Photovoltaic module and manufacturing method of frame of photovoltaic module

Abstract

The invention provides a photovoltaic module and a manufacturing method of a frame of the photovoltaic module, and relates to the technical field of solar cells, the photovoltaic module comprises a chip layer and a frame, the frame is located on one side of the chip layer, and the frame comprises a conductive layer; the insulating layer coats the outer side of the conductive layer; the gluing layer is positioned between the conductive layer and the insulating layer; wherein the insulating layer is provided with a first opening, and the conductive layer is exposed out of the first opening and is used for being electrically connected with the chip layer. The frame provided by the invention has a bus function, so that the photovoltaic module does not need to be provided with a bus bar independently, the overall thickness of the photovoltaic module is reduced, and the risk of solar cell piece cracking is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cells, and more particularly to a manufacturing method of a photovoltaic module and a frame of the photovoltaic module. Background Art

[0002] In the related art, the bus bars of a photovoltaic module are usually disposed on a frame or a chip layer, which affects the thickness of the photovoltaic module and is liable to cause situations such as cracking of solar cells. Summary of the Invention

[0003] The present invention aims to at least solve or improve the technical problem that a separate bus bar needs to be provided for a photovoltaic module in the prior art.

[0004] To this end, a first aspect of the present invention provides a photovoltaic module.

[0005] A second aspect of the present invention provides a manufacturing method of a frame of a photovoltaic module.

[0006] In view of this, according to the first aspect of the present invention, a photovoltaic module is provided, including: a chip layer and a frame, the frame being located on one side of the chip layer, the frame including: a conductive layer; an insulating layer covering the outside of the conductive layer; an adhesive layer located between the conductive layer and the insulating layer; wherein, the insulating layer is provided with a first opening, and the conductive layer is exposed to the first opening and is used for electrically connecting with the chip layer.

[0007] The photovoltaic module provided by the present invention includes a chip layer and a frame, the frame is disposed on one side of the chip layer, the frame includes a conductive layer, an adhesive layer and an insulating layer, the insulating layer covers the outside of the conductive layer, the adhesive layer is located between the conductive layer and the insulating layer, so as to ensure the reliability of the frame, the insulating layer is provided with a first opening, the conductive layer is exposed to the first opening, and moreover, the part of the conductive layer exposed through the first opening is electrically connected with the chip layer, so that the frame has the function of current collection, that is, the frame provided by the present invention has the function of current collection, such that the photovoltaic module does not need to be provided with a separate bus bar, reducing the overall thickness of the photovoltaic module and reducing the risk of cracking of solar cells.

[0008] In addition, according to the photovoltaic module in the above technical solution provided by the present invention, the following additional technical features may further be provided:

[0009] In some embodiments, optionally, the insulating layer is provided with a second opening, the conductive layer is exposed to the second opening and is used for electrically connecting with an external circuit.

[0010] In this embodiment, the insulating layer is further provided with a second opening, the conductive layer is exposed to the second opening, and moreover, the part of the conductive layer exposed through the second opening is electrically connected with the external circuit, so that the frame can realize the transmission of electric energy with the external circuit.

[0011] In some embodiments, optionally, the second opening is located at the end of the insulating layer, and the first opening is located on the side of the insulating layer.

[0012] In this embodiment, the second opening is located at the end of the insulating layer, facilitating the electrical connection between the conductive layer and the external circuit. The first opening is located on the side of the insulating layer, making the first opening correspond to the chip layer and facilitating the electrical connection between the conductive layer and the chip layer.

[0013] In some embodiments, optionally, the insulation resistance of the insulating layer is greater than or equal to 1×10 4 MΩ, the withstand voltage of the insulating layer is greater than or equal to 3 KV / min, and the insulating layer is doped with an ultraviolet absorber.

