure group. The visual structure group can abut against the receiving portion of the front support by means of an end face. It is possible that the visual structure group abuts against the front support, in particular against the receiving portion of the front support, by means of visual optics. The front support can be made of a heat-conducting material, for example aluminium.

[0009] The visual structure group includes at least one visual camera for taking at least one image and / or video in the visible spectral range of the radiation, an optics for the visual camera and a circuit board for the visual camera. The visual structure group, in particular the circuit board for the visual camera, is connected in terms of signal technology to the control unit. The optics for the visual camera is configured to refract, converge and / or focus the visual radiation and conduct it to the visual camera.

[0010] In addition, the front support has a further receiving portion. The further receiving portion of the front support can have an adhesive layer or an adhesive pad. The further receiving portion of the front support is configured to receive at least one infrared window and / or a glass plate for the visual structure group. In addition, it is possible that the further receiving portion of the front support receives, for example, a laser and a lens for a light source (such as an LED). In addition, a seal can be applied to and / or adhered to the front support.

[0011] The infrared structure group may have an infrared housing, an infrared sensor, infrared optics, and / or an infrared circuit board. The infrared housing is configured to arrange the infrared optics relative to the infrared sensor. The infrared sensor may be configured as an infrared detector array. It is also conceivable that the infrared sensor is configured as a bolometer, in particular a microbolometer. For measuring infrared radiation, the thermal imaging camera has an infrared structure group and an analysis and processing unit. The infrared sensor has a plurality of pixels sensitive to infrared radiation. The infrared sensor detects the infrared radiation radiated in a spatial angular range and projected onto the surface of the infrared sensor, and generates a detection signal based on the detected intensity of the incident infrared radiation. The infrared sensor has a two-dimensional detection surface on the surface facing the scene, and a plurality of pixels sensitive to infrared radiation are arranged on the two-dimensional detection surface. Here, each pixel in the pixels of the infrared detector array can, on the premise of being irradiated with infrared radiation, obtain image information and thus generate a detection signal. Next, the detection signal provided by each pixel can be used to determine temperature information. In particular, the detection signal of each pixel can be forwarded to the analysis and processing unit of the thermal imaging camera. The detection signal can be analyzed and processed by the analysis and processing unit individually and / or in combination with the detection signals of other pixels. The infrared optics is configured to refract, converge, and / or focus the infrared radiation and conduct it to the infrared sensor. The infrared sensor may be arranged on the infrared circuit board. Thus, the infrared sensor may be arranged between the infrared circuit board and the infrared optics. The infrared circuit board is connected in terms of signal technology to the control unit and / or the analysis and processing unit, so that the detection signal can be conducted from the infrared structure group to the control unit and / or the analysis and processing unit. The infrared structure group may at least partially engage into the recess of the front bracket. Here, the infrared structure group may be engaged into the recess by means of the infrared optics. The infrared structure group may define an optical axis, which may be the main incident direction of the infrared radiation. In particular, "axial" should be understood as being substantially parallel to the optical axis. And "radial" should be understood as being substantially perpendicular to the optical axis.

[0012] The thermal imaging camera has a control unit, which is at least used to control the infrared structure group and / or the visual structure group. For this purpose, the control unit is connected in terms of signal technology to at least the infrared structure group and the visual structure group. In addition, the control unit is connected in terms of signal technology to the analysis and processing unit. For example, the control unit may be arranged in the handle of the hand-held power tool, in the area of the energy supply interface, or in the area of the infrared structure group and / or the visual structure group. The control unit has at least one main circuit board. The main circuit board may be arranged opposite to the front bracket. For example, the main circuit board may be arranged in the direction towards the output device.

