LED packaging process

Abstract

The invention discloses an LED packaging process, and relates to the technical field of LEDs. Comprising the following steps: filling and leveling a ceramic substrate to ensure that the surface of the substrate is flat, and providing a foundation for a subsequent process; a box dam is arranged on the ceramic substrate, and the inner side of the box dam has an inclination angle of 50 + / -5 degrees; the design of the inclination angle is beneficial to improving the light emitting effect of the chip and reducing light loss; after the box dam is arranged, color matching is carried out; and after the color matching process is completed, performing a mold top ball head process to form a complete LED packaging structure. Through the design of the box dam structure and the inclination angle, the light emitting effect is optimized, and the lighting effect and uniformity of the LED are improved in combination with various color modulation processes.

Description

Technical Field

[0001] The present invention relates to the field of LED technology, and particularly to an LED packaging process. Background Art

[0002] As an efficient and energy-saving light source, LED (light-emitting diode) has been widely used in fields such as lighting and display. In the process of LED packaging, how to improve the light extraction efficiency is an important technical issue. The traditional LED packaging structure usually uses a flat substrate, and the light extraction effect is limited. In addition, existing color mixing processes (such as dispensing, powder spraying, film pasting, etc.) have problems such as uneven light efficiency and complex processes in application. Therefore, a new packaging structure and process are needed to optimize the light extraction effect and simplify the process flow. Summary of the Invention

[0003] Aiming at the deficiencies in the prior art, the purpose of the present invention is to provide an LED packaging process. Through the design of the dam structure and the tilt angle, the light extraction effect is optimized, and combined with various color mixing processes, the light efficiency and uniformity of the LED are improved.

[0004] To achieve the above object, the present invention is realized by the following technical solutions: An LED packaging process includes the following steps:

[0005] 1. Pretreatment of the ceramic substrate: The shaded part A of the ceramic substrate is filled to ensure the flatness of the substrate surface and provide a basis for subsequent processes.

[0006] 2. Design of the dam structure:

[0007] A dam is set on the ceramic substrate, and the inner side of the dam has an inclination angle of 50±5°; the design of this inclination angle is beneficial to improving the light extraction effect of the chip and reducing light loss;

[0008] 3. Color mixing process

[0009] After the dam is set, color mixing is carried out.

[0010] Preferably, the LED packaging process further includes a die top ball head process. After the color mixing process is completed, the die top ball head process is carried out to form a complete LED packaging structure. The die top ball head can be die topped at different angles.

[0011] Preferably, any one of the following processes is used for the color mixing:

[0012] Conventional dispensing process: The fluorescent glue is evenly coated on the inner side of the dam through a dispensing device.

[0013] Powder spraying process: The fluorescent powder is sprayed on the inner side of the dam to form a uniform fluorescent layer.

[0014] Film - sticking process: Attach a fluorescent film inside the dam to achieve a color - mixing effect.

[0015] Preferably, the dam is circular, square - cup - shaped or oval.

[0016] Advantages of the present invention: Through the design of the dam structure and the tilt angle, the light extraction efficiency of the LED chip is significantly improved. By adopting various color - mixing processes (dispensing, powder - spraying, film - sticking), the most suitable process can be selected according to requirements, improving production flexibility and light - effect uniformity. The filling treatment of the ceramic substrate ensures the flatness of the substrate surface, providing a good foundation for subsequent processes. The die - top ball - head process further optimizes the packaging structure, enhancing the reliability and light effect of the LED. Brief Description of the Drawings

[0017] The present invention will be described in detail below in conjunction with the drawings and specific embodiments;

[0018] Figure 1 It is a schematic diagram of the front - side dam of the bracket of the present invention;

[0019] Figure 2 For Figure 1 bottom view;

[0020] Figure 3 It is the front - and - back effect diagram of the bracket of the present invention;

[0021] Figure 4 It is the front - side and ball - head effect diagram of the bracket of the present invention;

