Passive electromagnetic waveguide and waveguide components and methods of making and making same

Abstract

The electromagnetic waveguide component includes a plurality of planar layers, and one or more layers are shaped to accommodate incident electromagnetic waves. Each layer includes two or more alignment features and corresponding pins, the two or more alignment features in each layer providing precise stack registration between the plurality of layers, and when assembled into a stack, the planar layers are configured to provide a desired radio frequency response, i.e., a desired RF response.

Description

BACKGROUND OF THE INVENTION

[0001] Passive electromagnetic wave components, such as waveguides, are used to transmit and manipulate electromagnetic fields without a separate energy source. The construction of passive electromagnetic wave components may require the integration of metals, ceramics (including lossy ceramics), plastics, and specialized magnetic components into a single assembly. Passive electromagnetic wave components include, but are not limited to, straight waveguide sections; waveguide bends; transitions from one waveguide size to another; waveguide transitions from one mode to another; couplers, splitters, or connectors; multiplexers; filters; equalizers; waveguide coaxial adapters, terminals, or loads; some phase shifters, isolators, and circulators, unbiased diodes, and some antennas.

[0002] The size and / or dimensions of the features of passive electromagnetic wave components depend on one or more frequencies of the electromagnetic waves that the components are designed to handle. Fabricating passive electromagnetic wave components requires geometries accurate to a fraction of a wavelength. At higher frequencies, achieving the required accuracy using conventional machining can be challenging and typically involves slow and expensive processes. For high frequencies, semiconductor lithography techniques can produce passive electromagnetic wave components at low cost but require a large upfront investment in tool and process development. Additive manufacturing offers a flexible approach but generally does not produce passive electromagnetic wave components of the same quality as those machined from solid material blanks. For example, the bulk electrical conductivity of the materials used for passive electromagnetic wave components affects their performance. Conventional additive manufacturing techniques may result in lower electrical conductivity, which in turn leads to an increase in the loss of electromagnetic wave energy. Additionally, when using conventional additive manufacturing techniques, the thermal conductivity and mechanical strength may be affected by porosity, inclusions, and contamination. SUMMARY OF THE INVENTION

[0003] Example designs, techniques, and processes for manufacturing passive electromagnetic wave components are disclosed herein. In some embodiments, the designs, techniques, and processes achieve accurate dimensions and small feature sizes with high electrical conductivity and high manufacturing flexibility. In some embodiments, the techniques and processes disclosed herein are particularly beneficial for the fabrication of millimeter-wave components when the wavelength is between one centimeter and one millimeter (approximately 30 GHz to 300 GHz). Here, the term "waveguide" is intended to refer to any passive electromagnetic wave component.

[0004] Various embodiments of the present invention use layered manufacturing designs, techniques, and processes. In some embodiments, compared to current manufacturing processes, multiple planar layers are fabricated and assembled via a low-cost and rapid process to form an accurate, highly conductive waveguide structure. The multiple layers can include conductive and / or non-conductive materials, such as dielectric or ferrite elements. The multiple layers can include alignment features that ensure accurate and low-cost assembly of the layers into a monolithic waveguide component. In some embodiments, because of the alignment features, the assembled monolithic waveguide component can be disassembled and reassembled without loss of performance, thereby allowing replacement of one layer, multiple layers, and / or specific elements within a layer. Although each of the layers is shown as planar, the layers are not necessarily planar.

[0005] The layers can be bonded together to form a high-strength assembly with minimal gaps or discontinuities between the layers. When bonding the layers together, any one of brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, ultrasonic welding, a combination of one or more of the foregoing, etc. can be used. In some embodiments, the bonding can be performed in a non-reactive environment, such as hydrogen, nitrogen, vacuum, etc.

[0006] Prior to bonding, the corresponding layers can be cleaned, plasma-etched, or otherwise processed to remove contaminants and any surface oxide layers and maintained in a vacuum or inert gas environment to assist in forming a leak-free bond. The corresponding layers can be coated (e.g., sputtered, electroplated, metallized, and / or painted) with materials to assist in creating a gap-free and void-free joint (which can be made of different materials) between the corresponding layers. The coating can include one or more of nickel, gold, silver, molybdenum-manganese, copper, copper-gold, copper-silver, titanium-nickel, gold-copper-titanium, copper-silver-titanium, copper-silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver-copper-indium-titanium, copper-germanium, palladium-nickel-copper-silver, gold-palladium-manganese, silver-palladium, gold-copper-nickel, gold-copper-indium, silver-copper-indium, gold-nickel, gold-nickel-chromium, etc.

[0007] The joints formed between adjacent layers can be airtight, especially in cases where the interior is to be evacuated or pressurized with gas, which is typically to reduce the likelihood of radio frequency (RF) breakdown events during use. At millimeter-wave frequencies, waveguides are particularly sensitive to small gaps, which can cause absorption losses and reflections of RF signals or may provide an undesired modification to RF characteristics such as resonance frequency or filtering frequency. The reduction of gaps and discontinuities results in a relatively high power handling capacity and high gradient capacity. The layered manufacturing designs, techniques, and processes are particularly suitable for devices from 30 GHz to 300 GHz, but can also be used for devices below 30 GHz and above 300 GHz.

