Switching circuit board and manufacturing process thereof
Through laser processing technology, the conductive sheet is divided into independent conductive parts and electrically connected to the test points, which solves the problems of high cost and manufacturing difficulties of existing adapter circuit boards, and realizes high-precision and high-functional adapter circuit boards.
Patent Information
- Application Number
- CN202510367225.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2025-06-24
AI Technical Summary
When existing adapter circuit boards fan out micron-sized small-pitch probes to millimeter-sized large-pitch pitches, the cost is too high and manufacturing is difficult.
By using laser processing technology, the conductive sheet is divided into a plurality of relatively independent and insulated conductive parts. By forming partition grooves on the conductive sheet, conductive parts that correspond to the test points one by one, and electrically connected to the test points through electrical connection lines.
The processing cost of the conductive part is significantly reduced, the processing accuracy is improved, the spacing between the conductive part and the contact end of the probe is reduced, and the functionality and reliability of the adapter circuit board is improved.
Smart Images
Figure CN120201635A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor test tools, and particularly relates to an adapter circuit board and a manufacturing process thereof. Background Art
[0002] During the manufacturing process of semiconductor chips, there are multiple testing processes to ensure that the shipped chips have normal functions and meet quality standards. Among them, CP testing refers to the testing carried out when the chips are in an uncut state on the wafer after wafer processing and before packaging. The purpose is to complete part or all of the chip function tests before packaging, detect manufacturing problems of the chips as early as possible, and reduce the waste of packaging costs caused by manufacturing defects in the chip wafer processing. With the increasing integration of chip manufacturing processes and packaging technologies, the pitch of chip test points is getting smaller and smaller. Since the probe needs to press on the chip test points for testing, the pitch of the probes is also getting smaller and smaller. Therefore, the probe card requires an adapter circuit board to fan out the probes with a micron-level small pitch into a millimeter-level large pitch, so that the test channels of the tester can be conductively connected to realize the function of testing the chip.
[0003] However, most of the existing adapter circuit boards are multi-layer organic boards and multi-layer ceramic boards, and such adapter circuit boards have extremely high costs and long manufacturing cycles. Summary of the Invention
[0004] The present application aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present application provides an adapter circuit board and a manufacturing process thereof, so as to solve the problems of excessively high costs and difficult manufacturing when the existing adapter circuit board fans out probes with a micron-level small pitch into a millimeter-level large pitch.
[0005] In a first aspect, the present application provides an adapter circuit board, including: a board body;
[0006] A conductive sheet and a plurality of test points electrically connected to the conductive sheet are provided on the test surface of the board body;
[0007] A plurality of conductive parts corresponding to and connected to each of the test points are formed on the conductive sheet, and a partition groove is formed on the outer peripheral side of each of the conductive parts by laser processing, so that the conductive part surrounded by the partition groove inside is insulated and isolated from other conductive parts.
[0008] Based on the above-mentioned adapter circuit board, the conductive sheet can be divided into a plurality of relatively independent and mutually insulated conductive parts by means of laser cutting. This cutting method can not only significantly improve the processing accuracy of the conductive parts at extremely low costs, but also significantly reduce the pitch of the ends of the conductive parts for contacting the probes.
[0009] Optionally, the two ends of the conductive part are respectively a contact end for electrically connecting with the probe and a connection end for electrically connecting with the test point;
[0010] The width of the conductive part gradually increases from the contact end to the connection end. There is a first set distance between the contact ends of every two adjacent conductive parts, and a second set distance between every two adjacent test points. The second set distance is greater than the first set distance.
[0011] Furthermore, based on the above arrangement of the conductive parts, the functionality of the adapter circuit board can be significantly improved, enabling the adapter circuit board to transfer small-pitch probes to multiple test points with large pitch after docking with a small-pitch probe group, thereby achieving connection with the testing machine.
[0012] Optionally, the second set distance is greater than or equal to 0.5 mm.
[0013] Optionally, at least two of the conductive parts form a group. The contact ends of at least two conductive parts in the same group are all located at the center position of the test surface, and the connection ends of at least two conductive parts in the same group are arranged in a fan shape on the outside of the contact end.
[0014] Furthermore, based on the above arrangement of the conductive parts, the layout of the adapter circuit board is further optimized, enabling the testing work of multiple groups or multiple specifications of probe groups to be completed as much as possible on a limited test surface.
[0015] Optionally, each connection end and the corresponding test point are electrically connected through an electrical connection line, and every two adjacent electrical connection lines are arranged in parallel.
