Multi-layer circuit board grinding equipment

Abstract

The invention discloses multilayer circuit board grinding equipment, and relates to the technical field of grinding equipment. A clamping seat is arranged on the clamping table; tensioning rollers are oppositely arranged on the tensioning seat up and down; the first grinding belt is over against the joint of the board layers of the multi-layer circuit board; the second grinding belt sleeves the second rotating shaft; the second grinding belt far away from the first grinding belt and one side of the multilayer circuit board far away from the board layer joint are on the same end face; a driving member; when the first grinding belt grinds the reserved part towards the direction of the multi-layer circuit board, the stirring assembly drives the tensioning roller to synchronously approach the multi-layer circuit board; when the first grinding belt grinds to the side wall of the multi-layer circuit board, the control assembly limits the first grinding belt to continuously grind the multi-layer circuit board and controls the second grinding belt to grind to the side wall of the multi-layer circuit board; when the first grinding belt is away from the multilayer circuit board, the control assembly controls the second grinding belt to the side, away from the multilayer circuit board, of the first grinding belt. The machining quality can be improved.

Description

Technical Field

[0001] This application relates to the technical field of grinding equipment, and in particular to a multi-layer circuit board grinding equipment. Background Art

[0002] In electronic and electrical products, a multi-layer printed circuit board (PCB) is stacked by multiple single- and double-sided wiring layers. When manufacturing a multi-layer printed circuit board, the lamination process is mainly used. According to the design sequence, multiple single- and double-layer PCB boards are glued and stacked with glue, and then laminated under high temperature and high pressure to make each layer stick firmly into a whole.

[0003] During processing, for circuit boards with many processes, protruding parts are usually left at key positions on the edge to facilitate clamping and fixing during processing. When processing is completed, this part is ground off with grinding equipment. At the same time, to improve production efficiency, multi-layer printed circuit boards are usually ground uniformly after all the board layers are laminated and bonded.

[0004] When manufacturing a multi-layer printed circuit board, air bubbles between the laminated boards are usually removed by extrusion. However, when the circuit board has a large area, during the process of the air bubbles in the middle moving towards the edge position, they are likely to remain near the edge. At this time, although most of the air bubbles can be removed, there are still some small air bubbles in the edge glue.

[0005] When grinding a multi-layer printed circuit board after production, a device with small abrasive grains is used to grind the reserved part. Although the small air bubbles at the edge position do not affect the use of the circuit board, when grinding the reserved part, the small air bubbles in the glue are exposed to form small holes. During grinding, the small abrasive grains will fall off. If the size of the small holes is similar to that of the fallen small abrasive grains, the small abrasive grains will fall into the small holes. When continuing to grind, the grinding part of the equipment squeezes the small abrasive grains, which will cause extrusion on the two layers of boards above and below the small holes, resulting in delamination between the two layers of boards above and below the small holes and affecting the processing quality. Summary of the Invention

[0006] In order to improve the processing quality, this application provides a multi-layer circuit board grinding equipment.

[0007] This application provides a multi-layer circuit board grinding equipment, adopting the following technical solutions: A multi-layer circuit board grinding equipment includes a machine body; A clamping table is arranged on the machine body. A clamping seat is arranged on the clamping table. The clamping seat is provided with a clamping tooling. A grinding area adjacent to the clamping seat is arranged on the clamping table; A tensioning seat is slidably connected to the clamping table and is located in the grinding area. Tensioning rollers are arranged on the tensioning seat in an up-and-down opposite manner, and a tensioning space is formed between the tensioning rollers; A grinding table is arranged on the machine body and is located at a side of the grinding area away from the clamping seat. A grinding seat is slidably arranged on the grinding table, and a receiving groove is provided on a side of the grinding seat close to the grinding area. A first grinding belt is arranged on the grinding seat, wherein a first rotating shaft is symmetrically and rotationally connected inside the grinding seat, the first grinding belt is connected end to end and sleeved on the first rotating shaft, and the first grinding belt faces the connection between the layers of the multi-layer circuit board; The upper and lower groove walls of the receiving groove are respectively provided with mounting seats that can be slidably disposed close to or away from the groove opening, and the mounting seats are provided with a second rotating shaft that rotates relatively, and the second rotating shaft is located between the first rotating shaft and away from the grinding area; A second grinding belt, connected end to end and arranged opposite to each other up and down, the second grinding belt is sleeved on the second rotating shaft, and the second grinding belt is slidably connected with the first grinding belt when sliding toward the grinding area; The second grinding belt is located away from the first grinding belt and is located on the same end surface as the multi-layer circuit board away from the connection between the board layers; A power assembly is disposed on the grinding seat, and the power assembly drives the first rotating shaft and the second rotating shaft to rotate; A driving member, disposed on the grinding table, the driving member controls the grinding table to approach and move away from the grinding area; A shifting assembly, wherein when the first grinding belt grinds the reserved portion toward the multi-layer circuit board, the shifting assembly drives the tensioning roller to synchronously approach the multi-layer circuit board; When the first grinding belt is away from the multi-layer circuit board, the shifting assembly drives the tensioning roller to reset; A control component is disposed on the grinding seat, and when the first grinding belt grinds to the side wall of the multi-layer circuit board, the control component restricts the first grinding belt from continuing to grind the multi-layer circuit board, and controls the second grinding belt to grind to the side wall of the multi-layer circuit board; When the first grinding belt is away from the multi-layer circuit board, the control component controls the second grinding belt to the side of the first grinding belt away from the multi-layer circuit board.

