Eddy current sensing integrated structure, eddy current sensor and integrated unit

By integrating the eddy current area and grounding area on the PCB substrate and setting an isolation area, the application restriction caused by the independent arrangement of the existing eddy current sensors and grounding devices is solved, and the integrated application of efficient eddy current sensing detection and shaft grounding functions is realized.

CN120195265APending Publication Date: 2025-06-24LEADRIVE TECH (SHANGHAI) CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202510618851.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-14
Publication Date
2025-06-24

AI Technical Summary

Technical Problem

The existing eddy current sensors and grounding devices are arranged independently, and the lack of integrated design leads to limited application, large space occupancy and high cost.

Method used

An eddy current sensing integrated structure is designed to integrate the eddy current area and the grounding area on a PCB substrate, and reduce signal interference through the isolation area to realize the eddy current sensing detection and shaft grounding functions.

Benefits of technology

The integrated application of eddy current sensing detection and shaft grounding functions is realized, solving the problems of large space occupation and high cost caused by independent arrangement, and at the same time improving detection accuracy.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120195265A_ABST
    Figure CN120195265A_ABST
Patent Text Reader

Abstract

The invention provides an eddy current sensing integrated structure, an eddy current sensor and an integrated unit, and relates to the technical field of eddy current sensors, and the eddy current sensing integrated structure comprises a PCB substrate which is provided with an eddy current region, a grounding region and an isolation region; a coil disposed on the PCB substrate to form the eddy current region; the conductive component is arranged on the PCB substrate, is connected with a motor rotating shaft and is connected with the shell through the grounding area; the isolation area is positioned between the eddy current area and the grounding area, so that the projections of the eddy current area and the grounding area along the axial direction of the rotating shaft are not overlapped; the problems that an existing eddy current sensor and an existing grounding device are independently arranged, integrated design is lacked, and application is limited are solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of eddy current sensors, and particularly to an eddy current sensing integrated structure, an eddy current sensor, and an integrated unit. Background Art

[0002] An eddy current sensor is a sensor based on the principle of eddy current effect. It measures various parameters of a metal conductor by detecting the eddy current generated in the metal conductor in an alternating magnetic field. It can non - contact measure a variety of physical quantities with the object surface being a metal conductor, such as displacement, vibration, thickness, rotational speed, stress, hardness, etc. The eddy current sensor has a simple structure, a wide frequency response, high sensitivity, a large measurement range, and strong anti - interference ability, so it has been widely used in various fields.

[0003] In vehicle applications, eddy current sensors can be arranged to detect specific marks or tooth grooves on the rotating parts of the motor, generating an electrical signal related to the rotational speed. Generally, considering motor safety, a grounding device for the motor shaft is also set to conduct the voltage on the motor shaft. However, the existing eddy current sensors and grounding devices (grounding rings / conductive rings) are arranged independently, occupying a large space, unable to meet the application requirements of some integrated scenarios, and having a high cost. Summary of the Invention

[0004] In order to overcome the above - mentioned technical defects, the purpose of the present invention is to provide an eddy current sensing integrated structure, an eddy current sensor, and an integrated unit to solve the problem that the existing eddy current sensors and grounding devices are arranged independently, lacking integrated design and having limited applications.

[0005] The present invention discloses an eddy current sensing integrated structure, including:

[0006] A PCB substrate having an eddy current region, a grounding region, and an isolation region;

[0007] A coil arranged on the PCB substrate to form the eddy current region;

[0008] A conductive component arranged on the PCB substrate, connected to the motor shaft and connected to the housing through the grounding region;

[0009] An isolation region located between the eddy current region and the grounding region, such that the axial projection of the eddy current region and the grounding region along the axis of the shaft has no overlap.

[0010] Preferably, the eddy current region has an annular segment structure concentric with the conductive component.

[0011] Preferably, the annular segment structure of the eddy current region occupies at least 1 / 6 of the annular structure concentric with the conductive component.

[0012] Preferably, the PCB substrate extends on both sides of the grounding area to correspond to the eddy current area.

[0013] Preferably, the isolation area makes the distance between the eddy current area and the grounding area not less than 2 mm.

[0014] Preferably, the conductive component includes a plurality of conductive fiber bundles;

[0015] Each conductive fiber bundle is arranged in a ring on the PCB substrate to form a hollow area through which the motor shaft passes and contacts each conductive fiber bundle.

[0016] Preferably, the conductive fiber bundles are evenly spaced.

[0017] Preferably, the PCB substrate is provided with a plurality of conductor structures in the grounding area so that the conductive component is connected to the housing for grounding.

[0018] Preferably, the isolation area is formed by being clamped between a coil arranged in the eddy current area but on the side closest to the grounding area and a conductor structure arranged in the grounding area but on the side closest to the eddy current area.