[0008] Most of the layered manufacturing designs, techniques, and processes disclosed herein can be used in any of the embodiments disclosed herein. Each embodiment disclosed herein is intended to teach additional designs, techniques, and processes that can be used in any other embodiment.

[0009] According to some embodiments, the present invention provides an electromagnetic waveguide component that includes a plurality of planar layers, the planar layers including: one or more layers shaped to accommodate at least a portion of a waveguide channel configured to transmit or manipulate electromagnetic waves and configured to provide a desired radio frequency (RF) response; one or more alignment features formed in each of the plurality of layers, the one or more alignment features in each layer of the plurality of layers being configured to provide precise stack registration between the plurality of planar layers, the one or more alignment features being configured to cooperate with corresponding pins; and the plurality of planar layers configured to form the waveguide channel when assembled into a stack.

[0010] One or more of the plurality of planar layers may include conductive and non-conductive materials. One or more of the plurality of planar layers may include ferrite materials. The plurality of planar layers may be bonded together to create an airtight seal for electromagnetic waves such that any losses and mismatches of the electromagnetic waves correspond to the losses and mismatches achieved from a solid piece of material. The plurality of planar layers may be made of copper, aluminum, titanium, tungsten, iron, nickel, cupronickel, stainless steel, carbon steel, alloy steel, tool steel, iron oxide-based ferromagnetic materials, copper alloys, dispersion-hardened copper, aluminum alloys, or any combination thereof. The plurality of layers may be made of multiple materials including one or more of lossy dielectrics, lossless dielectrics, insulators, ferromagnetic materials, diamagnetic materials, and electrets. The electromagnetic waveguide component may be a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port. The electromagnetic waveguide component may be a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port and provides couplers on one or more of the waveguide paths, the couplers providing a portion of a signal in one of the one or more waveguide channels at a coupling port. The electromagnetic waveguide component may be a coupler, phase shifter, circulator, load, or filter. The electromagnetic waveguide component may provide waveguide routing and coupling to one or more additional electromagnetic waveguide components. One or more of the alignment features may include different types of alignment features. The planar layers may be divided into at least two sections, and each of the sections may include at least one alignment feature. Each of the plurality of planar layers may include at least two alignment features. The waveguide channel may be routed up or down along different planar layers. The waveguide channel may pass above or below different waveguide channels. At least one of the plurality of planar layers may have at least one removable support formed thereon. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figures 1A to 1CShows an example passive waveguide component made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0012] Figures 2A to 2C Shows an example multi-port waveguide coupler made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0013] Figures 3A to 3D Displays an example T-shaped waveguide coupler made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0014] Figures 4A to 4C Shows an example waveguide filter made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0015] Figures 5A to 5F Shows an example waveguide phase shifter made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0016] Figures 6A to 6I Shows an example waveguide distribution network made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0017] Figures 7A to 7C Shows an example waveguide distribution network with an integrated coupler made using layered manufacturing according to some embodiments of the present invention.

[0018] Figures 8A to 8D Shows a waveguide component made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention, which is configured to be coupled to other waveguide components.

[0019] Figures 9A to 9I Shows a waveguide height converter 900 made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention. Detailed Description

[0020] Example designs, techniques, and processes for manufacturing passive electromagnetic components are disclosed herein. In some embodiments, the designs, techniques, and processes achieve accurate dimensions and small feature sizes with high conductivity and high manufacturing flexibility. In some embodiments, the techniques and processes disclosed herein are particularly beneficial for the manufacture of millimeter-wave components when the wavelength is between one centimeter and one millimeter (approximately 30 GHz to 300 GHz). Here, the term "waveguide" is intended to refer to any passive electromagnetic component.

[0021] Various embodiments of the present invention utilize layered manufacturing designs, techniques, and processes. In some embodiments, multiple planar layers are fabricated and assembled via a low-cost and rapid process to form an accurate, highly conductive waveguide structure as compared to current manufacturing processes. The multiple layers can include conductive and / or non-conductive materials, such as ferrite elements. The multiple layers can include alignment features that ensure accurate and low-cost assembly of the layers into a monolithic waveguide component. In some embodiments, due to the alignment features, the assembled monolithic waveguide component can be disassembled and reassembled without loss of performance, thereby allowing replacement of one or more layers and / or specific elements within a layer. Although each of the layers is shown as planar, the layers are not necessarily planar.

[0022] The layers can be bonded together to form a high-strength assembly with minimal gaps or discontinuities between the layers. When bonding the layers together, any one of brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, ultrasonic welding, a combination of one or more of the above, etc. can be used. In some embodiments, the bonding can be performed in a non-reactive environment, such as hydrogen, nitrogen, vacuum, etc.

