Device and method for eliminating copper cuttings in liquid cavity of spraying copper dissolving tank

Abstract

The invention relates to a device and a method for eliminating copper cuttings in a liquid cavity of a spraying copper dissolving tank, a sieve plate is arranged at the bottom of the spraying copper dissolving tank to serve as a copper sludge collecting platform, and a screen mesh is arranged above the sieve plate; and liquid of the spraying system of the copper dissolving tank flows through the sieve plate and the screen mesh, is circulated through the copper dissolving pump, and is continuously contacted and reacted with the copper sludge at the copper sludge collecting platform. The liquid cavity of the copper dissolving tank is modified, copper cuttings are collected on the platform and then continuously make contact with the oxygen-rich spraying liquid of the copper dissolving tank to generate chemical reaction, the copper cuttings are consumed by the reaction and are not accumulated to form copper sludge, the liquid cavity is always in a normal design use state, and the copper dissolving capacity of the system is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrolytic copper foil preparation, and particularly relates to a device and method for eliminating copper chips in the liquid cavity of a spray copper dissolving tank. Background Art

[0002] As one of the basic materials in the electronic information industry, with the rapid development of the electronic circuit industry in recent years, the market demand for electronic circuit copper foil has been increasing day by day. To maintain the full production operation of the raw foil machine, the copper dissolving capacity of the liquid preparation section needs to be fully guaranteed.

[0003] The copper dissolving capacity of the copper dissolving tank in the liquid preparation workshop is affected by many factors. Under the condition of standardized operation of control points, the system copper dissolving capacity will slowly decrease slightly over time because the copper powder generated in the production of electrolytic copper foil will return to the low-level tank with the electrolysis cycle, and then be pumped into the liquid cavity of the copper dissolving tank by the system copper replenishment system and slowly accumulate. The residual chips and copper particles of copper material dissolution will fall into the liquid cavity of the copper dissolving tank through the sieve plate holes of the copper dissolving tank and slowly accumulate. The continuous accumulation of copper powder, residual chips of copper material dissolution, and copper particles generated in the production of electrolytic copper foil in the liquid cavity eventually forms a mud-like shape. A large amount of copper mud will occupy the liquid cavity space, making the liquid stored in the liquid cavity less than the designed theoretical value, and the copper dissolving tank cannot achieve the designed use effect. Excessive accumulation of copper mud in the liquid cavity will also block the liquid inlet of the copper dissolving pump, making the liquid pumping volume of the copper dissolving pumps of a group of two copper dissolving tanks unbalanced, resulting in the liquid cavity of the copper dissolving tank being emptied and the function of the copper dissolving tank failing, seriously affecting the copper dissolving efficiency of the whole group. To restore the copper dissolving capacity of the copper dissolving tank, the copper mud needs to be cleaned out of the liquid cavity.

[0004] At present, the copper mud in the liquid cavity of the copper dissolving tank is cleaned by manual cleaning method. First, the electrolysis section needs to cooperate to stop the whole group of raw foil machines for production preparation. The liquid preparation section pumps out the electrolyte in the liquid cavity of the copper dissolving tank and stores it temporarily in the low-level tank. Then, the maintenance manhole of the copper dissolving tank is opened. After the temperature in the tank drops to slightly higher than room temperature, finally, the employee uses a long-handled rake to take out the copper mud from the liquid cavity little by little and pile it in a ton bag. After the copper mud is taken out, the manhole cover is closed, and then the production of the copper dissolving tank is restored according to the start-up process to resume the production of the electrolytic raw foil machine. The whole cleaning process takes about 18 hours of production suspension for the whole group of raw foil machines. Therefore, it is necessary to propose a method for eliminating copper chips in the liquid cavity of a spray copper dissolving tank to solve the accumulation of copper mud in the liquid cavity of the copper dissolving tank, avoid production suspension caused by the cleaning process, and at the same time reduce the huge waste of human resources in the cleaning process. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a device and method for eliminating copper chips in the liquid cavity of a spray copper dissolving tank, which can avoid the continuous accumulation of copper powder, residual chips of copper material dissolution, and copper particles generated in the production of electrolytic copper foil in the liquid cavity to form copper mud, and no longer requires electrolysis shutdown to clean the copper mud in the liquid cavity of the copper dissolving tank.

[0006] The present invention provides a device for eliminating copper chips in the liquid cavity of a spray copper dissolving tank. A sieve plate is arranged at the bottom of the spray copper dissolving tank as a copper mud collection platform, and a sieve mesh is arranged above the sieve plate; the liquid flow of the spray system in the copper dissolving tank passes through the sieve plate and the sieve mesh, and is circulated by a copper dissolving pump located on one side of the bottom of the spray copper dissolving tank, and continuously contacts and reacts with the copper mud at the copper mud collection platform.

[0007] Further, the sieve plate inclines upward from the side of the copper dissolving pump in the liquid cavity of the spray copper dissolving tank to form an inclined plane of the copper mud collection platform on the liquid cavity surface.

