Touch pressure sensing module, touch panel and electronic device

Abstract

The invention discloses a touch pressure sensing module, a touch panel and an electronic device. The technical problem that in the prior art, the structure is complex is solved. The touch pressure sensing module comprises a touch type flexible circuit board, a deformation transmission assembly and a pressure sensing type flexible circuit board. And the touch type flexible circuit board is used for realizing a sliding touch effect. The deformation transmission assembly is installed below the touch type flexible circuit board. The pressure-sensitive flexible circuit board is connected with the touch-type flexible circuit board, and the pressure-sensitive flexible circuit board is located below the deformation transmission assembly. When the touch type flexible circuit board is triggered, the deformation transmission assembly deforms and triggers the pressure-sensitive type flexible circuit board. According to the touch pressure sensing module disclosed by the invention, the touch type flexible circuit board and the pressure sensing type flexible circuit board are integrated together, so that low-cost and high-sensitivity pressure sensing is realized, and the touch pressure sensing module is simple in structure and lower in cost.

Description

Technical Field

[0001] This application belongs to the technical field of pressure sensing, and particularly relates to a touch pressure sensing module, a touch control panel, and an electronic device. Background Art

[0002] A touch pressure sensing module is a module that integrates touch and pressure sensing functions and is widely used in various electronic devices to provide a richer and more intuitive user interaction experience.

[0003] With the continuous development of the smartphone market, the touch pressure sensing module, as a new type of user interaction method, has gradually gained market favor. However, the structures of current touch pressure sensing modules on the market are complex and the costs are relatively high. Summary of the Invention

[0004] To solve the above technical problems, this application provides a touch pressure sensing module, a touch control panel, and an electronic device, aiming to solve the problems of complex structure and high cost in the prior art.

[0005] The technical solution adopted to achieve the purpose of this application is as follows. In the first aspect of this application, the present invention discloses a touch pressure sensing module, including:

[0006] A touch flexible circuit board;

[0007] A deformation transmission component installed on one side of the touch flexible circuit board; and

[0008] A pressure sensing flexible circuit board connected to the touch flexible circuit board, and the deformation transmission component is located between the pressure sensing flexible circuit board and the touch flexible circuit board;

[0009] Wherein, when the touch flexible circuit board is pressed, the deformation transmission component deforms and triggers the pressure sensing flexible circuit board.

[0010] In some embodiments, the pressure sensing flexible circuit board is provided with a pressure sensing module, the pressure sensing module includes a plurality of piezoresistive inks arranged at intervals, and conductive adhesives are arranged between the piezoresistive inks. The projections of the touch flexible circuit board, the deformation transmission component, and the pressure sensing module coincide. When the deformation transmission component deforms, it squeezes the piezoresistive inks, causing the piezoresistive inks to deform.

[0011] In some embodiments, the deformation transmission component includes a first deformation member, the first deformation member is located between the touch flexible circuit board and the pressure sensing flexible circuit board, and when the first deformation member deforms, it squeezes the piezoresistive inks.

[0012] In some embodiments, the first deformable member includes a top plate, a bottom plate, and at least two connecting blocks. The top plate and the bottom plate are disposed opposite to each other. Each connecting block is disposed between the top plate and the bottom plate, and the connecting blocks are respectively disposed at both ends of the top plate.

[0013] In some embodiments, the deformation transmission assembly further includes a second deformable member and a third deformable member. The second deformable member is located between the first deformable member and the third deformable member, and the free end of the third deformable member is disposed opposite to the free end of the first deformable member. The free end of the third deformable member abuts against the pressure sensing module. When the first deformable member deforms, it drives the second deformable member and the second deformable member to deform, thereby driving the piezoresistive ink to deform.

[0014] In some embodiments, a plurality of pressure sensing modules are disposed on the pressure sensing flexible circuit board. The plurality of pressure sensing modules are spaced apart. Both the first deformable member and the third deformable member have a plurality of free ends. Each free end of the first deformable member, each free end of the third deformable member, and each pressure sensing module are disposed in one-to-one correspondence.

[0015] In some embodiments, the pressure sensing flexible circuit board further includes a first insulating layer. The pressure sensing module is embedded in the first insulating layer, and the pressure sensing module is located on a side of the first insulating layer away from the deformation transmission assembly.