[0023] Prior to bonding, the corresponding layers can be cleaned, plasma etched, or otherwise processed to remove contaminants and any surface oxide layers and maintained in a vacuum or inert gas environment to assist in forming a leak-free bond. The corresponding layers can be coated (e.g., sputtered, electroplated, metallized, and / or painted) with materials to assist in creating a gap-free and void-free joint (which can be made of different materials) between the corresponding layers. The coating can include one or more of nickel, gold, silver, molybdenum-manganese, copper, copper-gold, copper-silver, titanium-nickel, gold-copper-titanium, copper-silver-titanium, copper-silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver-copper-indium-titanium, copper-germanium, palladium-nickel-copper-silver, gold-palladium-manganese, silver-palladium, gold-copper-nickel, gold-copper-indium, silver-copper-indium, gold-nickel, gold-nickel-chromium, etc.

[0024] The joints formed between adjacent layers can be airtight, particularly in cases where the interior is to be evacuated or pressurized with gas, which is typically done to reduce the likelihood of radio frequency (RF) breakdown events during use. At millimeter wave frequencies, waveguides are particularly sensitive to small gaps, which can lead to absorption losses and reflections of RF signals or may provide an undesired modification to RF characteristics such as resonant frequency or filtering frequency. The reduction of gaps and discontinuities results in a relatively high power handling capacity and high gradient capacity. The layered manufacturing designs, techniques, and processes are particularly suitable for devices from 30 GHz to 300 GHz, but can also be used for devices below 30 GHz and above 300 GHz.

[0025] Most of the layered manufacturing designs, techniques, and processes disclosed herein can be used in any of the embodiments disclosed herein. Each embodiment disclosed herein is intended to teach additional designs, techniques, and processes that can be used in any other embodiment.

[0026] Figures 1A to 1C An example passive waveguide component 100 made using layered manufacturing designs, techniques, and processes in accordance with some embodiments of the present invention is shown. Figure 1A An isometric view of the waveguide component 100 is shown. As shown, the waveguide component 100 includes seven layers: six non-channel layers 101 sandwiching a channel layer 102. The non-channel layers 101 and the channel layer 102 can be formed of any suitable waveguide material and can be designed to handle electromagnetic waves in a frequency range of approximately 30 GHz to 300 GHz or alternatively in other frequency ranges. The non-channel layers 101 and the channel layer 102 can include conductive or non-conductive materials.

[0027] The non-channel layers 101 (layer A) and the channel layer 102 (layer B) can be manufactured and then stacked to form the passive waveguide component 100. The manufacturing of the non-channel layers 101 and the channel layer 102 can include milling, drilling, or otherwise forming alignment features 120. As Figures 1A to 1C shown, in some embodiments, the alignment features 120 can be circular and can be located in the corners of each of the layers 101 and 102. Although the alignment features 120 are shown as circular, other shapes are possible. Although the alignment features 120 are shown as being located in the corners, other locations are possible. Although the layers are shown as including multiple alignment features, a layer 101 or 102 can include only one alignment feature 120. In some embodiments, a layer 101 or 102 can include two or more alignment features 120. In some embodiments, the multiple alignment features 120 can include alignment features of different shapes or different types. For a layer with a disconnected section (e.g., Figure 1C shown layer 102), one or more alignment features 120 can be located on each section. As Figure 1C shown, the channel layer 102 can be divided into two sections 102A and 102B, and each section 102A and 102B includes two alignment features 120.

[0028] In some embodiments, the alignment feature 120 can align the stacked layers 101 and 102. In some embodiments, in addition to the alignment feature 120 of the first shape, each of the layers 101 and 102 can also have an alignment feature 130 of a second shape. For example, the alignment feature 120 can include circular features, and the additional alignment feature 130 can include rectangular (including square) features configured to provide more precise layer alignment assurance. Different from a single circular alignment feature 120, a single rectangular alignment feature 130 controls layer rotation in addition to controlling layer position. Other shapes (such as triangles, pentagons, stars, etc.) can also control layer rotation. Multiple rectangular alignment features 130 provide further assurance for correct positioning and prevention of rotation. In some embodiments, the alignment feature 120 or 130 can include holes configured to receive alignment pins (not shown) having a substantially similar shape therein. The alignment feature 120 or 130 can include a borehole that partially or completely penetrates the layer. The alignment feature 120 can include the alignment feature 130.

[0029] The layer 102 can be made into two separate sections, or by removing the section 150 from a "solid" layer, leaving the sections 102A and 102B after removal. In some embodiments, the "solid" layer can remove non-channel portions, such as for the alignment feature 120. When assembling the layers of the waveguide component 100, the removed section 150 forms a waveguide channel. The thickness of the layer 102 (layer B) can be equal to the desired internal waveguide channel height. In some embodiments, the layer 102 can include a plurality of identical layers with reduced thickness such that the total thickness of these layers forms the waveguide height. The sections 102A and 102B can be separated by a distance equal to the desired internal waveguide channel width.

[0030] During assembly, the layers 101 and 102 can be fixed together, for example, glued together, to form the waveguide component 100. Gluing the layers together helps to establish close contact between them so that the final assembly is equivalent to or the same as a part made from one or more solid metal blocks using traditional processes. The gluing can be performed by various well-known techniques that involve applying a certain combination of increased pressure and temperature over an appropriate period of time. As indicated above, before assembly, the layers 101 and 102 can undergo a process of cleaning or etching to remove contaminants, and a process of applying one or more coatings to help produce a gapless and voidless joint between the corresponding layers. Thereafter, these layers can be glued together. In some embodiments where the layers are only mechanically clamped, the waveguide component can be disassembled and reassembled as needed.

