Hard disk storage device, server, shell-free solid state disk and backboard

Abstract

The invention discloses a hard disk storage device, a server, a shell-free solid state disk and a back plate, and relates to the technical field of solid state disks, on the basis of not changing the structure of the server, a huge solid state disk is formed by redesigning the size and the shape of the solid state disk, the back plate of the server and a front window of the server, and the service life of the solid state disk is prolonged. The solid state disk shell and the capacitor are removed, only the printed circuit board, the dynamic random access device, the main control unit and / or the integrated circuit chip are reserved, the thickness of the solid state disk is reduced, and therefore the size of the solid state disk is optimized, the assembly number of the whole machine is increased, and meanwhile the original space for storing the capacitor is replaced by storing the storage particles. The single-chip capacity of the solid state disk is increased, and the storage capacity of the whole hard disk storage device is further greatly improved; and the power-down protection function of the hard disk is realized through the backboard integrated capacitor.

Description

Technical Field

[0001] This application relates to the technical field of solid-state drives, and particularly to a hard disk storage device, a server, a shell-less solid-state drive, and a backplane. Background Art

[0002] With the development of technology, servers have increasingly higher requirements for the capacity of storage devices and faster performance requirements for storage devices. In servers, mechanical hard disks and solid-state drives are usually selected as data storage devices, and solid-state drives are more suitable for customers' requirements for high capacity and high performance of servers.

[0003] However, with the increasing requirements of customers for server capacity, the capacity of existing solid-state drives is limited and cannot meet the growing capacity demand. Therefore, without changing the existing server architecture, there is an urgent need for a new type of storage device to increase the server capacity. Summary of the Invention

[0004] This application provides a hard disk storage device, a server, a shell-less solid-state drive, and a backplane to at least solve the problem of how to increase the hard disk capacity in related technologies.

[0005] This application provides a hard disk storage device, which includes: The hard disk storage device includes a front window, a backplane, and a plurality of shell-less solid-state drives; Capacitors are arranged on the surface of the backplane away from the front window to implement power-off protection for the shell-less solid-state drives; The shell-less solid-state drive includes a printed circuit board, and the printed circuit board includes a storage unit area and a component unit area; At least one storage particle is arranged in the storage unit area, and a dynamic random access memory, a main control unit, and / or an integrated circuit chip are arranged in the component unit area.

[0006] In some embodiments, within the above-mentioned hard disk storage device: The storage particles are arranged at equal intervals in the storage unit area; The storage unit area maintains a first specified distance from the edge of the printed circuit board; The storage unit area maintains a second specified distance from the component unit area.

[0007] In some embodiments, within the above-mentioned hard disk storage device: A plurality of first slots are arranged on the front window, and the first slots are used for installing hard disk trays; The shell-less solid-state drives are fixed on the hard disk trays; Wherein, slide rails are arranged in the first slots, chutes are arranged on the hard disk trays, and the hard disk trays are connected to the slide rails through the chutes; After the hard disk tray is inserted into the front window through the slide rail, it is fixed to the bottom of the front window through a fixing structure.

[0008] In some embodiments, within the above hard disk storage device: The backplane includes a plurality of second slots, and the number of second slots matches the number of shell-less solid state drives; The shell-less solid state drive includes a gold finger; The gold finger is inserted into the second slot to achieve electrical connection between the backplane and the shell-less solid state drive.

[0009] In some embodiments, within the above hard disk storage device: An anti-static film is provided on the surface of the hard disk tray; The anti-static film includes a polyethylene film, a polyester film, and a polyvinyl chloride film.

[0010] This application also provides a server, including the above disclosed hard disk storage device, a motherboard connector, and a motherboard; The hard disk storage device is connected to the motherboard through the motherboard connector.

[0011] In some embodiments, within the above server: The motherboard further includes a spread spectrum clock generator; The spread spectrum clock generator responds to the enabling of the spread spectrum function within the basic input / output interface of the server to adjust the output of the phase-locked loop circuit.

[0012] In some embodiments, the above server further includes a fan cooling device, the fan cooling device includes a plurality of fans and a fan frame, the fan frame includes a plurality of mounting positions, and the fans are mounted on the mounting positions; The fan frame is disposed between the backplane and the motherboard; The fan frame is fixed to the side of the server chassis through a first structural member; The fan frame is fixed to the motherboard connector through a second structural member.

[0013] This application also provides a shell-less solid state drive, applied to the above disclosed hard disk storage device, the shell-less solid state drive includes a printed circuit board, and the printed circuit board includes a storage unit area and a component unit area; At least one storage particle is disposed within the storage unit area, and a dynamic random access memory, a main control unit, and / or an integrated circuit chip are disposed within the component unit area.

