Ultrasonic assembly packaging structure and ultrasonic module applied to same

Abstract

The invention relates to an ultrasonic assembly packaging structure and an ultrasonic module applied to the same. The ultrasonic assembly packaging structure comprises a substrate, an ultrasonic assembly, a first pin, a second pin and a protective shell. The substrate comprises a first connecting pad and a second connecting pad. The ultrasonic component comprises a first electrode and a second electrode which are electrically connected with the first connecting pad and the second connecting pad respectively. The first pin and the second pin are electrically connected with the first connecting pad and the second connecting pad respectively, and extend towards the opposite direction of the ultrasonic assembly. The protective housing surrounds the substrate and the ultrasonic assembly and has a first opening to expose the ultrasonic assembly. Through the design of the pins, the ultrasonic assemblies can be fixed in an inserting mode, interference between the ultrasonic assemblies can be avoided, and the sensing distance can be effectively shortened.

Description

Technical Field

[0001] This application relates to the field of sensing, and in particular to an ultrasonic component packaging structure and an ultrasonic module applied thereto. Background Art

[0002] An ultrasonic module usually includes a pair of ultrasonic transmitting components and ultrasonic receiving components for transmitting ultrasonic signals and receiving reflected waves. With the continuous breakthrough of current technologies, the ultrasonic module can be thinly and flatly attached to a circuit board.

[0003] However, the ultrasonic module used to sense long distances. Nowadays, there is also a need for short-distance sensing. However, in a planar ultrasonic module, there is still a problem of insensitivity at sensing distances below ten centimeters. Summary of the Invention

[0004] To solve the problems faced by the prior art, an ultrasonic component packaging structure is provided herein. In some embodiments, the ultrasonic component packaging structure includes a substrate, an ultrasonic component, a first pin, a second pin, and a protective housing.

[0005] The substrate includes a first connection pad and a second connection pad. The ultrasonic component is disposed on the first plane of the substrate and includes a first electrode and a second electrode. The first electrode and the second electrode are electrically connected to the first connection pad and the second connection pad respectively. The first pin is electrically connected to the first connection pad and extends toward the second plane of the substrate, and the second plane is opposite to the first plane. The second pin is electrically connected to the second connection pad and extends toward the second plane of the substrate, and the second pin is substantially parallel to the first pin. The protective housing surrounds the substrate and the ultrasonic component and has a first opening to expose the ultrasonic component.

[0006] In some embodiments, the first electrode and the second electrode are respectively connected to the first connection pad and the second connection pad through connection lines.

[0007] In some embodiments, the protective housing further includes two second openings, and the first pin and the second pin respectively protrude from the protective housing through the two second openings.

[0008] In some embodiments, the ultrasonic component includes one or more ultrasonic units. More specifically, in some embodiments, the ultrasonic unit is an ultrasonic transmitter or an ultrasonic receiver.

[0009] In some embodiments, the protective housing is made of a metal material.

[0010] Herein, an ultrasonic module is also provided. In some embodiments, the ultrasonic module includes two ultrasonic devices and a circuit board, and each ultrasonic device includes a substrate, an ultrasonic component, a first pin, a second pin, and a protective housing.

[0011] The substrate includes a first connection pad and a second connection pad. The ultrasonic component is disposed on a first plane of the substrate and includes a first electrode and a second electrode. The first electrode and the second electrode are electrically connected to the first connection pad and the second connection pad respectively. The first pin is electrically connected to the first connection pad and extends toward a second plane of the substrate, and the second plane is opposite to the first plane. The second pin is electrically connected to the second connection pad and extends toward the second plane of the substrate, and the second pin is substantially parallel to the first pin. The protective housing surrounds the substrate and the ultrasonic component and has a first opening to expose the ultrasonic component. The ultrasonic components of two ultrasonic devices, one is an ultrasonic transmitting component and the other is an ultrasonic receiving component. The first pins and the second pins of the two ultrasonic devices are soldered to the circuit board.

[0012] In some embodiments, the first electrode and the second electrode are respectively connected to the first connection pad and the second connection pad through connection lines.

[0013] In some embodiments, the protective housing further includes two second openings, and the first pin and the second pin respectively protrude from the protective housing through the two second openings.

[0014] In some embodiments, the ultrasonic component includes one or more ultrasonic units. More specifically, in some embodiments, the ultrasonic unit is an ultrasonic transmitter or an ultrasonic receiver.

[0015] In some embodiments, the protective housing is made of a metal material.

[0016] As shown in the foregoing embodiments, by encapsulating the ultrasonic component in the form of a passive component or a traditional LED and plugging through the first pin and the second pin, direct contact with the circuit board is avoided. Thus, the vibration of the circuit board caused by ultrasonic signals or reflected waves can be reduced, the problems faced by the flat structure can be improved, the sensing distance can be effectively shortened, and the sensitivity of near-distance sensing can be increased. Description of the Drawings

[0017] Figure 1 An exploded view of an embodiment of the ultrasonic component packaging structure.