[0031] Figures 2A to 2C An example porous waveguide coupler 200 made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention is shown. As Figure 2AAs shown, waveguide coupler 200 includes two non-channel layers 201 and one channel layer 202. Layers 201 and 202 may include conductive and / or non-conductive materials. Layers 201 and 202 may be fabricated and assembled using techniques similar to those described with respect to Figures 1A to 1C described.

[0032] As Figure 2B shown, non-channel layer 201 may include a generally solid layer. As described above, in some embodiments, the "solid" layer may remove non-channel portions, such as for alignment feature 120. As Figure 2C shown, channel layer 202 has two waveguide channels. The thickness of channel layer 202 may be equal to the desired internal waveguide channel height. As described above, layer 202 may include a plurality of identical layers with reduced thickness such that the total thickness of these layers forms the waveguide height. In some embodiments, the channels may be formed by removing material from a solid layer.

[0033] As Figures 2A to 2C shown, alignment features 120 (shown as circular, but other shapes and / or combinations of shapes are possible) may be formed in each of layers 201 and 202. As indicated above, alignment features 120 may include holes configured to receive alignment pins (not shown). Although not shown, additional alignment features 130, such as Figures 1A to 1C shown rectangular alignment features, may also be formed in layers 201 and 202, and / or in sections of the layers, such as sections of layer 102. For example, sections 202A - 202C of layer 202 may include circular features, and sections 202D and 202E may include square features. The dimensions of each of layers 201 and 202 (including the channels) may be selected to achieve the desired performance characteristics. When stacked to form a monolithic porous waveguide coupler 200, for example, when layer A is stacked, then sections of layer B are stacked, and then another layer A is stacked, alignment features 120 may be placed to properly align the layers and sections of the layers.

[0034] The non-channel layer 201 and the channel layer 202 may be fixed (e.g., bonded) together to form waveguide coupler 200. Bonding the layers together helps establish intimate contact between them such that the final assembly is equivalent to or the same as a part made from one or more solid metal blocks using conventional processes. The bonding may be performed by various well-known techniques that involve applying some combination of increased pressure and temperature over an appropriate period of time. As indicated above, prior to assembly, the layers may undergo processes of cleaning or etching to remove contaminants, and processes of applying one or more coatings to help produce a gap-free and void-free joint between the respective layers. Thereafter, the layers may be bonded together. Because the layers are assembled as disclosed herein, the waveguide components may be disassembled and reassembled as needed.

[0035] Figures 3A to 3D Shows an example of a T-waveguide coupler 300 fabricated using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention. As Figure 3A shown, the T-waveguide coupler 300 includes three layers 301, 302, and 303. Each of the fabrication layers 301, 302, and 303 is fabricated and then stacked to form the T-waveguide coupler 300. The layers 301-303 may include conductive and / or non-conductive materials. Figure 3B Shows the top layer 301, which has port 2 and a channel portion 350 through its thickness. Figure 3C Shows the channel layer 302, which has a t-shaped channel portion 350 leading to ports 1, 3, and 4. Figure 3D Shows the bottom layer 303 without channels or ports.

[0036] In some embodiments, the thickness of the channel layer 302 is equal to the desired internal waveguide channel height. As described above, the channel layer 302 may include a plurality of identical layers with reduced thickness such that the total thickness of these layers forms the waveguide height. The channel portion 350 passing through the thickness of layer 301 is connected to the t-shaped channel portion 350 of layer 302. As discussed, these channel portions 350 may be formed by removing material from the layers.

[0037] Alignment features 120 may be circular or other shapes and may be formed in each of the layers 301, 302, and 303. Rectangular or other shaped alignment features 130 may alternatively or additionally be formed on each of the layers or layer segments. The dimensions of the layers 301-303 may be selected to achieve the desired coupling between waveguides. The thickness of layer 302 may be designed to be the waveguide height, and one of the dimensions of the removal region 350 on layer 302 may correspond to the waveguide width. In some embodiments, segments of a single layer may be formed separately rather than by removing material. In some embodiments, the channels 350 do not need to create separate segments. In other words, the thickness of layer 302 may be thicker than the intended height of the waveguide channel. Thus, material removal may leave a floor that holds the thicker segments 302A, 302B, and 302C together.

[0038] Layers 301 - 303 are fixed or bonded together to form waveguide coupler 300. Bonding the layers together helps to establish intimate contact between them so that the final assembly is equivalent to or the same as a part made from one or more solid metal blocks using conventional processes. The bonding can be carried out by various well - known techniques that involve applying some combination of increased pressure and temperature for an appropriate period of time. As indicated above, prior to assembly, the layers can undergo processes of cleaning or etching to remove contaminants, and processes of applying one or more coatings to help create a gap - free and void - free joint between the respective layers. Thereafter, the layers can be bonded together. Because the layers are assembled as disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0039] Figures 4A to 4C An example waveguide filter 400 formed using additive manufacturing designs, techniques, and processes in accordance with some embodiments of the present invention is shown. As Figure 4A shown, waveguide filter 400 includes two non - channel layers 401 and one channel layer 402. The non - channel layers 401 and the channel layer 402 can include conductive and / or non - conductive materials. Figure 4B The non - channel layer 401 is shown. Figure 4C The channel layer 402 is shown.