[0022] Figure 5 It is the ball - head effect diagram of the present invention. Detailed Description of the Preferred Embodiments

[0023] To make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0024] Referring to Figures 1-5 , the following technical solutions are adopted in this specific embodiment: An LED packaging process, including the following steps:

[0025] 1. Pretreatment of the ceramic substrate: Perform a filling treatment on the ceramic substrate 1 to ensure the flatness of the substrate surface and provide a foundation for subsequent processes. Injection holes 3 are provided at the centers of the four sides of the front of the ceramic substrate 1, and a gasket 4 is provided at the center of the ceramic substrate 1.

[0026] 2. Design of the dam structure: Set a dam 2 on the ceramic substrate, and the inner side of the dam has an inclination angle of 50 ± 5°; the design of this inclination angle is beneficial to improving the light extraction effect of the chip and reducing light loss;

[0027] 3. Color mixing process: After the dam is set up, color mixing is carried out; any one of the following processes is adopted for the color mixing:

[0028] 3.1 Conventional dispensing process: The fluorescent glue is evenly coated on the inner side of the dam through a dispensing device.

[0029] 3.2 Powder spraying process: The fluorescent powder is sprayed on the inner side of the dam to form a uniform fluorescent layer.

[0030] 3.3 Film sticking process: A fluorescent film is attached to the inner side of the dam to achieve the color mixing effect.

[0031] The LED packaging process further includes a die top ball head process. After the color mixing process is completed, the die top ball head process is carried out to form a complete LED packaging structure. The die top ball head can be die topped at different angles.

[0032] In this specific embodiment, a ceramic substrate is selected, and the ceramic substrate is filled and leveled to ensure a flat surface. A dam is set on the ceramic substrate, and the inner inclination angle of the dam is 50 ± 5°. The dispensing, powder spraying or film sticking process is selected according to requirements for color mixing. After the color mixing is completed, the die top ball head process is carried out to form a complete LED packaging structure.

[0033] In this specific embodiment, first, through the pretreatment and filling of the ceramic substrate, the flatness of the substrate surface is ensured, providing a stable foundation for subsequent processes; second, the design of the 50 ± 5° inner inclination angle of the dam significantly improves the light extraction efficiency of the LED chip and reduces light loss; in addition, the use of various color mixing processes such as dispensing, powder spraying or film sticking not only improves the production flexibility but also allows the selection of the most suitable process according to requirements to ensure the uniformity and consistency of the light effect; finally, the die top ball head process further optimizes the packaging structure and improves the reliability and light effect of the LED. The overall process is simple and efficient, suitable for large-scale production, and has broad application prospects.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A LED packaging process, characterized in that: The following steps are involved: (1) Ceramic substrate pretreatment: Fill and level the ceramic substrate to ensure that the surface of the substrate is flat, providing a basis for subsequent processes; (2) Design of dam structure: A dam is set on the ceramic substrate, and the inner side of the dam has an inclination angle of 50±5°; the design of the inclination angle is conducive to improving the light output effect of the chip and reducing light loss; (3) Color matching process After the dam is set up, the color is adjusted.

2. The LED packaging process according to claim 1, characterized in that: It also includes a mold top ball head process. After the color adjustment process is completed, the mold top ball head process is performed to form a complete LED packaging structure.

3. The LED packaging process according to claim 1, characterized in that: The color mixing adopts any one of the following processes: Conventional dispensing process: The fluorescent glue is evenly applied on the inner side of the dam through the dispensing equipment; Powder spraying process: spray the phosphor on the inner side of the dam to form a uniform phosphor layer; Film pasting process: Attach fluorescent film to the inner side of the dam to achieve the color adjustment effect.

4. The LED packaging process according to claim 1, characterized in that: The dam is in the shape of a circle, a square cup or an ellipse.

5. The LED packaging process according to claim 2, characterized in that: The ball head can be molded at different angles.

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