[0018] Figure 2 A perspective view of an embodiment of the ultrasonic component packaging structure.

[0019] Figure 3 A bottom view of an embodiment of the ultrasonic component packaging structure.

[0020] Figure 4 An enlarged top view of an embodiment of the ultrasonic component.

[0021] Figure 5It is a top-down enlarged view of the second embodiment of the ultrasonic component.

[0022] Figure 6 It is a perspective view of an embodiment of the ultrasonic module.

[0023] Explanation of reference numerals:

[0024] 1: Ultrasonic component packaging structure;

[0025] 10: Substrate;

[0026] 10A: First plane;

[0027] 10B: Second plane;

[0028] 100: Ultrasonic module;

[0029] 11: First connection pad;

[0030] 13: Second connection pad;

[0031] 20: Ultrasonic component;

[0032] 21: First electrode;

[0033] 23: Second electrode;

[0034] 25: Connection line;

[0035] 27: Ultrasonic unit;

[0036] 31: First pin;

[0037] 33: Second pin;

[0038] 40: Protective housing;

[0039] 41: First opening;

[0040] 45: Second opening;

[0041] 50: Ultrasonic device;

[0042] 60: Circuit board. Detailed implementation manners

[0043] It should be understood that when a component is said to be "disposed" on another component, it may mean that the component is directly located on the other component, or there may be an intermediate component connecting the component and the other component. Conversely, when a component is said to be "directly disposed on another component" or "directly disposed onto another component", it can be understood that there is no intermediate component defined at this time.

[0044] In addition, terms such as "first", "second", and "third" are only used to distinguish one component, part, region, layer, or section from another, rather than indicating any necessary order. Moreover, relative terms such as "lower" and "upper" may be used herein to describe the relationship between one component and another. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientations shown in the figures. For example, if the device in one figure is flipped, a component described as being on the "lower" side of another component will be oriented on the "upper" side of the other component. This only represents a relative orientation relationship, rather than an absolute orientation relationship.

[0045] The applicant has found through experiments that in the case of close-range sensing by a planar ultrasonic module, since the circuit board is prone to resonance due to the ultrasonic signals of the ultrasonic transmitting component or vibration due to the reflected waves of the ultrasonic signals, the receiving end of the ultrasonic module is easily driven by the vibration of the circuit board and stops receiving signals. This phenomenon is more obvious when the ultrasonic sensing signals are emitted densely, resulting in insensitivity in close-range sensing.

[0046] Figure 1 An exploded view of an embodiment of the ultrasonic component packaging structure. Figure 2 A perspective view of an embodiment of the ultrasonic component packaging structure. As Figure 1 and Figure 2 shown, in some embodiments, the ultrasonic component packaging structure 1 includes a substrate 10, an ultrasonic component 20, a first pin 31, a second pin 33, and a protective housing 40.

[0047] The substrate 10 includes a first connection pad 11 and a second connection 13. The ultrasonic component 20 is disposed on the first plane 10A of the substrate 10 and includes a first electrode 21 and a second electrode 23. The first electrode 21 and the second electrode 23 are electrically connected to the first connection pad 11 and the second connection pad 13 respectively. In some embodiments, the first connection pad 11 and the second connection pad 13 may be wire bonding pads, and the first electrode 21 and the second electrode 23 are connected to the first connection pad 11 and the second connection pad 13 by connection wires 25 respectively. However, in fact, the substrate 10 may also be a circuit board, and electrical connection is achieved through circuit layout. Further, an optical adhesive or a thermosetting adhesive may be used to bond the connection wires 25 and the first connection pad 11 / second connection pad 13.

[0048] The first pin 31 is electrically connected to the first connection pad 11 and extends towards the second plane 10B of the substrate 10, where the second plane 10B is opposite to the first plane 10A. The second pin 33 is electrically connected to the second connection pad 13 and extends towards the second plane 10B of the substrate 10, and the second pin 33 is substantially parallel to the first pin 31. In other words, the first pin 31 and the second pin 33 are in the form of pin pins and extend reversely from the ultrasonic component 20 and are electrically connected to the ultrasonic component 20. The first pin 31 and the second pin 33 are connected to the first connection pad 11 and the second connection pad 13 by drilling holes in the substrate 10 so as to be connected by means of circuit layout.

[0049] The protective housing 40 surrounds the substrate 10 and the ultrasonic component 20 and has a first opening 41 to expose the ultrasonic component 20. The protective housing 40 can be made of a metallic material and surrounds the side edges of the substrate 10 and the ultrasonic component 20 to serve as electromagnetic shielding to prevent external electromagnetic wave interference, and only the ultrasonic component 20 is exposed through the first opening 41 to further define the pointing range of the ultrasonic component 20.

[0050] Figure 3 It is a bottom view of an embodiment of the ultrasonic component packaging structure. As Figure 3 shown, in some embodiments, the protective housing 40 can also completely cover the substrate 10 and includes two second openings 45, where the first pin 31 and the second pin 33 respectively protrude from the protective housing 40 through the two second openings 45.