[0040] The thickness of the channel layer 402 can be equal to the desired internal waveguide height. As described above, the channel layer 402 can include a plurality of identical layers with decreasing thickness such that the total thickness of these layers forms the waveguide height. The channel layer 402 can be manufactured by removing material from a solid layer to form waveguide path 450 and repeating features 460, which are configured to provide a filter - like response at the desired operating frequency. The process of selecting dimensions for these features to achieve the desired radio - frequency performance can be found in standard references and textbooks.

[0041] Alignment features 120 can include alignment holes, such as circular, rectangular, or other shapes or combinations of shapes, that can be formed in each of the non - channel layers 401 and the channel layer 402 to ensure alignment of all layers and sections when stacked and bonded.

[0042] The non-channel layer 401 and the channel layer 402 can be fixed and / or adhered together to form the waveguide filter 400. Adhering the layers together helps to establish a tight contact between them, making the final assembly equivalent to or identical to a part made from one or more solid metal blocks using traditional processes. The adhesion can be carried out by various well-known techniques that involve applying a certain combination of increased pressure and temperature for an appropriate period of time. As indicated above, before assembly, the corresponding layers can undergo processes such as cleaning or etching to remove contaminants, and processes of applying one or more coatings to help create a gap-free and void-free joint between the corresponding layers. Thereafter, these layers can be adhered together. Since the layers are assembled in the manner disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0043] Figures 5A to 5F An example waveguide phase shifter 500 formed using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention is shown. As Figure 5A shown, the waveguide phase shifter 500 includes a top layer and a bottom layer 501, an open channel layer 502, and a ferrite channel layer 504. Figure 5B The top layer or the bottom layer 501 is shown. Figure 5C The open channel layer 502 is shown. Figure 5D The ferrite channel layer 504 is shown. Figure 5E A bonded waveguide ferrite assembly 510 is shown, which includes magnetic field generating elements 560 positioned on the outer surfaces of the top layer and the bottom layer 501 of the waveguide phase shifter 500. Figure 5F Details of the bonded waveguide ferrite assembly 510 are shown, including magnetic field generating elements 560 positioned above the outer surfaces of the top layer and the bottom layer of the waveguide phase shifter 500.

[0044] The top layer and the bottom layer 501 and the open channel layer 502 can include conductive and / or non-conductive materials. As Figure 5B , Figure 5C and Figure 5D shown, each of the top layer and the bottom layer 501, the open channel layer 502, and the ferrite channel layer 504 includes a removable support, and each removable support has its own one or more alignment features 120. Each removable support is part of the layer 501, 502, 504 and is removably coupled to the body through one or more bridging members. The top layer and the bottom layer 501 include removable supports 501A and 501B. The open channel layer 502 includes removable supports 502A and 502B. The ferrite channel layer 504 includes removable supports 503A and 503B. The bridging members are preferably small to allow removal of the associated removable supports during assembly.

[0045] As Figure 5DAs shown, the ferrite channel layer 504 includes three sections, namely the ferrite section 503 and two side sections 504C and 504D of conductive material. To assemble the waveguide phase shifter 500, the top and bottom layers 501, the open channel layer 502, and the ferrite channel layer 504 (including their respective removable supports 501A and 501B; 502A and 502B; and 503A and 503B; channels 550 and alignment features 120) are fabricated. Then, as Figure 5A shown, the top and bottom layers 501, the open channel layer 502, and the ferrite channel layer 504 are stacked.

[0046] As Figure 5A shown, the thickness of the open channel layer 502 can be equal to the desired internal waveguide channel height. As described above, the channel layer 502 can include a plurality of identical layers with reduced thickness such that the total thickness of these layers forms the waveguide height. The open channel layer 502 and the ferrite channel layer 504 can remove channels. Alignment features 120 can be provided in each of the top layer 501, the bottom layer 501, the open channel layer 502, and the ferrite channel layer 504 (including in the ferrite section 503). The dimensions of each layer 501, 502, 504 can be selected to achieve the desired performance characteristics. The alignment features 120, including the alignment features 120 in the removable supports, ensure that all layers and corresponding features are aligned during assembly.

[0047] The layers 501, 502, 504 (including the ferrite section 503) are fixed together, for example, glued together. Gluing the layers together helps to establish close contact between them so that the final assembly is equivalent to or the same as a part fabricated from one or more solid metal blocks using traditional processes. Gluing can be performed by various well-known techniques that involve applying a certain combination of increased pressure and temperature over an appropriate period of time. As indicated above, prior to assembly, the layers can undergo processes of cleaning or etching to remove contaminants, as well as processes of applying one or more coatings to help produce gap-free and void-free joints between the corresponding layers. Thereafter, these layers can be glued together. Since the layers are assembled in the manner disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0048] After stacking, assembling, and gluing, each removable support can be removed.