[0013] The "analysis and processing unit" of the thermal imaging camera should be understood as the following unit: This unit has at least one information input terminal for receiving detection signals, an information processing unit for processing, in particular analyzing and processing, the received detection signals, and an information output section for transmitting the processed and / or analyzed detection signals and / or analysis and processing information. Advantageously, the analysis and processing unit has the following components: The components include at least one processor, a memory, and a running program with analysis and processing routines and calculation routines. In particular, the electronic components of the analysis and processing unit can be arranged on a circuit board or a printed circuit board, preferably arranged together with the control unit of the thermal imaging camera for controlling the thermal imaging camera on a common circuit board. In addition, the control unit and the analysis and processing unit can also be implemented as a single component, for example, a single component in the form of a microcontroller. The analysis and processing unit is set to receive, analyze and process the detection signals generated by the infrared detector array, in particular the detection signals of the pixels that can be connected to the analysis and processing unit in terms of signal technology, and perform the analysis and processing of the two-dimensional temperature information of the scene based on the detection signals of at least a plurality of irradiated pixels of the infrared detector array. Preferably, the analysis and processing unit is set to perform the analysis and processing of one or more temperature measurement values, in particular also the average temperature measurement value, and particularly preferably the thermal image, based on the detection signals of at least a plurality of irradiated pixels. In this way, the analysis and processing unit is used to obtain two-dimensional temperature information, in particular a thermal image, from the measured infrared radiation. The analyzed two-dimensional temperature information, in particular the thermal image, can be provided by the analysis and processing unit to the user of the thermal imaging camera by means of an output device and / or to an external device by means of a data communication interface for further processing and / or output.

[0014] The output device is configured to show the two-dimensional temperature information, in particular the thermal image, and provide and display information to the user. The output device can be configured as a display, for example. The output device can be arranged on the housing opposite to the front bracket. For example, the output device can reproduce the image or video of the visual structure group and / or the detection signals of the infrared structure group.

[0015] The input device is configured to receive the input of the user and forward the input at least to the control unit. The input device can have at least one operating element. For example, the operating element can be configured to turn on and / or turn off the thermal imaging camera, take a photo of the scene, set the operating mode, or activate other functions of the thermal imaging camera.

[0016] Arrange the device to mechanically arrange the visual structure group relative to the infrared structure group. Exemplarily, the device can be configured as a frame, a housing, or a tank. The device can be shaped around the optical axis. Additionally, the device is configured to thermally insulate the infrared structure group from the visual structure group. Additionally, the device is configured to reduce interfering radiation onto the infrared structure group. The device is substantially made of a non-conductive, i.e., thermally insulating, material. Here, the device can decouple the cooling element from the front bracket.

[0017] The energy supply unit is arranged for battery operation by means of a battery, for battery operation by means of an accumulator, in particular a battery pack for a hand-held power tool, and / or for mains operation. The energy supply unit is arranged for at least supplying energy to the thermal imaging camera. In a preferred embodiment, the energy supply is configured for battery operation. In the context of the present invention, a "battery pack for a hand-held power tool" should be understood as the combination of at least one battery cell and a battery pack housing. Advantageously, the battery pack for a hand-held power tool is configured for supplying energy to a commercially available battery-operated hand-held power tool. For example, at least one battery cell can be configured as a lithium-ion battery cell with a rated voltage of 3.6 V. Exemplarily, the battery pack for a hand-held power tool can include up to ten battery cells, where different numbers of battery cells can also be considered. The implementation of a battery-operated hand-held power tool and the operation of a hand-held power tool in mains operation are sufficiently known to a person skilled in the art, and therefore, the details of the energy supply are not discussed here.

[0018] The sensor bracket connects the infrared structure group to the cooling element. The cooling element is configured to cool at least the infrared structure group. Here, the cooling element dissipates heat from the infrared structure group. Here, the cooling element can be arranged opposite to the front bracket, in particular substantially arranged within the housing. The cooling element can be arranged axially along the optical axis between the front bracket and the output device. The cooler element is made of a thermally conductive material. The cooling element absorbs heat from at least the visual structure group and the infrared structure group and dissipates the heat in order to reduce, in particular minimize, the thermal interference effect. The sensor bracket is configured to protect the infrared structure group from mechanical influences, such as impacts. The sensor bracket is configured such that mechanical influences on the infrared structure group can be absorbed by the sensor bracket and conducted to the cooling element. Additionally, the sensor bracket protects the infrared structure group from the influence of thermal interference parameters. Thus, the sensor bracket protects the infrared structure group from substantially direct thermal radiation onto the infrared structure group. The thermal interference parameters can be absorbed by the sensor bracket and evenly distributed onto the cooling element.