[0051] Figure 4 It is an enlarged top view of an embodiment of the ultrasonic component. Figure 5 It is an enlarged top view of the second embodiment of the ultrasonic component. As Figure 4 shown, the ultrasonic component 20 includes an ultrasonic unit 27, and as Figure 5 shown, the ultrasonic component 20 includes a plurality of serially connected ultrasonic units 27. Here, the number of ultrasonic units 27 can be adjusted according to specifications such as the distance to be actually measured and the power of the ultrasonic unit 27.

[0052] Here, the ultrasonic unit 27 is an ultrasonic transmitter or an ultrasonic receiver and can be implemented by a piezoelectric micro-machined ultrasonic transducer (PMUT).

[0053] Figure 6 It is a perspective view of an embodiment of the ultrasonic module. As Figure 6As shown in the figure, the ultrasonic module 100 includes two ultrasonic devices 50 and a circuit board 60. Each ultrasonic device 50 is substantially the aforementioned ultrasonic component packaging structure 1 and is configured in pairs. The ultrasonic components 20 of the two ultrasonic devices 50, one is an ultrasonic transmitting component and the other is an ultrasonic receiving component. The first pins 31 and the second pins 33 of the two ultrasonic devices 50 are soldered to the circuit board 60.

[0054] In summary, by packaging the ultrasonic component 20 in the form of a passive component or a traditional LED and inserting it through the first pins 31 and the second pins 33, direct contact with the circuit board 60 is avoided. In this way, the vibration of the circuit board 60 caused by ultrasonic signals or reflected waves can be reduced, the problems faced by the flat structure can be improved, the sensing distance can be effectively shortened, and the sensitivity of near-distance sensing can be increased.

[0055] Although the technical content of this application has been disclosed above with preferred embodiments, it is not intended to limit this application. Any person skilled in this art, without departing from the spirit of this application, makes some modifications and refinements, which should all be covered within the scope of this application. Therefore, the protection scope of this application shall be subject to that defined by the appended patent application scope.

Claims

1. An ultrasonic component packaging structure, characterized in that, Comprising: A substrate, comprising a first connection pad and a second connection pad; An ultrasonic component, disposed on a first plane of the substrate, comprising a first electrode and a second electrode, the first electrode and the second electrode being electrically connected to the first connection pad and the second connection pad respectively; A first pin, electrically connected to the first connection pad and extending towards a second plane of the substrate, the second plane being opposite to the first plane; A second pin, electrically connected to the second connection pad and extending towards the second plane of the substrate, the second pin being substantially parallel to the first pin; And A protective housing, surrounding the substrate and the ultrasonic component and having a first opening to expose the ultrasonic component.

2. The ultrasonic component packaging structure according to claim 1, characterized in that, The first electrode and the second electrode are respectively connected to the first connection pad and the second connection pad through connection wires.

3. The ultrasonic component packaging structure according to claim 1, characterized in that The protective housing further comprises two second openings, through which the first pin and the second pin respectively protrude out of the protective housing.

4. The ultrasonic component packaging structure according to claim 1, characterized in that, The ultrasonic component comprises one or more ultrasonic units.

5. The ultrasonic component packaging structure according to claim 4, wherein, The ultrasonic unit is an ultrasonic transmitter or an ultrasonic receiver.

6. The ultrasonic component packaging structure according to claim 1, wherein, The protective housing is made of a metallic material.

7. An ultrasonic module, characterized in that, Comprising: Two ultrasonic devices, each of the ultrasonic devices comprising: A substrate, comprising a first connection pad and a second connection pad; An ultrasonic component, disposed on a first plane of the substrate, comprising a first electrode and a second electrode, the first electrode and the second electrode being electrically connected to the first connection pad and the second connection pad respectively; A first pin, electrically connected to the first connection pad and extending towards a second plane of the substrate, the second plane being opposite to the first plane; A second pin, electrically connected to the second connection pad and extending towards the second plane of the substrate, the second pin being substantially parallel to the first pin; And A protective housing, surrounding the substrate and the ultrasonic component and having a first opening to expose the ultrasonic component, wherein, for the ultrasonic components of the two ultrasonic devices, one is an ultrasonic transmitting component and the other is an ultrasonic receiving component; and A circuit board, to which the first pins and the second pins of the two ultrasonic devices are soldered.

8. The ultrasonic module according to claim 7, wherein The first electrode and the second electrode are respectively connected to the first connection pad and the second connection pad through connection wires.

9. The ultrasonic module according to claim 7, wherein The protective housing further comprises two second openings, through which the first pin and the second pin respectively protrude out of the protective housing.

10. The ultrasonic module according to claim 7, wherein, The ultrasonic component comprises one or more ultrasonic units.

11. The ultrasonic module according to claim 7, characterized in that, The protective housing is made of a metallic material.

Images