[0049] As Figure 5E and Figure 5F shown, magnetic field generating elements 560 can be added to the outer surfaces of the top and bottom layers 501 to form the waveguide phase shifter 500. As Figure 5FAs shown, the magnetic field generating element 560 may include an insulated wire 570 wound around a non-magnetic "bobbin". Passing an electric current through the wire 570 will cause a magnetic field to be generated in the vertical direction, thereby biasing the ferrite in the ferrite section 503 and changing the electrical phase length from one waveguide port to another. The magnetic field may alternatively be provided by a permanent magnet.

[0050] The waveguide phase shifter 500 may be combined with a coupler (such as Figures 3A to 3D as shown) to form a four-port waveguide circulator. Adding absorption loads at two of the ports makes the device a waveguide isolator. A similar approach can be used to implement a three-port y-type waveguide circulator and isolator.

[0051] Figures 6A to 6I An example waveguide distribution assembly 600 using layered manufacturing designs, techniques, and processes is shown in accordance with some embodiments of the present invention. As Figure 6A shown, the waveguide distribution assembly 600 includes two waveguide channels 660 and 650, which can be seen to cross each other internally. Although Figure 6A not shown in, the waveguide distribution assembly 600 is manufactured using multiple layers.

[0052] Figure 6B A cross-sectional side view of the waveguide distribution assembly 600 is shown. As Figure 6B shown, the waveguide channel 660 travels "horizontally" across the waveguide distribution assembly 600 without rising (routing upward through the layers) or falling (routing downward through the layers), and may only pass through a single layer. The waveguide channel 650 travels across the waveguide distribution assembly 600 while rising and falling through higher layers to cross over the waveguide channel 660.

[0053] Figure 6C A cross-sectional top view of the waveguide distribution assembly 600 is shown. As Figure 6C shown, the waveguide channel 660 travels across the waveguide distribution assembly 600 in an "S" curve from the rear section to the front section, and the waveguide channel 650 travels across the waveguide distribution assembly 600 in an "S" curve from the front section to the rear section. As shown, the waveguide channel 660 is located below the waveguide channel 650 because the waveguide channel 650 routes upward through higher layers above the waveguide channel 660 and then routes downward through lower layers, possibly (but not necessarily) returning to the same layer where it started. As shown, the waveguide channel ports may be provided on opposite sides of the waveguide distribution assembly 600.

[0054] Figure 6D The non-channel layer A is shown. Figure 6E The layer B with a portion of the channel 660 and the channel 650 is shown. Figure 6F The layer C with the first rising portion of the channel 650 is shown when the channel 650 routes upward on the layer B.Figure 6G Shows layer D with a second rising portion of channel 650 when the channel 650 is routed above layer C. Figure 6H Shows layer E with a third rising portion of channel 650 when the channel 650 is routed above layer D. Figure 6I Shows layer F with a fourth rising portion of channel 650 when the channel 650 is routed above layer E. The assembly of layers A - E is as Figure 6B shown. Note that as the channel rises through the layers, the thickness of each layer does not need to be the same to create a smoother transition (smaller steps). The individual layers of the waveguide distribution assembly 600 can be formed, stacked, and fixed (e.g., glued).

[0055] This example shows that these techniques allow any number of waveguide channels to be routed through the assembly in a manner similar to how signals are routed on a single conductor or a stripline in a printed circuit board. Increasing the number of layers may increase the routing complexity, but the change in manufacturing complexity is minimal. The step features that occur when transitioning between layers will affect the RF characteristics. Standard techniques known to those skilled in the field of RF design can account for these effects to produce the desired RF characteristics of the waveguide distribution assembly 600.

[0056] Alignment features 120 ensure that all layers and corresponding features are aligned during assembly. These layers can be fixed together, e.g., glued together. Gluing the layers together helps to establish tight contact between them so that the final assembly is equivalent to or the same as a part made from one or more solid metal blocks using traditional processes. Gluing can be performed by various well - known techniques that involve applying a certain combination of increased pressure and temperature over an appropriate period of time. As indicated above, prior to assembly, the layers can undergo processes such as cleaning or etching to remove contaminants, and processes of applying one or more coatings to help produce gap - free and void - free joints between the corresponding layers. Thereafter, these layers can be glued together. Since the layers are assembled in the manner disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0057] Figures 7A to 7C Shows an example waveguide distribution assembly 700 (with integrated couplers) made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention. As Figure 7A shown, the waveguide distribution assembly 700 includes a set of input ports ( Figure 7C shown on the front surface), a set of forward coupling ports 751 on the top surface, and a set of reverse coupling ports 752 on the top surface.

[0058] Figure 7BA cross-sectional side view of waveguide distribution assembly 700 is shown through one of the input ports, one of the forward coupling ports 751, and one of the reverse coupling ports 752. As shown, waveguide distribution assembly 700 includes layers 701 - 704. Layer 704 includes a non-channel base layer. Waveguide channels are positioned between layer 704 and layer 703. Layer 703 includes iris 760 to enable a traveling wave to pass through layer 703 upward out of the waveguide channel to layers 702 and 702, which form the forward and reverse channels to forward coupling port 751 and reverse coupling port 752, respectively.