[0019] In one embodiment of a thermal imaging camera, the sensor support has an infrared structure group receiving part, which is configured to receive an infrared structure group and arrange the infrared structure group relative to a cooling element. The infrared structure group receiving part can at least partially receive the infrared structure group. In addition, the infrared structure group receiving part can at least partially surround the infrared structure group. The infrared structure group can be, for example, screwed, glued, clamped or latched to the infrared structure group receiving part. For example, the infrared structure group receiving part can be configured in the form of a shell, a can or a shaft.

[0020] In one embodiment of a thermal imaging camera, the thermal imaging camera has at least one heat conducting element, which is arranged between the infrared structure group and the sensor support. The heat conducting element can be arranged axially between the infrared structure group and the sensor support relative to the optical axis. Here, the heat conducting element can be arranged between the infrared circuit board and the sensor support. The heat conducting element is configured to conduct heat from the infrared structure group to the cooling element. The heat conducting element is made of a heat conducting material. The heat conducting element can be arranged substantially in the infrared structure group receiving part. The heat conducting element avoids point-like heat transfer and enables a uniform heat distribution to the cooling element.

[0021] In one embodiment of a thermal imaging camera, the infrared structure group receiving part is configured to receive the heat conducting element. The infrared structure group receiving part receives the heat conducting element, wherein the heat conducting element can be received at least form-locked. It can be considered that the heat conducting element is connected to the infrared structure group receiving part material-locked. The heat conducting element is arranged axially between the infrared structure group receiving part and the infrared structure group in particular. The heat conducting element abuts against the infrared structure group receiving part. The heat conducting element abuts against the infrared structure group, in particular the infrared circuit board.

[0022] In one embodiment of a thermal imaging camera, the sensor support has at least one line guide which is configured to guide at least one line of an infrared structure group. The line guide is configured to guide the line of the infrared structure group in the direction towards the control unit. Here, the line of the infrared structure group should be able to be guided as unobstructed as possible from the infrared structure group in the direction towards the control unit in order to avoid absorbing thermal interference effects. The sensor support can form the line guide. For example, the sensor support can be connected to the line guide or be integrally formed. For example, the line guide can be configured as an opening, a shaft or a notch. Here, the line guide can be configured, for example, circularly, elliptically or polygonal. A covering element can be provided above the line guide. The covering element is configured to avoid an air flow through the line guide. For example, the covering element can be made of foam material or the like. The covering element can be connected to the line guide in a material-locking manner. In addition, the covering element is configured to reduce the mechanical stress on the infrared structure group connector in the case of mechanical movement of the line of the infrared structure group, for example in the case of the thermal imaging camera falling down.

[0023] In one embodiment of a thermal imaging camera, the sensor support has at least one line fixing part which fixes at least the line of the infrared structure group at least partially on the sensor support. The line fixing part fixes the line of the infrared structure group such that in the case of movement of the thermal imaging camera, for example in the case of the thermal imaging camera falling down, the line of the infrared structure group remains substantially fixed in the housing. This can avoid thermal and / or electrical contact between components. For example, the line fixing part can be configured in the form of a buckle strap (Spange), wherein other forms can be considered. For example, the line fixing part can have an adhesive pad which connects the line fixing part to the sensor support. The line fixing part can be connected to the sensor support at least form-locked, wherein force-locking and / or material-locking can also be considered.

[0024] In one embodiment of a thermal imaging camera, a cooling element forms the sensor support. The cooling element and the sensor support can be integrally formed. Here, the infrared circuit board can then be arranged axially between the infrared optics and the cooling element with respect to the optical axis. In addition, a heat conducting element can be arranged between the infrared optics and the cooling element.