[0016] Furthermore, based on the above connection method between the test points and the connection ends, after ensuring that all test points have sufficient spacing, the usage area on the test surface can be occupied less, thereby improving the utilization rate of the test surface.
[0017] Optionally, the electrical connection line is a metal coating on the test surface.
[0018] Optionally, the contact end and / or the test point is a circular conductive structure.
[0019] Furthermore, based on the above contact end and / or test point, the contact area between the conductive part and the probe, or the contact area between the test point and the testing machine can be increased, improving the reliability and stability of the adapter circuit board when connecting with the probe or the testing machine, and also reducing the difficulty during docking.
[0020] Optionally, there are multiple groups of the conductive parts and the test points, and multiple groups of the conductive parts and multiple groups of the test points are arranged uniformly along the circumference on the test surface.
[0021] Furthermore, the conductive parts and the test points are two groups, and the conductive parts and the test points can also be set into three groups, four groups, five groups, etc. according to actual needs, as long as they do not interfere with each other.
[0022] In a second aspect, the present application provides a process for manufacturing the adapter circuit board as described above, characterized in that it comprises the following steps:
[0023] S1, electroplating the center of the test surface of the board to form a conductive sheet;
[0024] S2, performing electroplating treatment on the peripheral side of the conductive sheet to form a test point;
[0025] S3, using laser to process partition grooves on the conductive sheet to form conductive parts corresponding to the test points one by one;
[0026] S4. Each conductive part is electrically connected to the corresponding test point by externally connecting wires or performing electroplating on the test surface.
[0027] Based on the above manufacturing process, the conductive sheet can be divided into multiple relatively independent and mutually insulated conductive parts by laser cutting. This cutting method can not only significantly improve the processing accuracy of the conductive parts at an extremely low cost, but also significantly reduce the spacing between the ends of the conductive parts for contacting the probes.
[0028] Optionally, step S3 specifically includes: using laser to process a U-shaped partition groove on the conductive sheet, so that a conductive part is formed at the inflection point inside the partition groove for connecting the contact end of the probe and a conductive part is formed at the open end of the partition groove for connecting the connection end of the test point.
[0029] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:
[0030] The conductive sheet can be divided into multiple relatively independent and mutually insulated conductive parts by laser cutting. This cutting method can not only significantly improve the processing accuracy of the conductive parts at a very low cost, but also significantly reduce the spacing between the ends of the conductive parts for contacting the probes.
[0031] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] The disclosure of the present application will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the drawings are used to represent similar components, among which:
[0033] Figure 1 Schematic diagram of the structure of the adapter circuit board described in the embodiments of the present application;
[0034] Figure 2 is Figure 1 Partial enlarged view of location A in
[0035] Description of reference numerals
[0036] 1. Board body; 11. Test surface; 12. Test point; 2. Conductive sheet; 21. Conductive part; 211. Contact end; 212. Connection end; 22. Partition groove; 3. Electrical connection wire. Specific embodiments
[0037] Some embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present application and are not intended to limit the protection scope of the present application.
[0038] Most of the adapter circuit boards in the prior art are multi-layer organic boards and multi-layer ceramic boards, and such adapter circuit boards have extremely high costs and long manufacturing cycles.
[0039] Based on this, the present application provides an adapter circuit board and its manufacturing process. The adapter circuit board can use laser cutting to divide the conductive sheet into multiple relatively independent and mutually insulated conductive parts. This cutting method can not only significantly improve the processing accuracy of the conductive parts at extremely low costs, but also significantly reduce the distance between the ends of the conductive parts for contacting the probes.
[0040] The present application will be specifically described below through specific embodiments.
[0041] Referring to Figure 1 and Figure 2 As shown, this embodiment provides an adapter circuit board, including: a board body 1; a conductive sheet 2 and a plurality of test points 12 electrically connected to the conductive sheet 2 are provided on the test surface 11 of the board body 1; a plurality of conductive parts 21 corresponding to and connected to each test point 12 are formed on the conductive sheet 2. That is to say, each test point 12 has a corresponding conductive part 21 on the conductive sheet 2 electrically connected thereto. After the conductive part 21 contacts the probe, the test point 12 can be electrically connected to the probe. A partition groove 22 is formed on the outer peripheral side of each conductive part 21 through laser processing, so that the conductive part 21 surrounded by the partition groove 22 is insulated and isolated from other conductive parts 21. That is to say, by performing laser cutting on the conductive sheet 2 along a set route, the shape of the conductive part 21 is outlined, and the inner side of the partition groove 22 is the outer contour of the conductive part 21.
