Microwave photonic link test method and device

Abstract

The invention relates to the field of link testing, and discloses a microwave photon link testing method and device, and the method comprises the steps: connecting a connector with a server substrate management controller, and receiving a first control signal and / or a second control signal issued by the server substrate management controller; the controller receives the first control signal and returns a first feedback signal to the server substrate management controller through the connector for signal detection; the hardware interface is respectively connected with the connector and the external hardware and is used for receiving a second control signal issued by the connector to the corresponding external hardware and returning a second feedback signal to the server substrate management controller through the connector for signal detection; therefore, the microwave photonic optical fiber transmission link testing device is used for replacing an HGX platform GPU module for microwave photonic optical fiber transmission link testing, the testing cost is remarkably reduced under the condition that an original link is covered, and the signal integrity of data transmitted between a server and a switch is effectively guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of link testing, and particularly to a microwave photonic link testing method and apparatus. Background Art

[0002] Microwave frequency signals play a crucial role in multiple fields such as communication, radar, electronic warfare, and measurement. With the development of the new generation of electronic information systems towards broadband, arrayed, generalized, and networked directions and the transformation of their technical systems, microwave frequency signals inevitably need to be transmitted over long distances in a large range. Optical fiber transmission is an efficient and low-loss transmission method that can resist electromagnetic interference and can transmit a large amount of information. However, the optical fiber transmission delay will change with factors such as the external environmental temperature and vibration, which will seriously affect the performance improvement of the electronic information system. During the design and development process of the server system, it is necessary to test the high-speed interconnected network to ensure that the signal quality meets the system requirements.

[0003] The whole cabinet server needs to be installed in advance during the production process. In the whole cabinet server, the server and the switch can be connected through cables and module connectors. However, both the long cable routing link and the quality problems of the module connectors will affect the signal integrity of the data transmitted between the server and the switch. Therefore, a microwave photonic link testing method and apparatus are needed. Summary of the Invention

[0004] The purpose of the present invention is to provide a microwave photonic link testing method and apparatus to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A microwave photonic link testing method, including the following steps:

[0006] Step S1, receiving a first control signal and a second control signal sent by the server baseboard management controller through a connector; in the case of receiving the first control signal, sending the first control signal to the controller, and returning the first feedback signal generated by the controller through the first microwave photonic fiber transmission test link to the server baseboard management controller through the connector for signal detection to obtain first test data;

[0007] Step S2, in the case of receiving the second control signal, sending the second control signal to the corresponding external hardware through a hardware interface, and returning the second feedback signal generated by the external hardware through the second microwave photonic fiber transmission test link to the server baseboard management controller through the connector for signal detection to obtain second test data;

[0008] Step S3, find the common node of the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link, connect the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link through a conduction tooling, receive the third control signal sent by the server baseboard management controller through a connector, and return the third control signal to the server baseboard management controller through the common node, the first microwave photonic fiber transmission test link, the second microwave photonic fiber transmission test link and the connector for signal detection to obtain the third test data;

[0009] Step S4, obtain the test result of the interconnection between the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link according to the first test data, the second test data, and the third test data.

[0010] Preferably: In step S1, the sensor chip receives the first control signal sent by the server baseboard management controller, and generates the first test data according to the first control signal through the sensor chip.

[0011] Preferably: In step S2, the controller sends the second feedback signal to the sensor chip, and generates the second test data according to the second feedback signal through the sensor chip.

[0012] Preferably: The conduction tooling in step S3 is made of a material with a loss not greater than 0.65 dB / inch at a frequency point of 10 GHz, and the impedance fluctuation at the transmission line and via is not more than ±5%.

[0013] Preferably: In step S4, the first test data, the second test data, and the third test data are processed through a cascading algorithm to obtain the test result of the interconnection between the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link.