[0025] In one embodiment of the thermal imaging camera, the cooling element has at least one cooling fin. A plurality of cooling fins can be provided. It is possible to provide, for example, two, three, four or more than four cooling fins. The cooling fins can surround the infrared structure group circuit. It is possible that the infrared structure group circuit can be guided through three of the cooling fins. For example, the cooling fins can extend in the direction of the control unit along the optical axis. For example, the cooling fins can be configured in a T-shape, double-T shape, F-shape, I-shape or L-shape.

[0026] In one embodiment of the thermal imaging camera, at least two of the cooling fins are configured to face each other. Here, the two cooling fins can be spaced apart from each other radially with respect to the optical axis.

[0027] In one embodiment of the thermal imaging camera, the cooling element has at least one cuboid cooling hollow body. The cuboid cooling hollow body can extend axially along the optical axis. The cooling hollow body can be connected to the cooling element in a form-fitting, force-fitting and / or material-fitting manner. It is possible that the cooling element is configured to form the cooling hollow body such that the cooling element and the cooling hollow body are integral. For example, two cooling hollow bodies are provided, and it is also possible to consider more than two cooling hollow bodies. The cooling hollow body can be arranged radially, especially offset with respect to the optical axis, from the cooling fins. The cooling fins and the cooling hollow body can form the geometry of the cooling body. The cooling element can form not only the cooling fins but also the cooling hollow body. Description of the Drawings

[0028] Hereinafter, the present invention will be described according to a preferred embodiment. The following drawings show:

[0029] Figure 1a A schematic front view of a thermal imaging camera according to the present invention;

[0030] Figure 1b A schematic rear view of a thermal imaging camera according to the present invention;

[0031] Figure 2 A fragment of a longitudinal section of the thermal imaging camera;

[0032] Figure 3 An exploded view showing the front bracket, the arrangement device, the sensor bracket, the cooling element, the infrared structure group and the vision structure group;

[0033] Figure 4a A perspective view showing the infrared structure group, the sensor bracket and the cooling element;

[0034] Figure 4b A side view showing the infrared structure group, the sensor bracket and the cooling element;

[0035] Figure 5a Front view showing the sensor bracket and the cooling element;

[0036] Figure 5b Perspective rear view showing the cooling element; Detailed description of the invention

[0037] Figure 1a Schematic front view showing the thermal imaging camera 100 according to the invention, wherein Figure 1b Schematic rear view showing the thermal imaging camera 100. Here, by way of example, the thermal imaging camera 100 is shaped as a hand-held thermal imaging camera 100. The thermal imaging camera 100 includes a housing 110, a front bracket 120, an infrared structure group 140 for detecting infrared radiation, a visual structure group 160 for receiving visual radiation, and at least one cooling element 180 for cooling at least the infrared structure group 140, see also Figure 2 to FIG. 5. The infrared structure group 140 and the visual structure group 160 are substantially arranged within the housing 110. The thermal imaging camera 100 includes an arrangement device 200, see also Figure 2 and Figure 3 . The arrangement device 200 is arranged to arrange the visual structure group 160 relative to the infrared structure group 140. The thermal imaging camera 100 includes a sensor bracket 500, see also Figure 2 to FIG. 5. The sensor bracket 500 is arranged to connect the infrared structure group 140 to the cooling element 180.

