Integrated circuit chip packaging test device

Abstract

The invention relates to an integrated circuit chip packaging testing device which comprises a box body, a stepping motor is arranged in the box body, the output end of the stepping motor is fixedly connected with a rotating column, the rotating column penetrates through the upper surface of the box body, the rotating column is fixedly connected with a plurality of electric telescopic rods, one end of each electric telescopic rod is connected with a rotating disc structure, and the other end of each electric telescopic rod is connected with a rotating disc. A light structure is fixedly connected to the top end of the rotating column, a transmission antenna is fixedly arranged on the upper surface of the light structure, a stand column is fixedly arranged on the upper surface of the box body and located on one side of the rotating disc structure, a connecting rod is fixedly connected to the upper portion of the stand column, and an industrial camera is fixedly connected to one end of the connecting rod. Through cooperation of the rotating disc structure and the electric telescopic rod, defective chips and qualified chips can be accurately sorted, information of the chips with flaws is printed out through the lamplight structure and the printer, each chip is numbered according to the lamplight structure, and the information of each flawed chip can be clearly displayed.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to an integrated circuit chip packaging and testing device. Background Art

[0002] An integrated circuit is a microelectronic device or component. Using a certain process, transistors, resistors, capacitors, inductors and other components and wirings required in a circuit are interconnected and fabricated on a small piece or a few small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a package to form a micro-structure with the required circuit functions; all components are integrated into a whole in structure, which has taken a big step forward in the direction of miniaturization, low power consumption, intelligence and high reliability of electronic components.

[0003] When detecting existing integrated circuit chips, industrial cameras are used for shooting, and then defects are identified. However, the existing detection can only perform chip detection and cannot directly sort out defective chips, which easily leads to the mixing of defective and qualified chips, not only affecting work efficiency but also prone to sorting errors. Summary of the Invention

[0004] In view of the above problems existing in the prior art, the main object of the present invention is to provide an integrated circuit chip packaging and testing device.

[0005] The technical solution of the present invention is as follows: An integrated circuit chip packaging and testing device includes a box body. A stepping motor is provided inside the box body. The output end of the stepping motor is fixedly connected to a rotating column, and the rotating column penetrates through the upper surface of the box body. A plurality of electric telescopic rods are fixedly connected to the rotating column. One end of the electric telescopic rod is connected to a rotating disc structure. The top end of the rotating column is fixedly connected to a lighting structure. A transmission antenna is fixedly provided on the upper surface of the lighting structure. On the upper surface of the box body, a column is fixedly provided on one side of the rotating disc structure. A connecting rod is fixedly connected above the column, and one end of the connecting rod is fixedly connected to an industrial camera. On the upper surface of the box body, a qualified inclined track and a defective inclined track are fixedly provided around the rotating disc structure. A printer is provided on the upper surface of the box body on one side of the defective inclined track. A control panel is fixedly provided on the side surface of the box body.

[0006] As a preferred embodiment, the rotating disc structure includes a combined rotating block. A rotating base is fixedly provided on the surface of the combined rotating block facing the rotating column. The rotating base is connected to the electric telescopic rod through a pin. Two chutes are provided on both sides of the combined rotating block, and the combined rotating block is rotatably connected to a fixed ring.

[0007] As a preferred embodiment, the lighting structure includes a fixing plate, and a plurality of rotating lamp holders are provided on the fixing plate, and the rotating lamp holders are rotatably connected to digital lamps.

[0008] As a preferred embodiment, the combined rotating blocks are slidably connected to each other, a placing table is formed by combining the combined rotating blocks, and a rubber anti-slip pad is provided on the upper surface of the combined rotating blocks.

[0009] As a preferred embodiment, an information transmission module is provided in the digital lamp, and the digital lamps and the combined rotating blocks correspond to each other one by one.

[0010] As a preferred embodiment, the camera of the industrial camera is directly facing one of the combined rotating blocks.

[0011] As a preferred embodiment, a signal transmission module is provided at the control end of the electric telescopic rod, a CPU processing center is provided in the control panel, the signal transmission module is electrically connected to the CPU processing center, and the information transmission module and the printer are both electrically connected to the CPU processing center.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are that through the cooperation of the rotating disk structure and the electric telescopic rod, defective chips and qualified chips can be accurately sorted, and the information of the defective chips is printed out through the lighting structure and the printer, and each chip is numbered according to the lighting structure, and the information of each defective chip is clearly displayed. Description of the Drawings

[0013] Figure 1 is a schematic diagram of the overall structure of an integrated circuit chip packaging and testing device provided by the present invention; Figure 2 is a schematic diagram of the rotating disk structure of an integrated circuit chip packaging and testing device provided by the present invention; Figure 3 is a schematic diagram of the lighting structure of an integrated circuit chip packaging and testing device provided by the present invention.