[0014] This application also provides a backplane, applied to the above disclosed hard disk storage device, and a capacitor is disposed on the surface of the backplane away from the front window to achieve power-off protection for the shell-less solid state drive.

[0015] Based on the hard disk storage device disclosed in this application, without changing the server structure, by redesigning the size and form of the solid-state drive, as well as the server backplane and the server front window, a huge "solid-state drive" is formed. The solid-state drive housing and capacitors are removed, and only the printed circuit board, dynamic random access memory, main control unit, and / or integrated circuit chips are retained, reducing the thickness of the solid-state drive, thereby optimizing the volume of the solid-state drive, increasing the number of units assembled in the whole machine. At the same time, the space originally for storing capacitors is replaced with space for storing memory particles, increasing the single-chip capacity of the solid-state drive, and further significantly increasing the storage capacity of the entire hard disk storage device; and the power-off protection function for the hard disk is achieved through the integration of capacitors on the backplane.

[0016] Furthermore, in this application, by defining the patch area of the memory particles, it is ensured that the memory particles are installed within a safe range, further improving the usability of the hard disk; at the same time, the patch distance is defined, and the patch density is maximized under the condition of ensuring the normal operation of each memory particle to ensure the storage capacity.

[0017] Furthermore, in this application, by designing the first slot and the hard disk tray and setting the slide rail, it is convenient for the normal extraction and insertion of the hard disk tray, and the hard disk tray is fixed to the lower end of the front window, realizing the fixation of the shell-less solid-state drive and the server front window, and improving the system stability.

[0018] Furthermore, in this application, by installing an anti-static film on the hard disk tray, the shell-less solid-state drive and the hard disk tray are physically isolated, ensuring that the shell-less solid-state drive does not directly contact the bottom of the metal tray, and there is an anti-static film in the middle to solve the problem of electrostatic discharge interference of the shell-less solid-state drive.

[0019] Furthermore, in this application, by installing a spread spectrum clock generator, the server will set a "spread spectrum" switch in the basic input / output system interface to activate the spread spectrum function. By setting in the basic input / output system, the phase-locked loop circuit is adjusted at the hardware level, so as to disperse the main frequency energy of the clock signal to a wider frequency band, reduce the energy peak value at a specific frequency point, and avoid the electromagnetic interference risk of the shell-less solid-state drive. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of this application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 Schematic diagram of a hard disk storage device provided by an embodiment of this application; Figure 2 Architecture diagram of a shell-less solid-state drive provided by an embodiment of this application; Figure 3 Schematic diagram of a combination of a shell-less solid state drive and a backplane provided by an embodiment of the present application; Figure 4 Schematic diagram of a server architecture provided by an embodiment of the present application; Figure 5 Schematic diagram of a fan heat dissipation device provided by an embodiment of the present application.

[0022] Description of the reference numerals in the drawings of the specification: 100, hard disk storage device; 200, server; 110, front window; 120, backplane; 130, shell-less solid state drive; 111, first slot; 121, second slot; 131, storage unit area; 132, component unit area; 133, storage particle; 134, main control; 135, dynamic random access memory; 136, integrated circuit chip; 137, printed circuit board; 138, gold finger; 210, motherboard connector; 220, motherboard; 230, fan heat dissipation device; 231, fan; 232, fan frame; 233, installation position; 234, first structural member; 235, second structural member. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. According to the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0024] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article or device including a series of elements includes not only those elements but also other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0025] As disclosed in the background art, mechanical hard drives and solid-state drives are usually selected as data storage devices in servers. Solid-state drives store data through storage particles, while mechanical hard drives store data through magnetic media. Solid-state drives do not have mechanical components such as motors and discs, and are all IC chips, so they have higher reliability and are not easily affected by the external environment. At the same time, the capacity of solid-state drives is much higher than that of mechanical hard drives, the size is smaller than that of mechanical hard drives, and the performance is dozens of times that of mechanical hard drives, fully meeting the requirements of high performance and high capacity of current rapidly developing business models such as AI for servers. However, with the continuous progress of technology, the accumulated data is increasing, and customers' requirements for the overall server capacity have been continuously improving. Therefore, how to further improve the overall capacity within the existing server architecture and solid-state drive protocol specifications has become a crucial issue.

[0026] Existing servers and solid-state drives have corresponding industry specifications, and product dimensions, interfaces, and protocols all need to be standardized devices; most servers are 1U, 2U, or 4U products, and most solid-state drives are 2.5-inch, E1.S, or E3.S products; taking a 2U server as an example, due to physical structure limitations, no matter which manufacturer, only 24 solid-state drives can be installed.