[0038] The housing 110 is shaped as a shell-type housing having two half-shells. The housing 110 includes a handle 112. The front bracket 120, the cooling element 180 and the arrangement device 200 are substantially arranged within the housing 110, see also Figure 2 and Figure 3 . The housing 110 houses a control unit 300, an input device 310, an output device 320, an energy supply unit 330 and an analysis and processing unit (not shown). The input device 310 includes, for example, five operating elements 311, 312, 313, 314, 315, see also Figure 1bFive operating elements 311, 312, 313, 314, 315 are provided for operating the thermal imaging camera 100. The first operating element 311 is configured as a trigger by means of which an image can be taken. The second operating element 312 is configured as a button by means of which the user can switch on or off the thermal imaging camera 100 and can call up a menu selection. The third operating element 313 and the fourth operating element 314 are configured for switching between operating modes within a menu selection. The fifth operating element 315 is configured for confirming and activating the desired operating mode. Here, the occupancy of the operating elements 311, 312, 313, 314, 315 is mentioned by way of example such that it is clear to the person skilled in the art that the occupancy can also be different. The output device 320 is provided for showing two-dimensional temperature information, in particular a thermal image, providing and displaying information to the user. By way of example, the output device 320 is configured as a display 322, see Figure 1b The output device 320 is arranged on the housing 110 opposite the front support 120. The energy supply unit 330 is configured for battery operation by means of a hand-held power tool battery pack 332. The energy supply unit 330 is configured for at least supplying energy to the thermal imaging camera 100. The housing includes an access opening 111. Visual radiation and / or infrared radiation can enter into the access opening 111. The infrared structure group 140 defines an optical axis 102 which is the main incident direction of infrared radiation and / or visual radiation through the access opening 111.

[0039] Figure 2 A fragment 400 of a longitudinal section of the thermal imaging camera 100 is shown. The cooling element 180 is configured for cooling at least the infrared structure group 140, wherein the cooling element is made of a thermally conductive material. The cooling element 180 is arranged opposite the front support 120. The cooling element 180 is arranged axially along the optical axis 102 between the front support 120 and the output device 300. The housing 110 receives the front support 120. The front support 120 includes an opening 121 for the infrared structure group and an opening 122 for the visual structure group 160. The front support 120 includes a receiving portion 123 for the visual structure group 160. The receiving portion 123 for the visual structure group 160 at least partially surrounds the visual structure group 160. The visual structure group 160 abuts against the receiving portion 123 of the front support 120 by means of an end face 161. The visual structure group 160 abuts against the front support 120 by means of a visual optical device 162. The visual structure group 160 has a visual camera 164 for taking at least one image and / or video in the visual spectrum of the radiation, an optical device 162 for the visual camera 164, and a circuit board 166 for the visual camera 164. The visual structure group 160, in particular the circuit board 166 for the visual camera 164, is connected to the control unit 300 in terms of signal technology by means of a cable 168.

[0040] The infrared structure group 140 includes an infrared housing 142, an infrared sensor 144, infrared optics 146, an infrared circuit board 148, and infrared structure group circuitry 150. The infrared housing 142 positions the infrared optics 146 relative to the infrared sensor 144. The infrared sensor 144 is shaped as an infrared detector array. For measuring infrared radiation, the thermal imaging camera 100 includes the infrared structure group 140 and an analysis and processing unit. The infrared structure group 140 is connected to the analysis and processing unit by means of the infrared structure group circuitry 150, where, herein, the control unit 300 has this analysis and processing unit. The infrared optics 146 focuses the infrared radiation incident through the entry opening 111 and forwards this infrared radiation to the infrared sensor 144. The infrared sensor 144 is arranged on the infrared circuit board 148, where the infrared sensor 144 is arranged between the infrared circuit board 148 and the infrared optics 146. The infrared circuit board 148 is connected to the control unit 300 by means of the infrared structure group circuitry 150. The infrared structure group 140 is at least partially embedded in the notch 124 of the front support 120, where the infrared structure group 140 is embedded in the notch 124 by means of the infrared optics 146.

[0041] The control unit 300 is connected to the infrared structure group 140 in terms of signal technology by means of the infrared structure group circuitry 150 and is connected to the visual structure group 160 by means of a cable 168. The control unit 300 includes a main circuit board 302, which is arranged opposite the front support 120. The main circuit board 302 is arranged, in particular axially relative to the optical axis 102, between the front support 120 and the output device 320. In addition, the main circuit board 302 is arranged, in particular axially relative to the optical axis 102, between the cooling element 180 and the output device 320.