[0042] The adapter circuit board provided in this embodiment can use laser cutting to divide the conductive sheet 2 into multiple relatively independent and mutually insulated conductive parts 21. This cutting method can not only significantly improve the processing accuracy of the conductive parts 21 at extremely low cost, but also significantly reduce the distance between the ends of the conductive parts 21 for contacting the probes.
[0043] Optionally, the two ends of the conductive part 21 are respectively a contact end 211 for electrically connecting with the probe and a connection end 212 for electrically connecting with the test point 12; the width of the conductive part 21 gradually increases from the contact end 211 to the connection end 212. The distance between the contact ends 211 of every two adjacent conductive parts 21 is a first set distance, and the distance between every two adjacent test points 12 is a second set distance, and the second set distance is greater than the first set distance.
[0044] Furthermore, based on the above settings of the conductive part 21, the functionality of the adapter circuit board can be significantly improved, enabling the adapter circuit board to transfer small-spacing probes to a plurality of test points 12 with large spacing after docking with a small-spacing probe group, thereby realizing the connection with the testing machine.
[0045] Optionally, the second set distance is greater than or equal to 0.5 mm, and the first set distance can be micron-level, so as to significantly improve the functionality of the adapter circuit board, be able to dock with a probe group with micron-level spacing, and transfer the probes with micron-level spacing to the test points 12 with millimeter-level spacing.
[0046] Optionally, at least two conductive parts 21 are in a group. The contact ends 211 of at least two conductive parts 21 in the same group are all located at the center position of the test surface 11, and the connection ends 212 of at least two conductive parts 21 in the same group are arranged in a fan shape outside the contact end 211 (arranged according to the positions of the testing machine channels). Continuing to refer to Figure 1 As shown, there are two groups of conductive parts 21 on the conductive sheet 2. The contact ends 211 of each group of conductive parts 21 are all close to the center position of the test surface 11, and the connection ends 212 are fan-shaped.
[0047] Furthermore, based on the above arrangement method of the conductive part 21, the layout of the adapter circuit board is further optimized, and it can complete the test work of multiple groups or multiple specifications of probe groups as much as possible on the limited test surface 11.
[0048] Optionally, each connection end 212 and the corresponding test point 12 are electrically connected through an electrical connection line 3, and every two adjacent electrical connection lines 3 are arranged in parallel.
[0049] Furthermore, based on the above connection method between the test point 12 and the connection end 212, after ensuring that all test points 12 have sufficient spacing, it can also occupy a smaller usage area on the test surface 11, thereby improving the utilization rate of the test surface 11.
[0050] In some embodiments, the electrical connection line 3 is a metal plating layer on the test surface 11. In other embodiments, the electrical connection line 3 can also be a wire structure such as a flying wire, as long as it can electrically connect the corresponding conductive part 21 and the test point 12.
[0051] In some embodiments, the contact end 211 and / or the test point 12 is a circular conductive structure.
[0052] Furthermore, based on the above-mentioned contact end 211 and / or test point 12, it is possible to increase the contact area between the conductive part 21 and the probe, or the contact area between the test point 12 and the testing machine, improve the reliability and stability of the adapter circuit board when connecting with the probe or the testing machine, and at the same time reduce the difficulty of docking.
[0053] Optionally, multiple groups are provided for both the conductive part 21 and the test point 12, and the multiple groups of conductive parts 21 and multiple groups of test points 12 are arranged circumferentially and evenly on the test surface 11.
[0054] Furthermore, continuing to refer to Figure 1 as shown, there are two groups for the conductive part 21 and the test point 12. The conductive part 21 and the test point 12 can also be set to three groups, four groups, five groups, etc. according to actual needs, as long as they do not interfere with each other.
[0055] In a second aspect, the present application provides a manufacturing process for an adapter circuit board as described above, which is characterized by including the following steps:
[0056] S1. Perform electroplating treatment on the central position of the test surface 11 of the board body 1 to form a conductive sheet 2;
[0057] S2. Perform electroplating treatment on the circumferential side of the conductive sheet 2 to form test points 12. Specifically, electroplating treatment is performed at multiple set points on the circumferential side of the conductive sheet 2, and a second set distance needs to be spaced between each adjacent set point, and the second set distance is not less than 0.5 mm;
[0058] S3. Use a laser to machine a partition groove 22 on the conductive sheet 2 to form conductive parts 21 corresponding to the test points 12 one by one;
[0059] S4. Through external wires or electroplating treatment on the test surface 11, electrically connect each conductive part 21 to the corresponding test point 12.