[0027] There are three mainstream protocols for solid-state drives, namely SATA (Serial Advanced Technology Attachment), SAS (Serial Attached SCSI), and NVME (Non-Volatile Memory Express). Regardless of which protocol is used, the appearance and internal structure of solid-state drives are basically the same, and they are all composed of components such as a main controller, storage chips, a PCB (Printed Circuit Board), DRAM (Dynamic Random Access Memory), and capacitors. Capacitors are used to provide power when the solid-state drive loses power, ensuring that critical information can be written into the flash memory. DRAM is used to improve data writing and storage speeds, and components such as I2C are used for internal monitoring and information transfer within the solid-state drive. The thickness dimensions of existing solid-state drives are 15mm and 7mm. In solid-state drives, the storage chips and capacitors occupy the most physical space. Especially in low-capacity drives, the space occupied by capacitors is several times higher than that of storage chips. The size of the capacitors is a key influencing factor in the thickness of solid-state drives. Taking tantalum capacitors as an example, these capacitors are very small in size and are mostly used in 7mm solid-state drives, but they are relatively costly. Therefore, most solid-state drives use traditional electrolytic capacitors, but these capacitors are relatively large in size and can only be used in 15mm solid-state drives. The main controller accounts for the highest cost proportion in solid-state drives. The more storage chips the main controller is connected to, the larger the single-disk capacity, and the lower the cost per GB of the solid-state drive. That is, the smaller the capacity of the solid-state drive, the higher the price, because a main controller and multiple capacitors must be equipped.

[0028] In addition, the storage particles in solid-state drives mainly include SLC (Single-Level Cell), MLC (Multi-Level Cell), TLC (Triple-Level Cell), and QLC (Quad-Level Cell) media. The current mainstream particle is TLC media, but QLC media can provide a higher single-chip capacity, and the problem is the insufficient read / write lifespan. Considering that the demand in large-capacity scenarios is mostly for cold data storage, QLC media can basically meet the requirements. Within the current technical scope, the maximum capacity of a solid-state drive using QLC media can reach 128TB. However, due to physical structure limitations, more storage particles cannot be installed within 15mm. Capacitors, DRAM, and the main controller are also key components of solid-state drives and require a certain amount of physical space. Currently, most solid-state drives are 15mm thick, and there are few 7mm models. However, the unit price of the products is relatively high, and they lack product competitiveness. Taking the mainstream 2U server as an example, it can support up to 24 15mm solid-state drives at most. The capacity of a single solid-state drive is 64TB, and the maximum capacity of the entire machine can reach 1.54PB.

[0029] In the prior art, since the electrolytic capacitors of solid-state drives occupy most of the physical space, it will limit the size of solid-state drives, especially the thickness of the hard disk, resulting in a limited number of solid-state drives that can be assembled in the server. In addition, since the electrolytic capacitors in solid-state drives occupy most of the physical space, it will limit the size of solid-state drives, especially the thickness of the disk, resulting in a limited number of hard disks that can be assembled in the server.

[0030] Moreover, most solid-state drives are 2.5 inches in size and follow the SFF-8201 size specification. Most of the interfaces use the SFF-8639 specification. The unified size and interface specifications limit the diversity of SSD forms. Further, due to the large number of capacitors per disk, the solid-state drive firmware needs to continuously maintain the dynamic balance of the capacitor charge, resulting in an overly complex firmware algorithm and prone to firmware anomalies. At the same time, regardless of the high or low capacity of solid-state drives, a main controller and multiple capacitors must be equipped, resulting in a relatively high cost per GB for low-capacity solid-state drives.

[0031] To enable those skilled in the art of this technology to better understand the solution of this application, the following further details this application in conjunction with the accompanying drawings and specific embodiments.