[0042] The positioning device 200 is shaped for mechanically positioning the visual structure group 160 relative to the infrared structure group 140. Exemplarily, the positioning device 200 is shaped as a frame 210, also see Figure 3 . The positioning device 200 is arranged around the optical axis 102 and thermally insulates the infrared structure group 140 from the visual structure group 160. The positioning device 200 thermally decouples the cooling element 180 from the front support 120. The positioning device 200 is arranged axially along the optical axis 102 between the front support 120 and the cooling element 180.

[0043] The sensor support 500 includes an infrared structure group receiving part 510. The infrared structure group receiving part 510 is shaped to receive the infrared structure group 140 and arrange the infrared structure group relative to the cooling element 180. The infrared structure group receiving part 510 at least partially receives the infrared structure group 140. The infrared structure group receiving part 510 at least partially surrounds the infrared structure group 140, also see Figure 3 and FIG. 4. For example, the infrared structure group 140 is screwed to the infrared structure group receiving part 510. For example, the infrared structure group receiving part 510 is shaped as a housing 512, also see Figure 3 to FIG. 5. Here, by way of example, the housing 512 is configured to have two steps 514 facing each other, see FIG. 5. The thermal imaging camera 100 includes a heat conducting element 520. The heat conducting element is arranged between the infrared structure group 140 and the sensor support 510, wherein the heat conducting element 520 is axially arranged between the infrared circuit board and the sensor support 500 relative to the optical axis 102. The heat conducting element 520 conducts heat from the infrared structure group 140 to the cooling element 180. The heat conducting element 520 is formed of a heat conducting material. Exemplarily, the heat conducting element 520 is shaped as a heat conducting pad. The infrared structure group receiving part 510 is arranged to receive the heat conducting element 520, wherein the infrared structure group receiving part 510 at least form-locking receives the heat conducting element 520. The heat conducting element 520 is connected to the infrared structure group receiving part 520 in a material-locking manner. The heat conducting element 520 is arranged between the infrared structure group receiving part 510 and the infrared structure group 140, in particular the infrared circuit board 148, and abuts against the infrared structure group receiving part and the infrared structure group, in particular the infrared circuit board.

[0044] The arrangement device 200 at least partially and / or at least in sections abuts against the cooling element 180 and the front support 120. In addition, the cooling element 180 is at least partially embedded in the arrangement device 200. The infrared structure group 140 and the visual structure group 160 are arranged overlapping each other, in particular axially along the optical axis 102, by means of the arrangement device 200. Here, at least the infrared optical device 146 and the circuit board 166 for the visual camera 164 overlap. The infrared structure group 140 and the visual structure group 160 are arranged spaced apart from each other in the radial direction, in particular relative to the optical axis 102. The arrangement device 200 includes a receiving part 220 for the infrared structure group 140. The receiving part 220 for the infrared structure group 140 at least partially, in particular substantially completely, surrounds the infrared structure group 140. Exemplarily, the receiving part 220 of the arrangement device 200 for the infrared structure group 140 is shaped as a quadrilateral opening 222, also see Figure 3and Figure 4. The receiving part 220 of the arrangement device 200 for the infrared structure group 140 at least partially surrounds the infrared housing 142. Here, the receiving part 220 of the arrangement device 200 for the infrared structure group 140 is spaced apart from the infrared structure group such that there is a spacing between the infrared housing 142 and the receiving part 220. The arrangement device 200 includes a receiving part 230 for the visual structure group 160. The receiving part 230 of the arrangement device 200 for the visual structure group 160 at least partially surrounds and at least partially receives the visual structure group 160. The visual structure group 160 only partially abuts against the receiving part 230 of the arrangement device 200 for the visual structure group 160. The receiving part 230 of the arrangement device 200 for the visual structure group 160 at least partially surrounds the circuit board 166 for the visual camera 164. The receiving part 220 of the arrangement device 200 for the infrared structure group 140 and the receiving part 230 of the arrangement device 200 for the visual structure group 160 are shaped on the arrangement device 200 such that they are radially offset from each other, in particular with respect to the optical axis 102. Exemplarily, the receiving part 230 of the arrangement device 200 for the visual structure group 160 is shaped in a shell-like manner.