[0019] The present invention also provides an eddy current sensor, which applies the eddy current sensing integrated structure described in any one of the above; it further includes a target wheel, and the target wheel cooperates with the coil to generate an eddy current effect in the eddy current area.

[0020] The present invention also provides an integrated unit, which applies the eddy current sensing integrated structure or the eddy current sensor described in any one of the above.

[0021] After adopting the above technical solutions, compared with the prior art, the following beneficial effects are achieved:

[0022] The eddy current sensing integrated structure, eddy current sensor and integrated unit provided by the present application integrate the eddy current area (coil) and the grounding area (the conductive component is connected to the housing for grounding) on a PCB substrate, and simultaneously realize the functions of eddy current sensing detection and shaft grounding. It solves the problem that the existing eddy current sensors and grounding devices are arranged independently, lack of integrated design, and have limited applications. Further, by setting an isolation area and there is no overlap in the axial projection of each area, the interference of the grounding area on the signal during the detection process of the eddy current area is reduced, and integrated application is realized, solving the problem that the existing eddy current sensors and grounding devices are arranged independently, lack of integrated design, and have limited applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic structural diagram of an embodiment of an eddy current sensing integrated structure, eddy current sensor and integrated unit according to the present invention.

[0024] Reference numerals:

[0025] 1 - PCB substrate; 2 - Eddy current area; 3 - Grounding area; 4 - Isolation area; 5 - Conductive fiber bundle. Detailed implementation manners

[0026] The advantages of the present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0027] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0028] The terms used in the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. The singular forms "a", "the", and "said" used in the present disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0029] It should be understood that the word "if" as used herein can be interpreted as "when" or "while" or "in response to determining".

[0030] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0031] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "mounted", "connected", and "connected" should be understood in a broad sense. For example, they can be mechanically connected or electrically connected, or can be the internal communication of two elements. They can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0032] In the following description, suffixes such as "module", "component", or "unit" used to denote elements are only for facilitating the description of the present invention and have no specific meaning in themselves. Therefore, "module" and "component" can be used interchangeably.

[0033] Embodiment: This embodiment discloses an eddy current sensing integrated structure, which can be applied to vehicle motors. It integrates an eddy current sensor and a conductive brush (for grounding) structure, and simultaneously realizes the functions of detecting the rotational speed (position / angle) on the vehicle motor and grounding the rotating shaft to the housing, so as to overcome the problem that two independent structures (eddy current sensor and conductive ring grounding device) need to be set up in the prior art, resulting in limited application.

[0034] Based on the above, as Figure 1 shown, the eddy current sensing integrated structure includes the following PCB substrate and a coil and a conductive component integrated on the PCB substrate; it can be understood that in this embodiment, a coil for generating an eddy current effect and a conductive component for grounding are integrated on the same PCB substrate. However, considering that the integration of the two may cause mutual interference, such as the interference of the eddy current generated by the conductive component (the conductive component is connected to the motor rotating shaft, the target wheel is connected to the motor rotating shaft and rotates synchronously, and the target wheel cuts the magnetic field formed by the conductive component to generate eddy current) on the signal received in the eddy current region. Therefore, it is necessary to separate the eddy current region and the grounding region on the PCB substrate; thus, the above structure also includes an isolation region.

[0035] Specifically, the PCB substrate has an eddy current region, a grounding region, and an isolation region. It can be understood that a coil for forming an eddy current and a grounding structure are integrated through a PCB substrate. As an illustration, the PCB board is a common structure of an existing eddy current sensor, and the integration is directly realized based on this, which is convenient for assembly or production. In this embodiment, other conductive plates or plates on which conductive structures can be arranged can also be used as alternative solutions.

[0036] Specifically, the isolation region can be formed by a conductor structure (a conductor structure on the coil or the PCB board, which can be etched on the PCB substrate) arranged in the eddy current region but closest to the grounding region side and a conductor structure (which can be etched on the PCB substrate, such as a wire) arranged in the grounding region but closest to the eddy current region (the relative boundary / contour formed by the conductor structures in the eddy current region and the grounding region). That is, the coil arranged in the eddy current region but closest to the grounding region side and the conductor structure arranged in the grounding region but closest to the eddy current region divide the entire PCB substrate into three regions, namely, from top to bottom, the eddy current region, the isolation region, and the grounding region, as shown in the figure.

[0037] Specific elaboration on the eddy current region, the grounding region, and the isolation region:

[0038] The coil is arranged on the PCB substrate to form the eddy current region. It should be noted that this eddy current region is used to achieve the eddy current induction function (i.e., the region covered by the magnetic field / eddy current effect generation), and can cooperate with the connection of the target wheel (connected to the rotating shaft and rotating synchronously) to generate the eddy current effect, so as to realize the detection of the motor speed on the vehicle. It includes a transmitting coil and a receiving coil to achieve the transmission and reception of the magnetic field for cooperating to generate the eddy current effect.