[0014] Legend: 1, box body; 2, rotating column; 3, electric telescopic rod; 4, rotating disk structure; 41, combined rotating block; 42, rotating base; 43, sliding groove; 44, fixing ring; 5, lighting structure; 51, fixing plate; 52, rotating lamp holder; 53, digital lamp; 6, transmission antenna; 7, column; 8, connecting rod; 9, industrial camera; 10, qualified inclined track; 11, defective inclined track; 12, printer; 13, control panel. Detailed Embodiments

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0016] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0017] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "install", "connect", "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Embodiment An integrated circuit chip packaging and testing device includes a box body 1. Inside the box body 1, there is a stepping motor. The output end of the stepping motor is fixedly connected to a rotating column 2. The rotating column 2 penetrates the upper surface of the box body 1. A number of electric telescopic rods 3 are fixedly connected to the rotating column 2. One end of the electric telescopic rod 3 is connected to a rotating disc structure 4. The top of the rotating column 2 is fixedly connected to a lighting structure 5. A transmission antenna 6 is fixedly provided on the upper surface of the lighting structure 5. On the upper surface of the box body 1, a column 7 is fixedly provided on one side of the rotating disc structure 4. An adapter rod 8 is fixedly connected above the column 7. One end of the adapter rod 8 is fixedly connected to an industrial camera 9. On the upper surface of the box body 1, a qualified inclined track 10 and a defective inclined track 11 are fixedly provided around the rotating disc structure 4. On one side of the defective inclined track 11, a printer 12 is provided on the upper surface of the box body 1. A control panel 13 is fixedly provided on the side surface of the box body 1. The integrated circuit chips are sequentially placed by using the rotating disc structure 4. As the rotating column 2 rotates, it drives the rotating disc structure 4 to rotate. When the rotating disc structure 4 rotates to directly below the industrial camera 9, the industrial camera 9 detects the integrated circuit chips. The industrial camera 9 will transmit the information to the control panel 13. For the chips with defects, when they rotate to the position of the defective inclined track 11, the electric telescopic rod 3 is activated to convey the defective chips to the defective inclined track 11. At the same time, the lighting structure 5 will number the defective chips, and when the industrial camera 9 takes pictures, the numbers will be taken in at the same time. When the defective chips enter the position of the defective inclined track 11, the printer 12 will print the taken pictures, corresponding to the chips one by one, which is convenient for information collection and pointing out the defect problems of defective products.

[0019] The rotating disc structure 4 includes a combined rotating block 41. On the side of the combined rotating block 41 facing the rotating column 2, a rotating base 42 is fixedly provided. The rotating base 42 is connected to the electric telescopic rod 3 through a pin. There are two sliding grooves 43 on both sides of the combined rotating block 41. The combined rotating block 41 is rotatably connected to a fixed ring 44. The combined rotating block 41 can rotate around the fixed ring 44 to generate an inclination angle, so that the chips on the upper surface of the combined rotating block 41 slide onto the corresponding qualified inclined track 10 and defective inclined track 11. Each combined rotating block 41 corresponds to an electric telescopic rod 3, and each electric telescopic rod 3 is controlled independently, which can achieve precise sorting.

[0020] The lighting structure 5 includes a fixing plate 51. A number of rotating lamp holders 52 are provided on the fixing plate 51. The rotating lamp holders 52 are rotatably connected to digital lamps 53. The digital lamps 53 can change numbers, which belongs to the prior art and will not be described here. Each digital lamp 53 corresponds to a combined rotating block 41. Only when defective products appear, the digital lamp 53 will number the defective chips. The industrial camera 9 will photograph the defective chips with numbers. The digital lamp 53 will rotate consistently with the defective chips until the defective chips enter the defective inclined track 11. The printer 12 will print the photographed pictures and correspond them to the defective chips. The combined rotating blocks 41 are slidably connected to each other. The combined rotating blocks 41 form a placement table through combination. A rubber anti-slip pad is provided on the upper surface of the combined rotating block 41 to fix the back of the integrated circuit chip by using the rubber anti-slip pad to prevent the chip from falling off during rotation. An information transmission module is provided in the digital lamp 53. The digital lamp 53 corresponds to the combined rotating block 41 one by one to ensure that the numbers of defective chips follow the chips to rotate and enter the defective inclined track 11. The camera of the industrial camera 9 is facing one of the combined rotating blocks 41 to facilitate the industrial camera 9 to detect the chips and identify defects.