[0045] The arrangement device 200 includes a shielding element 240. The shielding element 240 is arranged to shield the thermal radiation of the visual structure group 160 relative to the infrared structure group 140. Exemplarily, the arrangement device 200 is configured with the shielding element such that the arrangement device and the shielding element are integral here. The shielding element 240 extends axially along the optical axis 102. The shielding element 240 extends in the direction towards the front bracket 120. Exemplarily, the shielding element 240 is shaped as a shielding tab 242. The front bracket 120 includes an insulating element 126. The insulating element 126 is arranged to insulate the infrared structure group 140. The front bracket 120 is shaped with the insulating element 126 such that the front bracket and the insulating element are integral. The insulating element 126 extends axially along the optical axis 102 in the direction towards the infrared structure group 140 and the cooling element 180. Exemplarily, the insulating element 126 is shaped as an insulating tab. The shielding element 240 abuts against the insulating element 126. The arrangement device 200 includes at least one arrangement element 250. The arrangement element 250 is arranged to arrange the front bracket 120 relative to the infrared structure group 140 and the visual structure group 160. The arrangement device 200 is shaped with the arrangement element 250 such that the arrangement device and the arrangement element are integral. The arrangement element 250 orients the front bracket 120 relative to the infrared structure group 140 and the visual structure group 160 such that the opening 121 in the front bracket 120 for the infrared structure group 140 and the opening 122 in the front bracket 120 for the visual structure group 160 are axially oriented relative to the infrared structure group 140 and the visual structure group 160 respectively. Exemplarily, the arrangement element 250 is shaped in the form of screw bosses (Schraubdoms) 252, where four arrangement elements 250 are provided here. The arrangement elements 250 are snap-fitted into the front bracket 120. The front bracket 120 includes a receiving portion 130 for the arrangement element 250. The receiving portion 130 for the arrangement element 250 receives the arrangement element 250 at least form-locked. Exemplarily, the four receiving portions 130 are each configured for one of the arrangement elements 250. The cooling element 180 includes at least one orientation element 184. The arrangement device 200 includes at least one receiving portion 260 for the orientation element 184. The orientation element 186 is arranged to orient the arrangement device 20 relative to the cooling element 180 by means of the receiving portion 260 for the orientation element 186. Exemplarily, the cooling element 180 is shaped with the orientation element 184 such that the cooling element and the orientation element are integral. The orientation element 186 is at least form-locked and snap-fitted into the receiving portion 260 of the arrangement device 200 for the orientation element 184. Exemplarily, the orientation element 184 is shaped as an orientation bolt 186. Here, exemplarily, two orientation bolts 186 and two receiving portions 260 are constructed, also see Figure 3 Figures 5. The receiving portions 260 are each shaped as through openings 262.

[0046] Figure 3 Shows an exploded view of the front bracket 120, the arrangement device 200, the sensor bracket 500, the cooling element 180, the infrared structure group 140, and the vision structure group 160. The front bracket 120 includes an additional receiving portion 132. The additional receiving portion 132 of the front bracket 120 includes an adhesive pad 134. The additional receiving portion 132 of the front bracket 120 is configured to receive, via the adhesive pad 134, an infrared window 152 for the infrared structure group 140 and a glass plate 170 for the vision structure group 160. A seal 136 is adhered to the front bracket 120 to enclose the housing 110 relative to the working environment. The infrared structure group receiving portion 510 has a receiving protrusion 516, also see FIGS. 4 and 5. The receiving protrusion 516 is configured to be embedded in the infrared circuit board 148 and fix the infrared circuit board 148. The receiving protrusion 516 and the infrared structure group receiving portion 510 are integrally formed.

