A method for creating a database of hole clamp line width compensation data and the database itself.

Abstract

This application discloses a method and database for creating a via clamp linewidth compensation database, relating to the field of circuit board processing technology. The method for creating the via clamp linewidth compensation database includes: providing multiple core boards with copper-clad layers of different thicknesses; fabricating metallized holes on each core board; fabricating non-via clamp lines and various types of via clamp lines on each core board; measuring the linewidth b of the non-via clamp lines and the linewidth a of each via clamp line on each core board; and obtaining the linewidth compensation b-a for each via clamp line on each core board. The method and database for creating the via clamp linewidth compensation database provided in this application facilitate targeted compensation measures for different via clamp lines, ensuring that the compensated via clamp lines are compatible with the non-via clamp lines.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a method for creating a hole clamp line width compensation database and the database itself. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs), circuit fabrication is the most common and crucial part. During the etching process, there is a difference in line width between via-clamped traces and non-via-clamped traces.

[0003] In related technologies, a unified standard is used to compensate for wires with and without holes, but the compensated lines still do not meet the standard. Summary of the Invention

[0004] This application provides a method and database for creating a hole clamp line width compensation database, which facilitates targeted compensation measures for different hole clamp lines, making the compensated hole clamp lines compatible with non-hole clamp lines.

[0005] This application provides a method for creating a database of hole clamp line width compensation data, including:

[0006] Offers multiple core boards with different copper clad layers of varying thicknesses;

[0007] Metallized holes are formed on each of the core boards;

[0008] Non-hole clamping wires and various types of hole clamping wires are fabricated on each core board;

[0009] Measure the line width b of the non-hole clamping wire and the line width a of each hole clamping wire on each core board;

[0010] Obtain the line width compensation ba for each hole clamp line on each of the core boards.

[0011] In some possible implementations, the provision of multiple core boards with copper clad layers of different thicknesses includes:

[0012] A first core board, a second core board, and a third core board are provided. The copper clad layer thickness of the first core board is 18 μm, the copper clad layer thickness of the second core board is 35 μm, and the copper clad layer thickness of the third core board is 70 μm.

[0013] In some possible implementations, the process of creating metallized holes on each of the core boards includes:

[0014] Multiple first metallized holes are formed on each core board. The multiple first metallized holes are distributed in a region and form multiple first units. The first metallized holes in the same first unit have the same aperture, and the first metallized holes in different first units have different apertures.

[0015] Each of the first units includes multiple sets of the first metallized holes, and each set of the first metallized holes includes multiple first metallized holes arranged in an array. Any two adjacent columns of the first metallized holes have the same hole spacing, and each set in the same first unit has a different hole spacing.

[0016] In some possible implementations, the plurality of first metallized holes constitute twenty first units, wherein the aperture of the first metallized holes in the twenty first units is set to be from 0.2 mm to 4.0 mm, and the aperture gradient is 0.2 mm;

[0017] Each of the first units includes thirty-eight groups of the first metallized holes, with the hole spacing of the thirty-eight groups of the first metallized holes set to 3mil to 40mil and the hole spacing gradient set to 1mil.

[0018] In some possible implementations, the process of creating metallized holes on each of the core boards further includes:

[0019] Multiple second metallized holes and multiple third metallized holes are formed on each core board. The second metallized holes and the third metallized holes are alternately arranged. The multiple second metallized holes and the multiple third metallized holes are distributed into multiple second units. The second metallized holes in the same second unit have the same aperture, and the second metallized holes in different second units have different apertures.

[0020] Each second unit includes multiple modules, each module includes multiple groups, and each group includes multiple second metallized holes and multiple third metallized holes arranged in an array. The third metallized holes in the same module have the same aperture, and the third metallized holes in different modules of the same second unit have different apertures.

[0021] The second and third metallized holes in the same group have the same hole spacing, multiple second metallized holes in the same group have the same hole diameter, multiple third metallized holes have the same hole diameter, and the hole diameters of the second and third metallized holes are different. The hole spacing between the second and third metallized holes in different groups in the same module is different.