[0016] In some embodiments, the touch flexible circuit board includes a second insulating layer and at least one capacitor. The capacitor is embedded in the second insulating layer. The deformation transmission assembly abuts against the bottom of the second insulating layer, and the second insulating layer is connected to the first insulating layer.

[0017] The technical solution adopted to achieve the purpose of the present application is that in the second aspect of the present application, the present invention further discloses a touch panel, which includes a button and the touch and pressure sensing module described in the first aspect above. The button is located on a side of the pressure sensing flexible circuit board away from the deformation transmission assembly, and the button is touched when the pressure sensing flexible circuit board is triggered.

[0018] The technical solution adopted to achieve the purpose of the present application is that in the third aspect of the present application, the present invention further discloses an electronic device, which includes the touch panel described in the second aspect above.

[0019] As can be seen from the above technical solutions, the touch and pressure sensing module disclosed in this application includes a touch flexible circuit board, a deformation transfer component, and a pressure sensing flexible circuit board. The touch flexible circuit board is used to achieve a sliding touch effect. The deformation transfer component is installed on one side of the touch flexible circuit board. The pressure sensing flexible circuit board is connected to the touch flexible circuit board, and the pressure sensing flexible circuit board is located on the side of the deformation transfer component away from the touch flexible circuit board. When the touch flexible circuit board is pressed, the deformation transfer component deforms and triggers the pressure sensing flexible circuit board.

[0020] The touch and pressure sensing module structure disclosed in this application is simple. The touch flexible circuit board and the pressure sensing flexible circuit board are connected together, and the deformation transfer component is arranged between the touch flexible circuit board and the pressure sensing flexible circuit board to transfer pressure, so that the pressure sensing flexible circuit board can be triggered when the touch flexible circuit board is pressed. The integrated structure of this embodiment can reduce the production steps and the processing difficulty, thereby reducing the production cost. Description of the Drawings

[0021] In order to make those skilled in the art in the technical field to which this application belongs understand this application more clearly, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0022] Figure 1 Schematic diagram of the touch and pressure sensing module in one or more embodiments of this application;

[0023] Figure 2 For Figure 1 Schematic diagram of the deformation transfer component in;

[0024] Figure 3 For Figure 2 Schematic diagram of the first deformation member in;

[0025] Figure 4 For Figure 1 Schematic diagram of the connection between the touch flexible circuit board and the pressure sensing flexible circuit board in;

[0026] Figure 5 For Figure 4 Schematic diagram from another perspective.

[0027] Description of the Reference Numerals:

[0028] 100 - Touch flexible circuit board, 110 - Second insulating layer, 120 - Capacitor, 200 - Deformation transfer component, 210 - First deformable part, 211 - Top plate, 212 - Bottom plate, 213 - Connecting block, 220 - Second deformable part, 230 - Third deformable part, 300 - Pressure - sensitive flexible circuit board, 310 - First insulating layer, 320 - Piezoresistive ink, 330 - Conductive adhesive, 400 - Support block. Detailed implementation manners

[0029] In order to enable those skilled in the art in the technical field to which this application belongs to more clearly understand this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope protected by this application.

[0030] In addition, this application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0031] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments may be combined with each other.

[0032] The existing touch - pressure sensing module generally sets a pressure - sensing module and a capacitor integration module. By pressing the capacitor integration module, the capacitor integration module squeezes the pressure - sensing module to achieve cooperation. This kind of touch - pressure sensing module is not only complex but also costly.

[0033] The embodiments of the present invention disclose a touch - pressure sensing module, which can solve the technical problem of complex structure in the prior art. The technical solutions of this application will be introduced in detail below through specific embodiments:

[0034] Refer to Figure 1 and Figure 2, in the embodiment of the first aspect of the present application, a touch and pressure sensing module is provided, which includes a touch flexible printed circuit board 100, a deformation transfer component 200, and a pressure sensing flexible printed circuit board 300. The touch flexible printed circuit board 100 is used to achieve a sliding touch effect, and the pressure sensing flexible printed circuit board 300 is used to achieve a pressing touch effect. The deformation transfer component 200 is installed on one side of the touch flexible printed circuit board 100 and is located between the pressure sensing flexible printed circuit board 300 and the touch flexible printed circuit board 100. The pressure sensing flexible printed circuit board 300 is connected to the touch flexible printed circuit board 100. When the touch flexible printed circuit board 100 is pressed, the deformation transfer component 200 deforms and triggers the pressure sensing flexible printed circuit board 300.