[0008] By adopting the above technical solution, when grinding the reserved part of the multi-layer circuit board, the driving member is started to drive the grinding seat to move towards the clamping seat. At this time, the first grinding belt first grinds the board layer connection of the reserved part of the multi-layer circuit board. When the first grinding belt grinds, the upper and lower relatively tensioning rollers cooperate to clamp the reserved part of the multi-layer circuit board, reducing the possibility of delamination of the board layers of the reserved part of the multi-layer circuit board. Then the first grinding belt continues to grind the reserved part of the multi-layer circuit board. At this time, the tensioning seat moves towards the clamping seat, driving the tensioning roller to move, maintaining the clamping of the reserved part of the multi-layer circuit board. At the same time, the second grinding belt grinds the position of the reserved part of the multi-layer circuit board that has not been ground by the first grinding belt. Until the first grinding belt grinds to the vertical side wall of the multi-layer circuit board, the second grinding belt continues to move towards the clamping seat until the reserved part is ground to the vertical side wall on one side of the multi-layer circuit board facing the grinding seat. The whole process is simple. When the reserved part can be ground, and the possibility of delamination between the board layers of the multi-layer circuit board can be reduced, which is beneficial to improving the processing quality.

[0009] Optionally, the driving member is a driving hydraulic cylinder, the driving hydraulic cylinder is arranged on the grinding table, and the end of the piston rod of the driving hydraulic cylinder is connected to the side of the grinding seat far from the grinding area.

[0010] By adopting the above technical solution, using the driving hydraulic cylinder as the driving member and utilizing the telescopic movement of the piston rod of the driving hydraulic cylinder, the grinding seat can be conveniently and accurately controlled to approach or move away from the grinding area, so that the grinding operation is more flexible and controllable, improving the grinding processing efficiency and accuracy of the multi-layer circuit board.

[0011] Optionally, the control assembly includes a first linkage frame, a second linkage frame, a first control column, a second control column, a control spring, a control rope, a push column, a plug and a connection spring; The first linkage frame is arranged on the grinding seat and located in the receiving groove, and the first linkage frame is connected to the first rotating shaft and is rotatably connected; The second linkage frame is slidably arranged on the grinding seat and located in the receiving groove, and the second linkage frame is connected to the upper and lower opposite mounting seats; The second control column is slidably connected to the grinding seat and is arranged at the end of the piston rod of the driving hydraulic cylinder, and the second control column is connected to the second linkage frame; The first control column is slidably connected to the second control column and is coaxially arranged, and the side of the first control column far from the driving hydraulic cylinder is connected to the first linkage frame; The connection spring is arranged in the second control column, and the connection spring drives the first control column away from the driving hydraulic cylinder; The plug is slidably connected to the second control column and is vertically arranged, and the first control column is provided with a plugging groove for the plug to be inserted; The push column slides on the grinding seat and protrudes out of the grinding seat toward a side away from the driving hydraulic cylinder, and the control rope is slidably arranged in the grinding seat, the first linkage frame and the second control column; A limit block is provided on the top of the clamping platform, and the two ends of the control rope are respectively connected to the latch and the push column; When the grinding seat abuts against the limit block, the clamping seat pushes the push column to slide into the grinding seat, and at this time, the control rope pulls the latch to slide out of the plug-in slot until the first grinding belt slides on the side wall of the multi-layer circuit board, and the latch is disengaged from the plug-in slot; The control spring is arranged in the second control column. When the control spring drives the latch to be inserted into the insertion slot, the push column slides out of the grinding seat.

[0012] By adopting the above technical solution, the multi-layer circuit board grinding equipment can realize automatic control of the grinding process. When the first grinding belt grinds to the side wall of the multi-layer circuit board, the first grinding belt is restricted from continuing to grind the multi-layer circuit board, and the second grinding belt is controlled to grind to the side wall of the multi-layer circuit board. When the first grinding belt is away from the multi-layer circuit board, the second grinding belt is controlled to return to the side of the first grinding belt away from the multi-layer circuit board, so as to reasonably allocate the working stages of different grinding belts and improve the processing quality.

[0013] Optionally, the toggle assembly includes a toggle post and a toggle spring; The toggle spring is arranged on the clamping platform, and the toggle spring drives the tensioning seat away from the clamping seat; The toggle post is arranged on a side of the grinding seat close to the grinding area, and the toggle post is slidably arranged through the tensioning seat; When the first grinding belt grinds the reserved portion of the multi-layer circuit board, the toggle post abuts against the side of the tensioning seat away from the toggle spring.