[0008] Further, the size of the sieve plate is larger than the size of the outlet of the liquid funnel for downward spraying in the spray copper dissolving tank and smaller than the size of the spray copper dissolving tank.

[0009] Further, the sieve plate is located below the liquid level in the liquid cavity of the spray copper dissolving tank.

[0010] Further, a retaining fence is arranged on the outer edge of the sieve plate.

[0011] Further, the material of the sieve plate is 2205 stainless steel.

[0012] Further, the mesh number of the woven sieve mesh is larger than the mesh number of the copper mud.

[0013] Further, the sieve mesh covers the whole sieve plate.

[0014] The present invention also provides a method for eliminating copper chips in the liquid cavity of a spray copper dissolving tank, including the following steps: S1. Install a sieve plate at the bottom of the spray copper dissolving tank as a copper mud collection platform; S2. Lay a sieve mesh on the sieve plate to prevent the copper mud from leaking downward; S3. The copper mud falls into the liquid cavity from the partition of the copper dissolving tank and is collected; S4. The liquid flow of the spray system in the copper dissolving tank passes through the sieve plate and the sieve mesh, and is circulated by a copper dissolving pump located on one side of the bottom of the spray copper dissolving tank, and continuously contacts and reacts with the copper mud at the copper mud collection platform, and that's all.

[0015] Further, in step S4, the air intake in the upper part of the liquid cavity of the copper dissolving tank is controlled to be normal to ensure that the electrolyte continuously contacting the copper mud contains sufficient oxygen.

[0016] Beneficial effects (1) By transforming the liquid cavity of the copper dissolving tank, the present invention enables the copper chips to be collected on the platform and continuously contact with the oxygen-rich spray liquid in the copper dissolving tank to generate a chemical reaction. The copper chips are consumed by the reaction without accumulating to form copper mud, so that the liquid cavity is always in the normal designed use state, ensuring the copper dissolving capacity of the system.

[0017] (2) In the present invention, the copper chips are consumed through reaction in the liquid cavity of the copper dissolution tank, avoiding the generation of copper mud. The copper dissolution system can operate continuously and normally without the need to stop the machine regularly to clean the copper mud in the liquid cavity, ensuring the full production operation of the copper foil machines in the electrolysis section, improving the operating rate of the copper foil machines, and increasing the production capacity. Description of the Drawings Figure 1 It is a schematic structural diagram of the copper chip elimination device of the present invention.

[0018] Figure 2 It is a flow chart of the copper chip elimination method of the present invention. Specific Embodiments

[0019] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of this application.

[0020] Embodiment 1 As shown by Figure 1 this embodiment provides a device for eliminating copper chips in the liquid cavity of a spray copper dissolution tank. A sieve plate is arranged at the bottom of the spray copper dissolution tank as a copper mud collection platform, and a sieve mesh is arranged above the sieve plate; the liquid flow of the copper dissolution tank spray system passes through the sieve plate and the sieve mesh, and is circulated through a copper dissolution pump located on one side of the bottom of the spray copper dissolution tank, continuously contacting and reacting with the copper mud at the copper mud collection platform.

[0021] Further, the sieve plate inclines upward from the side of the copper dissolution pump of the spray copper dissolution tank towards the liquid surface of the liquid cavity, so that the copper mud collection platform forms an inclined plane on the liquid cavity surface to reduce the additional circulating resistance of the spray liquid of the copper dissolution system on the platform.

[0022] Further, the size of the sieve plate is larger than the size of the outlet of the spray funnel under the spray copper dissolution tank and smaller than the size of the spray copper dissolution tank, ensuring that all the copper chips falling from the partition of the copper dissolution tank can be collected. The sieve plate size cannot completely occupy the plane of the copper dissolution tank without a liquid flow channel other than the sieve mesh and the sieve plate leakage holes, and it is necessary to prevent the normal circulation of the spray liquid of the copper dissolution tank spray system in the case of blockage of the sieve mesh and the sieve plate leakage holes.

[0023] Further, the sieve plate is located below the liquid surface of the liquid cavity of the spray copper dissolution tank to ensure that the collected copper mud can continuously contact the electrolyte in the liquid cavity.

[0024] Further, a fence is arranged on the outer edge of the sieve plate to prevent the copper mud from falling from the outer edge of the sieve plate into the bottom of the liquid cavity, causing the platform to lose its functional role.

[0025] Further, the material of the sieve plate needs to be resistant to high-acid and high-temperature environments, preferably materials above 2205 stainless steel.

[0026] Further, the screen material needs to be resistant to high-acid and high-temperature environments, preferably TA2. The woven mesh count should be greater than the copper mud mesh count, preferably 60 mesh.

[0027] Further, the screen covers the entire screen plate, including the outer treatment enclosure.