[0059] Figure 7C A cross-sectional top view of waveguide distribution assembly 700 is shown through the input port, forward coupling port 751, and reverse coupling port 752. As shown, waveguide distribution assembly 700 includes five waveguide channels 753 - 757. Waveguide channels 753 - 757 are formed by layers 701 - 704 and can be made of conductive and / or non-conductive materials, such as by section removal.

[0060] Each waveguide channel 753 - 757 passes through coupler section 750, which is formed by a series of iris 760 in layer 703 directly above the through waveguide. Above the iris 760, coupler section 750 is formed by additional conductive layers 702 and 701 with appropriate material removal. During layer fabrication, features selected by traditional RF design techniques can be included in layers 701, 702, and 703 to provide appropriate RF characteristics, such as return loss, insertion loss, and directivity. Forward power coupling port 751 and reverse power coupling port 752 are formed in top layer 701. The respective layers 701 - 704 of assembly 700 can be formed, stacked, and fixed using the bonding techniques employed in any of the waveguide components disclosed herein.

[0061] As disclosed herein, example waveguide components can be formed quickly and precisely using stacked layers with alignment features (circular, square, rectangular, and / or other shapes) having common registration and corresponding alignment pins. The stacked layers can be conductive, non-conductive, or a combination of conductive and non-conductive. Waveguide paths can be formed in one or more layers by precise machining (e.g., material removal), which can be performed under the control of a suitably programmed processor. The size of the paths can be adjusted to achieve component performance over a range of electromagnetic frequencies. These layers can be assembled, aligned, and fixed. Because the layers are assembled as disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0062] Some of the features shown throughout the figures, such as alignment pin 120, perform the same or similar functions in these examples.

[0063] These layers can be fixed together, for example, glued together. Gluing the layers together helps to establish a tight contact between them so that the final assembly is equivalent to or identical to a part made from one or more solid metal blocks using traditional processes. The gluing can be performed by various well-known techniques that involve applying a certain combination of increased pressure and temperature over an appropriate period of time. As indicated above, prior to assembly, the layers can undergo processes such as cleaning or etching to remove contaminants, and application of one or more coatings to help produce a gap-free and void-free joint between the respective layers. Thereafter, the layers can be glued together. Since the layers are assembled in the manner disclosed herein, the waveguide component can be disassembled and reassembled as needed.

[0064] Figures 8A to 8D Shown is a waveguide component 800 made using additive manufacturing designs, techniques, and processes according to some embodiments of the present invention, which is configured to couple to other waveguide components.

[0065] Figure 8A A perspective view of the waveguide component 800 is shown, having a waveguide port 802 on the front face. As shown, the waveguide port 802 can include a waveguide opening on a surface perpendicular to the waveguide propagation direction, and can include a boss 808 that frames the waveguide opening. Additional features can be included to simplify the use of the waveguide component. Component alignment features (e.g., holes 804 and pins 806) can be included in the layers. The holes 804 can accommodate the pins 806. The pins 806 can be press-fitted into the near-fit holes 804, or fixed in other ways (brazing, soldering, epoxy, etc.). The pins 806 can be used to align the waveguide component 800 with a mating waveguide component. Holes 804 can also be included to receive the pins 806 on a mating waveguide component. Holes 804 can be included to allow attachment of the waveguide component by bolts. The holes 804 can be used as guiding features to provide an accurate location for drilling and tapping, or for applying threaded inserts. Various mechanisms have been designed for standard waveguide flanges. The use of these features allows for the manufacture of waveguide components that engage with standard flanges.

[0066] Figure 8B A top view of the waveguide component 800 is shown, including the pins 806 extending from the front face. Figure 8C A top view of the waveguide component 800 is shown and the cross-section A - A is identified. Figure 8D A cross-sectional side view of the waveguide component 800 is shown, showing a series of layers forming the holes 804, the waveguide port 802, and the frame 808.

[0067] For waveguide components that require airtightness, features can be included on the waveguide port face to accept an elastomeric "O-ring", thereby allowing for an airtight seal between this waveguide component and a mating waveguide component.

[0068] Figures 9A to 9I Shows a waveguide height converter 900 made using layered manufacturing designs, techniques, and processes according to some embodiments of the present invention.

[0069] As Figure 9A and Figure 9B shown, the waveguide height converter 900 includes a low-height waveguide port 902 and a full-height (standard) waveguide port 904. As Figure 9C shown, the assembled layers G, H, I, J, K, L form a waveguide height converter 906 to transition from the full-height waveguide port 904 to the low-height waveguide port 902. In one example, the standard waveguide is a WR-10 waveguide with a width of 0.1 inches and a height of 0.05 inches. The low-height waveguide has the same width (0.1 inches) at WR-10, but the height is reduced to 0.01 inches. This transition is achieved through multiple steps of forming a series of layers.

[0070] Figure 9D Layer G is shown as a non-channel layer with alignment features 120. Figure 9E Layer H is shown as a non-channel layer, where the first section 908 is removed to form the first section of the waveguide channel 906. Figure 9F Layer I is shown as a non-channel layer, where the second section 910 (longer than the first section 908) is removed to form the second section of the waveguide channel 906. Figure 9G Layer J is shown as a non-channel layer, where the third section 912 (longer than the first section 910) is removed to form the third section of the waveguide channel 906. Figure 9H Layer K is shown as a non-channel layer, where the third section 914 (longer than the first section 912) is removed to form the fourth section of the waveguide channel 906. Figure 9I Layer L is shown as a non-channel layer, where the section 916 (completely crossing layer L) is removed to form the bottom section of the waveguide channel 906. Each of layers H, I, J, K, and L also includes alignment features 120 to assist in assembling the layers together to form the waveguide height converter 900.