[0014] By adopting the above technical solution, the toggle spring is used to drive the tensioning seat away from the clamping seat, and the toggle column is arranged on the side of the grinding seat close to the grinding area. When the first grinding belt grinds the reserved part of the multi-layer circuit board, the toggle column abuts against the tensioning seat, so that the tensioning roller can be synchronously close to the multi-layer circuit board; when the first grinding belt is away from the multi-layer circuit board, the tensioning roller can be reset under the action of the toggle spring, which is convenient for the multi-layer circuit board grinding equipment to complete the multi-layer circuit board grinding operation in an orderly manner, ensure the stability and continuity of the grinding process, and improve the grinding efficiency and quality.

[0015] Optionally, a tensioning column is arranged on the tensioning seat, and the tensioning roller includes a first tensioning roller and a second tensioning roller; The first tensioning roller is rotatably connected to a side of the tensioning column away from the tensioning seat; The tensioning column slides up and down with a sliding seat, and the second tensioning roller is rotatably connected between the sliding seats and is located below the first tensioning roller; The tensioning seat is provided with an elastic tensioning member for driving the second tensioning roller to move upward close to the first tensioning roller.

[0016] By adopting the above technical solution, tensioning columns are oppositely arranged on the tensioning seat, and the first tensioning roller is rotatably connected to the tensioning column, which is convenient for the first tensioning roller to rotate. There is a sliding seat on the tensioning column that can slide up and down. The second tensioning roller is rotatably connected between the sliding seats and is located below the first tensioning roller. Cooperating with the elastic tensioning member to drive the second tensioning roller to move upward close to the first tensioning roller can make the tensioning space between the tensioning rollers stable, better clamp the multi-layer circuit board, ensure the stability of the multi-layer circuit board during the grinding process, and thus improve the grinding quality.

[0017] Optionally, the elastic tensioning member is a tensioning spring. The tensioning spring is arranged on the tensioning column, and the tensioning spring drives the sliding seat to move upward close to the first tensioning roller.

[0018] By adopting the above technical solution, the tensioning spring can drive the sliding seat to move upward close to the first tensioning roller, ensuring that the second tensioning roller and the first tensioning roller cooperate to apply an appropriate tensioning force to the reserved part of the multi-layer circuit board, ensuring the stability of the multi-layer circuit board when the first grinding belt grinds the reserved part of the multi-layer circuit board, reducing the possibility of uneven grinding or degumming caused by the shaking of the multi-layer circuit board, and being beneficial to improving the grinding quality of the multi-layer circuit board.

[0019] Optionally, a pressing plate slides up and down between the tensioning columns, and the bottom of the tensioning spring abuts against the side of the pressing plate close to the second tensioning roller; An adjusting bolt is rotatably connected to the tensioning seat, and the pressing plate is threadedly connected to the adjusting bolt.

[0020] By adopting the above technical solution, the adjusting bolt can be used to drive the pressing plate to slide up and down, thereby adjusting the pressure of the pressing plate on the tensioning spring and realizing the adjustment of the tensioning force for the second tensioning roller to move upward close to the first tensioning roller to meet different usage requirements.

[0021] Optionally, the connecting line of the central axes of the upper and lower tensioning rollers is on the same vertical plane as the side of the reserved part of the multi-layer circuit board close to the grinding seat.

[0022] By adopting the above technical solution, the possibility of delamination between the layers of the multi-layer circuit board during the grinding of the reserved part by the first grinding belt is reduced.

[0023] In summary, the present application includes at least the following beneficial effects: 1. When grinding the reserved part of the multi-layer circuit board, the first grinding belt first grinds the board layer connection of the reserved part of the multi-layer circuit board. At this time, the upper and lower relative tension rollers cooperate with each other to clamp the reserved part of the multi-layer circuit board, reducing the possibility of debonding of the board layer of the reserved part of the multi-layer circuit board, which is conducive to improving the processing quality; 2. The elastic tensioning member drives the second tensioning roller upward to approach the first tensioning roller, so that the tensioning space between the tensioning rollers can be stabilized, the multi-layer circuit board can be clamped better, the stability of the multi-layer circuit board during the grinding process can be ensured, and the grinding quality can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the external structure of an embodiment of the present application; Figure 2 is a schematic diagram of an internal cross-section of an embodiment of the present application; Figure 3 yes Figure 2 A magnified schematic diagram of part A; Figure 4 is a schematic diagram of the internal structure of the grinding seat in the embodiment of the present application; Figure 5 yes Figure 1 A magnified schematic diagram of part B; Figure 6 yes Figure 4 An enlarged schematic diagram of part C of FIG. Figure 7 yes Figure 2 An enlarged schematic diagram of part D of FIG.

[0025] Reference numerals: 1, machine body; 11, clamping table; 111, tensioning groove; 12, clamping seat; 13, grinding area; 2, tensioning seat; 21, tensioning column; 211, sliding seat; 22, tensioning spring; 23, extrusion plate; 24, adjusting bolt; 3, tensioning roller; 31, first tensioning roller; 32, second tensioning roller; 33, tensioning space; 4, grinding table; 41, grinding seat; 411, receiving groove; 42, first grinding belt; 43, first rotating shaft; 44, mounting seat; 45. Second rotating shaft; 46. Second grinding belt; 5. Power assembly; 51. First power motor; 52. Second power motor; 6. Driving hydraulic cylinder; 7. Toggle assembly; 71. Toggle column; 72. Toggle spring; 8. First linkage frame; 81. Second linkage frame; 82. First control column; 83. Second control column; 831. Plug-in slot; 84. Control spring; 85. Control rope; 86. Push column; 87. Latch; 88. Connecting spring; 89. Limit block. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1-7 This application is described in further detail.