[0032] An embodiment of this application provides a hard disk storage device, as Figure 1 shown in the schematic diagram of the hard disk storage device 100. The hard disk storage device 100 includes: A front window 110, a backplane 120, and a plurality of shell-less solid state drives 130; capacitors (not shown in the figure) are provided on the surface of the backplane 120 away from the front window 110 to achieve power-off protection for the shell-less solid state drives 130; the above-mentioned shell-less solid state drives 130 include a printed circuit board 137 (PCB, Printed Circuit Board), and the above-mentioned printed circuit board 137 includes a storage unit area 131 and a component unit area 132; at least one storage particle 133 is provided in the storage unit area 131, and a dynamic random access memory 135, a main control 134 unit, and / or an integrated circuit chip 136 are provided in the component unit area 132. Without changing the server structure, the hard disk storage device 100 disclosed in the embodiments of the present application forms a huge "solid state drive" by redesigning the size and form of the solid state drive, as well as the server backplane 120 and the server front window 110. The solid state drive housing and capacitors are removed, and only the printed circuit board 137, the dynamic random access memory 135, the main control 134 unit, and / or the integrated circuit chip are retained, reducing the thickness of the solid state drive, thereby optimizing the volume of the solid state drive, increasing the number of units assembled in the whole machine. At the same time, the space originally storing the capacitor is replaced with the space for storing the storage particles 133, increasing the single-chip capacity of the solid state drive, and further significantly increasing the storage capacity of the entire hard disk storage device 100; and the power-off protection function for the hard disk is realized by integrating capacitors on the backplane 120.

[0033] Among them, taking the E3.S 1T product as an example, normally only 8 storage particles can be installed on the disk with an E3.S interface. After redesigning the layout of the storage particles 133 in the hard disk storage device 100 disclosed in the present application, 16 storage particles can be installed, so as to improve the storage capacity of the whole disk without affecting the performance of the solid state drive. Similarly, taking a 2U server as an example, 36 hard disks can be assembled in a single machine in the hard disk storage device 100 disclosed in the present application; the specific number of hard disks to be assembled in the present application is not limited, and is set by those skilled in the art according to actual situations.

[0034] Specifically, as a data storage device, the shell-less solid state drive 130 must consider having a power storage device in case of abnormal power-off, so capacitors are essential components. The capacitors installed on the backplane 120 are preferably electrolytic capacitors. In the hard disk storage device 100 disclosed in the present application, the electrolytic capacitors are preferably electrolytic capacitors of more than 30,000 above, so as to achieve capacitor protection and power-off support for all shell-less solid state drives 130 by the backplane 120 at one time. Currently, most solid state drives require capacitors of about 400 , and the capacitors installed in the solid state drive are about 700 , calculated according to a 5-year quality, even if the solid state drive capacitors decay at the maximum amount, they can still store 500 For the above power consumption, when 36 shell-less solid-state drives 130 are provided in the hard disk storage device 100, the electrolytic capacitors integrated on the backplane 120 can fully ensure the power-off safety of the solid-state drives.

[0035] Among them, the server front window 110 is set as a detachable component, and multiple first slots 111 are provided in the front window 110 for the hard disk tray (not shown in the figure) to be inserted; this avoids the risks such as scratching the solid-state drive, causing UCE (Unrecoverable Correctable Error), and connection state changes (such as Link down / up) caused by using a card slot to insert the hard disk in the fixed front window 110 provided by the prior art.

[0036] In addition, since a large-capacity electrolytic capacitor is integrated in the backplane 120, the present application also proposes a safety protection design for capacitor discharge. Specifically, first, a transient voltage suppressor diode or a varistor can be added to the power supply circuit of the backplane 120 to achieve rapid conduction when the voltage exceeds a certain threshold, absorb the excess energy, and further protect the hard disk at the back end; further, a current-limiting element, such as a fixed-value current-limiting resistor or a thermosensitive resistor, is added to the charging path of the capacitor to prevent damage caused by excessive capacitor discharge by limiting the initial charging current. In addition, in order to detect the capacitance redundancy in time, redundant capacitors can also be designed in the backplane 120 to replace them when the main working capacitor is abnormal, further ensuring the hard disk power supply.

[0037] It can be understood that the hard disk storage device 100 disclosed in the embodiment of the present application is a re-design of the hard disk structure, while the interface and protocol remain unchanged. The storage particles 133 assembled in the above shell-less solid-state drive 130 are all packaged according to the JEDEC standard; there will be no situation where the particle sizes are different due to different particle suppliers. The JEDEC LGA-16 specification is used in the hard disk storage device 100 disclosed in the embodiment of the present application, and the BGA (Ball Grid Array Package) mode is used for the storage particles 133. The size of each storage particle 133 is 9×12.5 mm. In addition to the main control 134, dynamic random access memory 135, and storage particles on the printed circuit board 137 in the solid-state drive, there are also various integrated circuit chips 136 (IC, Integrated Circuit Chip), such as temperature sensors, PMIC (Power Management IC, power management integrated circuit chips), etc.; these integrated circuit chips 136 also occupy a certain physical space, and in the present application, the physical positions of the integrated circuit chips 136 are not changed, maintaining the physical position design of the solid-state drive for the integrated circuit chips 136 in the prior art.