[0014] In this embodiment, the insulation resistance of the insulating layer is greater than or equal to 1×10 4 MΩ, the withstand voltage of the insulating layer is greater than or equal to 3 KV / min, thus ensuring the safety of the photovoltaic module. The insulating layer is doped with an ultraviolet absorber, thereby enhancing the ability of the insulating layer to resist photoaging and improving the reliability of the photovoltaic module.

[0015] According to a second aspect of the present invention, a method for manufacturing a frame of a photovoltaic module is provided, which is used to manufacture the frame of the photovoltaic module as provided in the embodiments of the first aspect. The method includes: respectively disposing a set of adhesive layers and insulating layers on both sides of the conductive layer; combining the conductive layer, the adhesive layers, and the insulating layers through a lamination process; and forming a first opening in the insulating layer to expose the conductive layer at the first opening.

[0016] The method for manufacturing a frame of a photovoltaic module proposed by the present invention is used to manufacture the frame of the photovoltaic module as provided in the embodiments of the first aspect. The method includes: respectively disposing a set of adhesive layers and insulating layers on both sides of the conductive layer. The lamination order of the conductive layer, the adhesive layers, and the insulating layers is: insulating layer - adhesive layer - conductive layer - adhesive layer - insulating layer. Place the five-layer material in a mold, and then through a lamination process, press and combine the conductive layer, the adhesive layers, and the insulating layers to form an integral body. Then form a first opening in the insulating layer to expose the conductive layer at the first opening, so as to facilitate the electrical connection between the conductive layer and the chip layer.

[0017] Moreover, the frame has a current collecting function, enabling the photovoltaic module to eliminate the need for a separate bus bar, reducing the overall thickness of the photovoltaic module and the risk of surface cracking of the photovoltaic module.

[0018] In some embodiments, optionally, after combining the conductive layer, the adhesive layers, and the insulating layers through a lamination process, the method further includes: insulating at least a part of the conductive layer exposed outside the insulating layer.

[0019] In this embodiment, when the conductive layer, the adhesive layer, and the insulating layer are provided, at least a part of the conductive layer exposed outside the insulating layer can be insulated, thereby reducing the possibility of leakage at the frame.

[0020] In some embodiments, optionally, after combining the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: opening a second opening at an end of the insulating layer.

[0021] In this embodiment, after combining the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: opening a second opening at an end of the insulating layer to expose the conductive layer, and a part of the conductive layer exposed through the second opening is electrically connected to an external circuit, so that electrical energy can be transmitted between the frame and the external circuit.

[0022] In some embodiments, optionally, before respectively disposing a set of adhesive layer and insulating layer on two sides of the conductive layer, the method further includes: pre-treating the surface of the conductive layer to increase the adhesion of the surface of the conductive layer.

[0023] In this embodiment, before respectively disposing a set of adhesive layer and insulating layer on two sides of the conductive layer, the surface of the conductive layer is pre-treated, thereby increasing the adhesion of the surface of the conductive layer, improving the connection strength between the conductive layer and the adhesive layer and the insulating layer, and enhancing the reliability of the frame.

[0024] In some embodiments, optionally, after combining the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: trimming the insulating layer to make the roughness of the insulating layer less than or equal to 0.8 Ra.

[0025] In this embodiment, after combining the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the insulating layer is trimmed to make the roughness of the insulating layer less than or equal to 0.8 Ra, thereby reducing the possibility of the insulating layer scratching other articles and enhancing the safety of the photovoltaic module.

[0026] In some embodiments, optionally, the lamination process uses staged temperature rise; the pressure range of the lamination process is 15 MPa to 30 MPa; the vacuum degree of the lamination process is -0.09 MPa to -0.1 MPa; the time of the lamination process is 10 min to 15 min.