[0027] An embodiment of the present application discloses a multi-layer circuit board grinding device. Refer to Figure 1 , the grinding device includes a machine body 1 and a clamping table 11. The clamping table 11 is fixedly installed on the machine body 1. A clamping seat 12 is fixedly installed on the clamping table 11, and the multi-layer circuit board is placed on the top of the clamping seat 12. A clamping tooling is provided on the clamping seat 12. When the multi-layer circuit board is placed on the top of the clamping seat 12, it is detachably fixed by the clamping tooling, and the reserved part of the multi-layer circuit board protrudes beyond the top end face of the clamping seat 12 after being placed. A grinding area 13 is provided on the clamping table 11. The grinding area 13 is adjacent to the clamping seat 12, and the reserved part of the multi-layer circuit board is located directly above the grinding area 13.

[0028] Refer to Figure 2 And Figure 3 , the grinding device further includes a tensioning seat 2. A tensioning groove 111 in a "T" shape is formed on the clamping table 11. The tensioning seat 2 is in a "T" shape, and the tensioning seat 2 is slidably connected in the tensioning groove 111. The tensioning seat 2 is located in the grinding area 13, and the length direction of the tensioning seat 2 is parallel to the vertical side walls on the opposite sides of the clamping seat 12.

[0029] A tensioning column 21 is fixedly connected to the tensioning seat 2. There are two tensioning columns 21 and they are symmetrically arranged along the length direction of the tensioning seat 2. A tensioning roller 3 is provided on the tensioning seat 2. The tensioning roller 3 includes a first tensioning roller 31 and a second tensioning roller 32. A connecting seat is slidably connected to the side of the tensioning column 21 away from the tensioning seat 2. The connecting seat is detachably fixed to the tensioning column 21 through a screw and a nut. The two ends of the first tensioning roller 31 are rotatably connected to the opposite sides of the two connecting seats. Moving grooves extending in the vertical direction are respectively formed on the opposite sides of the two tensioning columns 21. A sliding seat 211 is provided on the tensioning column 21, and the sliding seat 211 slides up and down in the moving groove. The two ends of the second tensioning roller 32 are respectively rotatably connected to the opposite sides of the two sliding seats 211. The second tensioning roller 32 is located directly below the first tensioning roller 31. A tensioning space 33 is formed between the first tensioning roller 31 and the second tensioning roller 32. The reserved part of the multi-layer circuit board passes through the tensioning space 33, so that the first tensioning roller 31 abuts against the top of the reserved part, and the second tensioning roller 32 abuts against the bottom of the reserved part. In the initial state, the connection line between the central axes of the first tensioning roller 31 and the second tensioning roller 32 is on the same vertical plane as the vertical side wall of the reserved part of the multi-layer circuit board away from the clamping seat 12.

[0030] Refer to Figure 3 And Figure 4 , the tensioning seat 2 is provided with an elastic tensioning member for driving the second tensioning roller 32 to move upward close to the first tensioning roller 31, so that the second tensioning roller 32 and the first tensioning roller 31 cooperate with each other to clamp the reserved part of the multi-layer circuit board, limit small abrasive grains from squeezing into the glue in the reserved part of the board layer to form small holes, and reduce the possibility of separation between the board layers of the multi-layer circuit board when the reserved part is continuously ground.

[0031] See Figure 3 and Figure 5 , the elastic tension member is a tension spring 22, the tension springs 22 correspond to the sliding seats 211 one by one, the tension springs 22 are installed in the moving grooves, and the tops of the tension springs 22 abut against the bottoms of the sliding seats 211. An extrusion plate 23 is arranged between the two opposite tension columns 21, and the two ends of the extrusion plate 23 slide up and down in the moving grooves respectively. The bottom of the tension spring 22 abuts against the top of the extrusion plate 23. When the tension spring 22 elastically releases, it drives the sliding seat 211 to slide upward, so that the second tension roller 32 can approach the first tension roller 31 to extrude the reserved part of the multi-layer circuit board. An adjusting bolt 24 is rotatably connected to the tension seat 2, and the extrusion plate 23 is threadedly connected to the adjusting bolt 24. When the adjusting bolt 24 is rotated, the up-and-down movement of the extrusion plate 23 can be controlled. When the extrusion plate 23 moves upward, the extrusion plate 23 extrudes the tension spring 22, which is beneficial to increasing the force of the second tension roller 32 and the first tension roller 31 to clamp the reserved part of the multi-layer circuit board; when the extrusion plate 23 moves downward, the tension spring 22 expands, which is beneficial to reducing the force of the second tension roller 32 and the first tension roller 31 to clamp the reserved part of the multi-layer circuit board.