[0021] The control end of the electric telescopic rod 3 is provided with a signal transmission module. A CPU processing center is provided in the control panel 13. The signal transmission module is electrically connected to the CPU processing center. The information transmission module and the printer 12 are both electrically connected to the CPU processing center. The CPU processing center is responsible for information processing and automatic control to achieve automation.

[0022] Working principle: As shown in the figure, when in use, the user stands on one side of the box body 1 and starts the stepping motor through the control panel 13 to drive the rotating disc structure 4 to rotate. Manually place the integrated circuit chip on the combined rotating block 41. When the combined rotating block 41 rotates under the industrial camera 9, the industrial camera 9 will photograph the integrated circuit chip and send it to the CPU processing center for defect detection. If defective chips appear, the CPU processing center will control the digital lamp 53 to number the defective chips. Then the industrial camera 9 will take another picture and send the defect detection and the picture with numbers to the printer 12. When the defective chip rotates to the defective inclined track 11, the CPU processing center will control the electric telescopic rod 3 corresponding to the combined rotating block 41 where the defective chip is placed to extend and retract, so that the combined rotating block 41 is inclined. Due to the action of gravity, the defective chip moves towards the defective inclined track 11. At the same time, the printer 12 will print the defect report and the picture at the same time to achieve one-to-one correspondence. When the qualified product rotates to the qualified inclined track 10, the corresponding electric telescopic rod 3 will be started to drive the combined rotating block 41 to be inclined and enter the qualified inclined track 10 to complete the chip sorting.

[0023] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated circuit chip packaging and testing device, comprising a box (1), characterized in that: The box (1) is provided with a stepper motor inside, the output end of the stepper motor is fixedly connected to a rotating column (2), the rotating column (2) passes through the upper surface of the box (1), a plurality of electric telescopic rods (3) are fixedly connected to the rotating column (2), one end of the electric telescopic rod (3) is connected to a rotating disk structure (4), the top of the rotating column (2) is fixedly connected to a lighting structure (5), a transmission antenna (6) is fixedly provided on the upper surface of the lighting structure (5), a column (7) is fixedly provided on the upper surface of the box (1) at one side of the rotating disk structure (4), a connecting rod (8) is fixedly connected above the column (7), one end of the connecting rod (8) is fixedly connected to an industrial camera (9), a qualified inclined track (10) and a defective inclined track (11) are fixedly provided on the upper surface of the box (1) at the periphery of the rotating disk structure (4), a printer (12) is provided on the side of the defective inclined track (11) and located on the upper surface of the box (1), and a control panel (13) is fixedly provided on the side surface of the box (1).

2. The integrated circuit chip packaging and testing device according to claim 1, characterized in that: The rotating disk structure (4) comprises a combined rotating block (41), a rotating base (42) being fixedly provided on a side of the combined rotating block (41) facing the rotating column (2), the rotating base (42) being connected to the electric telescopic rod (3) via a pin, two sliding grooves (43) being provided on both sides of the combined rotating block (41), and the combined rotating block (41) being rotatably connected to a fixing ring (44).

3. The integrated circuit chip packaging and testing device according to claim 1, characterized in that: The lighting structure (5) comprises a fixing plate (51), on which a plurality of rotating lamp holders (52) are provided, and the rotating lamp holders (52) are rotatably connected to the digital lamps (53).

4. The integrated circuit chip packaging and testing device according to claim 2, characterized in that: The combined rotating blocks (41) are slidably connected to each other, the combined rotating blocks (41) are combined to form a placement table, and the upper surfaces of the combined rotating blocks (41) are provided with rubber anti-slip pads.

5. The integrated circuit chip packaging and testing device according to claim 3, characterized in that: An information transmission module is provided in the digital lamp (53), and the digital lamp (53) corresponds one to one with the combined rotating block (41).

6. The integrated circuit chip packaging and testing device according to claim 1, characterized in that: The camera head of the industrial camera (9) is facing one of the combined rotating blocks (41).

7. The integrated circuit chip packaging and testing device according to claim 1, characterized in that: The control end of the electric telescopic rod (3) is provided with a signal transmission module, the control panel (13) is provided with a CPU processing center, the signal transmission module is electrically connected to the CPU processing center, and the information transmission module and the printer (12) are both electrically connected to the CPU processing center.

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