[0027] In this embodiment, the lamination composite process uses stepwise heating to reduce phenomena such as cracking caused by differences in the material expansion coefficients. The pressure range of the lamination composite process is from 15 MPa to 30 MPa to ensure the reliability of the formation of the conductive layer, the adhesive layer, and the insulating layer. The vacuum degree of the lamination composite process is from -0.09 MPa to -0.1 MPa to reduce the possibility of air bubbles existing between the conductive layer, the adhesive layer, and the insulating layer. The time of the lamination composite process is from 10 min to 15 min to ensure the reliability of the connection between the conductive layer, the adhesive layer, and the insulating layer.

[0028] Additional aspects and advantages of the present invention will become apparent in the following description section or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0030] Figure 1 shows a schematic structural diagram of a photovoltaic module provided by an embodiment of the present invention;

[0031] Figure 2 shows a schematic structural diagram of a frame of a photovoltaic module provided by an embodiment of the present invention;

[0032] Figure 3 shows a schematic structural diagram of an insulating layer in a frame of a photovoltaic module provided by an embodiment of the present invention;

[0033] Figure 4 shows a schematic structural diagram of an insulating layer in a frame of a photovoltaic module provided by an embodiment of the present invention;

[0034] Figure 5 shows one of the flowcharts of a manufacturing method of a frame of a photovoltaic module provided by an embodiment of the present invention;

[0035] Figure 6 shows another flowchart of a manufacturing method of a frame of a photovoltaic module provided by an embodiment of the present invention.

[0036] Wherein, Figures 1 to 4 the corresponding relationship between the reference numerals in the drawings and the component names is as follows:

[0037] 100 photovoltaic module, 110 chip layer, 120 frame, 122 conductive layer, 124 insulating layer, 126 first opening, 128 second opening, 130 adhesive layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] In order to more clearly understand the above objects, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

[0039] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below.

[0040] The following refers to Figures 1 to 6 to describe a manufacturing method of a photovoltaic module 100 and a frame of the photovoltaic module according to some embodiments of the present invention.

[0041] As Figure 1 、 Figure 2 and Figure 3 shown, according to a first aspect of the present invention, the present invention provides a photovoltaic module 100, including: a chip layer 110 and a frame 120. The frame 120 is located on one side of the chip layer 110. The frame 120 includes: a chip layer 110, and the frame 120 includes: a conductive layer 122; an insulating layer 124 covering the outside of the conductive layer 122; an adhesive layer 130 located between the conductive layer 122 and the insulating layer 124; wherein, the insulating layer 124 is provided with a first opening 126, and the conductive layer 122 is exposed to the first opening 126 and is used for electrically connecting with the chip layer 110.

[0042] The photovoltaic module 100 provided by the present invention includes a chip layer 110 and a frame 120. The frame 120 is disposed on one side of the chip layer 110. The frame 120 includes a conductive layer 122, an adhesive layer 130, and an insulating layer 124. The insulating layer 124 covers the outside of the conductive layer 122, and the adhesive layer 130 is located between the conductive layer 122 and the insulating layer 124, thereby ensuring the reliability of the frame 120. The insulating layer 124 is provided with a first opening 126, and the conductive layer 122 is exposed to the first opening 126. Moreover, the portion of the conductive layer 122 exposed through the first opening 126 is electrically connected to the chip layer 110, so that the frame 120 has a current collecting function. That is, the frame 120 provided by the present invention has a current collecting function, enabling the photovoltaic module to not require a separate bus bar, reducing the overall thickness of the photovoltaic module, and reducing the risk of cracking of the solar cells.

[0043] Wherein, the position of the conductive layer 122 corresponding to the first opening 126 may be a through hole, and the edge of the through hole is exposed to the first opening 126, or the position where the conductive layer 122 blocks the first opening 126.

[0044] In the related art, the wires of a circuit are usually disposed on the frame 120 or on the cell layer. Due to the height difference, bubbles, cracks and other factors may occur in the laminated component, resulting in defects. At the same time, the laying becomes complex and the operation is cumbersome. However, for the frame 120 provided in the present application, a conductive layer 122 is provided inside, and there is no need to design a bus bar or the like, thereby solving the above problems.