[0032] See Figure 5 and Figure 6 , the grinding device further includes a grinding table 4 and a first grinding belt 42. The grinding table 4 is fixedly connected to the machine body 1, and the grinding table 4 is located on the side of the grinding area 13 away from the clamping seat 12. A grinding seat 41 is slidably arranged on the grinding table 4, and a receiving groove 411 is opened on the side of the grinding seat 41 close to the grinding area 13. A first rotating shaft 43 is rotatably connected in the grinding seat 41. The first rotating shaft 43 is located in the receiving groove 411, and the central axis of the first rotating shaft 43 extends in the vertical direction. There are two first rotating shafts 43 and they are symmetrically arranged. The connection line between the two first rotating shafts 43 is parallel to the vertical side wall of the clamping seat 12 close to the grinding area 13. The first grinding belt 42 is connected end to end and sleeved on the outer peripheral side of the first rotating shaft 43. The first grinding belt 42 faces the board layer connection of the multi-layer circuit board, and the width of the first grinding belt 42 is smaller than the thickness of the reserved part of the multi-layer circuit board.

[0033] See Figure 6 and Figure 7 , mounting seats 44 are respectively slidably connected to the upper and lower groove walls of the receiving groove 411, and the mounting seats 44 can move in the direction close to and away from the notch of the receiving groove 411. The mounting seat 44 has a cuboid structure, and the length direction of the mounting seat 44 is parallel to the connection line of the two first rotating shafts 43. A second rotating shaft 45 is rotatably connected to the mounting seat 44. The second rotating shaft 45 is parallel to the first rotating shaft 43. There are two second rotating shafts 45 symmetrically arranged along the length direction of the mounting seat 44, and the second rotating shafts 45 are located between the two opposite first rotating shafts 43. In the initial state, the second rotating shaft 45 is located on the side of the first rotating shaft 43 away from the grinding area 13.

[0034] The grinding device further includes a second grinding belt 46 and a power assembly 5. The second grinding belts 46 correspond to the mounting seats 44 one by one. The second grinding belts 46 are connected end to end and arranged opposite to each other up and down. The second grinding belts 46 are sleeved on the outer peripheral side of the second rotating shafts 45. When the mounting seats 44 slide towards the grinding area 13, the second grinding belts 46 are slidably connected to the first grinding belts 42, and the side of the second grinding belts 46 away from the first grinding belts 42 and the side of the multi-layer circuit board away from the board layer connection are on the same end face.

[0035] See Figure 1 And Figure 3 , the power assembly 5 is arranged on the grinding seat 41. During use, the power assembly 5 drives the first rotating shaft 43 and the second rotating shaft 45 to rotate. The power assembly 5 includes a first power motor 51 and a second power motor 52. The first power motor 51 is fixedly connected to the outer wall of the grinding seat 41. The output shaft of the first power motor 51 is fixedly connected and coaxially arranged with one of the first rotating shafts 43. The output shaft of the first power motor 51 is rotatably connected to the grinding seat 41. When the first power motor 51 is started, it drives the first rotating shaft to rotate, so that the first grinding belt 42 moves in a cycle to grind the board layer connection of the reserved part of the multi-layer circuit board. There are two second power motors 52, which are respectively slidably arranged on the grinding seat 41. The output shafts of the second power motors 52 are slidably connected to the grinding seat 41. The output shafts of the second power motors 52 are fixedly connected and coaxially arranged with one of the second rotating shafts 45 respectively. When the second power motors 52 are started, they drive the second rotating shafts 45 to rotate, so that the second grinding belts 46 move in a cycle. After the first grinding belts 42 grind the board layer connection of the reserved part of the multi-layer circuit board, the second grinding belts 46 grind the part of the reserved part of the multi-layer circuit board that has not been ground by the first grinding belts 42. The moving directions of the second grinding belts 46 and the first grinding belts 42 are the same.

[0036] The grinding device further includes a driving member, which is arranged on the grinding table 4. During use, the driving member controls the grinding table 4 to approach and move away from the grinding area 13. The driving member is a driving hydraulic cylinder 6. The driving hydraulic cylinder 6 is fixedly connected to the grinding table 4. The end of the piston rod of the driving hydraulic cylinder 6 is connected to the side of the grinding seat 41 away from the grinding area 13. When the driving hydraulic cylinder 6 starts a forward stroke, it drives the grinding seat 41 to move towards the direction close to the grinding seat 41. When the driving hydraulic cylinder 6 starts a reverse stroke, it drives the grinding seat 41 to move away from the grinding seat 41.

[0037] The grinding device further includes a control component disposed on the grinding base 41. When the first grinding belt 42 grinds to the side wall of the multi-layer circuit board, the control component controls the first grinding belt 42 to pause the continuous grinding of the vertical side wall of the multi-layer circuit board, and controls the second grinding belt 46 to continue grinding the reserved portion of the multi-layer circuit board until the side of the second grinding belt 46 away from the driving hydraulic cylinder 6 and the side of the first grinding belt 42 away from the driving hydraulic cylinder 6 are on the same vertical plane. When the first grinding belt 42 is away from the multi-layer circuit board, the control component controls the second grinding belt 46 to reset to the side of the first grinding belt 42 away from the multi-layer circuit board.