[0071] The individual layers 701 - 704 of the waveguide height converter 700 can be formed, stacked, and fixed using the bonding techniques employed in any of the waveguide components disclosed herein.

[0072] As disclosed herein, example waveguide components can be formed quickly and precisely using stacked layers with co-registered alignment features (circular, square, rectangular, and / or other shapes) and corresponding alignment pins. The stacked layers can be conductive, non-conductive, or a combination of conductive and non-conductive. Waveguide paths can be formed in one or more layers by precise machining (e.g., material removal), which can be performed under the control of a suitably programmed processor. The size of the paths can be adjusted to achieve component performance for a range of electromagnetic frequencies. These layers can be assembled, aligned, and fixed, e.g., glued. Gluing the layers together helps to establish intimate contact between them so that the final assembly is equivalent to or the same as a part made from one or more solid metal blocks using traditional processes. Gluing can be performed by various well-known techniques that involve applying some combination of increased pressure and temperature over an appropriate period of time. As indicated above, prior to assembly, the layers can undergo processes to clean or etch to remove contaminants, and processes to apply one or more coatings to help produce gap-free and void-free joints between the respective layers. Thereafter, the layers can be glued together. Because the layers are assembled in the manner disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0073] Some of the features illustrated throughout the figures, such as alignment feature 120, perform the same or similar functions in these examples.

[0074] In some embodiments, some designs can avoid the need for alignment feature 120 for some layers or some sections of layers. For example, a section can sit within a "cavity" of a layer. For example, there may be a cutout (completely through the layer forming a "hole" or only partially through the layer forming a "cavity") in a metal layer, and a dielectric of the same shape as the cutout can be placed therein. The dielectric will be aligned by the cutout. The shapes can have keys or be designed to self-align.

[0075] The foregoing description of the preferred embodiments of the invention is by way of example only, and other variations and modifications of the above-described embodiments and methods are possible in light of the above teachings. The embodiments described herein are not intended to be exhaustive or limiting. The invention is limited only by the appended claims.

Claims

1. An electromagnetic waveguide component, comprising: a plurality of planar layers, comprising: one or more layers shaped to accommodate at least a portion of a waveguide channel configured to transmit or manipulate electromagnetic waves and configured to provide a desired radio frequency response, i.e., a desired RF response; one or more alignment features formed in each of the plurality of layers, the one or more alignment features in each of the plurality of layers configured to provide precise stack registration between the plurality of planar layers, the one or more alignment features being arranged to cooperate with corresponding pins; and when assembled into a stack, the plurality of planar layers are configured to form the waveguide channel.

2. The electromagnetic waveguide component according to claim 1, wherein one or more of the plurality of planar layers comprise a conductive material and a non - conductive material.

3. The electromagnetic waveguide component according to claim 2, wherein one or more of the plurality of planar layers comprise a ferrite material.

4. The electromagnetic waveguide component according to claim 1, wherein the plurality of planar layers are bonded to create a hermetic seal to electromagnetic waves such that any losses and mismatches of the electromagnetic waves correspond to those achieved from a solid piece of material.

5. The electromagnetic waveguide component according to claim 1, wherein the plurality of planar layers are made of copper, aluminum, titanium, tungsten, iron, nickel, cupronickel, stainless steel, carbon steel, alloy steel, tool steel, iron - oxide - based ferromagnetic material, copper alloy, dispersion - hardened copper, aluminum alloy, or any combination thereof.

6. The electromagnetic waveguide component according to claim 1, wherein the plurality of layers are made of one or more of a lossy dielectric, a lossless dielectric, an insulator, a ferromagnetic material, a diamagnetic material, and an electret.

7. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port.

8. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port and provides couplers on one or more of the waveguide paths to provide a portion of the signal in one of the one or more waveguide channels at a coupling port.

9. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a coupler.

10. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a phase shifter.

11. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a circulator.

12. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a load.

13. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a filter.

14. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component provides waveguide routing to and coupling with one or more additional electromagnetic waveguide components.

15. The electromagnetic waveguide component according to claim 1, wherein the one or more alignment features comprise different types of alignment features.

16. The electromagnetic waveguide component according to claim 1, wherein at least one of the plurality of planar layers is divided into at least two sections, and each of the sections includes at least one alignment feature.

17. The electromagnetic waveguide component according to claim 1, wherein each of the plurality of planar layers includes at least two alignment features.

18. The electromagnetic waveguide component according to claim 1, wherein the waveguide channels are routed upward or downward in different planar layers.

19. The electromagnetic waveguide component according to claim 18, wherein the waveguide channels pass above or below different waveguide channels.

20. The electromagnetic waveguide component according to claim 1, wherein at least one removable support is formed on at least one of the plurality of planar layers.

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