[0045] As Figure 4 shown, in some embodiments, optionally, the insulating layer 124 is provided with a second opening 128, and the conductive layer 122 is exposed to the second opening 128 and is used for electrical connection with an external circuit.

[0046] In this embodiment, a second opening 128 is further provided on the insulating layer 124, and the conductive layer 122 is exposed to the second opening 128. Moreover, the portion of the conductive layer 122 exposed through the second opening 128 is electrically connected to the external circuit, so that the frame 120 can transmit electrical energy to the external circuit.

[0047] As Figure 3 and Figure 4 shown, in some embodiments, optionally, the second opening 128 is located at an end of the insulating layer 124, and the first opening 126 is located on a side surface of the insulating layer 124.

[0048] In this embodiment, the second opening 128 is located at an end of the insulating layer 124, facilitating the electrical connection between the conductive layer 122 and the external circuit. The first opening 126 is located on the side surface of the insulating layer 124, so that the first opening 126 corresponds to the chip layer 110, facilitating the electrical connection between the conductive layer 122 and the chip layer 110.

[0049] Specifically, the frame 120 is integrally strip-shaped. At least one of the two ends of the insulating layer 124 is provided with the second opening 128. The first opening 126 is located on the side surface of the insulating layer 124, that is, the first opening 126 is located at a position between the two ends of the insulating layer 124. Moreover, the number of the first openings 126 may be one, two or more, specifically determined according to the chip layer 110 and the circuit design. Similarly, the number of the second openings 128 may be one, two or more, specifically determined according to the circuit design.

[0050] In some embodiments, optionally, the insulation resistance of the insulating layer 124 is greater than or equal to 1×10 4 MΩ.

[0051] In this embodiment, the insulation resistance of the insulating layer 124 is greater than or equal to 1×10 4 MΩ, thereby ensuring the safety of the photovoltaic module.

[0052] In some embodiments, optionally, the withstand voltage of the insulating layer 124 is greater than or equal to 3 KV / min.

[0053] In this embodiment, the withstand voltage of the insulating layer 124 is greater than or equal to 3 KV / min, thereby ensuring the safety of the photovoltaic module.

[0054] In some embodiments, optionally, the insulating layer 124 is doped with an ultraviolet absorber.

[0055] In this embodiment, the insulating layer 124 is doped with an ultraviolet absorber, thereby enhancing the ability of the insulating layer 124 to resist photoaging and improving the reliability of the photovoltaic module.

[0056] Specifically, the content ratio of the ultraviolet absorber in the insulating layer 124 is 0.01% to 0.2%. Specifically, the content ratio of the ultraviolet absorber in the insulating layer 124 is 0.05%, 0.1% or 0.2%, etc.

[0057] In some embodiments, optionally, the conductive layer 122 can be a high-conductivity carbon fiber layer, a copper strip layer or an aluminum alloy layer, etc.

[0058] In some embodiments, optionally, the insulating layer 124 can be a glass fiber (Glass Fibre Reinforced Plastics, GFRP) layer, a polyurethane (Polyurthane Reactive, PUR) layer or an acrylate resin (Acrylonitrile Styrene Acryate copolymer, ASA) layer, etc.

[0059] In some embodiments, optionally, the adhesive layer 130 can be an epoxy resin layer, a polyurethane film layer or a hot melt adhesive film layer. The adhesive layer 130 is compatible with the insulating layer 124. The hot melt adhesive film layer can be an ethylene-vinyl acetate copolymer (Ethylene Vinyl Acetate copolymer, EVA) layer or a polyolefin elastomer (Polyolenfin Elastomer, POE) layer, etc.

[0060] In some embodiments, optionally, the thickness of the adhesive layer 130 is between 0.1 mm and 0.5 mm.