[0028] As Figure 2 shown, this embodiment also provides a method for eliminating copper chips in the liquid cavity of a spray copper dissolving tank, including the following steps: S1. Install a screen plate at the bottom of the spray copper dissolving tank as a copper mud collection platform; S2. Lay a screen on the screen plate to prevent copper mud from leaking downward; S3. After the copper mud falls into the liquid cavity from the partition of the copper dissolving tank, it is collected; S4. The liquid of the spray system in the copper dissolving tank flows through the screen plate and the screen, and is circulated through the copper dissolving pump located on one side of the bottom of the spray copper dissolving tank, and continuously contacts and reacts with the copper mud at the copper mud collection platform, that's all.

[0029] Further, in step S3, the copper chip collection adopts the method of automatic falling of the system without manual intervention.

[0030] Further, in step S4, the liquid of the copper dissolving spray system continuously contacts the copper mud at the platform. The copper dissolving pump is used to pump the electrolyte in the liquid cavity from below the copper mud collection platform, and then it falls from above the platform after passing through the spray system to form a cycle.

[0031] Further, in step S4, the air intake at the upper part of the liquid cavity of the copper dissolving tank is controlled to be normal to ensure that the electrolyte in continuous contact with the copper mud contains sufficient oxygen.

[0032] In the present invention, a screen plate serving as a copper mud collection platform is installed in the liquid cavity of the copper dissolving tank. A liquid drainage channel needs to be left at the outer edge of the screen plate and it cannot be completely sealed with the liquid cavity wall. A retaining wall is installed at the outer edge of the screen plate to prevent copper mud from settling from the outer edge to the bottom of the liquid cavity. After the screen plate is installed, a screen is laid on the screen plate. The mesh count of the screen is selected as 60 mesh which is slightly smaller than the mesh count of the copper mud particles. The screen needs to cover the entire screen plate serving as the platform, including the outer treatment enclosure. After the transformation is completed, the copper dissolving pump is used for spray liquid circulation to dissolve copper. Under the condition of air control, the electrolyte rich in oxygen continuously contacts the copper chips on the copper mud collection platform. After the copper chips are oxidized, they react with the acid in the electrolysis to form electrolyte and are consumed. The copper chips in the system are continuously generated and continuously consumed by the reaction at the same time, and will not accumulate and pile up to form copper mud.

[0033] The present invention transforms the liquid cavity of the spray copper dissolving tank to make it a composite copper dissolving tank. The main copper dissolution still adopts the spray copper dissolution mode. A sieve plate and a sieve mesh are installed in the liquid cavity of the copper dissolving tank as the copper mud collection platform, and the copper chips generated by the system are collected in the liquid cavity. The liquid cavity of the copper dissolving pump, the copper dissolving pump and the spray liquid circulation form a similar micro high-efficiency copper dissolving tank with copper chips as the copper material and air intake from the liquid surface of the liquid cavity. The copper chips are dissolved twice in the liquid cavity and will not accumulate to form copper mud, which affects the copper dissolution ability of the copper dissolving tank, and there is no need to stop the machine and manually clean the copper mud in the liquid cavity regularly.

Claims

1. A device for removing copper chips from the liquid chamber of a spray copper dissolving tank, characterized in that: A sieve plate is arranged at the bottom of the spray copper dissolving tank as a copper mud collection platform, and a screen is arranged above the sieve plate; the liquid of the copper dissolving tank spray system flows through the sieve plate and the screen, and is circulated through a copper dissolving pump located at one side of the bottom of the spray copper dissolving tank, and continuously contacts and reacts with the copper mud at the copper mud collection platform.

2. The device according to claim 1, characterized in that: The copper dissolving pump of the sieve plate is tilted above the liquid level of the liquid cavity of the copper dissolving tank to spray sideways, so that the copper mud collecting platform forms an inclined surface on the liquid cavity surface.

3. The device according to claim 1, characterized in that: The size of the sieve plate is larger than the size of the outlet of the spray lower liquid funnel in the spray copper dissolving tank, and smaller than the size of the spray copper dissolving tank.

4. The device according to claim 1, characterized in that: The sieve plate is located below the liquid level of the liquid cavity of the spray copper dissolving tank.

5. The device according to claim 1, characterized in that: The outer edge of the sieve plate is provided with a fence.

6. The device according to claim 1, characterized in that: The material of the sieve plate is 2205 stainless steel.

7. The device according to claim 1, characterized in that: The mesh number of the screen mesh is greater than the mesh number of the copper mud.

8. The device according to claim 1, characterized in that: The screen covers the entire screen plate.

9. A method for removing copper scraps from a liquid cavity of a spray copper dissolving tank, comprising the following steps: S1. Install a sieve plate at the bottom of the spray copper dissolving tank as a copper mud collection platform; S2, laying a screen on the screen plate to prevent the copper mud from leaking; S3, copper mud falls into the liquid cavity from the copper dissolving tank partition and is collected; S4, the liquid of the copper dissolving tank spraying system flows through the sieve plate and the screen, and is circulated by the copper dissolving pump located at one side of the bottom of the spray copper dissolving tank, and continuously contacts and reacts with the copper mud at the copper mud collecting platform.

10. The method according to claim 9, characterized in that: In step S4, the air inlet to the upper part of the liquid chamber of the copper dissolving tank is controlled to be normal.

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