[0035] The touch and pressure sensing module structure disclosed in this embodiment is simple. The touch flexible printed circuit board 100 and the pressure sensing flexible printed circuit board 300 are connected together. The deformation transfer component 200 is arranged between the touch flexible printed circuit board 100 and the pressure sensing flexible printed circuit board 300 to transfer pressure, so that the pressure sensing flexible printed circuit board 300 can be triggered when the touch flexible printed circuit board 100 is pressed. The touch flexible printed circuit board 100 and the pressure sensing flexible printed circuit board 300 produced by the integrated structure of this embodiment do not require additional connecting parts, and the touch flexible printed circuit board 100 and the pressure sensing flexible printed circuit board 300 can be produced at one time. Compared with the separate production of the touch flexible printed circuit board 100 and the pressure sensing flexible printed circuit board 300, the integrated structure can reduce the production steps, lower the processing difficulty, and thus reduce the production cost.

[0036] Among them, the touch flexible printed circuit board 100 (Flexible Printed Circuit, abbreviated as FPC), also called the touch function FPC, is a flexible circuit connection board with touch sensing function. It plays an important role in touch screen technology, especially in electronic products such as smart phones, tablet computers, and wearable touch and pressure sensing modules.

[0037] The working principle of the touch function FPC is based on capacitive sensing or resistive sensing technology. When the user touches the screen, a tiny capacitance or resistance change will be formed between the finger and the screen. This change will be captured by the sensing elements inside the FPC and converted into an electrical signal for transmission and processing. Finally, these signals will be converted into instructions or data input by the user to achieve interaction with the electronic touch and pressure sensing module.

[0038] The pressure-sensitive flexible printed circuit board 300 (Flexible Printed Circuit, abbreviated as FPC), also known as the pressure-sensitive function FPC, is a flexible printed circuit board that can generate resistance changes or other electrical signal changes when subjected to pressure. This circuit board combines the pressure-sensitive technology and the flexibility of the FPC, making it have broad application prospects in fields such as touchscreens, pressure sensors, and wearable touch and pressure sensing modules.

[0039] The working principle of the pressure-sensitive function FPC is mainly based on the piezoresistive effect or the capacitive effect. When an external pressure acts on the FPC, the conductive materials or structures inside it will deform, resulting in changes in electrical parameters such as resistance or capacitance. These changes can be captured by the circuit system and converted into corresponding electrical signals, thereby realizing the perception and measurement of pressure.

[0040] Refer to Figure 1 and Figure 5 In one embodiment, the pressure-sensitive flexible printed circuit board 300 is provided with a pressure-sensitive module. The pressure-sensitive module includes a plurality of piezoresistive inks 320 arranged at intervals, and a conductive adhesive 330 is provided between the piezoresistive inks 320. The projections of the touch-type flexible printed circuit board 100, the deformation transfer component 200, and the pressure-sensitive flexible printed circuit board 300 coincide. When the deformation transfer component 200 deforms, it will squeeze the piezoresistive ink 320, causing the piezoresistive ink 320 to deform.

[0041] The working principle of the piezoresistive ink 320 is based on the piezoresistive effect. The characteristic of the piezoresistive ink 320 is that when it is deformed by an external force, its resistance value will change accordingly. This change in resistance value can be captured by the circuit system and converted into corresponding electrical signals, thereby realizing the perception and measurement of pressure. This change usually has a certain relationship with the amount of pressure applied, which can be a linear relationship or a non-linear relationship. In the piezoresistive ink 320, this effect is achieved by the deformation or rearrangement of the conductive particles or conductive network in the ink when subjected to pressure.

[0042] According to the type of conductive particles, the piezoresistive ink 320 can be divided into metal particle type, carbon particle type, conductive polymer type, etc. According to the form of resistance change, the piezoresistive ink 320 can be divided into resistance increasing type and resistance decreasing type.

[0043] To enhance the sensitivity and stability of the pressure-sensitive module, a conductive adhesive 330 is provided between the piezoresistive inks 320. The conductive adhesive 330 not only plays a role in connecting the piezoresistive inks 320, but also can further affect the resistance value of the entire pressure-sensitive module through the change in the conductivity of the piezoresistive ink 320 when the piezoresistive ink 320 deforms. This design makes the pressure-sensitive module more sensitive and accurate in responding to pressure.