[0061] In some embodiments, optionally, the conductive layer 122 does not protrude beyond the edge of the insulating layer 124, that is, the area of the conductive layer 122 is smaller than the area of the insulating layer 124.

[0062] In some embodiments, optionally, the insulating layer 124 can fully cover the conductive layer 122, that is, except for the first opening 126 and the second opening 128, the conductive layer 122 is completely covered by the insulating layer 124, or the insulating layer 124 half-covers the conductive layer 122, that is, except for the first opening 126 and the second opening 128, part of the conductive layer 122 is not covered by the insulating layer 124, for example: both sides of the conductive layer 122 are covered with the insulating layer 124, and the part that is not attached to the insulating layer 124, that is, the part between the two insulating layers 124 is not covered by the insulating layer 124, and this position can be insulated by spraying insulation or other methods.

[0063] like Figure 1 As shown, there are two frames 120, which are respectively located on both sides of the chip layer 110, and one of the two frames 120 is connected to the positive electrode, and the other is connected to the negative electrode.

[0064] The chip layer 110 and the conductive layer 122 may be connected by screws, terminals, wires or solder, or by bonding.

[0065] The photovoltaic module 100 provided by the present invention does not need to set up a separate bus bar, simplifies the laying steps, improves product production efficiency, and can effectively reduce the possibility of cracks, bubbles, etc., improve product preparation yield, reduce costs, and save materials.

[0066] The photovoltaic component 100 may be a portable photovoltaic component, for example, a foldable photovoltaic component.

[0067] Figure 5 One of the flow charts of a method for manufacturing a frame of a photovoltaic module provided by an embodiment of the present invention is shown.

[0068] like Figure 5 As shown, the specific process of the method for manufacturing the frame of a photovoltaic module provided by one embodiment of the present invention is as follows:

[0069] Step 502: a group of adhesive layers and insulating layers are respectively provided on both sides of the conductive layer.

[0070] Specifically, a group of adhesive layers and insulating layers are respectively arranged on both sides of the conductive layer, and the conductive layer, adhesive layer and insulating layer are stacked in the manner of insulating layer-adhesive layer-conductive layer-adhesive layer-insulating layer, and the five layers of materials are stacked in sequence in the mold.

[0071] Step 504: Combine the conductive layer, the adhesive layer and the insulating layer through a lamination process.

[0072] Specifically, the conductive layer, the adhesive layer and the insulating layer are pressed together through a lamination composite process, so that the conductive layer, the adhesive layer and the insulating layer form a whole.

[0073] Step 506: Open a first opening in the insulating layer to expose the conductive layer at the first opening.

[0074] Specifically, open a first opening in the insulating layer to expose the conductive layer at the first opening, so as to facilitate the electrical connection between the conductive layer and the chip layer.

[0075] As described above, the frame has a current collecting function, so that the photovoltaic module does not need to be provided with a separate bus bar, reducing the overall thickness of the photovoltaic module and reducing the risk of solar cell cracking.

[0076] The surface area of the side of the conductive layer facing the insulating layer is smaller than the surface of the insulating layer facing the conductive layer.

[0077] In some embodiments, optionally, after combining the conductive layer, the adhesive layer and the insulating layer by a lamination process, the method further includes: insulating at least a part of the conductive layer exposed outside the insulating layer.

[0078] In this embodiment, after combining the conductive layer, the adhesive layer and the insulating layer, at least a part of the conductive layer exposed outside the insulating layer can be insulated, thereby reducing the possibility of frame leakage.

[0079] For example: the two sides of the conductive layer are covered with insulating layers, and the part between the two insulating layers is not covered by the insulating layer, and this position can be insulated by spraying insulation or other means.

[0080] In some embodiments, optionally, before respectively disposing a set of adhesive layer and insulating layer on both sides of the conductive layer, the method further includes: pre-treating the surface of the conductive layer to increase the adhesion of the surface of the conductive layer.