[0038] See Figure 6 And Figure 7 , the control component includes a first linkage 8, a second linkage 81, a first control column 82, a second control column 83, a control spring 84, a control rope 85, a push column 86, a pin 87 and a connecting spring 88. The structures of the first linkage 8 and the second linkage 81 are the same but their sizes are different. Among them, the size of the second linkage 81 is smaller than that of the first linkage 8. The first linkage 8 and the second linkage 81 respectively include two symmetrically arranged "U"-shaped linkage frames and a linkage bar connecting the upper and lower linkage frames.

[0039] Among them, the first linkage 8 is fixedly connected to the grinding base 41 and is located in the receiving groove 411. The two ends of the linkage frame of the first linkage 8 are respectively rotatably connected to the ends of the first rotating shaft 43. The second linkage 81 is slidably connected to the grinding base 41 and is located in the receiving groove 411. The two ends of the linkage frame of the second linkage 81 are respectively fixedly connected to the side of the mounting seat 44 away from the clamping seat 12, and the second power motor 52 is fixedly connected to the mounting seat 44.

[0040] The second control column 83 slidably penetrates through the grinding base 41. The second control column 83 is fixedly connected to the end of the piston rod of the driving hydraulic cylinder 6 and is coaxially arranged. The second control column 83 is fixedly connected to the second linkage 81. The first control column 82 is slidably connected to the side of the second control column 83 away from the driving hydraulic cylinder 6 (the driving hydraulic cylinder 6 is marked in Figure 1 ) and is coaxially arranged. The first control column 82 is fixedly connected to the first linkage 8 on the side away from the driving hydraulic cylinder 6. The connecting spring 88 is installed in the second control column 83. One end of the connecting spring 88 abuts against the side of the first control column 82 away from the first linkage 8, and the other end abuts against the second control column 83. When the connecting spring 88 elastically releases, it drives the first control column 82 to protrude towards the direction away from the driving hydraulic cylinder 6 to the second control column 83.

[0041] The latch 87 is slidably connected in the second control column 83, and the latch 87 and the first control column 82 are arranged perpendicular to each other. The first control column 82 is provided with a plug slot 831, and the latch 87 is inserted into the plug slot 831, so that the first control column 82 and the second control column 83 are connected and fixed. The push column 86 slides on the grinding seat 41, and the push column 86 protrudes out of the grinding seat 41 in a direction away from the driving hydraulic cylinder 6. The control rope 85 is slidably arranged in the grinding seat 41, the first linkage frame 8 and the second control column 83, and the two ends of the control rope 85 are respectively connected and fixed to the latch 87 and the push column 86. A limit block 89 is fixedly connected to the clamping table 11. When the grinding seat 41 approaches the multi-layer circuit board until the pushing column 86 abuts the clamping seat 12, the grinding seat 41 continues to approach the multi-layer circuit board. At this time, the clamping seat 12 pushes the pushing column 86 to slide into the grinding seat 41, so that the control rope 85 pulls the pin 87 to slide outward from the plug-in slot 831 until the first grinding belt 42 grinds to the vertical side wall of the multi-layer circuit board close to the grinding seat 41. The grinding seat 41 abuts the limit block 89, and the pin 87 disengages from the plug-in slot 831; then when the grinding seat 41 continues to approach the multi-layer circuit board, the second control column 83 drives the mounting seat 44 to slide through the second linkage frame 81, so that the second grinding belt 46 continues to grind the reserved part of the multi-layer circuit board. At this time, the first control column 82 slides into the second control column 83, and the connecting spring 88 enters a compressed state.

[0042] The control spring 84 is installed in the second control column 83, and the control spring 84 is sleeved on the outer peripheral side of the control rope 85. One end of the control spring 84 abuts against the side of the latch 87 away from the plug-in slot 831, and the other end abuts against the second control column 83. When the latch 87 is separated from the plug-in slot 831, the control spring 84 enters an extrusion state. When the grinding seat 41 is away from the multi-layer circuit board, the connecting spring 88 is elastically released, pushing the first control column 82 to slide out of the second control column 83, so that the second grinding belt 46 is reset; at the same time, when the first control column 82 and the second control column 83 slide to the time when the latch 87 and the plug-in slot 831 are aligned, the control spring 84 is elastically released, pushing the latch 87 to insert into the plug-in slot 831, and at this time, the control rope 85 pulls the push column 86 to slide out of the grinding seat 41.

[0043] See also Figure 5 and Figure 6 The grinding device also includes a toggle assembly 7. When the first grinding belt 42 grinds the reserved portion toward the multi-layer circuit board, the toggle assembly 7 drives the tensioning seat 2 to synchronously approach the multi-layer circuit board; when the first grinding belt 42 moves away from the multi-layer circuit board, the toggle assembly 7 drives the tensioning seat 2 to reset.