[0060] For the adapter circuit board manufactured based on the above manufacturing process, it is possible to use the laser cutting method to divide the conductive sheet 2 into multiple relatively independent and mutually insulated conductive parts 21. This cutting method can not only significantly improve the processing accuracy of the conductive parts 21 at extremely low cost, but also significantly reduce the spacing of the ends of the conductive parts 21 for contacting the probe.
[0061] Optionally, step S3 is specifically as follows: Use a laser to process a U-shaped partition groove 22 on the conductive sheet 2. There will be an angular deviation between the U-shapes of two adjacent partition grooves 22. The opening directions and the lengths of the sides of the partition groove 22 on both sides of the conductive part 21 are different, so that a contact end 211 for connecting a probe is formed at the inflection point inside the partition groove 22 and a connection end 212 for connecting the test point 12 is formed at the opening of the partition groove 22. The contact end 211 gradually widens to the connection end 212, and the width of the connection end 212 can correspond to the diameter of the test point 12. That is to say, after each conductive part 21 gradually widens to a certain width at the contact end 211, it is then used as the connection end 212 to connect with the electrical connection line 3.
[0062] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0063] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0064] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.
Claims
1. A transfer circuit board, characterized in that: include: plate(1); A conductive sheet (2) and a plurality of test points (12) electrically connected to the conductive sheet (2) are provided on the test surface (11) of the plate body (1); The conductive sheet (2) is provided with a plurality of conductive parts (21) connected one-to-one with each of the test points (12); a partition groove (22) is formed on the outer peripheral side of each of the conductive parts (21) by laser processing, so that the conductive part (21) surrounded by the partition groove (22) is insulated and isolated from other conductive parts (21).
2. The adapter circuit board according to claim 1, characterized in that: The two ends of the conductive part (21) are respectively a contact end (211) for electrically connecting to a probe and a connection end (212) for electrically connecting to the test point (12); The width of the conductive portion (21) gradually increases from the contact end (211) to the connection end (212); a first set distance is provided between the contact ends (211) of every two adjacent conductive portions (21); a second set distance is provided between every two adjacent test points (12); and the second set distance is greater than the first set distance.
3. The adapter circuit board according to claim 2, characterized in that: The second set distance is greater than or equal to 0.5 mm.
4. The adapter circuit board according to claim 2, characterized in that: At least two of the conductive parts (21) form a group, the contact ends (211) of the at least two conductive parts (21) of the same group are both located at the center of the test surface (11), and the connection ends (212) of the at least two conductive parts (21) of the same group are arranged in a fan shape outside the contact ends (211).
5. The adapter circuit board according to claim 2, characterized in that: Each of the connection ends (212) and the test point (12) corresponding thereto are electrically connected via an electrical connection line (3), and every two adjacent electrical connection lines (3) are arranged in parallel.
6. The adapter circuit board according to claim 5, characterized in that: The electrical connection line (3) is a metal coating on the test surface (11).
7. The adapter circuit board according to claim 2, characterized in that: The contact end (211) and / or the test point (12) are circular conductive structures.
8. The adapter circuit board according to claim 1, characterized in that: The conductive parts (21) and the test points (12) are each provided with a plurality of groups, and the plurality of groups of conductive parts (21) and the plurality of groups of test points (12) are evenly arranged on the test surface (11) along the circumferential direction.
9. A process for manufacturing a transfer circuit board according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, performing electroplating treatment on the center position of the test surface (11) of the plate body (1) to form a conductive sheet (2); S2, performing electroplating on the peripheral side of the conductive sheet (2) to form a test point (12); S3, using laser to process partition grooves (22) on the conductive sheet (2) to form conductive portions (21) corresponding one to one to the test points (12); S4. Each conductive portion (21) is electrically connected to a corresponding test point (12) by externally connecting wires or performing electroplating on the test surface (11).
10. The manufacturing process according to claim 9, characterized in that: The step S3 specifically comprises: using laser to process a U-shaped partition groove (22) on the conductive sheet (2), so that a conductive part (21) is formed at the inflection point inside the partition groove (22) for connecting the contact end (211) of the probe, and a conductive part (21) is formed at the open end of the partition groove (22) for connecting the connection end (212) of the test point (12).