[0038] In a specific implementation scenario, such as Figure 2 shown in the architecture diagram of the shell-less solid-state drive 130, the above-mentioned storage particles 133 are arranged at equal intervals within the storage unit area 131. Preferably, the interval between each storage particle can be designed to be 2 mm to ensure the placement distance. The storage unit area 131 maintains a first specified distance from the edge of the printed circuit board 137, and the storage unit area 131 maintains a second specified distance from the component unit area 132. It can be understood that the component unit area 132 is an area covering main components such as the main controller 134 and the integrated circuit chip 136, which can be a whole area or a combination of discontinuous multiple areas; while the storage unit area 131 is the blank area on the printed circuit board 137 except the component unit area 132. Preferably, the above-mentioned first specified distance includes 4 mm from the upper and lower side edges of the printed circuit board 137 and 6 mm from the left and right side edges; preferably, the above-mentioned second specified distance can be set to 2 mm from the edge of the component unit area 132; of course, in the actual scenario, it can be adaptively adjusted by those skilled in the art, and the present application does not make any limitations in this regard. It can be understood that Figure 2 only simply shows a typical structure diagram of the shell-less solid-state drive 130, and the positions of the above-mentioned main controller 134, integrated circuit chip 136, and dynamic random access memory 135 are not fixed.

[0039] By limiting the placement area of the storage particles 133, the present application ensures that the storage particles 133 are installed within a safe range, further improving the usability of the hard disk; at the same time, by limiting the placement distance, the placement density is maximized under the condition of ensuring the normal operation of each storage particle 133 to ensure the storage capacity.

[0040] In a specific implementation scenario, a plurality of first slots 111 are provided on the front window 110 of the above-mentioned server. The number of the first slots 111 matches the number of shell-less solid-state drives 130 to be inserted. For example, for the 36 hard drives disclosed in the foregoing content, 36 first slots 111 are correspondingly provided. The first slots 111 are used to install the hard drive trays. The shell-less solid-state drives 130 are fixed to the hard drive trays. The present application does not limit the specific fixing structure, which can be fixed by a snap-fastening method or by a slot. Among them, a slide rail (not shown in the figure) is provided in the first slot 111, and a sliding groove (not shown in the figure) is correspondingly provided on the hard drive tray (not shown in the figure). The hard drive tray is connected to the slide rail through the sliding groove to install the hard drive tray on the slot. After the hard drive tray is inserted into the front window 110 through the slide rail, it is fixed to the bottom of the front window 110 through a fixing structure. The above-mentioned fixing structure is preferably set as a spring buckle, and of course, it can also be set as other structures, such as a spring pin. The present application does not limit this. Through the above structure, the slide rail is provided to facilitate the normal extraction and insertion of the hard drive tray, and the hard drive tray is fixed to the lower end of the front window 110 to realize the fixation of the shell-less solid-state drive 130 and the server front window 110, thereby improving the system stability.

[0041] Furthermore, in a specific implementation scenario, an anti-static film is also provided on the surface of the above-mentioned hard drive tray. The anti-static film includes a polyethylene film, a polyester film, a polyvinyl chloride film, etc. The present application does not limit the specific material. By installing the anti-static film on the hard drive tray, the shell-less solid-state drive 130 and the hard drive tray are physically isolated to ensure that the shell-less solid-state drive 130 does not directly contact the bottom of the metal tray, and there is an anti-static film in the middle to solve the problem of electrostatic discharge interference of the shell-less solid-state drive 130.

[0042] In a specific implementation scenario, such as Figure 3As shown in the figure, the above-mentioned backplane 120 includes a plurality of second slots 121, and the number of second slots 121 matches the number of shell-less solid-state drives 130; the shell-less solid-state drive 130 includes a gold finger 138; the gold finger 138 is inserted into the second slot 121 to achieve electrical connection between the backplane 120 and the shell-less solid-state drive 130. That is, the shell-less solid-state drive 130 and the backplane 120 achieve male-female head docking through the gold finger 138 of the drive and the slot on the backplane 120 to complete the corresponding connection. It provides a hardware basis for the server backplane 120 to supply power to the shell-less solid-state drive 130 using electrolytic capacitors; ensures the data integrity of the shell-less solid-state drive 130 during abnormal power-on and power-off. It can be understood that the shell-less solid-state drive 130 uses a power supply mode of 12V + 5V or 12V + 3.3V, and the capacitors on the backplane 120 support multiple power supplies of 12V, 5V, 3.3V, and Standby, which can meet the normal power consumption requirements of the shell-less solid-state drive 130. The electrolytic capacitor will provide 12V_STBY power to the backplane 120, which is converted into P12V_STBY, P5V_STBY, and P3V3_I2C_STBY power by the MPQ8626 chip to meet the power supply requirements of the NVME drive, SATA drive, and I2C monitoring channel respectively.