[0014] According to the above-mentioned microwave photonic link testing device, it includes: a connector, which is connected to the server baseboard management controller and is used to receive the first control signal, the second control signal, and the third control signal issued by the server baseboard management controller; a controller, which is connected to the connector and is used for the controller to receive the first control signal and return the first feedback signal via the connector to be transmitted through the test link of the first microwave photonic fiber and then returned to the server baseboard management controller by the connector for signal detection; a hardware interface, which is respectively connected to the connector and external hardware and is used to receive the second control signal issued by the connector to the corresponding external hardware and return the second feedback signal via the connector to be transmitted through the test link of the second microwave photonic fiber and then returned to the server baseboard management controller by the connector for signal detection; a conduction tooling, which is used to connect two non-connected links with a common node.

[0015] Preferably: The conduction tooling is a PCB structure made of printed circuit board (PCB) material.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] In the present invention, the connector is connected to the server baseboard management controller to receive the first control signal and / or the second control signal issued by the server baseboard management controller; the controller receives the first control signal and returns the first feedback signal to the server baseboard management controller via the connector for signal detection; the hardware interface is respectively connected to the connector and external hardware and is used to receive the second control signal issued by the connector to the corresponding external hardware and return the second feedback signal to the server baseboard management controller via the connector for signal detection, so as to realize using the microwave photonic fiber transmission link testing device of the present invention to replace the HGX platform GPU module for microwave photonic fiber transmission link testing. Under the condition of covering the original link, the testing cost is significantly reduced, and the signal integrity of data transmission between the server and the switch is effectively guaranteed. Description of the Drawings

[0018] Figure 1 It is the method flow chart of the present invention. Detailed Embodiments

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Embodiment

[0021] Please refer to Figure 1 , a method for testing a microwave photonic link in the figure, including the following steps:

[0022] Step S1, receive the first control signal and the second control signal sent by the server baseboard management controller through a connector; in the case of receiving the first control signal, send the first control signal to the controller, and transmit the first feedback signal generated by the controller through the first microwave photonic fiber transmission test link back to the server baseboard management controller through the connector for signal detection to obtain the first test data;

[0023] Step S2, in the case of receiving the second control signal, send the second control signal to the corresponding external hardware through the hardware interface, and transmit the second feedback signal generated by the external hardware back to the server baseboard management controller through the second microwave photonic fiber transmission test link through the connector for signal detection to obtain the second test data;

[0024] Step S3, find the common node of the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link, and connect the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link through a conduction tooling. Receive the third control signal sent by the server baseboard management controller through the connector, and transmit the third control signal back to the server baseboard management controller through the common node, the first microwave photonic fiber transmission test link, the second microwave photonic fiber transmission test link, and the connector for signal detection to obtain the third test data;

[0025] Step S4, obtain the test result of the interconnection between the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link according to the first test data, the second test data, and the third test data.

[0026] In this embodiment, in step S1, the first control signal sent by the server baseboard management controller is received through the sensor chip, and the first test data is generated by the sensor chip according to the first control signal. In step S2, the controller sends the second feedback signal to the sensor chip, and the second test data is generated by the sensor chip according to the second feedback signal. The conduction tooling in step S3 is made of a material with a loss not greater than 0.65 dB / inch at a frequency point of 10 GHz, and the impedance fluctuation at the transmission line and the via does not exceed ±5%. In step S4, the first test data, the second test data, and the third test data are processed through a cascading algorithm to obtain the test result of the interconnection between the first microwave photonic fiber transmission test link and the second microwave photonic fiber transmission test link.

[0027] In this embodiment, a microwave photonic link testing device includes: a connector connected to a server baseboard management controller for receiving a first control signal, a second control signal, and a third control signal issued by the server baseboard management controller; a controller connected to the connector for receiving the first control signal by the controller and returning a first feedback signal via the connector to be transmitted through a first microwave photonic optical fiber test link and then returned to the server baseboard management controller by the connector for signal detection; a hardware interface respectively connected to the connector and an external hardware for receiving the second control signal issued by the connector to the corresponding external hardware and returning a second feedback signal via the connector to be transmitted through a second microwave photonic optical fiber test link and then returned to the server baseboard management controller by the connector for signal detection; and a conduction tooling for connecting two non-connected links with a common node.