[0044] In addition, the projections of the touch flexible circuit board 100, the deformation transmission component 200, and the pressure-sensitive flexible circuit board 300 coincide, which is an important prerequisite for ensuring the normal operation of the module. Only when the projections of these three completely coincide can the deformation transmission component 200 accurately transmit the pressure to the piezoresistive module when subjected to an external force, thereby triggering the deformation of the piezoresistive ink 320 and the change in its resistance value. This design not only improves the response speed of the module but also ensures its stability and reliability.

[0045] Refer to Figure 1 , Figure 2 and Figure 3 , in one embodiment, the deformation transmission component 200 includes a first deformable member 210. The first deformable member 210 is located between the touch flexible circuit board 100 and the pressure-sensitive flexible circuit board 300, and when the first deformable member 210 deforms, it squeezes the piezoresistive ink 320.

[0046] The first deformable member 210 is located between the touch flexible circuit board 100 and the pressure-sensitive flexible circuit board 300. It acts as a bridge, connecting the two circuit boards and transmitting pressure. When a user applies pressure on the touch flexible circuit board 100, this pressure is transmitted to the first deformable member 210 through the deformation transmission component 200. Since the first deformable member 210 has a certain elasticity and deformation ability, it can deform when subjected to an external force and transmit this deformation to the piezoresistive ink 320 on the pressure-sensitive flexible circuit board 300.

[0047] When an external force acts on the touch flexible circuit board 100, it is transmitted to the first deformable member 210 through other components (such as possible support structures or guiding structures) in the deformation transmission component 200. After being subjected to the external force, the first deformable member 210 will undergo elastic deformation, and its shape and size will change. This deformation process will cause changes in the contact area and contact pressure between the first deformable member 210 and the piezoresistive ink 320 on the pressure-sensitive flexible circuit board 300.

[0048] Since the resistance value of the piezoresistive ink 320 changes with its deformation and contact pressure, the deformation of the first deformable member 210 will directly cause a change in the resistance value of the piezoresistive ink 320. This change in the resistance value can be captured by the circuit system and converted into corresponding electrical signals, thereby realizing the perception and measurement of pressure.

[0049] In one embodiment, the first deformable member 210 includes a top plate 211, a bottom plate 212, and at least two connecting blocks 213. The top plate 211 and the bottom plate 212 are oppositely arranged, and each connecting block 213 is disposed between the top plate 211 and the bottom plate 212, and connecting blocks 213 are respectively arranged at both ends of the top plate 211.

[0050] The first deformation member 210 adopts a combined design of a top plate 211, a bottom plate 212, and at least two connecting blocks 213. This design not only enhances its structural stability but also optimizes the pressure transfer efficiency.

[0051] The top plate 211, as the top structure of the first deformation member 210, directly contacts the user's finger or an external object. When an external pressure acts on the top plate 211, the top plate 211 will undergo a slight deformation and transmit this deformation to the connecting blocks 213 below. The design of the top plate 211 needs to consider factors such as the material selection, thickness, and shape to ensure that it can maintain sufficient rigidity and deformation ability when subjected to external forces.

[0052] The bottom plate 212 is located at the bottom of the first deformation member 210 and directly contacts the piezoresistive ink 320 on the piezoresistive flexible circuit board 300. When the top plate 211 deforms, the deformation is transmitted to the connecting blocks 213 below. Since the connecting blocks 213 are connected to the bottom plate 212, the bottom plate 212 will also deform accordingly, thereby squeezing the piezoresistive ink 320 and changing its resistance value.

[0053] The connecting blocks 213, as the connecting structure between the top plate 211 and the bottom plate 212, play a role in supporting and transmitting pressure. At least two connecting blocks 213 are arranged between the top plate 211 and the bottom plate 212, and connecting blocks 213 are respectively arranged at both ends of the top plate 211. This design enables the first deformation member 210 to form a stable frame structure when subjected to external forces, thereby enhancing its structural stability and deformation ability.