[0022] In some possible implementations, the plurality of second metallized holes and the plurality of third metallized holes constitute twenty second units, wherein the aperture of the second metallized holes in the twenty second units is set to be from 0.2 mm to 4.0 mm, and the aperture gradient is 0.2 mm;

[0023] Each of the second units comprises nineteen of the aforementioned modules, wherein the aperture of the third metallized hole in each of the nineteen modules is set to be from 0.2 mm to 4.0 mm, with an aperture gradient of 0.2 mm.

[0024] Each module comprises thirty-eight groups, wherein the hole spacing between the second metallized hole and the third metallized hole in the thirty-eight groups is set to 3mil to 40mil, and the hole spacing gradient is set to 1mil.

[0025] In some possible implementations, the fabrication of non-hole clamps and various types of hole clamps on each of the core boards includes:

[0026] Non-hole clamping wires are fabricated on each of the core boards;

[0027] In each group position of each first unit, a first hole clamp line and a second hole clamp line are made. The first hole clamp line and the second hole clamp line are distributed between two different columns of the first metallized holes. The distance between the first hole clamp line and the two adjacent columns of the first metallized holes is equal, and the distance between the second hole clamp line and the two adjacent columns of the first metallized holes is not equal.

[0028] A third hole clamp and a fourth hole clamp are fabricated at each group position of each module. The third hole clamp and the fourth hole clamp are distributed between the second metallized holes and the third metallized holes in different adjacent columns. The distance between the third hole clamp and the second metallized hole in the adjacent column is equal to the distance between the third metallized hole in the adjacent column. The distance between the fourth hole clamp and the second metallized hole in the adjacent column is different from the distance between the fourth hole clamp and the third metallized hole in the adjacent column.

[0029] In some possible implementations, the fabrication of non-hole clamps and various types of hole clamps on each of the core boards includes:

[0030] A copper plating thickness of 5 μm to 10 μm is applied to the surface of each core board.

[0031] The circuitry of the core board covered with copper is displayed.

[0032] Electroplating is performed on the exposed lines;

[0033] Etching is performed at preset positions to obtain the non-hole clamping line and the hole clamping line.

[0034] In some possible implementations, the metallization hole fabrication on each core board includes:

[0035] Drill holes in the core board;

[0036] Deburring is performed on the hole walls;

[0037] Copper plating is performed on the hole walls to obtain metallized holes.

[0038] In addition, this application also provides a hole clamp line width compensation database, which is obtained by the hole clamp line width compensation database manufacturing method provided in the above embodiments.

[0039] The beneficial effects of this application are as follows: The method for creating a via clamp linewidth compensation database provided in this application can produce via clamp lines under various conditions and have corresponding compensation values ​​for the via clamp lines. During subsequent printed circuit board (PCB) processing, operators can directly obtain the compensation values ​​for the corresponding via clamp lines from the via clamp linewidth compensation database to perform targeted and accurate compensation for the via clamp lines, ensuring that the via clamp linewidths on the PCB match the non-via clamp linewidths. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 A flowchart illustrating the method for creating a hole clamp line width compensation database in some embodiments is shown;

[0042] Figure 2 Schematic diagrams of the structure of various core boards in some embodiments are shown;

[0043] Figure 3 A schematic diagram of the distribution structure of metallized holes on the core board in some embodiments is shown;

[0044] Figure 4 Dimensional diagrams of hole clamps and non-hole clamps are shown in some embodiments;

[0045] Figure 5 Schematic diagrams of the fabrication process for hole clamps and non-hole clamps are shown in some embodiments.