[0043] In this application, by redesigning the form and structure of the backplane, front window, and shell-less solid-state drive, only the key devices on the solid-state drive circuit board are retained to control the thickness of the solid-state drive, and further increase the assembly quantity of the solid-state drive in the server. The space originally for placing capacitors is all changed to store storage particles, which can double the capacity; secondly, by redesigning the hard disk backplane and placing a large-capacity electrolytic capacitor on the hard disk backplane, it can achieve capacitor protection and power-off support for all shell-less solid-state drives on the backplane at one time, that is, integrate the capacitors of each shell-less solid-state drive into one backplane capacitor, which not only avoids data loss due to abnormal power-off of the shell-less solid-state drive but also saves the printed circuit board space of the shell-less solid-state drive, enabling it to have more space to place storage particles, improving the single-disk capacity and the overall storage space of the machine.

[0044] An embodiment of this application also provides a server 200, as Figure 4 shown in the schematic diagram of the server 200 architecture, the server 200 includes a motherboard connector 210, a motherboard 220, and the hard disk storage device 100 provided in the above embodiment; among them, the hard disk storage device 100 is connected to the motherboard 220 through the motherboard connector 210. Among them, for the description of the features of the hard disk storage device 100 in the corresponding embodiment of the server 200, reference can be made to the description related to the hard disk storage device 100 in the corresponding embodiment, which will not be elaborated here one by one.

[0045] Further, in some implementation scenarios, a spread-spectrum clock generator (not shown in the figure) is also provided on the above-mentioned main board 220. The spread-spectrum clock generator responds to the activation of the spread-spectrum function in the basic input / output interface of the server 200 to adjust the output of the phase-locked loop circuit (not shown in the figure). It can be understood that since the shell-less solid-state drive 130 designed in this application has no protective shell, the main control 134, the storage particles 133, and the dynamic random access memory 135 are all attached to the printed circuit board 137, which is prone to electromagnetic interference risks. In this application, by installing a spread-spectrum clock generator, the server 200 will set a "spread spectrum" switch in the basic input / output system interface to activate the spread-spectrum function. By setting in the basic input / output system, the phase-locked loop circuit is adjusted at the hardware level, so as to disperse the main frequency energy of the clock signal to a wider frequency band, reduce the energy peak at specific frequency points, and avoid the electromagnetic interference risk of the shell-less solid-state drive 130.

[0046] In some implementation scenarios, the above-mentioned server 200 further includes a fan cooling device 230. Figure 5 As shown in the schematic diagram of the fan cooling device 230, the fan cooling device 230 includes a plurality of fans 231 and a fan frame 232. The fan frame 232 includes a plurality of mounting positions 233, and the fans 231 are mounted on the mounting positions 233; the fan frame 232 is arranged between the backplane 120 and the main board 220; since the fans 231 rotate at a very high speed during use, when designing the fan cooling device 230, the stability of the fan cooling device 230 and the wiring space of the backplane 120 need to be considered. Therefore, this application proposes a design: the fan frame 232 is fixed to the main board connector 210 through a second structural member 235; the fan frame 232 is fixed to the side of the chassis of the server 200 through a first structural member 234. In addition, it is worth noting that a certain height is reserved below the fan frame 232 (that is, between the fan frame 232 and the main board connector 210) for the cable connection between the backplane 120 and the main board 220. Except for the reserved wiring position, other spaces are filled with foam to prevent the air in the chassis from flowing back. The above-mentioned first structural member 234 is preferably set as a buckle, and of course, other fixing structures can also be used for fixing, such as a plug, and this application does not make any limitations in this regard; the above-mentioned second structural member 235 is preferably set as a direct plug connector, such as a male and female head, and this application does not make any limitations in this regard. For example, the above-mentioned fan cooling device 230 can use 6 fans of the 6050 model for heat dissipation; of course, those skilled in the art can also make adaptive adjustments according to the actual situation, and this application does not make any limitations on the specific number of fans.

[0047] In some implementation scenarios, the storage particles 133 are arranged at equal intervals within the storage unit area 131; the storage unit area 131 maintains a first specified distance from the edge of the printed circuit board 137; the storage unit area 131 maintains a second specified distance from the component unit area 132.