[0054] The parameters such as the number, position, and shape of the connecting blocks 213 can be adjusted according to specific application requirements to optimize the performance of the module. Refer to Figure 2 , in this embodiment, four connecting blocks 213 can be arranged between the top plate 211 and the bottom plate 212. However, in some other embodiments, when the top plate 211 and the bottom plate 212 are shorter, it is also possible to arrange only two connecting blocks 213 located at the ends respectively, or when the top plate 211 and the bottom plate 212 are longer, it is also possible to arrange more than four connecting blocks 213.

[0055] In one embodiment, the deformation transfer assembly 200 further includes a second deformation member 220 and a third deformation member 230. The second deformation member 220 is located between the first deformation member 210 and the third deformation member 230, and the free end of the third deformation member 230 is disposed opposite to the free end of the first deformation member 210, that is, the free end of the third deformation member 230 coincides with the projection of the free end of the first deformation member 210. The free end of the third deformation member 230 abuts against the pressure sensing module. When the first deformation member 210 deforms, it drives the second deformation member 220 and the second deformation member 220 to deform, and further drives the piezoresistive ink 320 to deform.

[0056] It should be noted that in this embodiment, the free end refers to a rod-shaped structure or a long strip-shaped structure, whose first end is fixed, while the second end is not restricted by other structures. When a non-axial force is applied to the second end, the second end bends relative to the first end under the action of this force, thereby generating deformation. And when the middle part of the rod-shaped structure or the long strip-shaped structure is fixed, both ends are free ends that can generate deformation after being subjected to non-axial forces.

[0057] The second deformable member 220 is disposed between the first deformable member 210 and the third deformable member 230, playing a connecting role. When the first deformable member 210 is deformed under an external pressure, it transmits this deformation to the second deformable member 220. Since the second deformable member 220 has certain elasticity and deformation ability, it can deform correspondingly after receiving the pressure transmitted by the first deformable member 210 and further transmit this deformation to the third deformable member 230 below.

[0058] The third deformable member 230, as the bottom structure of the deformation transmission assembly 200, has its free end disposed opposite to the free end of the first deformable member 210 and directly abuts against the piezoresistive ink 320 on the pressure sensing module. When the second deformable member 220 deforms, it pushes the third deformable member 230 to deform, thereby squeezing the piezoresistive ink 320 and changing its resistance value. This design enables the deformation transmission assembly 200 to form a continuous pressure transmission and deformation conversion process, thereby improving the response speed and accuracy of the module.

[0059] It is worth noting that the contact mode between the free end of the third deformable member 230 and the piezoresistive ink 320 has an important impact on the performance of the module. In order to ensure that the third deformable member 230 can accurately transmit pressure and squeeze the piezoresistive ink 320, the shape, size, and material selection of its free end need to be carefully designed. At the same time, in order to avoid generating unnecessary contact resistance between the third deformable member 230 and the piezoresistive ink 320 when there is no pressure, an appropriate contact gap also needs to be maintained between them.

[0060] In this embodiment, the deformation transmission assembly 200 is composed of the first deformable member 210, the second deformable member 220, and the third deformable member 230, and at this time, the response speed and accuracy of the module can already be improved. However, in other embodiments, it is also possible to only provide the first deformable member 210 or provide more deformable members to further improve the response speed or accuracy.

[0061] In one embodiment, a plurality of pressure sensing modules are provided on the pressure sensing flexible circuit board 300, and the plurality of pressure sensing modules are spaced apart. Both the first deformable member 210 and the third deformable member 230 have a plurality of free ends, and each free end of the first deformable member 210, each free end of the third deformable member 230, and each pressure sensing module are arranged in one-to-one correspondence, that is, the free ends of the third deformable member 230 corresponding to the free ends of the first deformable member 210 and the projections of the pressure sensing modules coincide, so as to ensure that when the user presses the corresponding position of the touch flexible circuit board 100, the free end of the corresponding first deformed edge drives the free end of the corresponding third deformable member 230 to form an extrusion on the corresponding pressure sensing module.

[0062] A plurality of pressure sensing modules are provided on the pressure sensing flexible circuit board 300, and these pressure sensing modules are spaced apart to cover a wider touch area and provide more accurate pressure sensing. Each pressure sensing module includes a plurality of piezoresistive inks 320 and conductive adhesives 330 that are spaced apart. When subjected to external pressure, these piezoresistive inks 320 will deform and change their resistance values, thereby realizing the perception and measurement of pressure.