[0047] Figure 4a Shows a perspective view of the infrared structure group 140, the sensor bracket 500, and the cooling element 180, Figure 4b Shows a side view of the infrared structure group 140, the sensor bracket 500, and the cooling element 180. The sensor bracket 500 includes a line guiding portion 530, also see FIG. 5. The line guiding portion 530 is configured to guide the infrared structure group line 150. Here, the line guiding portion 530 guides the infrared structure group line 150 from the infrared structure group 140 in the direction towards the control unit 300. The sensor bracket 500 forms the line guiding portion 530. Exemplarily, the line guiding portion 530 is formed as a substantially elliptical opening 532. A covering element 540 is arranged above the line guiding portion 530. The covering element 540 is configured to prevent an air flow through the line guiding portion 530. Exemplarily, the covering element 540 is formed of a foam material. Here, exemplarily, the covering element 540 is at least partially connected to the line guiding portion 530 in a material-locking manner. The sensor bracket 500 includes a line fixing portion 550. The line fixing portion 550 fixes at least the infrared structure group line 150 at least partially on the sensor bracket 500. Exemplarily, the line fixing portion 500 is formed as a buckle strap 552. The line fixing portion 550 includes an adhesive pad 554. The adhesive pad 554 is configured to connect the line fixing portion 550 to the sensor bracket 500. The line fixing portion 550 is connected to the sensor bracket 500 in a material-locking manner by means of the adhesive pad 554.

[0048] Figure 5a Shows a front view of the sensor bracket 500 and the cooling element 180, wherein, Figure 5bA perspective rear view showing the cooling element 180 is presented. The cooling element 180 forms the sensor bracket 500 such that the cooling element and the sensor bracket are integrally formed. The cooling element 180 includes at least one cooling fin 190, where, by way of example, two cooling fins 190 are formed herein. The cooling fin 190 at least partially surrounds the infrared structure group circuitry 150, also see Figure 2 FIG. 4. By way of example, the cooling fin 190 is formed in an F shape. The two cooling fins 190 are arranged opposite each other on the cooling element 180. The two cooling fins 190 are spaced apart from each other in the radial direction with respect to the optical axis 102. The cooling element 180 includes at least one rectangular parallelepiped-shaped cooling hollow body 192, where, by way of example, two rectangular parallelepiped-shaped cooling hollow bodies 192 are formed herein. The rectangular parallelepiped-shaped cooling hollow body 192 extends axially along the optical axis 102. The cooling element 180 forms the rectangular parallelepiped-shaped cooling hollow body 192 such that the cooling element and the rectangular parallelepiped-shaped cooling hollow body are integrally formed. The cooling hollow body 192 is arranged offset in the radial direction from the cooling fin 190.

Claims

1. A thermal imaging camera (100), comprising a housing (110), an infrared structural group (140) for detecting infrared radiation, a visual structural group (160) for receiving visual radiation, and at least one cooling element (180), the cooling element being used at least to cool the infrared structural group (140), wherein: The infrared structure group (140) and the visual structure group (160) are basically arranged in the housing (110), Features A sensor support (500) is configured to connect the infrared structure group (140) to the cooling element (180).

2. The thermal imaging camera (100) according to claim 1, characterized in that: The sensor support (500) has an infrared structure group receiving part (510), which is configured to receive the infrared structure group (140) and to arrange the infrared structure group (140) relative to the cooling element (180).

3. The thermal imaging camera (100) according to claim 1 or 2, characterized in that At least one heat conducting element (520) is arranged between the infrared structure group (140) and the sensor bracket (500).

4. The thermal imaging camera (100) according to claim 2 and 3, characterized in that The infrared structure group receiving portion (510) is configured to receive the thermal conductive element (520).

5. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The sensor support (500) has at least one line guide (530), which is configured to guide at least one infrared structure group line (150) of the infrared structure group (140).

6. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The sensor bracket (500) has at least one line fixing portion (550), and the line fixing portion at least partially fixes at least one infrared structure group line (150) on the sensor bracket (500).

7. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The cooling element (180) forms the sensor holder (500).

8. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The cooling element (180) has at least one cooling fin (190).

9. The thermal imaging camera (100) according to claim 8, characterized in that: At least two of the cooling fins (190) are configured to be opposite to each other.

10. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The cooling element (180) has at least one cuboid cooling hollow body (192).

Images