[0039] In this embodiment, the following conductive component (to achieve the function of grounding the conductive brush) needs to be integrated on the PCB board, so the distribution of the eddy current region is adjusted. In most existing eddy current sensors, the eddy current region is a complete annular region (circular probe region), and a magnetic field is formed within the annular region. However, in this embodiment, the eddy current region presents a ring segment structure. As a preferred arrangement, the (complete annular) corresponding to this ring segment structure is concentric with the conductive component. It should be noted that it is a ring segment structure, not a complete annular structure. A "ring segment" refers to a part intercepted from a complete ring, which can be regular or irregular. Specifically, it can be a part of the annular structure, such as 1 / 2 ring, 1 / 3 ring, etc.

[0040] Based on the above, in this embodiment, the coil arrangement for forming an incomplete annular eddy current region can utilize the coil arrangement in existing eddy current sensors. The specific arrangement of the coils is not specifically shown in the figure, such as the existing publicly disclosed arrangement on a semi-annular PCB substrate: three groups of coils are laid, each group of coils has two turns, occupying a mechanical angle of 120°, and are laid on multiple layers of the PCB substrate in a sine manner; among them, along the clockwise direction, each coil is arranged with a mechanical angle difference of 30° in sequence; or other existing applied coil arrangements of eddy current sensors based on incomplete annular PCB substrates can be referred to. In this embodiment, except for the foregoing examples, other coil arrangements that make the eddy current region generated conform to the above limitations are also acceptable.

[0041] Based on the foregoing, considering the implementation effect of the eddy current sensing detection function, in a preferred embodiment, the ring segment structure of the eddy current region occupies at least 1 / 6 of the annular structure concentric with the conductive component, that is, the eddy current region cannot be too small, so as to maintain the stability and accuracy of the eddy current sensing detection under the integrated design.

[0042] The conductive component is arranged on the PCB substrate, connected to the motor rotating shaft and connected to the housing through the grounding region; by connecting the conductive component to the motor rotating shaft and then to the housing, the function of grounding the electrode rotating shaft on the vehicle is realized. As a supplement, the housing can be a grounded motor housing or the housing of a grounded integrated unit (or eddy current sensor).

[0043] Specifically, the conductive component includes a plurality of conductive fiber bundles; each conductive fiber bundle is arranged in a ring (i.e., a conductive ring) on the PCB substrate to form a hollow area through which the motor shaft passes and contacts each conductive fiber bundle. A plurality of conductive fiber bundles arranged in a ring realize the function of an "electric current brush". When an unexpected electric voltage is generated on the motor shaft, it can be grounded through the conductive fiber bundles, thereby realizing the integration of the grounding device and the above-mentioned eddy current induction.

[0044] In this embodiment, each of the conductive fiber bundles can be arranged at uniform intervals, so as to improve the current transmission stability when the motor shaft runs. Further, the PCB substrate is provided with a plurality of conductor structures in the grounding area, so that the conductive component is connected to the housing for grounding. The conductor structure includes but is not limited to metal wires, copper foil metals, etc., which can be arranged on the PCB substrate by etching / printing, etc.

[0045] As described above, the eddy current area is formed as an incomplete ring structure, which may be a 1 / 2 ring, etc., or the area boundary may be regular or irregular, etc. In a preferred embodiment, the PCB substrate extends on both sides of the grounding area to correspond to the eddy current area. As shown in the figure, when projected from one side of the motor shaft, the eddy current area and the grounding area are combined to form an approximate circle, and the hollow area formed by the above-mentioned conductive component is located at the approximate center of the circle, so that the motor shaft passes through, thereby optimizing the structure distribution and improving the structural stability during application.

[0046] The above isolation area is located between the eddy current area and the grounding area. As shown in the figure, as a preferred arrangement, the conductor structure (eddy current area boundary / contour) on the eddy current area but closest to the grounding area is parallel to the conductor structure (grounding area boundary / contour) on the grounding area but closest to the eddy current area, so that the width of each part of the isolation area is uniform, and the eddy current area and the conductive component are symmetrically distributed relative to the same midline, with stable structure and improved stability of eddy current generation. Optionally, no conductor structure (wire / conductive element, etc.) is arranged in the isolation area on the PCB board. As a preferred embodiment, the isolation area makes the interval between the eddy current area and the grounding area not less than 2 mm. As a more preferred embodiment, the width of the isolation area (i.e., the distance between the opposite boundaries of the above-mentioned eddy current area and the grounding area) is set to 3-5 mm to optimize the structure and further reduce the risk of mutual interference between the eddy current area and the grounding area.