[0046] Explanation of key component symbols:

[0047] 100 - Core board; 110 - First core board; 120 - Second core board; 130 - Third core board; 101 - Copper cladding layer;

[0048] 210 - First metallized via; 220 - Second metallized via; 230 - Third metallized via;

[0049] 310 - Unit 1; 320 - Unit 2; 321 - Module;

[0050] 410 - Non-hole clamp wire; 420 - Hole clamp wire; 421 - First hole clamp wire; 422 - Second hole clamp wire; 423 - Third hole clamp wire; 424 - Fourth hole clamp wire. Detailed Implementation

[0051] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0052] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0056] like Figure 1 and Figure 4 As shown, the embodiment provides a method for creating a via clamp linewidth compensation database, which can be used to obtain the via clamp linewidth compensation database. During the processing of printed circuit boards, the compensation data for the corresponding via clamp line 420 can be directly queried from the via clamp linewidth compensation database to perform compensation operations on the via clamp line 420, making the linewidth of the via clamp line 420 consistent with the linewidth of the non-via clamp line 410.

[0057] like Figures 1 to 3 As shown, the method for creating a database of hole clamp line width compensation includes:

[0058] S100 provides multiple core boards 100 with copper clad layers 101 of different thicknesses.

[0059] In some embodiments, a first core board 110, a second core board 120, and a third core board 130 are provided. The dimensions of the first core board 110, the second core board 120, and the third core board 130 can all be set to 621mm * 544mm. Specifically, the copper clad layer 101 thickness H1 of the first core board 110 is 18µm. The copper clad layer 101 thickness H2 of the second core board 120 is 35µm. The copper clad layer 101 thickness H3 of the third core board 130 is 70µm.

[0060] In other embodiments, any two of the first core board 110, the second core board 120, and the third core board 130 may also be provided.

[0061] S200, metallized holes are made on each core board 100.

[0062] In some embodiments, holes can be drilled in the first core board 110, the second core board 120, and the third core board 130 by methods such as laser drilling or mechanical drilling. Then, the hole walls are deburred. Subsequently, copper plating and electroplating are performed on the hole walls in sequence to form copper plating on the hole walls, thereby achieving the metallization treatment of the holes and obtaining metallized holes.

[0063] In some embodiments, a plurality of first metallized holes 210 are formed on each core board 100. The plurality of first metallized holes 210 are distributed into a plurality of first units 310, that is, the plurality of first metallized holes 210 are distributed and arranged according to regions to form a plurality of first units 310. The first metallized holes 210 in the same first unit 310 all have the same aperture. The aperture of the first metallized hole 210 can refer to the diameter of the first metallized hole 210. The first metallized holes 210 in different first units 310 have different apertures, that is, the aperture of the first metallized hole 210 in any first unit 310 is different from the aperture of the first metallized hole 210 in other first units 310.

[0064] In some embodiments, each first unit 310 includes multiple groups of first metallized holes 210, that is, the multiple first metallized holes 210 in each first unit 310 are distributed regionally and form multiple groups. Each group of first metallized holes 210 includes multiple first metallized holes 210 arranged in an array, that is, the multiple first metallized holes 210 in the same group are arranged in an array. In each group of multiple first metallized holes 210, any two adjacent columns of first metallized holes 210 have the same hole spacing. In the same first unit 310, the first metallized holes 210 in each group have different hole spacings, that is, the hole spacing between two adjacent columns of first metallized holes 210 in any group is different from the hole spacing between two adjacent columns of first metallized holes 210 in other groups. Here, hole spacing may refer to the edge distance between two columns of first metallized holes 210 in the same group.

[0065] In some embodiments, a plurality of first metallized holes 210 are distributed to form twenty first units 310. The aperture of the first metallized holes 210 in the twenty first units 310 is set to 0.2 mm to 4.0 mm, with a aperture gradient of 0.2 mm. That is, the aperture of the first metallized holes 210 in the twenty first units 310 is arranged in a gradient distribution, and can increase sequentially from 0.2 mm to 4.0 mm, with the aperture of the first metallized hole 210 in the later first unit 310 increasing by 0.2 mm compared to the aperture of the first metallized hole 210 in the previous first unit 310.