[0081] In this embodiment, before respectively disposing a set of adhesive layer and insulating layer on both sides of the conductive layer, the surface of the conductive layer is pre-treated, thereby increasing the adhesion of the surface of the conductive layer, improving the connection strength between the conductive layer and the adhesive layer and the insulating layer, and improving the reliability of the frame.

[0082] In some embodiments, optionally, before respectively disposing a set of adhesive layer and insulating layer on both sides of the conductive layer, the method further includes: pre-treating the surface of the conductive layer to increase the adhesion of the surface of the conductive layer.

[0083] In this embodiment, before respectively disposing a set of adhesive layer and insulating layer on both sides of the conductive layer, the surface of the conductive layer is pre-treated, thereby increasing the adhesion of the surface of the conductive layer, improving the connection strength between the conductive layer and the adhesive layer and the insulating layer, and improving the reliability of the frame.

[0084] Specifically, the conductive layer is pre-treated, such as anodizing (film thickness from 15 μm to 25 μm) or chemical etching of aluminum alloy material or copper material, to enhance the roughness and improve the adhesive adhesion. The carbon fiber conductive composite material needs to be treated with a coupling agent to avoid electrochemical corrosion with the insulating layer.

[0085] In some embodiments, optionally, after combining the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: trimming the insulating layer to make the roughness of the insulating layer less than or equal to 0.8 Ra.

[0086] In this embodiment, after combining the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the insulating layer is trimmed to make the roughness of the insulating layer less than or equal to 0.8 Ra, thereby reducing the possibility of the insulating layer scratching other items and improving the safety of the photovoltaic module.

[0087] Specifically, it can be cutting the excess glue edges and grinding the burrs to ensure that the roughness of the frame is less than or equal to 0.8 Ra.

[0088] In some embodiments, optionally, the lamination process uses stepwise temperature increase; the pressure range of the lamination process is from 15 MPa to 30 MPa; the vacuum degree of the lamination process is from -0.09 MPa to -0.1 MPa; the time of the lamination process is from 10 min to 15 min.

[0089] In this embodiment, the lamination process uses stepwise temperature increase to reduce phenomena such as cracking caused by differences in the material expansion coefficients. The pressure range of the lamination process is from 15 MPa to 30 MPa to ensure the reliability of the formation of the conductive layer, the adhesive layer, and the insulating layer. The vacuum degree of the lamination process is from -0.09 MPa to -0.1 MPa to reduce the possibility of air bubbles existing between the conductive layer, the adhesive layer, and the insulating layer. The time of the lamination process is from 10 min to 15 min to ensure the reliability of the connection between the conductive layer, the adhesive layer, and the insulating layer.

[0090] Among them, the stepwise temperature increase can adopt a three-stage method. For example: the temperatures of the three stages are 110 degrees Celsius, 130 degrees Celsius, and 150 degrees Celsius respectively.

[0091] The vacuum degree of the lamination process is -0.09 MPa, -0.095 MPa, -0.098 MPa, or -0.1 MPa, etc.

[0092] Figure 6 Shows the second flowchart of the manufacturing method of the frame provided by an embodiment of the present invention.

[0093] Such as Figure 6As shown in the figure, the specific process of the manufacturing method of the frame provided by an embodiment of the present invention is as follows:

[0094] Step 602: Pretreatment.

[0095] Specifically, the conductive layer is pretreated, such as anodizing (film thickness from 15 μm to 25 μm) or chemical etching of aluminum alloy material or copper material to enhance roughness and improve the adhesive force of the adhesive. The carbon fiber conductive composite material needs to be treated with a coupling agent to avoid electrochemical corrosion with the insulating layer.

[0096] Step 604: Framing.

[0097] Specifically, the prepared materials are stacked into a special mold in sequence, specifically: insulating layer - adhesive layer - conductive layer - adhesive layer - insulating layer.

[0098] Step 606: Laminating and compounding.