[0063] To match the plurality of pressure sensing modules, the first deformable member 210 and the third deformable member 230 are also designed to have a plurality of free ends. These free ends are arranged in one-to-one correspondence with the pressure sensing modules, ensuring that each pressure sensing module can receive accurate pressure transmission from the deformation transmission assembly 200.

[0064] When the free ends of the first deformable member 210 are subjected to an external force, they will deform and transmit this deformation to the second deformable member 220 below. The second deformable member 220 serves as an intermediate transmission layer and further transmits the deformation to the third deformable member 230. The free ends of the third deformable member 230 directly abut against the piezoresistive ink 320 on the corresponding pressure sensing module. When the third deformable member 230 deforms, it will squeeze the piezoresistive ink 320 and change its resistance value. This change in resistance value can be captured by the circuit system and converted into a corresponding electrical signal, thereby realizing the perception and measurement of pressure.

[0065] It should be noted that due to the one-to-one correspondence between the pressure sensing modules, the first deformable member 210, and the third deformable member 230, each pressure sensing module can independently perceive and measure the external pressure. This design not only improves the response speed and accuracy of the module but also enables the module to simultaneously detect the positions and pressure magnitudes of multiple touch points, thereby realizing the functions of multi-touch and pressure sensing.

[0066] When the first deformable member 210 has only one free end, the second deformable member 220 is disposed at one end of the first deformable member 210, and the other end of the first deformable member 210 becomes a free end. Correspondingly, one end of the third deformable member 230 is connected to the second deformable member 220, and the other end of the third deformable member 230 becomes a free end.

[0067] When the first deformable member 210 has two free ends, the second deformable member 220 can be disposed in the middle of the first deformable member 210, and both ends of the first deformable member 210 are free ends. Correspondingly, the middle of the third deformable member 230 is connected to the second deformable member 220, and both ends of the third deformable member 230 are also free ends.

[0068] When viewed from a top view, when the first deformable member 210 has more free ends, it can be considered that a plurality of first deformable members 210 having only one free end are spliced ​​together, and the same is true for the third deformable member 230 .

[0069] In one embodiment, the pressure-sensitive flexible circuit board 300 further includes a first insulating layer 310. The pressure-sensitive module is embedded in the first insulating layer 310, and the pressure-sensitive module is located on the side of the first insulating layer 310 away from the deformation transfer component 200. This design not only effectively protects the pressure-sensitive module from interference and damage from the external environment, but also ensures electrical isolation between the pressure-sensitive module and the deformation transfer component 200, thereby improving the safety and stability of the module.

[0070] In order to ensure good insulation performance and mechanical strength, materials with high insulation resistance, low dielectric constant and low water absorption are usually selected. These materials can effectively prevent the passage of current and prevent the occurrence of electrical short circuits and leakage; at the same time, they also have a certain degree of elasticity and flexibility, which can adapt to the deformation of the pressure sensing module and the deformation transfer component 200 when subjected to external forces, thereby maintaining the stability and reliability of the module.

[0071] At the same time, in order to avoid unnecessary gaps or frictions between the first insulating layer 310 and the pressure sensing module or the deformation transfer component 200 , their contact surfaces need to be properly processed, such as coating with lubricants or performing surface treatment.

[0072] It is worth noting that the introduction of the first insulating layer 310 does not affect the module's perception and measurement of pressure. When the deformation transfer component 200 is deformed by external pressure, this deformation will be transmitted to the pressure sensing module and cause it to deform accordingly. Since the first insulating layer 310 has a certain degree of flexibility, it can adapt to this deformation and allow the pressure sensing module to undergo slight displacement and deformation when subjected to pressure. This displacement and deformation will cause the resistance value of the piezoresistive ink 320 to change, thereby realizing the perception and measurement of pressure.

[0073] Refer to Figure 1 and Figure 4 In one embodiment, the touch flexible circuit board 100 includes a second insulating layer 110 and at least one capacitor 120. The capacitor 120 is embedded in the second insulating layer 110, the deformation transfer assembly 200 abuts against the bottom of the second insulating layer 110, and the second insulating layer 110 is connected to the first insulating layer 310.