[0066] In some embodiments, each first unit 310 includes thirty-eight groups of first metallized vias 210, the spacing between the thirty-eight groups of first metallized vias 210 being set to 3 mil to 40 mil, and the spacing gradient being set to 1 mil. That is, the spacing between the thirty-eight groups of first metallized vias 210 is arranged in a gradient distribution, increasing sequentially from 3 mil to 40 mil, with the spacing between the next group of first metallized vias 210 increasing by 1 mil compared to the spacing between the previous group of first metallized vias 210.

[0067] In some embodiments, forming metallized holes on each core board 100 further includes:

[0068] Multiple second metallized holes 220 and multiple third metallized holes 230 are formed on each core board 100. The second metallized holes 220 and the third metallized holes 230 are alternately arranged, i.e., one row of second metallized holes 220, one row of third metallized holes 230, one row of second metallized holes 220, and so on. In addition, the multiple second metallized holes 220 and the multiple third metallized holes 230 are distributed into multiple second units 320, i.e., the multiple second metallized holes 220 and the multiple third metallized holes 230 are arranged in a regional distribution to form multiple second units 320. Each second unit 320 includes multiple modules 321, i.e., the second metallized holes 220 and the third metallized holes 230 of each second unit 320 are arranged in a regional distribution to form multiple modules 321. Each module 321 includes multiple groups, and each group includes multiple second metallized holes 220 and multiple third metallized holes 230 arranged in an array. The second metallized holes 220 and third metallized holes 230 are arranged alternately in sequence, i.e., one column of second metallized holes 220, one column of third metallized holes 230, one column of second metallized holes 220, and so on. That is, the second metallized holes 220 and third metallized holes 230 of each module 321 are distributed in a region and form multiple groups.

[0069] In some embodiments, the apertures of the plurality of second metallized holes 220 in the same group are the same, and the apertures of the plurality of third metallized holes 230 in the same group are also the same, but the apertures of the second metallized holes 220 and the third metallized holes 230 are different. Furthermore, in the same group, each column of second metallized holes 220 and third metallized holes 230 has the same hole spacing. Here, the aperture of the second metallized hole 220 refers to the diameter of the second metallized hole 220, and the aperture of the third metallized hole 230 refers to the diameter of the third metallized hole 230.

[0070] In some embodiments, within the same module 321, the spacing between the second metallized holes 220 and the third metallized holes 230 in different groups is different. In some embodiments, in different modules 321 within the same second unit 320, the third metallized holes 230 have different apertures, and the second metallized holes 220 in each module 321 within the same second unit 320 have the same aperture. In some embodiments, in different second units 320, the second metallized holes 220 have different apertures.

[0071] In some embodiments, the aperture of the second metallized hole 220 in each second unit 320 is set to be from 0.2 mm to 4.0 mm, and the aperture gradient is 0.2 mm. That is, the apertures of the second metallized holes 220 in the twenty second units 320 are arranged in a gradient distribution, and can be increased sequentially from 0.2 mm to 4.0 mm, with the aperture of the second metallized hole 220 in the later second unit 320 being 0.2 mm larger than the aperture of the second metallized hole 220 in the previous second unit 320.

[0072] In some embodiments, the same second unit 320 may include nineteen modules 321, and the aperture of the third metallized hole 230 of the nineteen modules 321 is set to 0.2 mm to 4.0 mm, with a aperture gradient of 0.2 mm. That is, the aperture of the third metallized hole 230 of the nineteen modules 321 is arranged in a gradient distribution, and can increase sequentially from 0.2 mm to 4.0 mm, with the aperture of the third metallized hole 230 of the later module 321 being 0.2 mm larger than that of the previous module 321. Moreover, in the same group, the aperture of the third metallized hole 230 is not the same as the aperture of the second metallized hole 220.