[0048] In some implementation scenarios, the shell-less solid-state drive 130 is fixed to a hard disk tray, and the hard disk tray is installed in the first slot 111, where the first slot 111 is provided on the front window 110 of the server, and a plurality of first slots 111 are provided in the server front window 110. Among them, a slide rail is provided in the first slot 111, a chute is provided on the hard disk tray, and the hard disk tray is connected to the slide rail through the chute; after the hard disk tray is inserted into the front window 110 through the slide rail, it is fixed to the bottom of the front window 110 through a fixing structure.

[0049] It can be understood that the shell-less solid-state drive 130 provided in this application has no external protective shell, and its thickness can reach less than 7 mm. In a standard 2U server 200, more than 24 pieces can be stored; in terms of heat dissipation, by setting the server 200 fan 231, cold air is directly blown onto the heat-generating components such as the main control 134 and storage particles 133 of the shell-less solid-state drive 130.

[0050] This application discloses a brand-new high-capacity server. By optimizing the form and interface of the solid-state drive, only the PCB board and key components are retained, and a matching dedicated backplane 120 is used to increase the number of hard disks assembled in the server; and the server backplane 120 and front window 110 are redesigned, and multiple capacitors are integrated into the backplane 120 and used as one capacitor, thereby reducing the cost of a single solid-state drive; while increasing the number of storage particles in the unit space of the hard disk, the storage capacity of a single solid-state drive is improved, further enhancing the capacity of the entire server and bringing better cost advantages, and improving the comprehensive competitiveness of the server.

[0051] In some implementation scenarios, the backplane 120 includes a plurality of second slots 121, and the number of second slots 121 matches the number of shell-less solid-state drives 130; the shell-less solid-state drive 130 includes a gold finger 138; the gold finger 138 is inserted into the second slot 121 to achieve electrical connection between the backplane 120 and the shell-less solid-state drive 130.

[0052] In some implementation scenarios, an anti-static film is provided on the surface of the hard disk tray; the anti-static film includes a polyethylene film, a polyester film, and a polyvinyl chloride film.

[0053] An embodiment of this application also provides a shell-less solid-state drive 130. In the hard disk storage device 100 disclosed in the above embodiment, the shell-less solid-state drive 130 includes a printed circuit board 137, and the printed circuit board 137 includes a storage unit area 131 and a component unit area 132; at least one storage particle 133 is provided in the storage unit area 131, and a dynamic random access memory 135, a main control 134 unit, and / or an integrated circuit chip are provided in the component unit area 132.

[0054] In some implementation scenarios, the storage particles 133 are arranged at equal intervals within the storage unit area 131; the storage unit area 131 maintains a first specified distance from the edge of the printed circuit board 137; the storage unit area 131 maintains a second specified distance from the component unit area 132.

[0055] In some implementation scenarios, the shell-less solid-state drive 130 is fixed to the hard disk bracket, and the hard disk bracket is installed in the first slot 111, where the first slot 111 is provided on the front window 110 of the server, and multiple first slots 111 are provided in the server front window 110. Among them, a slide rail is provided in the first slot 111, a sliding groove is provided on the hard disk bracket, and the hard disk bracket is connected to the slide rail through the sliding groove; after the hard disk bracket is inserted into the front window 110 through the slide rail, it is fixed to the bottom of the front window 110 through a fixing structure.

[0056] In some implementation scenarios, an anti-static film is provided on the surface of the hard disk bracket; the anti-static film includes a polyethylene film, a polyester film, and a polyvinyl chloride film.

[0057] In the shell-less solid-state drive 130 disclosed in this application, only key components such as the printed circuit board 137, the main controller 134, the storage particles 133, and the random access memory are retained, and the capacitors are transplanted into the backplane 120, and the backplane 120 is used to provide power-off protection for the shell-less solid-state drive 130. The space originally used to install the capacitors is used to install the storage particles 133, greatly increasing the storage capacity of a single hard disk; at the same time, since there is no protective case outside the hard disk, the thickness of the hard disk is reduced; thus, the number of hard disks that can be assembled in a server is increased, further increasing the storage capacity of the server.

[0058] Among them, for the description of the features of the hard disk storage device 100 in the embodiments corresponding to the shell-less solid-state drive 130, reference can also be made to the relevant descriptions of the embodiments corresponding to the hard disk storage device 100, which will not be elaborated here one by one.

[0059] The embodiments of this application also provide a backplane 120, and capacitors are provided on the surface of the backplane 120 away from the front window 110 to provide power-off protection for the shell-less solid-state drive 130.

[0060] In some implementation scenarios, the backplane 120 includes a plurality of second slots 121, and the number of the second slots 121 matches the number of the shell-less solid-state drives 130; the shell-less solid-state drive 130 includes a gold finger 138 module; the gold finger 138 module is inserted into the second slot 121 to achieve electrical connection between the backplane 120 and the shell-less solid-state drive 130.