[0044] The toggle assembly 7 includes a toggle column 71 and a toggle spring 72. The toggle spring 72 is installed in the tensioning groove 111. One end of the toggle spring 72 abuts against the side of the tensioning seat 2 close to the clamping seat 12, and the other end abuts against the wall of the tensioning groove 111. When the toggle spring 72 is elastically released, the tensioning seat 2 is driven away from the clamping seat 12.

[0045] The toggle post 71 is fixedly connected to the side of the grinding seat 41 close to the clamping seat 12, and the toggle post 71 is slidably arranged in the tensioning seat 2. When the first grinding belt 42 grinds the reserved portion of the multi-layer circuit board, the toggle post 71 abuts against the side of the tensioning seat 2 away from the toggle spring 72; then, when the first grinding belt 42 continues to grind the reserved portion of the multi-layer circuit board, the toggle post 71 pushes the tensioning seat 2 close to the clamping seat 12, and at this time, the first tensioning roller 31 and the second tensioning roller 32 slide on the multi-layer circuit board, and the tensioning seat 2 squeezes the toggle spring 72.

[0046] The implementation principle of a multi-layer circuit board grinding device in the embodiment of the present application is: When grinding the reserved part of the multi-layer circuit board, the driving hydraulic cylinder 6 is started and enters the forward stroke, driving the grinding seat 41 to move toward the clamping seat 12. At this time, the first grinding belt 42 first grinds the board layer connection of the reserved part of the multi-layer circuit board. When the first grinding belt 42 is grinding, the first tensioning roller 31 and the second tensioning roller 32 clamp the reserved part of the multi-layer circuit board to reduce the possibility of debonding of the board layer of the reserved part of the multi-layer circuit board. Then the first grinding belt 42 continues to grind the reserved part of the multi-layer circuit board. At this time, the tensioning seat 2 moves toward the clamping seat 12, driving the first tensioning roller 31 and the second tensioning roller 32 to move, maintaining the clamping of the reserved part of the multi-layer circuit board, and at the same time, the second grinding belt 46 grinds the position of the reserved part of the multi-layer circuit board that has not been ground by the first grinding belt 42. When the first grinding belt 42 grinds to the vertical side wall of the multi-layer circuit board, the grinding seat 41 contacts the limit block 89, limiting the grinding seat 41 from continuing to approach the clamping seat 12. At this time, the second grinding belt 46 continues to move toward the clamping seat 12 until the grinding reserved portion is grinded to the vertical side wall of the multi-layer circuit board facing the grinding seat 41. Then, the hydraulic cylinder 6 is driven to enter the reverse stroke, driving the grinding seat 41 away from the clamping seat 12, until the grinding seat 41 and the second grinding belt 46 return to the state before grinding.

[0047] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-layer circuit board grinding device, characterized in that: including body (1); A clamping table (11) is arranged on the machine body (1), a clamping seat (12) is arranged on the clamping table (11), a clamping tool is arranged on the clamping seat (12), and a grinding area (13) adjacent to the clamping seat (12) is arranged on the clamping table (11); A tensioning seat (2) is slidably connected to the clamping table (11) and is located in the grinding area (13); tensioning rollers (3) are arranged above and below the tensioning seat (2) in a manner opposite to each other; a tensioning space (33) is formed between the tensioning rollers (3); A grinding table (4) is arranged on the machine body (1) and is located on a side of the grinding area (13) away from the clamping seat (12); a grinding seat (41) is slidably arranged on the grinding table (4); and a receiving groove (411) is provided on a side of the grinding seat (41) close to the grinding area (13); A first grinding belt (42) is arranged on the grinding seat (41), a first rotating shaft (43) is symmetrically and rotationally connected inside the grinding seat (41), the first grinding belt (42) is connected end to end and sleeved on the first rotating shaft (43), and the first grinding belt (42) faces the connection between the layers of the multi-layer circuit board; A mounting seat (44) capable of approaching or moving away from the slot opening is slidably disposed on the upper and lower slot walls of the accommodating slot (411), and a second rotating shaft (45) is relatively rotatable on the mounting seat (44), and the second rotating shaft (45) is located between the first rotating shaft (43) and away from the grinding area (13); A second grinding belt (46) connected end to end and arranged opposite to each other up and down, the second grinding belt (46) being sleeved on the second rotating shaft (45), and the second grinding belt (46) being slidably connected to the first grinding belt (42) when sliding toward the grinding area (13); The second grinding belt (46) is located away from the first grinding belt (42) and is located on the same end surface as the multi-layer circuit board away from the connection between the board layers; A power assembly (5) is arranged on the grinding seat (41), and the power assembly (5) drives the first rotating shaft (43) and the second rotating shaft (45) to rotate; A driving member, disposed on the grinding table (4), the driving member controlling the grinding table (4) to move closer to and further away from the grinding area (13); A shifting assembly (7), wherein when the first grinding belt (42) grinds the reserved portion in the direction of the multi-layer circuit board, the shifting assembly (7) drives the tensioning roller (3) to synchronously approach the multi-layer circuit board; When the first grinding belt (42) is away from the multi-layer circuit board, the shifting assembly (7) drives the tensioning roller (3) to reset; a control component, arranged on the grinding seat (41), wherein when the first grinding belt (42) grinds to the side wall of the multi-layer circuit board, the control component restricts the first grinding belt (42) from continuing to grind the multi-layer circuit board, and controls the second grinding belt (46) to grind to the side wall of the multi-layer circuit board; When the first grinding belt (42) is away from the multi-layer circuit board, the control component controls the second grinding belt (46) to the side of the first grinding belt (42) away from the multi-layer circuit board.