[0028] Further, the conduction tooling is a PCB structure made of printed circuit board (PCB) material.

[0029] The present invention is connected to the server baseboard management controller through a connector to receive the first control signal and / or the second control signal issued by the server baseboard management controller; the controller receives the first control signal and returns a first feedback signal to the server baseboard management controller through the connector for signal detection; the hardware interface is respectively connected to the connector and the external hardware for receiving the second control signal issued by the connector to the corresponding external hardware and returning a second feedback signal to the server baseboard management controller through the connector for signal detection, so as to use the microwave photonic optical fiber transmission link testing device of the present invention to replace the HGX platform GPU module for microwave photonic optical fiber transmission link testing. Under the condition of covering the original link, the testing cost is significantly reduced, and the signal integrity of data transmitted between the server and the switch is effectively guaranteed.

[0030] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0031] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A microwave photon link testing method, characterized in that: The steps include: Step S1, receiving a first control signal and a second control signal sent by a server baseboard management controller through a connector; when the first control signal is received, sending the first control signal to the controller, and returning a first feedback signal generated by the controller to the server baseboard management controller through a first microwave photonic optical fiber transmission test link through the connector for signal detection to obtain first test data; Step S2, when receiving the second control signal, sending the second control signal to the corresponding external hardware via the hardware interface, and returning the second feedback signal generated by the external hardware to the server baseboard management controller through the connector via the second microwave photonic optical fiber transmission test link for signal detection to obtain second test data; Step S3, finding the common node of the first microwave photon fiber transmission test link and the second microwave photon fiber transmission test link, and conducting the first microwave photon fiber transmission test link and the second microwave photon fiber transmission test link through a conducting tool, receiving a third control signal issued by the server baseboard management controller through a connector, and returning the third control signal from the first microwave photon fiber transmission test link and the second microwave photon fiber transmission test link and the connector to the server baseboard management controller via the common node for signal detection, and obtaining third test data; Step S4, obtaining a test result of the interconnection between the first microwave photonic optical fiber transmission test link and the second microwave photonic optical fiber transmission test link according to the first test data, the second test data, and the third test data.

2. A microwave photon link testing method according to claim 1, characterized in that: The step S1 receives a first control signal sent by a server baseboard management controller through a sensor chip, and generates first test data according to the first control signal through the sensor chip.

3. A microwave photon link testing method according to claim 2, characterized in that: In step S2, the controller sends the second feedback signal to the sensor chip, and generates second test data according to the second feedback signal through the sensor chip.

4. A microwave photon link testing method according to claim 3, characterized in that: The conducting fixture in step S3 is made of a material with a loss of no more than 0.65 dB / inch at a frequency of 10 GHz, and the impedance fluctuation at the transmission line and the via hole does not exceed ±5%.

5. A microwave photon link testing method according to claim 4, characterized in that: The step S4 processes the first test data, the second test data, and the third test data through a cascade algorithm to obtain a test result of the interconnection between the first microwave photonic optical fiber transmission test link and the second microwave photonic optical fiber transmission test link.

6. A microwave photon link testing device according to any one of claims 1 to 5, characterized in that: include: A connector, the connector being connected to the server baseboard management controller and being used to receive a first control signal, a second control signal and a third control signal sent by the server baseboard management controller; A controller, the controller is connected to the connector, and is used for the controller to receive a first control signal, and return a first feedback signal via the connector, and return the first feedback signal from the connector to the server baseboard management controller via a first microwave photon optical fiber transmission test link for signal detection; a hardware interface, the hardware interface is respectively connected to the connector and the external hardware, and is used to receive a second control signal sent by the connector to the corresponding external hardware, and return a second feedback signal via the connector, and return the second feedback signal from the connector to the server baseboard management controller via a second microwave photon optical fiber transmission test link for signal detection; The conducting tool is used to connect two links that have a common node but are not connected.

7. A microwave photon link test device according to claim 6, characterized in that: The conducting tool is a PCB structure made of printed circuit board PCB material.

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