[0073] In some embodiments, each module 321 includes thirty-eight groups, wherein the hole spacing between the second metallized via 220 and the third metallized via 230 in the thirty-eight groups is set to 3 mil to 40 mil, and the hole spacing gradient is set to 1 mil. That is, in the thirty-eight groups, the hole spacing between the second metallized via 220 and the adjacent column of third metallized via 230 is arranged in a gradient distribution, increasing from 3 mil to 40 mil. The hole spacing between the second metallized via 220 in the next group and the adjacent column of third metallized via 230 is 1 mil more than the hole spacing between the second metallized via 220 in the previous group and the adjacent column of third metallized via 230.

[0074] S300, non-hole clamping wires 410 and various types of hole clamping wires 420 are fabricated on each core board 100.

[0075] like Figures 2 to 5 As shown, in some embodiments, step S300 may include the following steps:

[0076] S310, with a surface copper plating thickness of 5μm to 10um on each core board 100.

[0077] It is understood that the surfaces of the first core board 110, the second core board 120, and the third core board 130 are all electroplated with copper of a thickness of 5μm to 10μm, and a corresponding copper-clad laminate can be obtained. For example, the thickness of the copper on the surface of the core board 100 can be set to 5μm, 5.5μm, 6μm, 7μm, 7.5μm, 8μm, 9μm, 10μm, or any other thickness from 5μm to 10μm.

[0078] S320, Displaying the circuitry on the copper-clad core board 100.

[0079] Specifically, copper-clad laminates can be processed through exposure and development to retain the copper surface at preset locations.

[0080] S330, electroplating is performed on the displayed lines.

[0081] In this embodiment, copper and / or tin plating can be performed on the retained copper surface to ensure that the line thickness meets the required requirements.

[0082] S340, by etching, to obtain non-hole clamp line 410 and hole clamp line 420 at preset positions.

[0083] In the embodiment, non-hole clamping lines 410 and hole clamping lines 420 can be obtained at preset positions through an alkaline etching process.

[0084] In some embodiments, a non-hole clamping line 410 may be formed on each core board 100. The non-hole clamping line 410 is disposed away from the metallized holes, that is, the non-hole clamping line 410 is disposed away from the first metallized hole 210, the second metallized hole 220 and the third metallized hole 230.

[0085] Of course, in other embodiments, two or three or any other number of non-hole clamping lines 410 may be made on each core board 100.

[0086] In some embodiments, a first hole clamping line 421 and a second hole clamping line 422 are fabricated at each group position of each first unit 310, and the first hole clamping line 421 and the second hole clamping line 422 are distributed between two different columns of first metallized holes 210. The distance between the first hole clamping line 421 and the adjacent two columns of first metallized holes 210 is equal, that is, the first hole clamping line 421 can coincide with the central axis between the adjacent two columns of first metallized holes 210. The distance between the second hole clamping line 422 and the adjacent two columns of first metallized holes 210 is unequal, that is, the second hole clamping line 422 is offset relative to the central axis between the adjacent two columns of first metallized holes 210.

[0087] In some embodiments, in the second unit 320, a third hole clamping line 423 and a fourth hole clamping line 424 are fabricated at each group position in each module 321. The third hole clamping line 423 and the fourth hole clamping line 424 are distributed between the second metallized holes 220 and the third metallized holes 230 in different adjacent columns. The distance between the third hole clamping line 423 and the adjacent column of second metallized holes 220 is equal to the distance between the third hole clamping line 423 and the adjacent column of third metallized holes 230. That is, the central axis of the third hole clamping line 423 coincides with that of the adjacent column of second metallized holes 220 and the third metallized holes 230. The distance between the fourth hole clamping line 424 and the adjacent column of second metallized holes 220 is different from the distance between the fourth hole clamping line 424 and the adjacent column of third metallized holes 230; that is, the central axis of the fourth hole clamping line 424 is misaligned with that of the adjacent column of second metallized holes 220 and the third metallized holes 230.

[0088] Accordingly, four different types of hole clamp lines 420 can be fabricated on each core board 100, including first hole clamp lines 421 with the same hole diameter and equal spacing, second hole clamp lines 422 with the same hole diameter but unequal spacing, third hole clamp lines 423 with unequal hole diameter and equal spacing, and fourth hole clamp lines 424 with unequal hole spacing and unequal spacing.