[0074] The second insulating layer 110 serves as the substrate of the circuit board, providing good electrical isolation and mechanical support. The capacitor 120 is embedded in the second insulating layer 110 for sensing the user's touch action. When the user's finger or other conductive object touches the capacitor 120, the charge distribution of the capacitor 120 will be changed, thus triggering the response of the circuit system.

[0075] Refer to Figure 1 and Figure 5 In one embodiment, six capacitors 120 can be embedded in the second insulating layer 110. The capacitors 120 are arranged at intervals along the direction parallel to the top plate 211, and the projections of the capacitors 120 and the top plate 211 coincide. When the finger slides, the capacitance value signals on the touch path from the first capacitor 120 to the sixth capacitor 120 will change in sequence. By distinguishing the position and sequence of the signal changes, a sliding touch effect is generated.

[0076] Refer to Figure 1 , Figure 4 and Figure 5 In one embodiment, the first insulating layer 310 and the second insulating layer 110 are made of the same material, and the first insulating layer 310 and the second insulating layer 110 are integrally formed.

[0077] Selecting the same material for the first insulating layer 310 and the second insulating layer 110 can ensure that they have consistent performance in terms of electrical properties, mechanical strength, thermal stability, etc. This helps to reduce performance fluctuations caused by material differences and improve the overall stability and reliability of the module.

[0078] The integral forming process simplifies the manufacturing process and reduces the assembly and connection steps of multiple independent components. This not only improves production efficiency but also reduces manufacturing costs. At the same time, integral forming helps to reduce the risk of failures caused by improper connection of components.

[0079] In one embodiment, the touch pressure sensing module further includes a support block 400 for support, and the support block 400 can be made of foam. The support block 400 is disposed on the side of the first insulating layer 310 away from the third deformable member 230, and the projection of the support block 400 coincides with that of the second deformable member 220. The coincidence of the projection of the support block 400 and the second deformable member 220 means that when a touch action occurs, the support block 400 can assist the second deformable member 220 to better transmit the deformation to the pressure sensing module. This design ensures the accuracy and efficiency of the deformation transmission, and improves the response speed and accuracy of the module to touch actions.

[0080] The foam material has good elasticity and recovery, which means that the support block 400 can maintain its shape and performance during long-term use. The selection of this material helps to improve the durability of the module and extend its service life. The foam material also has good sound insulation and shock absorption properties. When the module is affected by external vibration or noise interference, the support block 400 can effectively reduce the impact of these interferences on the performance of the module, ensuring that the module can work stably.

[0081] When an external force acts on the touch flexible circuit board 100, the support force can be provided by the support block 400, so as to ensure that the first deformable member 210, the second deformable member 220, the third deformable member 230, and the piezoresistive ink 320 can deform normally.

[0082] Through the above embodiments, the present application has the following beneficial effects or advantages: The touch pressure sensing module disclosed in the present application has a simple structure, low cost, and is easy to mass-produce and apply. By adopting the combination of the piezoresistive ink 320 and the conductive adhesive 330, the pressure sensing function is realized, and the sensitivity and accuracy of the touch pressure sensing module are improved. The design of the deformation transmission assembly 200 enables the pressure to be evenly and effectively transmitted to the pressure sensing module, further improving the performance of the touch pressure sensing module.

[0083] Based on the same inventive concept, the second aspect of the embodiments of the present application discloses a touch panel, which includes a key and the touch pressure sensing module according to any one of the first aspects described above. The key is located on the side of the pressure-sensitive flexible circuit board 300 away from the deformation transmission assembly 200, and the key is touched when the pressure-sensitive flexible circuit board 300 is triggered.

[0084] The touch panel disclosed in the present application realizes a highly integrated touch pressure sensing module by closely combining the touch flexible circuit board 100, the deformation transmission assembly 200, and the pressure-sensitive flexible circuit board 300. The highly integrated touch pressure sensing module simplifies the production process and the structure of the touch pressure sensing module, and reduces the production cost. At the same time, since the stability and durability of the touch pressure sensing module are improved, the later maintenance cost is also reduced.

[0085] Based on the same inventive concept, an embodiment of the third aspect of the present application discloses an electronic device, including the touch panel of the second aspect described above.

[0086] The electronic device disclosed in the present application realizes a highly integrated touch and pressure sensing module by closely combining the touch flexible circuit board 100, the deformation transmission component 200, and the pressure sensing flexible circuit board 300. The highly integrated touch and pressure sensing module simplifies the production process and the structure of the touch and pressure sensing module, reducing the production cost. At the same time, since the stability and durability of the touch and pressure sensing module are improved, the later maintenance cost is also reduced.