[0061] In this application, by redesigning the backplane 120 and adding electrolytic capacitors to the rear side of the backplane 120, that is, transferring the capacitors in the single-chip solid-state drive to the backplane 120, it is realized to supply power to the solid-state drive by using the electrolytic capacitors on the backplane 120, thereby ensuring the data integrity of the solid-state drive during abnormal power-on and power-off.

[0062] In this application, by redesigning the hard disk backplane and placing a large-capacity electrolytic capacitor on the hard disk backplane, it realizes the capacitor protection and power-off support for all shell-less solid-state drives on the backplane at one time, that is, integrating the capacitors of each shell-less solid-state drive into one backplane capacitor. While avoiding data loss due to abnormal power-off of the shell-less solid-state drive, it also saves the printed circuit board space of the shell-less solid-state drive, enabling it to have more space to place storage particles, improving the single-disk capacity and the storage space of the whole machine.

[0063] For the description of the features of the hard disk storage device 100 corresponding to the backplane 120 in the corresponding embodiment, reference can also be made to the description of the relevant embodiment of the hard disk storage device 100, which will not be elaborated here one by one.

[0064] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0065] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed in this article can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0066] The above has introduced in detail a hard disk storage device, a server, a shell-less solid-state drive, and a backplane provided by this application. Specific embodiments are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the device of this application and its core idea. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A hard disk storage device, characterized in that, The hard disk storage device includes: a front window, a backplane, and a plurality of shell-less solid state drives; Capacitors are arranged on the surface of the backplane away from the front window to achieve power-off protection for the shell-less solid state drives; The shell-less solid state drive includes a printed circuit board, and the printed circuit board includes a storage unit area and a component unit area; At least one storage particle is arranged in the storage unit area, and a dynamic random access memory, a main control unit, and / or an integrated circuit chip are arranged in the component unit area.

2. The hard disk storage device according to claim 1, wherein the storage particles are arranged at equal intervals in the storage unit area; the storage unit area maintains a first specified distance from the edge of the printed circuit board; the storage unit area maintains a second specified distance from the component unit area.

3. The hard disk storage device according to claim 1, wherein A plurality of first slots are arranged on the front window, and the first slots are used for installing a hard disk tray; The shell-less solid state drive is fixed on the hard disk tray; Wherein, slide rails are arranged in the first slots, chutes are arranged on the hard disk tray, and the hard disk tray is connected to the slide rails through the chutes; After the hard disk tray is inserted into the front window through the slide rails, it is fixed to the bottom of the front window through a fixing structure.

4. The hard disk storage device according to claim 1, wherein the backplane includes a plurality of second slots, and the number of the second slots matches the number of the shell-less solid state drives; the shell-less solid state drive includes a gold finger; The gold finger is inserted into the second slot to achieve electrical connection between the backplane and the shell-less solid state drive.

5. The hard disk storage device according to claim 3, characterized in that, An anti-static film is arranged on the surface of the hard disk tray; The anti-static film includes a polyethylene film, a polyester film, and a polyvinyl chloride film.

6. A server, characterized in that, The server includes the hard disk storage device according to any one of claims 1-5, a motherboard connector, and a motherboard; The hard disk storage device is connected to the motherboard through the motherboard connector.

7. The server according to claim 6, wherein the motherboard further includes a spread spectrum clock generator; The spread spectrum clock generator responds to the enabling of the spread spectrum function in the basic input / output interface of the server to adjust the output of the phase-locked loop circuit.

8. The server according to claim 6, wherein The server further includes a fan heat dissipation device, the fan heat dissipation device includes a plurality of fans and a fan frame, the fan frame includes a plurality of mounting positions, and the fans are mounted on the mounting positions; The fan frame is arranged between the backplane and the motherboard; The fan frame is fixed to the side of the server chassis through a first structural member; The fan frame is fixed to the motherboard connector through a second structural member.

9. A shell-less solid-state drive, applied to the hard disk storage device described in any one of claims 1-5, characterized in that, The shell-less solid state drive includes a printed circuit board, and the printed circuit board includes a storage unit area and a component unit area; At least one storage particle is arranged in the storage unit area, and a dynamic random access memory, a main control unit, and / or an integrated circuit chip are arranged in the component unit area.

10. A backplane, applied to the hard disk storage device described in any one of claims 1-5, characterized in that Capacitors are arranged on the surface of the backplane away from the front window to achieve power-off protection for the shell-less solid state drives.

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