[0047] In this embodiment, the eddy current area and the grounding area are integrated on a PCB substrate, realizing the functions of eddy current sensing detection and shaft grounding at the same time. The grounding area and the eddy current area have no intersection or overlap in the (motor shaft) axial projection, and at the same time, the influence of the conductive structure in the grounding area on the eddy current area is reduced.

[0048] The eddy current sensor integrated structure provided by this embodiment integrates eddy current sensor detection and grounding (function integration in one), which is different from the existing method of independently installing two devices. The installation and assembly are simpler; the total mass of the device is reduced, which is less than the mass of independently installing a conductive structure and an eddy current sensor, and the cost is lower. By setting an isolation area and there is no intersection in the axial projection of each area, the interference of the eddy current generated in the grounding area (conductive structure) on the received signal during the eddy current sensor detection process is solved, and the test accuracy of the eddy current sensor is improved.

[0049] Furthermore, this embodiment also provides an eddy current sensor that applies the eddy current sensor integrated structure described in any one of the above; it further includes a target wheel (a common existing structure not shown in the drawings). The target wheel cooperates with the coil to generate an eddy current effect in the eddy current area; that is, the eddy current sensor includes the above-mentioned PCB substrate, the coil located on the PCB substrate, and the target wheel (optionally, in some scenarios, the eddy current sensor may not use the target wheel and be replaced by other metal components). The target wheel cooperates with the coil to generate an eddy current in the eddy current area, and the PCB substrate collects signals to achieve tests such as the motor speed.

[0050] Furthermore, this embodiment also provides an integrated unit, including a motor (which can be used in any motor that requires eddy current sensor detection). It applies the eddy current sensor integrated structure described in any one of the above or the above-mentioned eddy current sensor. Specifically, the eddy current area of the above-mentioned PCB substrate is connected to the motor housing, and the motor shaft passes through the target wheel and the above-mentioned conductive component, thereby realizing the application of this current sensor. The structure is simple and the performance is stronger. It can simultaneously complete the functions of speed (position / angle) detection and the function of connecting the rotating shaft to the housing - ground, and can be applied to different scenarios (such as vehicle motor control systems, etc.).

[0051] It should be noted that the embodiments of the present invention have good implementability and are not any form of limitation to the present invention. Any person skilled in the art may use the disclosed technical content to change or modify it into an equivalent effective embodiment. However, as long as it does not depart from the technical content of the present invention, any modification, equivalent change, or modification made to the above embodiments according to the technical essence of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. An eddy current induction integrated structure, characterized in that: include: A PCB substrate having an eddy current region, a ground region and an isolation region; A coil is arranged on the PCB substrate to form the eddy current region; A conductive component is arranged on the PCB substrate, connected to the motor shaft and connected to the housing through the grounding area; The isolation area is located between the eddy current area and the grounding area, so that the eddy current area and the grounding area have no overlap along the axial projection of the rotating shaft.

2. The eddy current inductor integrated structure according to claim 1, characterized in that: The eddy current region has a ring segment structure concentric with the conductive component.

3. The eddy current inductor integrated structure according to claim 2 is characterized in that: The ring segment structure of the eddy current region occupies at least 1 / 6 of the ring structure concentric with the conductive component.

4. The eddy current inductor integrated structure according to claim 2 is characterized in that: The PCB substrate extends on both sides of the grounding area to correspond to the eddy current area.

5. The eddy current inductor integrated structure according to claim 1 is characterized in that: The isolation area ensures that the interval between the eddy current area and the grounding area is not less than 2 mm.

6. The eddy current inductor integrated structure according to claim 1, characterized in that: The conductive component includes a plurality of conductive fiber bundles; The conductive fiber bundles are arranged in a ring shape on the PCB substrate to form a hollow area through which the motor shaft passes and contacts the conductive fiber bundles.

7. The eddy current inductor integrated structure according to claim 1, characterized in that: The PCB substrate is provided with a plurality of conductor structures in the grounding area, so that the conductive components are connected to the housing to be grounded.

8. The eddy current inductor integrated structure according to claim 7, characterized in that: The isolation area is formed by sandwiching a coil arranged in the eddy current area but closest to the grounding area and a conductor structure arranged in the grounding area but closest to the eddy current area.

9. An eddy current sensor, characterized in that: The eddy current inductor integrated structure according to any one of claims 1 to 8 above also includes a target wheel, which cooperates with the coil to generate an eddy current effect in the eddy current area.

10. An integrated unit, characterized in that: It comprises a motor and uses the eddy current induction integrated structure described in any one of claims 1 to 8 or the eddy current sensor described in claim 9.

Citation Information

Cited By

  • Integrated eddy current sensor, motor and motor rotating shaft anti-corrosion method

    CN121613168A