[0087] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention have been clearly and completely described above with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0088] Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings above is not intended to limit the scope of the claimed present invention, but merely represents the selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts fall within the scope of protection of the present invention.

[0089] It should be noted that: similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0090] In the description of the present invention, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0091] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0092] In the present invention, unless otherwise clearly specified or limited, the first feature being above or below the second feature may include direct contact between the first and second features, or may include contact between the first and second features through additional features therebetween rather than direct contact. Moreover, the first feature being above, on top of, and over the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being below, under, and beneath the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0093] Although the preferred embodiments of the present application have been described, those of ordinary skill in the art can make additional changes and modifications once they learn the basic creative concepts. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present application.

[0094] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

1. A touch pressure sensing module, characterized in that: include: Touch-sensitive flexible circuit board; A deformation transfer component is installed on one side of the touch-type flexible circuit board; as well as A pressure-sensitive flexible circuit board connected to the touch-type flexible circuit board, and the deformation transfer component is located between the pressure-sensitive flexible circuit board and the touch-type flexible circuit board; Wherein, when the touch-sensitive flexible circuit board is pressed, the deformation transfer component is deformed and triggers the pressure-sensitive flexible circuit board.

2. The touch pressure sensing module according to claim 1, characterized in that: The pressure-sensitive flexible circuit board is provided with a pressure-sensitive module, and the pressure-sensitive module includes a plurality of piezoresistive inks arranged at intervals, and conductive glue is arranged between each of the piezoresistive inks. The projections of the touch-type flexible circuit board, the deformation transfer component and the pressure-sensitive module overlap, and when the deformation transfer component is deformed, the piezoresistive ink is squeezed to cause the piezoresistive ink to deform.

3. The touch pressure sensing module according to claim 2, characterized in that: The deformation transfer component includes a first deformation member, which is located between the touch-type flexible circuit board and the pressure-sensitive flexible circuit board, and squeezes the piezoresistive ink when the first deformation member is deformed.

4. The touch pressure sensing module according to claim 3, characterized in that: The first deformation member includes a top plate, a bottom plate and at least two connection blocks. The top plate and the bottom plate are arranged opposite to each other. Each connection block is arranged between the top plate and the bottom plate, and the connection blocks are respectively arranged at both ends of the top plate.

5. The touch pressure sensing module according to claim 3, characterized in that: The deformation transfer component also includes a second deformation member and a third deformation member, the second deformation member is located between the first deformation member and the third deformation member, and the free end of the third deformation member is arranged opposite to the free end of the first deformation member, and the free end of the third deformation member abuts against the pressure sensing module, and when the first deformation member is deformed, the second deformation member and the third deformation member are driven to deform, thereby driving the piezoresistive ink to deform.

6. The touch pressure sensing module according to claim 5, characterized in that: A plurality of pressure sensing modules are arranged on the pressure-sensitive flexible circuit board, and the plurality of pressure sensing modules are arranged at intervals. The first deformable member and the third deformable member each have a plurality of free ends, and each free end of the first deformable member, each free end of the third deformable member and each pressure sensing module are arranged in a one-to-one correspondence.

7. The touch pressure sensing module according to any one of claims 2 to 6, characterized in that: The pressure-sensitive flexible circuit board further includes a first insulating layer, the pressure-sensitive module is embedded in the first insulating layer, and the pressure-sensitive module is located on a side of the first insulating layer away from the deformation transfer component.

8. The touch pressure sensing module according to claim 7, characterized in that: The touch-type flexible circuit board includes a second insulating layer and at least one capacitor, wherein the capacitor is embedded in the second insulating layer, the deformation transfer component abuts against the bottom of the second insulating layer, and the second insulating layer is connected to the first insulating layer.

9. A touch panel, characterized in that: It comprises a button and a touch pressure sensing module as claimed in any one of claims 1 to 8, wherein the button is located on a side of the pressure-sensitive flexible circuit board away from the deformation transfer component, and the button is touched when the pressure-sensitive flexible circuit board is triggered.

10. An electronic device, characterized in that: Comprising the touch panel as claimed in claim 9.

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