[0089] S400, measure the line width b of the non-hole clamping line 410 and the line width a of the hole clamping line 420 on each core board 100.

[0090] In spray etching, the etching process involves the penetration of the chemical solution within the liquid film, while high-pressure spraying facilitates the exchange of the liquid film, thus etching the circuitry. Building upon the existing liquid-level penetration and chemical exchange, the liquid film at the metallized vias experiences rapid flow due to the penetration capability of the vias. This rapid flow of the chemical allows for non-impact exchange of the liquid film at these locations. Consequently, the etching capability at the metallized via locations exceeds that at non-metallized via locations.

[0091] Furthermore, the size of the metallized holes also affects the etching capability. Smaller holes result in weaker penetration of the etching solution, slower liquid film migration, and consequently, weaker etching ability. Larger holes, on the other hand, result in stronger penetration of the etching solution, faster liquid film migration, and stronger etching capability. Additionally, the spray pressure during the etching process also affects the etching rate; in this embodiment, the spray pressure can be set to be constant.

[0092] Accordingly, the line width a of the hole clamp line 420 at the metallized hole location will be smaller than the line width b of the non-hole clamp line 410.

[0093] S500, obtain the line width compensation ba of each hole clamp line 420 on each core board 100.

[0094] In the embodiments, the line width compensation of the first hole clamping wire 421 under each condition, the line width compensation of the second hole clamping wire 422 under each condition, the line width compensation of the third hole clamping wire 423 under each condition, and the line width compensation of the fourth hole clamping wire 424 under each condition can be obtained respectively.

[0095] During the processing of printed circuit boards, the corresponding line width compensation can be obtained from the line width compensation database of the hole clamp line 420 according to the conditions of the hole clamp line 420, so as to perform individual and accurate compensation processing on the hole clamp line 420, ensuring that the line width of the hole clamp line 420 in the printed circuit board is compatible with the line width of the non-hole clamp line 410.

[0096] In this embodiment, a hole clamp line width compensation database is also provided, which can be obtained by the hole clamp line width compensation database manufacturing method provided in this embodiment.

[0097] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0098] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A hole clip line width compensation database creation method, characterized by, The application relates to a method for manufacturing a multi-layer printed circuit board. The method comprises the following steps: providing a plurality of core boards with different thicknesses of copper cladding; making a metalized hole on each of the core boards; making a non-hole clamping line and a plurality of types of hole clamping lines on each of the core boards; measuring the line width b of the non-hole clamping line and the line width a of each of the hole clamping lines on each of the core boards; 2. The hole pinch line width compensation library method of claim 1, wherein, obtaining the line width compensation b-a of each of the hole clamping lines on each of the core boards. The method for providing a plurality of core boards with different thicknesses of copper cladding comprises the following steps:

3. The hole pinch line width compensation library method of claim 1, wherein, providing a first core board, a second core board and a third core board, wherein the thickness of the copper cladding of the first core board is 18 um, the thickness of the copper cladding of the second core board is 35 um, and the thickness of the copper cladding of the third core board is 70 um. The method for making a metalized hole on each of the core boards comprises the following steps: making a plurality of first metalized holes on each of the core boards, wherein the plurality of first metalized holes are distributed in regions and form a plurality of first units, the first metalized holes in a same first unit have the same hole diameter, and the first metalized holes in different first units have different hole diameters; 4. The hole pinch line width compensation library method of claim 3, wherein, each of the first units comprises a plurality of groups of the first metalized holes, each group of the first metalized holes comprises a plurality of the first metalized holes arranged in an array, and any two adjacent columns of the first metalized holes have the same hole spacing, and each group in a same first unit has different hole spacing. The plurality of first metalized holes constitute twenty first units, the hole diameters of the first metalized holes in the twenty first units are set to be 0.2 mm to 4.0 mm, and the hole diameter gradient is 0.2 mm.