[0099] Specifically, the lamination and compounding process is used for forming. The temperature is raised in stages (110 °C - 130 °C - 150 °C) to avoid cracking caused by differences in the thermal expansion coefficients of the materials. Under a pressure of 15 MPa to 30 MPa and a vacuum degree of -0.098 MPa, the lamination is carried out for 10 min to 15 min.

[0100] Step 608: Post-treatment.

[0101] Specifically, cut the excess glue edges and polish the burrs to ensure that the roughness of the frame is less than 0.8 Ra.

[0102] Step 610: Drilling holes.

[0103] Specifically, local insulation treatment (such as spraying insulating paint) is carried out on a local area of the frame, and holes are drilled at both ends for the conductive layer to connect to an external circuit. Among them, drilling holes means setting a first opening and a second opening.

[0104] In the present invention, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance; the term "plural" means two or more, unless otherwise clearly defined. Terms such as "install", "connect", "join", "fix", etc. should be understood in a broad sense. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0105] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. These terms are only used for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or units referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0106] In the description of this specification, the descriptions of terms such as "one embodiment", "some embodiments", "specific embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or instance. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0107] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A photovoltaic module, characterized in that: include: A chip layer and a frame, wherein the frame is located on one side of the chip layer, and the frame includes: Conductive layer; An insulating layer, covering the outer side of the conductive layer; An adhesive layer, located between the conductive layer and the insulating layer; The insulating layer is provided with a first opening, the conductive layer is exposed to the first opening, and is used for being electrically connected to the chip layer.

2. The photovoltaic module according to claim 1, characterized in that: The insulating layer is provided with a second opening, and the conductive layer is exposed at the second opening and is used for being electrically connected to an external circuit.

3. The photovoltaic module according to claim 2, characterized in that: The second opening is located at an end of the insulating layer, and the first opening is located at a side of the insulating layer.

4. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The insulation resistance of the insulating layer is greater than or equal to 1×10 4 MΩ, the withstand voltage of the insulating layer is greater than or equal to 3KV / min, and the insulating layer is doped with an ultraviolet absorber.

5. A method for manufacturing a frame of a photovoltaic module, characterized in that: For manufacturing a frame of a photovoltaic assembly according to any one of claims 1 to 4, the method comprising: A group of adhesive layers and insulating layers are respectively arranged on both sides of the conductive layer; Combining the conductive layer, the adhesive layer and the insulating layer through a lamination process; A first opening is opened in the insulating layer so that the conductive layer is exposed in the first opening.

6. The method for manufacturing a frame of a photovoltaic module according to claim 5, characterized in that: After combining the conductive layer, the adhesive layer and the insulating layer through a lamination process, the method further includes: The conductive layer at least partially exposed outside the insulating layer is subjected to an insulating treatment.

7. The method for manufacturing a frame of a photovoltaic module according to claim 5, characterized in that: After combining the conductive layer, the adhesive layer and the insulating layer through a lamination process, the method further includes: A second opening is opened at the end of the insulating layer.

8. The method for manufacturing a frame of a photovoltaic module according to any one of claims 5 to 7, characterized in that: Before respectively arranging a set of adhesive layers and insulating layers on both sides of the conductive layer, the method further comprises: The surface of the conductive layer is pretreated to increase the adhesion of the surface of the conductive layer.

9. The method for manufacturing a frame of a photovoltaic module according to any one of claims 5 to 7, characterized in that: After combining the conductive layer, the adhesive layer and the insulating layer through a lamination process, the method further includes: The insulating layer is trimmed so that the roughness of the insulating layer is less than or equal to 0.8Ra.

10. The method for manufacturing a frame of a photovoltaic module according to any one of claims 5 to 7, characterized in that: The lamination process adopts staged heating; The pressure range of the lamination process is 15MPa to 30MPa; The vacuum degree of the lamination process is -0.09MPa to -0.1MPa; The lamination process takes 10 to 15 minutes.

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