2. A multi-layer circuit board grinding device according to claim 1, characterized in that: The driving member is a driving hydraulic cylinder (6), which is arranged on the grinding table (4), and the end of the piston rod of the driving hydraulic cylinder (6) is connected to a side of the grinding seat (41) away from the grinding area (13).

3. A multi-layer circuit board grinding device according to claim 2, characterized in that: The control assembly comprises a first linkage frame (8), a second linkage frame (81), a first control column (82), a second control column (83), a control spring (84), a control rope (85), a push column (86), a latch (87) and a connecting spring (88); The first linkage frame (8) is arranged on the grinding seat (41) and is located in the accommodating groove (411); the first linkage frame (8) is connected to the first rotating shaft (43) and is rotatably connected; The second linkage frame (81) is slidably disposed on the grinding seat (41) and is located in the receiving groove (411), and the second linkage frame (81) is connected to the mounting seat (44) in an upper and lower manner; The second control column (83) is slidably connected to the grinding seat (41) and is arranged at the end of the piston rod of the driving hydraulic cylinder (6), and the second control column (83) is connected to the second linkage frame (81); The first control column (82) is slidably connected to the second control column (83) and is coaxially arranged; the first control column (82) is connected to the first linkage frame (8) at a side away from the driving hydraulic cylinder (6); The connecting spring (88) is arranged in the second control column (83), and the connecting spring (88) drives the first control column (82) away from the driving hydraulic cylinder (6); The latch (87) is slidably connected in the second control column (83) and is vertically arranged, and the first control column (82) is provided with an insertion slot (831) for the latch (87) to be inserted; The pushing column (86) slides on the grinding seat (41) and protrudes out of the grinding seat (41) toward a side away from the driving hydraulic cylinder (6), and the control rope (85) is slidably arranged in the grinding seat (41), the first linkage frame (8) and the second control column (83); A limit block (89) is provided on the top of the clamping platform (11), and two ends of the control rope (85) are respectively connected to the latch (87) and the pushing column (86); When the grinding seat (41) abuts against the limit block (89), the clamping seat (12) pushes the push column (86) to slide into the grinding seat (41), and at this time, the control rope (85) pulls the latch (87) to slide outward of the plug-in slot (831), until the first grinding belt (42) slides on the side wall of the multi-layer circuit board, and the latch (87) is disengaged from the plug-in slot (831); The control spring (84) is disposed in the second control column (83), and when the control spring (84) drives the latch (87) to be inserted into the insertion slot (831), the push column (86) slides out of the grinding seat (41).

4. A multi-layer circuit board grinding device according to claim 1, characterized in that: The toggle assembly (7) comprises a toggle column (71) and a toggle spring (72); The toggle spring (72) is arranged on the clamping platform (11), and the toggle spring (72) drives the tensioning seat (2) away from the clamping seat (12); The toggle post (71) is arranged on a side of the grinding seat (41) close to the grinding area (13), and the toggle post (71) is slidably arranged through the tensioning seat (2); When the first grinding belt (42) grinds the reserved portion of the multi-layer circuit board, the toggle column (71) abuts against the side of the tensioning seat (2) away from the toggle spring (72).

5. The multi-layer circuit board grinding device according to claim 1, characterized in that: A tensioning column (21) is arranged opposite to the tensioning seat (2), and the tensioning roller (3) comprises a first tensioning roller (31) and a second tensioning roller (32); The first tensioning roller (31) is rotatably connected to a side of the tensioning column (21) away from the tensioning seat (2); The tensioning column (21) is provided with a sliding seat (211) that slides up and down, and the second tensioning roller (32) is rotatably connected between the sliding seats (211) and is located below the first tensioning roller (31); The tensioning seat (2) is provided with an elastic tensioning member for driving the second tensioning roller (32) upwards to approach the first tensioning roller (31).

6. A multi-layer circuit board grinding device according to claim 5, characterized in that: The elastic tensioning member is a tensioning spring (22), and the tensioning spring (22) is arranged on the tensioning column (21). The tensioning spring (22) drives the sliding seat (211) to move upward and close to the first tensioning roller (31).

7. A multi-layer circuit board grinding device according to claim 6, characterized in that: An extrusion plate (23) is provided to slide up and down relative to the tensioning column (21), and the bottom of the tensioning spring (22) abuts against a side of the extrusion plate (23) close to the second tensioning roller (32); An adjusting bolt (24) is rotatably connected to the tensioning seat (2), and the extrusion plate (23) is threadedly connected to the adjusting bolt (24).

8. The multi-layer circuit board grinding device according to claim 1, characterized in that: The line connecting the central axes of the upper and lower tension rollers (3) and the side of the multi-layer circuit board reserved portion close to the grinding seat (41) are located on the same vertical plane.

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