5. The hole pinch line width compensation library method of claim 3, wherein, Each of the first units comprises thirty-eight groups of the first metalized holes, the hole spacing of the thirty-eight groups of the first metalized holes is set to be 3 mil to 40 mil, and the hole spacing gradient is set to be 1 mil. The method for making a metalized hole on each of the core boards further comprises the following steps: making a plurality of second metalized holes and a plurality of third metalized holes on each of the core boards, wherein the second metalized holes and the third metalized holes are arranged alternately, the plurality of second metalized holes and the plurality of third metalized holes are distributed into a plurality of second units, the second metalized holes in a same second unit have the same hole diameter, and the second metalized holes in different second units have different hole diameters; each of the second units comprises a plurality of modules, each of the modules comprises a plurality of groups, each group comprises a plurality of the second metalized holes and a plurality of the third metalized holes arranged in an array, the third metalized holes in a same module have the same hole diameter, and the third metalized holes in different modules in a same second unit have different hole diameters; the second metalized holes and the third metalized holes in a same group have the same hole spacing, the hole diameters of the plurality of second metalized holes in a same group are the same, the hole diameters of the plurality of third metalized holes in a same group are the same, the hole diameter of the second metalized holes is different from the hole diameter of the third metalized holes, and the hole spacing of the second metalized holes and the third metalized holes in different groups in a same module is different.

6. The hole pinch line width compensation library method of claim 5, wherein, The plurality of second metallized holes and the plurality of third metallized holes constitute twenty of the second units, the second metallized holes of the twenty of the second units are set to have a hole diameter of 0.2mm to 4.0mm, and a hole diameter gradient of 0.2mm; Each of the second units comprises nineteen of the modules, the third metallized holes of the nineteen of the modules are set to have a hole diameter of 0.2mm to 4.0mm, and a hole diameter gradient of 0.2mm; Each of the modules comprises thirty-eight groups, the hole spacing between the second metallized holes and the third metallized holes in the thirty-eight groups is set to be 3mil to 40mil, and a hole spacing gradient of 1mil.

7. The hole pinch line width compensation library method of claim 5 or 6, wherein, The non-hole clamping lines and the plurality of types of hole clamping lines on each of the core boards are made by: Making non-hole clamping lines on each of the core boards; Making first hole clamping lines and second hole clamping lines in each group position of each of the first units, the first hole clamping lines and the second hole clamping lines are distributed between different two columns of the first metallized holes, the distance between the first hole clamping lines and the adjacent two columns of the first metallized holes is equal, and the distance between the second hole clamping lines and the adjacent two columns of the first metallized holes is not equal; Making third hole clamping lines and fourth hole clamping lines in each group position of each of the modules, the third hole clamping lines and the fourth hole clamping lines are distributed between different adjacent columns of the second metallized holes and the third metallized holes, the distance between the third hole clamping lines and the adjacent columns of the second metallized holes is equal to the distance between the third hole clamping lines and the adjacent columns of the third metallized holes, and the distance between the fourth hole clamping lines and the adjacent columns of the second metallized holes is different from the distance between the fourth hole clamping lines and the adjacent columns of the third metallized holes.

8. The hole-clip linewidth compensation library fabrication method of claim 1, wherein, The non-hole clamping lines and the plurality of types of hole clamping lines on each of the core boards are made by: Electroplating surface copper with a thickness of 5μm to 10um on the surface of each of the core boards; Performing line development on the core board covered with the surface copper; Electroplating on the developed lines; Etching the preset positions to obtain the non-hole clamping lines and the hole clamping lines.

9. The hole-clip linewidth compensation library fabrication method of claim 1, wherein, The metallized holes on each of the core boards are made by: Drilling holes on the core boards; Deburring the hole walls; Plating copper on the hole walls to obtain the metallized holes.

10. A hole clip line width compensation library characterized by, By the hole clamping line width compensation database making method according to any one of claims 1 to 9. By the hole clamping line width compensation database making method according to any one of claims 1 to 9.

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